TWI467227B - Three-dimensional microscope device and method using the same - Google Patents

Three-dimensional microscope device and method using the same Download PDF

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TWI467227B
TWI467227B TW101113060A TW101113060A TWI467227B TW I467227 B TWI467227 B TW I467227B TW 101113060 A TW101113060 A TW 101113060A TW 101113060 A TW101113060 A TW 101113060A TW I467227 B TWI467227 B TW I467227B
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objective lens
angle
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TW201341845A (en
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Ming Hung Chiu
Jen Tai Tan
Ming Hung Tsai
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Univ Nat Formosa
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穿透式三維顯微裝置及方法Penetrating three-dimensional microscopic device and method

本發明係有關於一種涉及於檢測生技材料、生物的顯微鏡技術領域,尤指利用光強度變化與反射率變化的關係,結合臨界角與CCD擷取影像技術,來測量可透光物體的表面或內部形貌結構。The invention relates to the field of microscopy technology related to detecting biotechnology materials and organisms, in particular, the relationship between light intensity variation and reflectance change, combined with critical angle and CCD capture image technology to measure the surface of a light transmissive object. Or internal topography.

目前觀察物體的形貌量測,大多偏向於顯微系統方面的量測,例如:生醫量測、半導體工業等,極力追求奈米等級之微觀世界,透過顯微鏡看到肉眼無法分辨的微細生物,自從1950年簡生父子(Hans Janssen and his son Zacharias Janssen),他們嘗試把數個鏡片安置在一筒子上,發現透過鏡片所見到的物件被放大。他們發明了世界上最原始的望遠鏡及顯微鏡,於是開啟了顯微鏡的歷史。光學顯微技術的種類,可分為二維結構量測及三維結構量測。二維結構量測可分為三類,全反射螢光顯微鏡(TIRFM:Total Internal Reflection Fluorescence Microscope)(參考文獻[1][2][3])、是利用全反射產生的衰逝波激發樣品,使樣品表面數百奈米厚的薄層內的螢光團受到激發,此技術已被生物學家應用於單分子的螢光成像中。TIRFM可分為兩種,一種是利用光透過稜鏡進行全反射(在物鏡的另一方向導入激發雷射,雷射進入稜鏡於觀察物體所進入之水溶液和波片之間產生全反射);另外一種是利用高NA值物鏡進行全反射(物鏡式之系統雷射光源是由物鏡邊緣導入,產生全反射並製造內全反射螢光激發的效果)。而顏毅廣(參考文獻[4])將全反射螢光顯微技術應用於蛋白質分子即時偵測與操控,乃是藉著整合全反射螢光顯微術與微機電製程技術,進行蛋白質在物性環境改變時,利用全反射光場以漸逝波激發螢光,使全反射螢光顯微術具有離玻璃基材150至700 nm尺寸等級以內的觀測功能,並且其影像的訊號背景比遠高於其他的顯微技術;而在橫向尺寸的功能也藉著量測1μm的螢光粒子得到了驗證。At present, the measurement of the shape of the observed objects is mostly biased toward the measurement of the microscopic system, such as: biomedical measurement, semiconductor industry, etc., and strives to pursue the microscopic world of the nanometer level, and sees the microscopic organisms that are indistinguishable to the naked eye through the microscope. Since Hans Janssen and his son Zacharias Janssen in 1950, they have tried to place several lenses on a bobbin and found that the objects seen through the lenses were magnified. They invented the world's most primitive telescopes and microscopes, and opened the history of the microscope. The types of optical microscopy technology can be divided into two-dimensional structure measurement and three-dimensional structure measurement. Two-dimensional structure measurement can be divided into three types, Total Internal Reflection Fluorescence Microscope (TIRFM) (Reference [1] [2] [3]), which is an evanescent wave generated by total reflection. The fluorophore in a thin layer of hundreds of nanometers thick on the surface of the sample is excited. This technique has been applied by biologists to single-molecule fluorescence imaging. TIRFM can be divided into two types. One is to use the light to transmit total reflection (in the other direction of the objective lens, the excitation laser is introduced, and the laser enters the aqueous solution and the wave plate between the observation object to generate total reflection) The other is to use a high-NA objective lens for total reflection (the objective-type system laser source is introduced by the edge of the objective lens to produce total reflection and to produce internal total reflection fluorescence excitation). Yan Yiguang (Ref. [4]) applied total reflection fluorescence microscopy technology to the immediate detection and manipulation of protein molecules by integrating total reflection fluorescence microscopy and microelectromechanical process technology to carry out protein in physical environment. When changing, the total reflection light field is used to excite the fluorescence with an evanescent wave, so that the total reflection fluorescence microscopy has an observation function within a size range of 150 to 700 nm from the glass substrate, and the signal background ratio of the image is much higher than Other microscopic techniques; and the lateral size function was also verified by measuring 1 μm of fluorescent particles.

近場掃描光學顯微鏡(NSOM:Near Field Scanning Mircoscope)(參考文獻[5][6][7][8])其基本原理是在1928年英國的Synge和1956年美國的O’ Keefe分別提出,利用於近場中(小於波長的距離內)進行光學量測,是要避免在遠場中(大於一個波長距離後)被光波動性干擾。而莊家璁(參考文獻[9])另外也有利用掃描式近場光學顯微鏡對不同樣品做非破壞性檢測分析。利用紫外光雷射或綠光雷射耦合入光纖,使用掃描式近場光學顯微鏡觀察圖樣化藍寶石基板上成長之氮化鎵薄膜的缺陷。成功運用掃描式近場光學顯微鏡及自製光纖探針配合不同光源跟光偵測器開發出可適用檢測不同能隙材料在不同種類晶片中生長情形之非破壞性近場量測。The Near Field Scanning Mircoscope (NSOM: Near Field Scanning Mircoscope) (Ref. [5][6][7][8]) is based on Synge in the United Kingdom in 1928 and O' Keefe in the United States in 1956. Optical measurements are made in the near field (within a distance less than the wavelength) to avoid interference with light fluctuations in the far field (greater than one wavelength distance). Zhuang Jiayu (Ref. [9]) also uses non-destructive detection of different samples using a scanning near-field optical microscope. The ultraviolet light or green laser is coupled into the fiber, and the scanning near-field optical microscope is used to observe the defects of the grown gallium nitride film on the patterned sapphire substrate. Successful use of scanning near-field optical microscopy and self-made fiber optic probes with different light sources and photodetectors has developed non-destructive near-field measurements that can be used to detect the growth of different energy gap materials in different types of wafers.

共焦顯微鏡術(confocal microscopy)由M. Minsky(參考文獻[10])於1957年提出其原理,但當時並沒有合適的光源,所以只停留在純理論的狀態,並未受到重視。一直到六零年代,雷射與電腦問世後,才逐漸受到重視。1969年P. Davidovits and M. D. Egger(參考文獻[11])利用雷射發展出一套掃瞄式共焦顯微系統(參考文獻[12]),經由數十年的努力,科技、光學不斷的進步,共焦微顯技術才趨於成熟。第一台及時成像掃描式共焦顯微技術系統是由G.Q.Xiao與G.S.Kino(參考文獻[13])所建構的。Confocal microscopy was proposed by M. Minsky (Ref. [10]) in 1957, but at the time there was no suitable source of light, so it only stayed in a purely theoretical state and was not taken seriously. It was not until the 1960s that lasers and computers came out that they gradually gained attention. In 1969, P. Davidovits and MD Egger (Ref. [11]) developed a scanning confocal microscopy system using lasers (Ref. [12]). Through decades of efforts, technology and optics have continued to improve. Confocal microdisplay technology has matured. The first timely imaging scanning confocal microscopy system was constructed by G.Q.Xiao and G.S.Kino (Ref. [13]).

