JP2019003917A - Vehicular headlamp using led element - Google Patents

Abstract

To provide a vehicular headlamp capable of resolving heat confinement in a substrate mounted with an LED element, suppressing increase in thermal contact resistance, and improving heat radiation efficiency.SOLUTION: A vehicular headlamp is a headlamp 10 that is divided into a head internal part arranged inside a light unit, and a head external part arranged outside the light unit, with a mouthpiece 22 constituting an attachment base part as a base point, wherein the head internal part has a light-emitting part. The head lamp uses an LED element 12 as a light source constituting the light-emitting part. The head lamp also comprises a metal substrate 14 on the front and rear surfaces of which the LED element 12 is mounted at corresponding positions, and which is extended from the head internal part to the head external part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a vehicle headlamp, and more particularly to a technique suitable for an exchangeable bulb using an LED element as a light source.

  In recent years, many vehicle headlamps that employ LED elements as light sources have been proposed from the viewpoint of power saving, high brightness, and long life. Heat generation is one of the problems common to various vehicle headlamps using LED elements that have been proposed. This is because the heat generated when the LED element emits light significantly reduces the light emission efficiency and the service life.

  A vehicle headlamp using an LED element disclosed in Patent Document 1 has LED elements mounted on both main surfaces of a substrate made of metal or ceramics. The substrate is configured to be connected to a mounting plane formed on a valve body made of metal or ceramics, and the valve body is configured to penetrate the mounting base. Further, the wiring for supplying power to the substrate is configured to be pulled out through a through hole formed in the valve body along the axial direction.

  According to the vehicle headlamp using the LED element having such a configuration, heat generated from the LED element is transmitted to the valve body through the substrate, and is transferred to the outside of the mounting base by heat conduction of the valve body. Expected to dissipate heat.

  Moreover, the vehicle headlamp using the LED element currently disclosed by patent document 2 has mounted the LED element on the semiconductor substrate, and has fixed this semiconductor substrate to the aluminum plate. The aluminum plate to which the semiconductor substrate is fixed is fixed to a copper heat conduction rod on which an attachment portion is formed, and the heat conduction rod penetrates the attachment base and extends to the outside. Furthermore, an aluminum heat dissipating pedestal having a hollow structure is attached around the heat conducting rod extending outside the attachment base. Further, a heat radiating fan is provided in the hollow portion of the heat radiating base.

  According to the vehicle headlamp using the LED element having such a configuration, the heat generated from the LED element is transmitted to the heat radiating base via the heat conduction rod, and the heat radiation efficiency is improved by the air flow generated by the heat radiating fan. It is expected to improve.

JP, 2014-120388, A Japanese Patent No. 5559386

  All the vehicle headlamps using the LED elements disclosed in the above-mentioned patent documents employ a configuration in which heat is radiated through a member having a large volume and high thermal conductivity. For this reason, compared with the vehicle headlamp using the conventional LED element, it can be anticipated that the heat dissipation effect is enhanced.

  However, the vehicular headlamp using the LED element disclosed in Patent Document 1 has a configuration in which an opening is provided in an attachment portion of the board on which the LED element is mounted to the valve body. The contact area is small, and there is a possibility that heat is easily generated on the substrate.

  Further, in the vehicle headlamp using the LED element disclosed in Patent Document 2, a board on which the LED element is mounted is connected to an aluminum plate, the aluminum plate is disposed on a copper heat conduction rod, and further, A heat dissipating base is attached to the conductive rod so that heat is dissipated. For this reason, there are many heat transfers between different members in the process leading to heat dissipation, the sum of the contact thermal resistance increases, and there is a concern that the heat dissipation efficiency is lowered.

  Therefore, in the present invention, for a vehicle using an LED element that can solve the above-mentioned problems, eliminate the heat burn to the substrate on which the LED element is mounted, suppress the increase in contact thermal resistance, and improve the heat radiation efficiency. The purpose is to provide headlamps.

