KR101207245B1 - Discharge apparatus and discharge method - Google Patents

Abstract

assignment
Provided are a discharge apparatus and a discharge method configured to detect and correct an inclination of a rotation direction on a horizontal plane of a substrate moving portion moving a substrate along two rails.
Solution
The discharge apparatus 10 of this invention has the 1st, 2nd coarse interference apparatus 62a, 62b, and the 1st, 2nd peripheral diameter devices 61a, 61b, and has it on the horizontal surface of the board | substrate moving part 20. FIG. It is configured to measure the inclination of the rotation direction. During the movement of the substrate moving part 20, the amount of movement on the two rails is controlled from the measurement result, respectively, to make the inclination the same as before the start of the movement. The discharge apparatus 10 has the 1st, 2nd subinterference apparatus 62c, 62d, and the sub diameter apparatus 61c, and is comprised so that the position of the board | substrate moving part 20 in the x-axis direction can be measured. During the movement of the substrate moving part 20, by controlling the movement of the head 32 from the measurement result, the relative positional relationship between the head 32 and the substrate moving part 20 in the x-axis direction is the same as before the start of the movement. The discharge liquid discharged from the discharge port 35 can be impacted at each impact position on the substrate 50.

Description

Dispensing apparatus and dispensing method {DISCHARGE APPARATUS AND DISCHARGE METHOD}

The present invention relates to a discharge device and a discharge method.

In recent years, with the growth of the information society, the demand for larger liquid crystal display devices has increased, and the improvement of the productivity is desired. In the color liquid crystal display device, a color filter is used to colorize the display image. The color filter is manufactured by arranging three colors of ink of R (red), G (green), and B (blue) in a predetermined pattern on a predetermined region on the substrate. Many inkjet methods are employed for ejecting ink.

Conventionally, many ejection apparatuses have a pedestal that is stationary relative to a reference plane, a substrate moving part that can move on the pedestal in a first direction, and a head retainer that can move in a second direction perpendicular to the first direction and parallel to the reference plane. Have

In the apparatus described in Patent Literature 1, a head moving system that discharges ink by reciprocating the head holding unit so as to scan the substrate is employed. In the head movement system, there is a problem that it takes a long time to eject ink in proportion to the size of the substrate, and that the head control is difficult to reach the ink at predetermined intervals without spots.

With respect to the head movement method, the head mounting method in which the head holding portion stopped relative to the pedestal has a plurality of discharge ports and discharges ink to the substrate passing therethrough has solved the above problems.

However, in the head mounting method, in order to discharge ink from the discharge port to each of the impact positions on the substrate, an operation of accurately positioning the substrate and the head is necessary.

As the size of the substrate increases, it becomes difficult to control the movement of the substrate moving portion, and the substrate is moved from the alignment position to the discharge position in the first direction even when the substrate and the head are aligned before entering the substrate below the head. There is a possibility that the inclination of the rotation direction parallel to the reference plane (the inclination with respect to the first direction or the second direction on the plane parallel to the reference plane) may occur due to the difference in the amount of movement on each rail in the direction of the moving part.

In short, in order to discharge ink from the discharge port at each impact position, the operation of discharging while detecting and correcting the inclination of the substrate moving portion generated while passing under the head is necessary.

Japanese Patent Application Laid-Open No. 11-248925 Japanese Laid-Open Patent Publication 2008-238143 Japanese Laid-Open Patent Publication No. 2008-145203 Japanese Laid-Open Patent Publication 2006-245174

The present invention has been made to solve the above problems of the prior art, the object of which is to rotate the direction parallel to the reference plane of the substrate moving portion that occurs with the movement during the discharge of the discharge liquid to the substrate passing through the lower head It is an object of the present invention to provide a discharge device configured to detect and correct an inclination of a laser using a laser.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention is a discharge apparatus, Comprising: The base which was stopped with respect to the reference plane, Two rails arrange | positioned along the 1st direction on the said base, and It fixed to the said base, respectively, The several discharge opening is formed, A head holding portion for holding a head, a substrate moving portion mounted on the two rails and capable of placing a substrate, and moving the substrate moving portion in the first direction along the two rails, A discharge apparatus having a rail moving mechanism that allows passage below, discharging a discharge liquid from the discharge port toward a substrate disposed on the substrate moving portion, and landing droplets of the discharge liquid on the substrate, wherein A first and a second main transmission device for transmitting the first and second main measurement light in a first direction, respectively, and in a second direction perpendicular to the first direction and parallel to the reference plane; A first and a second main mirror device that reflects and reflects the first and second main reflected light when the first and second main measurement light are irradiated, and the first main A first interference device for receiving measurement light and the first main reflection light and detecting a first interference result of the first main measurement light and the first main reflection light, the second main measurement light and the second measurement light A second interference device which receives main reflection light and detects a second interference result of the second principal measurement light and the second primary reflection light, and from the first and second interference results, the first interference A measuring device for obtaining a first circumferential distance between the device and the first circumferential device, a second circumferential distance between the second circumferential device and the second circumferential device, and a control in which the measurement result of the measuring device is transmitted Having a device, any one of said 1st, 2nd intercepting device, and said 1st, 2nd peripheral apparatus The apparatus of the room is disposed in the substrate moving unit, the other apparatus is stopped with respect to the pedestal, and the first and second interfering devices are the first and second peripheral apparatuses and the first and second main light beams. It is arrange | positioned between apparatuses, The said rail moving mechanism is the 1st moving mechanism which applies a 1st moving force with respect to the said 1st rail to the said board | substrate moving part, and the 2nd with respect to the said 2nd rail to the said board moving part. It has a 2nd moving mechanism which applies a moving force, and the said control apparatus is a discharge apparatus comprised so that the magnitude | size of the said 1st, 2nd movement force may be determined from the said 1st, 2nd main distance.

This invention is a discharge apparatus, The said control apparatus controls the said 1st, 2nd moving mechanism based on the set value of the difference of the said 1st, 2nd main distance, and makes the said board | substrate moving part move the two rails. It is a discharge device configured to move along.

The present invention provides a discharge device, comprising: a head moving mechanism that enables the head to move in the second direction, a first sub-light transmitting device that transmits a first sub-measuring light in the second direction, and the first sub-measuring light When the light is irradiated, the sub-diameter device reflects and reflects the first sub-reflected light, the first sub-measured light and the first sub-reflected light, and receives the first sub-measured light and the first sub-reflected light. And a first subinterference device for detecting an interference result, and a measurement device for obtaining a distance between the sub-scope device and the first sub-interference device from the first sub-interference device. Any one of the devices is disposed on a side surface parallel to the moving direction (the first direction) of the substrate moving part, the other device is stopped with respect to the pedestal, and the control device includes the secondary diameter device and the first device. Interference Device Corp The head moving mechanism moves the head from the difference between the position of the substrate moving part in the second direction and the position of the substrate moving part in the second direction and the position of the head in the second direction. It is a discharge device configured to determine the amount of movement.

The present invention provides a discharge device, comprising: a head moving mechanism that allows the head to move in the second direction, first and second sub-light transmitting devices that transmit first and second sub-measuring light, and the first and second parts. When the second sub-measuring light is irradiated, the sub-diameter apparatus reflects and reflects the first and second sub-reflection light, and receives the first and second sub-measurement light and the first and second sub-reflection light. First and second sub-interference devices for detecting the interference results of the second sub-measuring light and the first and second sub-reflection light, and the sub-scope device and the first and second sub-interferences from the first and second sub-interference results. It has a measuring apparatus which calculates the distance between two sub interference devices, The said 1st, 2nd interference device, and either one of the said sub-diameter devices are arrange | positioned at the said board | substrate moving part, and the other apparatus is with respect to the said base | board Stop, and the control device is connected between the secondary diameter device and the first secondary interference device. And a position in the second direction of the substrate moving part from any one or both of the distance between the sub-diameter device and the second sub-interference device, and the position of the substrate moving part in the second direction and the head of the head. From the difference of the position in two directions, it is a discharge apparatus comprised so that the said head movement mechanism may determine the movement amount which moves the said head.

This invention is a discharge apparatus, The said control apparatus controls the said head moving mechanism based on the set value of the difference of the position of the said 2nd direction of the said board | substrate moving part, and the position of the said 2nd direction of the head, And a discharge device configured to move the substrate moving portion along the two rails.

