TWI433729B - Discharge apparatus and discharging method - Google Patents
Discharge apparatus and discharging method Download PDFInfo
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- TWI433729B TWI433729B TW099117941A TW99117941A TWI433729B TW I433729 B TWI433729 B TW I433729B TW 099117941 A TW099117941 A TW 099117941A TW 99117941 A TW99117941 A TW 99117941A TW I433729 B TWI433729 B TW I433729B
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- 238000000034 method Methods 0.000 title claims description 13
- 238000007599 discharging Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims description 345
- 238000005259 measurement Methods 0.000 claims description 83
- 230000007246 mechanism Effects 0.000 claims description 65
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 32
- 239000007788 liquid Substances 0.000 claims description 21
- 230000004886 head movement Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 24
- 238000013461 design Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
- B41J29/393—Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Coating Apparatus (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Optical Filters (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
本發明係關於吐出裝置及吐出方法。The present invention relates to a discharge device and a discharge method.
隨著近年來的資訊化社會的發展,更大型的液晶顯示裝置之需求提高,因此期望能提高其生產性。在彩色液晶顯示裝置,為了將顯示影像全彩化而使用濾色器。濾色器,是在基板上的既定區域以既定的圖案配置R(紅)、G(綠)、B(藍)這三色的墨水而製作出。關於墨水的吐出,大多是採用噴墨方式。With the development of an information society in recent years, the demand for larger liquid crystal display devices has increased, and it is expected to improve productivity. In a color liquid crystal display device, a color filter is used in order to fully color the display image. The color filter is produced by arranging three colors of inks of R (red), G (green), and B (blue) in a predetermined pattern on a substrate. Regarding the discharge of ink, most of the ink is discharged.
以往,許多的吐出裝置係具備:相對於基準面呈靜止的台座、可在台座上沿第一方向移動之基板移動部、可沿第二方向(與前述第一方向垂直,且與基準面平行)移動之頭部保持部。Conventionally, many discharge devices include a pedestal that is stationary with respect to a reference surface, a substrate moving portion that is movable in a first direction on the pedestal, and is movable in a second direction (perpendicular to the first direction and parallel to the reference plane) ) Moving the head holding portion.
專利文獻1所記載的裝置,是採用頭部移動方式(讓頭部保持部以在基板上掃描的方式往復移動而吐出墨水)。依據頭部移動方式,隨著基板的大型化造成墨水吐出花費更長的時間,且很難將頭部控制成能以均一之既定間隔來讓墨水降落。The apparatus described in Patent Document 1 employs a head moving method (the head holding portion reciprocates to scan the substrate to eject ink). Depending on the head movement mode, it takes a longer time for the ink to be ejected as the substrate is enlarged, and it is difficult to control the head so that the ink can be dropped at a uniform interval.
相對於頭部移動方式,在頭部保持部(相對於台座呈靜止)具有複數個吐出口而朝通過其下方的基板吐出墨水之頭部靜置方式,可解決上述的課題。The above-described problem can be solved by the head holding portion (the stationary portion with respect to the pedestal) having a plurality of discharge ports and allowing the head to discharge ink toward the substrate passing therebelow.
然而,在頭部靜置方式下,為了從吐出口將墨水朝基板上的各降落位置吐出,必須實施讓基板和頭部正確對準的作業。However, in the head rest mode, in order to discharge the ink from the discharge port to each landing position on the substrate, it is necessary to perform an operation of properly aligning the substrate and the head.
隨著基板之大型化,控制基板移動部之移動變得困難,即使在基板進入頭部下方之前進行基板和頭部的對準,在從對準位置至吐出位置沿前述第一方向移動的期間,基板移動部的方向,可能會因各軌道上之移動量的差異而產生與基準面平行之旋轉方向的傾斜(在與基準面平行的面上,相對於第一方向或第二方向的傾斜)。As the size of the substrate increases, it becomes difficult to control the movement of the substrate moving portion, and the alignment of the substrate and the head is performed even before the substrate enters the lower portion of the head, and the movement is performed in the first direction from the aligned position to the discharge position. The direction of the substrate moving portion may cause a tilt in a rotation direction parallel to the reference plane due to a difference in the amount of movement on each track (inclination with respect to the first direction or the second direction on a plane parallel to the reference plane) ).
亦即,為了從吐出口朝各降落位置將墨水吐出,必須進行的作業包括:一邊檢測並修正通過頭部下方的期間所產生之基板移動部的前述傾斜,一邊進行吐出。In other words, in order to discharge the ink from the discharge port to each of the landing positions, it is necessary to perform the work of detecting and correcting the inclination of the substrate moving portion caused by the period below the head.
[專利文獻1]日本特開平11-248925號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 11-248925
[專利文獻2]日本特開2008-238143號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-238143
[專利文獻3]日本特開2008-145203號公報[Patent Document 3] Japanese Patent Laid-Open Publication No. 2008-145203
[專利文獻4]日本特開2006-245174號公報[Patent Document 4] Japanese Laid-Open Patent Publication No. 2006-245174
本發明是為了解決上述習知技術的問題點而開發完成的,其目的是為了提供一種吐出裝置,在通過頭部下方而朝基板吐出吐出液的過程中,能使用雷射來檢測出隨著移動所產生之基板移動部之與基準面平行的旋轉方向的傾斜並予以修正。The present invention has been made to solve the above problems of the prior art, and an object of the present invention is to provide a discharge device capable of detecting a laser using a laser to discharge a discharge liquid toward a substrate. The inclination of the rotation direction of the substrate moving portion which is generated in parallel with the reference plane is corrected and corrected.
為了解決上述課題,本發明之吐出裝置,係具備:相對於基準面呈靜止的台座、在前述台座上沿第一方向配置之兩條軌道、固定在前述台座而用來保持頭部(分別設有複數個吐出口)之頭部保持部、裝載在前述兩條軌道上而能配置基板之基板移動部、以及讓前述基板移動部沿著前述兩條軌道在前述第一方向移動而能通過前述頭部保持部的下方之軌道上移動機構;從前述吐出口朝向配置在前述基板移動部上之基板吐出吐出液,讓前述吐出液的液滴降落在前述基板上;該吐出裝置係具備:沿前述第一方向分別送出第一、第二主測定光之第一、第二主送光裝置、在第二方向(與前述第一方向垂直且與前述基準面平行)上分開設置而被前述第一、第二主測定光照射時會反射而使第一、第二主反射光折返之第一、第二主鏡裝置、接收前述第一主測定光和前述第一主反射光而檢測出前述第一主測定光和前述第一主反射光的第一主干涉結果之第一主干涉裝置、接收前述第二主測定光和前述第二主反射光而檢測出前述第二主測定光和前述第二主反射光的第二主干涉結果之第二主干涉裝置、根據前述第一、第二主干涉結果來分別求出前述第一主干涉裝置和前述第一主鏡裝置間的第一主距離及前述第二主干涉裝置和前述第二主鏡裝置間的第二主距離之測定裝置、以及被傳送前述測定裝置的測定結果之控制裝置;前述第一、第二主干涉裝置和前述第一、第二主鏡裝置當中任一方的裝置是配置在前述基板移動部,另一方的裝置相對於前述台座呈靜止;前述第一、第二主干涉裝置是配置在前述第一、第二主鏡裝置和前述第一、第二主送光裝置之間;前述軌道上移動機構係具備:對前述基板移動部施加相對於前述第一軌道的第一移動力之第一移動機構、以及對前述基板移動部施加相對於前述第二軌道的第二移動力之第二移動機構;前述控制裝置是根據前述第一、第二主距離來決定前述第一、第二移動力的大小。In order to solve the above problems, the discharge device of the present invention includes a pedestal that is stationary with respect to the reference surface, two rails that are disposed in the first direction on the pedestal, and are fixed to the pedestal for holding the head (respectively provided a head holding portion having a plurality of discharge ports, a substrate moving portion on which the substrates are placed on the two tracks, and a substrate moving portion that moves in the first direction along the two tracks a rail moving mechanism below the head holding portion; a discharge liquid is discharged from the discharge port toward a substrate disposed on the substrate moving portion, and droplets of the discharge liquid are dropped on the substrate; and the discharge device includes: The first and second main light transmitting devices that respectively send the first and second main measurement lights in the first direction are separately provided in the second direction (perpendicular to the first direction and parallel to the reference surface) and are 1. The first and second main mirror devices that reflect the first and second main reflected light when the second main measurement light is irradiated, receive the first main measurement light, and the first main Detecting the first main interference device that detects the first main interference result of the first main measurement light and the first main reflected light, and receives the second main measurement light and the second main reflection light to detect the first a second main interference device that combines the second main measurement light and the second main interference result of the second main reflected light, and obtains the first main interference device and the first main mirror respectively according to the first and second main interference results a first primary distance between the devices, a second primary distance between the second primary interference device and the second primary mirror device, and a control device for transmitting the measurement results of the measurement device; the first and second The primary interference device and one of the first and second primary mirror devices are disposed on the substrate moving portion, and the other device is stationary with respect to the pedestal; the first and second primary interference devices are disposed in the foregoing Between the first and second main mirror devices and the first and second main light transmitting devices; the on-track moving mechanism includes: applying a relative to the first track to the substrate moving portion a first moving mechanism for moving the force, and a second moving mechanism for applying a second moving force to the second moving track to the substrate moving portion; wherein the control device determines the first portion according to the first and second main distances First, the size of the second moving force.
本發明之吐出裝置,前述控制裝置,是根據前述第一、第二主距離的差之設定值來控制前述第一、第二移動機構,以使前述基板移動部沿著前述兩條軌道移動。In the discharge device of the present invention, the control device controls the first and second moving mechanisms to move the substrate moving portion along the two tracks based on a set value of a difference between the first and second main distances.
本發明之吐出裝置,係具備:能使前述頭部沿前述第二方向移動的頭部移動機構、沿前述第二方向送出第一副測定光之第一副送光裝置、被前述第一副測定光照射時會反射而使第一副反射光折返之副鏡裝置、接收前述第一副測定光和前述第一副反射光而檢測出前述第一副測定光和前述第一副反射光的干涉結果之第一副干涉裝置、以及根據前述第一副干涉結果來求出前述副鏡裝置和前述第一副干涉裝置間的距離之測定裝置;前述第一副干涉裝置和前述副鏡裝置當中任一方的裝置配置在與前述基板移動部的移動方向(前述第一方向)平行的側面上,另一方裝置相對於前述台座呈靜止;前述控制裝置,是根據前述副鏡裝置和前述第一副干涉裝置間的距離來求出前述基板移動部之前述第二方向的位置,根據前述基板移動部之前述第二方向的位置和前述頭部之前述第二方向的位置之差來決定前述頭部移動機構讓前述頭部移動的移動量。The discharge device of the present invention includes: a head moving mechanism that can move the head in the second direction; a first sub-light transmitting device that sends the first sub-measurement light in the second direction, and the first sub-lighting device Measuring, by the sub-mirror device that reflects the first sub-reflected light when the light is irradiated, receives the first sub-measurement light and the first sub-reflected light, and detects the first sub-measurement light and the first sub-reflected light. a first sub-interference device that interferes with the result, and a measurement device that obtains a distance between the sub-mirror device and the first sub-interference device based on the first sub-interference result; among the first sub-interference device and the sub-mirror device One of the devices is disposed on a side parallel to the moving direction of the substrate moving portion (the first direction), and the other device is stationary with respect to the pedestal; the control device is based on the sub-mirror device and the first pair Calculating a position in the second direction of the substrate moving portion by a distance between the interference devices, and a position in the second direction of the substrate moving portion and the head portion The difference between the position of said second direction to determine the head moving mechanism so that the moving amount of the head.
本發明之吐出裝置,係具備:能使前述頭部沿前述第二方向移動的頭部移動機構、送出第一、第二副測定光之第一、第二副送光裝置、被前述第一、第二副測定光照射時會反射而使第一、第二副反射光折返之副鏡裝置、接收前述第一、第二副測定光和前述第一、第二副反射光而檢測出前述第一、第二副測定光和前述第一、第二副反射光的干涉結果之第一、第二副干涉裝置、以及根據前述第一、第二副干涉結果來求出前述副鏡裝置和前述第一、第二副干涉裝置間的距離之測定裝置;前述第一、第二副干涉裝置和前述副鏡裝置當中任一方的裝置配置在前述基板移動部,另一方裝置相對於前述台座呈靜止;前述控制裝置,是根據前述副鏡裝置和前述第一副干涉裝置間的距離及前述副鏡裝置和前述第二副干涉裝置間的距離之任一方或雙方來求出前述基板移動部之前述第二方向的位置,根據前述基板移動部之前述第二方向的位置和前述頭部之前述第二方向的位置之差來決定前述頭部移動機構讓前述頭部移動的移動量。The discharge device of the present invention includes: a head moving mechanism that can move the head in the second direction, a first and second sub-light transmitting device that sends out the first and second sub-measurements, and the first a second sub-mirror device that reflects the first and second sub-reflected lights while receiving the second sub-measurement light, and receives the first and second sub-measurement lights and the first and second sub-reflected lights to detect the foregoing First and second sub-interference devices that first and second sub-measurement light and interference results of the first and second sub-reflected lights, and the sub-mirror device and the first sub-interference device are obtained based on the first and second sub-interference results a device for measuring a distance between the first and second sub-interference devices; wherein one of the first and second sub-interference devices and the sub-mirror device is disposed in the substrate moving portion, and the other device is opposite to the pedestal The control device determines the substrate shift based on either or both of the distance between the sub-mirror device and the first sub-interference device and the distance between the sub-mirror device and the second sub-interference device. The position of the portion of the second direction in accordance with the difference between the position of the movable portion of the substrate in the second direction and the position of the head of a second direction to determine the head moving mechanism allows the head moving amount.