  In order to achieve the above object, a vehicle headlamp using an LED element according to the present invention is separated from the inside of the head and the outside of the head with a mounting base as a base point, and has a light emitting portion inside the head. A metal substrate that is a headlamp, uses an LED element as a light source that constitutes the light emitting unit, and mounts the LED element at corresponding positions on the front and back sides, and extends from the inside of the head to the outside of the head It is characterized by having.

  In addition, in the vehicle headlamp using the LED element having the above characteristics, a standard value is defined for the outer dimension of the mounting base, and the metal substrate has a width dimension of a portion disposed outside the head. A value larger than the standard value is desirable. By having such a feature, it is possible to effectively diffuse the heat generated due to the light emission of the LED element and promote heat dissipation. In addition, by increasing the size of the metal substrate, it is possible to reduce the influence of heat on the substrate.

  Moreover, in the vehicle headlamp using the LED element having the above characteristics, the metal substrate may be constituted by a single metal plate. With such a feature, it is possible to prevent an increase in contact thermal resistance.

  In addition, in the vehicle headlamp using the LED element having the above characteristics, a heat radiating member that sandwiches at least a partial region of both the head inner side portion and the head outer side portion of the metal substrate is provided. It is good to make it. With such a feature, heat can be transferred from a large metal substrate to a heat radiating member having a large volume, thereby radiating heat. In addition, by adopting a configuration in which the metal substrate is sandwiched both inside the head and outside the head, the area of the contact surface between the metal substrate and the heat dissipation member can be increased, and heat transfer can be effectively performed. Is possible.

  In the vehicle headlamp using the LED element having the above characteristics, the heat dissipation member may cover the entire front and back surfaces of the metal substrate except for the mounting position of the LED element. By having such a feature, heat transfer is performed to the heat radiating member from the entire portion of the front and back surfaces of the metal substrate other than the mounting position of the LED element. Therefore, heat dissipation efficiency can be improved.

  Moreover, in the vehicle headlamp using the LED element having the above characteristics, the heat radiating member may be provided with fins for heat radiating outside the head. By having such a feature, the surface area of the heat radiating member on the outer side of the head can be increased. Thereby, heat dissipation efficiency can be improved.

  Further, in the vehicle headlamp using the LED element having the above characteristics, the heat dissipation member includes a rising surface from the periphery of the mounting position of the LED element in the thickness direction of the metal substrate, and the rising surface is the metal A configuration having an inclination in a direction away from the LED element mounted on the substrate is preferable.

  In a conventional vehicle headlamp using an LED element, a large space is provided around the position where the LED element is mounted in order to prevent light from the LED element and to prevent irregular reflection. For this reason, the heat generated due to the light emission of the LED element is transmitted in a plane along the plate surface of the substrate on which the LED element is mounted. On the other hand, the distance between the LED element mounting position and the heat dissipating member can be reduced by having the above-described features. With such a configuration, the heat generated due to the light emission of the LED element is also transmitted in the thickness direction of the heat dissipation member, and heat dissipation against the substrate can be suppressed and the heat dissipation efficiency can be improved.

  Further, in the vehicle headlamp using the LED element having the above characteristics, the mounting base is provided with a base for assembly, and the base rotates around an axis along the extending direction of the metal substrate. It is preferable to have a detent mechanism that prevents rotation exceeding a predetermined rotation angle.

  In vehicle headlamps with standardized mounting holes for light units, when LED elements are used as the light source, the light emitting surface (part) is different from the halogen bulb that emits light uniformly around the light source. It is necessary to mount at a predetermined angle determined in accordance with the reflector arrangement. For this reason, with respect to the headlamp body on which the LED element is mounted, it is desirable that the base serving as the mounting base is configured to be rotatable around the axis. On the other hand, in a headlamp with a fixed mounting angle, means for restricting the rotation of the base with respect to the headlamp main body is taken, but if this restricting means is canceled for some reason, the headlamp main body On the other hand, there is a possibility that the base will be idle and the headlamp cannot be removed from the light unit. For this reason, it can prevent that it becomes impossible to remove a headlamp resulting from the idle rotation of a nozzle | cap | die by having a rotation prevention mechanism which prevents the rotation exceeding a predetermined rotation angle.