The present invention relates to a substrate movement between a start point and an end point positioned on opposite sides with a head on a horizontal pedestal interposed therebetween, moving in a first direction along two rails from the start point to the end point. A substrate is mounted on a portion, the substrate moving portion is moved toward the end point, and while the substrate passes below the head, a discharge liquid is discharged from the discharge port to the substrate, and the substrate moving portion arrives at the end point. Thereafter, the substrate is dried, and the ejection method of removing the substrate from the substrate moving part, wherein the first direction or the second direction on a surface parallel to the reference plane of the substrate moving part before the substrate moving part moves. The inclination of the substrate moving part is measured while the inclination of the substrate moving part is measured. The respective amounts of movement on the two rails are respectively changed so that an error generated during the movement of the inclination of the plate moving part is zero, allowing the substrate to pass under the head while making the inclination of the substrate moving part equal to the inclination before moving. It is a discharge method.

This invention is a discharge method, Comprising: The position of the said 2nd direction of the said substrate movement part is measured before the movement of the said substrate movement part, During the movement of the said substrate movement part, the said inclination of the said substrate movement part is equal to the said inclination before a movement start. After that, the position of the substrate moving part is measured in the second direction, and the head is moved so that the difference between the position of the substrate moving part in the second direction and the position of the head in the second direction is the same as before the start of the movement. It is a discharge method which makes the said board | substrate pass under the head, making the relative positional relationship of the said 2nd direction between the said substrate moving part and the said head the same as the relative positional relationship before a movement.

The present invention provides a discharge method, wherein the substrate moving portion is moved after mounting the substrate on the substrate moving portion, and once stopped at a position before the head before the substrate enters the lower side of the head, the substrate It is an ejection method for positioning so that each impact position of an image passes just under the ejection opening formed in the said head.

The present invention provides a discharge method, comprising: first and second main mirrors reflecting first and second main reflected light when the first and second main measurement light are irradiated to either one of the substrate moving part and the pedestal. A first collapsing device arranged to receive the first main measuring light and the first main reflecting light, and detecting a first interfering result of the first main measuring light and the first main reflecting light; And a second interference device for receiving the second principal measurement light and the second main reflection light and detecting a second interference result of the second main measurement light and the second main reflection light, wherein the first And first and second principal distances between the first and second peripheral apparatuses and the first and second peripheral apparatuses are obtained from a second intercepting result, and the substrate is moved from the first and second principal distances. The inclination of the part is measured, and one of the substrate moving part and the pedestal is provided. When the 1st and 2nd sub-measuring light is irradiated, the 1st and 2nd sub-reflection light reflects, and the sub-mirror apparatus which reflects the 1st and 2nd sub-reflection light is arrange | positioned, and receives the 1st sub-measuring light and said 1st sub-reflection light on the other hand, and the said 1st A first subinterference device for detecting the first subinterference result of the sub measurement light and the first sub reflection light, the second sub measurement light and the second sub reflection light, and the second sub measurement light and the second sub reflection light A second sub-interference device for detecting a second sub-interference result of the second sub-reflection light is disposed, and the first and second sub-interference devices and the sub-viewer device from the first and second sub-interference results. 2 sub-distances are calculated | required and it is a discharge method which measures the position of the said 2nd direction of the said board | substrate moving part from any one or both of the said 1st, 2nd sub-distances.

Since the inclination of the direction of rotation parallel to the reference plane due to the difference in the amount of movement on each rail of the substrate moving part moving the substrate along the two rails can be detected and corrected, it is possible to accurately eject the ink onto the substrate to manufacture the substrate. The yield is improved.

1 is a side view of an example of a discharge device of the present invention.
2 is a plan view of an example of a discharge device of the present invention.
FIG.3 (a) is a schematic diagram of the image of the fixed camera at the time of mounting the image of a 1st, 2nd fixed camera in one plane coordinate. FIG.3 (b) is a schematic diagram of the image of the fixed camera when the image of a 3rd, 4th fixed camera is mounted in one plane coordinate.
4 is a view for explaining the arrangement of the head and the discharge port.
FIG. 5 is a view for explaining the arrangement of a head and a discharge port in the case where a plurality of discharge ports are arranged in a zigzag array to form one discharge port row. FIG.
6 is a cross-sectional view taken along the line AA of the discharge device.
7 is a sectional view taken along the line BB of the discharge device.
8 is a plan view of the discharge device when the first and second substrates are mounted.

The case where a discharge apparatus is used in manufacture of an RGB (red green blue) color filter is demonstrated below as an example.

This invention is not limited to manufacture of an RGB color filter, For example, manufacture of an EL (electroluminescent) display element and a liquid crystal display device is also included.

<Structure of Discharge Device>

1 shows a side view of a discharge device 10 used in the present invention, and FIG. 2 shows a plan view.

The discharge device 10 has a pedestal 70 stationary with respect to a horizontal reference plane, long first and second rails 71a and 71b, a substrate moving part 20 and a head holding part 30. . The first and second rails 71a and 71b are fixed on the pedestal 70 so that their respective longitudinal directions are parallel to each other. The board | substrate moving part 20 is arrange | positioned on the 1st, 2nd rail 71a, 71b. The head holding part 30 is supported by the support | pillar 72 fixed to the base 70, and is being fixed to the position higher than the height of the board | substrate moving part 20 on the 1st, 2nd rail 71a, 71b.

The substrate moving part 20 has a rail moving mechanism 41. The rail moving mechanism 41 is disposed between the first and second rails 71a and 71b and the substrate moving portion 20.

The rail moving mechanism 41 has first and second moving mechanisms 48a and 48b on the first and second rails 71a and 71b, respectively. When the 1st, 2nd moving mechanism 48a, 48b receives the signal transmitted from the control apparatus 92, respectively, the 1st, 2nd movement with respect to the 1st, 2nd rail 71a, 71b to the board | substrate moving part 20. 2 moving force is applied, respectively, and the board | substrate moving part 20 is moved along the 1st, 2nd rail 71a, 71b.

For example, a linear motor is used for the first and second moving mechanisms 48a and 48b. 6 is a sectional view taken along the line A-A of the discharge device 10 for explaining an example of the structure of the rail-like moving mechanism 41. The 1st, 2nd moving mechanism 48a, 48b has the 1st, 2nd movable electromagnets 45a, 45b and the some 1st, 2nd fixed electromagnets 46a, 46b, respectively. The first and second movable electromagnets 45a and 45b are fixed below the substrate moving part 20. The plurality of first and second fixed electromagnets 46a and 46b are arranged at equal intervals in each rail and are fixed over the longitudinal direction of each of the first and second rails 71a and 71b.

The air blower opening 47 is formed in the surface facing the board | substrate moving part 20, and by blowing air from the air blower opening 47, the board | substrate moving part 20 and the 1st, 2nd rail 71a, 71b are carried out. The air layer is interposed so as not to contact.

When the 1st, 2nd moving mechanism 48a, 48b receives the signal transmitted from the control apparatus 92 separately, respectively, each of the magnetic poles of the 1st, 2nd fixed electromagnets 46a, 46b is angled, respectively. The first and the second rails 71a and 71b with respect to the first and second rails 71a and 71b in the substrate moving part 20 which are changed over the longitudinal direction of the rail and to which the first and second movable electromagnets 45a and 45b are mounted, respectively. 2 Movement force can be applied. Since the first and second rails 71a and 71b are fixed on the pedestal 70, when the first and second moving forces are applied to the substrate moving part 20, the first and second rails 71a, 71b, 71b) The phase moves.

The board | substrate moving part 20 is comprised so that reciprocation of the head holding | maintenance part 30 may be carried out by moving along the 1st, 2nd rail 71a, 71b.

When the discharge apparatus 10 of this invention moves the board | substrate moving part 20 on one rail by moving the board | substrate moving part 20 on two rails (1st, 2nd rail 71a, 71b), In contrast, even when the substrate moving part 20 is enlarged, it is possible to move stably.

Subsequently, the moving direction (first direction) of the substrate moving part 20 moving along the first and second rails 71a and 71b is the y axis direction, a direction perpendicular thereto and parallel to the reference plane (second direction). Is called the x-axis direction.

