CN105953191A - Heat radiation lamp - Google Patents

Abstract

A heat dissipating luminaire, comprising: heat conduction base plate, LED light source subassembly, radiator and air supply arrangement. The two side surfaces of the heat conducting substrate are respectively provided with a mounting surface and a heat radiating surface. The LED light source assembly includes a plurality of LED sub-light sources. The radiator includes multiunit thermal module, multiunit thermal module is the rectangular array and sets up on the cooling surface, and thermal module includes fin subassembly and many main radiating pipes, and many main radiating pipes are arranged and are set up on the installation face, and main radiating pipe has embedded portion and installation department, and the junction of embedded portion and installation department is provided with the structure of buckling, and embedded portion at least part inlays in heat conduction base plate, and fin subassembly is worn to establish by the installation department, and fin subassembly includes a plurality of fin that set up at interval in proper order. The air supply device comprises an air supply pipe and an air supply assembly. The radiating lamp can meet the radiating requirement for high power, and is good in radiating performance.

Description

Radiator lamps

technical field

The invention relates to the technical field of high-power heat dissipation structures, in particular to a heat dissipation lamp.

Background technique

As we all know, LED light source is a new type of light source that is widely used and developed rapidly. Development and expansion of industry scale and market share, under the guidance of industry trends, its technology is constantly updated and deepened.

However, the biggest technical barrier currently restricting the development of LED light sources is the heat dissipation of LEDs. As a light source device, LED usually needs to work continuously for a long time, and at the same time, it will generate a large amount of heat accumulation, which requires a radiator to dissipate heat.

Although there are some radiators on the market at present, which can solve the heating problem generated by most LEDs, but for lighting fixtures with high-power and high-wattage LEDs, the heat generated by them is extremely large when they are normally illuminated. The heat sink is still difficult to meet the heat dissipation requirements of high power and high heat, and it is difficult to solve the problem of light decay when LEDs emit light.

Contents of the invention

Based on this, it is necessary to provide a heat dissipation lamp with better heat dissipation performance.

A heat dissipation lamp, comprising:

A thermally conductive substrate, the two sides of the thermally conductive substrate are respectively provided with a mounting surface and a heat dissipation surface;

LED light source assembly, the LED light source assembly includes a plurality of LED sub-light sources, and the plurality of LED sub-light sources are installed on the installation surface;

A radiator, the radiator includes multiple groups of heat dissipation modules, and the plurality of groups of the heat dissipation modules are arranged on the heat dissipation surface in a rectangular array, and the heat dissipation modules include a heat sink assembly and a plurality of main heat dissipation pipes, and a plurality of The main heat dissipation pipes are arranged in a row on the installation surface, the main heat dissipation pipes have an embedding portion and an installation portion, and a bending structure is provided at a connection between the embedding portion and the installation portion, and the embedding portion The mounting portion is at least partially embedded in the heat-conducting substrate, the mounting portion passes through the heat sink assembly, and the heat sink assembly includes a plurality of heat sinks arranged at intervals in sequence;

An air supply device, the air supply device includes an air supply pipe and an air supply assembly, the main heat dissipation pipe is a hollow structure with two ends open, the first end of the air supply pipe and the main heat dissipation pipe are located in the embedded One end of the placement part is connected with an opening for supplying air to the main cooling pipe, and the air supply assembly is connected with the second end of the air supply pipe for supplying air to the air supply pipe.

In one embodiment, the air supply assembly includes a housing and a blower, the blower is installed inside the housing, and the second end of the air supply pipe communicates with the housing.

In one of the embodiments, the air blower includes a motor, a fan blade and a power module, the motor is electrically connected to the power module, the fan blade is connected to the rotation shaft of the motor, and the fan blade It communicates with the second end of the air supply pipe.

In one of the embodiments, the fan blade has an arc-shaped structure.

In one of the embodiments, the air supply pipe has a bent structure.

In one of the embodiments, the air supply pipe has a circular cross-section.

In one of the embodiments, at least part of the air supply pipe is arranged parallel to the main heat dissipation pipe.