本發明之吐出裝置,前述控制裝置,是根據前述基板移動部之前述第二方向的位置和前述頭部之前述第二方向的位置之差之設定值來控制前述頭部移動機構,而讓前述基板移動部沿著前述兩條軌道移動。In the above-described control device, the control device is configured to control the head moving mechanism based on a set value of a difference between a position of the second moving direction of the substrate moving portion and a position of the head in the second direction. The substrate moving portion moves along the two tracks described above.
本發明之吐出方法,是在基板移動部(在隔著水平台座上的頭部互相位於相反側之起點和終點之間從前述起點往前述終點沿著兩條軌道在第一方向移動)上載置基板,讓前述基板移動部朝向前述終點移動,在前述基板通過前述頭部下方的期間,從吐出口朝前述基板吐出吐出液,當前述基板移動部到達前述終點後,讓前述基板乾燥後從前述基板移動部上將前述基板卸下;在前述基板移動部之移動前,測定前述基板移動部相對於與基準面平行的面上之前述第一方向或前述第二方向的傾斜,在前述基板移動部之移動中,測定前述基板移動部之前述傾斜,以前述基板移動部之前述傾斜在移動中產生的誤差成為零的方式分別改變前述兩條軌道上的各移動量,在使前述基板移動部的前述傾斜與移動前的前述傾斜相同的狀態下,讓前述基板通過前述頭部的下方。In the discharge method of the present invention, the substrate moving portion (moving in the first direction from the start point to the end point along the two tracks from the start point and the end point on the opposite side of the head portion on the water platform seat) is placed. The substrate moves the substrate moving portion toward the end point, and when the substrate passes under the head portion, discharges the discharge liquid from the discharge port toward the substrate, and when the substrate moving portion reaches the end point, the substrate is dried and then The substrate is removed from the substrate moving portion; and before the movement of the substrate moving portion, the tilt of the substrate moving portion with respect to the first direction or the second direction on a surface parallel to the reference surface is measured, and the substrate is moved. In the movement of the portion, the tilt of the substrate moving portion is measured, and the amount of movement on the two tracks is changed so that the error caused by the tilt of the substrate moving portion becomes zero, and the substrate moving portion is changed. The aforementioned inclination is the same as the aforementioned inclination before the movement, and the substrate is allowed to pass under the head.
本發明之吐出方法,是在前述基板移動部之移動前,測定前述基板移動部之前述第二方向的位置,在前述基板移動部之移動中,使前述基板移動部之前述傾斜與開始移動前之前述傾斜成為相同之後,測定前述基板移動部之前述第二方向的位置,以前述基板移動部之前述第二方向的位置和前述頭部之前述第二方向的位置之差與開始移動前成為相同的方式移動前述頭部,在使前述基板移動部和前述頭部間在前述第二方向的相對位置關係與移動前之相對位置關係成為相同的狀態下,讓前述基板通過前述頭部的下方。In the discharge method of the present invention, the position of the substrate moving portion in the second direction is measured before the movement of the substrate moving portion, and the tilting of the substrate moving portion and the start of movement before the movement of the substrate moving portion are performed. After the inclination is the same, the position of the substrate moving portion in the second direction is measured, and the difference between the position of the substrate moving portion in the second direction and the position of the head in the second direction is Moving the head in the same manner, the substrate is passed under the head in a state in which the relative positional relationship between the substrate moving portion and the head in the second direction is the same as the relative positional relationship before the movement. .
本發明之吐出方法,是在前述基板移動部上載置前述基板之後讓前述基板移動部移動,在前述基板進入前述頭部的下方之前,一旦靜止於前述頭部的前方位置,以前述基板上之各降落位置通過設置於前述頭部之吐出口正下方的方式進行對準。In the discharge method of the present invention, after the substrate is placed on the substrate moving portion, the substrate moving portion is moved, and before the substrate enters the lower portion of the head portion, the substrate is placed on the substrate. Each landing position is aligned by being disposed directly below the discharge port of the head.
本發明之吐出方法,在前述基板移動部和前述台座當中之任一方配置:被第一、第二主測定光照射時會反射而使第一、第二主反射光折返之第一、第二主鏡裝置,在另一方配置:接收前述第一主測定光和前述第一主反射光而檢測出前述第一主測定光和前述第一主反射光的第一主干涉結果之第一主干涉裝置、以及接收前述第二主測定光和前述第二主反射光而檢測出前述第二主測定光和前述第二主反射光的第二主干涉結果之第二主干涉裝置;根據前述第一、第二主干涉結果來求出前述第一、第二主干涉裝置和前述第一、第二主鏡裝置間之第一、第二主距離,根據前述第一、第二主距離來測定前述基板移動部之前述傾斜;在前述基板移動部和前述台座當中之任一方配置:被第一、第二副測定光照射時會反射而使第一、第二副反射光折返之副鏡裝置,在另一方配置:接收前述第一副測定光和前述第一副反射光而檢測出前述第一副測定光和前述第一副反射光的第一副干涉結果之第一副干涉裝置、以及接收前述第二副測定光和前述第二副反射光而檢測出前述第二副測定光和前述第二副反射光的第二副干涉結果之第二副干涉裝置;根據前述第一、第二副干涉結果來求出前述第一、第二副干涉裝置和前述副鏡裝置間之第一、第二副距離,根據前述第一、第二副距離之任一方或雙方來測定前述基板移動部之前述第二方向的位置。In the discharge method of the present invention, one of the substrate moving portion and the pedestal is disposed such that the first and second main reflected lights are deflected by the first and second main measurement lights, and the first and second main reflected lights are folded back. The main mirror device is configured to receive the first main interference light and the first main reflected light to detect a first main interference result of the first main measurement light and the first main reflection light of the first main reflection light And a second main interference device that receives the second main measurement light and the second main reflected light to detect a second main interference result of the second main measurement light and the second main reflection light; And obtaining, by the second main interference result, first and second main distances between the first and second main interference devices and the first and second main mirror devices, and measuring the first and second main distances The inclination of the substrate moving portion; and a sub-mirror device that reflects the first and second sub-reflected lights and is folded back when the first and second sub-measurement lights are irradiated, and is disposed in any one of the substrate moving portion and the pedestal; In another a first sub-interference device that receives the first sub-measurement light and the first sub-reflected light and detects a first sub-interference result of the first sub-measurement light and the first sub-reflected light, and receives the first a second sub-interference device that detects the second sub-interference result of the second sub-measurement light and the second sub-reflected light by the second measurement light and the second sub-reflected light; according to the first and second sub-interference results Calculating the first and second sub-distances between the first and second sub-interference devices and the sub-mirror device, and measuring the first portion of the substrate moving portion based on one or both of the first and second sub-distances The position in the second direction.
依據基板移動部(沿著二條軌道讓基板移動)在各軌道上的移動量差來檢測出與基準面平行的旋轉方向之傾斜並予以修正,因此可朝基板正確地吐出墨水,而能提昇基板製造的良率。According to the difference in the amount of movement of the substrate moving portion (moving the substrate along the two tracks) on the respective tracks, the inclination of the rotation direction parallel to the reference surface is detected and corrected, so that the ink can be accurately ejected toward the substrate, and the substrate can be lifted. Manufacturing yield.
以將吐出裝置使用在製造RGB(紅、綠、藍)濾色器的情況為一例來作說明。The case where the discharge device is used to manufacture RGB (red, green, and blue) color filters will be described as an example.
本發明並不限定於RGB濾色器的製造,例如也包含EL(電致發光)顯示元件和液晶顯示裝置的製造。The present invention is not limited to the manufacture of RGB color filters, and includes, for example, EL (electroluminescence) display elements and liquid crystal display devices.
第1圖係本發明所使用的吐出裝置10之側視圖,第2圖係俯視圖。Fig. 1 is a side view of a discharge device 10 used in the present invention, and Fig. 2 is a plan view.
吐出裝置10係具備:相對於水平基準面呈靜止的台座70、長形的第一、第二軌道71a、71b、基板移動部20、以及頭部保持部30。第一、第二軌道71a、71b是以長邊方向互相平行的方式固定在台座70上。基板移動部20配置在第一、第二軌道71a、71b。頭部保持部30,是被固定在台座70之支柱72所支承,而被固定在比第一、第二軌道71a、71b上的基板移動部20高度更高的位置。The discharge device 10 includes a pedestal 70 that is stationary with respect to a horizontal reference surface, elongated first and second rails 71a and 71b, a substrate moving portion 20, and a head holding portion 30. The first and second rails 71a and 71b are fixed to the pedestal 70 such that the longitudinal directions thereof are parallel to each other. The substrate moving portion 20 is disposed on the first and second rails 71a and 71b. The head holding portion 30 is fixed to the support 72 of the pedestal 70 and is fixed to a position higher than the height of the substrate moving portion 20 on the first and second rails 71a and 71b.
基板移動部20具有軌道上移動機構41。軌道上移動機構41是配置在第一、第二軌道71a、71b和基板移動部20之間。The substrate moving portion 20 has an on-track moving mechanism 41. The on-track moving mechanism 41 is disposed between the first and second rails 71a, 71b and the substrate moving portion 20.
軌道上移動機構41是在第一、第二軌道71a、71b上分別設有第一、第二移動機構48a、48b。第一、第二移動機構48a、48b分別接收控制裝置92所傳送的訊號時,會對基板移動部20施加相對於第一、第二軌道71a、71b之第一、第二移動力,而使基板移動部20沿著第一、第二軌道71a、71b移動。The on-track moving mechanism 41 is provided with first and second moving mechanisms 48a and 48b on the first and second rails 71a and 71b, respectively. When the first and second moving mechanisms 48a, 48b respectively receive the signals transmitted by the control device 92, the first and second moving forces with respect to the first and second tracks 71a, 71b are applied to the substrate moving portion 20, so that The substrate moving portion 20 moves along the first and second rails 71a, 71b.
第一、第二移動機構48a、48b例如是使用線性馬達。第6圖係說明軌道上移動機構41構造的一例之吐出裝置10的A-A線切斷截面圖。第一、第二移動機構48a、48b分別具備第一、第二可動電磁鐵45a、45b和複數個第一、第二固定電磁鐵46a、46b。第一、第二可動電磁鐵45a、45b固定在基板移動部20下方。複數個第一、第二固定電磁鐵46a、46b被固定成,遍及第一、第二軌道71a、71b各個的長邊方向在各軌道內等間隔地排列。The first and second moving mechanisms 48a, 48b are, for example, linear motors. Fig. 6 is a cross-sectional view taken along the line A-A of the discharge device 10 which is an example of the structure of the rail moving mechanism 41. The first and second moving mechanisms 48a and 48b include first and second movable electromagnets 45a and 45b and a plurality of first and second fixed electromagnets 46a and 46b, respectively. The first and second movable electromagnets 45a and 45b are fixed below the substrate moving portion 20. The plurality of first and second fixed electromagnets 46a and 46b are fixed so as to be arranged at equal intervals in each of the tracks in the longitudinal direction of each of the first and second rails 71a and 71b.
在基板移動部20之朝下的面上設置空氣噴出口47,藉由從空氣噴出口47噴出空氣,在基板移動部20和第一、第二軌道71a、71b可隔著空氣層而成為不接觸。An air ejection port 47 is provided on a downward surface of the substrate moving portion 20, and air is ejected from the air ejection port 47, so that the substrate moving portion 20 and the first and second rails 71a and 71b can be separated by an air layer. contact.
