TWI439734B - Lens module and a method for fabricating the same - Google Patents
Lens module and a method for fabricating the same Download PDFInfo
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- TWI439734B TWI439734B TW097120572A TW97120572A TWI439734B TW I439734 B TWI439734 B TW I439734B TW 097120572 A TW097120572 A TW 097120572A TW 97120572 A TW97120572 A TW 97120572A TW I439734 B TWI439734 B TW I439734B
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- 238000000034 method Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims description 53
- 239000011521 glass Substances 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000032683 aging Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 4
- 230000005499 meniscus Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 230000005070 ripening Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
- B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00413—Production of simple or compound lenses made by moulding between two mould parts which are not in direct contact with one another, e.g. comprising a seal between or on the edges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lens Barrels (AREA)
Description
本發明係有關於半導體科技,特別是有關於一種透鏡模組。The present invention relates to semiconductor technology, and more particularly to a lens module.
第1A圖為一傳統的透鏡模組的剖面圖。在第1A圖中,一玻璃基底1是用以形成一透鏡模組10。複數個透鏡模組10可形成於玻璃基底1上。透鏡模組10具有一第一透鏡組件11、一第二透鏡組件12、與一玻璃部分13,其中玻璃基底1是位於第一透鏡組件11與第二透鏡組件12之間,第一透鏡組件11與第二透鏡組件12是由透明的聚合物第二透鏡組件12所形成。Figure 1A is a cross-sectional view of a conventional lens module. In Fig. 1A, a glass substrate 1 is used to form a lens module 10. A plurality of lens modules 10 may be formed on the glass substrate 1. The lens module 10 has a first lens assembly 11, a second lens assembly 12, and a glass portion 13, wherein the glass substrate 1 is located between the first lens assembly 11 and the second lens assembly 12, and the first lens assembly 11 The second lens assembly 12 is formed from a transparent polymer second lens assembly 12.
第1B圖為傳統的透鏡模組10和用以形成透鏡模組10的模仁20與30的剖面圖。模仁20具有一圖形21,圖形21是用以形成透鏡模組10的第一透鏡組件11;而模仁30則具有一圖形31,圖形31是用以形成透鏡模組10的第二透鏡組件12。FIG. 1B is a cross-sectional view of a conventional lens module 10 and mold cores 20 and 30 for forming the lens module 10. The mold core 20 has a pattern 21 which is a first lens assembly 11 for forming the lens module 10, and the mold core 30 has a pattern 31 which is a second lens assembly for forming the lens module 10. 12.
透鏡模組10是藉由下列步驟所形成。首先,將一透鏡材料(未繪示)置於玻璃基底1的一第一表面1a上。然後,將模仁20置於玻璃基底1的第一表面1a上,並以圖形21壓印上述透鏡材料,接下來對已成形的透鏡材料施以熟化處理,以完成透鏡模組10的第一透鏡組件11。接下來,將相同的透鏡材料(未繪示)置於模仁30的圖形 31上。然後,將玻璃基底1與模仁20的組合結構移至模仁30,而使玻璃基底1的一第二表面1b(第一表面1a的相反表面)接觸模仁30的圖形31,以壓印模仁30的圖形31上的上述透鏡材料,並使其成形,接下來對已成形的透鏡材料施以熟化處理,以完成透鏡模組10的第二透鏡組件12。至此,已完成透鏡模組10。最後,將帶有透鏡模組10的玻璃基底1與模仁20、30分離。The lens module 10 is formed by the following steps. First, a lens material (not shown) is placed on a first surface 1a of the glass substrate 1. Then, the mold core 20 is placed on the first surface 1a of the glass substrate 1, and the lens material is embossed with the pattern 21, and then the formed lens material is subjected to aging treatment to complete the first of the lens module 10. Lens assembly 11. Next, the same lens material (not shown) is placed on the pattern of the mold core 30. 31. Then, the combined structure of the glass substrate 1 and the mold core 20 is moved to the mold core 30, and a second surface 1b (the opposite surface of the first surface 1a) of the glass substrate 1 is brought into contact with the pattern 31 of the mold core 30 to be imprinted. The lens material on the pattern 31 of the mold core 30 is shaped and then the formed lens material is subjected to a curing process to complete the second lens assembly 12 of the lens module 10. So far, the lens module 10 has been completed. Finally, the glass substrate 1 with the lens module 10 is separated from the mold cores 20, 30.
