TWI441268B - Substrate transporting method and substrate transporting device - Google Patents

Description

Substrate transfer method and substrate transfer device

The present invention relates to a substrate transfer method and a substrate transfer device for bonding a die of a semiconductor chip or the like to a substrate such as a lead frame.

On a semiconductor manufacturing facility, there is a die bonder. The die bonder is a device in which a die (a wafer in which a circuit is formed on a silicon substrate) is adhered to a lead frame (substrate) by using solder, gold plating, a resin or the like as a bonding material.

As shown in FIG. 11, the lead frame (substrate) 101 has a plurality of islands 102 at predetermined intervals (scheduled intervals) along the longitudinal direction thereof, and the crystal grains 103 are disposed to be bonded to the island regions 102. (semiconductor wafer, etc.). Therefore, on the die bonder, the adhesive 104 is supplied to the plurality of island regions 102 of the substrate 101, and the die 103 (semiconductor wafer or the like) is bonded to the island region 102 to which the adhesive 104 is supplied. Therefore, on the die bonder, it is necessary to transport the substrate 101 to the supply (coating) paste. The preform 104 is pre-formed at position A and transported to the bonding position B where the die 103 is supplied to the island region 102.

Therefore, there has been a conventional conveyance device for transporting the island-like regions 102 of the substrate 101 to the pre-formed position A and the bonding position B in order (Patent Document 1). On such a transfer device, the substrates 101 are intermittently transferred at regular intervals. That is, this conventional conveying device has a pin which can repeat the continuous rectangular movement in the front-rear direction of the up-and-down direction and the frame conveying direction (longitudinal direction of the frame). Further, the substrate 101 is provided with a through hole (transport hole) at each of the above-described predetermined intervals.

In such a handling device, the transfer pin is lowered and embedded in one of the transfer holes of the substrate 101. Further, in this state, the transport pins are moved at a fixed interval to the downstream side in the frame transport direction. Thereby, the substrate 101 is transported to the downstream side only at regular intervals. Then, after the transfer pin is lifted and pulled out from the transfer hole, the transfer pin is moved to the upstream side in the frame conveyance direction at a fixed interval. Thereafter, the substrate 101 is transported one by one at regular intervals by sequentially performing the above steps.

Further, the island region 102 of each substrate 101 is transported to the pre-formed position A, and after the adhesive layer 104 is applied to the pre-formed position A, it is transported to the bonding position B, and the die 103 is bonded at this bonding position B. .

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-128097

However, in conventional handling devices, in general, the spacing of the islands 102 can only be intermittently transmitted one by one. Therefore, the lead frame 101b on the upstream side and the lead frame 101a on the downstream side are spaced apart from each other in the state of α of the upstream side lead frame 101b, and the upstream end island area 102 of the downstream side lead frame 101a and the upstream end island area 102 of the downstream side lead frame 101a. Must be 2 x P.

However, if the interval between the downstream end island region 102 of the upstream side lead frame 101b and the upstream end island region 102 of the downstream side lead frame 101a is set to 2 × P, the lead on the upstream side will be as shown in the state of β in Fig. 11 . When the frame 101b and the lead frame 101a on the downstream side correspond to each other at the bonding position, the state of the island region which is not bonded is formed. Therefore, as shown in Fig. 11, it is preferable to eliminate the interval between the downstream end island region 102 of the upstream side lead frame 101b and the upstream end island region 102 of the downstream side lead frame 101a, and it does not take time in the operation step. The way to set.

However, in such a case, as shown in FIG. 12, the pre-formed position A and the bonded position B must be set. That is, as shown in the state of α of Fig. 12, in the state where the island portion 102 at the most downstream of the lead frame 101a has reached the bonding position B, it is necessary to reach the most downstream of the lead frame 101b which is further upstream than the lead frame 101a. The island region 102 has also reached the pre-formed position A.

That is, from the state indicated by α in Fig. 12, by routing the lead frames 101 one by one to the downstream side at regular intervals, the island regions can be sequentially arranged as shown in Fig. 12 by β, γ, δ, ε, ζ, η. The 102 is transported to the pre-formed position A and the bonded position B, respectively, and the pre-forming operation and the bonding operation can be performed at each position. Thereby, all the island regions 102 of the lead frames 101 can be adhered to the wafer 3.

However, as shown from θ in FIG. 12 to θ in FIG. 12, when the island-shaped region 102 at the most downstream of the lead frame 101b is transported to the bonding position B, it is necessary to be different from the above-described predetermined interval P. The lead frame 101 is transferred at an interval P1. In this case, even if the transfer of the interval P1 is performed (refer to α of FIG. 12), the island-shaped region 102 at the most downstream of the succeeding lead frame 101c can be corresponding to the pre-formed position A, and the pre-forming operation can be performed.

Therefore, if the pre-formation position A and the bonding position B are set as shown in Fig. 12, the transfer can be performed by adding the fixed interval P1 to the fixed interval P, and the pre-forming operation and the bonding operation can be performed without waste.

However, depending on the adhesive, there is a quick-drying adhesive (quick-drying adhesive) which is applied until the adhesive action is applied after the application of the adhesive, and once the time lapses, the quick-drying adhesive is dry and adhesive. A situation in which it deteriorates and cannot be adhered.

Therefore, in recent years, as shown in FIG. 13, a technique has been proposed in which the pre-formed position A is brought close to the bonding position B. In this case, it is necessary that the bonding position B is fixed and the pre-formed position A is changed.

That is, as indicated by α in FIG. 13, when the second island-shaped region 102 from the downstream of the lead frame 101a reaches the bonding position B, the most upstream island-like region 102 of the lead frame 101a reaches the pre-formed position A1. Then, as shown by β in FIG. 13, when the third island-like region 102 is transported from the downstream of the lead frame 101a to the bonding position B, the most upstream island-shaped region 102 of the lead frame 101b does not reach the pre-formed position A1. Therefore, the pre-formed position is changed to A2. Thereby, a pre-forming action at this pre-formed position A2 becomes possible.

Thereafter, if the lead frames 101 can be transported one by one at regular intervals, when the island regions 102 have reached the bonding position B, the respective island regions 102 can be corresponding to the pre-formed position A2, and the pre-formed position A2 can be pre-formed. The formation action becomes feasible. That is, as indicated by γ in Fig. 13, the island region 102 reaches the bonding position B at the most upstream of the lead frame 101a, and the pre-forming operation of the pre-forming position A2 becomes feasible.