The radiator of the above-mentioned heat-dissipating lamp is provided with multiple heat-dissipating modules, and each heat-dissipating module passes through the efficient heat-dissipating path of heat-conducting substrate-main heat-dissipating pipe-radiating fin, which can satisfy the heat dissipation of high-power and large-wattage LED light source components. Demand, good heat dissipation performance.

Description of drawings

1 is a schematic structural view of a heat dissipation lamp according to an embodiment of the present invention;

Fig. 2 is a structural schematic diagram of another angle of a heat dissipation lamp according to an embodiment of the present invention;

Fig. 3 is a structural schematic diagram of another angle of a heat dissipation lamp according to an embodiment of the present invention;

Fig. 4 is a partial structural schematic diagram of a heat dissipation lamp according to another embodiment of the present invention;

Fig. 5 is a partial structural schematic diagram of a heat dissipation lamp according to another embodiment of the present invention;

6 is a schematic diagram of a partial structure of a heat dissipation lamp according to another embodiment of the present invention;

Fig. 7 is a partial structural schematic diagram of a heat dissipation lamp according to another embodiment of the present invention;

Fig. 8 is a schematic diagram of a partial structure of a heat dissipation lamp according to another embodiment of the present invention.

detailed description

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the present invention is only for the purpose of describing specific embodiments, and is not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

For example, a heat dissipation lamp includes: a heat conduction substrate, the two sides of the heat conduction substrate are respectively provided with a mounting surface and a heat dissipation surface; an LED light source assembly, the LED light source assembly includes a plurality of LED sub-light sources, and a plurality of the LED sub-light sources Installed on the mounting surface; radiator, the radiator includes multiple groups of heat dissipation modules, and multiple groups of the heat dissipation modules are arranged on the heat dissipation surface in a rectangular array, and the heat dissipation modules include heat sink components and A plurality of main heat dissipation pipes, a plurality of the main heat dissipation pipes are arranged on the installation surface, the main heat dissipation pipes have an embedding part and an installation part, and the connection between the embedding part and the installation part is provided with Bending structure, the embedding part is at least partially embedded in the heat conduction substrate, the installation part passes through the heat sink assembly, and the heat sink assembly includes a plurality of heat sinks arranged at intervals in sequence; the air supply device , the air supply device includes an air supply pipe and an air supply assembly, the main heat dissipation pipe is a hollow structure with openings at both ends, the first end of the air supply pipe and the main heat dissipation pipe are located at the embedding part One end communicates with an opening for supplying air to the main cooling pipe, and the air supply assembly communicates with the second end of the air supply pipe for supplying air to the air supply pipe.

In order to further understand the above heat dissipation lamps, another example is, please refer to FIG. On both sides, the heat generated by the LED light source assembly 200 in normal operation is conducted to the heat sink 300 through the heat conduction substrate 100 , and the heat sink 300 dissipates the heat to the external environment to ensure the normal light emitting function of the LED light source assembly 200 .

Please refer to FIG. 1 and FIG. 2 together. Two sides of the thermally conductive substrate 100 are respectively provided with a mounting surface 110 and a heat dissipation surface 120 . For example, the heat-conducting substrate has a rectangular structure. The heat-conducting substrate 100 is used to quickly and timely absorb the heat generated by the high-power LED light source assembly 200 and disperse it into the overall structure of the heat-conducting substrate 100. The heat-conducting substrate 100 dissipates part of the heat dissipate, and transfer most of the remaining heat to the radiator 300, and the radiator 300 dissipates most of the remaining heat to achieve a better heat dissipation effect.

Please refer to FIG. 1 , the LED light source assembly 200 includes a plurality of LED sub-light sources 210 installed on the installation surface 110 , and the LED sub-light sources 210 are used for lighting effect. For example, the LED light source assembly is a high-power and high-wattage LED light source assembly. For example, the LED sub-light source generates more heat when it emits light normally, and is used for high-intensity or high-brightness in special occasions. lighting effects.

