TWI424800B - Sticking device for flexible printed circuit board of manufacturing equipment and process thereof - Google Patents

Description

Laminating device for flexible circuit board production equipment and its manufacturing process

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a laminating apparatus, and more particularly to a laminating apparatus for a flexible circuit board producing apparatus which has the effect of preventing abrasion and creases during transport of a single flexible circuit board or during operation.

Nowadays, electronic products are becoming lighter and thinner, consumers are becoming more and more demanding, and flexible circuit boards have the advantages of being bendable, light and thin, and low in cost. They can be used as one of the important parts of thin electronic products, and the future will be Key projects developed by science and technology manufacturers.

The roll type flexible circuit board is one of the commonly used electronic components, but in the process steps of manufacturing the roll type flexible circuit board, when the hole diameter of the drilled hole on the flexible circuit board is too small, the roll type flexible circuit board is fabricated. Failure to achieve the desired results (such as possible drilling position offset, equipment performance limitations, etc.), still need to change a single flexible circuit board to overcome the problem of too small hole diameter. However, in the process of transporting a single flexible circuit board, the soft circuit board is often worn and the crease is mainly caused by human factors and collision during transportation. The damaged flexible circuit board may cause the overall yield to decrease. This in turn affects the appearance and quality of the product.

The reason is that this creator feels that the above problems can be improved. He is devoted to research and cooperates with the application of theory, and finally proposes a creation that is reasonable in design and effective in improving the above-mentioned defects.

The embodiment of the invention provides a bonding device for a flexible circuit board production device and a manufacturing process thereof, which can improve the wear and crease of a single flexible circuit board during transportation or operation, thereby causing an increase in the proportion of poor appearance.

Embodiments of the present invention provide a bonding apparatus for a flexible circuit board production apparatus, wherein the production apparatus includes a conveyor belt, and the conveyor belt is provided with a plurality of separate flexible circuit boards. The fitting device includes a tape supply machine, a stretch gripper, and a baking unit. The tape supply machine has an opening for outputting a tape and a platform for placing the tape and displaceable up and down. The opening is disposed on one side of the tape supply machine, and the platform is disposed in the opening. The stretching gripper has a mechanical arm that is displaced up and down in synchronization with the platform. The direction of the mechanical arm corresponds to the tape on the platform, and the tape supply machine and the stretching gripper are disposed on both sides of the conveyor belt. The robot arm is telescopic to grasp the tape on the platform, wherein the robot arm and the platform synchronously act to press the tape between the two adjacent flexible circuit boards. The process includes sequentially adhering two adjacent flexible circuit boards on the conveyor belt, heating and curing the tapes on the two adjacent flexible circuit boards, repeating the above steps, and bonding the two separate flexible circuit boards to form a continuous rollable flexible circuit. board. A baking unit is disposed in the bonding device and is located on the conveyor belt, wherein the baking unit is used to heat and cure the tape.

In summary, the tape bonding apparatus for the flexible circuit board production equipment and the manufacturing process thereof according to the embodiment of the present invention provide a method for preventing wear and creases during the transportation or operation of a single flexible circuit board, thereby reducing the proportion of poor appearance and making the overall yield. Improve, and thus reduce costs... and other benefits.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of a bonding apparatus for a flexible circuit board production apparatus according to the present invention. The present invention provides a laminating apparatus for a flexible circuit board production apparatus, wherein the production apparatus includes a conveyor belt 100, and the conveyor belt 100 is provided with a plurality of separate flexible circuit boards 200.

The bonding device 3 includes a tape supply machine 31, a stretching gripper 32, and a baking unit 33. The tape supply machine 31 has an opening 312 for outputting the tape T and a platform 313 for placing the tape and being vertically displaceable. The opening 312 is provided on one side of the tape supply machine 31, and the platform 313 is disposed in the opening 312.

The stretching gripper 32 has a mechanical arm 321 that is displaced up and down in synchronization with the platform 313. The direction of the robot arm 321 corresponds to the tape T on the platform 313, and the tape feeder 31 and the stretching gripper 32 are disposed on the conveyor belt 100. On both sides.