如前所述,透鏡模組10的製造需要很多的製程步驟。透鏡模組10的第一透鏡組件11是經過了二次的熟化處理,因此其可能受到了過度的硬化。透鏡模組10的第一透鏡組件11的過度硬化會至少引發二項問題。其一是第一透鏡組件11會發生收縮變形,其二是第一透鏡組件11會發生顏色黃化。上述問題很有可能會對透鏡模組10的光學性能造成不良影響。另外,透鏡模組10並不是一個均質的透鏡,因為第一透鏡組件11與第二透鏡組件12均為聚合物,而玻璃部分13則是玻璃(玻璃部分13即是位於第一透鏡組件11與第二透鏡組件12之間的玻璃基底1)。聚合物與玻璃具有不同的折射係數,在二者之間的界面會發生光的全反射。因此,在透鏡模組10中是具有二個玻璃/聚合物界面,而會對透鏡模組10的透光率造成不良影響。還有,針對透鏡模組10形成壩狀結構(dam structure)(未繪示)及/或遮光罩(light shield)時,則會需要增加更多的製程步驟。As previously mentioned, the fabrication of the lens module 10 requires a number of process steps. The first lens assembly 11 of the lens module 10 is subjected to a secondary curing process, so that it may be excessively hardened. Excessive hardening of the first lens assembly 11 of the lens module 10 can cause at least two problems. One is that the first lens assembly 11 undergoes shrinkage deformation, and the other is that the first lens assembly 11 is yellowed. The above problems are likely to adversely affect the optical performance of the lens module 10. In addition, the lens module 10 is not a homogeneous lens because the first lens assembly 11 and the second lens assembly 12 are both polymers, and the glass portion 13 is glass (the glass portion 13 is located at the first lens assembly 11 and The glass substrate 1) between the second lens assemblies 12. The polymer has a different refractive index than the glass, and total reflection of light occurs at the interface between the two. Therefore, there are two glass/polymer interfaces in the lens module 10, which adversely affect the light transmittance of the lens module 10. Further, when a dam structure (not shown) and/or a light shield is formed for the lens module 10, it is necessary to add more process steps.
有鑑於此,本發明的實施例是提供透鏡模組及其製造方法,可改善透鏡模組的光學性能,並減少製造此一透鏡模組所需的製程步驟。In view of this, embodiments of the present invention provide a lens module and a method of fabricating the same that can improve the optical performance of the lens module and reduce the number of manufacturing steps required to fabricate the lens module.
本發明的一實施例是提供一種透鏡模組,包含:一基底,具有一貫穿孔於其中;以及一透鏡結構,嵌於上述貫穿孔中。An embodiment of the present invention provides a lens module including: a substrate having a uniform perforation therein; and a lens structure embedded in the through hole.
本發明的另一實施例是提供一種透鏡模組的製造方法。首先,提供一基底,上述基底具有一貫穿孔於其中。然後,提供一第一模仁(molding die)與一第二模仁,上述第一模仁具有對應於上述貫穿孔的一第一透鏡圖形,上述第二模仁具有對應於上述貫穿孔的一第二透鏡圖形。接下來,將上述基底置於上述第一模仁上,其中上述基底的上述貫穿孔是與上述第一透鏡圖形對準。接下來,將一透鏡材料置於上述貫穿孔內及上述第一透鏡圖形上。接著,將上述第二模仁置於上述基底上並壓印(imprinting)上述透鏡材料。上述第二透鏡圖形是與上述基底的上述貫穿孔對準,且使上述透鏡材料成形而成為一透鏡結構,上述透鏡結構藉由上述第一透鏡圖形與上述第二透鏡圖形而嵌入上述貫穿孔中。最後,將上述第一模仁、於上述貫穿孔包含上述透鏡結構的上述基底、與上述第二模仁分離。Another embodiment of the present invention provides a method of fabricating a lens module. First, a substrate is provided, the substrate having a uniform perforation therein. Then, a first molding die and a second mold core are provided, the first mold core has a first lens pattern corresponding to the through hole, and the second mold core has a corresponding one of the through holes Second lens pattern. Next, the substrate is placed on the first mold core, wherein the through hole of the substrate is aligned with the first lens pattern. Next, a lens material is placed in the through hole and on the first lens pattern. Next, the second mold core is placed on the substrate and the lens material is imprinted. The second lens pattern is aligned with the through hole of the base, and the lens material is formed into a lens structure. The lens structure is embedded in the through hole by the first lens pattern and the second lens pattern. . Finally, the first mold core and the base including the lens structure in the through hole are separated from the second mold core.
為讓本發明之上述和其他目的、特徵、和優點能更 明顯易懂,下文特舉出較佳實施例,並配合所附圖式,作詳細說明如下:在以下的敘述中,所謂的「實質上均質」,係指在設計上期望為均質,但在實際實行中卻難以達成數學上或理論上「完全地均質」,而當變動的範圍落於對應的標準或規格所訂定的允收範圍內,就應視為均質。本發明所屬技術領域中具有通常知識者應當瞭解依據不同的性質、條件、需求等等,上述對應的標準或規格會有所不同,故下文中並未列出特定的標準或規格。The above and other objects, features, and advantages of the present invention will be more The following is a detailed description of the preferred embodiments, and is described in detail below with reference to the accompanying drawings. In the following description, the term "substantially homogeneous" means that the design is expected to be homogeneous, but In practice, it is difficult to achieve "completely homogeneous" mathematically or theoretically, and it should be considered homogeneous when the scope of the change falls within the tolerance range specified by the corresponding standard or specification. Those having ordinary skill in the art to which the present invention pertains should understand that the above-mentioned corresponding standards or specifications may vary depending on different properties, conditions, requirements, etc., and thus specific standards or specifications are not listed below.
第2A~2C圖為一系列之剖面圖,係顯示本發明較佳實施例之透鏡模組。2A-2C are a series of cross-sectional views showing a lens module in accordance with a preferred embodiment of the present invention.