The head holding part 30 has a mounting plate 33 and a plurality of heads 32 mounted to the mounting plate 33.

4 is a schematic diagram illustrating the arrangement of the head 32 and the discharge port 35.

Each head 32 has a plurality of discharge ports 35. The plurality of discharge ports 35 of one head 32 are arranged in one row on one surface of the head 32 to form a discharge port row, or are arranged in a plurality of rows parallel to each other, The discharge port array is formed.

The ejection openings 35 in one head 32 are arranged at equal intervals in one direction, and if the interval is made into the ejection opening spacing (D: distance between the centers of the ejection openings), the ejection opening spacing D of each head 32 ) Are also the same value.

In the present invention, as long as the plurality of discharge ports 35 of one head 32 are arranged at equal intervals in one direction, they do not necessarily have to be arranged in a straight line, for example, as shown in FIG. It may be arranged in an arrangement and may form one discharge port row.

Here, each head 32 is attached to the mounting plate 33 in a direction in which the one direction is parallel to the x-axis direction.

Each head 32 is formed such that the length in one direction of the head is larger than the length of the discharge port array (the distance in the one direction between the centers of the ejection openings) added with the ejection outlet spacing D. Therefore, when the plurality of heads 32 are arranged in a line parallel to the X axis, and the positions on the y axis are the same, the discharge ports located at the discharge port row ends of one head and the discharge port row ends of the adjacent heads. The distance in the x-axis direction between the ejection openings located at is separated by a distance larger than the ejection opening interval D. FIG.

In the present invention, the plurality of heads 32 arranged along the x-axis direction have the y-axis of the ejection openings 35 of the adjacent heads so that the distance in the x-axis direction is the ejection opening spacing D even between the ejection openings of the ends of the different heads. On the x-axis, they are arranged at different positions, and end portions of adjacent heads overlap each other on the x-axis, and are arranged such that each discharge port 35 is arranged at the discharge port interval D on the x-axis, including between discharge ports of different heads.

In this case, the ejection openings 35 of the plurality of heads arranged along the x axis can be arranged at two kinds of positions on the y axis, and when the ejection opening rows of adjacent heads are alternately arranged at the two kinds of positions, One set of the plurality of heads 32 arranged as described above is arranged in a zigzag manner to constitute one head set 38.

The head set 38 has a plurality of sets arranged on the mounting plate 33.

The predetermined number n of head sets 38 constitute a head group, and among one head group, between two adjacent ejection openings 35 of one head set, an ejection opening 35 of another head set is x It is arrange | positioned one by one so that it may become equal intervals (D / n) in an axial direction.

The head holding | maintenance part 30 has the ink tank which is not shown in figure, and ink of one color among three colors of R, G, and B is stored in the ink tank. Each head 32 is connected to the ink tank.

Each discharge port 35 has an ink chamber each filled with ink (ejection liquid), and a pressure generating device is disposed in each ink chamber, respectively. Each pressure generating device receives a signal transmitted from an external control device 92, generates a predetermined pressure in the ink chamber, and discharges a predetermined amount of ink from the discharge port 35.

When the head holding portion 30 has three or more head groups, each head 32 is connected to an ink tank of a different color for each head group, so that one head holding portion 30 discharges three colors of ink. You can.

7 is a cross-sectional view taken along the line B-B of the discharge device 10.

The board | substrate moving part 20 has the 1st, 2nd mounting base 24a, 24b. The first mounting table 24a is larger than the second mounting table 24b, the first mounting table 24a is disposed on the substrate moving part 20, and the second mounting table 24b is the first mounting table ( 24a).

The surface facing upward of the 2nd mounting table 24b is formed so that it may become the same height as the surface facing upward of the 1st mounting board 24a.

Both surfaces face upward of the first and second mounting tables 24a and 24b have suction ports (not shown), and the suction ports are connected to a vacuum pump (not shown). After arranging the board | substrate 50 so that it may be caught by both mounting boards on the 1st, 2nd mounting boards 24a and 24b, and evacuating with a vacuum pump, the board | substrate 50 will be a 1st, 2nd mounting board ( Vacuum suction on 24a, 24b).

As shown in FIG. 8, the discharge apparatus 10 of this invention may arrange | position the 1st, 2nd board | substrate 50a, 50b on the 1st, 2nd mounting tables 24a, 24b, respectively. After arranging the 1st, 2nd board | substrate 50a, 50b, and evacuating with a vacuum pump not shown in figure, the 1st, 2nd board | substrate 50a, 50b will be a 1st, 2nd mounting table 24a, 24b. Are vacuum adsorbed on the substrate.

With reference to FIG.2, FIG.8, on the board | substrate 50 and the 1st, 2nd board | substrate 50a, 50b, the area | region (imposition position) to which each color of R, G, B should be impacted is determined, respectively. The substrate 50 and the first and second substrates 50a and 50b each have a black matrix having a lattice shape in a direction perpendicular to the direction parallel to one direction, and each impact position is divided by the black matrix. It is arranged in the area.

The space | interval of the impact position which adjoins each other in one direction on each board | substrate of the board | substrate 50 and the 1st, 2nd board | substrate 50a, 50b is the discharge port space | interval (D / n) which adjoins in the x-axis direction among one head group. ) Or an integer multiple of the discharge port interval D / n adjacent to the x-axis direction.

The discharge device 10 is provided to be spaced apart in the x-axis direction from the first and second main light-transmitting devices for transmitting the first and second main measurement lights 65a and 65b in the y-axis direction, respectively. When the two principal measurement lights 65a and 65b are irradiated, the first and second principal mirror devices 61a and 61b reflecting and reflecting the first and second principal reflection lights 66a and 66b, and the first principal measurement light ( A first interferometer device 62a for receiving the first main reflected light 66a and the first main reflected light 66a, and detecting a first interference result of the first main measured light 65a and the first main reflected light 66a; Second interference device 62b that receives the main measurement light 65b and the second main reflection light 66b and detects the second interference result of the second main measurement light 65b and the second main reflection light 66b. )

Any one of the first and second coarse interference devices 62a and 62b and the first and second peripheral device 61a and 61b is disposed in the substrate moving part 20, and the other device is stopped relative to the reference plane. Is fixed on the mounted pedestal 70.

Here, the discharge device 10 includes at least one light source 75 and first and second beam splitters 63a and 63b. The 1st main light transmitting apparatus is comprised by the light source 75 and the 1st beam splitter 63a, and the 2nd main light transmitting apparatus is comprised by the light source 75 and the 2nd beam splitter 63b. The first and second main measurement lights 65a and 65b are respectively transmitted from the first and second main light transmitting devices.

The 1st, 2nd coarse interference apparatus 62a, 62b is arrange | positioned between the mirror surface of the 1st, 2nd peripheral apparatuses 61a, 61b, and the 1st, 2nd main light transmission apparatus.

The first and second interference results are transmitted to the second measuring device 93b, and the first between the first and second interference devices 62a and 62b and the first and second peripheral devices 61a and 61b. , The second main distance is obtained.

The control apparatus 92 is comprised so that when the measurement result of a 1st, 2nd main distance is transmitted, the magnitude | size of a 1st, 2nd movement force will be determined from the difference.

The control device 92 can set the difference ΔL between the first and second main distances.

For example, before the start of the movement in the y-axis direction of the substrate moving part 20, the first column when the column in the x-axis direction of the discharge port 35 and the column in the x-axis direction of the impact position on the substrate 50 are parallel to each other. When the difference ΔL of the second main distance is set in the control device 92, when the difference between the first and second main distances L ₁ and L ₂ transmitted during the movement of the substrate moving part 20 becomes larger than the set value ΔL ( L ₁ -L ₂ > ΔL), the control device 92 controls the first moving mechanism 48a to reduce the first moving force, or controls the second moving mechanism 48b to increase the second moving force. Thus, the movement amount on the second rail 71b is made larger than the movement amount on the first rail 71a, and the difference between the first and second main distances L ₁ and L ₂ is equal to the set value ΔL. When the difference between the first and second main distances L ₁ , L ₂ is smaller than the set value ΔL (L ₁ -L ₂ <ΔL), the control device 92 controls the first moving mechanism 48a to increase the first moving force, or controls the second moving mechanism 48b to reduce the second moving force, thereby reducing the second rail. by reducing the amount of movement on the (71b) than the amount of movement on the first rail (71a), the first, second, has the main distance L comprises a control unit 92 _1, so as to be equal to the value ΔL is set a difference in L _2.

