TWI438377B - Lighting device - Google Patents

Description

Lighting fixture

The present invention relates to a luminaire device, and more particularly to a luminaire device for providing a through hole in a casing for heat dissipation.

In the existing lamp device, the circuit board for setting the light-emitting diode as the light source has poor thermal conductivity, and since the light-emitting diode is enclosed in a chamber, the hot air generated inside is not easily dissipated. It will cause poor heat dissipation, and the housing of the lamp device will block the flow of air, thus reducing the heat dissipation effect of the heat dissipation fins.

The reason is that the present inventors have felt the above-mentioned problems, and have devoted themselves to research and cooperated with the application of the theory, and finally proposed a present invention which is rational in design and effective in improving the above-mentioned defects.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a luminaire device which can dissipate hot air inside thereof.

In order to achieve the above object, the present invention provides a lamp device including a housing, a plurality of heat dissipation fins, a cover body, and a light source module. The housing is formed into a cylindrical shape and has a plate portion, an inner tube portion, an outer tube portion and a connecting portion. The outer tube portion is circumferentially disposed outside the inner tube portion and separated by a distance, and the plate portion covers the inner tube portion and One end of the outer tubular portion, the inner tubular portion and the plate portion together form a chamber, and the connecting portion connects the outer tubular portion and the other end portion of the inner tubular portion to form an opening, an inner tubular portion and an outer tubular portion in the inner tubular portion The plate portion and the connecting portion form a first space.

A heat sink is used to accommodate the housing. The cover body has a cover portion, a first extension portion and a second extension portion, and the first extension portion is circumferentially disposed on the outer side of the second extension portion and separated by a distance, the connection portion is located at the first extension portion and the The cover portion, the first extending portion, the second extending portion, and the connecting portion form a second space between the second extending portions.

The light source module is located in the chamber, and the light source module has a circuit board. a plurality of first through holes are formed in the circuit board, a plurality of second through holes are formed in the connecting portion, a plurality of third through holes are formed in the cover portion, and a plurality of fourth through holes are formed in the inner cylindrical portion to form a portion in the plate portion a plurality of fifth through holes, wherein the positions of the fifth through holes correspond to the first through holes, the second through holes and the fourth through holes are connected to the first space, the fifth through holes and the first through holes The four through holes communicate with the chamber, and the second through holes and the third through holes communicate with the second space.

The present invention has the following beneficial effects: The present invention expands the aperture of the through hole on the circuit board to become a vent hole to increase the escape path of the hot air. The through hole provided in the casing and the enlarged through hole form a pair of flow fields, which contribute to the exchange of hot and cold air in the chamber of the lamp device.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation. Referring to FIG. 1 to FIG. 4 , the lamp device 100 of the present invention mainly includes a cover 10 , a cover 20 , a casing 30 , a light source module 40 , a heat sink 50 , and a rear cover 60 .

The housing 30 is made of a thermally conductive metal material and includes an inner cylindrical portion 32, an outer cylindrical portion 34, a plate portion 36, and a connecting portion 38. The inner tubular portion 32 and the outer tubular portion 34 are substantially hollow cylindrical. The outer cylinder portion 34 is circumferentially disposed outside the inner cylinder portion 32, and the outer cylinder portion 34 and the inner cylinder portion 32 are spaced apart from each other such that the casing 30 is a two-layer structure. The plate portion 36 covers one end portion (upper end portion in the present embodiment) of the inner tubular portion 32 and the outer tubular portion 34 to cover the inner tubular portion 32 and the outer tubular portion 34. The inner tubular portion 32 and the plate portion 36 together form a chamber S.

The connecting portion 38 is substantially annular, and is provided at the other end portion (lower end portion in the present embodiment) of the inner cylindrical portion 32 and the outer cylindrical portion 34 and covers only between the inner cylindrical portion 32 and the outer cylindrical portion 34. An opening 321 is formed in the other end portion of the inner tubular portion 32, so that the inner tubular portion 32, the outer tubular portion 34, the plate portion 36, and the connecting portion 38 form a first space 31. Further, a plurality of flanges 35 having a zigzag shape on the outer edge of the connecting portion 38 project radially outward, and a notch 351 is formed between the flanges 35.

The cover plate 20 is disposed at the opening 321 of the inner cylindrical portion 32, and the cover plate 20 may be a lens or a light-transmitting plate.

The light source module 40 has a plurality of light emitting diodes 42 and a circuit board 44. The light emitting diodes 42 are disposed on the circuit board 44, and the light source module 40 is located in the chamber S, and the circuit board 44 is disposed on the board portion 36. The light of the light-emitting diode 42 is projected to the outside via the cover 20 .