However, from the state of γ of FIG. 13 to the δ of FIG. 13, when the island area 102 of the most downstream of the lead frame 101 of the next 1b is conveyed to the bonding position B, the transmission interval becomes P1. Therefore, the island region 102 becomes the corresponding pre-formed position A2, and the pre-formed position must be returned to A1. Thereby, the pre-forming action at the pre-formed position A1 becomes feasible.

Therefore, if the above operation can be performed, as shown in Fig. 13, even if the pre-formed position A is brought close to the bonding position B, it is possible to sequentially perform an efficient bonding operation.

However, in the pre-formed position and the bonded position, the alignment (fixing) of the alignment of the lead frame 101 must be performed. As a fixing method, the surface of the lead frame 101 is usually pressed from above by a pressing member, and the island region by vacuum suction is suction-fixed from the back surface of the lead frame 101.

The adsorption and fixation of the island region is constituted by an adsorption mechanism which is additionally provided on a member called an adsorption base and a plate. Further, an adsorption path communicating with the adsorption base and an adsorption hole opened at the upper surface are provided on the distribution plate. Therefore, it is necessary to process the adsorption holes arranged in the island area on the matching plate.

In the bonding position, the configuration is as follows, that is, the position of the adsorption hole in the X direction is solid. The Y-direction position of the adsorption hole is matched with the island-shaped region of the lead frame 101. On the other hand, at the pre-formed position, the adsorption hole is placed at a position close to the bonding position at the position where the bonding position is an integral multiple of the island-shaped space (the X-direction interval) and within the pre-formation range.

However, in order to carry out the method shown in Fig. 13, since the bonding position is fixed, although the fixing of the island-shaped region 102 can be stably performed in the bonding operation, there are two pre-forming positions, so it is necessary to press the pre-shaped positions together. Component and vacuum adsorption location.

That is, it is necessary to have a plurality of (two pieces) matching disks at the pre-formed positions, which correspond to the adsorption holes at the position of the island portion of the lead frame 101, and have two or one pressing members. Next, it is necessary to have two members corresponding to the shape of the pre-formed position. Therefore, an increase in the number of components and an increase in the size of the pressing member increase the cost.

Further, on one lead frame, a block portion is disposed at a predetermined interval along the conveyance direction, and a plurality of island regions are formed at regular intervals along the conveyance direction. In such a case, the pre-formation position is further increased, and accordingly, it is necessary to change the pressing member and the vacuum suction position, and further increase the number of members.

Therefore, the present invention has been made in view of such circumstances, and provides a substrate transfer device and a substrate transfer method, which can increase the number of device members without increasing the positional variation, and perform stable pre-forming operations and bonding operations.

The substrate transfer device of the present invention is formed at a predetermined interval along the conveyance direction The substrate having the plurality of island regions is transported along the transport direction, and the adhesive is applied to the island region of the substrate at a pre-formed position measured upstream, and the wafer is bonded to the adhesive position at the downstream side. The above-mentioned island region coated with the above adhesive. The substrate transfer device includes a transport unit that transports the substrate from the upstream side to the downstream side in the transport direction, and the adhesive unit transports the island region to which the adhesive is applied to the bonding position. Bonding the wafer to the island-like region; and forming a pre-formation position corresponding to the position of the island-like region of the stopped substrate, applying the adhesive to the pre-formed position; and holding the unit When the above-described adhesive unit is applied by the pre-forming unit, the holding unit holds the substrate while receiving the substrate by a substrate receiving member that reciprocates along the transport direction. The substrate transfer device and the pre-forming unit change in synchronization with the pre-formation position, and the holding position of the holding unit is changed.

In the substrate transfer method of the present invention, the substrate in which the plurality of island regions are formed at predetermined intervals along the conveyance direction is transported from the upstream side toward the downstream side along the conveyance direction, and the pre-formed position measured upstream is maintained. In the state of the substrate, an adhesive is applied to the island-like region of the substrate, and then the wafer is bonded to the island-shaped region coated with the adhesive at a bonding position on the downstream side. The substrate transfer method is capable of performing the fluctuation of the pre-formation position, wherein the fluctuation corresponds to a position of the island region of the substrate that has been stopped, and the pre-formation position and the substrate are maintained during a change in the pre-formation position. The position is synchronized and varied, and the adhesive is applied to the substrate at the changed pre-formed position The above island area.

According to the present invention, in the method of transporting the substrate, even if the basic transfer and the transfer different from the basic transfer are performed, the bonding position can be fixed, and the pre-forming operation can be performed at each pre-formed position by changing the pre-formed position. Therefore, the bonding position can be brought close to the pre-formed position. Further, since the holding position of the holding unit can be changed in synchronization with the fluctuation of the pre-formed position of the pre-formed unit, the pre-forming operation at each pre-formed position is stabilized.

In the substrate transfer device, an adsorption mechanism may be provided in the substrate receiving member, and the adsorption mechanism may have an adsorption hole for adsorbing the substrate from the back side, and the holding unit may be configured by the adsorption mechanism, and may include a pressing member. The substrate is pressed from above by the substrate received by the substrate receiving member, and the holding member is configured by the pressing member. Further, the holding unit may be configured by the suction mechanism and the pressing member. In other words, the substrate transfer device including the pusher can synchronize the change of the pre-formed position to change the pusher, and can press the substrate at an optimum position during the pre-forming operation.

Further, the substrate has an island-like region forming a block portion, and the island-shaped region forming block portion is formed with a plurality of island-shaped regions at predetermined intervals in a conveyance direction and a direction perpendicular to the conveyance direction, and the island-like region is formed. The block portion may be provided in plurality along the conveying direction.

The pre-forming unit may include: a first pre-forming unit that applies the adhesive to the pre-formed position on the downstream side; and a second pre-forming unit that is further upstream than a pre-formed position of the first pre-forming unit Preformed position coating Adhesive. At this time, one of the pre-forming units applies the above-described adhesive to the island-shaped region on the rear side in the width direction of the substrate, and the other pre-forming unit performs the above-mentioned island on the front side in the width direction of the substrate. Coating of the above adhesive in the region.

The present invention enables the use of a quick-drying adhesive in the pre-forming step, and does not require a speed up of the overall working step, and an improvement in throughput can be achieved. Further, even if the pre-formation position is changed, the pre-forming operation at each pre-formation position can be stabilized, and the adhesion of the adhesive from the island-shaped region and the insufficient application of the adhesive can be avoided, and the subsequent bonding step can be stabilized. High-precision bonding industry has become possible.