Therefore, the direction with respect to the advancing direction of the board | substrate moving part 20 during a movement can be kept the same as the direction before a movement start.

In addition, since the accurate movement amount of the substrate moving part 20 can be detected, accurate movement control is possible.

In the following description of the discharging device 10, the case where the substrate 50 is mounted on the substrate moving part 20 will be described. However, the first and second substrates 50a and 50b are mounted on the substrate moving part 20. The same applies when mounted.

Immediately before the start of the movement of the substrate moving part 20, the substrate 50 mounted on the substrate moving part 20 is rotated as described later, and heat in the x axis direction of the impact position on the substrate 50 is discharged ( The alignment of the angle is made so as to be parallel to the column of the x-axis direction of 35), and the direction with respect to the advancing direction of the substrate moving part 20 is the same as that of the alignment of the angle of the substrate 50 and the discharge port 35. The substrate moving portion 20 is moved in the y-axis direction while the substrate 50 is aligned at an angle with respect to the discharge port 35.

Therefore, when the substrate moving part 20 is moved while keeping the direction as described above, the distance in the y axis direction between each of the impact positions on the substrate 50 and the ejection openings 35 for discharging the ejection liquid at the impact positions, From the value before the movement start, the value is reduced by the amount of movement of the substrate moving portion 20, and no error occurs at the time of discharging the discharge liquid from the discharge port 35.

The discharge device 10 includes first and second sub-light transmitting devices for transmitting the first and second sub-measuring light 65c and 65d in the x-axis direction, and first and second sub-measuring light 65c and 65d, respectively. When it is irradiated, it receives the sub-diameter apparatus 61c which reflects and reflects the 1st, 2nd sub-reflected light, the 1st sub-measured light 65c, and the 1st sub-reflected light, and the 1st sub-measured light 65c and 1st The first sub-interference device 62c for detecting the first sub-interference result of the first sub-reflection light, the second sub-measurement light 65d and the second sub-reflection light, and receive the second sub-measurement light 65d and the second. The second sub-interference device 62d for detecting the second sub-interference result of the sub-reflection light is provided.

Here, the discharge device 10 has third and fourth beam splitters 63c and 63d. The 1st light-transmitting device is comprised by the light source 75 and the 3rd beam splitter 63c, and the 2nd light-transmitting device is comprised by the light source 75 and the 4th beam splitter 63d. The first and second sub measurement lights 65c and 65d are respectively transmitted from the first and second sub-light transmitting devices.

Any one of the first sub interference device 62c and the sub diameter device 61c is disposed on a side surface parallel to the moving direction (y axis direction) of the substrate moving part 20 (first sub interference device 62c). In the case of the light receiving surface is disposed on the side, in the case of the sub-calibration device 61c the reflection surface is disposed on the side), the other device is fixed on the pedestal 70 stationary with respect to the reference surface .

Here, the first sub-interference device 62c is a lateral position spaced apart from the moving range of the substrate moving part 20 of the pedestal 70 stationary with respect to the reference plane, and is positioned in the horizontal direction of the head holding part 30. The sub-diameter device 61c is formed at a position where the mirror surface can face the first sub-interference device 62c as the side surface of the substrate moving part 20.

Here, the substrate moving part 20 starts moving from the time point at which the substrate 50 is mounted on the substrate moving part 20, passes through below the head holding part 30, and then discharges ink. It is assumed that the substrate 50 reaches the end point, which is a position at which the substrate 50 is removed from the substrate moving portion 20, and the movement is terminated.

The 1st sub interference device 62c is arrange | positioned in the position nearer to the viewpoint than the discharge port 35 which is closest to the viewpoint among the discharge ports 35 in the head holding part 30, and the edge part side edge part of the mirror surface of the secondary diameter device 61c. Extends to the position closer to the end point than the impact position closest to the end point of the substrate 50 on the substrate moving part 20.

Therefore, before the impact position closest to the end point of the substrate 50 reaches the position closer to the end point than the discharge port 35 closest to the point in time, the mirror surface of the first subinterference device 62c and the minor diameter device 61c is mirrored. Will be started.

The first sub-interference result is transmitted to the second measuring device 93b, and the first sub-interval between the first sub-interference device 62c and the sub-scope device 61c is obtained.

In the control apparatus 92, the x coordinate with respect to the reference surface of the 1st subinterference device 62c stopped on the base 70 is stored. Therefore, the control apparatus 92 can calculate the x coordinate (position in the x axis direction) with respect to the reference plane of the substrate moving part 20 from the measurement result of the first sub-distance.

As will be described later, the head holding part 30 has a head moving mechanism 49 that is capable of moving in the x axis direction with respect to the reference plane by integrating the plurality of heads 32. The amount of movement in the x-axis direction of the head moving mechanism 49 is marked with a ± sign, measured by the first measuring device 93a, and transmitted to the control device 92. For example, if the value of the first measuring device 93a is zero before the start of the movement of the head 32 and the head 32 is moved from the state, the movement of the head 32 after the movement relative to the position before the start of the movement The position in the x-axis direction is known.

When the measurement result of a 1st sub distance is transmitted, the control apparatus 92 calculate | requires the position of the board | substrate moving part 20 in the x-axis direction from the measurement result of a 1st sub distance, and the x axis of the board | substrate moving part 20 From the difference between the position in the direction and the position in the x axis direction of the head 32, the head moving mechanism 49 is configured to determine the amount of movement to move the head 32.

For example, before the start of the movement of the substrate moving part 20, the first measuring device 93a which is the moving amount of the head 32 when the impact position on the substrate 50 is positioned to pass directly under the discharge port 35. ) Value is set to zero, and the position of the substrate moving part 20 in the x-axis direction is set in the control device 92, the value of the first sub-distance transmitted while moving the substrate moving part 20 increases or decreases. In response to the increase or decrease, the control device 92 controls the head moving mechanism 49 to move the head 32, and the position of the substrate moving part 20 in the x axis direction and the head 32 in the x axis direction. The control apparatus 92 is comprised so that the value which set the difference of the position of the same may become the same.

Therefore, the relative positional relationship in the x-axis direction between the substrate moving part 20 and the head 32 during the movement can be maintained the same as before the start of the movement.

 Immediately before the start of the movement of the substrate moving part 20, as described later, the alignment of the angle between the substrate 50 and the discharge port 35 is performed, and then the plurality of heads 35 are integrated to move in the x-axis direction. And the alignment in the x-axis direction is made such that each impact position passes just below the predetermined discharge port 35, and the direction of the substrate moving unit 20 is maintained in the same direction as the alignment as described above. If the relative positional relationship of the x-axis direction between the board | substrate moving part 20 and the head 32 is kept the same as that of the position alignment of the x-axis direction, the board | substrate moving part 20 will be each impacted position on the board | substrate 50. FIG. Is moved in the y-axis direction in the state passing directly under the predetermined discharge port 35.

Therefore, when the substrate moving part 20 moves while maintaining the above-described direction and positional relationship, no error occurs at the time of discharging the discharge liquid from the discharge port 35, and the predetermined impact position on the substrate 50 An error does not occur at the position where the discharge liquid is actually landed.

On the pedestal 70, a second sub-interference device 62d is formed at the end point side position than the first sub-interference device 62c.

When the substrate moving part 20 moves, the second sub interference device 62d starts to face the sub diameter device 61c while the first sub interference device 62c faces the mirror surface of the sub diameter device 61c. Thus, the substrate moving part 20 moves so that the mirror-viewing point side end portion of the sub-diameter device 61c moves to the end point side than the first sub-interference device 62c, so that the first sub-interference device 62c and the sub-diameter device 61c are moved. When the measurement of the first sub-distance by the mirror-facing face is completed, the second sub-interference device 62d and the sub-calibration device 61c are faced by the mirror surface of the second sub-interference device 62d and the sub-view device 61c. The measurement of the second sub-distance between them is started.