在第2A圖中,所示透鏡模組包含一基底100與一透鏡結構200。基底100包含一貫穿孔110,而透鏡結構200則嵌於貫穿孔110中。因此,透鏡結構200可以是均質或實質上均質,其內並未含有基底的任何一部分,而防止入射的光線因界面的全反射而遭受損失,並改善本發明較佳實施例之透鏡模組的光學性能。In FIG. 2A, the illustrated lens module includes a substrate 100 and a lens structure 200. The substrate 100 includes a uniform perforation 110, and the lens structure 200 is embedded in the through hole 110. Thus, the lens structure 200 can be homogeneous or substantially homogeneous, without any portion of the substrate therein, preventing loss of incident light due to total reflection of the interface, and improving the lens module of the preferred embodiment of the present invention. Optical performance.
基底100可以是透明基底、半透明基底、或不透光基底。基底100的材質可以玻璃或是其他的材質。在本實施例中,基底100為透明的玻璃基底。透鏡結構200的材質可以是任何已知的透明的聚合物。在本實施例中,透鏡結構200包含一透鏡本體210,透鏡本體210是直接與貫穿孔110的側壁連接。在本實施例中,透鏡本體210為一雙凸透鏡;而在其他實施例中,透鏡本體210 亦可以是其他種類的透鏡,例如平凸透鏡、彎月形透鏡(meniscus lens)、凹透鏡、或其他已知種類的透鏡。Substrate 100 can be a transparent substrate, a translucent substrate, or an opaque substrate. The material of the substrate 100 can be made of glass or other materials. In the present embodiment, the substrate 100 is a transparent glass substrate. The material of the lens structure 200 can be any known transparent polymer. In the present embodiment, the lens structure 200 includes a lens body 210 that is directly connected to the sidewall of the through hole 110. In this embodiment, the lens body 210 is a lenticular lens; in other embodiments, the lens body 210 Other types of lenses are also possible, such as plano-convex lenses, meniscus lenses, concave lenses, or other known types of lenses.
與第2A圖所示的透鏡模組相比,第2B圖所示的透鏡模組是以一透鏡結構300來取代嵌於貫穿孔110中的透鏡結構200。在第2B圖中,透鏡結構300包含一透鏡本體310與一連接構件320,連接構件320連接透鏡本體310與貫穿孔110的側壁。在本實施例中,透鏡本體310是位於貫穿孔110的中央區,且被連接構件320所圍繞;在其他實施例中,透鏡本體310的一部分可直接連接貫穿孔110的側壁的一部分,而連接構件320則連接透鏡本體310的其他部分與貫穿孔110的側壁的其他部分。在本實施例中,透鏡本體310為一雙凸透鏡;而在其他實施例中,透鏡本體310亦可以是其他種類的透鏡,例如平凸透鏡、彎月形透鏡(meniscus lens)、凹透鏡、或其他已知種類的透鏡。Compared with the lens module shown in FIG. 2A, the lens module shown in FIG. 2B replaces the lens structure 200 embedded in the through hole 110 by a lens structure 300. In FIG. 2B, the lens structure 300 includes a lens body 310 and a connecting member 320 that connects the lens body 310 and the sidewall of the through hole 110. In the present embodiment, the lens body 310 is located in a central region of the through hole 110 and is surrounded by the connecting member 320. In other embodiments, a portion of the lens body 310 may directly connect a portion of the sidewall of the through hole 110 to be connected. Member 320 connects the other portions of lens body 310 with other portions of the sidewalls of through hole 110. In this embodiment, the lens body 310 is a lenticular lens; in other embodiments, the lens body 310 can also be other kinds of lenses, such as a plano-convex lens, a meniscus lens, a concave lens, or the like. Know the kind of lens.
與第2A圖所示的透鏡模組相比,第2C圖所示的透鏡模組是以一透鏡結構400來取代嵌於貫穿孔110中的透鏡結構200。在第2C圖中,透鏡結構400包含一透鏡本體410、一連接構件420、與一壩狀結構430。壩狀結構430是位於貫穿孔110的至少一部分的側壁上,並延伸至貫穿孔110以外的區域。在某些實施例中,壩狀結構430可用於阻擋不需要的入射光。連接構件420則連接透鏡本體410與壩狀結構430。在本實施例中,透鏡本體410為一雙凸透鏡;而在其他實施例中,透鏡本體410 亦可以是其他種類的透鏡,例如平凸透鏡、彎月形透鏡(meniscus lens)、凹透鏡、或其他已知種類的透鏡。Compared with the lens module shown in FIG. 2A, the lens module shown in FIG. 2C replaces the lens structure 200 embedded in the through hole 110 by a lens structure 400. In FIG. 2C, the lens structure 400 includes a lens body 410, a connecting member 420, and a dam structure 430. The dam-like structure 430 is located on a side wall of at least a portion of the through hole 110 and extends to a region other than the through hole 110. In some embodiments, the dam-like structure 430 can be used to block unwanted incident light. The connecting member 420 connects the lens body 410 and the dam structure 430. In this embodiment, the lens body 410 is a lenticular lens; in other embodiments, the lens body 410 Other types of lenses are also possible, such as plano-convex lenses, meniscus lenses, concave lenses, or other known types of lenses.