The baking unit 33 is disposed in the bonding device 3 and is located on the conveyor belt 100, wherein the baking unit 33 is used to heat and cure the tape T located on the two adjacent flexible circuit boards 200.

The robot arm 321 is retractable to grip the tape T on the platform 313, wherein the synchronous action of the robot arm 321 and the platform 313 is used to press the tape T between the two adjacent flexible circuit boards 200.

The above operation is repeated to bond the separate flexible circuit boards 200 to form a continuous rollable flexible circuit board 201.

The production equipment further includes a feeder 1, a drilling machine 2, a black shadow processing machine 5, a copper plating tank 6, and a receiving reel machine 7. A conveying path A for conveying a plurality of separate flexible circuit boards 200 is formed between the feeder 1 and the take-up reel machine 7. The drilling machine 2, the black shadow processing machine 5 and the copper plating tank 5 are located on the conveying path A.

The drilling machine 2 is located between the feeder 1 and the bonding device 3, and the bonding device 3 The black shadow process machine 5 and the copper plating tank 6 are sequentially disposed in the direction of the conveyance path A with the take-up reel machine 7.

The production apparatus further has a press jig 8 in which the press jig 8 is located on the transport path A between the copper plating tank 6 and the take-up reel machine 7. The press jig 8 is used for the press-processed continuous rollable flexible circuit board 201 to be more flat without curling.

The tape T of the tape supply machine 31 is a thermosetting insulating tape T.

The tape supply machine 31 further includes a cut-off 311 provided on one side of the tape supply machine 31 and on the platform 312 for sequentially cutting off the excess tape T to which the flexible circuit board 200 has been attached.

Referring to FIG. 2, FIG. 2 is a manufacturing process diagram of a flexible circuit board according to the present invention, and please refer to FIG. The process step S101 is mainly to output the adjacent plurality of flexible circuit boards 200 to be processed to the conveyor belt 100, and the transmission mechanism (not shown) transports the adjacent plurality of flexible circuit boards 200 to be processed into the drilling machine 2. .

The process step S102 is to drill a hole pattern (for example, a through hole or a blind hole) into a flexible circuit board 200 by means of mechanical or laser drilling, but the drilling method is not limited. .

The process step S103 is to transport the adjacent plurality of flexible circuit boards 200 after the drilling process to the bonding device 3. Firstly, the adjacent two flexible circuit boards 200 after drilling are sequentially transported by the transmission mechanism to the conveyor belt 100 between the tape supply machine 31 and the stretching and gripping machine 32, and then positioned by the computer system (not shown). The distance between the adjacent two flexible circuit boards 200 is in line with the relative position of the mechanical arm 321 and the tape T. The spacing between the two adjacent flexible circuit boards 200 is maintained at 2 mm. The tape supply machine 31 outputs an appropriate length of the tape T at the opening 312, and the robot arm 321 extends toward the movement direction D1 to the tape supply machine 31. At the opening 312, the tape T of the appropriate length at the opening 312 is clamped (please refer to FIG. 3A, FIG. 3A is a schematic diagram of the extending action of the bonding device for the flexible circuit board production device of the present invention), and the tape T is moved toward the movement. The direction D2 is pulled back to the same length as the width of the flexible circuit board 200 (please refer to FIG. 3B, FIG. 3B is a schematic diagram of the pullback action of the bonding device for the flexible circuit board production device of the present invention), the mechanical arm 321 and the placement The platform 313 of the tape T is simultaneously pressed and pressed between the adjacent two flexible circuit boards 200 in the moving direction D3 to bond the two separate flexible boards 200 (refer to FIG. 3C, which is used in the present invention). The pressing action of the bonding device of the flexible circuit board manufacturing device is to cut off the excess tape T of the adjacent two flexible circuit boards 200 in the moving direction D3 by the cutter 311 of the tape supply machine 31 (please Referring to FIG. 3D, FIG. 3D is a schematic diagram showing the cutting operation of the bonding apparatus for the flexible circuit board production apparatus of the present invention. By repeating the above operation, the flexible circuit board 200 located on the conveyor belt 100 is bonded to form a long continuous flexible flexible circuit board 201, and the continuous flexible flexible circuit board 201 is transported by the transmission mechanism (not shown). The baking unit 33 proceeds to the next job flow.