第一、第二移動機構48a、48b,分別收到控制裝置92所傳送的訊號時,分別使複數個第一、第二固定電磁鐵46a、46b之磁極遍及各軌道的長邊方向而改變,藉此分別對安裝有第一、第二可動電磁鐵45a、45b之基板移動部20,施加可相對於第一、第二軌道71a、71b之第一、第二移動力。由於第一、第二軌道71a、71b被固定在台座70上,若對基板移動部20施加第一、第二移動力,就能使其在第一、第二軌道71a、71b上移動。When receiving the signals transmitted from the control device 92, the first and second moving mechanisms 48a and 48b respectively change the magnetic poles of the plurality of first and second fixed electromagnets 46a and 46b in the longitudinal direction of each track. Thereby, the first and second movable forces with respect to the first and second rails 71a and 71b are applied to the substrate moving portion 20 to which the first and second movable electromagnets 45a and 45b are attached, respectively. Since the first and second rails 71a and 71b are fixed to the pedestal 70, the first and second moving forces are applied to the substrate moving portion 20, so that the first and second rails 71a and 71b can be moved.
基板移動部20,藉由沿著第一、第二軌道71a、71b移動,可在頭部保持部30的下方進行往復移動。The substrate moving portion 20 is reciprocally movable below the head holding portion 30 by moving along the first and second rails 71a and 71b.
本發明之吐出裝置10,藉由在兩條軌道(第一、第二軌道71a、71b)上讓基板移動部20移動,比起在一條軌道上讓基板移動部20移動的情況,即使基板移動部20變得大型化仍能進行穩定的移動。In the discharge device 10 of the present invention, by moving the substrate moving portion 20 on the two tracks (the first and second tracks 71a, 71b), even if the substrate moving portion 20 is moved on one track, even if the substrate moves When the portion 20 is enlarged, stable movement can be performed.
以下,將沿著第一、第二軌道71a、71b移動之基板移動部20的移動方向(第一方向)稱為y軸方向,將與其垂直而與基準面平行的方向(第二方向)稱為x軸方向。Hereinafter, the moving direction (first direction) of the substrate moving portion 20 that moves along the first and second tracks 71a and 71b is referred to as a y-axis direction, and a direction (second direction) perpendicular thereto and parallel to the reference surface is referred to as a y-axis direction. Is the x-axis direction.
頭部保持部30係具備:安裝板33、安裝在安裝板33上之複數個頭部32。The head holding portion 30 includes a mounting plate 33 and a plurality of heads 32 attached to the mounting plate 33.
第4圖係說明頭部32和吐出口35的配置之示意圖。Fig. 4 is a view showing the arrangement of the head 32 and the discharge port 35.
各頭部32具有複數個吐出口35。一個頭部32之複數個吐出口35,在該頭部32的一面排成一列而形成吐出口列,或是排成互相平行的複數列而形成互相平行之複數個吐出口列。Each head 32 has a plurality of discharge ports 35. A plurality of discharge ports 35 of one head 32 are arranged in a row on one side of the head portion 32 to form a discharge port row, or a plurality of rows parallel to each other to form a plurality of discharge port rows parallel to each other.
一個頭部32中之吐出口35是沿著一方向等間隔地配置,設該間隔為吐出口間隔(吐出口的中心間距離)D,各頭部32之吐出口間隔D彼此相等。The discharge ports 35 in one of the heads 32 are arranged at equal intervals in one direction, and the interval is the discharge port interval (the distance between the centers of the discharge ports) D, and the discharge port intervals D of the respective head portions 32 are equal to each other.
在本發明,一個頭部32之複數個吐出口列35,只要是沿著一方向等間隔地配置即可,不一定要排列在一直線上,例如第5圖所示般呈鋸齒狀排列來形成一吐出口列亦可。In the present invention, the plurality of discharge port rows 35 of one head 32 may be arranged at equal intervals in one direction, and are not necessarily arranged on a straight line, and are formed in a zigzag manner as shown in FIG. A spit out column can also be used.
在此,各頭部32,是以前述一方向與x軸方向平行的方式安裝在安裝板33上。Here, each of the head portions 32 is attached to the mounting plate 33 so that the one direction is parallel to the x-axis direction.
各頭部32,頭部之前述一方向的長度,是比吐出口列的長度(端部的吐出口中心間之前述一方向上的距離)加上吐出口間隔D的長度形成更大,因此,若將複數個頭部32排列成與x軸平行的一列且使其在y軸上的位置相同,位於一個頭部之吐出口列端部之吐出口、和位於鄰接的頭部之吐出口列端部之吐出口間在x軸方向的距離,是隔著比吐出口間隔D更大的距離。The length of each of the head portions 32 in the one direction is larger than the length of the discharge port row (the distance in the one direction from the center of the discharge port of the end portion) plus the length of the discharge port interval D. Therefore, If a plurality of heads 32 are arranged in a row parallel to the x-axis and have the same position on the y-axis, the discharge port at the end of the discharge port of one head and the discharge port at the head of the adjacent head The distance between the discharge ports of the ends in the x-axis direction is greater than the distance D between the discharge ports.
在本發明,沿著x軸方向排列之複數個頭部32,以在不同頭部之端部的吐出口間之x軸方向距離也成為吐出口間隔D的方式,將鄰接的頭部之吐出口35配置在y軸上不同的位置,又鄰接的頭部之端部在x軸上重疊,包含不同頭部的吐出口間,將各吐出口35配置成在x軸上隔著吐出口間隔D排列。In the present invention, the plurality of head portions 32 arranged along the x-axis direction are such that the distance between the discharge ports at the end portions of the different head portions is also the discharge port interval D, and the adjacent head portion is spit. The outlets 35 are disposed at different positions on the y-axis, and the end portions of the adjacent heads are overlapped on the x-axis, and the discharge ports between the different heads are included, and the discharge ports 35 are disposed so as to be spaced apart from each other across the x-axis. D arranged.
在此情況,沿著x軸排列的複數個頭部之吐出口35,可交互配置在y軸上的兩種位置上,若鄰接的頭部之吐出口列交互配置在兩種位置,如此般配置的一組複數個頭部32,是呈鋸齒狀排列而構成一頭部組38。In this case, the plurality of head discharge ports 35 arranged along the x-axis can be alternately arranged at two positions on the y-axis, and if the adjacent head discharge ports are alternately arranged in two positions, A plurality of configured heads 32 are arranged in a zigzag configuration to form a head set 38.
將複數組的頭部組38配置在安裝板33上。The header array 38 of the complex array is disposed on the mounting board 33.
既定數目(n)的頭部組38是構成頭部群,在一個頭部群中,在一個頭部組之鄰接的兩個吐出口35間,其他頭部組的吐出口35是在x軸方向以等間隔D/n的方式逐一配置。The predetermined number (n) of head groups 38 constitutes a head group, in one head group, between two adjacent discharge ports 35 of one head group, and the discharge ports 35 of the other head groups are on the x-axis. The directions are configured one by one at equal intervals of D/n.
頭部保持部30具有未圖示的墨水槽,在墨水槽貯藏R、G、B三色當中的一色墨水。各頭部32連接於墨水槽。The head holding portion 30 has an ink tank (not shown), and stores one color ink among the three colors of R, G, and B in the ink tank. Each head 32 is connected to an ink tank.
各吐出口35的內部分別具有裝滿墨水(吐出液)的墨水室,在各墨水室分別配置壓力產生裝置。各壓力產生裝置接收外部的控制裝置92所傳送之訊號,讓墨水室產生既定壓力而從吐出口35吐出既定量的墨水。Each of the discharge ports 35 has an ink chamber filled with ink (discharge liquid), and a pressure generating device is disposed in each of the ink chambers. Each of the pressure generating devices receives the signal transmitted from the external control device 92, and causes the ink chamber to generate a predetermined pressure to discharge a predetermined amount of ink from the discharge port 35.
頭部保持部30具有三個以上的頭部群的情況,各頭部32將每個頭部群連接在不同色的墨水槽,藉此能從一個頭部保持部30吐出三色的墨水。When the head holding portion 30 has three or more head groups, each head portion 32 connects each head group to an ink tank of a different color, whereby three colors of ink can be discharged from one head holding portion 30.
第7圖係吐出裝置10之B-B線切斷截面圖。Fig. 7 is a cross-sectional view taken along the line B-B of the discharge device 10.
基板移動部20具有第一、第二載置台24a、24b。第一載置台24a比第二載置台24b大,第一載置台24a配置在基板移動部20上,第二載置台24b配置在第一載置台24a上。The substrate moving unit 20 has first and second mounting stages 24a and 24b. The first mounting table 24a is larger than the second mounting table 24b, the first mounting table 24a is disposed on the substrate moving portion 20, and the second mounting table 24b is disposed on the first mounting table 24a.
第二載置台24b之朝上方的面,是形成與第一載置台24a之朝上方的面等高。The upward facing surface of the second mounting table 24b is formed to have the same height as the upward facing surface of the first mounting table 24a.
第一、第二載置台24a、24b之朝上方的面都具有未圖示的吸引口,吸引口連接於未圖示的真空泵。將基板50配置在第一、第二載置台24a、24b上(及於兩載置台)之後,藉由真空泵進行排氣,可將基板50真空吸附保持在第一、第二載置台24a、24b上。The upward facing surfaces of the first and second mounting tables 24a and 24b each have a suction port (not shown), and the suction port is connected to a vacuum pump (not shown). After the substrate 50 is placed on the first and second mounting stages 24a and 24b (and on the two mounting stages), the substrate 50 is vacuum-adsorbed and held by the first and second mounting stages 24a and 24b by evacuation by a vacuum pump. on.
本發明之吐出裝置10,如第8圖所示,將第一、第二基板50a、50b分別配置在第一、第二載置台24a、24b上亦可。將第一、第二基板50a、50b配置之後,藉由未圖示的真空泵進行排氣,可將第一、第二基板50a、50b分別真空吸附保持在第一、第二載置台24a、24b上。In the discharge device 10 of the present invention, as shown in Fig. 8, the first and second substrates 50a and 50b may be disposed on the first and second mounting stages 24a and 24b, respectively. After the first and second substrates 50a and 50b are disposed, the first and second substrates 50a and 50b are vacuum-adsorbed and held by the first and second mounting stages 24a and 24b, respectively, by evacuation by a vacuum pump (not shown). on.
參照第2、8圖,在基板50和第一、第二基板50a、50b上,分別設定有R、G、B各色應降落的區域(降落位置)。基板50和第一、第二基板50a、50b,分別具有與一方向平行和垂直之格子狀的黑色矩陣,各降落位置是配置在由黑色矩陣區畫的區域。Referring to FIGS. 2 and 8, the regions (falling positions) at which the respective colors of R, G, and B should fall are set on the substrate 50 and the first and second substrates 50a and 50b, respectively. The substrate 50 and the first and second substrates 50a and 50b each have a lattice-shaped black matrix parallel and perpendicular to one direction, and each landing position is disposed in a region drawn by the black matrix region.
基板50和第一、第二基板50a、50b之在各基板上的一方向相鄰的降落位置的間隔,是與一個頭部群中沿x軸方向鄰接的吐出口間隔D/n相同,或是形成沿x軸方向鄰接的吐出口間隔D/n之整數倍的長度。The interval between the landing position of the substrate 50 and the first and second substrates 50a and 50b adjacent to each other on one of the substrates is the same as the discharge port spacing D/n adjacent to the x-axis direction of one of the head groups, or The length is formed as an integral multiple of the discharge port spacing D/n adjacent in the x-axis direction.
吐出裝置10係具備:沿y軸方向分別送出第一、第二主測定光65a、65b之第一、第二主送光裝置、在x軸方向上分開設置而被第一、第二主測定光65a、65b照射時會反射而使第一、第二主反射光66a、66b折返之第一、第二主鏡裝置61a、61b、接收第一主測定光65a和第一主反射光66a而檢測出第一主測定光65a和第一主反射光66a的第一主干涉結果之第一主干涉裝置62a、接收第二主測定光65b和第二主反射光66b而檢測出第二主測定光65b和第二主反射光66b的第二主干涉結果之第二主干涉裝置62b。The discharge device 10 includes first and second main light-transmitting devices that respectively send the first and second main measurement lights 65a and 65b in the y-axis direction, and are separately provided in the x-axis direction to be first and second main measurement. The first and second main mirror devices 61a and 61b which are reflected when the light 65a and 65b are irradiated to fold back the first and second main reflected lights 66a and 66b receive the first main measurement light 65a and the first main reflected light 66a. The first main interference device 62a that detects the first main interference result of the first main measurement light 65a and the first main reflection light 66a, the second main measurement light 65b and the second main reflection light 66b are detected to detect the second main measurement The second main interference means 62b of the second main interference result of the light 65b and the second main reflected light 66b.
第一、第二主干涉裝置62a、62b和第一、第二主鏡裝置61a、61b當中任一方的裝置是配置在基板移動部20,另一方的裝置被固定在相對於基準面呈靜止的台座70上。The first and second main interference devices 62a, 62b and one of the first and second primary mirror devices 61a, 61b are disposed on the substrate moving portion 20, and the other device is fixed to be stationary with respect to the reference surface. On the pedestal 70.
