TWI417023B - Electronic device housing - Google Patents
Electronic device housing Download PDFInfo
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- TWI417023B TWI417023B TW99126572A TW99126572A TWI417023B TW I417023 B TWI417023 B TW I417023B TW 99126572 A TW99126572 A TW 99126572A TW 99126572 A TW99126572 A TW 99126572A TW I417023 B TWI417023 B TW I417023B
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- side wall
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Abstract
Description
本發明涉及一種電子裝置殼體,尤其涉及一種採用焊接方式形成之電子裝置殼體。 The present invention relates to an electronic device housing, and more particularly to an electronic device housing formed by soldering.
請參閱圖1及圖2,一種電子裝置殼體10,其包括底殼11及頂蓋12。頂蓋12之邊緣藉由焊接與底殼11連接在一起。焊接過程中,頂蓋12及底殼11藉由定位夾具(圖未示)固定在一起,然後再放入焊接設備(圖未示)進行焊接。 Referring to FIGS. 1 and 2 , an electronic device housing 10 includes a bottom case 11 and a top cover 12 . The edge of the top cover 12 is joined to the bottom case 11 by welding. During the welding process, the top cover 12 and the bottom case 11 are fixed together by a positioning jig (not shown), and then placed in a welding device (not shown) for welding.
然,在使用定位夾具裝夾頂蓋12及底殼11,由於底殼11與頂蓋12焊接部位平滑相抵,底殼11容易失去穩定而偏離焊接位置,從而導致底殼11及頂蓋12之間產生錯位,影響焊接後之電子裝置殼體之外觀。另,由於底殼11與頂蓋12僅於邊緣部位進行焊接連接,底殼11與頂蓋12之間之連接強度亦比較低。 However, when the top cover 12 and the bottom case 11 are clamped by using the positioning jig, since the welded portion of the bottom case 11 and the top cover 12 is smoothly abutted, the bottom case 11 is easily lost and deviates from the welding position, thereby causing the bottom case 11 and the top cover 12 to be Misalignment occurs between them, affecting the appearance of the electronic device housing after soldering. In addition, since the bottom case 11 and the top cover 12 are welded only at the edge portion, the connection strength between the bottom case 11 and the top cover 12 is also relatively low.
鑒於以上內容,有必要提供一種在裝夾時不會失去穩定且焊接後連接強度較大之電子裝置殼體。 In view of the above, it is necessary to provide an electronic device housing that does not lose stability during mounting and has a high connection strength after soldering.
一種電子裝置殼體,其包括第一殼體、第二殼體、四支架及固定件,第一殼體及第二殼體焊接在一起,該第一殼體包括底板及由底板邊緣延伸形成之側壁,該側壁之頂端形成有焊接面,該第二殼體之邊緣與該焊接面相抵接,四支架固定設置於該第一殼體側 壁之四邊角部上,每一支架包括焊接部及由焊接部一端延伸形成之固定部,焊接部焊接至側壁之邊角部,固定部藉由固定件與第二殼體相連接。 An electronic device housing includes a first housing, a second housing, four brackets and a fixing member, the first housing and the second housing being welded together, the first housing comprising a bottom plate and extending from an edge of the bottom plate a sidewall, a top surface of the sidewall is formed with a soldering surface, an edge of the second housing abuts the soldering surface, and the four brackets are fixedly disposed on the first housing side Each of the brackets includes a welded portion and a fixing portion extending from one end of the welded portion, and the welded portion is welded to a corner portion of the side wall, and the fixed portion is connected to the second housing by a fixing member.
當焊接上述電子裝置殼體時,第一殼體及第二殼體可藉由支架及固定件相互定位,第一殼體不會失去穩定相對第二殼體移動,可使焊接後之電子裝置殼體具有較佳之外觀。另,第一殼體與第二殼體不僅藉由焊接連接,還藉由支架及固定件相互連接,從而增大二者之間之連接強度。 When the electronic device housing is soldered, the first housing and the second housing are mutually positioned by the bracket and the fixing member, and the first housing does not lose stability and moves relative to the second housing, so that the soldered electronic device can be The housing has a preferred appearance. In addition, the first housing and the second housing are not only connected by soldering but also connected to each other by the bracket and the fixing member, thereby increasing the connection strength between the two.
