TWI449804B - Metal layer-coated substrate and process for the production thereof - Google Patents

Metal layer-coated substrate and process for the production thereof Download PDF

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TWI449804B
TWI449804B TW096133891A TW96133891A TWI449804B TW I449804 B TWI449804 B TW I449804B TW 096133891 A TW096133891 A TW 096133891A TW 96133891 A TW96133891 A TW 96133891A TW I449804 B TWI449804 B TW I449804B
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layer
substrate
metal
metal layer
coated
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TW200835809A (en
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Hidekatsu Kuroda
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Ube Nitto Kasei Co
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/16Layered products comprising a layer of metal next to a particulate layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1651Two or more layers only obtained by electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Powder Metallurgy (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)

Description

被覆金屬層之基材及其製造方法Substrate coated metal layer and method of producing the same

本發明係有關一種可利用於導電材料、電磁波密封材料等被覆金屬層之基材及其製造方法。The present invention relates to a substrate which can be used for a coated metal layer such as a conductive material or an electromagnetic wave sealing material, and a method for producing the same.

在非導電性基材上被覆金屬之方法,一般而言為無電解電鍍法。無電解電鍍法,例如使基材浸漬於含有金屬鹽、金屬複合劑、pH調整劑、還原劑等之無電解電鍍液中,形成金屬層的方法(例如參照「無電解電鍍-基礎與應用-」、第4版、鍍金研究會編集、日刊工業新聞社發行、發行日1999年10月、第101~127頁)。The method of coating a metal on a non-conductive substrate is generally an electroless plating method. An electroless plating method, for example, a method of forming a metal layer by immersing a substrate in an electroless plating solution containing a metal salt, a metal complex, a pH adjuster, a reducing agent, etc. (for example, refer to "electroless plating - basis and application - , 4th edition, compilation of gold-plated research conference, publication of the Nikkan Kogyo Shimbun, and issue date October 1999, pages 101~127).

通常,藉由無電解電鍍法製造被覆金屬層之基材時,必須進行稱為活性化處理製程之使以無電解電鍍為始的觸媒附著於基材上,使基材表面予以活性化的前處理製程,一般而言該製程如下述進行。In general, when a substrate coated with a metal layer is produced by electroless plating, it is necessary to perform a process called an activation treatment to cause a catalyst which is electrolessly plated to adhere to a substrate to activate the surface of the substrate. The pretreatment process is generally carried out as follows.

使基材進行無電解電鍍前,與氯化錫之水溶液接觸以吸附錫離子,然後,與氯化鈀之水溶液進行接觸,藉由錫離子之還原作用在基材表面上吸附鈀膠體。該鈀膠體係作用為開始進行無電解電鍍之觸媒。Before the substrate is subjected to electroless plating, it is contacted with an aqueous solution of tin chloride to adsorb tin ions, and then contacted with an aqueous solution of palladium chloride to adsorb a palladium colloid on the surface of the substrate by reduction of tin ions. The palladium gel system acts to start the electroless plating catalyst.

活性化處理後,使基材浸漬於含有金屬鹽、金屬複合劑、pH值調整劑等之還原劑外的成分之無電解電鍍浴中,然後,添加還原劑,或使基材浸漬於含有金屬複合劑、pH值調整劑等之金屬鹽及還原劑外的成分之無電解電鍍浴中,其次,藉由添加還原劑與金屬鹽,在基材表面上形成金屬層。After the activation treatment, the substrate is immersed in an electroless plating bath containing a component other than a reducing agent such as a metal salt, a metal complexing agent, or a pH adjuster, and then a reducing agent is added or the substrate is immersed in a metal-containing material. In the electroless plating bath of a metal salt such as a complexing agent or a pH adjusting agent and a component other than the reducing agent, a metal layer is formed on the surface of the substrate by adding a reducing agent and a metal salt.

藉由上述方法,在基材表面上析出金屬層時,基材表面之活性化處理製程中,因吸附性等之差異,導致錫或鈀之分布不均勻,產生表面電位不均勻的情形。因此,於無電解電鍍時,金屬層產生容易析出的部分與不易析出的部分,僅部份形成金屬層,產生未析出部,且產生露出基材表面的部分。所以,於所得的被覆金屬層之基材中會有無法確保安定的導電性之問題。另外,由於在活性化處理製程中所使用的錫鹽具有腐蝕性,故為除去殘留的錫鹽時,必須於無電解電鍍開始前進行洗淨,惟相當頻繁地進行洗淨時,會有直至鈀膠體減少、且不易進行無電解電鍍的問題。When the metal layer is deposited on the surface of the substrate by the above method, the distribution of tin or palladium is uneven due to the difference in adsorptivity or the like during the activation treatment of the surface of the substrate, and the surface potential is not uniform. Therefore, in the electroless plating, the metal layer generates a portion which is easily precipitated and a portion which is hard to be precipitated, and only a portion of the metal layer is formed, and an unprecipitated portion is generated, and a portion which exposes the surface of the substrate is generated. Therefore, there is a problem in that the substrate of the obtained metal layer to be coated cannot ensure stable conductivity. In addition, since the tin salt used in the activation treatment process is corrosive, in order to remove the residual tin salt, it is necessary to wash it before the start of electroless plating, but when it is washed frequently, there may be until The palladium colloid is reduced and it is difficult to perform electroless plating.

本發明有鑑於上述情形,以提供一種具有安定導電性之被覆金屬層之基材,以及使該被覆金屬層之基材在沒有使用特別的設備或裝置下,以低成本且簡單製程製造、對環境之影響少的方法為目的。The present invention has been made in view of the above circumstances, and provides a substrate having a coated metal layer having a stable electrical conductivity, and the substrate of the coated metal layer is manufactured at a low cost and in a simple process without using a special equipment or device. The method of having less impact on the environment is for the purpose.

本發明人等再三深入研究的結果,發現含有基材、與在該基材上經由含螯合形成性官能基之矽烷偶合劑所形成的金屬奈米粒子之散佈物或層狀物、在該金屬奈米粒子之散佈物或層狀物上所形成的金屬層之新穎被覆金屬層之基材,藉由使基材與含有水解觸媒、含螯合形成性官能基的矽烷偶合劑及金屬奈米粒子形成性金屬鹽之水性溶液接觸後,以還原劑予以處理,在基材上經由含有螯合形成性官能基之矽烷偶合劑,形成金屬奈米粒子之散佈物或層狀物,然後,在該金屬奈米粒子之散佈物或層狀物上形成金屬層予以製得,以及所得的被覆金屬層之基材具有安定的導電性,以該見解為基礎,遂而完成本發明。As a result of further intensive studies by the inventors of the present invention, it has been found that a substrate or a dispersion or layer of metal nanoparticles formed on the substrate via a chelating coupling agent containing a chelating forming functional group is used. a substrate of a novel metal-clad layer of a metal layer formed on a dispersion of a metal nanoparticle or a layer, by a substrate and a decane coupling agent containing a hydrolysis catalyst, a chelate-forming functional group, and a metal After contact with the aqueous solution of the nanoparticle-forming metal salt, it is treated with a reducing agent, and a dispersion or layer of metal nanoparticles is formed on the substrate via a decane coupling agent containing a chelating forming functional group, and then The present invention is completed by forming a metal layer on the dispersion or layer of the metal nanoparticle and obtaining a stable electrical conductivity of the substrate of the obtained metal layer.

換言之,本發明係提供(1)一種被覆金屬層之基材,其特徵為含有基材、與在該基材上經由含螯合形成性官能基之矽烷偶合劑所形成的金屬奈米粒子之散佈物或層狀物、在該金屬奈米粒子之散佈物或層狀物上所形成的金屬層。In other words, the present invention provides (1) a substrate coated with a metal layer, characterized by comprising a substrate and metal nanoparticles formed on the substrate via a decane coupling agent containing a chelating forming functional group. A dispersion or layer, a metal layer formed on the dispersion or layer of the metal nanoparticle.

(2)如上述(1)記載之被覆金屬層之基材,其中基材為由至少一種以上選自二氧化矽、陶瓷及玻璃所成群所成。(2) The substrate of the metal-clad layer according to (1) above, wherein the substrate is formed by grouping at least one selected from the group consisting of ceria, ceramics, and glass.

(3)如上述(1)或(2)記載之被覆金屬層之基材,其中基材之形狀為1種選自球狀、棒狀、板狀、針狀、中空狀及不特定形狀所成群者。(3) The substrate of the metal-clad layer according to the above (1) or (2), wherein the shape of the substrate is one selected from the group consisting of a spherical shape, a rod shape, a plate shape, a needle shape, a hollow shape, and a non-specific shape. Group of people.

(4)如上述(3)記載之被覆金屬層之基材,其中基材之形狀為平均粒徑0.1~100μm的微粒子形狀。(4) The substrate of the metal-clad layer according to (3) above, wherein the shape of the substrate is a fine particle shape having an average particle diameter of 0.1 to 100 μm.