在此,吐出裝置10係具備:至少一個光源75、第一、第二分光鏡63a、63b。光源75和第一分光鏡63a係構成第一主送光裝置,光源75和第二分光鏡63b係構成第二主送光裝置。從第一、第二主送光裝置分別送出第一、第二主測定光65a、65b。Here, the discharge device 10 includes at least one light source 75, first and second beam splitters 63a and 63b. The light source 75 and the first dichroic mirror 63a constitute a first main light transmitting means, and the light source 75 and the second dichroic mirror 63b constitute a second main light transmitting means. The first and second main measurement lights 65a and 65b are respectively sent from the first and second main light transmitting devices.
第一、第二主干涉裝置62a、62b是配置在第一、第二主鏡裝置61a、61b的鏡面和第一、第二主送光裝置之間。The first and second main interference devices 62a and 62b are disposed between the mirror surfaces of the first and second main mirror devices 61a and 61b and the first and second main light transmitting devices.
第一、第二主干涉結果被傳送至第二測定裝置93b,藉此求出第一、第二主干涉裝置62a、62b和第一、第二主鏡裝置61a、61b之間的第一、第二主距離。The first and second main interference results are transmitted to the second measuring device 93b, thereby obtaining the first between the first and second main interference devices 62a, 62b and the first and second primary mirror devices 61a, 61b, Second primary distance.
控制裝置92,若有第一、第二主距離的測定結果傳來,會根據其差值來決定第一、第二移動力的大小。When the measurement result of the first and second main distances is transmitted, the control device 92 determines the magnitudes of the first and second moving forces based on the difference.
可在控制裝置92設定第一、第二主距離的差ΔL。The difference ΔL between the first and second main distances can be set at the control device 92.
例如,在控制裝置92設定:在基板移動部20沿y軸方向開始移動前,吐出口35之x軸方向的排列和基板50上的降落位置之x軸方向的排列平行時之第一、第二主距離的差ΔL;若基板移動部20之移動中傳來之第一、第二主距離L1 、L2 的差比設定值ΔL大(L1 -L2 >ΔL),控制裝置92控制第一移動機構48a而減少第一移動力,或控制第二移動機構48b而增加第二移動力,使第二軌道71b上的移動量比第一軌道71a上的移動量更大,以使第一、第二主距離L1 、L2 的差和設定值ΔL成為相同。若第一、第二主距離L1 、L2 的差比設定值ΔL小(L1 -L2 <ΔL),控制裝置92控制第一移動機構48a而增加第一移動力,或控制第二移動機構48b而減少第二移動力,使第二軌道71b上的移動量比第一軌道71a上的移動量更小,以使第一、第二主距離L1 、L2 的差和設定值ΔL成為相同。For example, the control device 92 sets the first and the first time when the arrangement of the discharge port 35 in the x-axis direction and the arrangement of the landing position on the substrate 50 in the x-axis direction are parallel before the substrate moving portion 20 starts moving in the y-axis direction. The difference ΔL between the two main distances; if the difference between the first and second main distances L 1 and L 2 transmitted during the movement of the substrate moving portion 20 is larger than the set value ΔL (L 1 - L 2 > ΔL), the control device 92 Controlling the first moving mechanism 48a to reduce the first moving force, or controlling the second moving mechanism 48b to increase the second moving force, so that the amount of movement on the second rail 71b is larger than the amount of movement on the first rail 71a, so that The difference between the first and second main distances L 1 and L 2 and the set value ΔL are the same. If the difference between the first and second main distances L 1 , L 2 is smaller than the set value ΔL (L 1 - L 2 < ΔL), the control device 92 controls the first moving mechanism 48a to increase the first moving force, or controls the second a second moving mechanism 48b to reduce the moving force of the moving rail 71b than the second moving amount on the first rail 71a is smaller, so that the first and second main distance L 1, L 2 of the difference between the set value and ΔL becomes the same.
因此,移動中之基板移動部20相對於行進方向的方向,能維持成與開始移動前的方向相同。Therefore, the direction of the substrate moving portion 20 during movement with respect to the traveling direction can be maintained to be the same as the direction before the start of movement.
再者,由於能檢測出基板移動部20之正確的移動量,可進行正確的移動控制。Furthermore, since the correct amount of movement of the substrate moving portion 20 can be detected, accurate movement control can be performed.
以下之吐出裝置10的說明,雖是說明在基板移動部20上載置基板50的情況,但在基板移動部20上載置第一、第二基板50a、50b的情況也是相同的。In the following description of the discharge device 10, the case where the substrate 50 is placed on the substrate moving unit 20 will be described. However, the same applies to the case where the first and second substrates 50a and 50b are placed on the substrate moving unit 20.
在基板移動部20開始移動前,如後述般,讓基板移動部20上所載置的基板50旋轉,以基板50上的降落位置之x軸方向的排列和吐出口35之x軸方向的排列成為平行的方式進行角度的對準,若基板移動部20相對於行進方向的方向能維持與基板50和吐出口35進行角度對準時相同的方向,基板移動部20就會在基板50相對於吐出口35實施角度對準的狀態下沿y軸方向移動。Before the substrate moving portion 20 starts moving, as will be described later, the substrate 50 placed on the substrate moving portion 20 is rotated, and the arrangement of the landing position on the substrate 50 in the x-axis direction and the arrangement of the discharge port 35 in the x-axis direction are performed. When the alignment of the substrate moving portion 20 with respect to the traveling direction can be maintained in the same direction as when the substrate 50 and the discharge port 35 are angularly aligned, the substrate moving portion 20 is opposed to the substrate 50 in the parallel direction. The outlet 35 is moved in the y-axis direction while being angularly aligned.
因此,若基板移動部20如上述般維持方向而進行移動,基板50上之各降落位置和吐出口35(朝該降落位置將吐出液吐出)間在y軸方向的距離,是從開始移動前的值減去基板移動部20的移動量,在從吐出口35將吐出液吐出的時刻不會產生誤差。Therefore, when the substrate moving portion 20 is moved in the direction as described above, the distance between the respective landing positions on the substrate 50 and the discharge port 35 (discharged to the falling position) in the y-axis direction is before the start of the movement. The value of the substrate is reduced by the amount of movement of the substrate moving portion 20, and no error occurs at the time when the discharge liquid is discharged from the discharge port 35.
吐出裝置10係具備:沿x軸方向分別送出第一、第二副測定光65c、65d之第一、第二副送光裝置、被第一、第二副測定光65c、65d照射時會反射而使第一、第二副反射光折返之副鏡裝置61c、接收第一副測定光65c和第一副反射光而檢測出第一副測定光65c和第一副反射光的干涉結果之第一副干涉裝置62c、以及接收第二副測定光65d和第二副反射光而檢測出第二副測定光65d和第二副反射光的干涉結果之第二副干涉裝置62d。The discharge device 10 includes first and second sub-light-transmitting devices that respectively send the first and second sub-measurement lights 65c and 65d in the x-axis direction, and are reflected by the first and second sub-measurement lights 65c and 65d. The sub-mirror device 61c that folds the first and second sub-reflected lights receives the first sub-measurement light 65c and the first sub-reflected light, and detects the interference result of the first sub-measurement light 65c and the first sub-reflected light. The pair of interference devices 62c and the second sub-interference device 62d that receives the second sub-measurement light 65d and the second sub-reflected light and detects the interference result of the second sub-measurement light 65d and the second sub-reflected light.
在此,吐出裝置10係具備第三、第四分光鏡63c、63d。光源75和第三分光鏡63c係構成第一副送光裝置,光源75和第四分光鏡63d係構成第二副送光裝置。從第一、第二副送光裝置分別送出第一、第二副測定光65c、65d。Here, the discharge device 10 includes third and fourth beam splitters 63c and 63d. The light source 75 and the third beam splitter 63c constitute a first sub-light transmitting device, and the light source 75 and the fourth dichroic mirror 63d constitute a second sub-light transmitting device. The first and second sub-measurement lights 65c and 65d are respectively sent from the first and second sub-light-transmitting devices.
第一副干涉裝置62c和副鏡裝置61c當中任一方的裝置配置在:基板移動部20之與移動方向(y軸方向)平行的側面(第一副干涉裝置62c的情況是其受光面配置在前述側面,副鏡裝置61c的情況是其反射面配置在前述側面),另一方的裝置固定在相對於基準面呈靜止的台座70上。One of the first sub-interference device 62c and the sub-mirror device 61c is disposed on a side surface of the substrate moving portion 20 that is parallel to the moving direction (y-axis direction) (in the case of the first sub-interference device 62c, the light-receiving surface is disposed at In the side surface, the sub mirror device 61c has its reflection surface disposed on the side surface, and the other device is fixed to the pedestal 70 that is stationary with respect to the reference surface.
在此,第一副干涉裝置62c是設置在:台座70(相對於基準面呈靜止的)之基板移動部20的移動範圍外之側方位置,且在頭部保持部30之橫向的位置;副鏡裝置61c設置在:基板移動部20的側面且其鏡面能與前述第一副干涉裝置62c相對置。Here, the first sub-interference device 62c is disposed at a lateral position outside the range of movement of the substrate moving portion 20 of the pedestal 70 (which is stationary with respect to the reference surface), and is located laterally of the head holding portion 30; The sub mirror device 61c is provided on the side surface of the substrate moving portion 20 and has a mirror surface that can face the first sub interference device 62c.
在此,基板移動部20從起點(在基板移動部20上載置基板50的位置)開始移動,當通過頭部保持部30的下方後,到達終點(將墨水降落後的基板50從基板移動部20上卸下的位置)而結束移動。Here, the substrate moving portion 20 starts moving from the starting point (the position at which the substrate 50 is placed on the substrate moving portion 20), and passes through the lower portion of the head holding portion 30 to reach the end point (the substrate 50 from which the ink is dropped is moved from the substrate) End the movement by removing the position on the 20th).
第一副干涉裝置62c是配置在:比頭部保持部30中的吐出口35當中最接近起點之吐出口35更靠近起點的位置;副鏡裝置61c之鏡面的終點側之端部,是延伸到比基板移動部20上的基板50之最接近終點的降落位置更靠近終點的位置。The first sub-interference device 62c is disposed at a position closer to the starting point than the discharge port 35 closest to the starting point among the discharge ports 35 in the head holding portion 30, and the end portion of the end surface side of the mirror surface of the sub-mirror device 61c is extended. It is closer to the end point than the landing position closest to the end point of the substrate 50 on the substrate moving portion 20.
因此,基板50之最接近終點的降落位置,在到達比最接近起點的吐出口35更接近終點的位置之前,第一副干涉裝置62c和副鏡裝置61c的鏡面間之對置開始進行。Therefore, the landing position of the substrate 50 closest to the end point is started before the mirror end of the first sub-interference device 62c and the sub-mirror device 61c is reached before reaching the position closer to the end point than the discharge port 35 closest to the starting point.
第一副干涉結果被傳送至第二測定裝置93b,而求出第一副干涉裝置62c和副鏡裝置61c間之第一副距離。The first sub-interference result is transmitted to the second measuring device 93b, and the first sub-distance between the first sub-interference device 62c and the sub-mirror device 61c is obtained.
在控制裝置92儲存有:靜止於台座70上之第一副干涉裝置62c相對於基準面之x座標。因此,控制裝置92可根據第一副距離的測定結果,來求出基板移動部20相對於基準面之x座標(x軸方向的位置)。The control device 92 stores the x coordinate of the first sub interference device 62c resting on the pedestal 70 with respect to the reference plane. Therefore, the control device 92 can obtain the x coordinate (the position in the x-axis direction) of the substrate moving portion 20 with respect to the reference surface based on the measurement result of the first sub-distance.
如後述般,頭部保持部30係具備:將複數個頭部32一體地相對於基準面沿x軸方向移動之頭部移動機構49。頭部移動機構49之x軸方向的移動量(帶有±符號),由第一測定裝置93a測定而傳送至控制裝置92。例如,在頭部32開始移動前將第一測定裝置93a的值設定為零,若從該狀態開始讓頭部32移動,可知相對於開始移動前的位置之移動後的頭部32在x軸方向的位置。As will be described later, the head holding portion 30 includes a head moving mechanism 49 that integrally moves a plurality of head portions 32 in the x-axis direction with respect to the reference plane. The amount of movement of the head moving mechanism 49 in the x-axis direction (with a ± sign) is measured by the first measuring device 93a and transmitted to the control device 92. For example, the value of the first measuring device 93a is set to zero before the head 32 starts moving. When the head 32 is moved from this state, it can be seen that the head 32 after the movement of the position before the start of the movement is on the x-axis. The position of the direction.
控制裝置92,若有第一副距離的測定結果傳來,會根據第一副距離的測定結果來求出基板移動部20的x軸方向的位置,根據基板移動部20之x軸方向的位置和頭部32之x軸方向的位置之差來決定頭部移動機構49應讓頭部32移動的移動量。When the measurement result of the first sub-distance is transmitted, the control device 92 obtains the position of the substrate moving unit 20 in the x-axis direction based on the measurement result of the first sub-distance, and the position in the x-axis direction of the substrate moving unit 20 is obtained. The difference between the position of the head 32 and the x-axis direction determines the amount of movement of the head moving mechanism 49 to move the head 32.