在本實施例中,壩狀結構430是置於貫穿孔110的全部的側壁上,並延伸至貫穿孔110以外的區域;而壩狀結構430則圍繞連接構件420;而連接構件420則圍繞透鏡本體410。在某些情況中,部分的透鏡本體410可直接連接部分的壩狀結構430,而連接構件420則連接透鏡本體410的其他部分與壩狀結構430的其他部分。In the present embodiment, the dam-like structure 430 is placed on all the side walls of the through hole 110 and extends to a region other than the through hole 110; and the dam-like structure 430 surrounds the connecting member 420; and the connecting member 420 surrounds the lens. Body 410. In some cases, a portion of the lens body 410 can directly connect portions of the dam-like structure 430, while the connecting member 420 connects other portions of the lens body 410 with other portions of the dam-like structure 430.
在某些實施例中,壩狀結構430可置於貫穿孔110的部分側壁上,並延伸至貫穿孔110以外的區域。在某些情況中,一部分的透鏡本體410可直接連接部分未連接壩狀結構430的貫穿孔110的側壁,而透鏡本體410的其他部分則藉由連接構件420而與壩狀結構430及未連接壩狀結構430的貫穿孔110的側壁的其他部分連接。在某些情況中,連接構件420連接透鏡本體410與壩狀結構430及貫穿孔110的側壁的其他部分。In some embodiments, the dam-like structure 430 can be placed over a portion of the sidewall of the through hole 110 and extends to a region other than the through hole 110. In some cases, a portion of the lens body 410 may directly connect a portion of the sidewall of the through hole 110 that is not connected to the dam structure 430, and other portions of the lens body 410 are not connected to the dam structure 430 by the connecting member 420. The other portions of the side walls of the through hole 110 of the dam-like structure 430 are connected. In some cases, the connecting member 420 connects the lens body 410 with the dam-like structure 430 and other portions of the sidewalls of the through-hole 110.
第3圖為一剖面圖,係顯示繪示於第2A圖的透鏡模組的應用。在第3圖中,第2A圖所示的透鏡模組係置於一半導體基底500的上方,並由二者之間的複數個間隔物510所支持。複數個透鏡本體210是分別對應半導體基底500上或其中的複數個感光元件(未繪示)。在其他的實施例中,可以相同的手法將繪示於第2A及/或2B圖半導體基底500所示的透鏡模組置於半導體基底500的上方。Figure 3 is a cross-sectional view showing the application of the lens module shown in Figure 2A. In Fig. 3, the lens module shown in Fig. 2A is placed over a semiconductor substrate 500 and supported by a plurality of spacers 510 therebetween. The plurality of lens bodies 210 are respectively corresponding to a plurality of photosensitive elements (not shown) on or in the semiconductor substrate 500. In other embodiments, the lens module shown in the semiconductor substrate 500 of FIGS. 2A and/or 2B can be placed over the semiconductor substrate 500 in the same manner.
第4A~4C圖為一系列之剖面圖,係顯示第2A圖所示之透鏡模組的一例示的製造方法。4A to 4C are a series of cross-sectional views showing an exemplary manufacturing method of the lens module shown in Fig. 2A.
在第4A圖中,是提供一基底100與一模仁610,其中基底100是具有貫穿孔110於其中,而模仁610則具有一透鏡圖形615,透鏡圖形615是對應於貫穿孔110。透鏡圖形615具有一透鏡本體圖形611,透鏡本體圖形611是包含第2A圖所示的透鏡模組的透鏡本體210的一輪廓。然後,將基底100的貫穿孔110與模仁610的透鏡圖形615對準,並將基底100實於模仁610上。In FIG. 4A, a substrate 100 and a mold core 610 are provided, wherein the substrate 100 has a through hole 110 therein, and the mold core 610 has a lens pattern 615 corresponding to the through hole 110. The lens pattern 615 has a lens body pattern 611 which is a contour of the lens body 210 including the lens module shown in FIG. 2A. Then, the through hole 110 of the substrate 100 is aligned with the lens pattern 615 of the mold core 610, and the substrate 100 is placed on the mold core 610.
在第4B圖中,是將一透鏡材料250置於貫穿孔110中及透鏡圖形615上。透鏡材料250較好為一可加熱熟化的透明聚合物、或是可經紫外光照射而熟化的一透明聚合物。In Fig. 4B, a lens material 250 is placed in the through hole 110 and on the lens pattern 615. The lens material 250 is preferably a heat-curable transparent polymer or a transparent polymer which can be cured by irradiation with ultraviolet light.