(5)如上述(1)~(4)項中任一項記載之被覆金屬層之基材,其中螯合形成性官能基為至少具有1種以上選自氮原子、硫原子及氧原子所成群的原子之官能基。(5) The base material of the metal-clad layer according to any one of the above-mentioned items, wherein the chelating-forming functional group has at least one selected from the group consisting of a nitrogen atom, a sulfur atom and an oxygen atom. The functional groups of a group of atoms.

(6)如上述(5)記載之被覆金屬層之基材,其中螯合形成性官能基為至少1種以上選自-SH、-CN、-NH2 、-SO2 OH、-SOOH、-OPO(OH)2 及-COOH所成群之官能基。(6) The substrate of the metal-clad layer according to the above (5), wherein at least one of the chelate-forming functional groups is selected from the group consisting of -SH, -CN, -NH 2 , -SO 2 OH, -SOOH, - A functional group of OPO(OH) 2 and -COOH.

(7)如上述(1)~(6)項中任一項記載之被覆金屬層之基材,其中金屬奈米粒子為由至少1種以上選自金、銀、銅及鎳所成群之金屬所成的奈米粒子。(7) The base material of the metal-clad layer according to any one of the above-mentioned, wherein the metal nanoparticles are in a group of at least one selected from the group consisting of gold, silver, copper, and nickel. Nanoparticles made of metal.

(8)如上述(1)~(7)項中任一項記載之被覆金屬層之基材,其中金屬層為由銀所成的層。The substrate of the metal-clad layer according to any one of the above-mentioned items, wherein the metal layer is a layer made of silver.

(9)一種被覆金屬層之基材的製造方法,其特徵為使基材接觸含有水解觸媒、含螯合形成性官能基之矽烷偶合劑及金屬奈米粒子形成性金屬鹽之水性溶液後,藉由以還原劑進行處理,在基材上經由含螯合形成性官能基之矽烷偶合劑以形成金屬奈米粒子之散佈物或層狀物,然後,在該金屬奈米粒子之散佈物或層狀物上形成金屬層。(9) A method for producing a substrate coated with a metal layer, characterized in that after contacting the substrate with an aqueous solution containing a hydrolysis catalyst, a decane coupling agent containing a chelating forming functional group, and a metal nanoparticle forming metal salt Forming a dispersion or layer of metal nanoparticles through a decane coupling agent containing a chelating forming functional group on the substrate by treatment with a reducing agent, and then dispersing the metal nanoparticles Or a metal layer is formed on the layer.

(10)如上述(9)記載之被覆金屬層之基材之製造方法,其中使金屬層藉由無電解電鍍法予以形成。(10) A method for producing a substrate coated with a metal layer according to (9) above, wherein the metal layer is formed by electroless plating.

藉由本發明在基材上形成金屬奈米粒子之散佈物或層狀物,以各金屬奈米粒子為起點,可容易在金屬奈米粒子之散佈物或層狀物上形成金屬層,同時在基材上形成金屬奈米粒子之層狀物時,即使在金屬奈米粒子層上產生金屬層之未形成部分,由於在基材與金屬層之間存在金屬奈米粒子層,所得的被覆金屬層之基材不會露出於基材表面下,可確保安定的導電性。By forming a dispersion or layer of metal nanoparticle on the substrate by the present invention, starting from each metal nanoparticle, a metal layer can be easily formed on the dispersion or layer of the metal nanoparticle. When a layer of metal nanoparticle is formed on the substrate, even if an unformed portion of the metal layer is formed on the metal nanoparticle layer, the resulting coated metal is present due to the presence of the metal nanoparticle layer between the substrate and the metal layer. The substrate of the layer is not exposed below the surface of the substrate, ensuring stable electrical conductivity.

另外,本發明可提供一種使上述被覆金屬層之基材在沒有使用特別的設備或裝置下,以低成本且簡單的製程,對環境而言影響很小的方法予以製造。Further, the present invention can provide a method in which the substrate of the above-mentioned metal-clad layer is produced in a low-cost and simple process without using a special equipment or apparatus, and which has little influence on the environment.

〔為實施發明之最佳形態〕[In order to implement the best form of the invention]

首先,說明有關本發明之被覆金屬層之基材。First, a substrate relating to the coated metal layer of the present invention will be described.

本發明之被覆金屬層之基材,其特徵為含有基材、與在該基材上經由含螯合形成性官能基之矽烷偶合劑所形成的金屬奈米粒子之散佈物或層狀物、在該金屬奈米粒子之散佈物或層狀物上所形成的金屬層。The substrate for covering a metal layer of the present invention is characterized by comprising a substrate and a dispersion or layer of metal nanoparticles formed on the substrate via a decane coupling agent containing a chelating forming functional group, a metal layer formed on the dispersion or layer of the metal nanoparticle.

本發明之被覆金屬層之基材中所使用的基材,以在基材表面上具有OH基,且與下述之矽烷偶合劑相互作用者較佳,該基材例如至少一種以上選自二氧化矽、陶瓷及玻璃所成群。The substrate used in the substrate for coating a metal layer of the present invention preferably has an OH group on the surface of the substrate and interacts with a decane coupling agent, for example, at least one or more selected from the group consisting of Oxide, ceramics and glass are grouped together.

二氧化矽例如經完全結晶化的乾式二氧化矽(結晶鹵化物)、水分散型二氧化矽(膠體二氧化矽)等。The cerium oxide is, for example, dry cerium oxide (crystalline halide) which is completely crystallized, water-dispersed cerium oxide (colloidal cerium oxide) or the like.

此外,陶瓷例如氧化鋁(alumina)、藍寶石、多鋁紅柱石、氧化鈦(titania)、碳化矽、氮化矽、氮化鋁、氧化鋯等。Further, ceramics such as alumina, sapphire, mullite, titania, tantalum carbide, tantalum nitride, aluminum nitride, zirconia, and the like.

玻璃例如BK7、SF11、LaSFN9等各種噴砂玻璃、光學圓玻璃、鹼玻璃、鹼石灰玻璃、低膨脹硼矽酸鹽玻璃等。Glass such as BK7, SF11, LaSFN9 and the like various kinds of sandblasted glass, optical round glass, alkali glass, soda lime glass, low expansion borosilicate glass, and the like.

另外,基材除上述外,以與矽烷偶合劑相互作用為條件下亦可使用樹脂類,樹脂類例如聚矽氧烷樹脂、苯酚樹脂、天然改性苯酚樹脂、環氧樹脂、聚乙烯醇系樹脂、纖維素系樹脂、聚醯胺樹脂(耐龍)等、或聚烯烴系樹脂、苯乙烯系樹脂、丙烯酸系樹脂等、以及此等之改性物或藉由電暈放電等之表面處理物。Further, in addition to the above, the substrate may be a resin such as a polyoxyalkylene resin, a phenol resin, a natural modified phenol resin, an epoxy resin, or a polyvinyl alcohol under the conditions of interaction with a decane coupling agent. a resin, a cellulose resin, a polyamide resin, or a polyolefin resin, a styrene resin, an acrylic resin, or the like, or a modified product thereof or a surface treatment by corona discharge or the like Things.

有關基材之形狀,沒有特別的限制,以至少1種以上選自球狀、粒子狀、珠狀、棒狀、板狀、針狀、粉末狀、中空狀、中空纖維狀及不特定形狀所成群較佳。基材之形狀以微粒子形狀更佳,其平均粒徑以0.1~100μm較佳、以1~20μm更佳。而且,於本說明書中,平均粒徑係指體積平均粒徑,體積平均粒徑例如可以粒度分布測定器等進行測定。The shape of the substrate is not particularly limited, and may be at least one selected from the group consisting of a spherical shape, a particle shape, a bead shape, a rod shape, a plate shape, a needle shape, a powder form, a hollow shape, a hollow fiber shape, and an unspecified shape. The group is better. The shape of the substrate is preferably in the form of fine particles, and the average particle diameter is preferably from 0.1 to 100 μm, more preferably from 1 to 20 μm. Further, in the present specification, the average particle diameter means a volume average particle diameter, and the volume average particle diameter can be measured, for example, by a particle size distribution measuring instrument or the like.

基材之表面具有凹凸時,容易進行底層處理,故較佳。該基材例如擦拭玻璃、多孔質粒子等。此外,基材以其表面被氧化者較佳。When the surface of the substrate has irregularities, it is easy to carry out the underlayer treatment, which is preferable. The substrate is, for example, a wipe glass, a porous particle or the like. Further, the substrate is preferably oxidized on its surface.

於本發明之被覆金屬層之基材中,上述基材與下述金屬奈米粒子之散佈物或層狀物間存在的含螯合形成性官能基之矽烷偶合劑,在分子之一端具有螯合形成性官能基,且在另一端上具有矽烷醇(Si-OH)及/或藉由水解所賦予的矽烷醇基的水解性官能基之化合物所成。In the substrate coated with the metal layer of the present invention, the decane coupling agent having a chelate-forming functional group existing between the substrate and the dispersion or layer of the metal nanoparticle described below has a chelate at one end of the molecule It forms a functional group and has a decyl alcohol (Si-OH) at the other end and/or a compound which hydrolyzed the hydrolyzable functional group of the stanol group imparted by the hydrolysis.