許多學者一直致力於共焦顯微技術的改良,汪志平(參考文獻[14])等人[發展出差動式共焦顯微術,大大提升縱向解析度,使得光學解析度與掃描探針顯微術可匹比,並有較大的動態範圍。1990年Denk(參考文獻[15])等人由提出雙光子顯微術。此技術與共焦顯微術的基本架構類似,不同的是使用在短時間內發出極高強度光子量的脈衝式雷射,一次以兩個較長波長的光子激發一個螢光分子。軸方向的高對比度為雙光子顯微術的最大優點。Many scholars have been working on the improvement of confocal microscopy technology. Wang Zhiping (Ref. [14]) et al. [developed differential confocal microscopy, which greatly improved the longitudinal resolution, making optical resolution comparable to scanning probe microscopy. Than, and have a larger dynamic range. In 1990, Denk (Ref. [15]) et al. proposed two-photon microscopy. This technique is similar to the basic architecture of confocal microscopy, except that a pulsed laser that emits very high intensity photons in a short period of time is used to excite one fluorescent molecule with two longer wavelength photons at a time. The high contrast in the axial direction is the biggest advantage of two-photon microscopy.

光學同調斷層掃瞄技術(Optical Coherence Tomography;OCT)(參考文獻[16]),是利用低同調性光源(Low-Coherence Light),或者是利用超短脈衝雷射(Ultra-short Laser Pulses)光源,所研發出來的光學斷層掃瞄技術,主要是以非侵入式方法掃瞄活體組織,以得到高解析度的內部結構斷層影像,於西元1991年由J.G.,Fujimoto首先發表出來。Optical Coherence Tomography (OCT) (Ref. [16]) uses low-coherence light or ultra-short laser pulses. The optical tomography technology developed by the company mainly scans living tissue in a non-invasive way to obtain high-resolution internal structural tomographic images. It was first published by JG and Fujimoto in 1991.

賴進發(參考文獻[17])研發數值孔徑為0.65之角度偏向顯微鏡,利用共光程外差干涉術結合了表面電漿共振角度量測架構,利用NA值為0.65,可以增加其量測解析度。此結構的優點是穩定性高,不易受到環境及溫度的影響,組裝架設容易且可利用電腦隨時監控,其靈敏度可達S=0.100deg/nm、縱向解析度R=3nm、橫向解析度約0.3μm(NA=0.65時)。大多採用相位法或是產生干涉條紋來進行量測,其精確度較高,但在成本方面也相對提高。因此研發出成本較低、精確度也較佳的量測裝置是為改變方向。所以在成本考量後,本發明方法採用強度法來實現橫向位移量測。Lai Jinfa (Ref. [17]) developed an angle-biased microscope with a numerical aperture of 0.65. Using a common path heterodyne interferometry combined with a surface plasma resonance angle measurement architecture, the NA value of 0.65 can be used to increase the measurement resolution. degree. The structure has the advantages of high stability, low environmental and temperature resistance, easy assembly and monitoring, and can be monitored by computer at any time. The sensitivity can reach S=0.100deg/nm, the longitudinal resolution is R=3nm, and the lateral resolution is about 0.3. Μm (at NA=0.65). Most of them use the phase method or generate interference fringes for measurement, which is more accurate, but also relatively higher in terms of cost. Therefore, the development of a lower cost, better precision measuring device is to change direction. Therefore, after cost considerations, the method of the present invention uses a strength method to achieve lateral displacement measurements.

詹遠生(參考文獻[18])提出一種以大面積反射量測方式,結合CCD光強度影像分析技術來量測出待測物之表面輪廓,利用角度偏向與光學成像技術,藉由光電感測陣列元件取出影像,由其二維圖像測量其面積尺寸大小,並由其光強度變化(反射率變量)轉換成高度值,而成三維之圖像之技術。目前於申請中的中華民國專利案號100107449號「光學式強度型三維表面形貌與顯微量測裝置及方法」。Zhan Yuansheng (Ref. [18]) proposed a large-area reflection measurement method combined with CCD light intensity image analysis technology to measure the surface profile of the object to be tested, using angle bias and optical imaging technology, by means of optical inductance measurement array The technique of taking out an image, measuring its area size by its two-dimensional image, and converting it into a height value by changing its light intensity (reflectance variable) into a three-dimensional image. The Republic of China Patent No. 100107449, which is currently in the application, "Optical Strength Type Three-Dimensional Surface Topography and Microscopic Measurement Apparatus and Method".

本發明第一目的,在提供一種穿透式三維顯微鏡裝置及方法,主要係利用光強度量測的方法結合臨界角與CCD擷取影像技術,針對可透光性的待測物,不需經過掃描與干涉,可即時利用該經過待測物的光強度變化,再透過軟體功能將反射率轉換成表面高度變化,而可一次獲得一較完整的三維顯微影像,而在量測上具有高靈敏度、量測範圍增大、成本較低的優點。A first object of the present invention is to provide a transmissive three-dimensional microscope device and method, which mainly utilizes a method of measuring light intensity combined with a critical angle and a CCD capture image technique, and does not need to pass through the object to be tested for opacity. Scanning and interference can instantly use the light intensity change of the object to be tested, and then convert the reflectance into a surface height change through the soft body function, and obtain a relatively complete three-dimensional microscopic image at a time, and have high measurement The advantages of sensitivity, measurement range and low cost.

本發明第二目的,在提供一種穿透式三維顯微鏡裝置及方法,其係能補償、修正非線性之誤差。A second object of the present invention is to provide a transmissive three-dimensional microscope apparatus and method capable of compensating and correcting nonlinear errors.

本發明第三目的,在提供一種穿透式三維顯微鏡裝置及方法,其可克服使用近光光源產生色散的問題。A third object of the present invention is to provide a transmissive three-dimensional microscope apparatus and method that overcomes the problem of generating dispersion using a low beam source.

為達上述目的,本發明採用之技術手段係包括:雷射光源;擴束器,其包含空間濾波器與透鏡,用以濾掉雷射光源出射光束的雜散光,用以供光束出射該透鏡而使發散光收斂為平行光;物鏡組,用以供穿透光束經物鏡組聚焦於可穿透的待測物,而物鏡組將穿透待測物的光束輸出成平行光束,使該待測物經該物鏡組可以成像;偏極板置於物鏡組之鄰側,其用以調整光束的偏極方向;分光稜鏡,用以將雷射光源分成反射光與穿透光兩道光束;可調整角度的角度感測器,其在臨界角附近做為微小角度感測之用,供該反射光束至少兩次反射;一第一影像擷取單元,其用以自該角度感測器反射出的光束來擷取待測物之影像;一直角稜鏡,用以提供該穿透光束可產生全反射作用;一第二影像擷取單元,用以自該直角稜鏡穿透的光束來擷取待測物之影像。In order to achieve the above object, the technical means adopted by the present invention comprises: a laser light source; a beam expander comprising a spatial filter and a lens for filtering out stray light of the laser light source exiting beam for the light beam to exit the lens And causing the divergent light to converge into parallel light; the objective lens group is configured to allow the penetrating beam to be focused by the objective lens group to the penetrable object to be tested, and the objective lens group outputs the beam that penetrates the object to be tested into a parallel beam, so that the object The measuring object can be imaged by the objective lens group; the polarizing plate is placed on the adjacent side of the objective lens group to adjust the polarization direction of the light beam; and the splitting light is used to split the laser light source into two beams of reflected light and transmitted light. An angle-correctable angle sensor for small angle sensing near a critical angle for reflecting the reflected beam at least twice; a first image capturing unit for using the angle sensor The reflected light beam captures the image of the object to be tested; the corner is provided to provide the total reflection effect; and the second image capturing unit is configured to penetrate the beam from the right angle To capture the image of the object to be tested.

