TWI438934B - Method for manufacturing led package - Google Patents

Description

Method for manufacturing light emitting diode package structure

The present invention relates to a semiconductor process, and more particularly to a method of fabricating a light emitting diode package structure.

Many Light Emitting Diode (LED) package structures include a reflective cup structure in which a packaging material is filled. In the manufacturing process of the LED package structure, a step of dispensing is used, and the glue-like encapsulant is dropped into the reflective cup by using a glue needle, and the glue flows slowly to cover the entire reflector cup, and then is cured by heating. Forming a light emitting diode package structure. As shown in Fig. 1, generally, the movement of the glue needle in the dispensing process is controlled by inputting a fixed program in the dispenser, and the moving distance of the needle is often a preset value D1, if the reflective cup on the substrate The distance between the two is inconsistent, which may cause the colloid point to go outside the reflector cup or the dispensing position is too biased, resulting in problems such as overflow or uneven formation of the encapsulation layer, thereby affecting the light uniformity or color rendering of the LED package structure.

In view of the above, it is necessary to provide a method of manufacturing a light emitting diode package structure capable of accurately controlling the position of a dispensing.

A method of manufacturing a light emitting diode package structure, comprising the steps of: Providing a substrate, comprising a plurality of package carriers, each package carrier having two lead frames, the package carrier comprising a first surface, the first surface is formed with a receiving groove, the receiving groove is surrounded by a bottom wall and a side wall Applying a light-emitting diode wafer to the bottom of the accommodating groove and electrically connecting the two lead frames; and detecting the position of the accommodating groove of each package carrier by using an inductor, the sensor a CCD image system; according to the detected position information of the sensor, adding a sealing glue in the receiving groove; curing the sealing glue to form an encapsulation layer; and cutting the substrate to form a plurality of light emitting diodes Body package structure.

In the manufacturing method of the LED package structure, since the position of the accommodating groove of each package carrier is accurately positioned by using an inductor before the package glue is dropped, the movement positioning of the glue needle is more accurate, and the package glue point is avoided. The outside of the groove or the position of the dispensing is too biased to prevent problems such as uneven formation of the glue or the encapsulation layer, thereby improving the light uniformity and color rendering of the LED package structure.

10‧‧‧Substrate

11‧‧‧Package carrier

12‧‧‧ lead frame

13‧‧‧Light Emitter Wafer

14‧‧‧Encapsulation layer

20‧‧‧ sensor

30‧‧‧Glue needle

40‧‧‧Packing glue

100‧‧‧Light emitting diode package structure

111‧‧‧ first surface

112‧‧‧ second surface

113‧‧‧ accommodating slots

114‧‧‧ bottom wall

115‧‧‧ side wall

131‧‧‧Metal wire

Figure 1 is a schematic view of a conventional dispensing technique.

FIG. 2 is a flow chart of a method for manufacturing a light emitting diode package structure according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of a manufacturing method of a light emitting diode package structure according to an embodiment of the present invention.

The invention will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 2 and FIG. 3, a method for fabricating a light emitting diode package structure according to an embodiment of the present invention includes the following steps.

Step S201: providing a substrate 10. The substrate 10 includes a plurality of package carriers 11 each having two lead frames 12 thereon. The package carrier 11 includes opposing first surface 111 and second surface 112. A receiving groove 113 is formed on the first surface 111. The accommodating groove 113 is surrounded by a bottom wall 114 and a side wall 115. The bottom wall 114 and the side wall 115 may be integrally formed or adhered by means of adhesive or the like. In the embodiment, the bottom wall 114 and the side wall 115 are integrally formed. The package carrier 11 can be made of a highly thermally conductive and electrically insulating material which can be selected from the group consisting of graphite, tantalum, ceramic, diamond-like, epoxy or decyloxy resin. One end of each lead frame 12 is exposed on the bottom wall 114 of the accommodating groove 113, and the other end is exposed on the second surface 112 of the package carrier 11. The lead frame 12 may be made of metal or a metal alloy.

