TWI442589B - Semiconductor device and electronic apparatus - Google Patents
Semiconductor device and electronic apparatusInfo
- Publication number
- TWI442589B TWI442589B TW099142874A TW99142874A TWI442589B TW I442589 B TWI442589 B TW I442589B TW 099142874 A TW099142874 A TW 099142874A TW 99142874 A TW99142874 A TW 99142874A TW I442589 B TWI442589 B TW I442589B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- electronic apparatus
- electronic
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
Landscapes
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Optical Filters (AREA)
- Photovoltaic Devices (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009298365A JP2011138950A (ja) | 2009-12-28 | 2009-12-28 | 半導体装置及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201133907A TW201133907A (en) | 2011-10-01 |
TWI442589B true TWI442589B (en) | 2014-06-21 |
Family
ID=44174805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099142874A TWI442589B (en) | 2009-12-28 | 2010-12-08 | Semiconductor device and electronic apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US8513586B2 (zh) |
JP (1) | JP2011138950A (zh) |
KR (1) | KR20110076770A (zh) |
CN (1) | CN102110703B (zh) |
TW (1) | TWI442589B (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011138950A (ja) * | 2009-12-28 | 2011-07-14 | Sony Corp | 半導体装置及び電子機器 |
JP2013093553A (ja) * | 2011-10-04 | 2013-05-16 | Canon Inc | 光電変換装置及びその製造方法、並びに光電変換システム |
JP5456084B2 (ja) * | 2012-02-07 | 2014-03-26 | 株式会社東芝 | 固体撮像素子 |
US8941203B2 (en) * | 2012-03-01 | 2015-01-27 | Raytheon Company | Photodetector with surface plasmon resonance |
US8957490B2 (en) * | 2013-06-28 | 2015-02-17 | Infineon Technologies Dresden Gmbh | Silicon light trap devices |
JP6398214B2 (ja) * | 2014-02-17 | 2018-10-03 | 株式会社ニコン | ピンホール装置及び露光装置 |
WO2016136502A1 (ja) * | 2015-02-26 | 2016-09-01 | ソニー株式会社 | 固体撮像素子、および電子装置 |
US9404804B1 (en) * | 2015-04-02 | 2016-08-02 | Palo Alto Research Center Incorporated | Thermal sensor with infrared absorption membrane including metamaterial structure |
US20190041260A1 (en) * | 2016-01-25 | 2019-02-07 | The Regents Of The University Of California | Nano-scale pixelated filter-free color detector |
CN108615736A (zh) * | 2016-12-11 | 2018-10-02 | 南京理工大学 | 制作在传感器表面的可提高光传感器灵敏度的结构 |
CN111033760B (zh) * | 2017-08-09 | 2023-01-03 | 株式会社钟化 | 光电转换元件和光电转换装置 |
CN109951661A (zh) * | 2019-04-23 | 2019-06-28 | Oppo广东移动通信有限公司 | 图像传感器及电子设备 |
CN110049261B (zh) * | 2019-04-23 | 2022-04-12 | Oppo广东移动通信有限公司 | 一种像素结构、图像传感器及终端 |
CN110087005B (zh) * | 2019-04-23 | 2021-07-09 | Oppo广东移动通信有限公司 | 一种彩色偏振式cis及图像处理方法、存储介质 |
CN110324545B (zh) * | 2019-06-11 | 2022-01-28 | Oppo广东移动通信有限公司 | 一种像素结构、图像传感器及终端 |
CN110166698A (zh) * | 2019-06-28 | 2019-08-23 | Oppo广东移动通信有限公司 | 对焦方法、互补金属氧化物图像传感器、终端及存储介质 |
CN110620861B (zh) * | 2019-09-24 | 2021-10-15 | Oppo广东移动通信有限公司 | 图像传感器、相机模组和终端 |
US11227960B2 (en) * | 2020-03-16 | 2022-01-18 | Globalfoundries U.S. Inc. | Multifunctional metamaterial-based optical device |
US11355540B2 (en) | 2020-04-15 | 2022-06-07 | Visera Technologies Company Limited | Optical device |
