TWI417026B - Electronic device housing - Google Patents
Electronic device housing Download PDFInfo
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- TWI417026B TWI417026B TW99126573A TW99126573A TWI417026B TW I417026 B TWI417026 B TW I417026B TW 99126573 A TW99126573 A TW 99126573A TW 99126573 A TW99126573 A TW 99126573A TW I417026 B TWI417026 B TW I417026B
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Abstract
Description
本發明涉及一種電子裝置殼體,尤其涉及一種採用焊接方式形成之電子裝置殼體。 The present invention relates to an electronic device housing, and more particularly to an electronic device housing formed by soldering.
請參閱圖1及圖2,一種電子裝置殼體10,其包括底殼11及頂蓋12。頂蓋12之邊緣藉由焊接與底殼11連接在一起。焊接過程中,頂蓋12及底殼11藉由定位夾具(圖未示)固定在一起,然後再放入焊接設備(圖未示)進行焊接。 Referring to FIGS. 1 and 2 , an electronic device housing 10 includes a bottom case 11 and a top cover 12 . The edge of the top cover 12 is joined to the bottom case 11 by welding. During the welding process, the top cover 12 and the bottom case 11 are fixed together by a positioning jig (not shown), and then placed in a welding device (not shown) for welding.
然,在使用定位夾具裝夾頂蓋12及底殼11,由於底殼11與頂蓋12焊接部位平滑相抵,底殼11容易失去穩定而偏離焊接位置,從而導致底殼11及頂蓋12之間產生錯位,影響焊接後之電子裝置殼體之外觀。另,由於底殼11與頂蓋12僅於邊緣部位進行焊接連接,底殼11與頂蓋12之間之連接強度亦比較低。 However, when the top cover 12 and the bottom case 11 are clamped by using the positioning jig, since the welded portion of the bottom case 11 and the top cover 12 is smoothly abutted, the bottom case 11 is easily lost and deviates from the welding position, thereby causing the bottom case 11 and the top cover 12 to be Misalignment occurs between them, affecting the appearance of the electronic device housing after soldering. In addition, since the bottom case 11 and the top cover 12 are welded only at the edge portion, the connection strength between the bottom case 11 and the top cover 12 is also relatively low.
鑒於以上內容,有必要提供一種在裝夾時不會失去穩定且焊接後連接強度較大之電子裝置殼體。 In view of the above, it is necessary to provide an electronic device housing that does not lose stability during mounting and has a high connection strength after soldering.
一種電子裝置殼體,其包括焊接在一起之第一殼體、第二殼體及固定設置於該第一殼體側壁上之四支架,該四支架分別設置於該 側壁之四邊角部,該第一殼體包括底板及由底板邊緣延伸形成之側壁,該側壁之頂端形成有焊接面,該第二殼體之邊緣與該焊接面相抵接,所述每一支架上延伸有限位部,所述限位部與第二殼體相連接。 An electronic device housing includes a first housing, a second housing, and four brackets fixedly disposed on the sidewall of the first housing, the four brackets are respectively disposed on the a fourth side of the side wall, the first housing includes a bottom plate and a side wall extending from an edge of the bottom plate, the top end of the side wall is formed with a welding surface, and an edge of the second housing abuts the welding surface, the bracket The upper limit portion is extended, and the limit portion is connected to the second housing.
當焊接上述電子裝置殼體時,第一殼體及第二殼體可藉由具有限位部之支架相互定位,第一殼體不會失去穩定相對第二殼體移動,可使焊接後之電子裝置殼體具有較佳之外觀。另,第一殼體與第二殼體不僅藉由焊接連接,還藉由支架相互連接,從而增大二者之間之連接強度。 When the electronic device housing is soldered, the first housing and the second housing can be mutually positioned by the bracket having the limiting portion, and the first housing does not lose stability and moves relative to the second housing, so that after welding The electronics housing has a preferred appearance. In addition, the first housing and the second housing are connected not only by soldering but also by brackets, thereby increasing the connection strength between the two.
30、50‧‧‧電子裝置殼體 30, 50‧‧‧ Electronic device housing
31、51‧‧‧第一殼體 31, 51‧‧‧ first housing
311‧‧‧底板 311‧‧‧floor
312、512‧‧‧側壁 312, 512‧‧‧ side walls
3121‧‧‧焊接面 3121‧‧‧welding surface
32、52‧‧‧第二殼體 32, 52‧‧‧ second housing
320‧‧‧安裝孔 320‧‧‧Mounting holes
33‧‧‧第一支架 33‧‧‧First bracket
331‧‧‧第一焊接部 331‧‧‧First Welding Department
3311‧‧‧第一焊接段 3311‧‧‧First welding section
3312‧‧‧第二焊接段 3312‧‧‧Second welding section
332‧‧‧第一限位部 332‧‧‧First Limitation
3321、3421‧‧‧本體 3321, 3421‧‧‧ ontology
3322、3422‧‧‧限位片 3322, 3422‧‧‧ Limits
34‧‧‧第二支架 34‧‧‧second bracket
341‧‧‧第二焊接部 341‧‧‧Second welding department
342‧‧‧第二限位部 342‧‧‧Second Limitation
527‧‧‧容納槽 527‧‧‧ accommodating slot
圖1係一種電子裝置殼體之立體示意圖。 1 is a perspective view of a housing of an electronic device.