螯合形成性官能基例如極性基或親水性基,以至少具有一種以上選自氮原子、硫原子及氧原子所成群的原子之官能基較佳,以至少一種以上選自-SH、-CN、-NH2 、-SO2 OH、-SOOH、-OPO(OH)2 ,-COOH所成群的官能基更佳。The chelate-forming functional group such as a polar group or a hydrophilic group is preferably a functional group having at least one atom selected from the group consisting of a nitrogen atom, a sulfur atom and an oxygen atom, and at least one selected from the group consisting of -SH and - The functional groups of CN, -NH 2 , -SO 2 OH, -SOOH, -OPO(OH) 2 , -COOH are more preferred.

此外,水解性官能基例如直接鍵結於Si原子上之烷氧基(-OR)等,構成上述烷氧基之R以碳數為1~6之直鏈狀、支鏈狀、環狀中任何一種的烷基較佳,具體而言例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第2-丁基、第3-丁基、戊基、己基、環戊基、環己基等。Further, the hydrolyzable functional group is, for example, an alkoxy group (-OR) directly bonded to a Si atom, and the R constituting the alkoxy group is a linear, branched or cyclic group having a carbon number of 1 to 6. Any alkyl group is preferred, and specifically, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, 2-butyl, 3-butyl, pentyl, hexyl , cyclopentyl, cyclohexyl and the like.

本發明被覆金屬層之基材中所使用的含螯合形成性官能基之矽烷偶合劑的具體例,如3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基三乙氧基矽烷,就矽烷偶合劑之成本、及處理容易性而言,以3-胺基丙基三甲氧基矽烷更佳。Specific examples of the chelating-forming functional group-containing decane coupling agent used in the substrate for coating the metal layer of the present invention, such as 3-aminopropyltrimethoxydecane, 3-aminopropyltriethoxydecane , N-2-(aminoethyl)-3-aminopropyltrimethoxydecane, N-2-(aminoethyl)-3-aminopropyltriethoxydecane, as a decane coupling agent The 3-aminopropyltrimethoxydecane is more preferable in terms of cost and ease of handling.

本發明之被覆金屬層之基材中,矽烷偶合劑一端之螯合形成性官能基係配位鍵結於金屬奈米粒子,矽烷偶合劑之另一端的矽烷醇基與基材表面之OH基相互作用。In the metal layer-coated substrate of the present invention, the chelate-forming functional group at one end of the decane coupling agent is coordinately bonded to the metal nanoparticle, the decyl alcohol group at the other end of the decane coupling agent and the OH group on the surface of the substrate. interaction.

因此,經由矽烷偶合劑,可使金屬奈米粒子之散佈物或層狀物安定、固定於基材上。Therefore, the dispersion or layer of the metal nanoparticles can be stabilized and fixed on the substrate via the decane coupling agent.

於本發明之被覆金屬層之基材,金屬奈米粒子以由至少一種以上選自金、銀、銅及鎳所成群的金屬所成之奈米粒子較佳。在金屬奈米粒子上藉由銀鏡反應形成金屬層(由銀所成的金屬層)、就考慮與銀之均染性良好而言,以金屬奈米粒子為金之奈米粒子較佳。In the base material of the metal-clad layer of the present invention, the metal nanoparticle is preferably a nanoparticle composed of at least one metal selected from the group consisting of gold, silver, copper and nickel. It is preferable to form a metal layer (a metal layer made of silver) by a silver mirror reaction on a metal nanoparticle, and it is preferable to use a metal nanoparticle as a gold nanoparticle in consideration of good dyeing property with silver.

金屬奈米粒子只要是經由矽烷偶合劑,至少部分附著於基材上即可,金屬奈米粒子之存在狀態例如散佈於基材上形成散佈物的狀態,或一樣地附著於基材上形成層狀物之狀態。金屬奈米粒子在沒有一樣地附著於基材上、形成散布時,由於可以各種金屬奈米粒子為起點,在金屬奈米粒子之散佈物上形成下述之金屬層,故可確保所得的被覆金屬層之基材具有安定的導電性。The metal nanoparticles may be at least partially adhered to the substrate via a decane coupling agent, and the metal nanoparticles may be present in a state of being dispersed on the substrate to form a dispersion, or may be attached to the substrate to form a layer. The state of the object. When the metal nanoparticles are not adhered to the substrate in the same manner and are dispersed, the metal layer described below can be used as a starting point for various metal nanoparticles, and the following metal layer can be formed on the dispersion of the metal nanoparticles to ensure the obtained coating. The substrate of the metal layer has a stable electrical conductivity.

另外,金屬奈米粒子一樣地附著於基材上、形成層狀物時,當然可在該金屬奈米粒子層之全面上形成下述之金屬層,假設即使產生金屬層之未形成部分,由於在基材與金屬層之間存在有金屬奈米粒子層,所得的被覆金屬層之基材在沒有露出於基材表面下,可確保具有安定的導電性。Further, when the metal nanoparticles are attached to the substrate in the same manner to form a layer, it is of course possible to form the following metal layer on the entire surface of the metal nanoparticle layer, assuming that even if an unformed portion of the metal layer is generated, A metal nanoparticle layer is present between the substrate and the metal layer, and the obtained metal layer-coated substrate is ensured to have stable conductivity without being exposed to the surface of the substrate.

而且,於本說明書中,金屬奈米粒子係指粒徑100nm以下之金屬所成的極小粒子。相同體積之大體積原子與奈米粒子之表面基相比時,由於奈米粒子之表面積者大,表面能量大(對全部能量而言之比例高),故期待具有與習知微粒子不同的特性,惟於本發明之被覆金屬層之基材中,使金屬層藉由無電解電鍍予以形成時,考慮以金屬奈米粒子作用為觸媒。Further, in the present specification, the metal nanoparticle refers to an extremely small particle made of a metal having a particle diameter of 100 nm or less. When the large volume atom of the same volume is compared with the surface group of the nano particle, since the surface area of the nano particle is large and the surface energy is large (the ratio of all energy is high), it is expected to have characteristics different from those of the conventional particle. However, in the base material of the metal-clad layer of the present invention, when the metal layer is formed by electroless plating, it is considered that the metal nanoparticle acts as a catalyst.

於本發明之被覆金屬層之基材中,構成在金屬奈米粒子層上所形成的金屬層之金屬種類,沒有特別的限制,以銀、金、銅、鎳較佳,上述金屬層以藉由銀鏡反應形成較佳,故構成金屬層之金屬種類以銀更佳。In the base material of the metal-clad layer of the present invention, the metal species constituting the metal layer formed on the metal nanoparticle layer is not particularly limited, and silver, gold, copper, and nickel are preferably used, and the metal layer is borrowed. It is preferably formed by a silver mirror reaction, so that the metal species constituting the metal layer is more preferably silver.

本發明之被覆金屬層之基材,可藉由下述說明的本發明被覆金屬層之基材的製造方法予以製造。The base material of the metal-clad layer of the present invention can be produced by the method for producing a substrate coated with a metal layer of the present invention described below.

本發明之被覆金屬層之基材的製造方法,其特徵為使基材接觸含有水解觸媒、含螯合形成性官能基之矽烷偶合劑及金屬奈米粒子形成性金屬鹽之水性溶液後,藉由以還原劑進行處理,在基材上經由含螯合形成性官能基之矽烷偶合劑以形成金屬奈米粒子之散佈物或層狀物,然後,在該金屬奈米粒子之散佈物或層狀物上形成金屬層。A method for producing a metal layer-coated substrate according to the present invention, characterized in that after the substrate is brought into contact with an aqueous solution containing a hydrolysis catalyst, a chelating coupling functional group-containing decane coupling agent, and a metal nanoparticle-forming metal salt, Forming a dispersion or layer of metal nanoparticles via a decane coupling agent containing a chelating forming functional group on the substrate by treatment with a reducing agent, and then spreading the metal nanoparticle or A metal layer is formed on the layer.

本發明之被覆金屬層之基材的製造方法中所使用的基材,例如與上述本發明被覆金屬層之基材說明者相同,如二氧化矽、陶瓷、玻璃、各種樹脂類等。The substrate used in the method for producing a metal layer-coated substrate of the present invention is, for example, the same as the substrate described above for the metal layer of the present invention, such as ceria, ceramics, glass, various resins, and the like.

本發明之被覆金屬層之基材的製造方法中所使用的水解觸媒、沒有特別的限制,例如醋酸酐、冰醋酸、丙酸、檸檬酸、甲酸、草酸等之有機酸、烷基乙酸鋁等之鋁螯合化合物、銨水等之無機鹼性化合物等。於此等之中,就考慮與矽烷偶合劑之3-胺基丙基三甲氧基矽烷之反應性、成本而言,以銨水較佳。The hydrolysis catalyst used in the method for producing a metal layer-coated substrate of the present invention is not particularly limited, and examples thereof include organic acids such as acetic anhydride, glacial acetic acid, propionic acid, citric acid, formic acid, and oxalic acid, and aluminum alkyl acetate. An aluminum chelate compound, an inorganic basic compound such as ammonium water, or the like. Among these, ammonium hydroxide is preferred in view of its reactivity with the 3-aminopropyltrimethoxydecane of the decane coupling agent and cost.

