TWI425672B - Method for producing packaged led - Google Patents

Description

Method for manufacturing packaged light-emitting diodes

The present invention relates to a packaged light emitting diode, and more particularly to a method of fabricating a packaged light emitting diode.

The packaged light-emitting diode of the prior art is mixed with silicone powder or epoxy resin, and is coated with a silicone or epoxy resin around the light-emitting diode wafer, and the light generated by the light-emitting diode can be used to excite the firefly. The light powder, in turn, emits various colors or white visible light.

However, such a packaged light-emitting diode is susceptible to instability and short life. Silicone and epoxy resin may be eroded by water, causing the phosphor powder to contact with moisture, causing the phosphor powder to deteriorate and consuming the life of the packaged LED. In addition, the LED chip will increase the temperature during use. In particular, while continuously improving the illumination power of the LED, the LED chip will generate more heat, which will deteriorate the surrounding silicone, epoxy resin and phosphor powder, and affect the stability of the package LED. Degree and service life.

The main object of the present invention is to provide a packaged light-emitting diode process, which has a better life and stability.

In order to achieve the above object, the present invention provides a method for manufacturing a packaged light-emitting diode, comprising the steps of: preparing a material, constructing a circuit, and fixing.

Wherein, the preparation is to take a substrate and a cover, the substrate has a first surface and a second surface, the cover has a third surface and a fourth surface, and the second surface and the third surface have a flange, the flange defines a groove, and the cover includes a Fluorescent layer.

The building circuit is configured to fix at least one light emitting diode circuit on the second surface, and the light emitting diode circuit comprises at least one light emitting diode chip.

The fixing is fixed to the substrate in a vacuum environment, and the groove is closed by the cover plate and the substrate to form a closed space, and the LED circuit is located in the closed space.

Thereby, the light-emitting diode wafer and the phosphor layer of the present invention are separated by a vacuum interlayer, which can reduce the heat transferred to the phosphor layer, and can reduce the deterioration of the cover plate and the fluorescent material, and at the same time, the cover plate It can also be made of glass to avoid contact with fluorescent substances due to moisture erosion, further reducing the deterioration of fluorescent substances and improving the service life of the light-emitting diodes.

The following is a description of the possible embodiments of the present invention, and is not intended to limit the scope of the invention as claimed.

The present invention provides a method for fabricating a packaged light emitting diode that can be used to fabricate a light emitting diode package as shown in FIG.

Referring to FIG. 2 to FIG. 5 , the method for manufacturing a packaged light-emitting diode provided by the present invention comprises the following steps: preparing a substrate 1 and a cover 2 . The substrate 1 made of the copper alloy or ceramic has a first surface 11 and a second surface 12. The cover 2 has a third surface 21 and a fourth surface 22, and the second surface 12 is formed with a convex surface. The flange 3 is surrounded by a groove, wherein the flange 3 may be integrally formed on the substrate 1 or may be assembled or glued to the substrate 1 by other parts. In other possible embodiments of the present invention, The flange 3 can also be located on the third face 21. The cover plate 2 comprises a fluorescent layer, more specifically, the cover plate is mixed and distributed with a fluorescent substance. Specifically, the cover plate 2 can be made of glass, acrylic or other permeable material, and is manufactured. When the phosphor material powder is mixed and mixed in the raw material, the formed cover plate 2 is a fluorescent layer. Preferably, the surface of the third surface 21 or the fourth surface 22 of the cover 2 is formed with a concave-convex texture, and the concave and convex lines can be used to reflect and refract light to exhibit the effect of collecting light.

As shown in FIG. 3, a light-emitting diode circuit 4 is fixed on the second surface 12, and the light-emitting diode circuit 4 may include one or more light-emitting diode chips 41, and may include a light-emitting diode. The wire 42 of the diode chip, preferably, the arrangement of the LED circuit 4 can be performed by an SMT (Surface Mount Technology) process.