TWI756764B (zh) * | 2020-07-31 | 2022-03-01 | 國立中興大學 | 光電流電極及光電免疫感測裝置 |
CN113270725B (zh) * | 2021-05-12 | 2023-05-23 | 中国人民解放军空军工程大学 | 基于人工表面等离激元的超宽带、大角度掠入射吸波体 |
WO2023105678A1 (ja) * | 2021-12-08 | 2023-06-15 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置および光学フィルタ |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5886374A (en) * | 1998-01-05 | 1999-03-23 | Motorola, Inc. | Optically sensitive device and method |
US6864557B2 (en) * | 2001-06-18 | 2005-03-08 | Foveon, Inc. | Vertical color filter detector group and array |
US7109517B2 (en) * | 2001-11-16 | 2006-09-19 | Zaidi Saleem H | Method of making an enhanced optical absorption and radiation tolerance in thin-film solar cells and photodetectors |
KR100791497B1 (ko) * | 2002-10-11 | 2008-01-04 | 캐논 가부시끼가이샤 | 센서 |
WO2005098966A1 (ja) * | 2004-04-05 | 2005-10-20 | Nec Corporation | フォトダイオードとその製造方法 |
US7592255B2 (en) * | 2004-12-22 | 2009-09-22 | Hewlett-Packard Development Company, L.P. | Fabricating arrays of metallic nanostructures |
US7586167B2 (en) * | 2006-05-05 | 2009-09-08 | Virgin Islands Microsystems, Inc. | Detecting plasmons using a metallurgical junction |
US20090284829A1 (en) * | 2006-09-12 | 2009-11-19 | Bower Christopher L | Plasmonic elements |
JP5273932B2 (ja) * | 2007-03-23 | 2013-08-28 | キヤノン株式会社 | 光検出素子及び光検出方法、撮像素子及び撮像方法 |
JP5300344B2 (ja) * | 2007-07-06 | 2013-09-25 | キヤノン株式会社 | 光検出素子及び撮像素子、光検出方法及び撮像方法 |
JP4621270B2 (ja) * | 2007-07-13 | 2011-01-26 | キヤノン株式会社 | 光学フィルタ |
US20090040132A1 (en) * | 2007-07-24 | 2009-02-12 | Northeastern University | Anisotropic metal-dielectric metamaterials for broadband all-angle negative refraction and superlens imaging |
KR101385250B1 (ko) * | 2007-12-11 | 2014-04-16 | 삼성전자주식회사 | Cmos 이미지 센서 |
EP2109147A1 (en) * | 2008-04-08 | 2009-10-14 | FOM Institute for Atomic and Molueculair Physics | Photovoltaic cell with surface plasmon resonance generating nano-structures |
US8866000B2 (en) * | 2009-07-31 | 2014-10-21 | Corey A. Weiss | Ultra-efficient energy conversion device for converting light to electricity by rectifying surface plasmon polaritons |
JP2011043681A (ja) * | 2009-08-21 | 2011-03-03 | Canon Inc | 光学素子、光検出素子、光変調素子、撮像素子及びカメラ |
JP2011138950A (ja) * | 2009-12-28 | 2011-07-14 | Sony Corp | 半導体装置及び電子機器 |
-
2009
- 2009-12-28 JP JP2009298365A patent/JP2011138950A/ja active Pending
-
2010
- 2010-12-08 TW TW099142874A patent/TWI442589B/zh not_active IP Right Cessation
- 2010-12-14 US US12/967,815 patent/US8513586B2/en not_active Expired - Fee Related
- 2010-12-15 KR KR1020100127994A patent/KR20110076770A/ko not_active Application Discontinuation
- 2010-12-21 CN CN201010598252.0A patent/CN102110703B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20110076770A (ko) | 2011-07-06 |
JP2011138950A (ja) | 2011-07-14 |
TW201133907A (en) | 2011-10-01 |
CN102110703B (zh) | 2014-10-29 |
US8513586B2 (en) | 2013-08-20 |
US20110155891A1 (en) | 2011-06-30 |
CN102110703A (zh) | 2011-06-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |