TWI436029B - Three dimensional surface profilometer and microscopy, and the method using the same - Google Patents

Description

Optical intensity type three-dimensional surface topography and microscopic measuring device and method

The invention relates to an optical intensity type three-dimensional surface topography and microscopic measuring device and method, in particular to an image using an angle biasing and optical imaging technology to extract an image by a light sensing array element, and a two-dimensional image thereof A technique for measuring the size of an area and converting it into a height value by changing its light intensity (reflectance variable) into a three-dimensional image.

According to the current measurement of surface roughness, since the early surface precision requirements are not so rigorous, most of them adopt a visual method. However, recent advances in science and technology have made the requirements for surface precision higher and higher. In order to speed up the online inspection speed and simplify the complexity of the instrument, the light intensity method is a better choice. Because of the simple structure and principle, whether it is an optical system. It's easy to set up, adjust and correct. In general, measurement can be divided into two types of contact and non-contact, and contact measurement is like a traditional stylus probe instrument. In order to obtain a more accurate measurement value, it is generally calculated after several measurements at different positions on the object to be tested, and then the average value is calculated, but this takes a considerable amount of time, and for soft materials, there is fear Scratch the surface of the surface. Therefore, the present invention proposes that the non-contact measurement method can perform the measurement operation in a short time, and does not damage the surface on the object to be tested, thereby affecting the accuracy.

Since more and more people have proposed a three-dimensional surface measurement method, in 2002, Chengping Zhang et al. [such as Reference 6] proposed a microscopic image displacement profiler of a digital micromirror device technology. The mirror device is combined with its illumination optics to form a three-dimensional stereo microscope, which is mainly used to calculate the resulting sinusoidal light intensity distribution stripe pattern through the microscope and then onto the surface of the object to be measured. Due to the shape of the surface of the object, the stripe is changed and then recorded by a Charge-Coupled Device (CCD), and then the phase-displacement technique is used to reconstruct the microscopic three-dimensional shape of the surface of the object. The experimental results have successfully demonstrated that the surface profile of this technique for measuring rough surfaces is on the order of microns.

In 2001, Cz. Lukianowicz et al. [Reference 7] proposed a non-contact reflective measurement method to measure the roughness, and measure it by moving or rotating, and then by CCD. Roughness or topography can be obtained by taking the relative light intensity versus pixel change, but this method is only presented in a one-dimensional method.

In 2010, in industrial applications, based on the rapid and accurate measurement of surface topography, distance and thickness, Antonin Miks et al. [Reference 1] proposed non-contact optical measurement like confocal theory. The sensor is based on the dependence of the longitudinal chromatic aberration wavelength of the optical system, mainly encoding the distance or thickness of the measured sample into spectral information. This method is a non-contact measurement of the thickness of the parallel plate. Since the transparent sample may have problems such as material dispersion and distortion, the measurement error is to measure the change of the CCD light intensity, and then perform numerical analysis to correct the object to be tested. Thickness and distance.

In the same year, Yajun Wang et al. [J. 2] proposed a phase-free expansion method to measure the three-dimensional surface profile by the adjusted Fourier transform method. The main structure is to project the projector on the object to be tested. The true phase value can be obtained by taking the CCD to extract the intensity of the unexpanded phase and combining the phase shift range from the color information.

In 2006, Oleg V. Angelsky et al. [see Reference 3] also used optically non-contact techniques to measure rough uneven surfaces. The main architecture was to use (Michelson's interferometer) to generate optical path differences, and then use CCD to capture interference. Graphics, and then reconstruct a large surface contour map.

In 2005, Madhuri Thakur et al. [Reference 4] used Talbot interferometry to measure transparent analytes. The main structure is to use collimated laser light to penetrate a grating, produce a periodic pattern, then penetrate the object to be tested, and finally interfere with each other through a grating, that is, to generate Talbot interferometric fringes. Then the CCD is used to capture the interference fringes, and the final experimental results are also compared with the measurement results of the probes.

In 2005, Jeong Seok Oh et al. [Reference 5] proposed a Femtosecond laser pulses surface profilometer, and discussed two methods to use femtosecond pulsed lasers to enhance interference and enhance the source. Precision surface profile measurement. The first type is an ultra-fast laser pulse repeating low, time-continuous scanning interference. Originally, this interferometry is not suitable for white light, but improved white light can be effectively used in this interferometry; the second is femtosecond pulse laser The high spatial coherence, with a relatively small reference plane, allows for greater optical testing in an asymmetric configuration. These two advantages were verified by Fizeau and Twyman-Green scanning interference experiments.

In view of the currently known surface topography measurement technology, there is no such a fast, stable and low-cost measuring device that can benefit the industry. In order to help sophisticated industrial measurement to obtain the desired wide-area surface topography and cost reduction more efficiently and efficiently, in view of the advantages of laser speed and stability in optical measurement, and the current papers on this technology and Patents are rare. The inventor has actively invested in research, and under the program subsidy of the National Science Council, through continuous experimentation and research and development, the results of the invention are finally produced. In order to obtain research and development results and efforts to obtain legal protection of rights and interests, it is a legal application for patents.

The main object of the present invention is to provide an optical intensity type three-dimensional surface topography and microscopic measuring device, which is a microscopic method combined with a critical angular intensity method and a CCD light intensity image capturing as a defect measurement. Device. This technology can rapidly increase the speed of the precision measurement industry and other related industries. In operation, since many operational inconveniences can be simplified, the learning operation can be quickly familiar, and since the present invention is a non-contact measurement, it does not cause measurement loss during measurement. And avoid unnecessary time and waste of money.

The technical means for achieving the foregoing object is to provide a light source, a beam expander, a polarizing plate, a second lens, a polarizing beam splitter, a second objective lens, a rotating platform, a quarter wave plate, a third lens, and an angle sensing. And matrix light sensors. A light beam is emitted by the light source; the light beam is expanded into a parallel beam by the beam expander; the parallel light beam is P-polarized light through the polarizing plate; the P-polarized light beam passes through the second lens and the polarizing beam splitter and then passes through the quarter The wave plate becomes circularly polarized and projected onto a test object through the second objective lens; the second objective lens supplies the reflected light from the object to be tested through the returning polarizing beam splitter to enlarge the surface topography of the object to be tested; The three lenses are used for the reflected light returning from the polarizing beam splitter; the angle sensor is used as a small angle sensing near the critical angle; and the light intensity of the reflected light of the object to be tested is captured by the matrix light sensor The change is transmitted to a computer for processing, and the size of the area is measured by the captured 2D image, and converted into a height value by the intensity change (or reflectance variable) to form a three-dimensional image.

one. Technical idea of the invention

The main idea of the present invention is to take advantage of the advantages of optical rapid measurement, as well as simplifying the structure, simplifying the operation, and simplifying the operation. The invention combines the method of measuring the light intensity with the critical angle and the CCD image capturing technology, and instantly converts the light intensity reflected back to the CCD by the object to be tested, and quickly converts into a 3D shape. From the 3D image, we can immediately know us. The desired defect on the surface of the object to be tested and the change in roughness. Moreover, the structure of the present invention also has a microscopic effect, and has the advantages of high sensitivity, high resolution, and the like in measurement.

Since it is necessary to rotate the crucible in the vicinity of the total reflection and the critical angle, and it is hoped that the two planes obtained can completely overlap, the reflectance distribution map of the surface to be tested can be truly calculated, and the error in the mechanism may be due to a long time. The motion causes errors in the measurement, so there must also be an automatic correction function.

two. Technical principle of the invention 1. The relationship between the incident external angle and the reflectivity of the parallelogram

The architecture of the present invention mainly uses S-polarized light as the reflectance change inside the parallelogram, and the S-polarized light can obtain a relatively linear curve after two reflections in the parallelogram, and then take it. The average value of the slope is applied by the present inventors because of the relative relationship between the slope and the reflectance of the parallelogram 稜鏡 and the external incident angle θ of the parallelogram 稜鏡. The inventors first studied how to obtain the reflectance and the relationship between the reflectance and the external incident angle θ of the parallelogram 稜鏡. According to the imaging system, the ABCD matrix is mainly used as the pursuit of the change of the light trajectory, such as the off-axis height and the tilt angle of the light, and finally combined with the reflectance of the present invention to further change the surface height. The image taken by the CCD is used as a basis for obtaining a three-dimensional surface height change. Therefore, in the imaging system, the present invention derives the relationship between the height change of the surface of the object to be tested and the incident angle of the parallelogram, and further determines the relationship between the reflectivity of the parallelogram and the surface of the object to be tested. From this, it is known that as long as the change in reflectance is known, the surface height of the object to be tested can be known. In order to measure the reflectance, it is necessary to take into account the variation of the light intensity. Therefore, it is necessary to take care of the CCD image. Therefore, repetitive image capture is necessary. Finally, the average light intensity is taken as the surface height. in accordance with. The technology of the present invention has the function of a microscope, not only can clearly see the surface contour of the object to be tested, but also can obtain a three-dimensional surface change, so the structure of the invention not only has the effect of measuring 3D, but also can be used as a surface inspection. Such as roughness, surface topography or defects.

As shown in Fig. 1, the reflected light is reflected twice inside the parallelogram 稜鏡200. From the boundary conditions and the Snell's law, the relationship between the reflectance of the two reflections and the external angle θ can be obtained, as shown by the equations (1) and (1-1) and (1-2):

From equation (1), we can use the MATLAB software (MATLAB is the abbreviation of MATRIX LABoratory, which is a commercial mathematics software produced by MathWorks, USA) to simulate the results shown in Figure 2. However, in order to better prove the correctness of the equation of this curve, the reflectance curve of the parallelogram is actually measured by Fig. 3 and compared. Therefore, we can see from Fig. 3 that the maximum slope is about 5.608 degrees, which is the critical angle θ _C (where the angle refers to the outer angle θ), and the change in reflectance of the nearby angle is the most sensitive. Since the architecture of the present invention uses the S-polarity as the reflectivity of the main parallelogram, the measurement can have a larger height measurement range than the P-polarization, because the linear range is larger and can have a larger The incident external angle θ.

2. The relationship between imaging system and reflectivity

The imaging system in the architecture of the present invention is mainly composed of a second objective lens 17 and a third lens (Lens3) 18, and finally formed on a charge coupled device CCD (Charge-Coupled Device). on. So we can according to the ABCD matrix, as shown in equation (2), and finally we can get the angle shown in equation (3) The relationship between the change relationship and the distance from the optical axis x ₃ , x _s shown in equation (4):

From equation (3), the angle of incidence when incident on Parallelogram Prism can be determined. However, in this architecture, the angle variation caused by Polarizing Beamsplitter (PBS) must be considered. Therefore, equation (3) also needs to be multiplied by a negative sign, that is, The amount of change in angle that is truly incident on the parallelogram. From equation (4) we can determine the magnification we want. Figure 5 shows the geometry of the surface height. We will find the equation (5) from the approximate method and substituting equation (3) to obtain the angle-to-height variation of equation (6).

Equation (7) is the slope relationship between the incident angle and the reflectivity of the parallelogram ,, so we can get the equation (9) by substituting equation (8) and then reduce it to equation (11) by equation (10). The relationship between the reflectivity shown and the change in surface height:

Δ h =Δ R _{s 2} ‧ M (11)

3. System architecture:

From the previous introduction, we can use the simple architecture and geometric principle to measure the amount of surface height change we want. The experimental architecture used in the present invention will be briefly introduced at first, as shown in FIG. In terms of software, Matlab software is mainly used to calculate the surface height variation and roughness of the object to be tested, and finally displays a three-dimensional figure. The advantage of 3D graphics is that we can quickly see the surface changes or defects of the object under test, and the architecture can be used for a wide range of measurements in real time, avoiding the waiting time.