本發明之技術手段,係以雷射光源射向該可透光之待測物而為測試光,在該測試光通過顯微鏡組的物鏡組,讓該待測物在顯微鏡下取得其測試兩邊界光之光強度變化量,並依光強度變化量求得該測試光的反射率變化量,以依該反射率變化量計算出該待測物的表面高度,得到顯微下待測物的三維形貌。The technical means of the invention is that the laser light source is directed to the permeable object to be tested as the test light, and the test light passes through the objective lens group of the microscope group, and the test object obtains the test two boundaries under the microscope. The amount of change in the intensity of the light, and the amount of change in the reflectance of the test light is obtained according to the amount of change in the intensity of the light, and the surface height of the object to be tested is calculated according to the amount of change in the reflectance, and the three-dimensional object under test is obtained. Morphology.

壹.本發明之技術概念one. Technical concept of the invention

本發明主要是利用一物鏡組來提高的解析度,以臨界角強度法檢測技術結合影像擷取技術來量測透明待測物細微之表面輪廓。當雷射光源經過透明待測物時,由於待測物表面的高度變化,造成穿透的光束有些微角度偏移,以至於入射至平行四邊形的角度感測器時,偏離了原先靠近臨界角的角度,而造成靈敏的出射光強度增減。因此待測物的表面高度變化與穿透光束強度比,與反射率成正比,故可利用反射率變化來描繪待測物的表面形貌。最後就可以利用二組第一、二影像擷取單元,分別擷取影像的二組反射率,來分析其反射率變化,可以具體描繪待測物的三維表面顯微形貌。The invention mainly utilizes an objective lens group to improve the resolution, and uses a critical angle intensity detection technique combined with an image capturing technique to measure the fine surface contour of the transparent object to be tested. When the laser light source passes through the transparent object to be tested, the transmitted beam is slightly angularly offset due to the change in the height of the surface of the object to be tested, so that the angle sensor that is incident on the parallelogram deviates from the original critical angle. The angle of the light, resulting in a sensitive increase in the intensity of the emitted light. Therefore, the ratio of the surface height of the object to be tested to the intensity of the transmitted beam is proportional to the reflectance, so that the change in reflectance can be used to describe the surface topography of the object to be tested. Finally, two groups of first and second image capturing units can be used to extract the two sets of reflectivity of the image to analyze the reflectance change, and the three-dimensional surface microstructure of the object to be tested can be specifically described.

貳.本發明具體實施例two. Specific embodiment of the present invention 2.1三維顯微鏡量測待測物高度的方法2.1 Method for measuring the height of a sample to be measured by a three-dimensional microscope

本發明在顯微鏡量測待測物三維形貌的方法,其係以雷射光源射向該可透光之待測物而為測試光,在該測試光通過顯微鏡組的物鏡組,讓該待測物在顯微鏡下取得其測試兩邊界光之光強度變化量,並依光強度變化量求得該測試光的反射率變化量,以依該反射率變化量計算出該待測物的表面高度,得到顯微鏡量測的三維形貌。The method for measuring the three-dimensional shape of the object to be tested by the microscope, wherein the laser light source is directed to the light-transmitting object to be tested as the test light, and the test light passes through the objective lens group of the microscope group, so that the The measured object obtains the change amount of the light intensity of the test two-border light under the microscope, and obtains the change amount of the reflectance of the test light according to the change amount of the light intensity, so as to calculate the surface height of the test object according to the change amount of the reflectance. , obtained the three-dimensional shape measured by the microscope.

2.1.1本發明角度感測器入射外角與反射率之關係2.1.1 Relationship between incident external angle and reflectivity of the angle sensor of the present invention

為說明角度感測器的反射率關係,角度感測器是以平行四邊形稜鏡為較佳實施例,並且以P偏振光為例,來作為平行四邊形稜鏡內部的反射率變化,若以其他偏振光入射,依個人需要可調整其量測靈敏度,由於P偏振光在平行四邊形稜鏡內部經過兩次的反射的反射率會比一次反射的反射率更靈敏,且可以得到較為接近線性的曲線,之後再取斜率之平均值,由於斜率與平行四邊形稜鏡的反射率以及平行四邊形稜鏡的外部入射角θ之間有相對關係。起先討論如何求得反射率,以及反射率與平行四邊形稜鏡的外部入射角θ之間的關係式。如圖1所示,反射光於平行四邊形內部作兩次之反射。之後由邊界條件以及Snell’s law求出兩次反射之反射率對外角θ與入射稜鏡內角θ 1 之關係式,如式(1)及式(1-1)與式(1-2)所示:To illustrate the reflectivity relationship of the angle sensor, the angle sensor is a parallelogram 稜鏡 as a preferred embodiment, and P-polarized light is taken as an example to change the reflectance inside the parallelogram ,, if other When the polarized light is incident, the measurement sensitivity can be adjusted according to individual needs. Since the P-polarized light is reflected twice in the parallelogram, the reflectivity is more sensitive than that of the primary reflection, and a curve close to linear can be obtained. Then, the average value of the slope is taken, and there is a relative relationship between the slope and the reflectivity of the parallelogram 稜鏡 and the external incident angle θ of the parallelogram 稜鏡. First, we discuss how to find the reflectivity and the relationship between the reflectivity and the external incident angle θ of the parallelogram 稜鏡. As shown in Figure 1, the reflected light is reflected twice inside the parallelogram. Then, from the boundary conditions and Snell's law, the relationship between the reflectance of the two reflections and the angle θ 1 of the incident angle is obtained, as shown in equations (1) and (1-1) and (1-2). Show:

其中,among them,

首先將圖1之外角θ,其範圍設定為4度到10度,且式(1)=R p 2 表示兩次反射,之後將稜鏡折射率n 1 =1.51509(波長λ =632.8 nm時)、空氣折射率n 2 =1 .0003 ,先後代入(1)、(1-1)、(1-2)式,再利用MATLAB程式模擬分析後,作出如圖2所示之結果,不過為了能證明此曲線模擬圖,由圖3之實際量測平行四邊形之反射率曲線。因此由圖3可以了解在5.58度附近角度,其反射率變化最靈敏,當θ1 c 時(θ c 為臨界角),代入(1-1)式所得到θ5.583度。本發明是以P偏振光為主要平行四邊形稜鏡之反射率,反射率變化比S偏振光更加靈敏,因此以P偏振光來作強度量測為較佳實施例。(若改用其他偏極,則反射率對入射角θ之變化靈敏度會下降。)First, the outer angle θ of Fig. 1 is set to a range of 4 to 10 degrees, and the formula (1) = R p 2 represents two reflections, then the refractive index n 1 = 1.51509 (when the wavelength λ = 632.8 nm), the air refractive index n 2 = 1. 0003 , substituting (1), (1-1), (1-2), after using MATLAB program simulation analysis, the result shown in Figure 2 is made, but in order to prove the curve simulation, the reflectance curve of the parallelogram is actually measured by Fig. 3. Therefore, it can be seen from Fig. 3 that the angle of change is most sensitive at an angle of around 5.58 degrees. When θ 1 = θ c c is the critical angle), the θ obtained by substituting (1-1) 5.583 degrees. The present invention is based on the reflectance of P-polarized light as the main parallelogram, and the reflectance change is more sensitive than the S-polarized light. Therefore, the intensity measurement using P-polarized light is a preferred embodiment. (If other poles are used instead, the sensitivity of the reflectance to the change in the incident angle θ will decrease.)