In the control apparatus 92, the x coordinate with respect to the reference surface of the second subinterference device 62d stationary on the pedestal 70 is stored. Therefore, the control apparatus 92 can calculate the x coordinate (position in the x axis direction) with respect to the reference plane of the substrate moving part 20 from the measurement result of the second sub-distance.

The present invention is not limited to the case where the measurement of the second sub-interval is started when the facing of the first secondary interference device 62c and the secondary mirror device 61c mirror surface is finished, and the second secondary interference device 62d and the secondary mirror device are started. (61c) The measurement of the second sub-distance is started until the measurement of the second sub-distance is started when the mirror-surface facing is started and the mirror surface of the first sub-interference device 62c and the mirror-viewing apparatus 61c is finished. The position of the x-axis direction of the board | substrate moving part 20 may be calculated | required, and the position of the x-axis direction of the board | substrate moving part 20 may be calculated | required from the measurement result of both the 1st, 2nd sub-distance.

Here, the second sub-interference device 62d is disposed at a position closer to the end point than the position of the discharge port 35 closest to the end point, and the viewpoint side end portion of the mirror surface of the sub-diameter device 61c is a substrate moving part ( It extends to the viewpoint side rather than the impact position closest to the viewpoint of the board | substrate 50 on 20).

Therefore, after the surface of the first mirror interference device 62c and the mirror surface device 61c mirror surface is started, the impact position closest to the starting point of the substrate 50 reaches the position closer to the end point than the discharge port 35 closest to the end point. Until this, either one or both of the first and second subinterfering devices 62c and 62d and the mirror surface of the minor diameter device 61c are continuously performed, and the substrate moving portion 20 and the head 32 are disposed. The relative positional relationship in the x-axis direction can be maintained in the state when the alignment in the x-axis direction is made.

According to the present invention, the mirror surface of the sub-diameter device 61c is formed to be longer than the sum of the column length in the y-axis direction of the impact position of the substrate 50 and the column length in the y-axis direction of the discharge port 35, and the edge of the substrate 50 From the time when the impact position close to the end point reaches a position closer to the end point than the discharge port 35 closest to the start point, the position close to the end point of the substrate 50 is closer to the end point than the discharge port 35 closest to the end point. It may be comprised so that facing of the mirror surface of the 1st sub interference device 62c and the sub diameter device 61c may be continued until it reaches | attains.

In addition, according to the present invention, the head diameter device 61c is formed to be horizontally long, and the head holding part 30 is a lateral position spaced apart from the moving range of the substrate moving part 20 of the pedestal 70 stationary with respect to the reference plane. The longitudinal direction may be formed along the y-axis direction at the horizontal position of the first direction, and the first and second subinterference devices 62c and 62d may be formed in the substrate moving part 20.

When the mirror surface of the sub-diameter device 61c is arrange | positioned toward the movement range of the board | substrate moving part 20, and when one side surface of the board | substrate moving part 20 passes through the position facing the mirror surface of the sub-diameter device 61c, The first sub-interference device 62c or the second sub-interference device 62d passes while facing the mirror surface of the sub-diameter device 61c.

The end point of the viewpoint side of the sub-diameter apparatus 61c is extended to the position closer to the viewpoint side than the discharge port 35 closest to the viewpoint, and similarly, the end point side edge part of the sub-diameter apparatus 61c has the discharge port 35 closest to the end point. It extends to a position closer to the end point.

The first sub-interference device 62c is disposed at a position closer to the end point than the impact position closest to the end point of the substrate 50, and the second sub-interference device 62d is closer than the impact position closest to the time point of the substrate 50. FIG. It is located near the viewpoint.

Therefore, before the board | substrate moving part 20 starts moving from a viewpoint and reaches the position nearer to the viewpoint than the discharge port 35 closest to the point of time, and the impact position closest to the end point of the board | substrate 50 reaches the 1st subinterference. The first part until the surface of the mirror surface of the apparatus 62c and the sub-diameter apparatus 61c starts, and the part closest to the starting point of the board | substrate 50 reaches the position closer to an end point than the discharge port 35 which is closest to the end point, The surface of the interference device 62c or the second sub-interference device 62d and the mirror surface device 61c mirror surface is continued, and the relative positional relationship in the x axis direction between the substrate moving part 20 and the head 32 is determined. It can be kept in the state when it aligned in the x-axis direction.

That is, the inclination of the rotation direction on the xy plane of the substrate moving part 20 (the inclination with respect to the x axis direction or the y axis direction on the xy plane) in the first and second interfering devices 62a and 62b, and y The amount of movement in the axial direction can be detected accurately. Moreover, the 1st, 2nd non-interference apparatus 62c, 62d can detect the deviation amount of the x-axis direction accompanying the movement of the board | substrate moving part 20 in the y-axis direction correctly.

<Ink discharge method>

The discharge process of the ink (ejection liquid) on the board | substrate 50 is demonstrated.

Below, the position which mounts the board | substrate 50 on the board | substrate moving part 20 before discharge is called a starting point, and the position which removes the board | substrate 50 from the board | substrate moving part 20 after discharge is called end point. The start point and the end point are located opposite to each other with the head holder 30 interposed on the y axis.

It is assumed that each head 32 is aligned with respect to the reference position by the positioning operation in the first positioning step described later.

First, the substrate moving part 20 is moved to a viewpoint and stopped. The board | substrate 50 is mounted on the 1st, 2nd mounting board 24a, 24b so that it may be caught by both mounting boards, and vacuum-sorption will be carried out, and the board | substrate 50 may be mounted on the 1st, 2nd mounting board 24a, 24b. Keep adsorption on.

Subsequently, the board | substrate 50 is moved toward an end point with the board | substrate moving part 20, and the position where each impact position on the board | substrate 50 in front of the head holding | maintenance part 30 and the predetermined discharge port 35 are aligned is performed. Stop at once.

Like the positioning operation in the second positioning step described later, each impact position and the predetermined discharge port 35 on the substrate 50 are transferred to the mobile camera 21 and the first and second fixed cameras 31a and 31b. By positioning.

After aligning, the first and second cogwheel devices 62a and 62b are already facing the first and second cogwheel devices 61a and 61b, respectively, and the first and second cogwheel devices 62a and 62b. ) And the x-axis direction on the xy plane of the substrate moving part 20 obtained from the first and second principal distances or the first and second principal distances between the first and second peripheral apparatuses 61a and 61b. the tilt with respect to the y-axis direction) is measured.

In addition, the position of the board | substrate moving part 20 in the x-axis direction was calculated | required by moving the moving camera 21, and image | photographing the origin set to the reference plane, for example, in the state which stopped the board | substrate moving part 20. FIG.

Next, the movement of the substrate moving part 20 is started toward the end point.

From the measurement result of a 1st, 2nd main distance, the 1st, 2nd moving mechanisms 48a and 48b are controlled and calculated | required from the difference of the 1st, 2nd main distance, or the difference of the 1st, 2nd main distance The amount of movement on the first and second rails 71a and 71b is changed so that the inclination of the substrate moving unit 20 with respect to the X-axis direction (or y-axis direction) on the xy plane becomes the same as the value before the start of the movement, The direction with respect to the advancing direction of the board | substrate moving part 20 becomes the same as the direction aligned before the start of a movement.

Therefore, the distance in the y-axis direction between each impact position and the discharge port 35 which discharges discharge liquid to the impact position is a value reduced by the movement amount of the board | substrate moving part 20 from the value before a movement start, and each The time at which the impact position passes the position below the discharge port 35 for discharging the discharge liquid to the impact position can be calculated.

Either one or both of the first and second sub-interference devices 62c, 62d and before the discharge is started from the discharge port 35 discharged first, until the discharge liquid is discharged from the discharge port 35 discharged last. The mirror surface of the secondary diameter device 61c was continuously faced, and either or both of the first and second secondary distances between the first and second secondary interference devices 62c and 62d and the secondary diameter device 61c were measured. .

From either or both of the measurement results of the first and second sub-distances, the position in the x-axis direction of the substrate moving part 20 is determined, the head moving mechanism 49 is controlled, and the substrate moving part 20 is The head 32 is moved so that the difference between the position in the x-axis direction and the position in the x-axis direction of the head 32 is equal to the value aligned before the start of movement, and thus, between the substrate moving part 20 and the head 32. The relative positional relationship in the x-axis direction is the same as the positional alignment before the start of movement.