The process step S104 is to bake and cure the pressed continuous rollable flexible circuit board 201. Because the process step S103 is mainly to press the adjacent two flexible circuit boards 200, but the tape T belongs to the thermosetting insulating tape T, the tape T must be heated before the tape T can be cured, so that the continuous rollable flexible circuit board 201 must be The baking unit 33 sent to the bonding apparatus 3 performs an operation of curing the tape. The baking unit 33 of the present invention is heated at a temperature of 160°, and the working time is 1 hour. However, the setting mode can be changed according to the current environment and design conditions, and the temperature and time adjustment of the present invention is not limited.

The process step S105 is a shadow process. The black shadow process of the present invention mainly uses graphite (not shown) as a conductive material because of graphite molecular knots. The structure has a large amount of electron distribution, whereby the conductivity of graphite is superior to other conductive materials, and the better the conductivity, the relative influence on the speed of electroplating, but the present invention does not limit the conductive material. The black shadow process of the present invention firstly transports the baked and rollable flexible flexible circuit board 201 to the black shadow process machine 5, cleans and washes the continuous rollable flexible circuit board 201, and adds a black shadow agent and a fixer (Fig. Slightly, the continuous rollable flexible circuit board 201 is washed with water, and then dried and inspected for the continuous rollable flexible circuit board 201. Thereafter, a micro-etching agent (not shown) is added to the board, and the continuous rollable flexible circuit board 201 is washed with water. Then, an antioxidant (not shown) is added to the board, and the continuous flexible flexible circuit board 201 is washed with water to perform the final drying operation, and after drying, the entire black shadow production process is completed.

After the black shadow process of the process step S105, the continuous rollable flexible circuit board 201 is transported into the copper plating tank 6. In the process step S106, the continuous rollable flexible circuit board 201 is further coated with a layer of conductive copper metal, including continuous rollable softness. The tape T on the circuit board 201 is attached.

The transmission mechanism (not shown) will be the continuous rollable flexible circuit board 201 after the copper plating operation is completed, and the continuous rollable flexible circuit board 201 is flattened by the pressing jig 8, and then sent to the receiving reel machine 7 for collection. material.

The process step S107 is to wind the processed continuous rollable flexible circuit board 201 into the take-up reel machine 7, thereby completing the entire manufacturing process of converting the plurality of adjacent flexible circuit boards 200 into the continuous rollable flexible circuit board 201.

According to a preferred embodiment of the present invention, the above-mentioned laminating apparatus for a flexible circuit board production apparatus and a process thereof are provided for preventing wear and crease of a single flexible circuit board during transportation or work, and reducing labor costs and thereby increasing products. Yield...etc.

However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. The scope of patent protection created.

1‧‧‧ Feeder

2‧‧‧Drilling machine

3‧‧‧Fitting device

31‧‧‧ Tape Supply Machine

311‧‧‧cutters

312‧‧‧ openings

313‧‧‧ platform

32‧‧‧Stretching and gripping machine

321‧‧‧ Robotic arm

33‧‧‧ baking unit

5‧‧‧Shadow Process Machine

6‧‧‧ copper plating trough

7‧‧‧Receiving reel

8‧‧‧Compression fixture

100‧‧‧ conveyor belt

200‧‧‧Soft circuit board

201‧‧‧Continuous rollable flexible circuit board

A‧‧‧Transportation path

D1~D3‧‧‧ direction of movement

T‧‧‧ Tape

S101~S107‧‧‧Process steps

1 is a schematic view of a bonding apparatus for a flexible circuit board production apparatus of the present invention.

2 is a manufacturing process diagram of a flexible circuit board production apparatus of the present invention.