30、50‧‧‧電子裝置殼體 30, 50‧‧‧ Electronic device housing
31、51‧‧‧第一殼體 31, 51‧‧‧ first housing
311‧‧‧底板 311‧‧‧floor
312、512‧‧‧側壁 312, 512‧‧‧ side walls
3121‧‧‧焊接面 3121‧‧‧welding surface
32、52‧‧‧第二殼體 32, 52‧‧‧ second housing
320‧‧‧安裝孔 320‧‧‧Mounting holes
33‧‧‧第一支架 33‧‧‧First bracket
331、341‧‧‧焊接部 331, 341‧‧ ‧ welding department
3311‧‧‧第一焊接段 3311‧‧‧First welding section
3312‧‧‧第二焊接段 3312‧‧‧Second welding section
332、342‧‧‧固定部 332, 342‧‧‧ Fixed Department
3321、3421‧‧‧支撐片 3321, 3421‧‧‧ support piece
3322、3422‧‧‧連接片 3322, 3422‧‧‧ connecting pieces
34‧‧‧第二支架 34‧‧‧second bracket
35‧‧‧固定件 35‧‧‧Fixed parts
527‧‧‧容納槽 527‧‧‧ accommodating slot
圖1係一種電子裝置殼體之立體示意圖。 1 is a perspective view of a housing of an electronic device.
圖2係圖1所示電子裝置殼體焊接前沿II-II線之部分剖面示意圖。 2 is a partial cross-sectional view showing the welding front edge II-II of the electronic device housing shown in FIG.
圖3係本發明第一實施方式之電子裝置殼體之立體示意圖。 3 is a perspective view of a housing of an electronic device according to a first embodiment of the present invention.
圖4係係圖3所示電子裝置殼體之立體分解圖。 4 is an exploded perspective view of the electronic device housing shown in FIG. 3.
圖5係圖3所示電子裝置殼體焊接後沿V-V線之局部剖面示意圖。 FIG. 5 is a partial cross-sectional view of the electronic device housing shown in FIG. 3 along the line V-V after soldering.
圖6係本發明第二實施方式之電子裝置殼體焊接後之局部剖面示意圖。 6 is a partial cross-sectional view showing the electronic device housing of the second embodiment of the present invention after soldering.
下面將結合附圖及實施方式對本發明之電子裝置殼體作進一步詳細說明。 The electronic device housing of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
請參閱圖3至圖5,本發明第一實施方式之電子裝置殼體30包括藉由焊接方式連接之第一殼體31及第二殼體32,焊接至第一殼體31 之第一支架33及第二支架34,以及連接第二殼體32與第一支架33、第二支架34之固定件35。本實施方式中,第一殼體31為底殼,第二殼體32為頂蓋。電子裝置殼體30包括四第一支架33及二第二支架34,其中,四第一支架33分佈於第一殼體31之邊角處,二第二支架34分佈於二相鄰之第一支架33之間且相對設置。第一殼體31包括底板311及由底板311邊緣延伸形成之側壁312。側壁312之頂端形成有焊接面3121。本實施方式中,底板311大致為矩形,側壁312為弧形側壁。 Referring to FIG. 3 to FIG. 5 , the electronic device housing 30 of the first embodiment of the present invention includes a first housing 31 and a second housing 32 connected by soldering, and is soldered to the first housing 31 . The first bracket 33 and the second bracket 34 and the fixing member 35 connecting the second casing 32 and the first bracket 33 and the second bracket 34. In this embodiment, the first housing 31 is a bottom case, and the second housing 32 is a top cover. The electronic device housing 30 includes four first brackets 33 and two second brackets 34. The four first brackets 33 are distributed at the corners of the first housing 31, and the second brackets 34 are distributed at the first two adjacent positions. The brackets 33 are disposed opposite each other. The first housing 31 includes a bottom plate 311 and a side wall 312 extending from an edge of the bottom plate 311. A welding surface 3112 is formed at the top end of the side wall 312. In this embodiment, the bottom plate 311 is substantially rectangular, and the side wall 312 is a curved side wall.
第二殼體32大致為矩形,其中央開設有容納顯示幕(圖未示)之安裝孔320,邊緣部位開設有複數通孔321。第二殼體32之邊緣與第一殼體31之側壁312之焊接面3121相抵接。 The second housing 32 is substantially rectangular, and has a mounting hole 320 for receiving a display screen (not shown) at the center thereof, and a plurality of through holes 321 are defined at the edge portion. The edge of the second housing 32 abuts the soldering surface 3121 of the sidewall 312 of the first housing 31.