在第4C圖中,是提供一模仁620,模仁620具有一透鏡圖形625,透鏡圖形625是對應於貫穿孔110。透鏡圖形625具有一透鏡本體圖形621,透鏡本體圖形621是包含第2A圖所示的透鏡模組的透鏡本體210的一輪廓。在本實施例中,模仁610與620均包含用以製造第2A圖所示的透鏡模組的透鏡本體210的透鏡圖形;在某些實施例中,僅模仁610與620其中之一具有用以製造第2A圖所示的透鏡模組的透鏡本體210的透鏡圖形,而另一個則支撐基底100與透鏡材料250,但不具有包含透鏡本體210的一輪廓的透鏡本體圖形。In FIG. 4C, a mold core 620 is provided. The mold core 620 has a lens pattern 625 corresponding to the through hole 110. The lens pattern 625 has a lens body pattern 621 which is a contour of the lens body 210 including the lens module shown in FIG. 2A. In the present embodiment, the mold cores 610 and 620 each include a lens pattern for fabricating the lens body 210 of the lens module shown in FIG. 2A; in some embodiments, only one of the mold cores 610 and 620 has The lens pattern of the lens body 210 used to fabricate the lens module shown in FIG. 2A, while the other supports the substrate 100 and the lens material 250, but does not have a lens body pattern including a contour of the lens body 210.
接下來,將模仁620的透鏡圖形625與基底100的 貫穿孔110對準,然後將模仁620置於基底100上。在此時,是使繪示於第4B圖的透鏡材料250成形,而成為嵌於貫穿孔110中的透鏡結構200。Next, the lens pattern 625 of the mold core 620 and the substrate 100 are The through holes 110 are aligned and the mold core 620 is then placed on the substrate 100. At this time, the lens material 250 shown in FIG. 4B is molded to form the lens structure 200 embedded in the through hole 110.
在一較佳的實施例中,是需要一熟化的步驟來硬化透鏡結構200。上述熟化步驟可在將模仁610、於貫穿孔110包含透鏡結構200的基底100、與模仁620分離之前或之後實施,且較好為在上述分離步驟之前實施以避免在熟化步驟的過程中,透鏡結構200的輪廓發生變化。上述熟化步驟的實施可使用紫外光的照射或加熱(熱處理)。在本實施例中,是在將模仁610、於貫穿孔110包含透鏡結構200的基底100、與模仁620分離之前,以紫外光的照射來熟化透鏡結構200。在上述熟化步驟後,將模仁610、於貫穿孔110包含透鏡結構200的基底100、與模仁620分離,而完成第2A圖所示的透鏡結構。In a preferred embodiment, a curing step is required to harden the lens structure 200. The above-described maturation step may be carried out before or after separating the mold core 610, the substrate 100 including the lens structure 200 in the through-hole 110, and the mold core 620, and preferably before the separation step described above to avoid during the ripening step. The contour of the lens structure 200 changes. The above-described curing step can be carried out by irradiation with ultraviolet light or heating (heat treatment). In the present embodiment, the lens structure 200 is cured by irradiation of ultraviolet light before the mold core 610, the substrate 100 including the lens structure 200 in the through hole 110, and the mold core 620 are separated. After the aging step, the mold core 610, the substrate 100 including the lens structure 200 in the through hole 110, and the mold core 620 are separated, and the lens structure shown in FIG. 2A is completed.
受惠於第2A圖所示的透鏡結構的製造僅需要最多一道的熟化步驟,可以避免透鏡結構200的過度硬化、收縮變形、及顏色黃化,並可減少製程步驟。The fabrication of the lens structure benefiting from Fig. 2A requires only a maximum of one aging step, which avoids excessive hardening, shrinkage deformation, and yellowing of the lens structure 200, and can reduce the number of processing steps.
第2B與2C圖所示的透鏡模組的製造,亦可使用等效於前文對第4A~4C圖所作敘述的步驟與分別符合其透鏡模組的模仁。For the manufacture of the lens module shown in FIGS. 2B and 2C, it is also possible to use a procedure equivalent to the steps described above for FIGS. 4A to 4C and the molds respectively conforming to the lens module.
在第5圖中,是顯示第2B圖所示的透鏡結構及其適用的模仁710與720。模仁710具有一透鏡圖形715,透鏡圖形715是對應於貫穿孔110。透鏡圖形715具有一透鏡本體圖形711與一連接構件圖形712,連接構件圖形 712是連接於透鏡本體圖形711。透鏡本體圖形711包含透鏡本體310的一輪廓,連接構件圖形712則包含連接構件320的一輪廓。在本實施例中,透鏡本體310是被連接構件320所圍繞,因此透鏡本體圖形711是被連接構件圖形712所圍繞;在其他實施例中,透鏡本體圖形711與連接構件圖形712的排列是決定於透鏡本體310與連接構件320的預定的排列方式。In Fig. 5, the lens structure shown in Fig. 2B and its applicable mold cores 710 and 720 are shown. The mold core 710 has a lens pattern 715 corresponding to the through hole 110. The lens pattern 715 has a lens body pattern 711 and a connecting member pattern 712, and the connecting member pattern 712 is connected to the lens body pattern 711. The lens body pattern 711 includes a contour of the lens body 310, and the connecting member pattern 712 includes a contour of the connecting member 320. In the present embodiment, the lens body 310 is surrounded by the connecting member 320, so the lens body pattern 711 is surrounded by the connecting member pattern 712; in other embodiments, the arrangement of the lens body pattern 711 and the connecting member pattern 712 is determined. The predetermined arrangement of the lens body 310 and the connecting member 320.