本發明之被覆金屬層之基材的製造方法中所使用的含螯合形成性官能基之矽烷偶合劑,係為如上述在分子之一端具有螯合形成性官能基、且在另一端具有矽烷基及/或藉由水解賦予矽烷醇基之水解性官能基者。The chelating-forming functional group-containing decane coupling agent used in the method for producing a metal layer-coated substrate of the present invention has a chelate-forming functional group at one end of the molecule and a decane at the other end as described above. And/or by hydrolysis to impart a hydrolyzable functional group to the stanol group.

螯合形成性官能基可例如與上述相同者,亦可以上述各官能基之鹽的形態提供。官能基為-OH、-SH、-SO2 OH、-SOOH、-OPO(OH)2 、-COOH等之酸性基時,其鹽例如鈉、鉀、鋰等之鹼金屬鹽、或銨鹽等。另外,為-NH2 等鹼性基時,其鹽例如鹽酸、硫酸、硝酸等之無機酸、甲酸、醋酸、丙酸、三氟醋酸等有機酸之加成鹽等。The chelate-forming functional group may be, for example, the same as the above, or may be provided in the form of a salt of each of the above functional groups. When the functional group is an acidic group such as -OH, -SH, -SO 2 OH, -SOOH, -OPO(OH) 2 or -COOH, the salt thereof is an alkali metal salt such as sodium, potassium or lithium, or an ammonium salt or the like. . Further, when it is a basic group such as -NH 2 , the salt thereof is, for example, an inorganic acid such as hydrochloric acid, sulfuric acid or nitric acid, an addition salt of an organic acid such as formic acid, acetic acid, propionic acid or trifluoroacetic acid.

此外,水解性官能基例如可與上述本發明之被覆金屬層之基材所說明者相同。Further, the hydrolyzable functional group can be, for example, the same as those described above for the base material of the coated metal layer of the present invention.

於本發明之被覆金屬層之基材的製造方法中所使用的構成金屬奈米粒子形成性金屬鹽之金屬種,與上述本發明之被覆金屬層之基材所說明者相同,例如金、銀、銅、鎳等。金屬鹽例如氯化金酸、硝酸銀、硫酸銅、硫酸鎳等。The metal species constituting the metal nanoparticle-forming metal salt used in the method for producing a metal layer of the coated metal layer of the present invention is the same as that described above for the substrate of the metal layer of the present invention, for example, gold or silver. , copper, nickel, etc. Metal salts such as gold chloride acid, silver nitrate, copper sulfate, nickel sulfate, and the like.

於本發明之被覆金屬層之基材的製造方法中所使用的水性溶液,只要是以水為主成分者即可,沒有特別的限制,亦可含有水與水混合性有機化合物。此處,水混合性有機化合物之例,如甲醇、乙醇、丙醇、丁醇等之低元醇類、丙酮等之酮類等。此時,水混合性有機化合物可單獨與水混合使用、亦可2種以上組合與水混合。The aqueous solution to be used in the method for producing a metal layer of the metal layer of the present invention is not particularly limited as long as it is water-based, and may contain a water-water mixed organic compound. Here, examples of the water-miscible organic compound include low-alcohols such as methanol, ethanol, propanol, and butanol, and ketones such as acetone. In this case, the water-miscible organic compound may be used alone or in combination of two or more kinds with water.

還原劑以考慮使用的金屬奈米粒子性金屬鹽之金屬成分的氧化還原電位予以適當使用。還原劑只要是溶解於水性溶液所得者即可,沒有特別的限制,可適當選自上述習知的還原劑使用。該還原劑例如四氫硼酸鈉等之氫化硼酸鹽(氫化硼鈉等之鹼金屬氫化硼酸鹽類、銨氫化硼酸鹽類等)、聯胺系化合物類、次亞氯酸鹽等之無機系還原劑、甲醛、乙醛、檸檬酸、檸檬酸鈉等之有機系還原劑。此等之還原劑可單獨1種使用,亦可2種以上組合使用。The reducing agent is suitably used in consideration of the oxidation-reduction potential of the metal component of the metal nanoparticulate metal salt to be used. The reducing agent is not particularly limited as long as it is obtained by dissolving in an aqueous solution, and may be appropriately selected from the above-mentioned conventional reducing agents. The reducing agent is, for example, an inorganic reduction such as a borohydride such as sodium tetrahydroborate or an alkali metal hydride borate such as sodium borohydride or an ammonium hydride borate; a hydrazine compound or a hypochlorite. An organic reducing agent such as a formaldehyde, formaldehyde, acetaldehyde, citric acid or sodium citrate. These reducing agents may be used alone or in combination of two or more.

於本發明之被覆金屬層之基材的製造方法中,金屬奈米粒子之散佈物或層狀物之形成,係藉由使基材接觸含有水解觸媒、含螯合形成性官能基之矽烷偶合劑及金屬奈米粒子形成性金屬鹽之水性溶液後,以還原劑進行處理。具體的方法,例如在含有基材及水解性觸媒之水性溶液(A液)中,加入含有含螯合形成性官能基之矽烷偶合劑及金屬奈米粒子形成性金屬鹽的溶液(B液)予以攪拌後,在該混合溶液中滴入含有還原劑之溶液(C液),進行加熱、攪拌的方法。In the method for producing a substrate coated with a metal layer according to the present invention, the dispersion or layer of the metal nanoparticle is formed by contacting the substrate with a decane containing a hydrolysis catalyst and a chelating forming functional group. The coupling agent and the aqueous solution of the metal nanoparticle-forming metal salt are treated with a reducing agent. In a specific method, for example, a solution containing a chelating-forming functional group-containing decane coupling agent and a metal nanoparticle-forming metal salt is added to an aqueous solution (liquid A) containing a substrate and a hydrolyzable catalyst (solution B) After stirring, a solution containing a reducing agent (liquid C) is dropped into the mixed solution, and heating and stirring are carried out.

使A液與B液混合、攪拌時之溫度,以10~40℃較佳,攪拌時間以1~30分鐘較佳。在A液與B液之混合液中滴入C液後之加熱溫度,以30~70℃較佳,加熱時間以2~5小時較佳。The temperature at which the liquid A and the liquid B are mixed and stirred is preferably 10 to 40 ° C, and the stirring time is preferably 1 to 30 minutes. The heating temperature after dropping the liquid C into the mixture of the A liquid and the B liquid is preferably 30 to 70 ° C, and the heating time is preferably 2 to 5 hours.

對1莫耳含螯合形成性官能基之矽烷偶合劑而言,水解觸媒之使用量以0.5~5.0莫耳較佳,以1.5~2.5莫耳更佳。此外,對1莫耳含螯合形成性官能基之矽烷偶合劑而言,金屬奈米粒子形成性金屬鹽之使用量以0.005~0.05莫耳較佳,以0.015~0.025莫耳更佳。另外,對1莫耳金屬奈米粒子形成性金屬鹽而言,還原劑之使用量以0.025~0.25莫耳較佳,以0.075~0.125莫耳更佳。For a 1 molar chelating coupling functional decane coupling agent, the amount of the hydrolysis catalyst used is preferably 0.5 to 5.0 moles, more preferably 1.5 to 2.5 moles. Further, the metal nanoparticle-forming metal salt is preferably used in an amount of from 0.005 to 0.05 mol, more preferably from 0.015 to 0.025 mol, per mole of the decane coupling agent having a chelate-forming functional group. Further, for the 1 mol metal nanoparticle-forming metal salt, the reducing agent is preferably used in an amount of 0.025 to 0.25 mol, more preferably 0.075 to 0.125 mol.

於本發明之被覆金屬層之基材的製造方法中,以在金屬奈米粒子之散佈物或層狀物上形成金屬層作為最終製程。In the method for producing a substrate coated with a metal layer of the present invention, a metal layer is formed on the dispersion or layer of the metal nanoparticle as a final process.

形成金屬層之金屬,可使用如上所述之銀、金、銅、鎳等。As the metal forming the metal layer, silver, gold, copper, nickel, or the like as described above can be used.

金屬層之形成方法,以無電場電鍍法較佳,就考慮反應之進行度及安定性時,以銀鏡反應更佳。The method for forming the metal layer is preferably an electroless plating method, and the silver mirror reaction is more preferable in consideration of the progress of the reaction and the stability.

如上所述,形成使金屬奈米粒子一樣地附著於基材上之層時,金屬層並不一定必須被覆於金屬奈米粒子層之全面上。As described above, when a layer in which metal nanoparticles are attached to the substrate in the same manner is formed, the metal layer does not necessarily have to be coated on the entire surface of the metal nanoparticle layer.