Further, since the holding position of the holding unit can be changed in synchronization with the fluctuation of the pre-formed position of the pre-formed unit, the basic interval transfer can be performed at a different interval from the basic interval transfer (for example, transfer between substrates and The mixing is carried out between the block portions in the substrate, and the bonding loss such as waiting for the bonding operation is not caused.

As the holding means, by pressing the pressing member of the substrate received by the substrate receiving member from above, the island region to which the adhesive is applied can be stably maintained at a predetermined position during pre-forming, and the pre-forming operation can be stabilized. In particular, when the holding unit is constituted by the suction mechanism, the adsorption hole serving as the substrate receiving member may be arranged in a row in an island shape in a direction (Y direction) perpendicular to the substrate conveyance direction (X direction), and The hole size can also be fixed. Therefore, even basic interval transfers and transmissions at different intervals from this basic interval transfer (eg, inter-substrate transfer and on-base) It is also possible to mix the substrate receiving members by mixing between the block portions in the plate. Therefore, it is possible to eliminate a plurality of types of corresponding parts and achieve low cost. (In this case, if the position of the adsorption hole cannot be changed, the adsorption hole must be arranged along the X direction, so the adsorption route is complicated, and the type corresponding parts are also increased.)

When the holding unit is configured by the pressing member, since the conveying direction (X direction) is possible, it is possible to adjust the substrate pressing portion of the pressing member to a direction (Y direction) perpendicular to the conveying direction, so that it is not necessary to prepare each. A variety of pressing members and a plurality of types of corresponding parts are not required, and low cost can be achieved. As described above, it is possible to reduce the type switching cost by including the suction mechanism that adsorbs from the back side of the substrate and the pressing member that presses the substrate received by the substrate receiving member from above.

As the substrate, the plurality of island-shaped regions forming the block portions may be disposed along the transport direction, and the plurality of island-shaped regions may have different intervals between the block-like portions, and may correspond to a plurality of types of substrates as devices. Excellent versatility.

By including the first pre-forming unit and the second pre-forming unit, it is possible to increase the efficiency of the pre-forming operation of one substrate. Further, the work efficiency can be improved by dividing the pre-formed unit into the front side in the substrate width direction and the rear side in the substrate width direction.

1, 1a, 1b, 101, 101a, 101b, 101c‧‧‧ lead frame (substrate)

2. 102‧‧‧ islands

3‧‧‧ wafer

4, 104‧‧‧Adhesive

10‧‧‧Transportation unit

11‧‧‧Control unit

12‧‧‧Preformed unit

12A‧‧‧1st pre-formed unit

12B‧‧‧2nd pre-formed unit

13‧‧‧bonding unit

14‧‧‧Holding unit

15‧‧‧Setting unit

20‧‧‧Nozzle 20

21‧‧‧ cylinder

22, 22a, 22b, 22c‧‧‧XYZ platform

23‧‧‧ camera

25‧‧‧Supply Department

26‧‧‧ chuck

27‧‧‧Semiconductor wafer

30‧‧‧Substrate receiving member

31‧‧‧Adsorption base

32‧‧‧ Matching

33‧‧‧Adsorption holes

34‧‧‧Adsorption mechanism

35‧‧‧rails

36‧‧‧Slide rails

40, 60‧‧‧ Pressing parts

41, 61‧‧‧ Pressing rod

41a, 61a‧‧‧ body of the pressing rod

42, 62‧‧‧ drive mechanism

51, 51A, 51B, 51C, 51D‧‧‧ islands form a block

55‧‧‧1st area

56‧‧‧2nd area

103‧‧‧ grain

A, A1, A2‧‧‧ pre-formed position

B‧‧‧bonding position

S‧‧‧ gap

H, I, J, P, P1‧‧

W‧‧‧Transportation path

X1, X2, Y1, Y2, Y3, Y4, Z1, Z2, Z3, Z4‧‧‧ direction

α, β, γ, δ, ε, ζ, η, θ‧‧‧ states

Fig. 1 is a block diagram showing the configuration of a substrate transfer device according to an embodiment of the present invention.

Fig. 2 is a perspective view showing a main part of the substrate transfer device of Fig. 1;

Fig. 3 is a plan view showing a substrate receiving member of the substrate transfer device of Fig. 1;

Fig. 4 is a front elevational view showing the substrate receiving member of the substrate transfer device of Fig. 1;

Fig. 5 is a schematic view showing a pre-forming unit of the substrate transfer device of Fig. 1;

Fig. 6 is a schematic sectional view showing a bonding unit of the substrate transfer device of Fig. 1;

Figure 7 is a perspective view of the wafer bonded by the bonding unit of Figure 6 above.

Figure 8 is a plan view of a lead frame of a substrate.

Fig. 9 is a schematic view showing a step of transporting a substrate according to an embodiment of the present invention.

Fig. 10 is a schematic cross-sectional view showing a main part of a substrate transfer device according to an embodiment of the present invention.

Fig. 11 is a schematic view showing the relationship between a lead frame and a pre-formed position in a conventional substrate transfer method.

Fig. 12 is a schematic view showing a conventional substrate transport method.

Fig. 13 is a schematic view showing a conventional method of transporting a conventional substrate.

Hereinafter, embodiments of the present invention will be described based on Figs. 1 to 10 .

Fig. 1 is a schematic block diagram showing a substrate transfer device of the present invention. This substrate transfer device is not a main part of a die bonder as a semiconductor manufacturing facility, and is a substrate 1 for bonding a wafer (die) 3 such as a semiconductor wafer (see FIGS. 6 and 7) to a lead frame or the like (see Figure 2, etc.). The lead frame is a thin plate metal used as an internal wiring of a semiconductor package. Therefore, in the present invention The substrate 1 is generally referred to as a lead frame, and is a substrate (for example, a printed circuit board) including various electronic components and the like.

As shown in FIG. 9, the substrate transfer apparatus has a plurality of sheets 1 formed in a plurality of island-like regions 2 at predetermined intervals along the longitudinal direction, and sequentially transports a plurality of sheets along the longitudinal direction, and a pre-formed position on the upstream side. A (A1, A2), after the adhesive 4 is applied to the island region 2 of the substrate 1, the wafer 3 is bonded to the island region 2 of the substrate at the bonding position B on the downstream side.

As shown in FIG. 1, the substrate transfer device includes a transport unit that transports a plurality of substrates 1, a control unit 11 that controls the transport unit 10, a pre-form unit 12, and a bonding unit 13.