3A is a schematic view showing an extended operation of the bonding apparatus for a flexible circuit board production apparatus according to the present invention.

FIG. 3B is a schematic diagram of the pulling back action of the bonding apparatus for the flexible circuit board production apparatus of the present invention.

FIG. 3C is a schematic view showing the pressing action of the bonding apparatus for the flexible circuit board production apparatus of the present invention.

FIG. 3D is a schematic diagram showing the cutting operation of the bonding apparatus for the flexible circuit board production apparatus of the present invention.

1. . . Feeder

2. . . driller

3. . . Laminating device

31. . . Tape supply machine

311. . . Cutter

312. . . Opening

313. . . platform

32. . . Tension gripper

321. . . Mechanical arm

33. . . Baking unit

5. . . Black shadow process machine

6. . . Copper plating tank

7. . . Receiving reel

8. . . Pressing fixture

100. . . conveyor

200. . . Flexible circuit board

201. . . Continuous rollable flexible circuit board

A. . . Conveying path

T. . . tape

Claims (8)

A laminating device for a flexible circuit board production device, wherein the production device comprises a conveyor belt, the conveyor belt is provided with a plurality of separate flexible circuit boards; the bonding device comprises: a tape supply machine having an output tape The opening and a platform for placing the tape and disposing up and down, the opening is disposed on one side of the tape supply device, the platform is disposed in the opening; a stretching and gripping machine has a displacement up and down in synchronization with the platform a mechanical arm that is telescopic to grip the tape on the platform, the direction of the robot arm corresponding to the tape on the platform, the tape supply machine and the stretching gripper are disposed on two sides of the conveyor belt, wherein the machine a synchronous action of the arm and the platform for pressing the adhesive tape between the two adjacent flexible circuit boards; and a baking unit disposed in the bonding device and located on the conveyor belt, wherein The baking unit is used to heat cure the tape. The bonding device for a flexible circuit board production apparatus according to claim 1, wherein the tape of the tape supply machine is a thermosetting insulating tape. The bonding apparatus for a flexible circuit board manufacturing apparatus according to claim 1, wherein the tape supply machine further comprises a cutoff device disposed on one side of the tape supply machine and located on the platform Used to cut off the excess tape that has been attached to the flexible circuit board in sequence. A process for a flexible circuit board production apparatus, wherein the production apparatus comprises a conveyor belt and a black shadow process machine, the conveyor belt is provided with a plurality of separate flexible circuit boards, and the black shadow process machine is used in a black shadow process A black shadow agent, a fixer, a micro-etching agent, and an antioxidant. The process includes the following steps: Transmitting a plurality of equally spaced flexible circuit boards on the conveyor belt; stretching a tape on the adjacent two flexible circuit boards on the conveyor belt; pressing and bonding the tape to the two adjacent flexible circuit boards Between the two pieces of the flexible circuit board that have been pasted together; heat-cure the tape on the two adjacent flexible circuit boards; repeat the above steps to bond the two separate flexible circuit boards to form a Continuously rollable flexible circuit board; transport the continuous rollable flexible circuit board to the black shadow process machine for performing a black shadow process; and wind up the continuous rollable flexible circuit board. The process for a flexible circuit board production apparatus according to claim 4, wherein the distance between two adjacent flexible circuit boards is 2 mm. The process for manufacturing a flexible circuit board manufacturing device according to claim 4, wherein the black shadow process sequentially cleans and washes the continuous rollable flexible circuit board, adds a black shadow agent and a fixer, and washes the continuous After the flexible circuit board is rolled, it is dried and the continuous flexible flexible circuit board is inspected. The process for a flexible circuit board production apparatus according to claim 6, wherein after the continuous rollable flexible circuit board is inspected, a micro-etching agent is added to the board, and then the continuous rollable flexible circuit board is washed with water. The process for manufacturing a flexible circuit board manufacturing apparatus according to claim 7, wherein after the continuous rollable flexible circuit board is washed, an antioxidant is added to the board, and the continuous rollable flexible circuit board is washed with water to perform the final Drying work.