3.1 Introduction to optical components and instruments

As shown in FIG. 6, the system architecture of a specific embodiment of the present invention includes: a light source 10 for emitting a light beam, which can be a single wavelength (wavelength of 632.8 nm) system light source, or a laser light source, DETAILED DESCRIPTION OF THE INVENTION The invention is a laser source; a light blocker (Isolator) 11 for passing a light beam from a light source to prevent the reflected light of the system from returning to the light source, thereby causing damage to the light source; Beam Expander 12 Receiving a light beam from the light blocker 11 for expanding the light beam into a parallel light beam. In one embodiment of the present invention, the beam expander 12 includes a first objective lens 120, a first lens 121, and a first objective lens 120. The pinhole 122 is disposed between the first lens 121 and the first lens 121. The first objective lens 120 is configured to expand the beam after passing the beam through the pin hole 122, and a spatial filter (not shown) is disposed on the focal length for filtering. In addition to the stray light source; the first lens 121 is used to make the enlarged beam into a parallel beam; the Polarizer 13 has an angle adjustment function for changing the direction of the light polarization of the beam from the beam expander 12; a second lens (Lens) 14 for The light beam from the polarizing plate 13 expands and focuses the light spot; a Polarizing Beamsplitter (PBS) 15 for the light beam from the second lens 14 to pass through and project onto the object to be tested 30; An objective lens 17 is interposed between the polarizing beam splitter 15 and the object to be tested 30. The light beam from the polarizing beam splitter 15 passes through and is projected on the surface of the object to be tested 30, and is supplied from the object to be tested 30. The reflected light passes through the returning polarizing beam splitter 15 to amplify the surface topography of the object to be tested 30; a quarter wave plate ( Wave plate 16 is interposed between the polarizing beam splitter 15 and the second objective lens 17. The light beam from the polarizing beam splitter 15 passes through the wave plate 16 and becomes a circularly polarized light; the third lens 18 is used for The reflected light returned by the polarizing beam splitter 15 passes through; a Rotation Stage 19, which is an angle-changeable platform; an angle sensor 20, which is disposed on the rotating platform 19 and rotated by the rotating platform 19. The angle sensor 20 causes the reflected light incident angle sensor 20 from the third lens 18 to be reflected multiple times, and controls the reflected light to be slightly angled near the critical angle. In a specific embodiment of the present invention, The angle sensor 20 is a coated Parallelogram Prism, and the number of reflections is twice; and the matrix photo sensor 21 is used for capturing and extracting the light intensity of the reflected light of the object to be tested. The change is transmitted to a computer 22 for processing to calculate the surface topography of the object to be tested 30. In one embodiment of the present invention, the matrix photosensor 21 is a Charge-Coupled Device (CCD).