Step S202: The LED chip 13 is attached to the bottom wall 114 of the accommodating groove 113 or the lead frame 12. Specifically, the LED chip 13 can be fixed on the bottom wall 114 of the accommodating groove 113 or the lead frame 12 by adhesive. The LED chip 13 is electrically connected to the two lead frames 12 by a metal wire 131. It should be noted that the LED chip 13 can also be electrically connected to the two lead frames 12 by flip-chip or eutectic. Preferably, the sidewall 115 can reflect the light emitted by the LED chip 13 to control the light outgoing direction of the LED chip 13.

Step S203: detecting the receiving slot of each package carrier 11 by using a sensor 20 113 location. Specifically, the sensor 20 can detect the position of the accommodating groove 113 according to the relative position of the LED chip 13 or the position of the sidewall 115 of the accommodating groove 113. In the present embodiment, the sensor 20 detects the position of the accommodating groove 113 according to the relative position of the illuminating diode chip 13, and determines the relative distances L1, L2, and L3 of the respective illuminating diode chips 13. The sensor 20 moves over the substrate 10 to record the position information of the receiving slot 113 of each package carrier 11.

Step S204: The glue needle 40 is dripped in the accommodating groove 113 according to the position information detected by the sensor 20 to cover the LED chip 13 and the bottom wall 114. The sensor 20 can be a CCD image system, a CMOS image system, or the like. The material of the encapsulating glue 40 may be silicone, epoxy or a combination thereof. The encapsulating glue 40 may further comprise a fluorescent conversion material, which may be garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor powder, sulfide-based fluorescent material. Powder, thiogallate-based phosphor and nitride-based phosphor.

Step S205: curing the encapsulation glue 40 to form an encapsulation layer 14, which can protect the LED chip 13 from dust, moisture and the like.

Step S206: cutting the substrate 10 to form a plurality of the LED package structures 100.

In the manufacturing method of the LED package structure provided by the embodiment of the present invention, since the position of the accommodating groove of each package carrier is accurately positioned by using an inductor before the package glue is dropped, the movement positioning of the glue needle is more accurate and avoids The package glue points to the outside of the accommodating groove or the dispensing position is too biased to prevent the glue or the encapsulation layer from forming unevenly. Produced to improve the light uniformity and color rendering of the light-emitting diode package structure.

Claims (8)

A manufacturing method of a light emitting diode package structure, comprising the steps of: providing a substrate, comprising a plurality of package carriers, each package carrier having two lead frames, the package carrier comprising a first surface, and the first surface is formed with a capacity The accommodating groove is surrounded by a bottom wall and a side wall; the illuminating diode chip is attached to the bottom of the accommodating groove and electrically connected to the two lead frames; using a sensor to detect Measure the position of the accommodating groove of each package carrier; according to the detected position information of the sensor, the sensor is a CCD image system, and the package glue is dripped in the accommodating groove; and the package glue is solidified to form Encapsulating the substrate; and cutting the substrate to form a plurality of light emitting diode package structures. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the sensor detects the position of the accommodating groove according to the relative position of the light emitting diode chip. The method for manufacturing a light-emitting diode package structure according to claim 1, wherein the sensor detects the position of the accommodating groove according to the position of the side wall of the accommodating groove. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the material of the sealing glue is silicone, epoxy resin or a combination thereof. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the package glue comprises a fluorescent conversion material. The method for manufacturing a light-emitting diode package structure according to claim 5, wherein the fluorescent conversion material is garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphoric acid. One of a light powder, a sulfide-based phosphor powder, a thiogallate-based phosphor powder, or a nitride-based phosphor powder. The manufacturing method of the light emitting diode package structure of claim 1, wherein the lead frame is located at the bottom of the receiving groove, and the light emitting diode chip is attached to the lead frame. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the light emitting diode chip is electrically connected to the two lead frames by metal wire connection, flip chip or eutectic. .