The transport unit 10 includes, for example, a clamp mechanism that sandwiches the substrate 1 and a drive mechanism that moves the clamp portion of the clamp mechanism from the upstream side toward the downstream side. The drive mechanism can use, for example, a servomotor, and the substrate 1 can be transported to the downstream side at an arbitrary interval (set interval) by the control of the control unit 11. That is, the island regions 2 of the substrate 1 can be sequentially transferred to the pre-formed positions A (A1, A2) and the bonding position B.

As the handling unit 10, a driving wheel, a driven wheel, a belt feeder including a belt wound around the driving wheel and the driven wheel, and a driving mechanism for driving the feeder may be included. In this case, if the substrate 1 is supplied to the feeder, the substrate 1 is configured in a positioned state by a positioning unit (for example, a pin fitted to a through hole formed in the substrate). On the feeder. As the drive mechanism, for example, a servo motor or the like can be used, and the drive of the feeder is controlled by the control of the control unit 11. The moving wheel is driven to an arbitrary rotation angle that has been set, and the substrate 1 can be conveyed to the downstream side at an arbitrary interval (set interval). Further, in the case of using a feeder, it may be a feeder other than the belt feeder. In other words, the arrangement of the island-like regions 2, the arrangement interval between the block portions 51 (see FIG. 8), and the arrangement interval between the substrates 1 can be carried.

The control unit 11 is, for example, a central processing unit (CPU), and is connected to each other via a bus such as a read only memory (Random Access Memory) or a random access memory (RAM). Connected to a micro computer. The control unit 11 is provided with a memory device as a memory unit. The memory device includes a Hard Disk Drive (HDD), a Digital Versatile Disk (DVD) machine, a Computer Disk-Recordable (CD-R) machine, an electronic erasable and a programmable device. Electrically Erasable and Programmable Read Only Memory (EEPROM). Also, the ROM stores programs and data executed by the CPU.

At the pre-formed position A (A1, A2), a pre-forming step (dispense step) of applying the adhesive 4 to the island-like region 2 of the substrate 1 is performed. Therefore, as shown in FIG. 5, the pre-forming unit 12 includes, for example, a cylinder 21 for applying an adhesive and an XYZ stage 22, wherein the cylinder 21 has a nozzle 20 for discharging the adhesive 4 (see FIG. 6). The XYZ stage 22 has the cylinder 21 in the X-axis direction (the directions of the arrows X1 and X2 shown in FIG. 2), the Y-axis direction (the directions of the arrows Y1 and Y2 shown in FIG. 2), and the Z-axis direction (up and down direction). )Carried on drive. That is, the XYZ stage 22 includes an X stage 22a that drives the X-axis direction, a Y stage 22b that drives the Y-axis direction, and a Z stage 22C that drives the Z-axis direction.

Therefore, the movement of the cylinder 21 in the X-axis direction, the movement in the Y-axis direction, and the movement in the Z-axis direction are possible. Thereby, the nozzle 20 corresponds to the position of the island-like region 2 at the time of pre-forming, and the adhesive 4 is discharged to the island-like region 2 in a state where the discharge amount (coating amount) is controlled from the nozzle 20. Further, a camera 23 for detecting the island region 2 is mounted on the XYZ stage 22.

Further, at the bonding position B, the wafer (die) 3 is transported to the island region 2 to which the adhesive 4 is applied, and is bonded to the adhesive 4. Therefore, the bonding apparatus includes a bonding arm (not shown) having the chuck 26 of the wafer 3 for adsorbing the supply unit 25, a camera for confirming the wafer 3 of the supply unit 25 (not shown), and A camera (not shown) for confirming the observation of the island region 2 of the lead frame (substrate) 1 at the bonding position.

The supply unit 25 includes a semiconductor wafer 27 (see FIG. 7), and the semiconductor wafer 27 is divided into a plurality of wafers 3. That is, the wafer 27 is attached to an adhesive film (dicing sheet) which is held on an annular frame. Further, the wafer 27 on the cut film is singulated using a circular blade (dicing saw) or the like to form the wafer 3. Further, it is possible to maintain the movement between the pick-up position and the bonding position by the bonding arm holding the chuck 26 via the carrying unit.

Further, the chuck 26 vacuum-adsorbs the wafer 3 via an adsorption hole opened at the lower end surface thereof, and adsorbs the wafer 3 on the lower end surface of the chuck 26. Again, the vacuum suction When the attachment (vacuum suction) is released, the wafer 3 is released from the chuck 26.

Next, the bonding method using this bonding apparatus will be described. First, the wafer 3 to be gripped is observed by the confirmation camera disposed above the supply unit 25, and after the chuck 26 is positioned above the wafer 3 to be gripped, the chuck 26 is lowered by the arrow Z1. The wafer 3 is taken up. Thereafter, the chuck 26 is raised as indicated by the arrow Z2.

Next, the island region 2 of the lead frame 1 to be bonded is observed by the confirmation camera disposed above the bonding position, and the chuck 26 is moved in the direction of the arrow Y3 and positioned above the island region 2, thereby The chuck 26 is moved downward by the arrow Z3, and the wafer 3 is supplied to the island region 2. Further, after the wafer 3 is supplied to the island region 2, the chuck 26 is raised by the arrow Z4, and the arrow Y4 is returned to the standby position above the gripping position.

That is, by moving the chuck 26 in order as the arrows Z1, Z2, Y3, Z3, Z4, Y4 are moved, the wafer 3 positioned based on the observation by the gripping confirmation camera is gripped by the chuck 26, and The wafer 3 is mounted on the island region 2.

Further, the frame of the plurality of wafers 3 is held, for example, by holding the XY table or the like and moving the table, so that the wafer 3 to be gripped is positioned at the gripping position.

In this apparatus, as shown in FIG. 9, the pre-formed position A is changed to the position of A1 or the position of A2, and the adhesive position B does not change and is fixed.

As shown in FIGS. 3 and 4, the substrate transfer device includes a substrate receiving member 30 that receives the substrate 1 along the upstream side of the bonding position B of the conveyance path W of the substrate 1 and proceeds along the conveyance direction. slide. Substrate connection The receiving member 30 has an adsorption base 31, an adapter plate 32 fixed to the adsorption base 31, and an adsorption hole 33 is formed in the upper surface of the distribution plate 32. That is, the substrate receiving member 30 is provided with an adsorption mechanism 34 having an adsorption hole 33.