  Furthermore, in the vehicle headlamp using the LED element having the above characteristics, a wiring pattern is formed on the surface of the metal substrate via an insulating layer, and at least one of the parts other than the wiring pattern forming portion is formed. It is preferable that the insulating layer is removed and the metal surface constituting the metal substrate is exposed in the portion. By having such characteristics, the heat transfer coefficient between the metal substrate and the heat dissipation member can be improved.

  According to the vehicle headlamp using the LED element having the above-described characteristics, heat dissipation on the board on which the LED element is mounted is eliminated, and an increase in contact thermal resistance is suppressed, thereby improving heat dissipation efficiency. Can be planned.

It is a plane exploded view showing composition of a vehicular headlamp using an LED element concerning an embodiment. It is a figure which shows the cross-section of the state which assembled | attached the LED element which comprises the vehicle headlamp using the LED element which concerns on embodiment, a metal substrate, a heat radiating member, a nozzle | cap | die, a cap, and an external heat radiating member. It is a figure which shows the side surface structure of the thermal radiation member which comprises the vehicle headlamp using the LED element which concerns on embodiment. It is a perspective view which shows the structure of the nozzle | cap | die which comprises the vehicle headlamp using the LED element which concerns on embodiment. It is a sectional side view of the external heat radiating member which comprises the vehicle headlamp using the LED element which concerns on embodiment. It is a figure which shows the example of the range which removes the insulating layer comprised in the metal substrate which comprises the vehicle headlamp using the LED element which concerns on embodiment. It is a figure which shows the example in the case of widening the width | variety of the mounting side piece of a metal substrate, or providing a constriction in the heat-transfer part of a heat radiating member in comprising the vehicle headlamp using the LED element which concerns on embodiment. .

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments according to a vehicle headlamp using an LED element of the present invention will be described in detail with reference to the drawings. The following embodiments are some of the forms that are considered suitable for carrying out the invention, and the shape and the like of each element are changed as long as the effect based on each element and its combination is achieved. Even so, it can be considered part of the present invention.

  First, a vehicle headlamp using an LED element according to an embodiment having a basic configuration according to the invention will be described with reference to FIGS. 1 to 5. FIG. 1 is an exploded plan view showing a configuration of a vehicle headlamp using the LED element according to the embodiment. Moreover, FIG. 2 shows a cross-sectional structure in a state in which the LED element constituting the vehicle headlamp using the LED element according to the embodiment and the metal substrate, the heat radiating member, the base, the cap, and the external heat radiating member are assembled. FIG. Moreover, FIG. 3 is a figure which shows the side surface structure of the thermal radiation member which comprises the vehicle headlamp using the LED element which concerns on embodiment. FIG. 4 is a perspective view showing a configuration of a base that constitutes a vehicle headlamp using the LED element according to the embodiment. Furthermore, FIG. 5 is a sectional side view of an external heat dissipating member constituting the vehicle headlamp using the LED element according to the embodiment.

[Overall configuration of headlights]
A vehicle headlamp (hereinafter simply referred to as a headlamp 10) using an LED element according to the present embodiment can be attached to or replaced with a light unit (not shown), and a base 22 serving as a mounting base. Is basically separated from the inside of the head arranged inside the light unit and the outside of the head arranged outside the light unit. The headlamp 10 according to the present embodiment having such a basic configuration includes an LED element 12, a metal substrate 14, a heat dissipation member 16, a base 22, an external heat dissipation member 30, and a heat dissipation fan 36. .

[LED element]
The LED element 12 is an element serving as a light source that constitutes a light emitting unit in the headlamp 10. The headlamp 10 according to the present embodiment is mounted in pairs at corresponding positions on the front and back surfaces of the metal substrate 14, which will be described in detail later.