Referring to FIG. 3 , the heat sink 300 includes multiple groups of heat dissipation modules 310, and the plurality of groups of heat dissipation modules 310 are arranged on the heat dissipation surface 120 in a rectangular array. For example, a gap is provided between two adjacent heat dissipation modules, Used for heat dissipation and ventilation. For example, the overall heat dissipation effect of the radiator is reflected by the sum of the heat dissipation effects of multiple heat dissipation modules.

Please refer to FIG. 3 , the heat dissipation module 310 includes a heat sink assembly 311 and a plurality of main heat dissipation pipes 312, and a plurality of main heat dissipation pipes 312 are arranged on the mounting surface 120, and a heat sink assembly 311 and the heat conducting substrate 100 are provided with interval.

Referring to FIG. 3 , the main heat pipe 312 has an embedding portion 312 a and a mounting portion 312 b, and a bending structure is provided at a connection between the embedding portion 312 a and the mounting portion 312 b, and the embedding portion 312 a is at least partially embedded in the heat conducting substrate 100 , The mounting portion 312b passes through the heat sink assembly 311, and the heat sink assembly 311 includes a plurality of heat sinks 311a arranged at intervals in sequence. For example, the heat sink is provided with a through hole, and the installation part is fixedly connected to the inner side wall of the through hole.

The embedding portion 312a of the main heat dissipation pipe 312 is used to quickly and timely absorb the heat on the heat conduction substrate 100 and quickly transfer it to the mounting portion 312b. It should be noted that since the embedding portion 312a is at least Partially embedded in the heat conduction substrate 100 can increase the degree of contact between the main heat dissipation pipe and the heat conduction substrate for improving heat conduction efficiency. When the main heat pipe 312 is dissipating part of the heat transferred from the heat conducting substrate, the mounting portion 312b of the main heat pipe 312 transfers the remaining heat to the heat sink assembly 311 at the same time, and the heat sink assembly 311 dissipates the remaining heat. Heat dissipation operation. In this process, the main heat dissipation pipe 312 plays the most critical role of heat conduction, that is, heat conduction. It can be understood that because the main heat dissipation pipe 312 can play a better heat conduction effect, that is, the heat on the heat conduction substrate 100 quickly and be transferred to the heat sink assembly 311 in time, so that a space can be set between the heat sink assembly 311 and the heat conduction substrate 100, thus avoiding direct contact between the heat conduction substrate 100 and the heat sink assembly 311, and simultaneously Increase the heat dissipation surface area of the heat conduction substrate 100 and the heat dissipation fin assembly 311 to enhance the heat dissipation effect of the heat conduction substrate 100 and the heat dissipation fin assembly 311 at the same time, and at the same time, because the main heat dissipation pipe 312 has a better heat conduction effect , the remaining heat on the heat-conducting substrate 100 can be transferred to the heat sink assembly 311 quickly and in a timely manner, which alleviates the local accumulation of residual heat on the heat-conducting substrate 100, that is, the occurrence of local overheating. In this way, it can greatly Improve the heat dissipation performance of the radiator. In addition, since a plurality of the cooling fins 311a are sequentially arranged at intervals, the heat transferred from the main cooling pipe 312 can be quickly and promptly dissipated to the outside.

The radiator 300 of the above-mentioned heat dissipation lamp 10 is provided with a plurality of heat dissipation modules 310, and each heat dissipation module 310 passes through the efficient heat dissipation path of the heat conduction substrate 100-the main heat dissipation pipe 312-the heat dissipation fin 311a, which can especially meet the requirements for high power and large The heat dissipation requirements of the LED light source assembly 200 of the wattage are better, and the heat dissipation performance is better.

In order to further improve the heat dissipation performance of the heat dissipation lamp, for example, the extending direction of the embedding part is the same as the extending direction of the heat conducting substrate, so as to further improve the contact degree between the embedding part and the heat conducting substrate, as The contact area is used to further improve the heat conduction efficiency, so as to further improve the heat dissipation performance of the heat dissipation lamp.

