TWI424495B - Substrate processing apparatus having window heating structure - Google Patents

Description

Substrate processing equipment with window heating structure

This invention relates to a substrate processing apparatus that produces a plasma within a chamber to treat a surface of a substrate.

As is well known in the art, the manufacture of electronic devices such as large integrated circuits (LSIs) or flat panel displays (FPDs) typically undergoes processing as a vacuum treated substrate.

In the vacuum processing method, gas is supplied to the chamber, and then plasma is generated by high voltage discharge. The acceleration force of the plasma particles physically sputters the material onto the substrate. The substance on the substrate is chemically decomposed by plasma radicals.

The technology of plasma treatment of substrates is divided into plasma etching (PE) technology, reactive ion etching (RIE) technology, magnetic field enhanced reactive ion etching (MERIE) technology, and electron cyclotron resonance (ECR) technology. , transformer-coupled plasma (TCP) technology, inductively coupled plasma (ICP) technology.

In particular, the formation of high density plasma and enhanced plasma density uniformity on glass (or semiconductor) substrates will greatly affect deposition or etch performance. To achieve these goals, various methods of producing plasma have been developed. Inductively coupled plasma (ICP) is a representative example of plasma generation methods.

The ICP method is a method for producing high-density plasma. The principle is that when the coil is wound around the dielectric to change the field, an induced magnetic field is generated in the coil, and a secondary induced current is formed in the reaction chamber.

Generally, a substrate processing apparatus using the ICP method includes a lower electrode disposed at a lower portion of a reaction chamber. The substrate is placed on the lower electrode. The apparatus further includes an antenna disposed within the chamber or coupled to the cover frame of the chamber housing. Radio frequency (RF) power is applied to the antenna. The surface of the substrate is treated by supplying a reactive gas to the chamber and generating a plasma.

However, in the plasma processing operation of the substrate processing apparatus, by-products of the etching process (such as polymers, etc.) are deposited on the lower portion of the ceramic window. If the deposition by-products are displaced during the substrate processing operation, the processing operation may create defects.

To overcome this problem, a method is proposed which installs a cover that avoids the deposition of by-products formed during etching in front of the ceramic window. However, as the size of the flat panel display becomes larger, the size of the chamber or window also increases. Therefore, in the conventional heating method, it is difficult to effectively prevent by-products from being deposited on the window.

It is to be understood that the above-described prior art is the information obtained by the inventors of the present invention prior to the inference of the present invention or the inference of the present invention, and does not mean that the structure of the prior art is well known before the filing date.

Accordingly, the present invention is directed to the above problems occurring in the prior art, and an object of the present invention is to provide a substrate processing apparatus having a structure for heating a window which heats a window by discharging heated air to a window to prevent deposition of by-products. Windows, which in turn enhances the reliability of the device.

Another object of the present invention is to provide a substrate processing apparatus having a window heating structure that is configured such that a single device can simultaneously heat the window and cool the antenna, thereby enhancing the performance of the device despite the simple structure.

To achieve the above object, the present invention provides a substrate processing apparatus having a window heating structure, comprising: a chamber in which a substrate is processed; and a window disposed at an upper portion of the chamber to realize an internal space of the chamber and an antenna Coupling, and the window is composed of an insulating material; a heating tube is disposed above the window, the heating tube discharges heated air to the upper surface of the window to heat the window; and means for supplying heated air to the heating tube.

The chamber includes a chamber housing and a cover frame that couples the upper end of the chamber housing. The cover frame includes an outer frame that forms a perimeter of the polygonal frame structure, and a divider frame that is disposed within the outer frame and coupled to each other to divide the window into a plurality of windows. The windows may include a central window defined by the dividing frame and located on a central portion of the cover frame, and a plurality of surrounding windows surrounding the central window, the surrounding windows being separated from each other by a dividing frame. The heating tube heats the central window and the surrounding window at the same time.

The heating tubes can be arranged horizontally above the window. A plurality of injection holes are formed in the heating tube. The injection holes are oriented towards the window.

The device includes a vortex generator that produces both heated air and cooling air.