3.2 Measurement results

The experimental framework of the present invention is shown in FIG. 6. The He-Ne Laser is used as the light source 10, and passes through a light blocker (Isolator) 11 to prevent the reflected light of the optical system from returning to the inside of the laser. The Beam Expander 12 is expanded into a parallel beam, and then becomes P-polarized light through the polarizing plate 13 (P(0°)), and is tight after the beam penetrates the second lens 14 and the polarizing beam splitter (PBS) 15. Then, after the quarter wave plate 16 becomes a circularly polarized pole, the sample of the object to be tested 30 to be measured (the present invention is mainly composed of a grating and a λ/20 standard sheet) is irradiated by the light beam, and then passes through the second objective lens 17, The polarization beam splitter 15, the third lens 18, and the angle sensor 20 are imaged on the matrix photosensor 21. The matrix photosensor 21 (ie, the charge coupled device (CCD)) is directly connected to the computer 22 by a universal serial bus connection (USB), and finally the image taken by the CCD can be displayed by the software on the computer 22. Mainly different from the total reflection (0 °) and the critical angle (5.608 °) when shooting a gray scale light intensity change map, respectively I _o2 and I _o1 , and then use Matlab software for analysis, its The intensity map of the captured light is obtained by R _s2 =I _o1 /I _o2 to obtain the reflectance after the secondary reflection, and then the height is changed by the equation (11), and finally the three-dimensional contour map is drawn. However, the angle sensor 20 (ie, Parallelogram Prism) is a Rotation Stage 19 that is used to control the angle sensor 20 to rotate back and forth between the total reflection angle and the critical angle. First, the λ / 20 standard is used as the systematic error measurement, and the surface roughness value measured by the experimental framework of the present invention is subtracted from the roughness value (as a reference value) measured by the atomic force microscope to estimate the experiment of the present invention. After systematic errors exist in the architecture, the system errors are corrected by using equations (12) and (13).

3.2.1 Measurement results of non-penetrating test objects (λ/20 standard)

First, the matrix light sensor 21 is a charge-coupled device (CCD) for the total reflection and the gray-scale pattern of the light intensity change taken near the critical angle to obtain I _{o 1} and I _{o 2} . The reflectance R _{s 2 is} derived to determine the height change. Figure 7 is a three-dimensional graph of a λ/20 standard sheet.

3.2.2 Measurement results of penetrating test objects (Grating grating)

Please refer to FIGS. 6, 8, and 9, and similarly use the matrix photosensor 21 (ie, Charge-Coupled Device (CCD)) to take its angle sensor 20 (ie, parallelogram ribs). After the mirror (Parallelogram Prism) is turned to the total reflection angle and the vicinity of the critical angle, a gray-scale pattern of light intensity changes is taken by the CCD to obtain I _{o 1} and I _{o 2} , and the reflectance R _{s 2} can be derived. The height change is obtained, as shown in Fig. 8 as a three-dimensional pattern of a 20 lines/mm grating, and Fig. 9 is a graph of the y-axis measured at a distance of 150 μm in Fig. 8. Before shooting, it is necessary to adjust the surface of the object to be tested 30 to the focal plane of the second objective lens 17 and make the CCD image clear. The best adjustment method is to adjust the angle before the critical angle, because the reflectance changes near the critical angle. Sensitive, so you can clearly get a higher contrast change.

3.2.2 Systematic error correction

The system error correction of the present invention is discussed in the λ / 20 standard sheet, and the roughness measured by atomic force microscopy (AFM) is used as a standard basis, and then the M value measured closer to AFM is obtained. Since the roughness measured by the architecture of the present invention is a times the roughness measured by the AFM, we have the M value of the structure of the present invention being (12), and the a (b) of the formula (12) is as the formula (13) As shown, this a value is the corrected magnification. Finally, when using MATLAB to find the roughness, as long as the original m value of the architecture is ( m / a ), after the corrected systematic error, the S _a (Average Roughness) and S _q (Root Mean Square) measured by the architecture of the present invention. ) [8] will be the same as S _a and S _q measured by AFM.