模仁720具有一透鏡圖形725,透鏡圖形725是對應於貫穿孔110。透鏡圖形725具有一透鏡本體圖形721與一連接構件圖形722,連接構件圖形722是連接於透鏡本體圖形721。透鏡本體圖形721包含透鏡本體310的一輪廓,連接構件圖形722則包含連接構件320的一輪廓。在本實施例中,透鏡本體310是被連接構件320所圍繞,因此透鏡本體圖形721是被連接構件圖形722所圍繞;在其他實施例中,透鏡本體圖形721與連接構件圖形722的排列是決定於透鏡本體310與連接構件320的預定的排列方式。The mold core 720 has a lens pattern 725 corresponding to the through hole 110. The lens pattern 725 has a lens body pattern 721 and a connecting member pattern 722, and the connecting member pattern 722 is coupled to the lens body pattern 721. The lens body pattern 721 includes a contour of the lens body 310, and the connecting member pattern 722 includes a contour of the connecting member 320. In the present embodiment, the lens body 310 is surrounded by the connecting member 320, so the lens body pattern 721 is surrounded by the connecting member pattern 722; in other embodiments, the arrangement of the lens body pattern 721 and the connecting member pattern 722 is determined. The predetermined arrangement of the lens body 310 and the connecting member 320.
在本實施例中,模仁710與720均包含用以製造透鏡本體310的透鏡本體圖形、與用以製造連接構件320的連接構件圖形;在某些實施例中,僅模仁710與720其中之一具有用以製造透鏡本體310的透鏡本體圖形、與用以製造連接構件320的連接構件圖形;而另一個則在製程中支撐基底100與一透鏡材料(未繪示),但不具有用以製造透鏡本體310的透鏡本體圖形、與用以製造連 接構件320的連接構件圖形。In the present embodiment, the mold cores 710 and 720 each include a lens body pattern for fabricating the lens body 310, and a connecting member pattern for fabricating the connecting member 320; in some embodiments, only the mold cores 710 and 720 are One has a lens body pattern for manufacturing the lens body 310, and a connecting member pattern for manufacturing the connecting member 320; and the other supports the substrate 100 and a lens material (not shown) in the process, but does not have a use. To manufacture the lens body pattern of the lens body 310, and to manufacture The connecting member pattern of the connecting member 320.
在第6圖中,是顯示第2C圖所示的透鏡結構及其適用的模仁810與820。模仁810具有一透鏡圖形815,透鏡圖形815是對應於貫穿孔110。透鏡圖形815具有一透鏡本體圖形811、一壩狀結構圖形813、與一連接構件圖形812,連接構件圖形812是連接透鏡本體圖形811與壩狀結構圖形813。因此,壩狀結構430可與透鏡本體410與連接構件420同時製造,也就是不需要額外的製程步驟來製造壩狀結構430。In Fig. 6, the lens structure shown in Fig. 2C and its applicable mold cores 810 and 820 are shown. The mold core 810 has a lens pattern 815 corresponding to the through hole 110. The lens pattern 815 has a lens body pattern 811, a dam-like structure pattern 813, and a connection member pattern 812 which is a connection lens body pattern 811 and a dam-like structure pattern 813. Thus, the dam-like structure 430 can be fabricated simultaneously with the lens body 410 and the connecting member 420, that is, no additional processing steps are required to fabricate the dam-like structure 430.
透鏡本體圖形811具有透鏡本體410的一輪廓,連接構件圖形812則具有連接構件420的一輪廓,而壩狀結構圖形813則具有壩狀結構430的一輪廓。在本實施例中,壩狀結構430圍繞連接構件420,且連接構件420圍繞透鏡本體410;因此,壩狀結構圖形813圍繞連接構件圖形812,且連接構件圖形812圍繞透鏡本體圖形811。在其他實施例中,透鏡本體圖形811、連接構件圖形812、與壩狀結構圖形813的排列是決定於透鏡本體410、連接構件420、與壩狀結構430的預定的排列方式。The lens body pattern 811 has a contour of the lens body 410, the connecting member pattern 812 has a contour of the connecting member 420, and the dam-like structure pattern 813 has a contour of the dam-like structure 430. In the present embodiment, the dam-like structure 430 surrounds the connecting member 420, and the connecting member 420 surrounds the lens body 410; therefore, the dam-like structure pattern 813 surrounds the connecting member pattern 812, and the connecting member pattern 812 surrounds the lens body pattern 811. In other embodiments, the arrangement of the lens body pattern 811, the connecting member pattern 812, and the dam-like structure pattern 813 is determined by a predetermined arrangement of the lens body 410, the connecting member 420, and the dam-like structure 430.