例如,在基板移動部20開始移動前,將進行對準(使基板50上的降落位置能通過吐出口35正下方)時的頭部32之移動量的第一測定裝置93a的值設定為零,且將基板移動部20之x軸方向的位置設定在控制裝置92,若基板移動部20在移動中所傳送的第一副距離的值有增減,控制裝置92會按照其增減來控制頭部移動機構49而使頭部32移動,以使基板移動部20之x軸方向的位置和頭部32之x軸方向的位置之差與設定值成為相同。For example, before the substrate moving unit 20 starts moving, the value of the first measuring device 93a that performs the alignment (the position at which the landing position on the substrate 50 can pass directly below the discharge port 35) is set to zero. And the position of the substrate moving portion 20 in the x-axis direction is set to the control device 92, and if the value of the first sub-distance transmitted by the substrate moving portion 20 during the movement increases or decreases, the control device 92 controls according to the increase and decrease thereof. The head moving mechanism 49 moves the head 32 so that the difference between the position of the substrate moving portion 20 in the x-axis direction and the position of the head portion 32 in the x-axis direction is the same as the set value.
因此,移動中的基板移動部20和頭部32間之x軸方向的相對位置關係,可維持成與開始移動前相同。Therefore, the relative positional relationship between the moving substrate moving portion 20 and the head portion 32 in the x-axis direction can be maintained to be the same as before the start of the movement.
在基板移動部20即將開始移動時,如後述般,在實施基板50和吐出口35之角度對準後,使複數個頭部35一體地沿x軸方向移動,以各降落位置可通過既定吐出口35正下方的方式實施x軸方向的對準,將基板移動部20的方向維持成與前述般對準時同樣的方向,且將基板移動部20和頭部32間之x軸方向的相對位置關係維持成與x軸方向的對準時相同的話,基板移動部20,能以基板50上之各降落位置通過既定吐出口35正下方的狀態沿y軸方向移動。When the substrate moving portion 20 is about to start moving, as will be described later, after the angle between the substrate 50 and the discharge port 35 is aligned, the plurality of head portions 35 are integrally moved in the x-axis direction, and each of the landing positions can pass through the predetermined spout. The alignment in the x-axis direction is performed directly below the outlet 35, and the direction of the substrate moving portion 20 is maintained in the same direction as in the above-described general alignment, and the relative position in the x-axis direction between the substrate moving portion 20 and the head portion 32 is maintained. When the relationship is maintained in the same manner as the alignment in the x-axis direction, the substrate moving portion 20 can be moved in the y-axis direction by the state immediately below the predetermined discharge port 35 at each of the landing positions on the substrate 50.
因此,若基板移動部20能維持上述方向和位置關係而移動,在從吐出口35吐出吐出液的時刻不會產生誤差,且基板50上的既定降落位置和吐出液之實際降落位置不會產生誤差。Therefore, when the substrate moving portion 20 can be moved while maintaining the above-described direction and positional relationship, no error occurs at the time when the discharge liquid is discharged from the discharge port 35, and the predetermined landing position on the substrate 50 and the actual falling position of the discharge liquid do not occur. error.
在台座70上,在比第一副干涉裝置62c更接近終點側的位置,設置第二副干涉裝置62d。On the pedestal 70, a second sub-interference device 62d is provided at a position closer to the end point than the first sub-interference device 62c.
若基板移動部20移動,在第一副干涉裝置62c與副鏡裝置61c的鏡面相對置的期間,第二副干涉裝置62d與副鏡裝置61c間之對置開始進行,基板移動部20移動而使副鏡裝置61c之鏡面的起點側之端部移動至比第一副干涉裝置62c更接近終點側後,當依據第一副干涉裝置62c與副鏡裝置61c的鏡面相對置來進行之第一副距離的測定結束時,藉由使第二副干涉裝置62d與副鏡裝置61c的鏡面相對置,開始進行第二副干涉裝置62d和副鏡裝置61c間之第二距離的測定。When the substrate moving unit 20 moves, while the first sub-interference device 62c faces the mirror surface of the sub-mirror device 61c, the opposing between the second sub-interference device 62d and the sub-mirror device 61c starts, and the substrate moving portion 20 moves. After the end portion on the starting point side of the mirror surface of the sub-mirror device 61c is moved closer to the end point side than the first sub-interference device 62c, the first sub-interference device 62c is opposed to the mirror surface of the sub-mirror device 61c. When the measurement of the sub-distance is completed, the second sub-interference device 62d is opposed to the mirror surface of the sub-mirror device 61c, and the measurement of the second distance between the second sub-interference device 62d and the sub-mirror device 61c is started.
在控制裝置92儲存著:靜止於台座70上之第二副干涉裝置62d相對於基準面的x座標。因此,控制裝置92可根據第二副距離的測定結果,來求出基板移動部20相對於基準面之x座標(x軸方向的位置)。The control device 92 stores the x coordinate of the second sub-interference device 62d resting on the pedestal 70 with respect to the reference plane. Therefore, the control device 92 can obtain the x coordinate (the position in the x-axis direction) of the substrate moving portion 20 with respect to the reference surface based on the measurement result of the second sub-distance.
本發明並不限定於在第一副干涉裝置62c與副鏡裝置61c的鏡面之相對置結束時開始測定第二副距離的情況;在第二副干涉裝置62d與副鏡裝置61c的鏡面間之對置開始進行時就開始測定第二副距離,在第一副干涉裝置62c與副鏡裝置61c的鏡面之相對置結束前,根據第二副距離的測定結果來求出基板移動部20之x軸方向的位置亦可,或根據第一、第二副距離雙方的測定結果來求出基板移動部20之x軸方向的位置亦可。The present invention is not limited to the case where the measurement of the second sub-distance is started when the opposing faces of the first sub-interference device 62c and the mirror surface of the sub-mirror device 61c are completed; between the mirror faces of the second sub-interference device 62d and the sub-mirror device 61c When the opposing start is started, the second sub-distance is measured, and before the end of the mirror surface of the first sub-interference device 62c and the sub-mirror device 61c, the substrate moving portion 20 is obtained based on the measurement result of the second sub-distance. The position in the axial direction may be determined, or the position of the substrate moving portion 20 in the x-axis direction may be obtained from the measurement results of both the first and second sub-distances.
在此,第二副干涉裝置62d是配置在:比最接近終點之吐出口35的位置更靠近終點的位置;副鏡裝置61c之鏡面的起點側之端部,是延伸至比基板移動部20上的基板50之最接近起點的降落位置更靠近起點側。Here, the second sub-interference device 62d is disposed at a position closer to the end point than the position of the discharge port 35 closest to the end point; the end portion on the start side of the mirror surface of the sub-mirror device 61c extends to the specific substrate moving portion 20. The landing position of the upper substrate 50 closest to the starting point is closer to the starting point side.
因此,在第一副干涉裝置62c與副鏡裝置61c的鏡面間之對置開始後,迄基板50之最接近起點的降落位置到達比最接近終點之吐出口35更靠近終點的位置為止,第一、第二副干涉裝置62c、62d之任一方或雙方與副鏡裝置61c之鏡面間之對置會繼續進行,而能使基板移動部20和頭部32間之x軸方向的相對位置關係維持成x軸方向對準時的狀態。Therefore, after the first sub-interference device 62c and the mirror surface of the sub-mirror device 61c are opposed to each other, the landing position of the substrate 50 closest to the starting point reaches the position closer to the end point than the discharge port 35 closest to the end point. 1. The alignment between the mirror surface of either or both of the second sub-interference devices 62c and 62d and the mirror surface of the sub-mirror device 61c is continued, and the relative positional relationship between the substrate moving portion 20 and the head portion 32 in the x-axis direction can be made. Maintain the state when aligned in the x-axis direction.
本發明也能採用以下的構造,亦即,使副鏡裝置61c的鏡面形成比基板50之降落位置在y軸方向的排列長度和吐出口35在y軸方向的排列長度兩者的和更長,從基板50之最接近終點的降落位置到達比最接近起點的吐出口35更靠近終點的位置時開始,迄基板50之最接近起點的降落位置到達比最接近終點的吐出口35更靠近終點的位置為止,能繼續進行第一副干涉裝置62c與副鏡裝置61c的鏡面間之對置。The present invention can also adopt a configuration in which the mirror surface of the sub-mirror device 61c is formed longer than the arrangement length of the landing position of the substrate 50 in the y-axis direction and the arrangement length of the discharge port 35 in the y-axis direction. When the landing position closest to the end point of the substrate 50 reaches the position closer to the end point than the discharge port 35 closest to the starting point, the landing position closest to the starting point of the substrate 50 reaches the end point closer to the discharge port 35 closest to the end point. The position between the first sub-interference device 62c and the mirror surface of the sub-mirror device 61c can be continued until the position is reached.
此外,本發明亦可為,副鏡裝置61c是形成橫長狀,在台座70(相對於基準面呈靜止的)之基板移動部20的移動範圍外的側方位置,且在頭部保持部30之橫向的位置,以長邊方向沿著y軸方向的方式設置,而且第一、第二副干涉裝置62c、62d設置在基板移動部20上。Further, in the present invention, the sub-mirror device 61c may be formed in a laterally long position and at a lateral position outside the range of movement of the substrate moving portion 20 on the pedestal 70 (which is stationary with respect to the reference surface), and may be in the head holding portion. The lateral position of 30 is disposed along the y-axis direction in the longitudinal direction, and the first and second sub-interference devices 62c, 62d are provided on the substrate moving portion 20.
副鏡裝置61c的鏡面是朝向基板移動部20的移動範圍,當基板移動部20的一側面通過與副鏡裝置61c的鏡面對置的位置時,第一副干涉裝置62c或第二副干涉裝置62d會以與副鏡裝置61c的鏡面相對置的狀態通過。The mirror surface of the sub-mirror device 61c is a range of movement toward the substrate moving portion 20, and when the one side surface of the substrate moving portion 20 passes the position facing the mirror of the sub-mirror device 61c, the first sub-interference device 62c or the second sub-interference The device 62d passes in a state of being opposed to the mirror surface of the sub-mirror device 61c.
副鏡裝置61c之起點側的端部,是延伸至比最接近起點之吐出口35更靠近起點側的位置,同樣的,副鏡裝置61c之終點側的端部,是延伸至比最接近終點之吐出口35更靠近終點側的位置。The end portion on the starting point side of the sub-mirror device 61c extends to a position closer to the starting point side than the discharge port 35 closest to the starting point, and similarly, the end portion on the end side of the sub-mirror device 61c extends to the closest end point. The discharge port 35 is closer to the end point side.
第一副干涉裝置62c是配置在比基板50之最接近終點的降落位置更靠近終點的位置,第二副干涉裝置62d是配置在比基板50之最接近起點的降落位置更靠近起點的位置。The first sub-interference device 62c is disposed at a position closer to the end point than the landing position closest to the end point of the substrate 50, and the second sub-interference device 62d is disposed at a position closer to the starting point than the landing position closest to the starting point of the substrate 50.
因此,基板移動部20從起點開始移動,在基板50之最接近終點的降落位置到達比最接近起點的吐出口35更靠近起點的位置之前,第一副干涉裝置62c和副鏡裝置61c的鏡面間之對置開始進行,迄基板50之最接近起點的部分到達比最接近終點的吐出口35更靠近終點的位置為止,第一副干涉裝置62c或第二副干涉裝置62d和副鏡裝置61c的鏡面間之對置繼續進行,基板移動部20和頭部32間之x軸方向的相對位置關係可維持x軸方向對準時的狀態。Therefore, the substrate moving portion 20 moves from the starting point, and the mirror surface of the first sub-interference device 62c and the sub-mirror device 61c before the landing position of the substrate 50 closest to the end point reaches the position closer to the starting point than the discharge port 35 closest to the starting point. The opposite direction starts until the portion closest to the starting point of the substrate 50 reaches the position closer to the end point than the discharge port 35 closest to the end point, and the first sub-interference device 62c or the second sub-interference device 62d and the sub-mirror device 61c The opposing of the mirror surfaces continues, and the relative positional relationship between the substrate moving portion 20 and the head portion 32 in the x-axis direction can maintain the state in the x-axis direction alignment.
亦即,藉由第一、第二主干涉裝置62a、62b,可正確地檢測出基板移動部20在xy平面上之旋轉方向的傾斜(相對於xy平面上之x軸方向或y軸方向的傾斜)及y軸方向的移動量。此外,藉由第一、第二副干涉裝置62c、62d,可正確地檢測出基板移動部20之y軸方向的移動所產生之x軸方向的偏移量。That is, the inclination of the rotation direction of the substrate moving portion 20 on the xy plane can be accurately detected by the first and second main interference devices 62a, 62b (relative to the x-axis direction or the y-axis direction on the xy plane) The amount of movement in the tilt and y-axis directions. Further, the first and second sub-interference devices 62c and 62d can accurately detect the amount of shift in the x-axis direction caused by the movement of the substrate moving portion 20 in the y-axis direction.