The adsorption base 31 is provided with an adsorption pipe connection port and an adsorption passage, and the distribution plate 32 is provided with an adsorption passage that is communicated by the adsorption passage of the adsorption base 31, and is disposed in the Y-axis direction of the island-like region 2 corresponding to the lead frame 1. The adsorption hole 33 described above. In this case, the conveyance path W is provided with a pair of parallel guide rails 35 and 35 extending in the X-axis direction, and the substrate receiving members 30 are disposed on the guide rails 35 and 35 via the slide rails 36 and 36. Since the slide rails 36, 36 reciprocate in the X-axis direction along the guide rails 35, 35, the substrate receiving member 30 can reciprocate in the X-axis direction. The slide rails 36, 36 are reciprocated in the X-axis direction by a drive unit omitted from illustration. Further, for example, a drive motor and an interlocking mechanism that transmits the driving force of the drive motor to the slide rails 36 and 36 may be configured as a drive unit. Further, it may be constituted by a belt mechanism or the like as a linkage mechanism.

Further, a vacuum source (not shown) is connected to the adsorption pipe connection port of the adsorption susceptor 31. Therefore, vacuum suction from the adsorption holes 33 of the distribution tray 32 is performed by driving by a vacuum source or via the adsorption passage of the adsorption base 31 and the adsorption passage of the accommodation tray 32.

Further, a pressing member 40 as shown in FIG. 2 is attached to the substrate receiving member 30. The pressing member 40 includes a pressing lever 41 and a driving mechanism 42 that moves the pressing lever 41 up and down. The pressing lever 41 includes a main body portion 41a extending in a conveying direction perpendicular to the conveying path W, and extending from the main body portion 41a in the X1 direction or the X2 direction. Multiple feet (illustrated omitted). Therefore, the pressing lever 41 positioned above the substrate 1 is lowered by the driving mechanism 42, and the substrate 1 can be pressed by the leg portion (not shown). In this case, the leg portion is disposed between the island regions disposed along the Y-axis direction, and does not interfere with the application work of the adhesive 4. Further, the drive mechanism 42 may be configured by a reciprocating mechanism such as a cylinder mechanism, a ball nut mechanism, or a linear guide mechanism.

Further, even in the bonding position, as shown in FIG. 2, the pressing member 60 and the suction mechanism (not shown) are disposed. The pusher 60 includes a pressing lever 61 and a drive mechanism 62 that moves the pressing lever 61 up and down. The drive mechanism 42 may be configured by a reciprocating mechanism such as a cylinder mechanism, a ball nut mechanism, and a linear guide mechanism. In this case, it is not necessary to change the position of the pressing hole 61 and the suction hole of the attachment mechanism in the X direction.

That is, at the bonding position, it is adsorbed from below the bonded island-like region 2, or the side of the island-like region 2 is pressed upward by the pressing lever 61 of the pusher 60 that can move up and down. The pressing lever 61 includes a pressing lever main body 61a and a plurality of leg portions (not shown) extending from the main body portion 161a in the X1 direction or the X2 direction, and the leg portions press the substrate 1.

Further, the substrate 1 on which the pre-forming step and the bonding step are performed, for example, is a lead frame as shown in FIG. The lead frame 1 in this case has an island-like region forming a block portion 51 which is formed with a plurality of island-like regions 2 formed on the block portion 51, and the island-like region forms the block portion 51 along the conveying direction There are multiple (four in this case).

A plurality of island-like regions 2 are arranged at predetermined intervals in the X-axis direction and the Y-axis direction on each of the island-like region forming block portions 51. Further, the most downstream island-like region forms the island portion 2 of the most upstream row of the block portion 51A and the island portion adjacent to the island-like region forming block portion 51A forms the island of the most downstream column of the block portion 51B. The interval H between the regions 2, and the island-like region 2 in which the island-shaped region forms the most upstream column of the block portion 51B and the island-like region adjacent to the island-like region forming the block portion 51B form the block portion 51C The interval I between the island regions 2 of the most downstream columns is not the same. Further, the island-like region 2 in which the island-like region forms the most upstream row of the block portion 51C and the island-like region adjacent to the island-like region forming the block portion 51C form the island-like region 2 of the most downstream row of the block portion 51D The interval between the partitions and the island-like region forming block portion 51A and the island-like region forming block portion 51B is identical.

Further, such a lead frame 1 is continuously conveyed a plurality of pieces from the upstream side to the downstream side. Therefore, the lead frame 1a on the downstream side and the lead frame 1b on the upstream side are provided with a gap S of a predetermined size. That is, the island portion 2 of the most upstream column forming the block portion 51D on the upstream side of the lead frame 1a on the downstream side forms the block portion 51A with the island portion 2 on the most downstream side of the lead frame 1b on the upstream side. A space J is formed between the island regions 2 of the most downstream columns. The interval J in this case is not the same as the above-described interval H and interval I.

Next, the substrate transfer method of the substrate transfer device configured as described above will be described with reference to FIG. 9 and the like. In this case, in order to explain the basic operation, the island regions 2 on the substrate 1 are disposed at equal intervals P only along the conveyance direction thereof, and the island regions 2 on the most upstream side of the substrate 1a on the downstream side are provided. The interval J from the most downstream island-like region 2 of the substrate 1b on the upstream side is set to be larger than the island-shaped region interval P. In addition, the bonding position is fixed to the B line, and the pre-forming position is set to 2 on the A1 line and the A2 line. When the island 2 reaches the B line, it is transported to the bonding position B, and when the island 2 reaches the A1 line, it is transported to the pre-formed position A1, and when the island 2 reaches the A2 line, It is transported to the preformed position A2. Since the cylinder 21 having the nozzle 20 of the pre-forming unit 12 is capable of moving in the X direction, the pre-forming operation at each of the pre-formed positions A1, A2 becomes possible.

As shown by α in Fig. 9, the substrate 1 is transported from the upstream side to the downstream side, and when the island-shaped region 2 at the most downstream of the substrate 1a is transported to the bonding position B, the second side from the upstream side of the substrate 1a is used. The island region 2 is set to be transported to the pre-formed position A. In this state, the pre-forming action by the pre-forming unit 12 and the bonding action by the bonding unit 13 are possible.

Therefore, when the respective substrates 1 are transported to the downstream side at only one interval P from the state indicated by α in Fig. 9, the second island-like region 2 is formed downstream of the substrate 1a as indicated by β in Fig. 9 . It is transported to the bonding position B, and the most upstream island region 2 of the substrate 1a is transported to the pre-formed position A1. Therefore, in this state, the pre-forming operation at the pre-formation position A1 and the bonding operation at the bonding position B can be performed.