模仁820具有一透鏡圖形825,透鏡圖形825是對應於貫穿孔110。透鏡圖形825具有一透鏡本體圖形821、一壩狀結構圖形823、與一連接構件圖形822,連接構件圖形822是連接透鏡本體圖形821與壩狀結構圖形823。透鏡本體圖形821具有透鏡本體410的一輪廓,連接構件圖形822則具有連接構件420的一輪廓,而壩狀結構 圖形823則具有壩狀結構430的一輪廓。在本實施例中,壩狀結構430圍繞連接構件420,且連接構件420圍繞透鏡本體410;因此,壩狀結構圖形823圍繞連接構件圖形822,且連接構件圖形822圍繞透鏡本體圖形821。在其他實施例中,透鏡本體圖形821、連接構件圖形822、與壩狀結構圖形823的排列是決定於透鏡本體410、連接構件420、與壩狀結構430的預定的排列方式。The mold core 820 has a lens pattern 825 corresponding to the through hole 110. The lens pattern 825 has a lens body pattern 821, a dam-like structure pattern 823, and a connecting member pattern 822. The connecting member pattern 822 is a connecting lens body pattern 821 and a dam-like structure pattern 823. The lens body pattern 821 has a contour of the lens body 410, and the connecting member pattern 822 has a contour of the connecting member 420, and the dam structure The graphic 823 has a contour of the dam-like structure 430. In the present embodiment, the dam-like structure 430 surrounds the connecting member 420, and the connecting member 420 surrounds the lens body 410; therefore, the dam-like structure pattern 823 surrounds the connecting member pattern 822, and the connecting member pattern 822 surrounds the lens body figure 821. In other embodiments, the arrangement of the lens body pattern 821, the connecting member pattern 822, and the dam-like structure pattern 823 is determined by a predetermined arrangement of the lens body 410, the connecting member 420, and the dam-like structure 430.
在本實施例中,模仁810與820均包含用以製造透鏡本體410的透鏡本體圖形、用以製造連接構件420的連接構件圖形、與用以製造壩狀結構430的壩狀結構圖形;在某些實施例中,僅模仁810與820其中之一具有用以製造透鏡本體410的透鏡本體圖形、用以製造連接構件420的連接構件圖形、與用以製造壩狀結構430的壩狀結構圖形;而另一個則在製程中支撐基底100與一透鏡材料(未繪示),但不具有用以製造透鏡本體410的透鏡本體圖形、用以製造連接構件420的連接構件圖形、與用以製造壩狀結構430的壩狀結構圖形。In the present embodiment, the mold cores 810 and 820 each include a lens body pattern for manufacturing the lens body 410, a connection member pattern for manufacturing the connection member 420, and a dam-like structure pattern for manufacturing the dam structure 430; In some embodiments, only one of the mold cores 810 and 820 has a lens body pattern for fabricating the lens body 410, a connection member pattern for fabricating the connection member 420, and a dam structure for fabricating the dam structure 430. The other one supports the substrate 100 and a lens material (not shown) in the process, but does not have the lens body pattern for manufacturing the lens body 410, the connecting member pattern for manufacturing the connecting member 420, and the A dam-like structure pattern of the dam-like structure 430 is fabricated.
如前所述,本發明之透鏡模組及其製造方法的功效是提供均質或實質上均質的透鏡結構、改善透鏡模組的光學性能、並減少製造透鏡模組所需的製程步驟。As described above, the lens module of the present invention and the method of manufacturing the same have the function of providing a homogeneous or substantially homogeneous lens structure, improving the optical performance of the lens module, and reducing the number of manufacturing steps required to manufacture the lens module.
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專 利範圍所界定者為準。Although the present invention has been disclosed in the above preferred embodiments, the present invention is not intended to limit the invention, and it is possible to make a few changes without departing from the spirit and scope of the invention. And the retouching, so the scope of protection of the present invention is attached to the application The scope defined by the scope of interest is subject to change.
1‧‧‧玻璃基底1‧‧‧glass substrate
1a‧‧‧第一表面1a‧‧‧ first surface
1b‧‧‧第二表面1b‧‧‧ second surface
10‧‧‧透鏡模組10‧‧‧ lens module
11‧‧‧第一透鏡組件11‧‧‧First lens assembly
12‧‧‧第二透鏡組件12‧‧‧Second lens assembly
13‧‧‧玻璃部分13‧‧‧glass section
20、30、610、620、710、720、810、820‧‧‧模仁20, 30, 610, 620, 710, 720, 810, 820‧‧‧
21、31‧‧‧圖形21, 31‧‧‧ graphics
100‧‧‧基底100‧‧‧Base
110‧‧‧貫穿孔110‧‧‧through holes
200、300、400‧‧‧透鏡結構200, 300, 400‧‧‧ lens structure
210、310、410‧‧‧透鏡本體210, 310, 410‧‧‧ lens body
250‧‧‧透鏡材料250‧‧‧Lens material
320、420‧‧‧連接構件320, 420‧‧‧ connecting members
430‧‧‧壩狀結構430‧‧‧ dam structure
500‧‧‧半導體基底500‧‧‧Semiconductor substrate
510‧‧‧間隔物510‧‧‧ spacers
611、621、711、721、811、821‧‧‧透鏡本體圖形611, 621, 711, 721, 811, 821‧‧‧ lens body graphics
615、625、715、725、815、825‧‧‧透鏡圖形615, 625, 715, 725, 815, 825‧‧ ‧ lens graphics
712、722、812、822‧‧‧連接構件圖形712, 722, 812, 822‧‧‧ connection member graphics
813、823‧‧‧壩狀結構圖形813, 823‧‧‧ dam structure graphics
第1A圖為一剖面圖,係顯示一傳統的透鏡模組。Figure 1A is a cross-sectional view showing a conventional lens module.