[Metal substrate]
The metal substrate 14 serves as a heat conducting member as well as a substrate for mounting the LED element 12. The metal substrate 14 is made of a metal having high thermal conductivity such as copper, aluminum, or silver, or an alloy mainly composed of these metals. This is because it is possible to efficiently diffuse the heat generated when the LED element 12 emits light and promote heat dissipation.

  The metal substrate 14 according to the embodiment is a large substrate that extends from the inside of the head where the LED element 12 is disposed to the outside of the head that is separated via the mounting base. Furthermore, the metal substrate 14 is configured such that the plate width of the heat radiation side piece 14b that is located outside the head is wider than the mounting side piece 14a that is located inside the head.

  When aiming at heat dissipation and heat transfer, the effect becomes greater when the plate width of the metal substrate 14 is increased. However, since the mounting-side piece 14a is disposed in the light unit, it is necessary to have a width that can be inserted into an attachment hole (not shown) defined by the standard. For this reason, by making the plate width of the heat radiating side piece 14b located outside the mounting hole larger than the plate width of the mounting side piece 14a (more specifically, the standard defined as the external dimension of the mounting hole By making it larger than the value, the efficiency of heat dissipation and heat transfer can be improved while maintaining the form according to the standard.

  The mounting state of the LED element 12 with respect to the metal substrate 14 is such that the mounting terminals (not shown) are arranged so that the LED elements 12 mounted on the front and back are respectively in corresponding positions (for example, line symmetry) with the metal substrate 14 as a base point. Provided. Further, the metal substrate 14 is formed with an LED mounting terminal, a wiring pattern, and an input / output terminal (not shown) via an insulating layer, so that power can be supplied to the LED element 12.

[Heat dissipation member]
The heat radiating member 16 is an element for promoting the heat radiating of the heat transmitted through the metal substrate 14. The heat dissipating member 16 is configured to be sandwiched so as to cover the entire front and back surfaces of the metal substrate 14 excluding the mounting position of the LED element 12. In the present embodiment, the heat radiating member 16 is configured such that the state in which the metal substrate 14 is sandwiched is a columnar shape. More specifically, in the heat transfer portion 16a located on the inner side of the head and the heat radiating portion 16b located on the outer side of the head, the radii of the cylinders are different so as to correspond to the difference in the plate width of the metal substrate 14. It is That is, the heat radiating portion 16b is configured to form a larger-diameter column than the heat transfer portion 16a. In addition, a plurality of slits are provided in the column constituting the heat radiation portion 16b in a direction intersecting with the arrangement direction of the metal substrate 14, and heat radiation fins 16b1 are formed. By configuring the heat radiation fin 16b1, the surface area of the heat radiation portion 16b in the heat radiation member 16 can be increased. This is because the heat dissipation efficiency can be improved.

  Further, in the heat transfer portion 16 a of the heat radiating member 16, a rising surface 18 extending in the thickness direction of the metal substrate 14 is formed around the mounting position of the LED element 12. The rising surface 18 is configured to be inclined in a direction away from the LED element 12. With such a configuration of the rising surface 18, there is no possibility that the light generated by the light emission of the LED element 12 is hindered by the rising surface 18 of the heat radiating member 16 or causes unnecessary reflection. In addition, by producing such an effect, when the rising surface 18 is inclined, the gap between the opening 20 formed in the heat transfer portion 16a and the mounting position of the LED element 12 may be reduced. it can. Thereby, the heat generated due to the light emission of the LED element 12 can be transmitted from the vicinity of the opening 20 in the thickness direction of the heat dissipation member 16. As a result, it is possible to prevent heat from being applied to the metal substrate 14.