Additionally, a cooling passage may be formed in the antenna such that the cooling fluid flows through the cooling passage along the antenna. Cooling air generated from the device is supplied into the cooling passage of the antenna to cool the antenna.

The above-mentioned key technical solutions of the present invention will become more apparent and understood after the detailed description and the accompanying drawings, and other technical solutions according to the present invention will be proposed and explained.

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Reference is now made to the drawings in which like reference

Fig. 1 is a schematic cross-sectional view showing the configuration of a substrate processing apparatus according to an embodiment of the present invention.

The substrate processing apparatus according to the present invention includes a chamber casing 11, a substrate support table 15, a lower electrode 17, a cover frame 20, a plurality of windows 30, an antenna 40, a radio frequency (RF) power supply 50, and a process gas supply unit 60. . The substrate supporting table 15 and the lower electrode 17 are provided in the chamber casing 11, and the substrate S is placed on the substrate supporting table 15 and the lower electrode 17. The cover frame 20 is coupled to the upper end of the chamber casing 11. The window 30 is provided in the cover frame 20. Antenna 40 and RF power supply 50 are located on window 30. The process gas supply unit 60 supplies process gas into the chamber 10, which is defined by the chamber housing 11 and the cover frame 20.

The features of the substrate processing apparatus according to the present invention will be further described in detail below.

First, the cover frame 20 will be described with reference to FIGS. 2 and 3.

The cover frame 20 has a rectangular frame structure. The interior of the cover frame 20 is divided into five zones, five zones defining five windows 30, respectively.

To form this structure, the cover frame 20 includes an outer frame 21 which constitutes a periphery of the rectangular frame structure, and a partition frame 25 which is disposed in the outer frame 21 and coupled to each other such that the inside of the outer frame 21 is divided into five parts to form Five windows 30.

The five windows 30 formed in the cover frame 20 include a central window 30A located at a central portion of the cover frame 20 and four peripheral windows 30B which are arranged around the central window 30A.

The center window 30A and the surrounding window 30B have a rectangular shape. In this embodiment, as shown, the four surrounding windows 30B are arranged in a clockwise direction around the central window 30A. Of course, the four surrounding windows 30B are also arranged in a counterclockwise direction around the central window 30A.

In the example in which the surrounding window 30B is rectangular, each of the surrounding windows 30B includes a first side a, a second side b, a third side c, and a fourth side d. The first side a separates the surrounding window 30B and the central window 30A from another adjacent surrounding window 30B, which is the next window in the clockwise direction. The second side b separates the surrounding window 30B and another adjacent surrounding window 30B that is located rearward in the clockwise direction. The third side c faces the first side a and is bordered by the surrounding surface of the cover frame 20. The fourth side d faces the second side b and borders the peripheral surface of the cover frame 20.

Desirably, the first side a of each of the peripheral windows 30B is simultaneously bordered by the corresponding side of the central window 30A and the second side b' of the peripheral window 30B at the front thereof, so that all of the surrounding windows 30B are continuous in a clockwise direction. Arranged around the central window 30A.

Further, the first side a and the second side b of each of the surrounding windows 30B are constituted by the corresponding partition frame 25, and the third side c and the fourth side d are constituted by the outer frame 21.

Thus, each of the surrounding windows 30B is bordered by one of the four sides of the four sides of the center window 30A, and the four surrounding windows 30B are arranged around the center window 30A in a clockwise or counterclockwise direction. Therefore, as a whole, the surrounding windows 30B form a regular arrangement.

The insulating window 31, which is composed of a ceramic material, is inserted into the central window 30A and the peripheral window 30B which are formed in the above arrangement. Plate support members 22 each having a stepped structure are formed on the inner surface of the outer frame 21 and both sides of the partition frame 25 such that the periphery of the insulating plate 31 is supported by the corresponding plate support member 22.

Further, the brackets 23, 26 are attached to the outer frame 21 and the partition frame 25 so as not to improperly disengage the insulating plate 31 from the window 30. As shown in the figure, the bracket 23 provided on the outer frame 21 has an L-shaped cross section, and the bracket 26 provided on the partition frame 25 has a U-shaped cross section.

The U-shaped bracket 26 can simultaneously support the insulating sheets 31 provided on the opposite sides of the single partition frame.