接著說明朝基板50上吐出墨水(吐出液)之吐出步驟。Next, a discharge step of discharging ink (discharge liquid) onto the substrate 50 will be described.
以下,將吐出前在基板移動部20上載置基板50的位置稱為起點,將吐出後從基板移動部20上卸下基板50的位置稱為終點。起點和終點,是在y軸上隔著頭部保持部30互相位於相反側。Hereinafter, a position at which the substrate 50 is placed on the substrate moving portion 20 before ejection is referred to as a starting point, and a position at which the substrate 50 is detached from the substrate moving portion 20 after ejection is referred to as an end point. The start point and the end point are on the opposite side of each other across the y-axis via the head holding portion 30.
藉由後述的第一對準步驟之對準作業,使各頭部32相對於基準位置進行對準。The head portions 32 are aligned with respect to the reference position by the alignment operation of the first alignment step described later.
首先,讓基板移動部20移動至起點並靜止。在第一、第二載置台24a、24b上以及於兩載置台的方式載置基板50,進行真空吸附,以將基板50吸附保持在第一、第二載置台24a、24b上。First, the substrate moving portion 20 is moved to the starting point and is stationary. The substrate 50 is placed on the first and second mounting stages 24a and 24b and on the two mounting stages, and vacuum suction is performed to adsorb and hold the substrate 50 on the first and second mounting stages 24a and 24b.
接著,讓基板50和基板移動部20一起朝向終點移動,一旦靜止於頭部保持部30的前方之要進行基板50上之各降落位置和既定吐出口35的對準之位置。Next, the substrate 50 and the substrate moving portion 20 are moved toward the end point, and the positions of the respective landing positions on the substrate 50 and the alignment of the predetermined discharge port 35 are made to stand in front of the head holding portion 30.
像後述之第二對準步驟的對準作業那樣,藉由移動式攝影機21和第一、第二固定式攝影機31a、31b來進行基板50上之各降落位置和既定吐出口35的對準。The alignment of each of the landing positions on the substrate 50 and the predetermined discharge port 35 is performed by the mobile camera 21 and the first and second fixed cameras 31a and 31b as in the alignment operation of the second alignment step to be described later.
在對準後,第一、第二主干涉裝置62a、62b分別與第一、第二主鏡裝置61a、61b相對置,可測定第一、第二主干涉裝置62a、62b和第一、第二主鏡裝置61a、61b間的第一、第二主距離,或是根據第一、第二主距離所求出之基板移動部20相對於xy平面上的x軸方向(或y軸方向)的傾斜。After the alignment, the first and second main interference devices 62a, 62b are opposed to the first and second main mirror devices 61a, 61b, respectively, and the first and second main interference devices 62a, 62b and the first and the second can be measured. The first and second main distances between the two primary mirror devices 61a, 61b, or the substrate moving portion 20 obtained from the first and second principal distances with respect to the x-axis direction (or the y-axis direction) on the xy plane The slope.
此外,基板移動部20之x軸方向的位置,例如在基板移動部20保持靜止狀態下,將移動式攝影機21移動來拍攝設定在基準面的原點,而藉此求出。Further, the position of the substrate moving portion 20 in the x-axis direction is obtained by, for example, moving the movable camera 21 while the substrate moving portion 20 is stationary, and capturing the origin set on the reference surface.
接著,開始讓基板移動部20朝向終點移動。Next, the substrate moving portion 20 is started to move toward the end point.
根據第一、第二主距離的測定結果來控制第一、第二移動機構48a、48b,分別改變第一、第二軌道71a、71b上的移動量,而使第一、第二主距離的差、或根據第一、第二主距離的差而求出之基板移動部20相對於xy平面上的x軸方向(或y軸方向)的傾斜,與開始移動前的值相同,藉此使基板移動部20相對於行進方向的方向與開始移動前進行對準後的方向相同。Controlling the first and second moving mechanisms 48a, 48b according to the measurement results of the first and second main distances, respectively changing the amount of movement on the first and second rails 71a, 71b, and making the first and second main distances The inclination or the inclination of the substrate moving portion 20 obtained from the difference between the first and second main distances with respect to the x-axis direction (or the y-axis direction) on the xy plane is the same as the value before starting the movement, thereby making the difference The direction of the substrate moving portion 20 with respect to the traveling direction is the same as the direction after alignment is started before starting the movement.
因此,各降落位置和朝該降落位置吐出吐出液之吐出口35間在y軸方向的距離,是從開始移動前的值減去基板移動部20的移動量後的值,而能算出各降落位置通過朝該降落位置吐出吐出液之吐出口35的下方位置的時刻。Therefore, the distance in the y-axis direction between each of the landing position and the discharge port 35 for discharging the discharge liquid to the landing position is a value obtained by subtracting the amount of movement of the substrate moving portion 20 from the value before the start of the movement, and the respective landings can be calculated. The position is a time at which the lower position of the discharge port 35 of the discharge liquid is discharged toward the landing position.
在從最初吐出的吐出口35開始進行吐出之前,迄從最後吐出的吐出口35吐出吐出液為止,第一、第二副干涉裝置62c、62d之任一方或雙方與副鏡裝置61c的鏡面之相對置會繼續進行,而能測定第一、第二副干涉裝置62c、62d和副鏡裝置61c間之第一、第二副距離之任一方或雙方。One or both of the first and second sub-interference devices 62c and 62d and the mirror surface of the sub-mirror device 61c are discharged from the discharge port 35 which is discharged last until the discharge is discharged from the discharge port 35 which is discharged first. The relative position is continued, and either or both of the first and second sub-distances between the first and second sub-interference devices 62c and 62d and the sub-mirror device 61c can be measured.
根據第一、第二副距離的測定結果之任一方或雙方來求出基板移動部20在x軸方向的位置,控制頭部移動機構49讓頭部32移動,使基板移動部20之x軸方向位置和頭部32之x軸方向位置的差與開始移動前進行對準後的值相同,藉此使基板移動部20和頭部32間的x軸方向的相對位置關係與開始移動前進行對準後的關係成為相同。The position of the substrate moving portion 20 in the x-axis direction is obtained based on either or both of the measurement results of the first and second sub-distances, and the head moving mechanism 49 is controlled to move the head 32 to cause the x-axis of the substrate moving portion 20. The difference between the positional position and the position of the head 32 in the x-axis direction is the same as the value after the alignment is started, whereby the relative positional relationship between the substrate moving portion 20 and the head portion 32 in the x-axis direction is performed before the start of the movement. The relationship after alignment becomes the same.
因此,各降落位置,會通過朝該降落位置吐出吐出液之吐出口35的正下方。由於降落位置通過正下方的時刻已被算出,在所算出的時刻從各吐出口35吐出的吐出液會降落在既定的降落位置。Therefore, each landing position is directly below the discharge port 35 through which the discharge liquid is discharged toward the landing position. Since the time at which the landing position passes directly below is calculated, the discharged liquid discharged from each of the discharge ports 35 at the calculated time falls to a predetermined landing position.
若基板移動部20到達終點,在基板50上的各降落位置都有吐出液降落,在卸下位置進行乾燥後,解除真空吸附而從第一、第二載置台24a、24b上卸下基板50。When the substrate moving portion 20 reaches the end point, the discharge liquid falls on each of the landing positions on the substrate 50, and after drying at the removal position, the vacuum suction is released, and the substrate 50 is removed from the first and second mounting tables 24a and 24b. .
如第8圖所示,將第一、第二基板50a、50b分別裝載在第一、第二載置台24a、24b上,朝第一、第二基板50a、50b上吐出吐出液亦可。在此情況,是在上述吐出液的吐出方法中,藉由第二對準步驟的對準作業而使第一基板50a與頭部32對準之後,藉由後述的第三對準步驟的對準作業來進行第二基板50b與頭部32的對準,接著開始讓基板移動部20朝向終點移動。如此,第一、第二基板50a、50b能維持與頭部32對準的狀態而沿y軸方向移動,從吐出口35吐出的吐出液會降落在第一、第二基板50a、50b上之既定的降落位置。As shown in Fig. 8, the first and second substrates 50a and 50b are respectively mounted on the first and second mounting stages 24a and 24b, and the discharge liquid may be discharged onto the first and second substrates 50a and 50b. In this case, in the discharge method of the discharge liquid, after the first substrate 50a and the head portion 32 are aligned by the alignment operation of the second alignment step, the third alignment step described later is performed. The alignment of the second substrate 50b with the head portion 32 is performed in the quasi-operation, and then the substrate moving portion 20 is started to move toward the end point. As described above, the first and second substrates 50a and 50b can be moved in the y-axis direction while maintaining the state in alignment with the head portion 32, and the discharge liquid discharged from the discharge port 35 can be dropped on the first and second substrates 50a and 50b. The established landing position.
以下說明的第一對準步驟,是由原點位置對準作業、頭部陣列對準作業、固定式攝影機的攝影機基準點的位置測定作業所構成。The first alignment step described below is composed of an origin position alignment operation, a head array alignment operation, and a position measurement operation of a camera reference point of the stationary camera.
基板移動部20具有移動式攝影機21。移動式攝影機21是配置在基板移動部20之y軸方向的端部。移動式攝影機21在上端具有鏡頭,移動式攝影機21所拍攝的影像是藉由外部的控制裝置92進行影像處理。控制裝置92例如是使用電腦。The substrate moving unit 20 has a mobile camera 21. The mobile camera 21 is an end portion disposed in the y-axis direction of the substrate moving portion 20. The mobile camera 21 has a lens at the upper end, and the image captured by the mobile camera 21 is subjected to image processing by an external control device 92. The control device 92 is, for example, a computer.
對於基板移動部20,若將與基板移動部20的移動方向垂直且與基準面平行的方向稱為X方向,基板移動部20具有能讓移動式攝影機21沿X方向移動之攝影機移動機構44。在攝影機移動機構44設有馬達,若接收控制裝置92所傳送的訊號,會讓移動式攝影機21沿X方向移動。In the substrate moving portion 20, a direction perpendicular to the moving direction of the substrate moving portion 20 and parallel to the reference surface is referred to as an X direction, and the substrate moving portion 20 has a camera moving mechanism 44 that can move the moving camera 21 in the X direction. The camera moving mechanism 44 is provided with a motor, and if the signal transmitted from the control device 92 is received, the mobile camera 21 is moved in the X direction.
首先進行移動式攝影機21和原點的對準,以了解藉由移動式攝影機21所拍攝之影像上的一點相對於基準面之xy座標。First, the alignment of the mobile camera 21 and the origin is performed to understand the xy coordinate of a point on the image captured by the mobile camera 21 with respect to the reference plane.
在外部的測定裝置93設有:用來測定移動式攝影機21之x座標上的移動量(帶有±符號)之x軸方向距離測定裝置、用來測定y座標上的移動量(帶有±符號)之y軸方向距離測定裝置;移動式攝影機21在兩點間移動時,可了解連結移動的起點和終點之向量的x成分和y成分。由於測定的距離帶有符號,在往復移動而返回起點的情況之測定值為零。The external measuring device 93 is provided with an x-axis direction distance measuring device for measuring the amount of movement (with a ± sign) on the x coordinate of the mobile camera 21, and for measuring the amount of movement on the y coordinate (with ± The y-axis direction distance measuring device of the symbol); when moving between two points, the mobile camera 21 can understand the x component and the y component of the vector connecting the start point and the end point of the movement. Since the measured distance has a sign, the measured value in the case of reciprocating movement and returning to the starting point is zero.
在移動式攝影機21可拍攝的範圍之視野內,設定有在視野內不動之移動基準點。In the field of view of the range in which the mobile camera 21 can capture, a moving reference point that does not move in the field of view is set.
在該吐出裝置10,設定有相對於基準面呈靜止之xy座標的原點。In the discharge device 10, an origin of the xy coordinate which is stationary with respect to the reference surface is set.
讓移動式攝影機21移動而拍攝原點(假定移動式攝影機21是拍攝通過原點的垂線時則拍攝通過原點的垂線),當原點的影像(或通過原點之垂線的影像)與移動基準點一致時,將x軸方向距離測定裝置和y軸方向距離測定裝置的值設定為零。Let the mobile camera 21 move to capture the origin (assuming that the mobile camera 21 captures a perpendicular line passing through the origin when the vertical line passing through the origin is taken), the image of the origin (or the image passing through the perpendicular of the origin) and the movement When the reference points match, the values of the x-axis direction distance measuring device and the y-axis direction distance measuring device are set to zero.