  Further, the heat dissipating member 16 according to the embodiment does not require a space for passing wiring or the like between the metal substrate 14 to be sandwiched. For this reason, the contact area between the metal substrate 14 and the heat dissipation member 16 can be increased. In addition, since an air layer is not interposed in a path where heat conduction is performed, high heat conductivity can be maintained. The heat dissipating member 16 is preferably composed of a metal having high thermal conductivity such as copper, aluminum, or silver, an alloy mainly composed of these metals, or other ceramics.

[Base]
The base 22 is an element for fixing the headlamp 10 to the mounting hole provided in the light unit by constituting the mounting base by being assembled to the heat radiating member described above. The base 22 according to the present embodiment is formed in an annular shape that can be inserted through the heat transfer portion 16 a of the heat radiating member 16. The shape around the mounting hole of the light unit is standardized, and a positioning piece 24 that conforms to a predetermined standard is formed on the outer periphery of the base 22 so as to protrude.

  Further, a concave groove 26 is formed on the inner periphery of the base 22, and a convex portion 16 a 1 is formed on the heat radiating member 16 at a position corresponding to the concave groove 26. Here, the convex portion 16a1 is configured to be positioned above the concave groove 26 when the base 22 is pushed into a predetermined position. In the case of such a configuration, when the base 22 is pushed into the heat radiating member 16, the positions of the convex portions 16 a 1 of the heat radiating member 16 and the concave grooves 26 of the base 22 need to be made to correspond to each other. After the base 22 is pushed to a predetermined position, when the base 22 is rotated around the longitudinal axis of the heat dissipating member 16, the convex portion 16 a 1 is positioned above the concave groove 26. 22 is retained.

  Further, the heat radiating member 16 has a concave groove (outer peripheral groove 16a2) on the outer periphery located closer to the heat radiating portion 16b than the convex portion 16a1. The outer peripheral groove 16a2 does not extend around the entire periphery of the heat radiating member 16, but is provided with a non-formed portion 16a3 at least in part. On the other hand, in the base 22, a female screw hole 22 a into which the male screw 28 can be screwed is formed at a position where it will overlap the outer peripheral groove 16 a 2 when pushed into the heat radiating member 16. With such a configuration, by tightening the screw 28 of the pressed base 22, the screw 28 is fitted into the outer peripheral groove 16 a 2 and further tightened so that the screw is fixed to the bottom of the outer peripheral groove 16 a 2. 28 is pressed and serves as a detent. On the other hand, even when the coffin screw 28 is loosened and does not perform the detent function, the coffin screw 28 is caught by the step between the non-formed portion 16a3 and the outer circumferential groove 16a2 where the outer circumferential groove 16a2 is not formed. Rotation is impeded. For this reason, there is no possibility that the headlamp 10 cannot be removed from the light unit even when the screw 28 is loosened.

[External heat dissipation member]
The external heat radiating member 30 is disposed so as to cover the heat radiating fins 16b1 of the heat radiating portion 16b of the heat radiating member 16, and is an element for improving the heat radiating efficiency. The external heat radiating member 30 is preferably composed of a metal having high thermal conductivity such as copper, aluminum, or silver, an alloy mainly composed of these metals, or other ceramics. The external heat radiating member 30 has a hollow portion 34 that covers the heat radiating fins 16b1 of the heat radiating portion 16b in addition to the through hole 32 through which the heat transfer portion 16a of the heat radiating member 16 is inserted. A plurality of slits 34a are formed on the side wall constituting the outer periphery of the cavity 34 in the direction along the longitudinal direction of the heat radiating member 16 at the time of assembly so as to increase the surface area and improve the air permeability. Further, in the external heat radiating member 30 according to the present embodiment, the cavity 34 is extended to the rear of the heat radiating fins 16b1 constituting the heat radiating member 16. This is because a heat dissipating fan 36 whose details will be described later can be installed.