Hey. in conclusion

The technical scope of the present invention is optical reflective, non-destructive, large-area, and quick-test surface contour and roughness measurement. If the magnification of the objective lens is increased, the efficiency of a three-dimensional microscope can be obtained. Three-dimensional images can be directly obtained without scanning or faulting or image stacking. More importantly, the architecture developed by the present invention can be used for large-area measurement, thereby not only saving time and cost, but also destroying the surface of the object to be tested, whether it is non-transmissive or penetrating. The measurement object can be measured as long as there is sufficient reflected light intensity. The invention belongs to an optical intensity type three-dimensional surface topography and microscopic measuring device. The invention can be used as a measurement of defects, defects, surface analysis or roughness. The invention can be used as a film thickness measurement. The invention can be used as a surface measurement for transparent and non-transparent materials. The invention belongs to a three-dimensional electronic image composed of a two-dimensional image of an optical system (such as a microscope) plus surface height information. The present invention is a measuring device that converts light intensity or reflectance into surface height. The present invention is a method of using a matrix type photo sensor (for example, a charge coupled device CCD, or a complementary metal-oxide-semiconductor (CMOS)) to extract an image of a test object, which is glazed at each point. Intensity is used as a measure of the height of the surface. The present invention is a device comprising a change in the angle of reflected light caused by a change in surface height. The invention is a device comprising a change in reflectance or light intensity caused by the deflection of the angle of the light. The reflectance range is from 0 to 1.0, the angle range is from ±0 to 10 degrees, the surface height measurement range is from 0.1 nm to 1 mm, the longitudinal resolution is from 0.1 nm to 100 μm, and the lateral resolution is from 0.1 μm to 100 μm; the magnification can be The angle sensor used in the present invention is a conversion of reflectance or light intensity to incident angle change, and may be a germanium or a coated component. The light source used in the present invention is a single wavelength light source or Use a laser.

The above is only one of the possible embodiments of the present invention, and is not intended to limit the scope of the patents of the present invention, and the equivalent implementations of other changes according to the contents, features and spirits of the following claims are It should be included in the scope of the patent of the present invention. In addition to the above advantages, the invention has deep industrial applicability, can effectively improve the lack of use, and is specifically defined in the characteristics of the request item, is not found in the same kind of articles, so it is practical and progressive, and has been in line with the new type. For patents, the application shall be filed in accordance with the law. The Bureau shall be required to approve the patent in accordance with the law to protect the lawful rights and interests of the applicant.

10. . . light source

11. . . Light blocker

12. . . Beam expander

120. . . First objective

121. . . First lens

122. . . Pin hole

13. . . Polar plate

14. . . Second lens

15. . . Polar spectroscope

16. . . Quarter wave plate

17. . . Second objective

18. . . Third lens

19. . . Rotating platform

20. . . Angle sensor

200. . . Parallelogram

twenty one. . . Matrix light sensor

twenty two. . . computer

30. . . Analyte

1 is a schematic diagram showing two reflections of light in a parallelogram crucible according to the present invention; FIG. 2 is a simulation diagram of a change in reflectance of two S-polarized reflections according to the present invention; FIG. 3 is a reflectance of a parallelogram of the present invention. FIG. 4 is a schematic diagram of an imaging system of the architecture of the present invention; FIG. 5 is a schematic diagram of geometric heights of the object to be tested according to the present invention;

Figure 6 is an experimental structural diagram of the present invention;

Figure 7 is a 3D diagram of the λ/20 standard sheet of the present invention (including systematic errors);

Figure 8 is a 3D diagram (including system error) of the 20 lines/mm grating of the present invention;

Figure 9 is a graph (including systematic error) for taking the y-axis of Figure 8 at a distance of 150 μm for the present invention.

Attachment: References.

10. . . light source

11. . . Light blocker

12. . . Beam expander

120. . . First objective

121. . . First lens

122. . . Pin hole

13. . . Polar plate

14. . . Second lens

15. . . Polar spectroscope

16. . . Quarter wave plate

17. . . Second objective

18. . . Third lens

19. . . Rotating platform

20. . . Angle sensor

twenty one. . . Matrix light sensor

twenty two. . . computer

30. . . Analyte

Claims (10)