若從該狀態開始讓移動式攝影機21移動,可了解移動式攝影機21所拍攝的影像上之與移動基準點重疊的位置相對於基準面的xy座標。When the mobile camera 21 is moved from this state, it is possible to know the xy coordinate of the position on the image captured by the mobile camera 21 that overlaps with the movement reference point with respect to the reference plane.
接著,藉由基板移動部20之y軸方向的移動和移動式攝影機21之x軸方向的移動,讓移動式攝影機21位於一個吐出口35的下方。Next, the moving camera 21 is positioned below one discharge port 35 by the movement of the substrate moving portion 20 in the y-axis direction and the movement of the moving camera 21 in the x-axis direction.
觀察移動式攝影機21的影像,當移動基準點和該吐出口35的影像中心一致時,根據測定裝置93的值來求出該吐出口35相對於基準面之xy座標。When the image of the mobile camera 21 is observed, when the moving reference point coincides with the image center of the discharge port 35, the xy coordinate of the discharge port 35 with respect to the reference surface is obtained based on the value of the measuring device 93.
對於全部的吐出口35,反覆進行上述般吐出口35相對於基準面的xy座標之測定作業。The measurement operation of the xy coordinates of the above-described discharge port 35 with respect to the reference surface is repeated for all the discharge ports 35.
各吐出口35相對於基準面之xy座標,分別具有事先的設定值。當相對於基準面之xy座標的測定值與設定值有誤差的情況,各個頭部32所具有之個別頭部位置修正手段(微動螺絲),是藉由手動或控制裝置92所傳送的訊號控制,以進行修正而使吐出口35相對於基準面之xy座標與設定值一致。修正後之各吐出口35相對於基準面之xy座標,是儲存在控制裝置92。Each of the discharge ports 35 has a predetermined setting value with respect to the xy coordinates of the reference surface. When there is an error in the measured value of the xy coordinate with respect to the reference plane and the set value, the individual head position correcting means (the jog screw) of each head 32 is controlled by the signal transmitted by the manual or control means 92. By correcting, the xy coordinates of the discharge port 35 with respect to the reference plane are matched with the set values. The corrected xy coordinates of the discharge ports 35 with respect to the reference surface are stored in the control device 92.
頭部保持部30係具有第一、第二、第三、第四固定式攝影機31a、31b、31c、31d,第一、第二、第三、第四固定式攝影機31a、31b、31c、31d是固定在頭部保持部30之y軸方向的一端。第一、第二、第三、第四固定式攝影機31a、31b、31c、31d在下端具有鏡頭,可拍攝在下方移動的基板50和第一、第二基板50a、50b。The head holding portion 30 has first, second, third, and fourth fixed cameras 31a, 31b, 31c, and 31d, and first, second, third, and fourth fixed cameras 31a, 31b, 31c, and 31d. It is fixed to one end of the head holding portion 30 in the y-axis direction. The first, second, third, and fourth stationary cameras 31a, 31b, 31c, and 31d have lenses at the lower end, and can photograph the substrate 50 and the first and second substrates 50a and 50b that move downward.
第一、第二固定式攝影機31a、31b是配置成:分別設定在第一、第二固定式攝影機31a、31b上之第一、第二攝影機基準點間的距離,是和分別設定在第一、第二基板50a、50b兩基板上之第一、第二基板基準點51a、51b間的距離相同,且設計成:連結第一、第二攝影機基準點的線與x軸方向平行。The first and second fixed cameras 31a and 31b are disposed so as to set the distance between the first and second camera reference points on the first and second fixed cameras 31a and 31b, respectively, and set the first and the first cameras respectively. The distance between the first and second substrate reference points 51a and 51b on the two substrates of the second substrates 50a and 50b is the same, and the line connecting the first and second camera reference points is designed to be parallel to the x-axis direction.
第三、第四固定式攝影機31c、31d是配置成:分別設定在第三、第四固定式攝影機31c、31d上之第三、第四攝影機基準點間的距離,是和分別設定在第二基板50b兩基板上之第三、第四基板基準點51c、51d間的距離相同,且設計成:連結第三、第四攝影機基準點的線與x軸方向平行。The third and fourth fixed cameras 31c and 31d are arranged to set the distance between the third and fourth camera reference points on the third and fourth fixed cameras 31c and 31d, respectively, and set the second and the second camera respectively. The distance between the third and fourth substrate reference points 51c and 51d on the two substrates of the substrate 50b is the same, and the line connecting the third and fourth camera reference points is designed to be parallel to the x-axis direction.
但實際上,起因於固定在頭部保持部30時的安裝誤差,第一、第二、第三、第四固定式攝影機31a、31b、31c、31d是安裝在偏離設計值的位置。Actually, however, the first, second, third, and fourth stationary cameras 31a, 31b, 31c, and 31d are mounted at positions deviated from the design value due to the mounting error when the head holding portion 30 is fixed.
第一、第二、第三、第四固定式攝影機31a、31b、31c、31d分別在鏡頭上之攝影機基準點的位置具有:可從外部藉由移動式攝影機21拍攝之固定標記。讓移動式攝影機21移動至第一固定式攝影機31a的下方。藉由移動式攝影機21所拍攝的影像上,當第一固定式攝影機31a的固定標記的影像與移動基準點一致時,根據測定裝置93的值來測定第一固定式攝影機31a之攝影機基準點相對於基準面之xy座標。以同樣的方式測定第二、第三、第四固定式攝影機31b、31c、31d之攝影機基準點相對於基準面之xy座標,分別予以儲存。The first, second, third, and fourth fixed cameras 31a, 31b, 31c, and 31d respectively have positions of the camera reference point on the lens: fixed marks that can be taken from the outside by the mobile camera 21. The mobile camera 21 is moved to the lower side of the first stationary camera 31a. When the image of the fixed mark of the first stationary camera 31a coincides with the movement reference point on the image captured by the mobile camera 21, the camera reference point of the first stationary camera 31a is measured based on the value of the measuring device 93. The xy coordinate of the reference plane. The camera reference points of the second, third, and fourth stationary cameras 31b, 31c, and 31d are measured in the same manner and stored with respect to the xy coordinates of the reference plane.
本發明並不限定於:基板50之第一、第二基板基準點51a、51b間的距離和第一、第二攝影機基準點間的距離相同,而藉由第一、第二固定式攝影機31a、31b來拍攝的情況;只要和四個固定式攝影機31a、31b、31c、31d之攝影機基準點當中兩個不同的攝影機基準點間的距離相同,而藉由對應的兩個固定式攝影機來拍攝即可。The present invention is not limited to the case where the distance between the first and second substrate reference points 51a, 51b of the substrate 50 is the same as the distance between the first and second camera reference points, and by the first and second fixed cameras 31a. The case of photographing 31b; as long as the distance between two different camera reference points among the camera reference points of the four fixed cameras 31a, 31b, 31c, 31d is the same, and the corresponding two fixed cameras are used for shooting Just fine.
以下說明第二對準步驟,是在基板50或第一基板50a之任一方(以下的說明以第一基板50a為代表)通過頭部保持部30的下方的期間,為了使基板上的各降落位置通過至少一個吐出口35的正下方而進行之對準作業。In the following, the second alignment step is described in which one of the substrate 50 or the first substrate 50a (hereinafter referred to as the first substrate 50a) passes under the head holding portion 30, in order to land each of the substrates. The alignment is performed by the position directly under the at least one discharge port 35.
藉由第一、第二固定式攝影機31a、31b所拍攝的影像,在控制裝置92進行影像處理,以了解影像內之既定位置相對於基準面之xy座標。The image captured by the first and second fixed cameras 31a, 31b is subjected to image processing by the control device 92 to know the xy coordinates of the predetermined position within the image with respect to the reference plane.
首先,讓基板移動部20沿y軸方向移動,使第一基板50a之第一、第二基板基準點51a、51b分別位於第一、第二固定式攝影機31a、31b的下方。First, the substrate moving portion 20 is moved in the y-axis direction so that the first and second substrate reference points 51a and 51b of the first substrate 50a are positioned below the first and second fixed cameras 31a and 31b, respectively.
第3(a)圖係顯示:將第一、第二固定式攝影機的影像85a、85b放在一個平面座標時之固定式攝影機影像之示意圖。Fig. 3(a) shows a schematic view of a fixed camera image when the images 85a, 85b of the first and second fixed cameras are placed in a plane coordinate.
第3(a)圖中,符號81a、81b表示第一、第二固定式攝影機31a、31b之攝影機基準點,符號82a、82b表示各個的設計值(第一、第二設計值)。符號83a、83b分別表示第一、第二固定式攝影機31a、31b所拍攝之第一、第二基板基準點51a、51b的影像。In Fig. 3(a), reference numerals 81a and 81b denote camera reference points of the first and second fixed cameras 31a and 31b, and reference numerals 82a and 82b denote respective design values (first and second design values). Symbols 83a and 83b respectively indicate images of the first and second substrate reference points 51a and 51b captured by the first and second fixed cameras 31a and 31b.
控制裝置92,是根據各點的座標經由計算而求出:通過第一、第二設計值82a、82b這兩點的直線和通過第一、第二基板基準點的影像83a、83b這兩點的直線所構成的角度θ1 之值。The control device 92 calculates, based on the coordinates of each point, the straight line passing through the first and second design values 82a and 82b and the images 83a and 83b passing through the first and second substrate reference points. The value of the angle θ 1 formed by the straight line.
由於控制裝置92了解影像內之x軸方向或y軸方向,經由計算來求出通過第一、第二基板基準點的影像83a、83b這兩點的直線和x軸方向或y軸方向所構成的角度亦可。The control device 92 knows the x-axis direction or the y-axis direction in the image, and calculates the straight line and the x-axis direction or the y-axis direction of the two points of the images 83a and 83b passing through the first and second substrate reference points by calculation. The angle can also be.
基板移動部20係具備:能讓第一載置台24a相對於基板移動部20與基準面平行地旋轉之第一基板旋轉機構42。第一基板旋轉機構42,例如是使用藉由壓縮空氣進行旋轉驅動之空氣軸承轉軸。The substrate moving unit 20 includes a first substrate rotating mechanism 42 that allows the first mounting table 24a to rotate in parallel with the reference surface with respect to the substrate moving unit 20. The first substrate rotating mechanism 42 is, for example, an air bearing rotating shaft that is rotationally driven by compressed air.
控制裝置92將旋轉訊號傳送至第一基板旋轉機構42,該訊號是為了以連結第一基板50a上之第一、第二基板基準點51a、51b的線與x軸方向平行的方式,讓第一載置台24a相對於基板移動部20與基準面平行地旋轉既定角度。The control device 92 transmits the rotation signal to the first substrate rotating mechanism 42 for making the line connecting the first and second substrate reference points 51a and 51b on the first substrate 50a parallel to the x-axis direction. The one mounting table 24a is rotated by a predetermined angle in parallel with the reference plane with respect to the substrate moving portion 20.
第一基板旋轉機構42,若接收控制裝置92所傳送的訊號,會使第一載置台24a和該第一載置台24a上所保持之第一、第二基板50a、50b相對於基板移動部20與基準面平行地旋轉既定角度。When the first substrate rotating mechanism 42 receives the signal transmitted from the control device 92, the first and second substrates 50a and 50b held on the first mounting table 24a and the first mounting table 24a are moved relative to the substrate moving portion 20. Rotate a predetermined angle in parallel with the reference plane.
旋轉移動後之第一、第二基板基準點51a、51b,經由控制裝置92進行影像處理,將其相對於基準面之xy座標儲存於控制裝置92。The first and second substrate reference points 51a and 51b after the rotational movement are subjected to image processing via the control device 92, and are stored in the control device 92 with respect to the xy coordinates of the reference surface.
在第一基板50a上,由於已經事先設定第一、第二基板基準點51a、51b和各降落位置的相對位置,根據第一、第二基板基準點51a、51b的xy座標可求出各降落位置相對於基準面之xy座標。On the first substrate 50a, since the relative positions of the first and second substrate reference points 51a, 51b and the respective landing positions have been set in advance, the respective lands can be found based on the xy coordinates of the first and second substrate reference points 51a, 51b. The position is relative to the xy coordinate of the reference plane.
各吐出口35,經由前述第一對準步驟進行對準,其相對於基準面之xy座標是儲存於控制裝置92。Each of the discharge ports 35 is aligned via the first alignment step, and the xy coordinates with respect to the reference surface are stored in the control device 92.
頭部保持部30係具有:讓安裝板33相對於頭部保持部30沿x軸方向移動之頭部保持機構49。在頭部保持機構49設置頭部移動馬達。The head holding portion 30 has a head holding mechanism 49 that moves the mounting plate 33 in the x-axis direction with respect to the head holding portion 30. A head moving motor is provided at the head holding mechanism 49.