圖2係圖1所示電子裝置殼體焊接前沿II-II線之部分剖面示意圖。 2 is a partial cross-sectional view showing the welding front edge II-II of the electronic device housing shown in FIG.
圖3係本發明第一實施方式之電子裝置殼體之立體示意圖。 3 is a perspective view of a housing of an electronic device according to a first embodiment of the present invention.
圖4係係圖3所示電子裝置殼體之立體分解圖。 4 is an exploded perspective view of the electronic device housing shown in FIG. 3.
圖5係圖3所示電子裝置殼體焊接後沿V-V線之局部剖面示意圖。 FIG. 5 is a partial cross-sectional view of the electronic device housing shown in FIG. 3 along the line V-V after soldering.
圖6係本發明第二實施方式之電子裝置殼體焊接後之局部剖面示意圖。 6 is a partial cross-sectional view showing the electronic device housing of the second embodiment of the present invention after soldering.
下面將結合附圖及實施方式對本發明之電子裝置殼體作進一步詳細說明。 The electronic device housing of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
請參閱圖3至圖5,本發明第一實施方式之電子裝置殼體30包括藉由焊接方式連接之第一殼體31及第二殼體32,以及連接第一殼體31及第二殼體32之第一支架33及第二支架34。本實施方式中,第一殼體31為底殼,第二殼體32為頂蓋。電子裝置殼體30包括四第一支架33及二第二支架34,其中,四第一支架33分佈於第一殼體31之邊角處,二第二支架34分佈於二相鄰之第一支架33之間,且相對設置。 Referring to FIG. 3 to FIG. 5 , the electronic device housing 30 of the first embodiment of the present invention includes a first housing 31 and a second housing 32 that are connected by soldering, and connects the first housing 31 and the second housing. The first bracket 33 and the second bracket 34 of the body 32. In this embodiment, the first housing 31 is a bottom case, and the second housing 32 is a top cover. The electronic device housing 30 includes four first brackets 33 and two second brackets 34. The four first brackets 33 are distributed at the corners of the first housing 31, and the second brackets 34 are distributed at the first two adjacent positions. The brackets 33 are disposed opposite each other.
第一殼體31包括底板311及由底板311邊緣延伸形成之側壁312。側壁312之頂端形成有焊接面3121。本實施方式中,底板311大致為矩形,側壁312為弧形側壁。 The first housing 31 includes a bottom plate 311 and a side wall 312 extending from an edge of the bottom plate 311. A welding surface 3112 is formed at the top end of the side wall 312. In this embodiment, the bottom plate 311 is substantially rectangular, and the side wall 312 is a curved side wall.
第二殼體32大致為矩形,其中央開設有容納顯示幕(圖未示)之安裝孔320,且其底面開設有複數分佈在安裝孔320四周之限位孔(圖未標)。第二殼體32之邊緣與弧形側壁312之焊接面3121相抵接。 The second housing 32 is substantially rectangular, and has a mounting hole 320 for receiving a display screen (not shown) at the center thereof, and a bottom surface of the second housing 32 is provided with a plurality of limiting holes (not labeled) distributed around the mounting hole 320. The edge of the second housing 32 abuts the soldering surface 3121 of the curved sidewall 312.
第一支架33包括第一焊接部331及由第一焊接部331一端延伸形成之第一限位部332。第一焊接部331與第二殼體32之邊角部位之側壁312相適配,其包括第一焊接段3311及由第一焊接段3311之一端基本垂直延伸形成之第二焊接段3312,第一焊接段3311及第二焊接段3312均為弧形片狀。第一限位部332包括本體3321及由本體3321兩端遠離第一焊接部331延伸形成之限位片3322。本實施方式中,本體3321大致為弧形拱狀,限位片3322為矩形片狀。 The first bracket 33 includes a first welded portion 331 and a first limiting portion 332 extending from one end of the first welded portion 331 . The first welding portion 331 is adapted to the side wall 312 of the corner portion of the second housing 32, and includes a first welding portion 3311 and a second welding portion 3312 formed by a substantially vertical extension of one end of the first welding portion 3311, A welded section 3311 and a second welded section 3312 are both curved sheets. The first limiting portion 332 includes a body 3321 and a limiting piece 3322 extending from the first end of the body 3321 away from the first welding portion 331 . In the present embodiment, the body 3321 is substantially arcuately arched, and the limiting piece 3322 is in the shape of a rectangular plate.
第二支架34包括第二焊接部341及由第二焊接部341一端延伸形成 之第二限位部342。第二焊接部341設置於第二殼體32之相對之二側壁312之中央,其為與側壁312適配之弧形片狀。第二限位部342包括本體3421及由本體3421二端遠離第二焊接部341延伸形成之限位片3422。本實施方式中,本體3421大致為弧形拱狀,限位片3422為矩形片狀。 The second bracket 34 includes a second welded portion 341 and is extended by one end of the second welded portion 341 The second limiting portion 342. The second soldering portion 341 is disposed at the center of the opposite sidewalls 312 of the second housing 32, and is in the shape of a curved sheet that fits the sidewall 312. The second limiting portion 342 includes a body 3421 and a limiting piece 3422 extending from the second end of the body 3421 away from the second welding portion 341 . In the present embodiment, the body 3421 is substantially arcuately arched, and the limiting piece 3422 is in the shape of a rectangular plate.