第一支架33包括焊接部331及由焊接部331一端延伸形成之固定部332。焊接部331與第二殼體32之邊角部位之側壁312相適配,其包括第一焊接段3311及由第一焊接段3311之一端基本垂直延伸形成之第二焊接段3312,第一焊接段3311及第二焊接段3312均為弧形片狀。固定部332包括支撐片3321及由支撐片3321一端垂直延伸形成之連接片3322,連接片3322上開設有螺孔3324。本實施方式中,焊接部331上延伸形成有二固定部332,支撐片3321及連接片3322均為矩形片狀。 The first bracket 33 includes a welded portion 331 and a fixed portion 332 formed by extending one end of the welded portion 331. The welding portion 331 is adapted to the side wall 312 of the corner portion of the second housing 32, and includes a first welding portion 3311 and a second welding portion 3312 extending substantially perpendicularly from one end of the first welding portion 3311, the first welding The segment 3311 and the second welded segment 3312 are both curved sheets. The fixing portion 332 includes a supporting piece 3321 and a connecting piece 3322 extending perpendicularly from one end of the supporting piece 3321. The connecting piece 3322 is provided with a screw hole 3324. In the present embodiment, two fixing portions 332 are formed on the welded portion 331 , and the supporting piece 3321 and the connecting piece 3322 are both in a rectangular sheet shape.
第二支架34包括焊接部341及由焊接部341一端延伸形成之固定部342。焊接部341設置於第二殼體32之相對之二側壁312之中央,其為與側壁312適配之弧形片狀。固定部342包括支撐片3421及由支撐片3421一端垂直延伸形成之連接片3422,連接片3422上開設有螺孔3424。本實施方式中,焊接部341上延伸形成有二固定部 342,支撐片3421及連接片3422均為矩形片狀。 The second bracket 34 includes a welded portion 341 and a fixed portion 342 formed by extending one end of the welded portion 341. The soldering portion 341 is disposed at the center of the opposite sidewalls 312 of the second housing 32, and is in the shape of a curved sheet that fits the sidewall 312. The fixing portion 342 includes a supporting piece 3421 and a connecting piece 3422 extending perpendicularly from one end of the supporting piece 3421. The connecting piece 3422 is provided with a screw hole 3424. In this embodiment, two fixing portions are formed on the welded portion 341. 342, the support piece 3421 and the connecting piece 3422 are both rectangular sheets.
固定件35為螺釘,其穿過第二殼體32上之通孔321後螺入第一支架33上之螺孔3324或第二支架34上之螺孔3424,以將第二殼體32與第一支架33及第二支架34相連。可以理解,固定件35亦可為銷釘等元件,只要能起到連接第二殼體32與第一支架33及第二支架34之作用即可。 The fixing member 35 is a screw that passes through the through hole 321 of the second housing 32 and is screwed into the screw hole 3324 of the first bracket 33 or the screw hole 3424 of the second bracket 34 to connect the second housing 32 with The first bracket 33 and the second bracket 34 are connected. It can be understood that the fixing member 35 can also be an element such as a pin, as long as it can function to connect the second housing 32 with the first bracket 33 and the second bracket 34.