The heat sink 50 is made of a heat conductive metal material, and includes a main body 51 and a plurality of heat dissipation fins 52 disposed on the periphery of the main body 51. The upper and lower ends of the main body 51 are open, and an accommodating space 53 is formed therein to accommodate Housing 30. A plurality of heat dissipation channels 54 are formed between the heat dissipation fins 52 to communicate with the notches 351. The position and the number of the serrated flanges 35 correspond to the heat dissipation fins 52, and the shape of the flanges 35 corresponds to the sectional shape of the heat dissipation fins 52, and the arrangement of the flanges 35 can increase the heat dissipation area. The rear cover 60 is coupled to the heat dissipation fins 52.

The cover 10 covers the housing 30 and has a cover portion 12, a first extension portion 14 and a second extension portion 16. The cover portion 12 has a substantially annular plane, a first extension portion 14 and a second extension portion. The portions 16 are all cylindrical and are connected to one side of the cover portion 12 (upper surface in this embodiment), and the first extending portion 14 is connected from the middle portion of the cover portion 12 and extends to the heat dissipation fin 52, the second extension The portion 16 is connected from the inner side of the cover portion 12 to the connecting portion 38, and the first extending portion 14 is circumferentially disposed outside the second extending portion 16 with a distance therebetween, so that the cover 10 is a two-layer structure. The connecting portion 38 is located between the first extending portion 14 and the second extending portion 16, such that the second surface 17 is formed by the cover portion 12, the first extending portion 14, the second extending portion 16, and the connecting portion 38. The above is a description of the configuration of the lamp device 100 of the present invention, and the following is a description of the structure related to the heat dissipation mechanism of the lamp structure 100 of the present invention.

Since the light is generated when the light emitting diode 42 emits light, the housing 30 is housed in the accommodating space 53 of the heat sink 50 so that heat is dissipated from the heat radiating fin 52, and the circuit board is formed. 44 is provided with a plurality of first through holes 46, a plurality of second through holes 37 are formed in the connecting portion 38, and a plurality of third through holes 18 are formed in the cover portion 12, and the third through holes 18 are interposed between the first extending portions Between the junction of the 14 and the second extension portion 16, a plurality of fourth through holes 39 are formed in the inner cylindrical portion 32, and a plurality of fifth through holes 33 are formed in the plate portion 36. Thereby, the hot air in the chamber S of the lamp device 100 can be dissipated to the outside to increase the heat dissipation effect. The second through hole 37 and the fourth through hole 39 are in communication with the first space 31. The second through hole 37 and the third through hole 18 are in communication with the second space 17 . The fifth through hole 33 and the fourth through hole 39 communicate with the chamber S. The position of the fifth through hole 33 corresponds to the first through hole 46 and the aperture of the fifth through hole 33 is the same as the aperture of the first through hole 46. In addition, the first through hole 46 may also be formed by increasing the aperture of the original via hole on the circuit board 44.

Referring to FIG. 5, the hot air generated by the LEDs 42 may exist in the chamber S, and the external cold air may sequentially pass through the third through holes 18 of the cover portion 12 along the air flow path L1. The second through hole 37 of the connecting portion 38 and the fourth through hole 39 of the inner cylindrical portion 32 enter the chamber S, and are dissipated to the outside via the first through hole 46 and the fifth through hole 33, so that the hot air is dissipated into the chamber S. The cold air entering the chamber S can form a pair of flow cycles, which increases the heat dissipation efficiency of the lamp device 100. In addition, the cold air outside the cold air may enter the second space 17 through the third through hole 18 along the air flow path L2, and is radiated outward from the heat dissipation channel 54 of the notch 351 and the heat dissipation fin 52 to increase the light fixture. The heat dissipation efficiency of the device 100.

In order to achieve good heat dissipation efficiency, the ratio of the diameter of the first through hole 46 in the distribution area of the circuit board 44 to the diameter of the circuit board 44 is preferably 0.3 or more and 0.6 or less. 7 shows the relationship between the diameter of the first through hole 46 and the diameter of the circuit board 44 and the temperature of the light emitting diode 42, wherein the horizontal axis represents the ratio of the diameter of the first through hole 46 to the diameter of the circuit board 44, and the vertical axis represents the light emission. The temperature of the polar body 42 can be seen from FIG. 7. When the ratio of the diameter of the first through hole 46 to the diameter of the circuit board 44 is 0.06, the temperature of the light emitting diode 42 tends to decrease significantly, as can be seen from FIG. In order to make the first through hole 46 effectively exhibit the effect of heat dissipation, the ratio of the diameter of the first through hole 46 to the diameter of the circuit board 44 is preferably 0.05 or more and 0.07 or less.