However, when the respective substrates 1 are transported to the downstream side at only one interval P from the state indicated by β in Fig. 9, the third island-like region 2 is transported from the downstream of the substrate 1a as indicated by γ in Fig. 9 . Up to the bonding position B, the island portion 2 at the most downstream of the substrate 1b is not carried to the pre-formed position A1. Therefore, in this state, the bonding operation at the bonding position B can be performed, but the pre-forming operation at the pre-forming position A1 cannot be performed. Therefore, in the state of γ as shown in FIG. 9, the pre-formation position is changed to the pre-formation position A2 in which the S(J-P) is moved only to the upstream side. Thereby, the pre-form at the pre-formed position A2 The action becomes possible.

When the respective substrates 1 are sequentially transported to the downstream side at one interval P from the state indicated by γ in FIG. 9, the islands 2 of the most upstream of the substrate 1a reach the bonding position as indicated by δ in FIG. 9 . Up to B, the island regions 2 of the substrate 1b are sequentially corresponding to the pre-formation position A2 by the intermittent transfer of the one interval P. Therefore, the pre-forming action at the pre-formed position A2 is possible, and the bonding action at the bonding position B is also possible.

However, from the state shown by δ in Fig. 9 to the ε shown in Fig. 9, when the island-shaped region 2 at the most downstream of the substrate 1b is transported to the bonding position B, it is necessary to transmit at intervals of J. When the interval transmission is performed, the second island-like region 2 from the upstream of the substrate 1b does not correspond to the pre-formation position A2. Therefore, in the state of ε in FIG. 9, the pre-formation position is changed to the pre-formation position A1 which moves only to the downstream side by S(J-P). Thereby, the pre-forming operation at the pre-formation position A1 becomes possible.

Therefore, the substrate 1 shown in FIG. 9 can be conveyed and mixed with the interval of J different from P and the interval of the reference ground P, whereby the island-like region 2 of the substrate 1 can be sequentially transported to the preform of A1 or A2. position. As described above, in the state where the island regions 2 of the pre-formed positions A1 and A2 have been transported, the island region 2 to which the adhesive has been applied reaches the bonding position B. Therefore, the wafer 3 can be bonded to the island region 2 to which the adhesive has been applied at the bonding position B.

Further, the pre-formed position is by the pre-forming unit 12 to apply the adhesive to the position of the island-like region 2 at the pre-formed position. Therefore, the adsorption hole 33 of the substrate receiving member 30 corresponds to the position where the island region 2 coated with the adhesive can be adsorbed from below, and corresponds to the side of the island 2 from the pressing lever 41 of the pressing member 40. The position to press from above.

Therefore, at each of the pre-formed positions A1, A2 of the present invention, the substrate receiving member 30 slides along the X-axis direction, and the adsorption hole 33 of the substrate receiving member 30 corresponds to the island-like region 2 at the pre-formed position. In this case, the pressing lever 41 of the pusher 40 and the substrate receiving member 30 are integrally slid (synchronized), and can be pressed from the side of the island-shaped region 2 to which the adhesive 4 is applied from above. In a state where the substrate receiving member 30 is slid, as the state in which the pressing lever 41 is raised, and the state in which the substrate 1 is not interfered, the adsorption hole 33 of the substrate receiving member 30 corresponds to the island at the pre-formed position. In the case of the region 2, the pressing lever 41 is lowered and the substrate 1 is pressed from above.

Thus, in the above embodiment, when the adhesive 4 is applied by the pre-forming unit 12 by the suction mechanism 34 and the pressing member 40, the holding unit 14 of the substrate 1 is held and synchronized with the fluctuation of the pre-formed position. The holding position of the holding unit 14 is moved, and the substrate 1 can be held at an optimum position.

Further, the pre-forming operation of the pre-forming unit 12, the bonding unit 13, the slide rail of the substrate receiving member 30, the holding operation of the holding unit 1, and the like are controlled by the above-described control unit 11 by the interval conveyance of the transport unit 10. Various materials such as an operator of the setting unit 15 are input, and the control unit 11 controls each of the units 12, 13, and the like based on the set value.

Here, in the above description, the lead frame 1 shown in Fig. 9 is used because the drawing is simplified, but even the lead frame 1 actually used as shown in Fig. 8 can be used in the present device. In this case, each island region forms a block portion 51. The arrangement interval of the island-like regions 2 in the X-axis direction is P, but between the formation of the block-like portions 51 in the island-like region, that is, between the lead frames 1, there is a difference (arrangement interval) H between the lead frames 1 and the arrangement interval P. , I, J.

Further, in each of the block portions 51, a plurality of island-like regions 2 are arranged along the X-axis direction and the Y-axis direction, and in the pre-forming operation, the pre-formation position A corresponds to the arrangement interval of the island-like regions 2, and along The cylinder 21 having the nozzle 20 is moved at a predetermined interval in the Y-axis direction. In this case, the island-shaped region 2 from the rear side in the width direction of the substrate 1 (the rear side in the direction perpendicular to the conveyance direction) is applied to the front side in the width direction (the front side in the direction perpendicular to the conveyance direction). 4. Alternatively, an adhesive may be applied from the island-like region 2 on the front side in the width direction of the substrate 1 to the rear side in the width direction.

As shown in FIG. 8, in the lead frame 1, when H=I=J, if the bonding position B is disposed in each of the island regions, the island portion 2 of the front end (downstream end) of the block portion 51 is formed, and When the formation position A is disposed in the island-like region 2 in which the front end (downstream end) of the block portion 51 is formed in each of the island regions, the timing of the entry and the transfer of the interval J between the lead frames H and I and the lead frame becomes the bonding position and The timing of pre-forming the same position. Therefore, in the state shown in FIG. 12, it is not necessary to change the pre-formation position.

However, in the case where the island-like region 2 in which the front end (downstream end) of the block portion 51 is formed in the island region is not disposed at the pre-formed position, the interval H, I and the lead between the block portions at the bonding position The timing of the entry of the interval J between the frames must cause the pre-formed position A to fluctuate. Therefore, two pre-formed positions are required.

In addition, in the case of the interval H≠I=J, if the pre-formed position A is configured The island-like region 2 of the front end (downstream end) of the block portion 51C is formed in the island region, and the interval I between the land portion forming block portion 51B and the island region forming the block portion 51C is formed, and the island region is formed. Since the timing of the intrusion of the interval H between the block portion 51A and the island-like region forming block portion 51B is the same, it is not necessary to change the pre-formation position A.

