TWI442867B - Electronic device housing - Google Patents

Description

Electronic device housing

The present invention relates to an electronic device housing, and more particularly to an electronic device housing formed by soldering.

Referring to FIGS. 1 and 2 , an electronic device housing 10 includes a bottom case 11 and a top cover 12 . The edge of the top cover 12 is joined to the bottom case 11 by welding. During the welding process, the top cover 12 and the bottom case 11 are fixed together by a positioning jig (not shown), and then placed in a welding device (not shown) for welding.

However, when the top cover 12 and the bottom case 11 are clamped by using the positioning jig, since the welded portion of the bottom case 11 and the top cover 12 is smoothly abutted, the bottom case 11 is easily lost and deviates from the welding position, thereby causing the bottom case 11 and the top cover 12 to be Misalignment occurs between them, affecting the appearance of the electronic device housing after soldering. In addition, since the bottom case 11 and the top cover 12 are welded only at the edge portions, the connection strength between the bottom case 11 and the top cover 12 is also low.

In view of the above, it is necessary to provide an electronic device housing that does not lose stability during mounting and has a high connection strength after soldering.

An electronic device housing includes a first housing and a second housing, the edge of the first housing is formed with a welded portion, and the edge of the second housing is provided with a receiving groove adapted to the welded portion, and the welded portion is welded a first welding surface and a second welding surface welded to the welded portion are formed on an inner wall of the receiving groove of the second casing, the first welding The face and the second weld face are perpendicular to each other.

When the electronic device housing is soldered, the soldering portion of the first housing can be positioned in the receiving slot of the second housing, so that after the clamping is performed using the positioning clamp, the first housing does not lose stability and moves relative to the second housing. The soldered electronic device housing can have a better appearance. In addition, by forming the receiving groove on the second casing, the welding area of the first casing and the second casing can be increased, thereby increasing the connection strength between the two.

30, 50‧‧‧ Electronic device housing

31, 51‧‧‧ first housing

311, 511‧‧‧ welding department

312‧‧‧floor

313‧‧‧ side wall

32, 52‧‧‧ second housing

321, 521‧‧‧ accommodating slots

3211, 5211‧‧‧ first welding surface

3212, 5212‧‧‧second welding surface

1 is a perspective view of a housing of an electronic device.

2 is a partial cross-sectional view showing the welding front edge II-II of the electronic device housing shown in FIG.

3 is an exploded perspective view of the electronic device housing according to the first embodiment of the present invention.

4 is a partial cross-sectional view of the electronic device housing shown in FIG. 3 taken along line IV-IV after soldering.

FIG. 5 is an exploded perspective view of the electronic device housing shown in FIG. 4 before soldering.

6 is a partial cross-sectional view showing the electronic device housing of the second embodiment of the present invention after soldering.

FIG. 7 is an exploded perspective view of the electronic device housing shown in FIG. 6 before soldering.

The electronic device housing of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 3 to FIG. 5 , the electronic device housing 30 of the first embodiment of the present invention includes a first housing 31 and a second housing 32 that are connected by welding. In this embodiment, the first One housing 31 is a bottom case and the second housing 32 is a top cover. A mounting hole for receiving a display screen (not shown) is opened in the center of the second housing 32.

The edge of the first casing 31 is formed with a welded portion 311, and the welded portion 311 has a straight strip shape in cross section. In the present embodiment, the first housing 31 includes a rectangular bottom plate 312 and a side wall 313 extending from the edge of the bottom plate. The welded portion 311 is formed at the top end of the side wall 313 and has a substantially rectangular frame shape.

A receiving groove 321 is formed in the edge of the second housing 32 to cooperate with the welded portion 311. A first welding surface 3211 and a second welding surface 3212 welded to the welded portion 311 are formed on the inner wall of the accommodating groove 321 . In the present embodiment, the first welding surface 3211 and the second welding surface 3212 are both flat and perpendicular to each other.

When welding, the first housing 31 and the second housing 32 are fixed together by using a positioning jig (not shown), and then the positioning jigs equipped with the first housing 31 and the second housing 32 are placed in the welding device ( The welding portion 311 of the first housing 31 is positioned in the receiving groove 321 of the second housing 32 and is in contact with the first welding surface 3211 and the second welding surface 3212. The housing 31 does not lose stability and moves relative to the second housing 32, so the welding device can accurately weld the first housing 31 and the second housing 32 to provide a better appearance of the soldered electronic device housing 30. . In addition, the inner wall of the receiving groove 321 of the second casing 32 has two welding faces of the first welding face 3211 and the second welding face 3212, which effectively increases the welding area, and can make the electronic device casing 30 after welding Good connection strength.

It can be understood that the first housing 31 can also be a top cover, and the second housing 32 is a bottom case welded to the top cover. The welded portion 311 may have other shapes, and the shape of the receiving groove 321 of the second casing 32 needs to be opened according to the shape of the welded portion.

Referring to FIG. 6 and FIG. 7, the electronic device housing 50 of the second embodiment of the present invention has a similar structure to the electronic device housing 30 of the first embodiment, except that the cross section of the welded portion 511 is curved. The first welding surface 5211 on the inner wall of the receiving groove 521 engaged with the welded portion 511 is a flat surface, and the second welded surface 5212 is a curved surface. Since the second welding surface 5212 is a curved surface, the welding area of the first casing 51 and the second casing 52 can be further increased, and the connection strength of the electronic device casing 50 can be further improved. It can be understood that the first welding surface 5211 can also be a curved surface to further increase the welding area of the two.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

311‧‧‧Weld Department

312‧‧‧floor

313‧‧‧ side wall

32‧‧‧Second housing

321‧‧‧ accommodating slot

3211‧‧‧First welding surface

3212‧‧‧Second welding surface

Claims (7)

An electronic device housing includes a first housing and a second housing, wherein the edge of the first housing is formed with a welded portion, and an edge of the second housing is formed to fit the welded portion a groove, the welded portion is welded to the inner wall of the receiving groove of the second casing, and the inner wall of the receiving groove is formed with a first welding surface and a second welding surface welded to the welded portion, the first welding surface and The second weld faces are perpendicular to each other. The electronic device housing of claim 1, wherein the welded portion has an arc shape in cross section. The electronic device housing of claim 1, wherein the welded portion has a straight strip shape. The electronic device housing of claim 1, wherein the welded portion has a rectangular frame shape. The electronic device housing of claim 1, wherein the first housing is a bottom case and the second housing is a top cover. The electronic device housing of claim 1, wherein the first housing is a top cover and the second housing is a bottom housing. The electronic device housing of claim 1, wherein the second housing is provided with a mounting hole for receiving the display screen.