An optical intensity type three-dimensional surface topography and microscopic measuring device, comprising: a light source for emitting a light beam; and a beam expander receiving the light beam for expanding the light beam into a parallel light beam; a plate having an angle adjustment function for changing a direction of a light deflecting pole of the parallel beam; a second lens for expanding and focusing a light beam from the polarizing plate; a polarizing beam splitter, The light beam from the second lens passes through and is projected onto a sample to be tested; a second objective lens is interposed between the polarized beam splitter and the object to be tested, and is supplied from the polarizing beam splitter. The light beam passes through and is projected on the surface of the object to be tested, and the reflected light from the object to be tested is traversed back to the polarizing beam splitter to amplify the surface topography of the object to be tested; a rotating platform, which is a changeable angle a platform that is reciprocally rotatable between total reflection and a critical angle; a quarter-wave plate interposed between the polarizing beam splitter and the second objective lens, the light beam from the polarizing beam splitter passing through Wave plate, will become a circular aurora; a third lens, with The reflected light returned from the polarizing beam splitter passes; an angle sensor disposed on the rotating platform for receiving the reflected light from the third lens and allowing the reflected light to be reflected multiple times For microscopic angle sensing near total reflection and critical angle; a matrix light sensor for capturing and capturing light intensity changes from the angle sensor, for total reflection And a light intensity change near each of the critical angles a gray scale graphic; and a computer for receiving the two gray scale pattern, and measuring an area size of the object to be tested by the two gray scale pattern, and then performing a reflectance distribution analysis on the second gray scale pattern to obtain The reflectance after the second reflection is converted into a height value by the reflectance variable, thereby forming a three-dimensional image of the object to be tested. The optical intensity type three-dimensional surface topography and microscopic measuring device according to claim 1, wherein the light source is a single wavelength light source having a wavelength of 632.8 nm. The optical intensity type three-dimensional surface topography and microscopic measuring device according to claim 1, wherein the light source is a laser light source. The optical intensity type three-dimensional surface topography and microscopic measuring device according to claim 1, wherein a light blocker is disposed between the light source and the beam expander, and the light blocker passes the light beam from the light source. To avoid the reflected light from the system return to the source. The optical intensity type three-dimensional surface topography and microscopic measuring device according to claim 1, wherein the angle sensor is a parallelogram, and the reflected light has two reflection times at the angle sensor. Times. The optical intensity type three-dimensional surface topography and microscopic measuring device according to claim 1, wherein the matrix type photo sensor is a Charge-Coupled Device (CCD). An optical intensity type three-dimensional surface topography and microscopic measurement method, comprising: providing the apparatus according to claim 1; emitting a light beam by a light source; the light beam is expanded into a parallel light beam by the beam expander; the parallel light beam Passing the polarizing plate into P-polarized light; the P-polarized light beam passes through the second lens and the polarizing beam splitter and then passes through the The quarter wave plate becomes a circularly polarized pole and is projected onto the object to be tested through the second objective lens; the second objective lens passes the reflected light from the object to be tested to return to the polarizing beam splitter to enlarge the a surface topography of the object to be tested; the reflected light returned by the third lens from the polarizing beam splitter passes; the angle sensor is used as a micro angle sensing near the total reflection and the critical angle; and the matrix is used a light sensor that takes a grayscale pattern of light intensity changes near the total reflection and the critical angle and transmits it to the computer for processing. The computer can measure the area by the two-dimensional two-gray pattern captured. Dimensions, the computer then analyzes the reflectance distribution of the two-gray scale image to obtain the reflectance after the secondary reflection, and converts it into a height value by its intensity change (or reflectance variable) to form a three-dimensional shape. Image. The optical intensity type three-dimensional surface topography and microscopic measurement method according to claim 7, wherein the matrix type photo sensor captures the image of the object to be tested, and the light intensity at each point is measured. Surface height information. The optical intensity type three-dimensional surface topography and microscopic measurement method according to claim 7, wherein a light blocker is disposed between the light source and the beam expander, and the light blocker passes the light beam from the light source. To avoid the reflected light from the system return to the source. The optical intensity type three-dimensional surface topography and microscopic measurement method according to claim 7, wherein the angle sensor is a coated parallelogram 稜鏡, and the reflected light is reflected by the angle sensor. For two times.