The second through holes 37 are annularly arranged on the connecting portion 38, and the third through holes 18 are also arranged in a ring shape on the cover portion 12. The fourth through hole 39 is formed on the inner cylindrical portion 32 and arranged in a plurality of upper and lower directions. The fourth through hole 39 has a wall which is inclined and has an inclination angle θ between the extension line and the horizontal plane. The inclination angle θ can be determined. The direction in which the cold air enters the inner tubular portion 32 toward the circuit board 44, and FIG. 8 shows the relationship between the tilt angle θ and the temperature of the light-emitting diode 42, wherein the horizontal axis represents the tilt angle θ and the vertical axis represents the light-emitting diode. The temperature of 42 can be seen from Fig. 8. In order to obtain better heat dissipation efficiency, the above inclination angle θ is preferably in the range of 25 to 45 degrees, and the position of the fourth through hole 39 is preferably the same as the circuit board. The distance of 44 is 1/2 or more of the height of the inner cylindrical portion 32, so that an optimum cooling effect can be achieved when cold air enters the inner cylindrical portion 32. In addition, the cross section of the fourth through hole 39 in the present embodiment is a parallelogram, that is, the wall of the upper and lower ends is parallel to each other, but the cross-sectional shape of the fourth through hole 39 is not limited, and may be a circle, a triangle, or the like. As long as the angle of the hole wall meets the above.

In addition, referring to FIG. 2 and FIG. 4 , a substrate 55 can be further extended inside the accommodating space 53 of the heat sink 50 , and the plate portion 36 of the casing 30 abuts against the substrate 55 . The substrate 55 is provided with a through hole 551 to correspond to the first through hole 46 of the circuit board 44 and the fifth through hole 33 of the plate portion 36.

In addition, in order to increase the heat dissipation efficiency of the heat dissipation fins 52, referring to FIG. 6, the lamp device 100 of the present invention forms a ceramic material layer 56 on the surface of the heat dissipation fins 52. The ceramic material layer 56 forms a porous structure. The contact area with the cold air is increased to exchange heat with the outside air, but the thickness of the ceramic material layer 56 is not too thick, so as not to affect the heat dissipation effect of the heat dissipation fin 52. The thickness of the ceramic material layer 56 and the metal fin are experimentally confirmed. The ratio of the thickness of the sheet 52 is preferably in the range of 0.02 to 0.05 to achieve an optimum heat dissipation effect.

The invention enlarges the aperture of the through hole on the circuit board to become a ventilation hole (ie, the first through hole) to increase the dissipation path of the hot air. A plurality of fourth and fifth through holes are formed in the casing to increase the passage of the airflow and enhance the heat dissipation effect. The fourth through hole, the fifth through hole and the first through hole form a pair of flow fields, which contribute to the exchange of hot and cold air in the chamber of the lamp device. In addition, since the ceramic material layer formed on the surface of the heat dissipation fin has a porous structure, it can increase the heat dissipation area and conduct heat more efficiently to achieve heat exchange with the outside air.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalents of the present invention and the equivalents of the drawings are all included in the present invention. Within the scope of protection, it is given to Chen Ming.

10. . . Cover

12. . . Cover face

14. . . First extension

16. . . Second extension

17. . . Second space

18. . . Third through hole

20. . . Cover

30. . . case

31. . . First space

32. . . Inner tube

321. . . Opening

33. . . Fifth through hole

34. . . Outer tube

35. . . Burst

351. . . gap

36. . . Board

37. . . Second through hole

38. . . Connection

39. . . Fourth through hole

40. . . Light source module

42. . . Light-emitting diode

44. . . Circuit board

46. . . First through hole

50. . . heat sink

51. . . main body

52. . . Heat sink fin

53. . . Housing space

54. . . Cooling channel

55. . . Substrate

551. . . perforation

56. . . Ceramic material layer

60. . . Back cover

100. . . Lighting fixture

S. . . Chamber

L1. . . Air flow path

L2. . . Air flow path

θ. . . slope

1 is a perspective assembled view of a lamp device of the present invention.

Figure 2 is an exploded perspective view of the luminaire device of the present invention.

Figure 3 is another perspective exploded view of the luminaire device of the present invention.

Figure 4 is a cross-sectional view taken along line 4-4 of Figure 1.

Figure 5 is a perspective cross-sectional view of the luminaire device of the present invention.

Figure 6 is a cross-sectional view taken along line 6-6 of Figure 2;

Fig. 7 is a view showing the relationship between the ratio of the diameter of the first through hole and the diameter of the board to the temperature of the light emitting diode in the lamp device of the present invention.