In order to further improve the heat dissipation performance of the heat dissipation lamp, for example, the distance between two adjacent heat dissipation fins gradually decreases from the direction close to the heat dissipation surface to the direction away from the heat dissipation surface, so that the main For the overall heat distribution of the heat dissipation pipe 312, at the position where the heat of the main heat dissipation pipe 312 gathers more, the heat dissipation fins with higher density are arranged, for example, at the position close to the heat conduction substrate, at the position of the main heat dissipation Where the heat of the tube 312 accumulates less, for example, arranging less intensive heat sinks at a position away from the heat conducting substrate can optimize the heat dissipation path and further improve the heat dissipation performance of the heat dissipation lamp.

In order to improve the uniformity of heat conduction and heat dissipation of the main heat dissipation pipe, and further alleviate the problem of local heat accumulation on the heat conduction substrate, for example, a plurality of main heat dissipation pipes 312 are arranged in a linear arrangement on the installation surface, and as The distance between every two adjacent main heat dissipation pipes is equal, so that the uniformity of heat conduction and heat dissipation of the main heat dissipation pipes can be improved, and the problem of local heat accumulation on the heat conduction substrate can be further alleviated.

In order to further enhance the heat dissipation effect of the heat sink, for improving the overall heat dissipation effect of the heat sink, for example, please refer to FIG. 410, the cooling wire 410 has a spiral structure, the cooling wire 410 is arranged between two adjacent cooling fins 311a, the first end of the cooling wire is connected to one of the cooling fins, The second end of the heat dissipation wire is connected to another heat sink; as another example, a plurality of heat dissipation wires are distributed between two adjacent heat sinks in a rectangular array; The heat dissipation wires are distributed in a circular array between two adjacent heat sinks; as another example, the heat dissipation wires include a heat dissipation mother wire and a plurality of heat dissipation sub-filaments, and the plurality of heat dissipation sub-filaments are wound and arranged on the On the heat dissipation mother wire; as another example, the diameter of the heat dissipation mother wire is larger than the diameter of the heat dissipation sub-wire; as another example, the heat dissipation mother wire and the heat dissipation sub-wire have the same or different materials; as another example, The heat dissipation wire has an Archimedes spiral structure; as another example, the heat dissipation wire has an involute structure, so that the heat dissipation effect of the heat dissipation fin can be further enhanced by utilizing the heat conduction and heat dissipation effect of the heat dissipation wire, It is used to improve the overall heat dissipation effect of the radiator.

In order to further enhance the heat dissipation effect of the heat sink, for improving the overall heat dissipation effect of the radiator, for example, please refer to FIG. And the air supply assembly (not shown in the figure), the main heat dissipation pipe 312 is a hollow structure with openings at both ends, the first end of the air supply pipe 510 and the main heat dissipation pipe are located at one end opening of the embedded part 312a communicated to supply air to the main cooling pipe, and the air supply assembly communicates with the second end of the air supply pipe for supplying air to the air supply pipe; as another example, the air supply assembly includes a shell Body and air blower, the air blower is installed inside the housing, the second end of the air supply pipe communicates with the housing; as another example, the air blower includes a motor, fan blades and a power module, the motor The fan blade is electrically connected to the power supply module, the fan blade is connected to the rotation shaft of the motor, and the fan blade communicates with the second end of the air supply pipe; as another example, the fan blade has an arc shape Structure; as another example, the air supply pipe has a bent structure; as another example, the air supply pipe has a circular cross-section; as another example, at least part of the air supply pipe is parallel to the main heat dissipation pipe In this way, using the air blowing effect of the air blowing device 500, the circulation of air can be enhanced, and the heat dissipation effect of the heat sink can be further enhanced, so as to improve the overall heat dissipation effect of the radiator.