Therefore, each impact position passes just under the discharge port 35 which discharges discharge liquid to the impact position. Since the time at which the impact position passes immediately below has already been calculated, the discharge liquid discharged from each discharge port 35 at the calculated time reaches the predetermined impact position.

When the substrate moving part 20 arrives at the end point, the discharge liquid reaches the respective impact positions on the substrate 50, and after drying at the removal position, the vacuum suction is released to release the first and second mounting tables 24a. , The substrate 50 is removed from the phase 24b).

As shown in FIG. 8, the 1st, 2nd board | substrate 50a, 50b is mounted on the 1st, 2nd mounting boards 24a, 24b, respectively, and the earth | waist on the 1st, 2nd board | substrate 50a, 50b is shown. The output liquid may be discharged. In this case, in the discharge method of the discharge liquid, immediately after the first substrate 50a and the head 32 are aligned by the positioning operation of the second alignment process, the third alignment process described later will be performed. The second substrate 50b and the head 32 are aligned by the positioning operation, and then the movement of the substrate moving portion 20 is started toward the end point. In this way, the 1st, 2nd board | substrate 50a, 50b is moved to the y-axis direction, maintaining the alignment state with the head 32, and the discharge liquid discharged from the discharge port 35 is a 1st, 2nd board | substrate ( It arrives at the predetermined impact position on 50a, 50b).

<First positioning process>

Hereinafter, a first positioning process consisting of an origin positioning operation, a head array positioning operation, and a positioning measurement operation of a camera reference point of the fixed camera will be described.

The substrate moving part 20 has a moving camera 21. The moving camera 21 is arrange | positioned at the stage of the y-axis direction of the board | substrate moving part 20. As shown in FIG. The mobile camera 21 has a lens on the upper end, and the image photographed by the mobile camera 21 is image-processed by the external control device 92. A computer is used for the control apparatus 92, for example.

When the direction perpendicular to the moving direction of the substrate moving part 20 with respect to the substrate moving part 20 and parallel to the reference plane is called the X direction, the substrate moving part 20 can move the moving camera 21 in the X direction. It has the camera movement mechanism 44 which exists. The motor is formed in the camera movement mechanism 44, and when receiving the signal transmitted from the control apparatus 92, the movement camera 21 is moved to a X direction.

<Origin Position Alignment>

First, the positioning of the origin with the mobile camera 21 is performed so that the xy coordinate with respect to the reference plane of one point on the image photographed by the mobile camera 21 can be known.

The external measuring device 93 includes an X-axis distance measuring device that measures the movement amount on the x coordinate of the mobile camera 21 by ± sign, and a y-axis distance measurement that measures the movement amount on the y coordinate by ± sign. An apparatus is provided, and when the mobile camera 21 moves between two points, it becomes possible to know the x component and the y component of the vector which connect the starting point and the end point of the movement. Since the distance to be measured is indicated by a sign, the measured value at the time of returning to the starting point after reciprocating is zero.

In the visual field which is the range which can image | photograph the mobile camera 21, the floating moving reference point is determined in the visual field.

In this discharge apparatus 10, the origin of the xy coordinate stopped with respect to the reference plane is determined.

When the mobile camera 21 is moved and the home line or the vertical line passing through the origin is assumed to be photographed by the mobile camera 21, the vertical line passing through the origin is photographed, so that the image of the origin or the vertical line passing through the origin is displayed. When it coincides with a movement reference point, the values of the X-axis direction measuring device and the Y-direction distance measuring device are zero.

When the moving camera 21 moves from this state, the xy coordinate with respect to the reference plane of the position overlapping with the moving reference point on the image photographed by the moving camera 21 can be known.

<Head array alignment operation>

Next, the movement camera 21 is positioned under one discharge port 35 by the movement in the y axis direction of the substrate moving part 20 and the movement in the X direction of the movement camera 21.

When the image of the moving camera 21 is seen and the center of the image of the discharge reference point 35 and the moving reference point coincide, the xy coordinate with respect to the reference plane of the discharge port 35 is obtained from the value of the measuring device 93. .

The measurement operation of the xy coordinate with respect to the reference plane of the discharge port 35 is repeated at all the discharge ports 35.

As for the xy coordinate with respect to the reference plane of each discharge port 35, a preset value is predetermined, respectively. When the measured value of the xy coordinate with respect to the reference plane differs from the set value, the individual head position correcting means (microscopic screw) of each head 32 is connected to a signal transmitted from the human hand or the control device 92. Is controlled, and is modified so that the xy coordinate with respect to the reference plane of the discharge port 35 coincides with the set value. After the correction, the xy coordinate with respect to the reference plane of each discharge port 35 is stored in the control device 92.

<Measurement of position of camera reference point of fixed camera>

The head holding | maintenance part 30 has the 1st, 2nd, 3rd, and 4th fixed camera 31a, 31b, 31c, 31d. The 1st, 2nd, 3rd, and 4th fixed cameras 31a, 31b, 31c, and 31d are being fixed to the one end of the head holding part 30 in the y-axis direction. Since the 1st, 2nd, 3rd, and 4th fixed cameras 31a, 31b, 31c, and 31d have a lens in the lower end, the board | substrate 50 which moves below and the 1st, 2nd board | substrate 50a, 50b) can be taken.

In the arrangement of the first and second fixed cameras 31a and 31b, the distance between the first and second camera reference points set in the first and second fixed cameras 31a and 31b, respectively, is equal to that of the substrate 50 and the first substrate. The line segments connecting the first and second camera reference points are designed to be parallel to the x-axis direction in the same manner as the distance between the first and second substrate reference points 51a and 51b which both substrates of 50a respectively have. .

In the arrangement of the third and fourth fixed cameras 31c and 31d, the distance between the third and fourth camera reference points set in the third and fourth fixed cameras 31c and 31d respectively has the second substrate 50b. In the same manner as the distance between the third and fourth substrate reference points 51c and 51d, the line segments connecting the third and fourth camera reference points are designed to be parallel to the x axis direction.

In reality, however, the first, second, third, and fourth fixed cameras 31a, 31b, 31c, and 31d are mounted at positions deviated from the design values due to mounting errors when they are fixed to the head holding unit 30. It is.

The 1st, 2nd, 3rd, and 4th fixed cameras 31a, 31b, 31c, and 31d have the fixed mark which can image with the mobile camera 21 from the outside at the position of the camera reference point on each lens. . The moving camera 21 is moved and positioned below the first fixed camera 31a. On the image photographed by the mobile camera 21, when the image of the fixed mark of the first fixed camera 31a coincides with the moving reference point, from the value of the measuring device 93, the camera reference point of the first fixed camera 31a The xy coordinate for the reference plane of is measured. The xy coordinates with respect to the reference plane of the camera reference point of the second, third, and fourth fixed cameras 31b, 31c, and 31d are measured in the same manner and stored, respectively.

According to the present invention, the distance between the first and second substrate reference points 51a and 51b of the substrate 50 is the same as the distance between the first and second camera reference points, and the first and second fixed cameras 31a and 31b are used. Is not limited to the case of shooting with the camera), and the same distance between two different camera reference points among the camera reference points of the four fixed cameras 31a, 31b, 31c, and 31d may be used for shooting with two corresponding fixed cameras. .

<Second positioning process>

Below, each impact on a board | substrate is carried out while either one of the board | substrate 50 or the 1st board | substrate 50a (represented by the 1st board | substrate 50a in the following description) passes below the head holding part 30. A second alignment step of performing the alignment operation so that the position passes immediately below the at least one discharge port 35 will be described.

The images picked up by the first and second fixed cameras 31a and 31b are image-processed by the control device 92, and the xy coordinates with respect to the reference plane of the desired position in the image can be known.

First, the board | substrate moving part 20 is moved to the y-axis direction, and the 1st, 2nd fixed camera 31a, 31b moves the 1st, 2nd board | substrate reference point 51a, 51b which the 1st board | substrate 50a has. Place them below each.