於本發明之被覆金屬層之基材的製造方法中,藉由在基材上被覆以矽烷偶合劑形成安定化的金屬奈米粒子之散佈物或層狀物後,以無電解電鍍法形成金屬層,在不一定必須以一般的無電解電鍍之基材表面的活性化處理製程下,可在基材上形成金屬層。另外,在基材上形成金屬奈米粒子之層狀物時,假設即使在金屬奈米粒子層上產生金屬層之無電解電鍍層的未形成部分,由於在基材與金屬層之間存在金屬奈米粒子層,故所得的被覆金屬層之基材可在沒有露出基材表面下,確保安定的導電性。而且,可使上述被覆金屬層之基材在沒有使用特別的設備或裝置下,以低成本且簡單的製程、對環境而言影響很少地予以製造。In the method for producing a substrate coated with a metal layer according to the present invention, a dispersion of a stabilized metal nanoparticle or a layer is formed by coating a substrate with a decane coupling agent, and then forming a metal by electroless plating. The layer may form a metal layer on the substrate under an activation treatment process that does not necessarily have to be on the surface of the substrate for general electroless plating. Further, when a layer of metal nanoparticle is formed on a substrate, it is assumed that even if an unformed portion of the electroless plating layer of the metal layer is formed on the metal nanoparticle layer, metal exists between the substrate and the metal layer. Since the nanoparticle layer is formed, the substrate of the obtained metal layer can be ensured to have stable conductivity without exposing the surface of the substrate. Further, the substrate on which the metal layer is coated can be produced with little influence on the environment at a low cost and in a simple process without using a special equipment or apparatus.

〔實施例〕[Examples]

其次,藉由實施例更詳細地說明本發明,惟本發明不受該例所限制。Next, the present invention will be described in more detail by way of examples, but the invention is not limited by the examples.

實施例1(被覆銀層之二氧化矽粒子的製造例)Example 1 (Production Example of Cerium Oxide Particles Covered with Silver Layer)

(1)在二氧化矽粒子上形成金奈米粒子層在500mL之三角燒瓶中加入10g二氧化矽粒子(平均粒徑6.4μm),加入63g異丙醇(IPA),進行超音波處理10分鐘。此外,加入63g甲醇,以磁力攪拌器進行攪拌10分鐘,且加入50g之25%銨水溶液,在油浴中、30℃下攪拌10分鐘(以該溶液作為A液)。(1) Formation of a layer of gold nanoparticles on cerium oxide particles 10 g of cerium oxide particles (average particle diameter: 6.4 μm) was placed in a 500 mL Erlenmeyer flask, and 63 g of isopropyl alcohol (IPA) was added thereto, and ultrasonic treatment was performed for 10 minutes. . Further, 63 g of methanol was added, and the mixture was stirred for 10 minutes with a magnetic stirrer, and 50 g of a 25% aqueous ammonium solution was added thereto, and the mixture was stirred in an oil bath at 30 ° C for 10 minutes (the solution was used as the solution A).

在0.23g氯化金酸(HAuCl4 .4H2 O)中加入50mL甲醇,以磁力攪拌器進行攪拌10分鐘後,加入4.5mL之3-胺基丙基三甲氧基矽烷,再進行攪拌10分鐘(以該溶液作為B液)。Add 50 mL of methanol to 0.23 g of gold chloride acid (HAuCl 4 .4H 2 O), stir for 10 minutes with a magnetic stirrer, then add 4.5 mL of 3-aminopropyltrimethoxydecane, and stir for another 10 minutes. (This solution is used as the B solution).

在0.107g四氫硼酸鈉(NaBH4 )中加入50mL甲醇,以磁力攪拌器進行攪拌10分鐘(以該溶液作為C液)。50 mL of methanol was added to 0.107 g of sodium tetrahydroborate (NaBH 4 ), and the mixture was stirred with a magnetic stirrer for 10 minutes (this solution was used as the C solution).

在A液中加入B液,在30℃下進行攪拌5分鐘後,慢慢地滴入C液時,反應系變化成紅色。滴入C液後,使油浴在65℃下過熱,進行攪拌3小時。停止攪拌,進行3次甲醇分級後,予以吸引過濾,採取形成有金奈米粒子層之二氧化矽粒子,且在烤箱中、70℃下進行乾燥3小時。所得的粒子呈紅色。The liquid B was added to the liquid A, and the mixture was stirred at 30 ° C for 5 minutes. Then, when the liquid C was slowly dropped, the reaction system was changed to red. After dropping the liquid C, the oil bath was overheated at 65 ° C and stirred for 3 hours. Stirring was stopped, and methanol fractionation was carried out three times, and then suction filtration was carried out, and cerium oxide particles having a layer of gold nanoparticles formed thereon were taken, and dried in an oven at 70 ° C for 3 hours. The resulting particles are red in color.

所得的形成有金奈米粒子層之二氧化矽粒子的電子顯微鏡(SEM)照片如第1圖所示。由第1圖可知,二氧化矽粒子全部表面上均勻地附著有金奈米粒子。An electron microscope (SEM) photograph of the obtained cerium oxide particles having a gold nanoparticle layer formed is shown in Fig. 1. As can be seen from Fig. 1, the gold nanoparticles are uniformly adhered to the entire surface of the ceria particles.

(2)在金奈米粒子層上形成銀層在1g以上述(1)所得的形成有金奈米粒子層之二氧化矽粒子中加入200mL水,進行超音波處理10分鐘後,加入0.65g硝酸銀,以磁力攪拌器進行攪拌10分鐘。加入13mL之25%銨水溶液後,添加20mL之0.24毫莫耳/L甲醛水溶液,進行攪拌5分鐘。以吸引過濾採取經沉澱的被覆銀層之二氧化矽粒子,且以甲醇進行洗淨後,在烤箱、70℃下進行乾燥3小時。(2) Forming a silver layer on the layer of gold nanoparticles. 1 g of 200 g of water was added to the cerium oxide particles having the layer of gold nanoparticles formed in the above (1), and ultrasonic treatment was carried out for 10 minutes, and then 0.65 g was added. Silver nitrate was stirred with a magnetic stirrer for 10 minutes. After adding 13 mL of a 25% aqueous ammonium solution, 20 mL of a 0.24 mmol/L aqueous formaldehyde solution was added and stirred for 5 minutes. The precipitated silver-coated cerium oxide particles were taken by suction filtration, washed with methanol, and dried in an oven at 70 ° C for 3 hours.

所得的被覆銀層之二氧化矽粒子的電子顯微鏡(SEM)照片如第2圖所示。由第2圖可知,在金奈米粒子層之全面上層合有由銀所成的層。An electron microscope (SEM) photograph of the obtained silver-coated cerium oxide particles is shown in Fig. 2. As can be seen from Fig. 2, a layer made of silver is laminated on the entire layer of the gold nanoparticle layer.

以微小壓縮試驗機測定20個被覆銀層之二氧化矽粒子之電阻值,求取其平均值。所得的結果與標準偏差如表1所示。The resistance values of the 20 silver-coated cerium oxide particles were measured by a micro compression tester, and the average value thereof was determined. The results obtained and the standard deviation are shown in Table 1.

由表1之結果可知,以實施例1所得的被覆銀層之二氧化矽粒子,平均電阻值為3.9Ω之低值,標準偏差為2.2,導電性安定。As is clear from the results of Table 1, the cerium oxide particles coated with the silver layer obtained in Example 1 had a low average value of 3.9 Ω and a standard deviation of 2.2, and the conductivity was stable.

實施例2(被覆銀層之聚醯亞胺粒子的製造例)Example 2 (Production Example of Polyimine Particles Covered with Silver Layer)

在500mL之三角燒瓶中加入3g聚醯亞胺粒子(住友貝谷賴頓(譯音)(股)製:平均粒徑0.5μm),加入63g異丙醇(IPA),進行超音波處理10分鐘。另外,加入63g甲醇,以磁力攪拌器進行攪拌10分鐘,加入50g之25%銨水溶液,在油浴中、30℃下進行攪拌10分鐘(以該溶液作為A液)。To a 500 mL Erlenmeyer flask, 3 g of polyimide particles (manufactured by Sumitomo Beyton, Inc.: average particle diameter: 0.5 μm) were added, and 63 g of isopropyl alcohol (IPA) was added thereto, and ultrasonic treatment was performed for 10 minutes. Separately, 63 g of methanol was added, and the mixture was stirred for 10 minutes with a magnetic stirrer, and 50 g of a 25% aqueous ammonium solution was added thereto, and the mixture was stirred at 30 ° C for 10 minutes in an oil bath (the solution was used as the solution A).

在0.50g氯化金酸(HAuCl4 .4H2 O)中加入50mL甲醇,以磁力攪拌器進行攪拌10分鐘後,加入7.0mL之3-胺基丙基三甲氧基矽烷,再進行攪拌10分鐘(以該溶液作為B液)。50 mL of methanol was added to 0.50 g of gold chloride acid (HAuCl 4 .4H 2 O), and the mixture was stirred for 10 minutes with a magnetic stirrer. Then, 7.0 mL of 3-aminopropyltrimethoxydecane was added, followed by stirring for 10 minutes. (This solution is used as the B solution).