In order to further improve the convenience of the installation operation of the heat conduction substrate and the heat sink, that is, the installation and disassembly operations are simpler and more convenient. For example, please refer to FIG. The fixed plate 130 is attached to the installed plate 140, the mounting surface is located on the side of the installed plate away from the fixed plate, and the main heat dissipation pipe is located on the fixed plate away from the side of the fixed plate. The side of the mounting plate body, the embedding portion is at least partially embedded in the fixing plate body, the fixing plate body 130 is provided with a sliding groove 131 facing the side of the mounting plate body, and the mounting plate body 140 is facing the side of the mounting plate body. A slide rail 141 is provided on the side of the fixed plate body, and the slide rail is slidably embedded in the slide groove; the slide rail has a cross-section of a "T" shape structure; for another example, the slide groove has a "T" "The cross-section of the font structure; as another example, the thickness of the fixed plate body and the installation plate body are the same or differently arranged; as another example, the fixed plate body is provided with a plurality of the chute, and the installation plate body A plurality of slide rails are provided, and the plurality of slide rails are slidably embedded in one of the slide grooves one by one; for another example, a plurality of the slide rails are arranged in parallel; for another example, a plurality of the slide grooves Arranged in parallel; as another example, the material of the fixed plate body is the same as or different from that of the mounting plate body, so that through the cooperation of the slide rail and the chute, the heat conduction substrate and the heat conduction substrate can be further improved. The convenience of the installation operation of the radiator, that is, the installation and removal operations are simpler and more convenient.

In order to further improve the air circulation between the plurality of heat sinks, and to improve the overall heat dissipation performance of the heat dissipation lamps, for example, please refer to FIG. Arranged perpendicularly to the installation part, the heat dissipation fin 311a is provided with a plurality of heat dissipation holes 311b, and the heat dissipation holes 311b on two adjacent heat dissipation fins 311a are arranged in a misalignment; as another example, the heat dissipation fin has a rectangular sheet Shaped structure; as another example, the heat dissipation hole has a polygonal cross section; as another example, the heat dissipation hole has a hexagonal cross section; as another example, the distance between two adjacent heat sinks is determined by the The heat dissipation surface gradually decreases in the direction away from the heat dissipation surface; as another example, a plurality of the heat dissipation holes are distributed on the heat dissipation sheet in a rectangular array; as another example, a plurality of the heat dissipation holes are distributed in a circular array on the heat dissipation sheet In another example, the edge of the heat dissipation hole has a circular arc structure, so that the heat dissipation hole arranged in a misplaced position can improve the degree of air circulation between the plurality of heat dissipation fins, and is used to improve the heat dissipation of the heat dissipation lamp. overall thermal performance.

In order to better fix the heat sink on the main heat pipe more firmly, for example, please refer to FIG. 8 , the heat dissipation lamp also includes a limiting assembly 600, and the limiting assembly 600 includes a plurality of limiting rings 610. The limiting ring 610 is arranged between two adjacent heat sinks 311a, and the limiting ring is placed in the main heat dissipation pipe, and the first end of the limiting ring is connected to one of the heat sinks. The heat sink is connected, and the second end of the limiting ring is connected to another heat sink; as another example, the connection between the heat sink and the limiting ring is provided with an annular accommodating groove, and the limiting ring The end of the positioning ring is embedded in the accommodating groove; as another example, the embedding place between the limiting ring and the accommodating groove is coated with thermally conductive glue; as another example, the thermally conductive glue is thermally conductive silica gel; As another example, the inner diameter of the limiting ring is the same as the outer diameter of the main heat dissipation pipe; as another example, the outer diameter of the limiting ring gradually increases from its middle position to its end position; as another example, The outer surface of the limiting ring is provided with a striped structure, so that the supporting effect of the limiting ring on two adjacent heat sinks can better make the heat sink more firmly fixed on the above the main radiator.

It can be understood that in the heat dissipation path of the heat conduction substrate-main heat dissipation pipe-radiation fin, it has the highest requirement for the heat conduction performance of the heat conduction substrate, since the main heat dissipation pipe is connected with the heat conduction substrate, therefore, the main heat dissipation pipe The heat dissipation pipe must also have better heat conduction performance. As for the heat sink, as the last link of the overall heat dissipation path, it should have better heat dissipation performance.

For example, the thermally conductive substrate includes the following components in parts by mass:

90-92 parts of copper, 2-4.5 parts of aluminum, 1-2.5 parts of magnesium, 0.5-0.8 parts of nickel, 0.1-0.3 parts of iron, 1.5-4.5 parts of vanadium, 0.1-0.4 parts of manganese, titanium 0.5-0.8 parts, 0.5-0.8 parts of chromium, 0.5-0.8 parts of magnesium, 0.8-15 parts of silicon and 0.5-2 parts of graphene.

