TWI437952B - Cooling system - Google Patents

Description

cooling system

The present invention relates to a cooling system, and more particularly to a portable electronic device and a cooling system thereof.

With the rapid development of information technology and the popularity of the computer industry, portable electronic devices, such as notebook computers, tablet computers, and other sophisticated electronic instruments have been widely used. Due to the rapid advancement of electronic products, under the consideration of improving the portability and practicality, the volume of portable electronic devices currently on the market is moving toward the light, thin, short and small design requirements and directions.

However, with the improvement of the integrated circuit (Integrated Circuits) process, and the increasing requirements for the functions and specifications of the integrated circuits, the IC elements have been continuously increased. Taking a central processing unit (CPU) as an example, since the circuit layout of the IC chip in the CPU is very delicate and complicated, it is required to consume a large amount of electric energy, thereby causing an increase in the temperature of the iC chip to generate heat. If these accumulated heat cannot be discharged immediately, the electronic components inside the notebook will not work properly, or even the entire computer system will be down. Therefore, in order to improve the heat dissipation efficiency of the notebook computer, it is necessary to use a high wattage cooling fan to dissipate heat. However, in order to make the cooling fan generate a larger amount of airflow and the required fin area, a problem of noise is derived. In addition to this, scattered The number of electromagnetic poles, the number of revolutions and the number of blades of the hot fan interact with each other, which also causes noise problems in the cooling fan.

Fig. 1 is a schematic view showing the flow of airflow during the heat dissipation operation of the heat sink of the conventional notebook computer. As shown in the figure, the conventional heat sink 1 includes a heat collecting device 110, a heat pipe 120, a fan 130, and a heat sink 140. The two ends of the heat pipe 120 are respectively connected to the heat collecting device 110 and the heat sink 140, and The heat pipe 120 is disposed through the heat sink 140 , and the fan 130 is disposed on one side of the heat sink 140 and between the heat collecting device 110 and the heat sink 140 . When the conventional heat sink 1 is in operation, the heat generated by the CPU (not shown) is collected by the heat collecting device 110, and is conducted to the heat sink 140 via the heat pipe 120, and the heat concentrated on the heat sink 140 by the fan 130. The discrete thermal sheet 140 is blown, meaning that the heat is taken away from the inside of the notebook.

Referring to FIG. 1 again, when the fan 130 is operated, the airflow in the fan 130 will flow in the vertical direction of the fan blade and the bearing line (ie, flowing in the y direction) due to the driving of the fan blade, and when When the airflow exits the air outlet of the fan 130 and contacts the heat sink 140, the airflow flows along the airflow path formed between the plurality of heat sinks 140 (as indicated by arrow 150). The direction of the air flow inside the conventional heat sink 1 varies depending on the relative positions of the fins 140 and the fan blades 130a of the fan 130. Taking FIG. 1 as an example, the angle between the direction in which the air flows and the fins 140 are increased. When the time is large (for example, angles A, B, and C, and the angle is from small to large, the angle is A, B, C), the flow rate of airflow that can be discharged along the heat sink 140 is smaller (where the length of the arrow 150 represents The flow rate of the air flow is easy to form a vortex between the fins 140, so that the noise generated by the fins 140 is more serious. Therefore, the conventional heat dissipating device 1 has a heat dissipation performance that cannot be improved and a noise is easily generated during operation.

Therefore, how to develop a portable electronic device that can improve the above-mentioned conventional technology The cooling system is a subject that is urgently needed for research and development.

The purpose of the present invention is to provide a cooling system for a portable electronic device, which mainly uses a fluid conduit, a pump and a heat dissipation module to form a closed cooling circulation loop, so that the fluid can flow in the closed cooling circulation loop for heat dissipation. , to achieve improved heat dissipation, and to solve the lack of noise caused by the use of fans.