2.1.2待測物表面高度與反射率之關係2.1.2 Relationship between surface height and reflectivity of the object to be tested

如圖4所示,假如待測物(10)是在基板裡面時,則待測物(10)之外在環境為玻璃(13),折射率為n 1 ,待測物(10)之折射率為n 2 。所以偏向角度β又可由下式推導出:As shown in FIG. 4, if the object to be tested (10) is inside the substrate, the object (10) outside the object to be tested (10) is in the environment of glass (13), the refractive index is n 1 , and the object (10) is refracted. The rate is n 2 . Therefore, the deflection angle β can be derived from the following formula:

n 2 sin2 =n 1 sinθ1  (2) n 2 sin 2 = n 1 sin θ 1 (2)

由式(4)可知,偏向角度β正比於內部偏移角α。因此當我們已知待測物(10)之外在環境為玻璃(13),折射率為n 1 ,及待測物(10)的折射率n 2 ,就能藉由測量β角可由公式得到待測物內部偏移角α。As can be seen from equation (4), the deflection angle β is proportional to the internal offset angle α. Therefore, when we know that the object to be tested (10) is in the environment of glass (13), the refractive index is n 1 , and the refractive index n 2 of the analyte (10) can be obtained by the formula by measuring the angle β. The internal offset angle α of the object to be tested.

並且由圖4可看出光線入射待測物(10),若待測物(10)表面高度有dh 的變化時,會造成光路偏移原來路徑方向,形成+β或-β的角度偏移量。在此待測物(10)中,雷射光入射待測物(10)再折射出去,若待測物件(10)的表面平整兩側表面平行,即入射的第一界面(17)及折射出去的第二界面(19)彼此平行時,透射出去的光線不會產生角度的偏移(β=0 o );若待測物(10)如圖4所示,第一、二界面(17)(19)之間產生±α的夾角,則會分別形成+β或-β的偏向角度變化量。回到(4)式,當界面2的斜率為正時,我們定義α值為正,相反的,則α值為負。θ t 2 為出射角,n 2 為待測物折射率,dx 為每單位掃描的移動距離,dh 為相對於dx 之待測物表面高度變化量。已知β和α幾乎是維持一個線性關係。又It can be seen from Fig. 4 that the light is incident on the object to be tested (10). If the surface height of the object to be tested (10) has a change in dh , the optical path is shifted from the original path direction to form an angular shift of +β or -β. the amount. In the object to be tested (10), the laser light is incident on the object to be tested (10) and then refracted. If the surface of the object to be tested (10) is flat on both sides of the surface, the first interface (17) is incident and is refracted. When the second interface (19) is parallel to each other, the transmitted light does not have an angular offset (β=0 o ); if the object to be tested (10) is as shown in FIG. 4, the first and second interfaces (17) When an angle of ±α is generated between (19), the amount of change in the deflection angle of +β or -β is formed, respectively. Returning to equation (4), when the slope of interface 2 is positive, we define the alpha value as positive, and the opposite, the alpha value is negative. θ t 2 is the exit angle, n 2 is the refractive index of the object to be tested, dx is the moving distance per unit scan, and dh is the amount of change in the surface height of the object to be tested relative to dx . It is known that β and α maintain almost a linear relationship. also

n 0 γ≒n 1 β n 0 γ≒ n 1 β

γ=(n 2 -n 1γ=( n 2 - n 1

由(5)式可知As can be seen from equation (5)

因此表面高度變化量可寫成式(7)Therefore, the amount of surface height change can be written as equation (7)

dhdx  (7) Dhdx (7)

將(6)式代入(7)式可得:Substituting (6) into (7) gives:

因此可以得知角度偏向γ=(n 2 -n 1 )α,故稜鏡入射角度改變量為d θ=γ,而高度dh 對γ的關係為dhdx 。因此,待測物(10)表面輪廓h 可視為每一單位間隔dx 上之x 方向像素對應高度差變化量dh 的總合,可以寫成式(9)及(10):Therefore, it can be known that the angle is biased toward γ=( n 2 - n 1 )α, so the amount of change in the incident angle of 稜鏡 is d θ = γ, and the relationship between the height dh and γ is dh = α dx . Therefore, the surface contour h of the object to be tested (10) can be regarded as the sum of the height difference variation dh of the x- direction pixels on each unit interval dx , which can be written as equations (9) and (10):

h =B (R P 2 -D ) (10) h = B ( R P 2 - D ) (10)

D 為常數,B =BD 為初始高度,n 1n 2 分別為基板與待測物之折射率,R p 2 為所量到的P偏極二次內反射率,當dX =Mdx ,且n 2 <n 1 ,則B >0。dX 可視為pixel之大小。 D is a constant, B = BD is the initial height, n 1 and n 2 are the refractive indices of the substrate and the object to be tested, respectively, and R p 2 is the measured P-pole secondary internal reflectance when dX = Mdx and n 2 < n 1 , then B >0. dX can be regarded as the size of the pixel.

2.3本發明三維顯微鏡裝置之結構2.3 Structure of the three-dimensional microscope device of the present invention