在0.23g四氫硼酸鈉(NaBH4 )中加入50mL甲醇,以磁力攪拌器進行攪拌10分鐘(以該溶液作為C液)。50 mL of methanol was added to 0.23 g of sodium tetrahydroborate (NaBH 4 ), and the mixture was stirred with a magnetic stirrer for 10 minutes (this solution was used as the C solution).

在A液中加入B液,在30℃下進行攪拌5分鐘後,慢慢地滴入C液時,反應系變化成紅色。滴入C液後,使油浴在65℃下過熱,進行攪拌3小時。停止攪拌,進行3次甲醇分級後,予以吸引過濾,採取形成有金奈米粒子層之二氧化矽粒子,且在烤箱中、70℃下進行乾燥3小時。所得的粒子呈紅色。The liquid B was added to the liquid A, and the mixture was stirred at 30 ° C for 5 minutes. Then, when the liquid C was slowly dropped, the reaction system was changed to red. After dropping the liquid C, the oil bath was overheated at 65 ° C and stirred for 3 hours. Stirring was stopped, and methanol fractionation was carried out three times, and then suction filtration was carried out, and cerium oxide particles having a layer of gold nanoparticles formed thereon were taken, and dried in an oven at 70 ° C for 3 hours. The resulting particles are red in color.

在0.5g所得的形成有金奈米粒子層之聚醯亞胺粒子中加入300mL水,進行超音波處理15分鐘後,加入0.67g硝酸銀,以磁力攪拌器進行攪拌10分鐘。加入20mL之25%銨水溶液後,添加30mL之0.24毫莫耳/L甲醛水溶液,進行攪拌5分鐘。進行吸引過濾以採取經沉澱的被覆銀層之聚醯亞胺粒子,以甲醇進行洗淨後,在烤箱、70℃下進行乾燥3小時。After 0.5 g of water was added to 0.5 g of the obtained polyimine particles having the gold nanoparticle layer, and ultrasonic treatment was performed for 15 minutes, 0.67 g of silver nitrate was added, and the mixture was stirred for 10 minutes with a magnetic stirrer. After adding 20 mL of a 25% ammonium aqueous solution, 30 mL of a 0.24 mmol/L aqueous formaldehyde solution was added and stirred for 5 minutes. The polyimine particles which were subjected to suction filtration to take the precipitated silver layer were washed with methanol, and then dried in an oven at 70 ° C for 3 hours.

使所得的被覆銀層之聚醯亞胺粒子的電子顯微鏡(SEM)照片如第3圖所示。由第3圖可知,在金奈米粒子層之全面上層合有由銀所成的層。An electron microscope (SEM) photograph of the obtained silver-coated polyimide layer particles is shown in Fig. 3. As can be seen from Fig. 3, a layer made of silver is laminated on the entire layer of the gold nanoparticle layer.

實施例3(被覆銀層之氧化鈦粉末的製造例)Example 3 (Production Example of Titanium Oxide Powder Covered with Silver Layer)

在300mL之三角燒瓶中加入5g氧化鈦粉末(石原產業(股)製:ST-01),加入31.5g異丙醇(IPA),進行超音波處理10分鐘。另外,加入31.5g甲醇,以磁力攪拌器進行攪拌10分鐘,加入25g之25%銨水溶液,在油浴中、30℃下進行攪拌10分鐘(以該溶液作為A液)。To a 300 mL Erlenmeyer flask, 5 g of titanium oxide powder (manufactured by Ishihara Sangyo Co., Ltd.: ST-01) was added, and 31.5 g of isopropyl alcohol (IPA) was added thereto, and ultrasonic treatment was performed for 10 minutes. Further, 31.5 g of methanol was added, and the mixture was stirred for 10 minutes with a magnetic stirrer, and 25 g of a 25% aqueous ammonium solution was added thereto, and the mixture was stirred in an oil bath at 30 ° C for 10 minutes (this solution was used as the solution A).

在0.20g氯化金酸(HAuCl4 .4H2 O)中加入50mL甲醇,以磁力攪拌器進行攪拌10分鐘後,加入2.2mL之3-胺基丙基三甲氧基矽烷,再進行攪拌10分鐘(以該溶液作為B液)。Add 50 mL of methanol to 0.20 g of gold chloride acid (HAuCl 4 .4H 2 O), stir for 10 minutes with a magnetic stirrer, then add 2.2 mL of 3-aminopropyltrimethoxydecane, and stir for another 10 minutes. (This solution is used as the B solution).

在0.092g四氫硼酸鈉(NaBH4 )中加入50mL甲醇,以磁力攪拌器進行攪拌10分鐘(以該溶液作為C液)。50 mL of methanol was added to 0.092 g of sodium tetrahydroborate (NaBH 4 ), and the mixture was stirred for 10 minutes with a magnetic stirrer (the solution was used as the C solution).

在A液中加入B液,在30℃下進行攪拌5分鐘後,慢慢地滴入C液時,反應系變化成紫紅色。滴入C液後,使油浴在65℃下過熱,進行攪拌3小時。停止攪拌,進行3次甲醇分級後,予以吸引過濾,採取形成有金奈米粒子層之氧化鈦粉末,且在烤箱中、70℃下進行乾燥3小時。所得的粒子呈紫紅色。The liquid B was added to the liquid A, and the mixture was stirred at 30 ° C for 5 minutes. Then, when the liquid C was slowly dropped, the reaction system was changed to purple. After dropping the liquid C, the oil bath was overheated at 65 ° C and stirred for 3 hours. Stirring was stopped, and methanol fractionation was carried out three times, and then suction filtration was carried out, and titanium oxide powder in which a layer of gold nanoparticles was formed was taken, and dried in an oven at 70 ° C for 3 hours. The resulting particles were purplish red.

在3.0g所得的形成有金奈米粒子層之氧化鈦粉末中加入300mL水,進行超音波處理15分鐘後,加入0.67g硝酸銀,以磁力攪拌器進行攪拌10分鐘。加入20mL之25%銨水溶液後,添加30mL之0.24毫莫耳/L甲醛水溶液,進行攪拌5分鐘。進行吸引過濾以採取經沉澱的被覆銀層之氧化鈦粒子,以甲醇進行洗淨後,在烤箱、70℃下進行乾燥3小時。300 mL of water was added to 3.0 g of the obtained titanium oxide powder layer having the gold nanoparticle layer, and after ultrasonic treatment for 15 minutes, 0.67 g of silver nitrate was added, and the mixture was stirred for 10 minutes with a magnetic stirrer. After adding 20 mL of a 25% ammonium aqueous solution, 30 mL of a 0.24 mmol/L aqueous formaldehyde solution was added and stirred for 5 minutes. The titanium oxide particles of the precipitated silver coating layer were subjected to suction filtration, washed with methanol, and dried in an oven at 70 ° C for 3 hours.

以電子顯微鏡(SEM)觀察所得的被覆金奈米粒子層之氧化鈦粉末結果,可知在金奈米粒子層之全面上層合有由銀所成的層。As a result of observing the obtained titanium oxide powder of the coated gold nanoparticle layer by an electron microscope (SEM), it was found that a layer made of silver was laminated on the entire surface of the gold nanoparticle layer.

實施例4(被覆銀層之聚丙烯粉末的製造例)Example 4 (Production Example of Polypropylene Powder Covered with Silver Layer)

於實施例3中,除使氧化鈦改為5g聚丙烯粉末(布賴姆(譯音)聚合物公司製)外,進行相同的作業,製得被覆銀之聚丙烯粉末。In the third embodiment, the silver-coated polypropylene powder was obtained by performing the same operation except that the titanium oxide was changed to 5 g of polypropylene powder (manufactured by Brym Polymer Co., Ltd.).

使所得的被覆銀之聚丙烯粉末以電子顯微鏡(SEM)觀察的結果,可知在金奈米粒子層之全面上層合有由銀所成的層。As a result of observing electron microscopy (SEM) of the obtained silver-coated polypropylene powder, it was found that a layer made of silver was laminated on the entire surface of the gold nanoparticle layer.

實施例5(被覆銀層之玻璃板的製造例)Example 5 (Production Example of Glass Plate Covered with Silver Layer)

於實施例3中,除在三角燒瓶中使氧化鈦改為1×1cm2 微條玻璃板(松浪玻璃工業(股)製)、浸漬外,進行相同的作業,製得被覆銀之玻璃板。In the third embodiment, the same operation was carried out except that the titanium oxide was changed to a 1 × 1 cm 2 micro glass plate (manufactured by Matsuron Glass Co., Ltd.) in an Erlenmeyer flask, and a silver-coated glass plate was obtained.

使所得的被覆銀之玻璃板以電子顯微鏡(SEM)觀察的結果,可知在金奈米粒子層之全面上層合有由銀所成的層。As a result of observing the obtained silver-coated glass plate by an electron microscope (SEM), it was found that a layer made of silver was laminated on the entire surface of the gold nanoparticle layer.