The brackets 23, 26 are fixed to the cover frame 20 by a fixing fitting or the like.

In addition, the shape and structure of the brackets 23, 26 can be modified in various ways as necessary.

Referring to Fig. 3, a heating fluid passage 24a is formed in the outer frame 21 of the cover frame 20 such that the fluid that heats the cover frame flows along the heating fluid passage 24a. Further, the inlet and outlet connection short tubes 24b are provided at predetermined portions of the outer frame 21 such that the heating fluid passages 24a are connected to the external heating fluid supply line via the short tubes 24b.

In addition, the antenna passage groove 27 is formed in the partition frame 25 of the cover frame 20 to create a space in the partition frame 25, so that the surrounding antenna 45 (which will be described later in detail) can pass through the partition frame 25. In other words, as shown in Fig. 2, the antenna passage grooves 27 are formed in the partition frame 25, which separates the peripheral windows 30B from each other.

In Fig. 3, reference numeral 28 denotes an antenna fixing bracket which is mounted in each of the antenna passage grooves 27 to fix the antenna to the corresponding partition frame 25. Component symbol 29 represents an antenna mount that covers each antenna mount bracket 28 to prevent the surrounding antenna 45 from moving away from its mounting position. Preferably, the antenna holder 29 also has a U-shaped cross section. More preferably, the antenna mount 29 is configured such that it can also be used to support the corresponding insulating plate 31.

Meanwhile, although the cover frame 20 is depicted as having a rectangular frame structure, the present invention is not limited thereto. For example, the cover frame 20 can have a pentagon or hexagonal frame structure and its configuration can be modified in various ways as desired.

The arrangement of the antennas 40 in the substrate processing apparatus provided with the cover frame 20 having the above structure will be described below with reference to Figs. 3 and 4.

Referring to Fig. 3, two center antennas 41 are mounted on the center window 30A of the cover frame 20. Four surrounding antennas 45 are mounted on the four surrounding windows 30B.

The two central antennas 41 include two antennas 40 that lead to the center of the cover frame and extend clockwise around the center of the central window 30A on the central window 30A.

The four surrounding antennas 45 are configured to direct the antennas to a corresponding peripheral window 30B and successively pass through the other three surrounding windows 30B in a clockwise direction. For example, referring to FIG. 3, the first surrounding antenna 451 extends from the first surrounding window 301 to the fourth surrounding window 304 in a clockwise direction via the second surrounding window 302 and the third surrounding window 303. The second surrounding antenna 452 extends from the second surrounding window 302 to the first surrounding window 301 in a clockwise direction via the third surrounding window 303 and the fourth surrounding window 304. The beginning end of the second surrounding antenna 452 is located within the first surrounding antenna 451. The third surrounding antenna 453 and the fourth surrounding antenna 454 are arranged in the same manner as the first surrounding antenna 451 and the second surrounding antenna 452. Therefore, on the whole, the four surrounding antennas 45 are regularly arranged in a spiral shape and are equidistant from each other.

The symbol 401 in the figure represents a portion in which the center antenna 41 or each of the surrounding antennas 45 is introduced. The symbol 405 represents an end support provided at a position where the center antenna 41 or each of the surrounding antennas 45 extends, so that the corresponding antenna 40 is connected to the ground portion via the end support.

Preferably, three antenna insertion holes 28a are formed in each of the antenna fixing brackets 28 such that the three surrounding antennas 45 passing through the corresponding partition frame 25 are inserted into the respective antenna insertion holes 28a. The antenna holder 29 (refer to FIG. 2) is coupled to the upper portion of the antenna fixing bracket 28 such that the surrounding antenna 45 is firmly fixed to the antenna fixing bracket 28.

In the above arrangement of the cover frame 20 and the antenna 40 provided by the present invention, the direction in which the plasma is generated in the chamber is related to the structure in which the surrounding window and the antenna are arranged around the central window of the cover frame. Therefore, during the substrate processing operation, not only the central portion of the chamber, but also the plasma density is uniformly formed around the chamber. In addition, eddy currents are generated around the partition frame 25, so that plasma can be distributed more uniformly. Thus, due to the arrangement of the cover frame 20 and the antenna 40 described above, the processing performance can be remarkably improved.