Fig. 8 is a view showing the relationship between the inclination angle of the hole wall of the fourth through hole and the temperature of the light emitting diode in the lamp device of the present invention.

10. . . Cover

12. . . Cover face

14. . . First extension

17. . . Second space

16. . . Second extension

18. . . Third through hole

20. . . Cover

31. . . First space

32. . . Inner tube

33. . . Fifth through hole

34. . . Outer tube

35. . . Burst

351. . . gap

36. . . Board

37. . . Second through hole

38. . . Connection

39. . . Fourth through hole

40. . . Light source module

42. . . Light-emitting diode

44. . . Circuit board

46. . . First through hole

50. . . heat sink

52. . . Heat sink fin

53. . . Housing space

54. . . Cooling channel

55. . . Substrate

551. . . perforation

60. . . Back cover

100. . . Lighting fixture

S. . . Chamber

L1. . . Air flow path

L2. . . Air flow path

Claims (15)

A lamp device comprising: a casing having a plate portion, an inner tubular portion, an outer tubular portion and a connecting portion, the outer tubular portion being circumferentially disposed outside the inner cylindrical portion and separated by a distance, the plate portion Covering the inner tube portion and the one end portion of the outer tube portion, the inner tube portion and the plate portion together form a chamber, and the connection portion is disposed at the outer tube portion and the other end portion of the inner tube portion to The inner tube portion forms an opening, the inner tube portion, the outer tube portion, the plate portion and the connecting portion form a first space; a heat sink for accommodating the housing; a cover body having a cover portion, a first extension portion and a second extension portion are circumferentially disposed on the outer side of the second extension portion and separated by a distance, the connection portion is located between the first extension portion and the second extension portion The cover portion, the first extending portion, the second extending portion and the connecting portion form a second space; and a light source module located in the chamber, the light source module having a circuit board, wherein the circuit Forming a plurality of first through holes on the plate, and forming a plurality of second through holes at the connecting portion, where Forming a plurality of third through holes in the face portion, forming a plurality of fourth through holes in the inner tube portion, and forming a plurality of fifth through holes in the plate portion, the positions of the fifth through holes corresponding to the first through holes The second through hole and the fourth through hole communicate with the first space, the fifth through hole and the fourth through hole communicate with the chamber, and the second through hole and the third through hole communicate with the The second space. The luminaire device of claim 1, wherein a ratio of a diameter of the distribution area of the first through holes on the circuit board to a diameter of the circuit board is 0.3 or more and 0.6 or less. The luminaire device according to claim 1 or 2, wherein a ratio of a diameter of the first through holes to a diameter of the circuit board is 0.05 or more and 0.07 or less. The luminaire device of claim 1, wherein the wall of the fourth through hole is inclined and an inclined angle is formed between the extension line and the horizontal plane. The luminaire device of claim 4, wherein the inclination angle is 25 degrees or more and 45 degrees or less. The luminaire device of claim 4, wherein the distance between the fourth through holes and the circuit board is 1/2 or more of the height of the inner cylindrical portion. The luminaire device of claim 1, wherein the heat sink comprises a main body and a plurality of heat dissipating fins disposed on a periphery of the main body, the inner portion of the main body forming an accommodating space, the housing is received by the housing Accommodate space. The luminaire device of claim 7, wherein the surface of the heat dissipation fin forms a layer of ceramic material. The luminaire device of claim 8, wherein the ceramic material layer forms a porous structure, and a ratio of a thickness of the ceramic material layer to a thickness of the heat dissipation fins is 0.02 or more and 0.05 or less. The luminaire device of claim 7, wherein the connecting portion has a plurality of flanges in a zigzag shape, a plurality of notches are formed between the flanges, and a plurality of heat dissipation channels are formed between the heat dissipation fins. In the gaps. The luminaire device of claim 10, wherein the positions of the flanges correspond to the heat dissipation fins. The luminaire device of claim 7, wherein the accommodating space of the heat sink has a substrate extending therein, the plate portion of the casing abuts the substrate, and the substrate is provided with a through hole to correspond to the first a through hole and the fifth through hole. The luminaire device of claim 1, wherein the cover portion is formed in a ring shape, and the third through holes are arranged in a ring shape; the connecting portion is formed in a ring shape, and the second through holes are arranged in a ring shape. shape. The luminaire device of claim 1, wherein the first extension extends from the cover portion to the heat sink, and the second extension extends from the cover portion to the connecting portion. The luminaire device of claim 1, wherein the light source module further comprises a plurality of light emitting diodes, wherein the light emitting diodes are disposed on the circuit board, and the circuit board is disposed on the board portion.