實施例6(被覆銀層之中空纖維狀耐龍12的製造例)Example 6 (Production Example of Hollow Fiber Type Nylon 12 Covered with Silver Layer)

於實施例3中,除使氧化鈦改為中空纖維狀耐龍12(宇部興產(股)製)內徑48mm、外徑50mm、長度2cm外,進行相同的作業,製得被覆銀之中空纖維狀耐龍12。In the third embodiment, except that the titanium oxide was changed to a hollow fiber-like Nylon 12 (manufactured by Ube Industries, Ltd.) with an inner diameter of 48 mm, an outer diameter of 50 mm, and a length of 2 cm, the same operation was performed to obtain a hollow silver coating. Fibrous resistant dragon 12.

使所得的被覆銀之中空纖維狀耐龍12以電子顯微鏡(SEM)觀察的結果,可知在金奈米粒子層之全面上層合有由銀所成的層。As a result of observing an electron microscope (SEM) of the obtained silver-coated hollow fiber-shaped nylon 12, it was found that a layer made of silver was laminated on the entire layer of the gold nanoparticle layer.

實施例7(使用3-巰基丙基三甲氧基矽烷之附著有金奈米粒子的二氧化矽粒子之製造例)Example 7 (Production Example of Using Cerium Oxide Particles with Gold Nanoparticles Attached to 3-Mercaptopropyltrimethoxydecane)

於實施例1(1)中,除使4.5mL之3-胺基丙基三甲氧基矽烷改為4.5mL之3-巰基丙基三甲氧基矽烷外,進行相同的作業。與實施例1(1)所得的形成有金奈米粒子層之二氧化矽粒子相比時,製得在二氧化矽粒子上附著有凝聚的金奈米粒子之試料。其SEM照片如第4圖所示。In Example 1 (1), the same operation was carried out except that 4.5 mL of 3-aminopropyltrimethoxydecane was changed to 4.5 mL of 3-mercaptopropyltrimethoxydecane. When compared with the cerium oxide particle in which the gold nanoparticle layer obtained in Example 1 (1) was formed, the sample which adhered the aggregated gold nanoparticle to the cerium oxide particle was prepared. The SEM photograph is shown in Fig. 4.

實施例8(在部分的金奈米粒子層上沒有層合有銀層之例)Example 8 (Example in which no silver layer is laminated on a portion of the layer of gold nanoparticles)

在1g實施例1(1)所得的形成有金奈米粒子層之二氧化矽粒子中加入200mL水,進行超音波處理10分鐘後,加入0.41g硝酸銀,以磁力攪拌器進行攪拌10分鐘。加入8.2mL之25%銨水溶液後,添加12.6mL之0.24毫莫耳/L甲醛水溶液,進行攪拌5分鐘。進行吸引過濾以採取經沉澱的被覆銀層之二氧化矽粒子,以甲醇洗淨後,在烤箱、70℃下進行乾燥3小時。To 1 g of the cerium oxide particles having the gold nanoparticle layer obtained in Example 1 (1), 200 mL of water was added thereto, and ultrasonic treatment was carried out for 10 minutes. Then, 0.41 g of silver nitrate was added, and the mixture was stirred for 10 minutes with a magnetic stirrer. After adding 8.2 mL of a 25% aqueous ammonium solution, 12.6 mL of a 0.24 mmol/L aqueous formaldehyde solution was added and stirred for 5 minutes. The cerium oxide particles of the precipitated silver-coated layer were subjected to suction filtration, washed with methanol, and dried in an oven at 70 ° C for 3 hours.

所得的被覆銀層之二氧化矽粒子的電子顯微鏡(SEM)照片如第5圖所示。由第5圖可知,在部分的金奈米粒子層上沒有層合銀層。An electron microscope (SEM) photograph of the obtained silver-coated cerium oxide particles is shown in Fig. 5. As can be seen from Fig. 5, there is no silver layer laminated on a portion of the layer of gold nanoparticles.

以微小壓縮試驗機測定20個被覆銀層之二氧化矽粒子之電阻值,求取其平均值。所得的結果與標準偏差如表2所示。The resistance values of the 20 silver-coated cerium oxide particles were measured by a micro compression tester, and the average value thereof was determined. The results obtained and the standard deviation are shown in Table 2.

由表2之結果可知,以實施例8所得的被覆銀層之二氧化矽粒子,在部分的金奈米粒子層上沒有層合銀層,惟可知藉由金奈米粒子層存在,平均電阻值為11.8Ω之低值。As can be seen from the results of Table 2, the silver dioxide-coated cerium oxide particles obtained in Example 8 had no silver layer laminated on the partial gold nanoparticle layer, but it was found that the average resistance was present by the layer of the gold nanoparticle. The value is a low value of 11.8 Ω.

實施例9(被覆銀層之鹼石灰玻璃珠的製造例)Example 9 (Example of production of soda lime glass beads coated with a silver layer)

(1)在鹼石灰玻璃珠上形成金奈米粒子層除使用鹼石灰玻璃珠(粒徑5~63μm)取代二氧化矽粒子外,以與實施例1(1)相同的方法,在鹼石灰玻璃珠上形成金奈米粒子層。(1) Forming a layer of gold nanoparticles on soda-lime glass beads: In the same manner as in Example 1 (1), in soda lime, except that soda lime glass beads (particle size: 5 to 63 μm) were used instead of cerium oxide particles. A layer of gold nanoparticles is formed on the glass beads.

(2)在金奈米粒子層上形成銀層使用上述形成有金奈米粒子層之鹼石灰玻璃珠,與實施例1(2)相同地,在金奈米粒子層之全面上形成銀層。(2) Forming a Silver Layer on the Gold Nanoparticle Layer Using the soda lime glass beads having the above-described gold nanoparticle layer, the silver layer was formed on the entire surface of the gold nanoparticle layer in the same manner as in Example 1 (2). .

使所得的被覆銀層之鹼石灰玻璃珠的電子顯微鏡(SEM)照片如第6圖所示。An electron microscope (SEM) photograph of the obtained silver-coated soda lime glass beads is shown in Fig. 6.

以微小壓縮試驗機測定20個被覆銀層之鹼石灰玻璃珠之電阻值,求取其平均值。所得的結果與標準偏差如表3所示。The resistance values of the soda lime glass beads of 20 coated silver layers were measured by a micro compression tester, and the average value thereof was determined. The results obtained and the standard deviation are shown in Table 3.

由表3之結果可知,以實施例9所得的被覆銀層之鹼石灰玻璃珠,平均電阻值為14.3Ω之低值。As is clear from the results of Table 3, the soda lime glass beads of the silver-coated layer obtained in Example 9 had a low average value of 14.3 Ω.

實施例10(被覆銀層之二氧化矽粒子的製造例)Example 10 (Production Example of Cerium Oxide Particles Covered with Silver Layer)

(1)在二氧化矽粒子上形成金奈米粒子層除使用N-2(胺基乙基)-3-胺基丙基三甲氧基矽烷取代3-胺基丙基三甲氧基矽烷外,以與實施例1(1)相同的方法,在二氧化矽粒子上形成金奈米粒子層。使所得的形成有金奈米粒子層之二氧化矽粒子的電子顯微鏡(SEM)照片如第7圖所示。與實施例1(1)所得的形成有金奈米粒子層之二氧化矽粒子相比時,可知在二氧化矽粒子上附著有經凝聚的金奈米粒子。(1) Forming a layer of gold nanoparticles on cerium oxide particles, except that N-2 (aminoethyl)-3-aminopropyltrimethoxy decane is substituted for 3-aminopropyltrimethoxy decane, A gold nanoparticle layer was formed on the ceria particles in the same manner as in Example 1 (1). An electron microscope (SEM) photograph of the obtained cerium oxide particles having a gold nanoparticle layer formed is shown in Fig. 7. When compared with the cerium oxide particles in which the gold nanoparticle layer obtained in Example 1 (1) was formed, it was found that the condensed gold nanoparticles adhered to the cerium oxide particles.

(2)在金奈米粒子層上形成銀層使用上述形成有金奈米粒子層之二氧化矽粒子,與實施例1(2)相同地,在金奈米粒子層之全面上形成銀層。(2) Forming a Silver Layer on the Gold Nanoparticle Layer Using the above-described cerium oxide particles having the gold nanoparticle layer formed thereon, a silver layer was formed on the entire surface of the gold nanoparticle layer in the same manner as in Example 1 (2). .

實施例11(被覆銀層之二氧化矽粒子的製造例)Example 11 (Production Example of Cerium Oxide Particles Covered with Silver Layer)

(1)在二氧化矽粒子上形成銀奈米粒子層除使0.23g氯化金酸(HAuCl4 .4H2 O)取代成0.48硝酸銀,使0.107g之NaBH4 改為0.092g外,以與實施例1(1)相同的方法,製得形成有銀奈米粒子層之二氧化矽粒子。使所得的形成有銀奈米粒子層之二氧化矽粒子的電子顯微鏡(SEM)照片如第8圖所示。(1) Forming a silver nanoparticle layer on the ceria particles, except that 0.23 g of gold chloride acid (HAuCl 4 .4H 2 O) is substituted with 0.48 silver nitrate, and 0.107 g of NaBH 4 is changed to 0.092 g, In the same manner as in Example 1 (1), cerium oxide particles having a silver nanoparticle layer formed thereon were obtained. An electron microscope (SEM) photograph of the obtained cerium oxide particles having a silver nanoparticle layer formed is shown in Fig. 8.