Using the following components by mass can make the thermally conductive substrate have good thermal conductivity, so that heat can be quickly and timely transferred to the heat dissipation plate body, the thermally conductive medium and the radiator.

For example, the main cooling pipe includes the following components in parts by mass:

95-98 parts of copper, 55-60 parts of aluminum, 10-15 parts of silver, 0.8-1.2 parts of magnesium, 0.2-0.5 parts of manganese, 0.05-0.3 parts of titanium, 0.05-0.1 parts of chromium, vanadium 0.05-0.3 parts, 0.3-0.5 parts of silicon and 0.1-0.3 parts of graphene.

Since at least part of the main heat pipe is housed inside the heat sink, considering the need to quickly and timely transfer heat to the heat sink, the thermal conductivity can be significantly improved by adding 10-15 parts of silver .

For example, the heat sink includes the following components in parts by mass:

88-93 parts of aluminum, 5.5-10.5 parts of silicon, 0.3-0.7 parts of magnesium, 0.05-0.3 parts of copper, 0.2-0.8 parts of iron, 0.2-0.5 parts of manganese, 0.05-0.3 parts of titanium, chromium 0.05 to 0.1 parts, 0.05 to 0.3 parts of vanadium and 5 to 15 parts of graphene.

The heat sink using the above components by mass can dissipate or dissipate the heat transferred from the heat-conducting substrate to the outside quickly and in a timely manner.

In this way, the heat conduction substrate, the main heat dissipation pipe and the heat dissipation fin body respectively adopting the above components by mass can form a heat conduction gradient and optimize heat conduction and heat dissipation paths.

It should be noted that other embodiments of the present invention also include implementable heat dissipation lamps formed by combining the technical features of the above-mentioned embodiments.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (7)

1. A cooling lamp, characterized in that it comprises: A thermally conductive substrate, the two sides of the thermally conductive substrate are respectively provided with a mounting surface and a heat dissipation surface; LED light source assembly, the LED light source assembly includes a plurality of LED sub-light sources, and the plurality of LED sub-light sources are installed on the installation surface; A radiator, the radiator includes multiple groups of heat dissipation modules, and the plurality of groups of the heat dissipation modules are arranged on the heat dissipation surface in a rectangular array, and the heat dissipation modules include a heat sink assembly and a plurality of main heat dissipation pipes, and a plurality of The main heat dissipation pipes are arranged in a row on the installation surface, the main heat dissipation pipes have an embedding portion and an installation portion, and a bending structure is provided at a connection between the embedding portion and the installation portion, and the embedding portion The mounting portion is at least partially embedded in the heat-conducting substrate, the mounting portion passes through the heat sink assembly, and the heat sink assembly includes a plurality of heat sinks arranged at intervals in sequence; An air supply device, the air supply device includes an air supply pipe and an air supply assembly, the main heat dissipation pipe is a hollow structure with two ends open, the first end of the air supply pipe and the main heat dissipation pipe are located in the embedded One end of the placement part is connected with an opening for supplying air to the main cooling pipe, and the air supply assembly is connected with the second end of the air supply pipe for supplying air to the air supply pipe. 2. The heat dissipation lamp according to claim 1, wherein the air supply assembly comprises a casing and a blower, the blower is installed inside the casing, and the second end of the air supply pipe is connected to the Shell connected. 3. The heat dissipation lamp according to claim 2, wherein the air blower includes a motor, a fan blade and a power module, the motor is electrically connected to the power module, and the fan blade is connected to the motor The rotation shaft is connected, and the fan blade communicates with the second end of the air supply pipe. 4. The heat dissipation lamp according to claim 3, wherein the fan blade has an arc-shaped structure. 5. The heat dissipation lamp according to claim 1, wherein the air supply pipe has a bent structure. 6 . The heat dissipation lamp according to claim 1 , wherein the air supply pipe has a circular cross-section. 7 . 7. The heat dissipation lamp according to claim 1, wherein at least part of the air supply pipe is arranged parallel to the main heat dissipation pipe.