焊接時,先將第一支架33之第一焊接部331及第二支架之第二焊接部341焊接至第一殼體31,然後將第一限位部332之限位片3322及第二限位部342之限位片3422插入第二殼體32之限位孔以使二者相對固定,接著使用定位夾具夾持第一殼體31及第二殼體32,並將裝有第一殼體31及第二殼體32之定位夾具放入焊接設備(圖未示)對焊接面3121進行焊接,由於第一殼體31及第二殼體32藉由第一支架33及第二支架34相互定位,故第一殼體31不會失去穩定而相對第二殼體32移動,因此焊接設備能對第一殼體31及第二殼體32進行準確焊接,以使焊接後之電子裝置殼體30具有較佳之外觀。另,第一殼體及第二殼體不僅藉由焊接方式連接,還藉由第一支架33及第二支架34相連,可使焊接後之電子裝置殼體30具有較好之連接強度。 When welding, the first soldering portion 331 of the first bracket 33 and the second soldering portion 341 of the second bracket are first welded to the first housing 31, and then the limiting piece 3322 of the first limiting portion 332 and the second limit are respectively limited. The limiting piece 3422 of the position portion 342 is inserted into the limiting hole of the second housing 32 to fix the two, and then the first housing 31 and the second housing 32 are clamped by using the positioning clamp, and the first housing is mounted. The positioning fixtures of the body 31 and the second housing 32 are placed in a welding device (not shown) for welding the welding surface 3121. Since the first housing 31 and the second housing 32 are supported by the first bracket 33 and the second bracket 34 Positioned relative to each other, the first housing 31 does not lose stability and moves relative to the second housing 32, so the welding device can accurately weld the first housing 31 and the second housing 32 to make the electronic device housing after welding Body 30 has a preferred appearance. In addition, the first housing and the second housing are not only connected by soldering, but also connected by the first bracket 33 and the second bracket 34, so that the soldered electronic device housing 30 has better connection strength.
可以理解,第一殼體31亦可為頂蓋,第二殼體32為與頂蓋焊接之底殼。第一焊接部331及第二焊接部341亦可為其他形狀,其與第一殼體31之側壁312之形狀相適配。 It can be understood that the first housing 31 can also be a top cover, and the second housing 32 is a bottom case welded to the top cover. The first weld portion 331 and the second weld portion 341 may also have other shapes that are adapted to the shape of the side wall 312 of the first casing 31.
請參閱圖6,本發明第二實施方式之電子裝置殼體50與第一實施方式中之電子裝置殼體30具有相似之結構,其不同在於:第二殼體52之邊緣開設有容納槽527以容納第一殼體51之側壁512,側壁 512焊接至容納槽527之內壁。由於電子裝置殼體50之第二殼體52開設有容納槽527對第一殼體51定位,可以進一步提高二者之連接強度。 Referring to FIG. 6, the electronic device housing 50 of the second embodiment of the present invention has a similar structure to the electronic device housing 30 of the first embodiment, except that the edge of the second housing 52 is provided with a receiving groove 527. To accommodate the side wall 512 of the first housing 51, the side wall 512 is welded to the inner wall of the receiving groove 527. Since the second housing 52 of the electronic device housing 50 is provided with the receiving groove 527 for positioning the first housing 51, the connection strength between the two can be further improved.
綜上所述,本發明符合發明專利要件,爰依法提出申請專利。惟,以上該者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之如申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
311‧‧‧底板 311‧‧‧floor
312‧‧‧側壁 312‧‧‧ side wall
331‧‧‧第一焊接部 331‧‧‧First Welding Department
332‧‧‧第一限位部 332‧‧‧First Limitation
3321‧‧‧本體 3321‧‧‧ Ontology
3322‧‧‧限位片 3322‧‧‧Limited film
32‧‧‧第二殼體 32‧‧‧Second housing
Claims (9)
Priority Applications (1)
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TW99126573A TWI417026B (en) | 2010-08-10 | 2010-08-10 | Electronic device housing |
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TW99126573A TWI417026B (en) | 2010-08-10 | 2010-08-10 | Electronic device housing |
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TW201208526A TW201208526A (en) | 2012-02-16 |
TWI417026B true TWI417026B (en) | 2013-11-21 |
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TW99126573A TWI417026B (en) | 2010-08-10 | 2010-08-10 | Electronic device housing |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW476908B (en) * | 1998-12-11 | 2002-02-21 | Nippon Electric Co | Liquid crystal module installation structure and portable terminal device having the same |
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2010
- 2010-08-10 TW TW99126573A patent/TWI417026B/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW476908B (en) * | 1998-12-11 | 2002-02-21 | Nippon Electric Co | Liquid crystal module installation structure and portable terminal device having the same |
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