[Heat dissipation fan]
The heat radiating fan 36 is an element that plays a role of creating a flow of air passing between the heat radiating fins 16b1 of the heat radiating member 16 and the slits 34a of the external heat radiating member 30 and improving heat radiating efficiency by heat exchange. The heat radiating fan 36 rotates a fan (not shown) by supplying power. In the case of the present embodiment, the fan rotates from the rear end of the cavity 34 of the external heat radiating member 30 in a direction to send air out of the cavity 34. With such a configuration, air is sucked into the cavity 34 from the slit 34 a formed on the outer periphery of the external heat dissipation member 30 as the heat dissipation fan 36 is operated (rotated). The air sucked into the cavity portion 34 flows along the radiation fins 16b1 of the heat radiation member 16 and is then exhausted to the outside of the cavity portion 34 via the heat radiation fan 36. The air flowing along the slits 34a of the external heat radiating member 30 and the heat radiating fins 16b1 of the heat radiating member 16 exchanges heat with each member and collects radiant heat. By such a heat dissipation action, the metal substrate 14 and the mounting portion of the LED element 12 through the heat dissipation member 16 are cooled.

  In addition, at the rear end of the external heat radiating member 30 constituting the cavity 34 where the heat radiating fan 36 is disposed, a cover 38 provided with an opening for ventilation is disposed to cover the heat radiating fan 36. Safety can be improved. Moreover, it is preferable to provide a cap 40 at the tip of the heat radiating member 16 configured by sandwiching the metal substrate 14 (tip of the heat transfer portion 16a). In addition, the wiring for supplying power to the LED element 12 and the heat radiating fan 36 may be configured to be drawn to the outside of the headlamp 10 via the sealing member 42 disposed on the external heat radiating member 30.

[effect]
According to the headlamp 10 having such a configuration, since the large metal substrate 14 arranged from the inside of the head to the outside of the head is adopted, the heat is efficiently transmitted to the vicinity of the radiation fins 16b1 having high cooling efficiency. Therefore, the heat dissipation efficiency can be improved. Moreover, after covering the whole area except the site | part which mounted the LED element 12 among the front and back of the large sized metal substrate 14 with the heat radiating member 16, and increasing the area in which the heat transfer between members is made, on the heat radiating fin 16b1 By using only one transmission member, the contact thermal resistance can be reduced. For this reason, it is also possible to eliminate the heat burn on the metal substrate 14. Therefore, it becomes possible to constitute the headlamp 10 having higher heat dissipation efficiency than the conventional one.

[Modification]
In the said embodiment, it described that the wiring pattern was formed in the metal substrate 14 via the insulating layer. In the metal substrate 14 having such a configuration, for example, when the wiring pattern 14c is formed as shown in FIG. 6, the formation of the wiring pattern 14c is affected as in the range surrounded by the broken line in FIG. The insulating layer may be removed within a range not to be provided, and the metal surface may be exposed. This is because with such a configuration, the heat transfer rate from the metal substrate 14 to the heat dissipation member 16 is improved, and the heat dissipation efficiency can be improved. Here, the means for removing the insulating layer from the surface of the metal substrate 14 is not particularly limited, and examples thereof include mechanical etching, grinding, sand blasting, scientific etching, and the like.

  Further, as a means for reducing the contact thermal resistance between the metal substrate 14 and the heat radiating member 16, an adhesive member (not shown) having a high thermal conductivity such as a heat conductive double-sided tape is disposed on the surface of the metal substrate 14. Good. This is because an air layer can be prevented from intervening on the contact surface between the metal substrate 14 and the heat radiating member 16 and the heat transfer rate can be improved.

  Moreover, in the said embodiment, it described that the nozzle | cap | die 22 was a specification member which makes the heat-transfer part 16a of the heat radiating member 16 penetrate, and enables attachment of the headlamp 10 with respect to a light unit. For this reason, the base 22 can be exchanged according to the standard of the mounting hole of the light unit to be mounted. This is because the versatility of the headlamp 10 can be improved.