(2)在銀奈米粒子層上形成銀層使用上述形成有銀奈米粒子層之二氧化矽粒子,與實施例1(2)相同地,在銀奈米粒子層之全面上形成銀層。(2) Formation of Silver Layer on Silver Nanoparticle Layer Using the above-described cerium oxide particles having a silver nanoparticle layer formed thereon, a silver layer was formed on the entire silver nanoparticle layer in the same manner as in Example 1 (2). .

實施例12(被覆金層之二氧化矽粒子的製造例)Example 12 (Production Example of Cerium Oxide Particles Covered with Gold Layer)

在1g實施例1(1)所得的形成有金奈米粒子層之二氧化矽粒子中加入500mL水,進行超音波處理10分鐘後,加入0.25g氯化金酸,為使水溶液變成鹼性時再加入5ml之2.5%銨水溶液,以磁力攪拌器進行攪拌10分鐘。慢慢地滴入250mL作為還原劑之1.87毫莫耳/L肆羥基甲基氯化膦水溶液。進行吸引過濾以採取經沉澱的被覆金層之二氧化矽粒子,以甲醇洗淨後,在烤箱、70℃下進行乾燥3小時。500 g of water was added to 1 g of the cerium oxide particles having the gold nanoparticle layer obtained in Example 1 (1), and after ultrasonic treatment for 10 minutes, 0.25 g of gold chloride was added to make the aqueous solution alkaline. Further, 5 ml of a 2.5% aqueous ammonium solution was added, and the mixture was stirred for 10 minutes with a magnetic stirrer. 250 mL of a 1.87 mmol/L hydrazine hydroxymethylphosphine chloride aqueous solution as a reducing agent was slowly added dropwise. The cerium oxide particles of the precipitated gold layer were subjected to suction filtration, washed with methanol, and dried in an oven at 70 ° C for 3 hours.

所得的被覆金層之二氧化矽粒子的電子顯微鏡(SEM)照片如第9圖所示。An electron microscope (SEM) photograph of the obtained gold-coated cerium oxide particles is shown in Fig. 9.

以微小壓縮試驗機測定10個被覆銀層之二氧化矽粒子之電阻值,求取其平均值。所得的結果與標準偏差如表4所示。The resistance values of the ten silver-coated cerium oxide particles were measured by a micro compression tester, and the average value thereof was obtained. The results obtained and the standard deviation are shown in Table 4.

由表4之結果可知,以實施例12所得的被覆金層之二氧化矽粒子,平均電阻值為22.2Ω之低值。As is clear from the results of Table 4, the ruthenium dioxide particles coated with the gold layer obtained in Example 12 had a low average value of 22.2 Ω.

〔產業上之利用價值〕[industrial use value]

藉由本發明,可提供一種具有安定的導電性之被覆金屬層之基材,以及使該被覆金屬層之基材在沒有使用特別的設備或裝置下,以低成本且簡易製程、對環境而言影響很小地予以製造。According to the present invention, it is possible to provide a substrate having a coated metal layer having a stable conductivity, and to make the substrate of the coated metal layer low-cost, simple process, and environment for use without using special equipment or devices. The impact is minimally manufactured.

本發明之被覆金屬層之基材,可使用於導電材料、電磁波密封材料等。The substrate coated with the metal layer of the present invention can be used for a conductive material, an electromagnetic wave sealing material, or the like.

〔第1圖〕係為實施例1所得的形成金奈米粒子層之二氧化矽粒子的SEM照片。[Fig. 1] is a SEM photograph of the cerium oxide particles forming the gold nanoparticle layer obtained in Example 1.

〔第2圖〕係為實施例1所得的被覆銀層之二氧化矽粒子的SEM照片。[Fig. 2] is a SEM photograph of the cerium oxide particles coated with the silver layer obtained in Example 1.

〔第3圖〕係為實施例2所得的被覆銀層聚醯亞胺粒子的SEM照片。[Fig. 3] is a SEM photograph of the coated silver layer polyimine particles obtained in Example 2.

〔第4圖〕係為實施例7所得的形成金奈米粒子層之二氧化矽粒子的SEM照片。[Fig. 4] is a SEM photograph of the cerium oxide particles forming the gold nanoparticle layer obtained in Example 7.

〔第5圖〕係為實施例8所得的被覆銀層之二氧化矽粒子的SEM照片。[Fig. 5] A SEM photograph of the cerium oxide particles coated with the silver layer obtained in Example 8.

〔第6圖〕係為實施例9所得的被覆銀層之鹼石灰玻璃珠的SEM照片。[Fig. 6] is a SEM photograph of the soda lime glass beads of the silver-coated layer obtained in Example 9.

〔第7圖〕係為實施例10所得的形成金奈米粒子層之二氧化矽粒子的SEM照片。[Fig. 7] is a SEM photograph of the cerium oxide particles forming the gold nanoparticle layer obtained in Example 10.

〔第8圖〕係為實施例11所得的形成銀奈米粒子層之二氧化矽粒子的SEM照片。[Fig. 8] is a SEM photograph of the cerium oxide particles forming the silver nanoparticle layer obtained in Example 11.

〔第9圖〕係為實施例12所得的被覆金屬之二氧化矽粒子的SEM照片。[Fig. 9] is a SEM photograph of the coated metal cerium oxide particles obtained in Example 12.

Claims (7)

一種被覆金屬層之基材,其特徵為含有基材、與在該基材上經由含螯合形成性官能基之矽烷偶合劑所形成的金屬奈米粒子之散佈物或層狀物、與在該金屬奈米粒子之散佈物或層狀物上所形成的金屬層,其中,基材為由二氧化矽所成,金屬奈米粒子為由粒徑100nm以下之金所成,金屬層為由銀所成的層。 A substrate coated with a metal layer, characterized by comprising a substrate, a dispersion or layer of metal nanoparticles formed on the substrate via a decane coupling agent containing a chelating forming functional group, and a metal layer formed on the dispersion or layer of the metal nanoparticle, wherein the substrate is made of cerium oxide, and the metal nanoparticle is made of gold having a particle diameter of 100 nm or less, and the metal layer is composed of The layer made of silver. 如申請專利範圍第1項之被覆金屬層之基材,其中基材之形狀為1種選自球狀、棒狀、板狀、針狀、中空狀及不特定形狀所成群者。 The base material of the coated metal layer according to claim 1, wherein the shape of the base material is one selected from the group consisting of a spherical shape, a rod shape, a plate shape, a needle shape, a hollow shape, and a non-specific shape. 如申請專利範圍第2項之被覆金屬層之基材,其中基材之形狀為平均粒徑0.1~100μm的微粒子形狀。 The substrate of the coated metal layer according to claim 2, wherein the shape of the substrate is a fine particle shape having an average particle diameter of 0.1 to 100 μm. 如申請專利範圍第1~3項中任一項之被覆金屬層之基材,其中螯合形成性官能基為至少具有1種以上選自氮原子、硫原子及氧原子所成群的原子之官能基。 The substrate of the metal-clad layer according to any one of claims 1 to 3, wherein the chelating-forming functional group is an atom having at least one selected from the group consisting of a nitrogen atom, a sulfur atom and an oxygen atom. Functional group. 如申請專利範圍第4項之被覆金屬層之基材,其中螯合形成性官能基為至少1種以上選自-SH、-CN、-NH2 、-SO2 OH、-SOOH、-OPO(OH)2 及-COOH所成群之官能基。The substrate of the coated metal layer according to claim 4, wherein the chelating-forming functional group is at least one selected from the group consisting of -SH, -CN, -NH 2 , -SO 2 OH, -SOOH, -OPO ( OH) Functional groups in groups of 2 and -COOH. 一種被覆金屬層之基材的製造方法,其係製造申請專利範圍第1~5項中任一項之被覆金屬層之基材之方法,其特徵為使基材接觸含有水解觸媒、含螯合形成性官能基之矽烷偶合劑及金屬奈米粒子形成性金屬鹽之水性溶液後,藉由以還原劑進行處理,在基材上經由含螯合形成 性官能基之矽烷偶合劑以形成金屬奈米粒子之散佈物或層狀物,然後,在該金屬奈米粒子之散佈物或層狀物上形成金屬層。 A method for producing a substrate coated with a metal layer, which is a method for producing a substrate for coating a metal layer according to any one of claims 1 to 5, characterized in that the substrate is contacted with a hydrolysis catalyst, and a chelate is provided. After forming a water-soluble solution of a decane coupling agent and a metal nanoparticle-forming metal salt of a forming functional group, it is formed by chelating on a substrate by treatment with a reducing agent. A functional decane coupling agent to form a dispersion or layer of metal nanoparticles, and then a metal layer is formed on the dispersion or layer of the metal nanoparticles. 如申請專利範圍第6項之被覆金屬層之基材的製造方法,其中使金屬層藉由無電解電鍍法予以形成。The method for producing a substrate coated with a metal layer according to claim 6, wherein the metal layer is formed by electroless plating.
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