However, in this case, if the pre-formed position is not disposed in the island-like region 2 where the island-shaped region forms the front (downstream end) of the block portion 51, the island-like region forms the block portion 51B at the bonding position. The interval I between the island-like regions forming the block portions 51C and the timing at which the interval H between the island-like region forming block portions 51A and the island-like region forming the block portions 51B are different are different, and therefore it is necessary to make the The formation position is changed. Therefore, three pre-formed positions are required.

As described above, if there is one different arrangement interval for the reference interval, two pre-formed positions are required. Therefore, in the lead frame shown in Fig. 8, since there are three different arrangement intervals, it is necessary to have 2 × 3 and 6 as the pre-formed position. However, in the past, only two positions were obtained as a pre-formed position. In this case, it is limited to only J≠P (or I). In such a block-like acquisition type, if the pre-formation position A cannot be placed in front of the block portion 51, the block-shaped portion P is transmitted several times at an island-like interval P, and the mantissa cannot be divided at the delivery position. The amount of transmission is corrected. In the case of this method, a column with only pre-formation action occurs, and a loss of adhesion occurs. The same applies to the pressing position. If the pre-forming position is allowed to be two positions, the shape must be pressed by the two, and the substrate 1 (lead frame) must be pressed in a wide range according to the type, and depending on the situation, In the vicinity of the frame, the frame of both sides is pressed, causing difficulty in transportation and cannot be performed. Two positions are set and a loss occurs. In addition, not only losses will occur, but also the design of the matching plate and the pressing member for each lead frame will be required, and the number of types will increase, and the types of corresponding parts will also increase.

However, in the substrate carrying device of the present invention, since the reciprocating motion of the cylinder 21 of the pre-forming unit 12 in the X-axis direction is possible, the cylinder 21 is moved corresponding to the changed pre-formed position, and the pre-position at the position It is also possible to form an action. Therefore, even if six locations are required as the pre-formed positions, the pre-forming action at each pre-formed position is still possible. Further, the reciprocating motion of the substrate receiving member 30 along the X-axis direction is also possible, so that the substrate receiving member 30 can be moved in accordance with the changed pre-formed position. Further, as the movement moves, the holding position of the holding unit 14 is moved, and the substrate 1 can be held at the optimum position.

In the substrate transfer method of the present invention, even if the basic transfer and the transfer different from the basic transfer are mixed, the pre-formed position A can be changed by fixing the adhesive position B, and the pre-formed position can be pre-formed. Form an action. Therefore, in the pre-forming step, a quick-drying adhesive can be used, and the speed improvement of the overall working step is not required, and the yield can be improved. Further, since the holding position of the holding unit 14 can be changed in synchronization with the fluctuation of the pre-formed position A of the holding unit 12, the pre-forming operation at each pre-forming position A can be stabilized, and the island-shaped area can be avoided. 2 Adhesive sticking and insufficient coating of the adhesive, etc., so that the subsequent bonding step is stable, and high-precision bonding work becomes possible.

Further, since it is possible to synchronize with the fluctuation of the pre-formed position A of the pre-formed unit 12 and to change the holding position of the holding unit 14, the basic The intermittent transfer and the different interval transfer (for example, inter-substrate transfer and inter-substrate transfer between the substrates) are mixed, and the adhesive loss such as waiting for the bonding operation can be prevented.

As the holding unit 14, since the suction mechanism 34 that adsorbs the substrate 1 from the back side and the pressing member 40 that presses the substrate 1 from above are included, the island region 2 to which the adhesive 4 is applied can be stabilized at the time of pre-forming. Maintained in a high position and stabilized the preforming operation. In particular, when the holding unit 14 is configured by the suction mechanism 34, the adsorption hole 33 serving as the substrate receiving member 30 can be arranged in an array of island-shaped regions arranged in a direction perpendicular to the conveyance direction (X direction) of the substrate 1. And the hole size can be fixed. Therefore, in the method of transporting the substrate 1, the substrate receiving member 30 is mixed even if the basic interval is conveyed and transported at a different interval from the interval of the substrate (for example, transfer between substrates and transfer between blocks in the substrate). Sharing is also possible. Therefore, it is not necessary to have a plurality of types of corresponding parts, and low cost can be achieved. (In this case, if the position of the adsorption hole cannot be changed, the adsorption hole must be arranged along the X direction, so the adsorption route is complicated. Moreover, the type corresponding parts are increased.)

As the substrate 1, even if a plurality of island-like regions are formed along the transport direction to form the block portion 51, the intervals between the plurality of island-shaped regions forming the block portions 51 may have different intervals, and can correspond to various types of the substrate 1 . Further, the interval between the substrate 1 on the upstream side and the substrate 1 on the downstream side may correspond to a plurality of types. Therefore, it is excellent in versatility as a device.

Further, in the above embodiment, the substrate receiving member 30 includes the adsorption base 31 and the matching disk 32. Therefore, for one adsorption susceptor 31, by including a plurality of the accommodating disks 32, the number of the adsorption holes 33 of the lands 32 and the arrangement interval are not The same can be used for a plurality of types of substrates 1. That is, by mounting the different types of the mats 32 with one of the adsorption susceptors 31, it is possible to cope with a plurality of types of substrates 1, and it is possible to achieve cost reduction.

Next, FIG. 10 includes two pre-formed units 12. In this case, one of the (first) pre-formed units 12A is provided on the downstream side, and the other (second) pre-formed unit 12B is provided on the upstream side.

In addition, as the first pre-forming unit 12A, the application of the adhesive to the island-shaped region 2 is performed on the rear side in the width direction of the substrate 1, and the second pre-forming unit 12B performs an island shape on the front side in the width direction of the substrate 1. Coating of the adhesive of zone 2. That is, in this embodiment, the block portion 51 is formed in the island region, the adhesive is applied in the zone 55 by the pre-forming unit 12A, and the adhesive is formed in the region 56 as the pre-formed unit 12B. Coating.

In this case, since each of the pre-formed cells 12A, 12B can also be constituted by the pre-formed cells 12 as shown in FIG. 5, each of the pre-formed cells 12A, 12B can correspond to a change in the pre-formed position. Further, a pair of substrate receiving members 30 with a pressing member 40 are included. Therefore, the fluctuation of the pre-formation position is synchronized with the holding position of the holding unit 14 and the fluctuation thereof, and the application operation of the adhesive to each of the island-like regions 2 is stably performed.