基於前述方法,請參看圖5所示,本發明之三維顯微鏡裝置係包括:一雷射光源(20),其係波長為632.8nm之氦氖雷射(He-Ne Laser)光源,用以產生一雷射光束;一減光器(21),其係用以以減弱雷射光源(20)出射的雷射光束的強度;一擴束器(22),其包含空間濾波器與透鏡(25),前述之空間濾波器包含一第一物鏡(23)<其NA=0.45>以及針孔(24)所組成,當雷射光束經過第一物鏡(23)聚焦在針孔上(24),此時的出射光就會濾掉雜散光所造成的影響,進而提高光束精度,而透鏡(25)係用以經過該空間濾波器的發散光收斂為一平行光束;一物鏡組(26),其包含一第二物鏡(261)與第三物鏡(262)形成雙物鏡形態,用以供生物形態的待測物(10)置於第二物鏡(261)、第三物鏡(262)的中間,該待測物(10)可採用單細胞生物,諸如眼蟲、草履蟲等等,供穿透該透鏡(25)的光束經過該第二物鏡(261)聚焦在待測物(10)上,待測物(10)可置於一雙軸移動平臺(27),雙軸移動平臺(27)利用二個單軸來移動平臺,用以固定待測物(10)並做微小橫向位移,使待測物(10)可以移動到設定位置,之後的第三物鏡(262)則把穿透該待測物(10)的光束輸出成平行光束並為一測試光束(此時是以待測物為基準面時),利用單軸移動的方式,帶動第三物鏡(262)做微小縱向位移,使待測物(10)可以因此清晰成像;一偏極板(29),其置於物鏡組(26)的第三物鏡(262)之鄰側,其用以調整測試光束透射的透光軸角度,以改變來自物鏡組(26)之測試光束的偏極方向;一分光稜鏡(30),藉以將來自偏極板(29)之測試光束分成反射光束(45)與穿透光束(40);一角度感測器(32),其為平行四邊形稜鏡,在臨界角附近做為微小角度感測之用,供穿透光束(40)至少兩次反射,在雷射光源(20)條件下,其折射率為1.51509,該角度感測器(32)是設置於一旋轉平臺(321)上,用以方便旋轉角度感測器(32),來調整穿透光束(40)的入射角至臨界角之角度;一第一影像擷取單元(33),其為光電感測,諸如電荷藕合元件(簡稱:CCD),用來擷取自角度感測器(32)出射的光束而得到待測物(10)之具有一第一光強度的一第一影像,其面向角度感測器(32);一直角稜鏡(35),藉以提供反射光束(45)可以產生全反射的功能,包含兩呈等腰的第一腰部(351)、第二腰部(352),以及一最長底面的斜底面(353),第一腰部(351)朝向分光稜鏡(30),反射光束(45)由第一腰部(351)進入之後,在最長的斜底面(353)產生全反射,然後由相對的另一個第二腰部(352)射出,由於僅發生一次全反射,所以影像的旋向性會被改變,造成影像反轉;及一第二影像擷取單元(37),其為光電感測,諸如電荷藕合元件(簡稱:CCD)用來擷取該來自直角稜角鏡(35)出射的光束獲得待測物之具有一第二光強度的一第二影像,特別是指其面向直角稜鏡(35)之第二腰部(352)。Based on the foregoing method, as shown in FIG. 5, the three-dimensional microscope apparatus of the present invention comprises: a laser light source (20) which is a He-Ne Laser source having a wavelength of 632.8 nm for generating a laser beam; a dimmer (21) for attenuating the intensity of the laser beam emitted by the laser source (20); a beam expander (22) comprising a spatial filter and a lens (25) The spatial filter comprises a first objective lens (23) <its NA = 0.45> and a pinhole (24). When the laser beam is focused on the pinhole (24) through the first objective lens (23), At this time, the emitted light will filter out the influence caused by the stray light, thereby improving the beam precision, and the lens (25) is used to converge the divergent light passing through the spatial filter into a parallel beam; an objective lens group (26), The second objective lens (261) and the third objective lens (262) form a dual objective lens shape for the biological object to be tested (10) to be placed in the middle of the second objective lens (261) and the third objective lens (262). The test object (10) may be a single-celled organism such as an eye worm, a paramecium, or the like, and the light beam penetrating the lens (25) is focused by the second objective lens (261). On the object (10), the object to be tested (10) can be placed on a biaxial moving platform (27), and the two-axis moving platform (27) uses two single axes to move the platform for fixing the object to be tested (10). Making a slight lateral displacement, the object to be tested (10) can be moved to the set position, and then the third objective lens (262) outputs the beam that penetrates the object to be tested (10) into a parallel beam and is a test beam (this) When the object to be tested is used as the reference surface, the third objective lens (262) is driven by the uniaxial movement to make a slight longitudinal displacement, so that the object to be tested (10) can be clearly imaged; a polarizing plate (29) Placed on the adjacent side of the third objective lens (262) of the objective lens group (26) for adjusting the transmission axis angle of the test beam transmission to change the polarization direction of the test beam from the objective lens group (26); a beam splitter (30) for splitting the test beam from the polarizing plate (29) into a reflected beam (45) and a penetrating beam (40); an angle sensor (32), which is a parallelogram, in The critical angle is used for micro-angle sensing for at least two reflections of the penetrating beam (40). Under the laser source (20), the refractive index is 1.51509. The device (32) is disposed on a rotating platform (321) for facilitating the rotation angle sensor (32) to adjust the angle of incidence of the penetrating beam (40) to the angle of the critical angle; a first image capture a unit (33), which is a photo-electrical inductance measurement, such as a charge-coupling component (abbreviation: CCD), is used to extract a light beam emitted from the angle sensor (32) to obtain a first object (10) having a first a first image of light intensity, which faces the angle sensor (32); a constant angle 稜鏡 (35), thereby providing a function of the reflected beam (45) to produce total reflection, comprising two first waists that are isosceles ( 351), a second waist portion (352), and a sloped bottom surface (353) of a longest bottom surface, the first waist portion (351) faces the beam splitter (30), and the reflected light beam (45) is entered by the first waist portion (351). Total reflection is generated on the longest inclined bottom surface (353), and then emitted by the opposite second waist portion (352). Since only one total reflection occurs, the rotation of the image is changed, causing image inversion; a second image capturing unit (37) for photo-sensing, such as a charge-clamping component (abbreviation: CCD) for extracting the lens from the right-angle prism (35) The emitted light beam obtains a second image of the object to be tested having a second light intensity, in particular a second waist portion (352) facing the right angle 稜鏡 (35).

2.4本發明三維顯微鏡裝置之量測實施例2.4 Measurement Example of Three-Dimensional Microscope Apparatus of the Present Invention

請配合參看圖5所示,以氦氖雷射作為雷射光源(20),雷射光源(20)產生雷射光束入射擴束器(22),將入射的雷射光束擴大為平行光束,經第二物鏡(261)入射至待測物(10),再由第三物鏡(262)出射而為測試光束,測試光束經過偏極板(29)形成P偏光,並入射到分光稜鏡(30),測試光束經由分光稜鏡(30)將光分為穿透光束(40)及反射光束(45)兩道光束,穿透光束(40)經由角度感測器(32)前進,使用者可轉動旋轉台(32)直到穿透光束(40)的入射角達到靠近臨界角,再適當調整第一影像擷取單元(33)位置,使其成像在第一影像擷取單元(33)上,將其光強度分布圖設為I CCD 2 。反射光束(45)則經由直角稜鏡(35),透過第一腰部(351),並由斜底面(353)做反射,再成像在第二影像擷取單元(37),設定其光強度分布圖為I CCD 1Referring to FIG. 5, the laser is used as the laser source (20), and the laser source (20) generates a laser beam incident beam expander (22) to expand the incident laser beam into a parallel beam. The second objective lens (261) is incident on the object to be tested (10), and then emitted by the third objective lens (262) as a test beam. The test beam passes through the polarizing plate (29) to form P-polarized light, and is incident on the spectroscopic beam ( 30), the test beam splits the light into two beams of the penetrating beam (40) and the reflected beam (45) via the beam splitter (30), and the penetrating beam (40) advances through the angle sensor (32), the user The rotating table (32) can be rotated until the incident angle of the penetrating beam (40) reaches a critical angle, and the position of the first image capturing unit (33) is appropriately adjusted to be imaged on the first image capturing unit (33). , set its light intensity distribution to I CCD 2 . The reflected beam (45) is transmitted through the first waist portion (351) through the right angle 稜鏡 (35), and is reflected by the oblique bottom surface (353), and then imaged in the second image capturing unit (37) to set the light intensity distribution. The picture shows I CCD 1 .

其次,藉由USB直接連電腦與第一、二影像擷取單元(33)(37),以顯示出第一、二影像擷取單元(33)(37)所拍攝的影像,將兩影像重疊後,取出光強度比值即可獲得反射率,最後由Matlab軟體(數學計算軟體)分析,描繪出待測物(10)在顯微鏡下之三維表面形貌圖。Secondly, the first image capturing unit (33) (37) is directly connected to the computer and the first and second image capturing units (33) (37) to display the images captured by the first and second image capturing units (33) (37), and the two images are overlapped. After taking out the light intensity ratio The reflectivity can be obtained, and finally analyzed by Matlab software (mathematical software) to depict the three-dimensional surface topography of the analyte (10) under the microscope.