第1B圖為一剖面圖,係顯示第1A圖所示之傳統的透鏡模組及用以形成該傳統的透鏡模組的模仁。Fig. 1B is a cross-sectional view showing a conventional lens module shown in Fig. 1A and a mold core for forming the conventional lens module.
第2A~2C圖為一系列之剖面圖,係顯示本發明較佳實施例之透鏡模組。2A-2C are a series of cross-sectional views showing a lens module in accordance with a preferred embodiment of the present invention.
第3圖為一剖面圖,係顯示本發明較佳實施例之透鏡模組的應用。Figure 3 is a cross-sectional view showing the application of the lens module of the preferred embodiment of the present invention.
第4A~4C圖為一系列之剖面圖,係顯示第2A圖所示之透鏡模組的一例示的製造方法。4A to 4C are a series of cross-sectional views showing an exemplary manufacturing method of the lens module shown in Fig. 2A.
第5圖為一剖面圖,係顯示第2B圖所示之透鏡模組及用以形成該透鏡模組的模仁。Figure 5 is a cross-sectional view showing the lens module shown in Figure 2B and the mold used to form the lens module.
第6圖為一剖面圖,係顯示第2C圖所示之透鏡模組及用以形成該透鏡模組的模仁。Figure 6 is a cross-sectional view showing the lens module shown in Figure 2C and the mold used to form the lens module.
100‧‧‧基底100‧‧‧Base
110‧‧‧貫穿孔110‧‧‧through holes
200‧‧‧透鏡結構200‧‧‧ lens structure
210‧‧‧透鏡本體210‧‧‧ lens body
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US12/039,257 US7920328B2 (en) | 2008-02-28 | 2008-02-28 | Lens module and a method for fabricating the same |
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JP5009209B2 (en) * | 2008-03-21 | 2012-08-22 | シャープ株式会社 | Wafer-like optical device and manufacturing method thereof, electronic element wafer module, sensor wafer module, electronic element module, sensor module, and electronic information device |
JP2011180293A (en) * | 2010-02-26 | 2011-09-15 | Fujifilm Corp | Lens array |
CN102812387A (en) * | 2010-03-31 | 2012-12-05 | Ev集团有限责任公司 | Method and device for producing a micro-lens |
SG179304A1 (en) * | 2010-09-16 | 2012-04-27 | Dharmatilleke Medha | Methods and camera systems for recording and creation of 3-dimension (3-d) capable videos and 3-dimension (3-d) still photos |
FR2965103B1 (en) * | 2010-09-17 | 2013-06-28 | Commissariat Energie Atomique | OPTICAL IMAGING SYSTEM WITH IMPROVED FTM |
WO2013010284A2 (en) * | 2011-07-19 | 2013-01-24 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same |
JP2014521992A (en) * | 2011-07-19 | 2014-08-28 | ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッド | Method for manufacturing passive optical component and device comprising passive optical component |
TWI614107B (en) * | 2015-07-15 | 2018-02-11 | 趙崇禮 | Molding device for lens array and the using method thereof |
DE102016113471B4 (en) * | 2016-07-21 | 2022-10-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | PROCESS FOR MANUFACTURING OPTICAL COMPONENTS |
CN107146800A (en) * | 2017-05-22 | 2017-09-08 | 武汉新芯集成电路制造有限公司 | A kind of encapsulation design of imaging sensor |
TWI701127B (en) * | 2019-05-16 | 2020-08-11 | 趙崇禮 | Molding device for lens array |
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US4154506A (en) | 1976-08-12 | 1979-05-15 | Izon Corporation | Projection lens plate for microfiche |
US6707613B2 (en) * | 2000-04-05 | 2004-03-16 | Rohm Co., Ltd. | Lens array unit and method of forming image |
EP1251365B1 (en) | 2001-04-20 | 2004-02-25 | Matsushita Electric Industrial Co., Ltd. | Microlens array and method of its manufacturing |
US6894840B2 (en) * | 2002-05-13 | 2005-05-17 | Sony Corporation | Production method of microlens array, liquid crystal display device and production method thereof, and projector |
JP3983652B2 (en) * | 2002-11-13 | 2007-09-26 | シャープ株式会社 | Microlens array substrate manufacturing method and manufacturing apparatus |
JP2004198536A (en) | 2002-12-16 | 2004-07-15 | Three M Innovative Properties Co | Lens array sheet and its forming method |
JP4751650B2 (en) * | 2004-06-11 | 2011-08-17 | 株式会社リコー | Micro optical element, spatial light modulation device and projector apparatus using the micro optical element |
JP4423671B2 (en) * | 2004-12-15 | 2010-03-03 | セイコーエプソン株式会社 | Exposure head control device, exposure head, and image forming apparatus |
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CN101521215B (en) | 2012-03-21 |
TW200937041A (en) | 2009-09-01 |
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