FIG.3 (a) has shown the schematic diagram of the fixed camera image at the time of mounting the image 85a, 85b of the 1st, 2nd fixed camera to one plane coordinate.

Reference numerals 81a and 81b in FIG. 3A denote camera reference points of the first and second fixed cameras 31a and 31b, and reference numerals 82a and 82b denote respective design values (first and second design values). . Reference numerals 83a and 83b denote images of the first and second substrate reference points 51a and 51b respectively photographed by the first and second fixed cameras 31a and 31b.

The control device 92 is formed by a straight line passing through two points of the first and second design values 82a and 82b and a straight line passing through two points of the images 83a and 83b of the first and second substrate reference points. The value of angle (theta) ₁ is calculated | required by calculation from the coordinate of each point.

Since the control device 92 can know the x-axis direction or the y-axis direction in the image, the straight line passing through two points of the images 83a and 83b of the first and second substrate reference points and the x-axis direction or the y-axis direction You may calculate | require this angle by calculation.

The board | substrate moving part 20 has the 1st board | substrate rotation mechanism 42 which can rotate the 1st mounting table 24a with respect to the board | substrate moving part 20 in parallel with a reference plane. As the first substrate rotating mechanism 42, for example, an air spindle that performs rotational driving by compressed air is used.

The control apparatus 92 moves the 1st mounting table 24a so that the line segment connecting the 1st, 2nd board | substrate reference point 51a, 51b on the 1st board | substrate 50a may be parallel with an x-axis direction. The signal which rotates with respect to the 20 at a predetermined angle in parallel with the reference plane is transmitted to the first substrate rotating mechanism 42.

When the 1st board | substrate rotation mechanism 42 receives the signal transmitted from the control apparatus 92, the 1st board | substrate 24a and the 1st, 2nd board | substrate 50a which are hold | maintained on the 1st board | substrate 24a, 50b) is rotated with respect to the substrate moving part 20 by a predetermined angle in parallel with the reference plane.

The 1st, 2nd board | substrate reference point 51a, 51b is image-processed by the control apparatus 92 after rotational movement, and the xy coordinate with respect to each reference plane is memorize | stored in the control apparatus 92. FIG.

Since the relative position of the 1st, 2nd board | substrate reference point 51a, 51b and each impact position is preset beforehand on the 1st board | substrate 50a, from the xy coordinate of the 1st, 2nd board | substrate reference point 51a, 51b, The xy coordinate with respect to the reference plane of each impact position is calculated | required.

Each discharge port 35 is aligned by the above-described first alignment step, and the xy coordinate with respect to the reference plane is stored in the control device 92.

The head holding part 30 has a head moving mechanism 49 that can move the mounting plate 33 with respect to the head holding part 30 in the x axis direction. The head movement mechanism 49 is provided with a head movement motor.

The control apparatus 92 calculates an error from the x coordinate of the predetermined discharge port 35 and the x coordinate of the first and second substrate reference points 51a and 51b on the first substrate 50a, and the mounting plate so that the error becomes zero. The signal for moving the 33 in the x axis direction by a predetermined distance is transmitted to the head moving mechanism 49.

When the head moving mechanism 49 receives a signal transmitted from the control device 92, the head moving mechanism 49 moves the mounting plate 33 and the head 32 mounted on the mounting plate 33 with respect to the head holding unit 30 in the x-axis direction. To move a predetermined distance.

In the above-described order, the second alignment process is completed. In this state, each impact position on the first substrate 50a passes immediately below the at least one discharge port 35 while the first substrate 50a passes below the head holding part 30. .

<3rd position alignment process>

In the following, while the second substrate 50b passes below the head holding part 30, the alignment operation is performed such that each impact position on the second substrate 50b passes immediately below the at least one discharge port 35. The 3rd alignment process which implements this is demonstrated.

The images picked up by the third and fourth fixed cameras 31c and 31d are image-processed by the control device 92 so that the coordinates of the desired position in the image can be known.

First, the substrate moving part 20 is moved in the y axis direction, and the third and fourth substrate reference points 51c and 51d of the second substrate 50b are under the third and fourth fixed cameras 31c and 31d. To each.

FIG.3 (b) has shown the schematic diagram of the fixed camera image at the time of mounting the image 85c, 85d of the 3rd, 4th fixed camera in one plane coordinate.

Reference numerals 81c and 81d in FIG. 3 (b) denote camera reference points of the third and fourth fixed cameras 85c and 85d, and reference numerals 82c and 82d denote respective design values (third and fourth design values). . Reference numerals 83c and 83d denote images of the third and fourth substrate reference points 51c and 51d captured by the third and fourth fixed cameras 85c and 85d, respectively.

The control device 92 is formed by a straight line passing through two points of the third and fourth design values 82c and 82d and a straight line passing through two points of the images 83c and 83d of the third and fourth substrate reference points. The value of angle (theta) ₂ is calculated | required by calculation from the coordinate of each point.

Since the control device 92 can know the x-axis direction or the y-axis direction in the image, the straight line passing through two points of the images 83c and 83d of the third and fourth substrate reference points and the x-axis direction or the y-axis direction You may calculate | require this angle by calculation.

The substrate moving part 20 can rotate the second mounting table 24b with respect to the first mounting table 24a in parallel with the reference plane, and can move the second mounting table 24b in the x-axis direction. ) As the 2nd board | substrate positioning mechanism 80, either one of an xy (theta) stage or a UVW stage is used, for example. In the present invention, since the mechanism can be configured by suppressing the height by using the UVW stage, the stability of the second mounting table 24b may be ensured.

The control apparatus 92 mounts the 2nd mounting table 24b in the 1st mounting table so that the line segment connecting the 3rd, 4th board | substrate reference point 51c, 51d on the 2nd board | substrate 50b may become parallel to an x-axis direction. The signal which rotates with respect to 24a by a predetermined angle in parallel with a reference plane is transmitted to the 2nd board | substrate positioning mechanism 80. As shown in FIG.

When the 2nd board | substrate positioning mechanism 80 receives the signal transmitted from the control apparatus 92, the 2nd board | substrate positioning mechanism 80 will replace the 2nd board | substrate 24b and the 2nd board | substrate 50b hold | maintained on the 2nd board | substrate 24b. The substrate is rotated by a predetermined angle with respect to the substrate moving part 20 in parallel with the reference plane.

The 3rd, 4th board | substrate reference point 51c, 51d is image-processed by the control apparatus 92 after rotational movement, and the xy coordinate with respect to each reference plane is memorize | stored in the control apparatus 92. FIG.

Since the relative positions of the third and fourth substrate reference points 51c and 51d and the impact positions are preset on the second substrate 50b, from the xy coordinates of the third and fourth substrate reference points 51c and 51d, The xy coordinate with respect to the reference plane of each impact position is calculated | required.

Each discharge port 35 is aligned by the first and second alignment steps described above, and the xy coordinate with respect to the reference plane is stored in the control device 92.

The control device 92 obtains an error from the x coordinates of the third and fourth substrate reference points 51c and 51d on the second substrate 50b and the x coordinate of the predetermined discharge port 35, and the second so that the error becomes zero. The signal for moving the mounting table 24b in the x axis direction by a predetermined distance is transmitted to the second substrate positioning mechanism 80.

When the 2nd board | substrate positioning mechanism 80 receives the signal transmitted from the control apparatus 92, the 2nd board | substrate positioning mechanism 80 will attach the 2nd board | substrate 50b hold | maintained on the 2nd mounting board 24b to the 1st mounting board 24a. Relative distance in the x-axis direction.

In the above procedure, the third positioning process is completed. In this state, while the 2nd board | substrate 50b passes below the head holding part 30, each impact position on the 2nd board | substrate 50b passes just below the at least 1 discharge port 35. As shown in FIG.