參.本發明三維顯微鏡裝置測量實施例Participation. Three-dimensional microscope device measurement embodiment of the present invention 3.1適用20 lines/mm穿透式繞射光柵3.1 for 20 lines/mm penetrating diffraction grating

本發明實驗例中,待測物為20lines/mm穿透式繞射光柵,透過圖5之結構,在經由直角稜鏡(35)造成全反射時,成像於第二影像擷取單元(37)所拍攝的20 lines/mm光柵之強度分佈圖(I CCD 1 ),其結果如附件1圖1所示,而在經由角度感測器(32)產生臨界角附近的光線,成像於第一影像擷取單元(33)所拍攝的20 lines/mm光柵之強度分佈圖(I CCD 2 ),則如附件1圖2所示,將附件1圖1及圖2完全重疊後,取得反射率資訊,經由(10)式h =B (R P 2 -D )的公式所得的表面高度圖則如圖6所示。In the experimental example of the present invention, the object to be tested is a 20 lines/mm transmissive diffraction grating, and through the structure of FIG. 5, when the total reflection is caused by the right angle 稜鏡 (35), the image is imaged by the second image capturing unit (37). The intensity map of the 20 lines/mm grating taken ( I CCD 1 ), the result is shown in Figure 1 of Annex 1, and the light near the critical angle is generated by the angle sensor (32), and imaged on the first image. The intensity distribution map ( I CCD 2 ) of the 20 lines/mm grating captured by the capture unit (33) is as shown in Figure 2 of Annex 1, and the reflectance information is obtained by completely overlapping the Figure 1 and Figure 2 of the Annex 1. The surface height map obtained by the formula of (10) h = B ( R P 2 - D ) is shown in Fig. 6.

故由圖6取出資料,分別算出圖6中的第360列、第420列、第480列最大高度差平均值約為84 nm、81nm、86 nm,這些狀況則如圖7所示。本件實施例中取約10列計算其總平均高度為84 nm,如圖8所示。故附件3之表1可以得知圖8,y軸總平均高度差平均值與商用測膜機所測得的高度(83.45 nm)之間的差為0.55 nm,即可知本實施例量測之誤差百分率接近1%。本待測物利用本發明量測出來的結果與商用測膜機Dektak-6M量測結果相差很小,可證明本發明具可實施性。Therefore, the data is extracted from Fig. 6, and the maximum height difference of the 360th column, the 420th column, and the 480th column in Fig. 6 is calculated to be about 84 nm, 81 nm, and 86 nm, respectively, and these conditions are as shown in Fig. 7. In this embodiment, about 10 columns are calculated and the total average height is 84 nm, as shown in FIG. Therefore, in Table 1 of Annex 3, it can be seen that the difference between the average value of the total average height difference of the y-axis and the height measured by the commercial film measuring machine (83.45 nm) is 0.55 nm, which means that the measurement of this embodiment is known. The percentage error is close to 1%. The measured result of the present invention using the measurement results of the present invention is very small compared with the measurement result of the commercial film measuring machine Dektak-6M, and the invention can be proved to be implementable.

3.2適用眼蟲(Euglena)之量測3.2 Measurement of Euglena

待測物眼蟲(學名:Euglena)是生物裡的一個屬於裸藻綱。眼蟲為單細胞生物,其體長約數十微米,中間寬,兩端窄。後段較尖,前端圓。整個身體為一個大細胞,外邊包過一個通透性良好的外膜,可以使水、氧氣等小分子物質通過。其折射率約為1.3。實施方法如上所述,附件2圖1及圖2所示為分別於全反射角以及臨界角附近,利用第二、一影像擷取單元(37)(33)拍攝的光強度變化之灰階圖形,重疊後,各點光強度分別得I CCD 1 以及I CCD 2 ,即可推得反射率R p2 進而求出待測物眼蟲的高度形貌。拍攝時,參考圖5所示,其係需調整待測物(10)至物鏡組(26)之共焦平面上,並調整第一、二影像擷取單元(33)(37)位置以使影像清析。經換算成表面高度後,所呈現的三維立體圖像如圖9所示,將其放大來觀察則如圖10所示。依據本發明所測量的眼蟲實際尺寸為70 μm×35 μm×0.87 μm。The eye worm (Euglena) is a species of the genus Euglena in the organism. Euglena is a single-celled organism with a body length of about tens of microns, a wide middle, and narrow ends. The rear section is sharper and the front end is round. The whole body is a large cell, and a well-permeated outer membrane is wrapped outside to allow small molecules such as water and oxygen to pass through. Its refractive index is about 1.3. The method of implementation is as described above, and FIG. 1 and FIG. 2 of FIG. 2 show gray-scale patterns of light intensity changes taken by the second image capturing unit (37) (33) in the vicinity of the total reflection angle and the critical angle, respectively. After the overlap, the light intensity of each point is I CCD 1 and I CCD 2 respectively , and the reflectivity R p2 can be obtained to obtain the height morphology of the eye worm of the object to be tested. When shooting, referring to FIG. 5, it is necessary to adjust the object to be tested (10) to the confocal plane of the objective lens group (26), and adjust the positions of the first and second image capturing units (33) (37) so that Image analysis. After being converted into the surface height, the three-dimensional image presented is as shown in FIG. 9, and is enlarged and observed as shown in FIG. The actual size of the ophthalmite measured according to the present invention is 70 μm × 35 μm × 0.87 μm.

3.2適用草履蟲(Paramecium)之量測3.2 Applicable to the measurement of Paramecium

做法如同眼蟲(Euglena)之量測所示,草履蟲之所有量測,圖形不再贅述。本實驗所得的草履蟲實際尺寸為390 μm×150 μm×0.7 μm,其三維立體圖像如圖11所示。The practice is shown in the measurement of Euglena, and all measurements of the paramecium are not repeated. The actual size of the paramecium obtained in this experiment is 390 μm × 150 μm × 0.7 μm, and its three-dimensional image is shown in Fig. 11.

肆.結論Hey. in conclusion

因此,藉由上述技術特徵的設置,本發明確實具有下列的特點:Therefore, with the above technical features, the present invention does have the following features:

1.本發明利用光電感測功能的影像擷取單元來擷取待測物影像,藉以透過其每點光強度或反射率轉換成待測物表面高度的量測裝置,進而使顯微觀察待測物可以得出三維圖像,因此本發明具有非接觸式、非破壞性、非干涉方法之量測優點。1. The invention utilizes the image capturing unit of the photo-sensing function to extract the image of the object to be tested, thereby converting the light intensity or reflectance of each point into a measuring device for the surface height of the object to be tested, thereby making the microscopic observation The object can be used to derive a three-dimensional image, so the present invention has the advantage of non-contact, non-destructive, non-interferometric methods.

2.本發明為穿透式光學系統量測,橫向解析度可達到至少0.5 μm,縱向解析度至少高於幾個奈米,因此可應用測量的用途非常廣泛,比如生物科技、生醫檢測、膜厚量測、光電產業、半導體產業、精密製造業、食品加工業、化工業、等等需要微細觀察與測量之產業均能適用;甚至可同時針對瑕疵、缺陷、表面分析、膜厚、生物樣本或粗糙度等量測。2. The invention is a transmissive optical system measurement, the lateral resolution can reach at least 0.5 μm, and the longitudinal resolution is at least a few nanometers, so the measurement can be applied for a wide range of applications, such as biotechnology, biomedical testing, Film thickness measurement, optoelectronic industry, semiconductor industry, precision manufacturing, food processing industry, chemical industry, etc. can be applied to industries that require fine observation and measurement; even for defects, defects, surface analysis, film thickness, and biology Sample or roughness measurement.

3.本發明可不經掃描而獲取一整面待測物的資訊,而其量測範圍與放大倍率均可調整。3. The invention can obtain information of a whole surface to be tested without scanning, and the measurement range and the magnification can be adjusted.

4.本發明所用雷射光源的偏振方向可隨使用者之需要變換,非為固定。4. The polarization direction of the laser light source used in the present invention can be changed according to the needs of the user, and is not fixed.

5.本發明係針對透光式的待測物來作顯微鏡三維量測。5. The present invention performs three-dimensional microscopic measurement of a microscope for a light-transmitting object to be tested.