In order to achieve the above object, a broader aspect of the present invention provides a cooling system for a portable electronic device having a first housing and a second housing, the cooling system including at least a fluid conduit having a fluid inside and disposed inside the first housing and the second housing; the heat dissipation module disposed on the inner side of the first housing and communicating with the fluid conduit and configured to receive thermal energy of the heating element; And a pump disposed in the inner side of the first housing to communicate with the fluid conduit and configured to drive the fluid flow; wherein the fluid conduit, the heat dissipation module, and the pump form a closed cooling circulation loop by the fluid in the closed cooling cycle Flow in the loop for heat dissipation.

In order to achieve the above object, another broad aspect of the present invention provides a portable electronic device including at least: a first housing; a second housing; a heating element; and a cooling system including: a fluid conduit, the interior thereof Having a fluid and disposed inside the first housing and the second housing; the heat dissipation module is disposed on the inner side of the first housing and communicates with the fluid conduit, and is configured to receive thermal energy of the heating element; and the pump is disposed on the pump The inner side of the first housing is in communication with the fluid conduit and is configured to drive the fluid flow; wherein the fluid conduit, the heat dissipation module and the pump form a closed cooling circulation loop, and the fluid flows through the closed cooling circulation loop for heat dissipation .

1‧‧‧heating device

110‧‧‧Heating device

120‧‧‧heat pipe

130‧‧‧fan

130a‧‧‧fan blades

140‧‧‧ Heat sink

150‧‧‧ arrow

A, B, C‧‧‧ angle

Y‧‧‧ direction

2‧‧‧Portable electronic devices

21‧‧‧ first housing

22‧‧‧ second housing

23‧‧‧heating components

3‧‧‧Cooling system

31‧‧‧ Fluid conduit

32‧‧‧ Thermal Module

321‧‧‧ frame trough

322‧‧‧heat conduction device

3221‧‧‧ board

3222‧‧‧ Thermally conductive parts

3223‧‧‧ first surface

3224‧‧‧ second surface

3225‧‧‧ flow path

323‧‧‧ accommodating space

324‧‧‧ entrance

325‧‧‧Export

33‧‧‧ pump

34‧‧‧Closed cooling circuit

Fig. 1 is a schematic view showing the flow of airflow during the heat dissipation operation of the heat sink of the conventional notebook computer.

Figure 2 is a schematic view showing the structure of the cooling system of the preferred embodiment of the present invention.

Fig. 3 is a schematic exploded view of the heat dissipation module shown in Fig. 2.

Fig. 4A is a schematic view showing the structure of the heat conducting device shown in Fig. 3.

Fig. 4B is a top plan view showing the heat conducting device of another embodiment shown in Fig. 3.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and drawings are intended to be illustrative and not limiting.

Figure 2 is a schematic view showing the structure of the cooling system of the preferred embodiment of the present invention. As shown in the figure, the cooling system 3 of the present invention is applicable to a portable electronic device 2, such as but not limited to a notebook computer, and the portable electronic device 2 includes a first housing 21, a second housing 22, and a heating element. 23 and the cooling system 3, wherein the first housing 21 and the second housing 22 are upper and lower opposite housings and respectively include a metal housing. In the present embodiment, the cooling system 3 includes a fluid conduit 31, a heat dissipation module 32, and a pump 33. The fluid conduit 31 has a fluid (not shown) flowing inside the fluid conduit 31 and is disposed in the first shell. The inside of the body 21 and the second casing 22. The fluid conduit 31 is a metal conduit, and the fluid conduit 31 is in contact with or integrally formed with the metal housings of the first housing 21 and the second housing 22. The heat dissipation module 32 and the pump 33 are disposed on the inner side of the first housing 21, wherein the heat dissipation module 32 is configured to receive the heat energy of the heat generating component 23 (for example, the central processing unit), and the heat dissipation module 32 can be directly connected to the heat generating component 23. Contact setting, pump 33 is used to drive the flow Body flow. In the present embodiment, the fluid conduit 31, the heat dissipation module 32 and the pump 33 are connected to each other and connected to form a closed cooling circulation circuit 34, and the pump 33 drives the fluid to flow in the closed cooling circulation circuit 34. The heat generated by the heat generating element 23 is dissipated by heat exchange.