焊接時,先將第一支架33之焊接部331及第二支架34之焊接部341焊接至第一殼體31,然後用固定件35將第一支架33之固定部332之連接片3322及第二支架34之固定部342之連接片3422固定至第二殼體32,接著使用定位夾具(圖未示)夾持第一殼體31及第二殼體32,並將裝有第一殼體31及第二殼體32之定位夾具放入焊接設備(圖未示)對焊接面3121進行焊接,由於第一殼體31及第二殼體32藉由第一支架33、第二支架34及固定件35相互連接定位,故第一殼體31不會失去穩定而相對第二殼體32移動,因此焊接設備能對第一殼體31及第二殼體32進行準確焊接,以使焊接後之電子裝置殼體30具有較佳之外觀。另,第一殼體31及第二殼體32不僅藉由焊接方式連接,還藉由第一支架33、第二支架34及固定件35相連,可使焊接後之電子裝置殼體30具有較好之連接強度。 When welding, the welded portion 331 of the first bracket 33 and the welded portion 341 of the second bracket 34 are first welded to the first casing 31, and then the connecting piece 3322 and the first portion of the fixing portion 332 of the first bracket 33 are fixed by the fixing member 35. The connecting piece 3422 of the fixing portion 342 of the second bracket 34 is fixed to the second housing 32, and then the first housing 31 and the second housing 32 are clamped using a positioning jig (not shown), and the first housing is mounted. 31 and the positioning fixture of the second housing 32 are placed in a welding device (not shown) for welding the welding surface 3121. The first housing 31 and the second housing 32 are supported by the first bracket 33 and the second bracket 34. The fixing members 35 are connected to each other, so that the first housing 31 does not lose stability and moves relative to the second housing 32, so that the welding device can accurately weld the first housing 31 and the second housing 32 so that after welding The electronic device housing 30 has a preferred appearance. In addition, the first housing 31 and the second housing 32 are not only connected by soldering, but also connected by the first bracket 33, the second bracket 34 and the fixing member 35, so that the soldered electronic device housing 30 can be compared. Good connection strength.
可以理解,第一殼體31亦可為頂蓋,第二殼體32為與頂蓋焊接之底殼。焊接部331及焊接部341亦可為其他形狀,其與第一殼體31之側壁312之形狀相適配。 It can be understood that the first housing 31 can also be a top cover, and the second housing 32 is a bottom case welded to the top cover. The welded portion 331 and the welded portion 341 may have other shapes that are adapted to the shape of the side wall 312 of the first housing 31.
請參閱圖6,本發明第二實施方式之電子裝置殼體50與第一實施方式中之電子裝置殼體30具有相似之結構,其不同在於:第二殼體52之邊緣開設有容納槽527以容納第一殼體51之側壁512,側壁 512焊接至容納槽527之內壁。由於電子裝置殼體50之第二殼體52開設有容納槽527對第一殼體51定位,可進一步提高二者之連接強度。 Referring to FIG. 6, the electronic device housing 50 of the second embodiment of the present invention has a similar structure to the electronic device housing 30 of the first embodiment, except that the edge of the second housing 52 is provided with a receiving groove 527. To accommodate the side wall 512 of the first housing 51, the side wall 512 is welded to the inner wall of the receiving groove 527. Since the second housing 52 of the electronic device housing 50 is provided with the receiving groove 527 for positioning the first housing 51, the connection strength between the two can be further improved.
綜上所述,本發明符合發明專利要件,爰依法提出申請專利。惟,以上該者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之如申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
31‧‧‧第一殼體 31‧‧‧First housing
32‧‧‧第二殼體 32‧‧‧Second housing
33‧‧‧第一支架 33‧‧‧First bracket
331‧‧‧焊接部 331‧‧‧Weld Department
332‧‧‧固定部 332‧‧‧ fixed department
35‧‧‧固定件 35‧‧‧Fixed parts
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99126572A TWI417023B (en) | 2010-08-10 | 2010-08-10 | Electronic device housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW99126572A TWI417023B (en) | 2010-08-10 | 2010-08-10 | Electronic device housing |
Publications (2)
Publication Number | Publication Date |
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TW201208522A TW201208522A (en) | 2012-02-16 |
TWI417023B true TWI417023B (en) | 2013-11-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW99126572A TWI417023B (en) | 2010-08-10 | 2010-08-10 | Electronic device housing |
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TW (1) | TWI417023B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW476908B (en) * | 1998-12-11 | 2002-02-21 | Nippon Electric Co | Liquid crystal module installation structure and portable terminal device having the same |
TWI236333B (en) * | 1999-06-11 | 2005-07-11 | Samsung Electronics Co Ltd | Structure for mounting a PCB in an electronic apparatus housing |
-
2010
- 2010-08-10 TW TW99126572A patent/TWI417023B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW476908B (en) * | 1998-12-11 | 2002-02-21 | Nippon Electric Co | Liquid crystal module installation structure and portable terminal device having the same |
TWI236333B (en) * | 1999-06-11 | 2005-07-11 | Samsung Electronics Co Ltd | Structure for mounting a PCB in an electronic apparatus housing |
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TW201208522A (en) | 2012-02-16 |
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