6.本發明包含有二組光電感測的影像擷取單元,一組針對光線進入全反射角,另一組是針對光線進入臨界角,因此可不必調整全反射角而可減少調整角度所產生的誤差,有效地補償與修正。6. The present invention comprises two sets of image capturing units for photo-sensing, one for the light to enter the total reflection angle and the other for the light entering the critical angle, so that the adjustment angle can be reduced without adjusting the total reflection angle. The error is effectively compensated and corrected.

7.依本發明進行量測,可以具備橫向解析度高於0.5微米,縱向解析度可高於幾奈米,解析度與靈敏度更好。7. According to the invention, the lateral resolution can be higher than 0.5 micron, the longitudinal resolution can be higher than several nanometers, and the resolution and sensitivity are better.

以上所述,僅為本發明之一可行實施例,並非用以限定本發明之專利範圍,凡舉依據下列請求項所述之內容、特徵以及其精神而為之其他變化的等效實施,皆應包含於本發明之專利範圍內。本發明所具體界定於請求項之結構特徵,未見於同類物品,且具實用性與進步性,已符合發明專利要件,爰依法具文提出申請,謹請 鈞局依法核予專利,以維護本申請人合法之權益。The above is only one of the possible embodiments of the present invention, and is not intended to limit the scope of the patents of the present invention, and the equivalent implementations of other changes according to the contents, features and spirits of the following claims are It should be included in the scope of the patent of the present invention. The invention is specifically defined in the structural features of the request item, is not found in the same kind of articles, and has practicality and progress, has met the requirements of the invention patent, and has filed an application according to law, and invites the bureau to approve the patent according to law to maintain the present invention. The legal rights of the applicant.

(10)...待測物(10). . . Analyte

(13)...玻璃(13). . . glass

(15)...空氣(15). . . air

(17)...第一界面(17). . . First interface

(19)...第二界面(19). . . Second interface

(20)...雷射光源(20). . . Laser source

(21)...減光器(twenty one). . . Dimmer

(22)...擴束器(twenty two). . . Beam expander

(23)...第一物鏡(twenty three). . . First objective

(24)...針孔(twenty four). . . Pinhole

(25)...透鏡(25). . . lens

(26)...物鏡組(26). . . Objective lens group

(261)...第二物鏡(261). . . Second objective

(262)...第三物鏡(262). . . Third objective

(27)...雙軸移動台(27). . . Two-axis mobile station

(28)...單軸移動台(28). . . Single axis mobile station

(29)...偏極板(29). . . Polar plate

(30)...分光稜鏡(30). . . Splitter

(32)...角度感測器(32). . . Angle sensor

(321)...旋轉台(321). . . Rotary table

(33)...第一影像擷取單元(33). . . First image capturing unit

(35)...直角稜鏡(35). . . Right angle 稜鏡

(351)...第一腰部(351). . . First waist

(352)...第二腰部(352). . . Second waist

(353)...斜底面(353). . . Oblique bottom

(37)...第二影像擷取單元(37). . . Second image capturing unit

(40)(45)...光束(40) (45). . . beam

圖1係本發明光線於平行四邊形稜鏡內作兩次反射示意圖。Figure 1 is a schematic illustration of the two embodiments of the present invention in which the light is reflected twice in a parallelogram.

圖2係本發明P偏光兩次反射之反射率對外角的變化模擬曲線圖。Fig. 2 is a graph showing the change of the reflectance of the P-polarized double reflection of the present invention to the external angle.

圖3係本發明平行四邊形稜鏡之反射率量測曲線圖。Fig. 3 is a graph showing the reflectance measurement of the parallelogram of the present invention.

圖4係本發明表面高度與偏向角關係示意圖。Figure 4 is a schematic view showing the relationship between the surface height and the deflection angle of the present invention.

圖5係本發明強度型穿透式三維顯微鏡術實施例架構示意圖。Fig. 5 is a schematic view showing the structure of an embodiment of the intensity-type transmissive three-dimensional microscope of the present invention.

圖6係本發明量測實例一,20 lines/mm光柵之量測3D圖。Fig. 6 is a measurement 3D diagram of a 20 lines/mm grating of the first measurement example of the present invention.

圖7係本發明依圖6量測之第360、420、480列表面輪廓比較圖。FIG. 7 is a comparison diagram of the 360th, 420, and 480 list surface contours measured by the present invention according to FIG. 6.

圖8係本發明依圖6所量測表面輪廓平均高度圖。Figure 8 is a graph showing the average height of the surface profile of the present invention as measured in Figure 6.

圖9係本發明量測實例二,眼蟲量測3D圖。Fig. 9 is a third measurement example of the present invention, and an eye worm measurement 3D map.

圖10係本發明由圖9所得之眼蟲量測局部圖。Figure 10 is a partial view of the eye worm obtained by Figure 9 of the present invention.

圖11係本發明量測實例三,草履蟲量測3D圖。Figure 11 is a third comparative measurement of the present invention, a 3D map of the paramecium measurement.

附件1:圖1係本發明量測實例一,當外角角度於全反射角時CCD拍攝之影像平面圖;圖2係本發明待測物為20 lines/mm光柵當外角角度於臨界角附近時,影像擷取單元拍攝之影像平面圖。Attachment 1 is a plan view of the image taken by the CCD when the external angle is at the total reflection angle; and FIG. 2 is a 20 lines/mm grating of the present invention when the external angle is near the critical angle. The image plan taken by the image capture unit.

附件2:圖1係本發明量測實例二,待測物為眼蟲,當外角角度於全反射角時CCD拍攝之影像平面圖;圖2係本發明量測實例二:待測物為眼蟲,當外角角度於臨界角附近時CCD拍攝之影像平面圖。Attachment 2: Figure 1 is a measurement example 2 of the present invention. The object to be tested is an eye worm. The image of the CCD is taken when the external angle is at the total reflection angle. Figure 2 is a measurement example 2 of the present invention: the object to be tested is an eye worm A plan view of the image taken by the CCD when the angle of the outer corner is near the critical angle.

附件3:為20 lines/mm光柵之高度量測比較表。Attachment 3: Height measurement comparison table for 20 lines/mm grating.

附件4:參考文獻Annex 4: References

(10)...待測物(10). . . Analyte

(20)...雷射光源(20). . . Laser source

(21)...減光器(twenty one). . . Dimmer

(22)...擴束器(twenty two). . . Beam expander

(23)...第一物鏡(twenty three). . . First objective

(24)...針孔(twenty four). . . Pinhole

(25)...透鏡(25). . . lens

(26)...物鏡組(26). . . Objective lens group

(261)...第二物鏡(261). . . Second objective

(262)...第三物鏡(262). . . Third objective

(27)...雙軸移動台(27). . . Two-axis mobile station

(28)...單軸移動台(28). . . Single axis mobile station

(29)...偏極板(29). . . Polar plate

(30)...分光稜鏡(30). . . Splitter

(32)...角度感測器(32). . . Angle sensor

(321)...旋轉台(321). . . Rotary table

(33)...第一影像擷取單元(33). . . First image capturing unit

(35)...直角稜鏡(35). . . Right angle 稜鏡

(351)...第一腰部(351). . . First waist

(352)...第二腰部(352). . . Second waist

(353)...斜底面(353). . . Oblique bottom

(37)...第二影像擷取單元(37). . . Second image capturing unit

(40)(45)...光束(40) (45). . . beam

Claims (10)