In some embodiments, the flow system within the fluid conduit 31 is a cooling fluid, such as pure water or a mixture of pure water and ethylene glycol. In other embodiments, the flow system has a relatively high dielectric constant and properties such as insulation, such as Perfluor Ocarbons (PFCs) or Perfluorpolyethers (PFPFs), but not Limited. As a result, if the fluid is inadvertently leaked out of the closed cooling circuit 34, the fluid has an insulating property, so that the internal circuit of the portable electronic device 2 is not short-circuited and cannot operate.

In the present embodiment, the pump 33 is a power source that drives the fluid in the fluid conduit 31 such that the fluid flows in the closed cooling circuit 34, wherein the pump 33 can be, but not limited to, a piezoelectric pump. . In some embodiments, the external structure of the pump 33, such as a valve body seat or a valve body cover (not shown), may be made of metal, but not limited thereto, whereby the fluid passes through the pump 33. In the process, heat exchange can be performed at the same time, and the fluid can be directly dissipated.

Fig. 3 is a schematic exploded view of the heat dissipation module shown in Fig. 2. As shown in the figure, the heat dissipation module 32 mainly includes a frame body 321 and a heat conducting device 322, and is assembled into a heat dissipation module 32 from the frame body 321 and the heat conducting device 322 from top to bottom. When the assembly is completed, the interior of the frame body 321 defines an accommodating space 323 for accommodating the fluid and accommodating the heat conducting device 322 therein. In addition, the frame body 321 further has an inlet 324 and an outlet 325, and is in communication with the fluid conduit 31, respectively, and the inlet 324 is disposed relative to the outlet 325. The heat conducting device 322 includes a plate body 3221 and a plurality of heat conducting members 3222. The plate body 3221 has a first surface 3223 and a second surface 3224, and the first surface 3223 and the second surface 3224 are oppositely disposed, and the second surface 3224 is in contact with the heat generating component 23 (as shown in FIG. 2). In this embodiment, when the pump 33 is introduced into the accommodating space 323 of the heat dissipation module 32 via the inlet 324, the fluid passes through the heat transfer device 322 and then flows out of the heat dissipation module 32 via the outlet 325. The second surface 3224 of the 32 can be disposed in direct contact with the heat generating component 23, such as the central processing unit, and dissipate heat, thereby improving the heat dissipation performance of the heat generating component 23.

Fig. 4A is a schematic view showing the structure of the heat conducting device shown in Fig. 3. As shown, the first surface 3223 of the plate 3221 of the heat conducting device 322 is provided with a plurality of heat conducting members 3222 for conducting heat. In this embodiment, the heat conducting component 3222 can be, but is not limited to, a micro-cylinder structure, and each of the heat conducting components 3222 are staggered with each other to define a plurality of flow channels 3225, thereby allowing fluid to be in multiple streams. The track 3225 is flowed and is in contact with a plurality of adjacent thermally conductive members 3222 during the flow. In some embodiments, the heat conducting component 3222 is made of a metal material, but not limited thereto, so that the fluid can transfer thermal energy to the heat conducting component 3222 during the process of contacting the heat conducting component 3222 to dissipate heat.

Of course, the heat conducting component 3222 of the heat conducting device 322 of the heat dissipation module 32 is not limited to a micro-cylinder structure, and may be an upright fin structure. Please refer to FIG. 4B , which is a schematic top view of the heat conducting device of another embodiment shown in FIG. 3 . As shown in FIG. 4B, in the embodiment, the plurality of heat conducting members 3222 of the heat conducting device 322 can be an upright fin structure, and each of the heat conducting members 3222 are arranged in parallel with each other to define a plurality of flow paths 3225. Since the operation mode and principle of the heat conducting device 322 are similar to those of the foregoing embodiment, details are not described herein again.