The first pre-forming unit 12A and the second pre-forming unit 12B can increase the efficiency of the pre-forming operation of the one substrate 1 . Further, it is possible to further improve the work efficiency by dividing the pre-forming unit 12 into the front side in the width direction of the substrate 1 and the rear side in the width direction of the substrate.

Further, in the case of a pair of pre-formed units 12 of 12A and 12B, each The pre-forming unit may sequentially apply the adhesive 4 in the direction of the arrow Y1, or may sequentially apply the adhesive 4 in the direction of the arrow Y2.

Further, as shown in FIG. 10, in the case of a pair of pre-formed units 12 having 12A and 12B, by the identification of the island-like region 2 of the camera 23, it is preferable that the first region 55 is rearward from the width direction as the arrow Y2. The lateral direction is performed on the front side in the lateral direction, and the second region 56 is formed from the front side in the width direction toward the rear side in the width direction as indicated by an arrow Y1. This is for preventing the erroneous determination of the identification of the island region 2 by the camera 23, and therefore it is preferably performed from the outside of the substrate 1. Therefore, since the camera 23 and the cylinder 21 are integrated, the first region 55 is formed from the front side in the width direction toward the rear side in the width direction as indicated by the arrow Y1, and the rear side in the width direction as the arrow Y2 in the second region 56. The adhesive 4 is applied to the front side in the width direction.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the number of the block portions 51 of the substrate 1, the arrangement interval between the block portions 51, the number of the island regions of each of the block portions 51, the arrangement interval of the island regions 2, and the arrangement between the substrates 1 The interval can be changed arbitrarily.

The holding unit 14 may be configured only by the suction mechanism 34 provided in the adsorption hole 33 of the substrate receiving member 30, or may be configured only by the pressing member 60 that presses the substrate 1 received by the substrate receiving member 30 from above. . That is, the holding unit 14 may not have the pressing member 60 or the suction mechanism 34. Further, the substrate receiving member 30 is constituted by two members of the adsorption base 31 and the matching disk 32 in the above-described embodiment, but may be composed of one member or three or more members.

In addition, as the pre-forming unit 12, it can be 1 machine, and can be 2 machines, and further Can also be 3 machines. Further, in the case of including two machines, in the above-described embodiment, the pre-formation unit 12A close to one of the bonding positions performs a pre-forming operation on the island-shaped region 2 on the rear side of the substrate, and the other is pre-formed. The forming unit 12B performs a pre-forming operation on the island-shaped region 2 on the front side of the substrate, but may reversely perform pre-forming operation on the island-shaped region 2 on the front side of the substrate by one of the pre-forming units 12A, and in another The pre-forming unit 12B performs a pre-forming operation on the island-like region 2 on the rear side of the substrate.

Further, as the adhesive, there are a solder paste, a resin glue, a resin film, and the like. Further, as the resin glue and the resin film, a plurality of epoxy resin-based or polyamide-based resin adhesive materials can be used.

[Industrial availability]

A wafer (die) for bonding a semiconductor wafer or the like to a substrate such as a lead frame can be used. The substrate transfer device includes a transfer unit that transports a plurality of substrates, a control unit that controls the transfer unit, a pre-forming unit, and a bonding unit. As the adhesive to be used, there are a solder paste, a resin glue, a resin film, and the like.

10‧‧‧Transportation unit

11‧‧‧Control unit

12‧‧‧Preformed unit

13‧‧‧bonding unit

14‧‧‧Holding unit

15‧‧‧Setting unit

Claims (7)

A substrate transfer device that transports a substrate having a plurality of island-shaped regions at predetermined intervals along a conveyance direction along the conveyance direction, and applies an adhesive to the island shape of the substrate at a pre-formed position measured upstream After the region, the wafer is bonded to the island region coated with the adhesive at a bonding position on the downstream side, and the substrate transfer device includes a transfer unit that moves the substrate from the upstream side to the downstream side in the transport direction. The side is spaced apart; the bonding unit bonds the wafer to the island region when the island region coated with the adhesive is transported to the bonding position; and the pre-forming unit corresponds to the above-mentioned substrate that has been stopped The pre-formed position is changed by the position of the island-shaped region, and the adhesive is applied to the pre-formed position; and a holding unit that uses the adhesive along the conveyance direction when the adhesive unit is applied by the pre-forming unit Holding the substrate while the reciprocating substrate receiving member receives the substrate, wherein the substrate is moved Pre-forming means and said forming means changes the pre-sync position, and changes the holding position of the holding means. The substrate transfer device according to the first aspect of the invention, wherein the substrate receiving member is provided with an adsorption mechanism, wherein the adsorption mechanism has an adsorption hole for adsorbing the substrate from a back side, and the holding unit is configured by the adsorption mechanism. . The substrate transfer device according to claim 1, further comprising a pressing member that presses the substrate received by the substrate receiving member from above, and the holding member constitutes the holding unit. The substrate transfer device according to claim 1, further comprising a pressing member that presses the substrate received by the substrate receiving member from above, and the substrate receiving member is provided with the substrate The adsorption mechanism that adsorbs from the back side constitutes the holding unit by the adsorption mechanism and the pressing member. The substrate transfer device according to any one of claims 1 to 4, wherein the pre-forming unit includes: a first pre-forming unit, wherein the adhesive is applied to the pre-formed position on the downstream side; The second pre-forming unit applies the adhesive at a pre-formation position on the upstream side of the pre-formed position of the first pre-forming unit. The substrate transfer device according to claim 5, wherein one of the first pre-forming unit and the second pre-forming unit performs the pair of island-shaped regions on the rear side in the width direction of the substrate In the application of the above-described adhesive, the first pre-forming unit and the other pre-forming unit of the second pre-forming unit apply the adhesive to the island-shaped region on the front side in the width direction of the substrate. A substrate transport method in which a substrate having a plurality of island regions formed at predetermined intervals along a conveyance direction is performed from the upstream side toward the downstream side along the conveyance direction The adhesive is applied to the island-shaped region of the substrate in a state where the substrate is held in the pre-formed position measured upstream, and then the wafer is bonded to the adhesive layer coated on the downstream side at the bonding position on the downstream side. In the above-described island-shaped region, the substrate transfer method is characterized in that the substrate transfer method is capable of performing a change in the pre-formation position, wherein the fluctuation corresponds to a position of the island-shaped region of the stopped substrate, and the pre-formed position is In the case of the change, the pre-formed position and the holding position of the substrate are synchronized and fluctuated, and the adhesive is applied to the island-shaped region of the substrate at the changed pre-formed position.