一種穿透式三維顯微鏡裝置,其係包括:一雷射光源,用以發射一雷射光束;一擴束器,其包含一空間濾波器與一透鏡,用以濾掉該雷射光束的雜散光,並出射至該透鏡而收斂為平行光束;一物鏡組,用以供該平行光束聚焦於一可穿透的待測物,並將穿透該待測物的光束平行輸出而為一測試光束;一偏極板,用以調整該測試光束之偏極方向;一分光稜鏡,用以將該測試光束分成一反射光束與一穿透光束;一可調整角度的角度感測器,其在臨界角附近做為微小角度感測之用,供該穿透光束至少兩次反射;一第一影像擷取單元,其用以自該角度感測器出射的光束來擷取該待測物之具有一第一光強度的一第一影像;一直角稜鏡,用以提供該反射光束產生全反射作用;及一第二影像擷取單元,用以自該直角稜鏡出射的光束來擷取該待測物之具有一第二光強度的一第二影像。 A transmissive three-dimensional microscope device comprising: a laser light source for emitting a laser beam; a beam expander comprising a spatial filter and a lens for filtering out the laser beam Astigmatism, and exiting to the lens to converge into a parallel beam; an objective lens group for focusing the parallel beam on a penetrable object to be tested, and outputting the beam penetrating the object to be tested in parallel for testing a polarizing plate for adjusting a polarization direction of the test beam; a splitting beam for dividing the test beam into a reflected beam and a penetrating beam; an angle-adjustable angle sensor, Having a small angle sensing near the critical angle for the reflected beam to be reflected at least twice; a first image capturing unit for extracting the object to be tested from the beam emitted from the angle sensor a first image having a first light intensity; a constant angle 稜鏡 for providing a total reflection of the reflected light beam; and a second image capturing unit for emitting a light beam from the right angle 撷Taking the object to be tested has a second light intensity A second image. 如請求項1所述之穿透式三維顯微鏡裝置,其中,該角度感測器係為一平行四邊形稜鏡供該反射光束做兩次反射,且該角度感測器連結設置於一可旋轉角度之旋轉台。 The transmissive three-dimensional microscope device of claim 1, wherein the angle sensor is a parallelogram for the reflected beam to be reflected twice, and the angle sensor is coupled to a rotatable angle. Rotating table. 如請求項1所述之穿透式三維顯微鏡裝置,其中,該雷射光源是波長為632.8nm之氦氖雷射(He-Ne Laser)光源,在該雷射光源與該擴束器之間安置一減光器,用以減弱雷射光源的強度;該擴束器之該空間濾波器包含一第一物鏡及一針孔,該雷射光源經過該第一物鏡聚焦在該針孔。The transmissive three-dimensional microscope device of claim 1, wherein the laser source is a He-Ne laser source having a wavelength of 632.8 nm between the laser source and the beam expander A dimmer is disposed to attenuate the intensity of the laser light source; the spatial filter of the beam expander includes a first objective lens and a pinhole, and the laser light source is focused on the pinhole through the first objective lens. 如請求項1所述之穿透式三維顯微鏡裝置,其中,該物鏡組包含一第二物鏡及一第三物鏡而形成雙物鏡形態,該待測物置於該第二物鏡及該第三物鏡的中間。The transmissive three-dimensional microscope device of claim 1, wherein the objective lens group comprises a second objective lens and a third objective lens to form a dual objective lens shape, wherein the object to be tested is placed on the second objective lens and the third objective lens intermediate. 如請求項4所述之穿透式三維顯微鏡裝置,其中,該待測物可置於一雙軸移動平臺,用以固定該待測物而供做微小橫向位移,該偏極板置於該物鏡組的該第三物鏡之鄰側。The transmissive three-dimensional microscope device according to claim 4, wherein the object to be tested is placed on a biaxial moving platform for fixing the object to be tested for slight lateral displacement, and the polarizing plate is disposed The adjacent side of the third objective lens of the objective lens group. 如請求項1所述之穿透式三維顯微鏡裝置,其中,該直角稜鏡包含兩呈等腰的一第一腰部及一第二腰部,及一斜底面;該第一腰部朝向該分光稜鏡,該穿透光束由該第一腰部進入,在該斜底面產生全反射,而由該第二腰部射出光束。The transmissive three-dimensional microscope device of claim 1, wherein the right angle 稜鏡 includes two first waist portions and a second waist portion, and a slanted bottom surface; the first waist portion faces the astigmatism The penetrating beam enters from the first waist portion, and total reflection is generated on the oblique bottom surface, and the light beam is emitted from the second waist portion. 一種穿透式三維顯微鏡量測方法,其係提供一種如請求項1所述之穿透式三維顯微鏡裝置;以該雷射光源產生一雷射光束;以該擴束器濾掉該雷射光束的雜散光,並出射收斂為一平行光束;以該物鏡組將該平行光束聚焦於一可穿透的待測物,並將穿透該待測物的光束平行輸出為一測試光束;以該偏極板調整該測試光束之偏極方向;以該分光稜鏡將該測試光束分成一反射光束與一穿透光束;以該角度感測器在臨界角附近做為微小角度感測之用,供該穿透光束至少兩次反射;以該第一影像擷取單元自該角度感測器出射的光束來擷取該待測物之具有一第一光強度的一第一影像;以該直角稜鏡供該反射光束產生全反射;及以該第二影像擷取單元自該直角稜鏡出射的光束來擷取該待測物之具有一第二光強度的一第二影像;由一數學計算軟體依該第一光強度相對該第二光強度的比值而求得該測試光束的反射率變化量,並依該反射率變化量計算出該待測物的表面高度,及描繪出該待測物的三維表面形貌。A penetrating three-dimensional microscope measuring method, which provides a penetrating three-dimensional microscope device according to claim 1, wherein a laser beam is generated by the laser light source; and the laser beam is filtered by the beam expander And the exiting light converges to a parallel beam; the parallel beam is focused by the objective lens on a penetrable object to be tested, and the beam penetrating the object to be tested is outputted in parallel as a test beam; The polarizing plate adjusts a polarization direction of the test beam; the test beam is divided into a reflected beam and a penetrating beam by the beam splitter; and the angle sensor is used for small angle sensing near a critical angle, Providing the penetrating beam at least twice; and extracting, by the first image capturing unit, the first image of the object to be tested having a first light intensity from the beam emitted from the angle sensor;稜鏡 providing a total reflection of the reflected light beam; and extracting, by the second image capturing unit, the light beam emitted from the right angle 稜鏡 to capture a second image of the object to be tested having a second light intensity; Calculating the software according to the first light intensity The ratio of the reflectance of the test beam is determined by the ratio of the second light intensity, and the surface height of the object to be tested is calculated according to the amount of change in the reflectance, and the three-dimensional surface topography of the object to be tested is drawn. 如請求項7所述之方法,其中,該角度感測器為一平行四邊形稜鏡供該反射光束做兩次反射,且該角度感測器連結設置於一可旋轉角度之旋轉台。The method of claim 7, wherein the angle sensor is a parallelogram for the reflected beam to be reflected twice, and the angle sensor is coupled to a rotating table. 如請求項7所述之方法,其中,該物鏡組包含一第二物鏡及一第三物鏡而形成雙物鏡形態,該待測物置於該第二物鏡及該第三物鏡的中間。The method of claim 7, wherein the objective lens group comprises a second objective lens and a third objective lens to form a dual objective lens shape, the test object being placed between the second objective lens and the third objective lens. 如請求項7所述之方法,其中,該待測物置於一雙軸移動平臺,供該待測物做微小橫向位移。The method of claim 7, wherein the object to be tested is placed on a biaxial moving platform for the micro lateral displacement of the object to be tested.
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