控制裝置92,根據既定吐出口35的座標和第一基板50a上之第一、第二基板基準點51a、51b的x座標來求出誤差,為了使誤差成為零,將讓安裝板33沿x軸方向移動既定距離的訊號傳送至頭部移動機構49。The control device 92 obtains an error based on the coordinates of the predetermined discharge port 35 and the x coordinates of the first and second substrate reference points 51a and 51b on the first substrate 50a. To make the error zero, the mounting plate 33 is placed along the x. A signal for moving the predetermined distance in the axial direction is transmitted to the head moving mechanism 49.
頭部移動機構49,若接收到控制裝置92所傳送的訊號,會讓安裝板33和該安裝板33上所安裝之頭部32,相對於頭部保持部30沿x軸方向移動既定距離。When the head moving mechanism 49 receives the signal transmitted from the control device 92, the mounting plate 33 and the head 32 mounted on the mounting plate 33 are moved by a predetermined distance in the x-axis direction with respect to the head holding portion 30.
經由以上的順序完成第二對準步驟。在此狀態下,在第一基板50a通過頭部保持部30下方的期間,使第一基板50a上之各降落位置通過至少一個吐出口35的正下方。The second alignment step is completed via the above sequence. In this state, while the first substrate 50a passes under the head holding portion 30, the respective landing positions on the first substrate 50a are passed directly under the at least one discharge port 35.
以下說明第三對準步驟,是在第二基板50b通過頭部保持部30下方的期間,為了使第二基板50b上之各降落位置通過至少一個吐出口35的正下方而進行對準作業。Hereinafter, the third alignment step will be described in which the alignment operation is performed so that the respective landing positions on the second substrate 50b pass under the at least one discharge port 35 while the second substrate 50b passes under the head holding portion 30.
藉由第三、第四固定式攝影機31c、31d所拍攝的影像,在控制裝置92進行影像處理,以了解影像內之既定位置的座標。The images captured by the third and fourth fixed cameras 31c and 31d are subjected to image processing by the control device 92 to know the coordinates of the predetermined position within the image.
首先,讓基板移動部20沿y軸方向移動,使第二基板50b之第三、第四基板基準點51c、51d分別位於第三、第四固定式攝影機31c、31d的下方。First, the substrate moving portion 20 is moved in the y-axis direction, and the third and fourth substrate reference points 51c and 51d of the second substrate 50b are positioned below the third and fourth fixed cameras 31c and 31d, respectively.
第3(b)圖係顯示:將第三、第四固定式攝影機的影像85c、85d放在一個平面座標時之固定式攝影機影像之示意圖。Figure 3(b) shows a schematic view of a fixed camera image when the images 85c, 85d of the third and fourth fixed cameras are placed in a plane coordinate.
第3(b)圖中,符號81c、81d表示第三、第四固定式攝影機31c、31d之攝影機基準點,符號82c、82d表示各個的設計值(第三、第四設計值)。符號83c、83d分別表示第三、第四固定式攝影機31c、31d所拍攝之第三、第四基板基準點51c、51d的影像。In Fig. 3(b), reference numerals 81c and 81d denote camera reference points of the third and fourth fixed cameras 31c and 31d, and reference numerals 82c and 82d denote respective design values (third and fourth design values). Symbols 83c and 83d respectively indicate images of the third and fourth substrate reference points 51c and 51d captured by the third and fourth fixed cameras 31c and 31d.
控制裝置92,是根據各點的座標經由計算而求出:通過第三、第四設計值82c、82d這兩點的直線和通過第三、第四基板基準點的影像83c、83d這兩點的直線所構成的角度θ2 之值。The control device 92 calculates, based on the coordinates of each point, the straight line passing through the third and fourth design values 82c and 82d and the images 83c and 83d passing through the third and fourth substrate reference points. The value of the angle θ 2 formed by the straight line.
由於控制裝置92了解影像內之x軸方向或y軸方向,經由計算來求出通過第三、第四基板基準點的影像83c、83d這兩點的直線和x軸方向或y軸方向所構成的角度亦可。The control device 92 knows the x-axis direction or the y-axis direction in the image, and calculates the straight line and the x-axis direction or the y-axis direction of the two points of the images 83c and 83d passing through the third and fourth substrate reference points by calculation. The angle can also be.
基板移動部20係具備:能讓第二載置台24b相對於第一載置台24a與基準面平行地旋轉、且沿x軸方向移動之第二基板對準機構80。第二基板對準機構80,例如是使用xyθ載台或UVW載台之任一方。在本發明,若使用UVW載台可構成降低高度的機構,因此能確保第二載置台24b的穩定性。The substrate moving unit 20 includes a second substrate alignment mechanism 80 that can rotate the second mounting table 24b in parallel with the reference surface with respect to the first mounting table 24a and move in the x-axis direction. The second substrate alignment mechanism 80 is, for example, one of an xyθ stage or a UVW stage. According to the present invention, since the UVW stage can be used to form a mechanism for reducing the height, the stability of the second mounting table 24b can be ensured.
控制裝置92將旋轉訊號傳送至第二基板對準機構80,該訊號是為了以連結第二基板50b上之第三、第四基板基準點51c、51d的線與x軸方向平行的方式,讓第二載置台24b相對於第一載置台24a與基準面平行地旋轉既定角度。The control device 92 transmits the rotation signal to the second substrate alignment mechanism 80 for allowing the lines connecting the third and fourth substrate reference points 51c, 51d on the second substrate 50b to be parallel to the x-axis direction. The second mounting table 24b is rotated by a predetermined angle in parallel with the reference surface with respect to the first mounting table 24a.
第二基板對準機構80,若接收控制裝置92所傳送的訊號,會使第二載置台24b和該第二載置台24b上所保持之第二基板50b相對於基板移動部20與基準面平行地旋轉既定角度。The second substrate alignment mechanism 80 receives the signal transmitted from the control device 92, so that the second substrate 50b held on the second mounting table 24b and the second mounting table 24b is parallel to the reference plane with respect to the substrate moving portion 20. Rotate the ground at a given angle.
旋轉移動後之第三、第四基板基準點51c、51d,經由控制裝置92進行影像處理,將其相對於基準面之xy座標儲存於控制裝置92。The third and fourth substrate reference points 51c and 51d after the rotational movement are subjected to image processing via the control device 92, and are stored in the control device 92 with respect to the xy coordinates of the reference plane.
在第二基板50b上,由於已經事先設定第三、第四基板基準點51c、51d和各降落位置的相對位置,根據第三、第四基板基準點51c、51d的xy座標可求出各降落位置相對於基準面之xy座標。On the second substrate 50b, since the relative positions of the third and fourth substrate reference points 51c and 51d and the respective landing positions have been set in advance, the respective lands can be obtained from the xy coordinates of the third and fourth substrate reference points 51c and 51d. The position is relative to the xy coordinate of the reference plane.
各吐出口35,經由前述第一、第二對準步驟進行對準,其相對於基準面之xy座標是儲存於控制裝置92。Each of the discharge ports 35 is aligned via the first and second alignment steps, and the xy coordinates with respect to the reference surface are stored in the control device 92.
控制裝置92,根據第二基板50b上之第三、第四基板基準點51c、51d的x座標和既定吐出口35的x座標來求出誤差,為了使誤差成為零,將讓第二載置台24b沿x軸方向移動既定距離的訊號傳送至第二基板對準機構80。The control device 92 obtains an error based on the x coordinate of the third and fourth substrate reference points 51c and 51d on the second substrate 50b and the x coordinate of the predetermined discharge port 35. To make the error zero, the second stage is placed. The signal of 24b moving a predetermined distance in the x-axis direction is transmitted to the second substrate alignment mechanism 80.
第二基板對準機構80,若接收到控制裝置92所傳送的訊號,會讓第二載置台24b上所保持的第二基板50b相對於第一載置台24a沿x軸方向移動既定距離。When the second substrate alignment mechanism 80 receives the signal transmitted from the control device 92, the second substrate 50b held on the second mounting table 24b is moved by a predetermined distance in the x-axis direction with respect to the first mounting table 24a.
經由以上的順序完成第三對準步驟。在此狀態下,在第二基板50b通過頭部保持部30下方的期間,使第二基板50b上之各降落位置通過至少一個吐出口35的正下方。The third alignment step is completed via the above sequence. In this state, while the second substrate 50b passes under the head holding portion 30, the respective landing positions on the second substrate 50b are passed directly under the at least one discharge port 35.
10...吐出裝置10. . . Discharge device
20...基板移動部20. . . Substrate moving part
30...頭部保持部30. . . Head retention
32...頭部32. . . head
35...吐出口35. . . Spit
41...軌道上移動機構41. . . Moving mechanism on the track
48a、48b...第一、第二移動機構48a, 48b. . . First and second moving mechanisms
49...頭部移動機構49. . . Head moving mechanism
50...基板50. . . Substrate
61a、61b...第一、第二主鏡裝置61a, 61b. . . First and second primary mirror devices
61c...副鏡裝置61c. . . Secondary mirror device
62a、62b...第一、第二主干涉裝置62a, 62b. . . First and second main interference devices
62c、62d...第一、第二副干涉裝置62c, 62d. . . First and second sub-interference devices
70...台座70. . . Pedestal
71a、71b...第一、第二軌道71a, 71b. . . First and second tracks
92...控制裝置92. . . Control device
93a、93b...第一、第二測定裝置93a, 93b. . . First and second measuring devices
第1圖係本發明的吐出裝置之一例的側視圖。Fig. 1 is a side view showing an example of a discharge device of the present invention.
第2圖係本發明的吐出裝置之一例的俯視圖。Fig. 2 is a plan view showing an example of the discharge device of the present invention.
第3(a)圖係將第一、第二固定式攝影機的影像放在一個平面座標時之固定式攝影機的影像之示意圖;第3(b)圖係將第三、第四固定式攝影機的影像放在一個平面座標時之固定式攝影機的影像之示意圖。Figure 3(a) is a schematic diagram of the image of the fixed camera when the images of the first and second fixed cameras are placed in one plane coordinate; the third (b) is the image of the third and fourth fixed cameras A schematic representation of the image of a stationary camera when the image is placed on a plane coordinate.
第4圖係頭部和吐出口的配置之說明圖。Fig. 4 is an explanatory view of the arrangement of the head and the spout.
第5圖係將複數個吐出口呈鋸齒狀排列而形成一個吐出口列的情況之頭部和吐出口的配置之說明圖。Fig. 5 is an explanatory view showing the arrangement of the head and the discharge port in the case where a plurality of discharge ports are arranged in a zigzag manner to form one discharge port row.
第6圖係吐出裝置之A-A線切斷截面圖。Fig. 6 is a cross-sectional view showing the A-A line of the discharge device.
第7圖係吐出裝置之B-B線切斷截面圖。Fig. 7 is a cross-sectional view taken along the line B-B of the discharge device.
第8圖係載置第一、第二基板時之吐出裝置的俯視圖。Fig. 8 is a plan view of the discharge device when the first and second substrates are placed.
10...吐出裝置10. . . Discharge device
20...基板移動部20. . . Substrate moving part
21...移動式攝影機twenty one. . . Mobile camera
24a、24b...第一、第二載置台24a, 24b. . . First and second mounting platforms
30...頭部保持部30. . . Head retention
31a、31b、31c、31d...第一、第二、第三、第四固定式攝影機31a, 31b, 31c, 31d. . . First, second, third, fourth fixed camera
32...頭部32. . . head
33...安裝板33. . . Mounting plate
41...軌道上移動機構41. . . Moving mechanism on the track
42...第一基板旋轉機構42. . . First substrate rotating mechanism
44...攝影機移動機構44. . . Camera moving mechanism
48a、48b...第一、第二移動機構48a, 48b. . . First and second moving mechanisms
49...頭部移動機構49. . . Head moving mechanism
50...基板50. . . Substrate
51a、51b...第一、第二基板基準點51a, 51b. . . First and second substrate reference points
61a、61b...第一、第二主鏡裝置61a, 61b. . . First and second primary mirror devices
61c...副鏡裝置61c. . . Secondary mirror device
62a、62b...第一、第二主干涉裝置62a, 62b. . . First and second main interference devices
62c、62d...第一、第二副干涉裝置62c, 62d. . . First and second sub-interference devices
63a、63b、63c、63d...第一、第二、第三、第四分光鏡63a, 63b, 63c, 63d. . . First, second, third, and fourth beam splitters
65a、65b...第一、第二主測定光65a, 65b. . . First and second main measurement light
65c、65d...第一、第二副測定光65c, 65d. . . First and second sub-measurement light
66a、66b...第一、第二主反射光66a, 66b. . . First and second main reflected light
70...台座70. . . Pedestal
71a、71b...第一、第二軌道71a, 71b. . . First and second tracks
72...支柱72. . . pillar
75...光源75. . . light source
92...控制裝置92. . . Control device
93a、93b...第一、第二測定裝置93a, 93b. . . First and second measuring devices
Claims (9)
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