  Moreover, in the said embodiment, it described that the heat radiating member 16 and the external heat radiating member 30 were comprised separately. However, even if the heat radiating member 16 and the external heat radiating member 30 are integrally formed, they can be regarded as a part of the present invention. This is because the same effect as that of the headlamp 10 according to the embodiment can be obtained even in such a configuration.

  Moreover, in the said embodiment, it indicated that the heat radiating member 16 was a member which covers the whole region except the mounting position of the LED element 12 of the metal substrate 14. FIG. However, for example, as shown in FIG. 7, the width of the mounting side piece 14 a in the metal substrate 14 may be increased on the inner side of the head so that the side surface is exposed from the heat radiating member 16. From the viewpoint of design, as shown in FIG. 7, a constriction 16 a 4 or the like may be provided on a part of the heat transfer portion 16 a on the inner side of the head, and the mounting side piece 14 a of the metal substrate 14 may be exposed. This is because if the heat dissipation member 16 is configured to sandwich at least a part of the surface of the metal substrate 14, some of the effects of the present invention can be achieved.

DESCRIPTION OF SYMBOLS 10 ......... Headlight, 12 ......... LED element, 14 ......... Metal substrate, 14a ......... Mounting side piece, 14b ......... Heat radiation side piece, 14c ......... Wiring pattern, 16 ......... Heat radiation Member, 16a ......... Heat transfer portion, 16a1 ......... Convex portion, 16a2 ......... Outer peripheral groove, 16a3 ......... Non-formed portion, 16a4 ......... Narrow, 16b ......... Heat dissipation portion, 16b1 ......... Heat release Fins, 18 ..... Rising surface, 20 ..... Opening, 22 ..... Base, 22a ..... Female screw hole, 24 ..... Positioning piece, 26 ..... Groove, 28 .... 30 ......... External heat dissipation member, 32 ......... Through hole, 34 ......... Cavity, 34a ......... Slit, 36 ......... Heat dissipation fan, 38 ......... Cover, 40 ......... Cap, 42 ... ...... Sealing member.

Claims (9)

A vehicle headlamp that is separated from the inside of the head and the outside of the head with the mounting base as a base, and has a light emitting part inside the head,
Using an LED element as a light source constituting the light emitting unit,
A vehicular headlamp using an LED element, wherein the LED element is mounted at corresponding positions on the front and back sides and has a metal substrate extending from the inside of the head to the outside of the head. A standard value is defined for the outer dimensions of the mounting base,
The vehicle headlamp using an LED element according to claim 1, wherein the metal substrate has a width dimension of a portion disposed outside the head portion larger than the standard value.   The vehicle headlamp using an LED element according to claim 1 or 2, wherein the metal substrate is constituted by a single metal plate.   The heat dissipation member which clamps at least one partial area | region of both the said head inner side site | part and the said head outer side site | part of the said metal substrate was provided. Vehicle headlamps using LED elements.   The vehicular headlamp using an LED element according to claim 4, wherein the heat dissipating member covers the entire front and back surfaces of the metal substrate excluding the mounting position of the LED element.   6. The vehicle headlamp using an LED element according to claim 4, wherein the heat dissipating member includes a fin for heat dissipation on the outside of the head. The heat dissipating member includes a rising surface in the thickness direction of the metal substrate from around the mounting position of the LED element,
The LED element according to any one of claims 4 to 6, wherein the rising surface has an inclination in a direction away from the LED element mounted on the metal substrate. Vehicle headlamp. The mounting base includes a base for assembly,
The said nozzle | cap | die has the rotation prevention mechanism which prevents the rotation exceeding a predetermined rotation angle while enabling the rotation of the said board | substrate along the extending direction of the said metal substrate. Vehicle headlamps using LED elements. A wiring pattern is formed on the surface of the metal substrate via an insulating layer,
The at least one part other than the said wiring pattern formation part removes the said insulating layer, and the metal surface which comprises the said metal substrate is exposed, The any one of Claim 1 thru | or 8 characterized by the above-mentioned. Vehicle headlamps using LED elements.

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