Please refer to Fig. 2 and Fig. 3 again. When the cooling system 3 is actuated, the pump 33 will drive the flow. The fluid in the body conduit 31 allows the fluid to flow out of the pump 33 and enter the heat dissipation module 32 via the inlet 324. At this time, the fluid flows into the accommodating space 323 in the frame body 321 and passes through and directly contacts the heat conducting component of the heat conducting device 322. 3222, and the thermal energy produced by the heating element 23 can be conducted to the first surface 3223 via the second surface 3224 of the heat conducting device 322, and then conducted by the first surface 3223 to the plurality of thermally conductive members 3222, such that when the fluid passes through the plurality When the plurality of channels 3225 are in contact with the plurality of heat conducting members 3222, the heat energy on the heat conducting members 3222 can be taken away to achieve the effect of dissipating heat to the heat generating elements 23. The subsequent fluid flows out of the outlet 325 and enters the fluid conduit 31, and then enters the pump again. Pu 33 to complete the cooling heat cycle.

In summary, the cooling system of the portable electronic device of the present invention is connected to each other by a fluid conduit, a heat dissipation module and a pump to form a closed cooling circulation loop, and the pump is used as a power source for driving the fluid. The fluid is allowed to flow in the closed cooling circuit, wherein the fluid conduit is disposed inside the first casing and the second casing of the portable electronic device to improve the heat dissipation performance of the fluid conduit, and the heat dissipation module is It is directly in contact with the heating element. When the fluid passes through the heat dissipation module, the heat energy generated by the heating element can be dissipated by heat exchange. The cooling system of the portable electronic device of the present invention can improve the heat dissipation performance by a closed cooling loop circuit, and does not need to use a fan as the conventional heat sink to achieve the purpose of heat dissipation, and can better solve the problem that the fan of the conventional heat sink device is easy to generate noise. Missing.

This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

<A1Ex><A1Ex><A1Ex><A1Ex><A1Ex>

2‧‧‧Portable electronic devices

21‧‧‧ first housing

22‧‧‧ second housing

23‧‧‧heating components

3‧‧‧Cooling system

31‧‧‧ Fluid conduit

32‧‧‧ Thermal Module

33‧‧‧ pump

34‧‧‧Closed cooling circuit

Claims (10)

A cooling system is applied to a portable electronic device having a casing and a heating element. The cooling system includes at least: a fluid conduit disposed on the casing, and the conduit capacity a fluid flow is provided; a heat dissipation module is disposed in the housing and communicates with the fluid conduit, the heat dissipation module includes a frame body having an inlet and an outlet, and forming a cavity between the outlet and the inlet a space, and a heat conducting device disposed in the receiving space of the frame body, and the heat conducting device comprises a plate body having a first surface and a second surface, and a plurality of heat conducting members disposed on the plate The first surface of the body is configured to conduct heat, and the plurality of heat conducting members form a plurality of flow paths for the fluid to flow in the plurality of flow channels; and a pump is disposed on one side of the housing and The fluid conduit is in communication for driving the fluid flow; wherein the fluid conduit, the heat dissipation module and the pump form a closed cooling circulation loop, and the fluid flows in the closed cooling circulation loop Cooling. The cooling system of claim 1, wherein the housing comprises a first housing and a second housing. The cooling system of claim 2, wherein the first housing and the second housing are respectively made of a metal material. The cooling system of claim 2, wherein the heat dissipation module is disposed on a side of the first housing. The cooling system of claim 1, wherein the fluid conduit is a metal conduit and the fluid conduit is in contact with the housing. The cooling system of claim 1, wherein the fluid conduit is a metal conduit, and the fluid conduit is integrally formed with the housing. The cooling system of claim 1, wherein the plurality of thermally conductive members are a plurality of micro-cylinders, and the thermally conductive members are staggered with each other to form the plurality of flow paths. The cooling system of claim 1, wherein the plurality of thermally conductive members are a plurality of upright fins, and the thermally conductive members are arranged in parallel with each other to form the plurality of flow channels. The cooling system of claim 1, wherein the heat conducting members are made of a metal material. The cooling system of claim 1, wherein the second surface of the plate is in contact with the heating element of the electronic device.