10 ... ... Discharge device
20 ... ... Board moving part
30 ... ... Head retainer
32 ... ... head
35. ... Outlet
41…. ... Rail moving mechanism
48a, 48b... ... 1st, 2nd moving mechanism
49. ... Head moving mechanism
50 ... ... Board
61a, 61b... ... 1st, 2nd peripheral device
61c... ... A police device
62a, 62b... ... 1st, 2nd Weekly Interference Device
62c, 62d... ... 1st, 2nd interference interference device
70 ... ... Pedestal
71a, 71b... ... 1st, 2nd rail
92. ... controller
93a, 93b... ... 1st, 2nd measuring device

Claims (11)

A pedestal stationary relative to the reference plane,
Two rails disposed in the first direction on the pedestal;
A head holding part fixed to the pedestal and holding a head each having a plurality of discharge holes formed therein;
A substrate moving part mounted on the two rails and capable of arranging a substrate;
It has a rail moving mechanism which moved the said board | substrate moving part to the said 1st direction along the said two rails, and can pass under the said head holding part,
A discharge apparatus for discharging a discharge liquid toward the substrate disposed on the substrate moving part from the discharge port, and landing droplets of the discharge liquid on the substrate.
First and second main light transmitting apparatuses respectively transmitting first and second main measuring light in the first direction;
A second device which is installed in a second direction perpendicular to the first direction and parallel to the reference plane, and reflects the first and second main reflected light when the first and second main measurement light are irradiated; 1, the second main mirror device,
A first interference device for receiving the first principal measurement light and the first principal reflection light and detecting a first interference result of the first principal measurement light and the first principal reflection light;
A second coherence interference device for receiving the second main measurement light and the second main reflection light and detecting a second interference result of the second main measurement light and the second main reflection light;
From the results of the first and second intercepts, a first principal distance between the first apparatus and the first peripheral apparatus and a second principal distance between the second apparatus and the second apparatus Measuring device to obtain each,
Has a control device to which the measurement result of the measuring device is transmitted,
One of the first and second intercept devices and the first and second peripheral apparatuses is disposed on the substrate moving part, and the other device is fixed on the pedestal,
The first and second intercept devices are disposed between the first and second peripheral apparatuses and the first and second main light transmitting apparatuses.
The rail moving mechanism includes a first moving mechanism for applying a first moving force with respect to the first rail to the substrate moving part and a second moving force for applying the second moving force with respect to the second rail to the substrate moving part. With two moving mechanisms,
And the control device is configured to determine the magnitude of the first and second moving force from the first and second main distances. The method of claim 1,
The control device is configured to control the first and second moving mechanisms to move the substrate moving part along the two rails based on a set value of the difference between the first and second main distances. . The method according to claim 1 or 2,
A head moving mechanism allowing the head to move in the second direction;
A first sub-light transmitting device for transmitting the first sub-measuring light in the second direction;
A sub-diameter device that reflects and reflects the first sub-reflection light when the first sub-measurement light is irradiated;
A first sub-interference device for receiving the first sub-measurement light and the first sub-reflection light, and detecting an interference result of the first sub-measurement light and the first sub-reflection light;
It has a measuring apparatus which calculates the distance between the said subscope apparatus and said 1st subinterference apparatus from the said 1st subinterference result,
The first sub-interference device and one of the sub-diameter devices are disposed on a side surface parallel to the moving direction (the first direction) of the substrate moving part, and the other device is fixed on the pedestal,
The control device obtains the position in the second direction of the substrate moving part from the distance between the sub-diameter device and the first sub-interference device, and the position in the second direction of the substrate moving part and the second direction of the head. And a discharging device configured to determine, from the difference in the position of the head moving mechanism, the amount of movement in which the head moving mechanism moves the head. The method according to claim 1 or 2,
A head moving mechanism allowing the head to move in the second direction;
A first and a second sub-light transmitting device for transmitting the first and second sub-measuring light,
A submirror device that reflects the first and second sub-reflected light by reflecting the first and second sub-measured light upon irradiation;
First and second light receiving the first and second sub-measuring light and the first and second sub-reflection light, and detecting an interference result between the first and second sub-measuring light and the first and second sub-reflection light With two interference device,
It has a measuring apparatus which calculates the distance between the said sub diameter apparatus and the said 1st, 2nd subinterference apparatus from the said 1st, 2nd subinterference result,
Any one of the first and second sub-interference devices and the sub-calibration device is disposed on the substrate moving part, and the other device is fixed on the pedestal,
The control device is configured to adjust the position of the substrate moving part in the second direction from any one or both of the distance between the sub-scope device and the first sub-interference device and the distance between the sub-view device and the second sub-interference device. And a discharge device configured to determine a movement amount of the head moving mechanism to move the head from a difference between the position in the second direction of the substrate moving portion and the position in the second direction of the head. The method of claim 3, wherein
The control device controls the head moving mechanism based on a set value of a difference between a position in the second direction of the substrate moving part and a position in the second direction of the head, so that the substrate moving part includes the two rails. Dispensing apparatus configured to move along the. The method of claim 4, wherein
The control device controls the head moving mechanism based on a set value of a difference between a position in the second direction of the substrate moving part and a position in the second direction of the head, so that the substrate moving part includes the two rails. Dispensing apparatus configured to move along the. On the substrate moving portion moving between the starting point and the end point positioned on the opposite sides with the heads on the horizontal pedestal interposed therebetween in the first direction along the two rails from the starting point to the end point. Mount the substrate on,
Move the substrate moving portion toward the end point,
While discharging the discharge liquid from the discharge port to the substrate while the substrate passes below the head,
An ejecting method of drying the substrate and removing the substrate from the substrate moving part after the substrate moving part reaches the end point,
Before the movement of the substrate moving part, the inclination of the first direction on the plane parallel to the reference plane of the substrate moving part or the second direction perpendicular to the first direction and parallel to the reference plane is measured,
During the movement of the substrate moving portion,
Measure the inclination of the substrate moving part and change the respective amounts of movement on the two rails so that the error generated during the inclination of the substrate moving part is zero, so that the inclination of the substrate moving part is equal to the inclination before moving. Discharging the substrate while passing under the head. The method of claim 7, wherein
Before the movement of the substrate moving part, the position in the second direction of the substrate moving part is measured,
During the movement of the substrate moving portion,
After making the inclination of the substrate moving part equal to the inclination before the start of the movement, the position of the second direction of the substrate moving part is measured, and the position of the second direction of the substrate moving part and the second direction of the head are measured. The head is moved so that the difference in the position of is the same as before the start of the movement,
And the substrate is passed under the head while making the relative positional relationship in the second direction between the substrate moving part and the head the same as the relative positional relationship before movement. The method of claim 7, wherein
After mounting the substrate on the substrate moving portion, the substrate moving portion is moved, and before the substrate enters the lower side of the head, it is once stopped at a position before the head, and each impact position on the substrate is determined by the head. A discharging method for positioning so as to pass through just below the discharge port formed in the. The method of claim 8,
After mounting the substrate on the substrate moving portion, the substrate moving portion is moved, and before the substrate enters the lower side of the head, it is once stopped at a position before the head, and each impact position on the substrate is determined by the head. A discharging method for positioning so as to pass through just below the discharge port formed in the. The method according to any one of claims 7 to 10,
One of the said board | substrate moving parts and the said base is reflected, when 1st, 2nd main measurement light is irradiated, and the 1st, 2nd main mirror apparatus which semi-reflects the 1st, 2nd main reflection light is arrange | positioned, and the other A first observing device for receiving the first main measuring light and the first main reflecting light, and detecting a first observing result of the first main measuring light and the first main reflecting light, and the second main measuring light And a second interference device for receiving the second main reflection light and detecting a second interference result of the second main reflection light and the second main reflection light,
First and second principal distances between the first and second peripheral apparatuses and the first and second peripheral apparatuses are obtained from the first and second apparatuses.
Measuring the inclination of the substrate moving part from the first and second main distances,
One of the said board | substrate moving part and the said base is reflected, when a 1st, 2nd sub-measuring light is irradiated, and the submirror apparatus which reflects the 1st, 2nd sub-reflection light is arrange | positioned, and the said 1st sub-measuring is located on the other side. A first sub-interference device that receives light and the first sub-reflection light, and detects a first sub-interference result of the first sub-reflection light and the first sub-reflection light, the second sub-measurement light and the second sub-light A second sub-interference device for receiving the reflected light and detecting a second sub-interference result of the second sub-measurement light and the second sub-reflection light,
From the first and second sub-interference results, first and second sub-distances between the first and second sub-interference devices and the sub-view device are obtained.
A discharge method for measuring a position in the second direction of the substrate moving part from any one or both of the first and second sub-distances.

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