Fixing: the cover plate 2 is fixed to the substrate 1 in a vacuum environment, and the groove is closed by the cover plate 2 and the substrate 1 to form a closed space, and the closed space is in a vacuum state, and the light is emitted. The diode circuit 4 is then located in the enclosed space. The cover plate 2 and the substrate 1 are fixed by the photo-curing resin 5, and in other possible embodiments of the present invention, if the cover plate 2 is made of acrylic or other material that is easy to melt, it can also be utilized. The high frequency is heated, and the cover 2 is further pressed against the substrate 1.

With the above steps, the LED of the package shown in FIG. 1 can be manufactured, wherein the LED wafer 41 is separated from the cover 2, and the enclosed space is in a vacuum state, so that the LED wafer 41 is made. The generated heat is not easily transmitted to the cover 2, and the fluorescent material in the cover 2 is prevented from being deteriorated by the high temperature; at the same time, the fluorescent substance in the cover 2 is coated on other materials of the cover 2, Fluorescent substances can be prevented from being directly exposed to the outside, and the fluorescent substances can be prevented from being deteriorated by contact with moisture.

Moreover, the closed space between the cover plate 2 and the substrate 1 is in a vacuum state, which can reduce the loss of light generated by the light-emitting diode wafer 41 and cause loss of light, and can maintain better luminous efficiency; The formation of embossed lines provides the effect of concentrating light and maintaining better illumination.

Referring to FIG. 6 , in another embodiment of the present invention, the cover 2 may further include a protective layer 23 , and the protective layer 23 is located on the fourth surface 22 , and the protective layer may be used to block outside air or water to prevent fire. The phosphor material on the surface of the light layer 24 contacts air and water to improve the stability of the phosphor layer 24. Referring to FIG. 7 , the cover 2 can further include another protective layer 25 , so that the fluorescent layer 24 is sandwiched between the two protective layers 23 and 25, and the stability of the fluorescent layer 24 is further improved. degree.

In summary, the method for manufacturing a packaged light-emitting diode provided by the present invention can be used to manufacture a packaged light-emitting diode, which can improve the durability and stability of the packaged light-emitting diode. The effect is in line with the patent requirements stipulated by the national patent law, and the patent application is filed according to law.

1‧‧‧Substrate

11‧‧‧ first side

12‧‧‧ second side

2‧‧‧ Cover

21‧‧‧ third side

22‧‧‧ fourth side

23, 25‧‧ ‧ protective layer

24‧‧‧Fluorescent layer

3‧‧‧Flange

4‧‧‧Lighting diode circuit

41‧‧‧Light Emitter Wafer

42‧‧‧Wire

5‧‧‧Photohardening resin

Figure 1 is a partial cross-sectional view of the present invention.

2 to 5 are schematic views of continuous production of the present invention.

6 and 7 are schematic cross-sectional views showing other embodiments of the present invention.

1. . . Substrate

2. . . Cover

3. . . Flange

4. . . Light-emitting diode circuit

Claims (4)

A method for manufacturing a packaged light-emitting diode comprises the steps of: preparing a substrate and a cover, the substrate having a first surface and a second surface, the cover having a third surface and a first surface Four sides, the second surface and the third surface have a flange, the flange defines a groove, the cover plate comprises a fluorescent layer, and the circuit is configured to: fix at least the second surface a light-emitting diode circuit, the light-emitting diode circuit comprising at least one light-emitting diode chip; fixed: the cover plate is fixed on the substrate in a vacuum environment, and the groove is covered by the cover plate and the substrate The encapsulation forms a closed space, and the LED circuit is located in the enclosed space; wherein the cover further comprises a second protective layer, the fluorescent layer being sandwiched between the two protective layers. The method for manufacturing a packaged light-emitting diode according to claim 1, wherein in the fixing step, the cover plate and the substrate are fixed to each other with a photo-curable resin. A method for manufacturing a packaged light-emitting diode according to claim 1, wherein the third surface is formed with a concave-convex texture. The method for manufacturing a packaged light-emitting diode according to claim 1, wherein the fourth surface is formed with a concave-convex texture.