Fig. 4 is a plan view showing an embodiment of another antenna array structure.

The antenna 40' shown in Fig. 4 includes a center antenna 41' and a peripheral antenna 45' whose facing directions are opposite to the facing directions of the center antenna 41 and the surrounding antenna 45 of the Fig. 3 embodiment.

Each of the surrounding antennas 45' includes two branch antennas 45a that are branched from a single wire. Therefore, the four pairs of surrounding antennas 45' are arranged in a spiral form on the four surrounding windows 30B.

Next, the structure for supplying and injecting the processing gas to the substrate processing apparatus will be described with reference to FIGS. 5 to 10, and the substrate processing apparatus is provided with the cover frame 20 having the above structure.

In one embodiment, the shower head 61 (see Fig. 7) is provided in a portion of the partition frame 25, and a central window 30A is defined therein to inject a process gas from the shower head 61 into the chamber. In other words, the center window 30A has a rectangular structure, whereby the shower head 61 that injects the processing gas into the chamber is provided on each of the partition frames 25, which form the four sides of the center window 30A.

Fig. 7 is an inverted perspective view showing the central portion of the cover frame 20. The structure of the shower head 61 will be described below with reference to this figure.

The shower heads 61 respectively provided on the partition frames 25 forming the four sides of the center window 30A include a plurality of injection holes 62a which are regularly arranged. In the embodiment of Figure 7, the showerhead 61 is configured to inject process gas from the four sides of the central window 30A rather than from the corners of the central window 30A into the chamber.

Preferably, the shower head 61 has a groove 63 (refer to FIG. 6) formed on the lower surface of the partition frame 25 to pass the process gas through the groove 63, and the shower head plate 62, which contains the injection hole 62a. The outer side of the groove 63 is coupled to the partition frame 25.

8 to 10 are cross-sectional views showing the partition frame 25 provided with the shower head plate 62. Several injection structure embodiments of the showerhead 61 will be described below with reference to these figures.

The injection structure of the shower head 61 includes an injection surface 62b formed on the lower surface of the partition frame 25. As shown in Fig. 8, the injection surface 62b is positioned in the horizontal direction, and the injection hole 62a is positioned in the vertical direction.

Further, as shown in Fig. 9, the injection surface 62b' may be semicircular or semi-elliptical, and the injection hole 62a' is formed in a radial dispersion form on the circular injection surface 62b'. The circular injection surface 62b' and the radial injection hole 62a' form a simple structure which can effectively distribute the processing gas uniformly into the chamber, thereby improving the efficiency of the substrate processing operation.

Alternatively, as shown in Fig. 10, the injection surface 62b" may be formed not only on the lower surface of the partition frame 25, but also on one side of the partition frame 25, and may form an injection hole 62a" to penetrate the lower surface and The corresponding sides of the partition frame 25 are separated. In this example, the side injection holes 62a" are preferably arranged such that the process gas discharged from the side injection holes 62a" is injected into the center window 30A.

The structure for supplying the process gas to the shower head 61 will be described below with reference to the related drawings including the fifth and sixth figures, which can be embodied in several embodiments having the above structure.

The process gas supply structure can be embodied in a variety of ways. In one embodiment, the gas inlet 64 (see Fig. 6) is formed at a position where the partition frame 25 abuts the four corners of the center window 30A. The gas inlet pipe 65 is vertically coupled to the upper surface of the partition frame 25 having the gas inlet 64.

The process gas supply structure may be configured such that the gas supplied through each of the gas inlet pipes 65 flows in a one-way or two-way flow along the flow passage formed in the corresponding partition frame 25 starting from a corresponding corner of the center window 30A. In the example where the process gas supply structure is configured to flow the gas in both directions, the barrier wall is disposed inside the recess 63, which forms a flow passage at a corresponding side of the center window 30A.

Since the gas inlet pipe 65 is disposed around the four corners of the center window 30A, the formation of the process gas supply structure does not hinder the bracket 26 or 29 supporting the insulating plate 31.

The component symbols 65a, 65b represent flanges of the gas inlet pipe 65. The upper flange 65a is fixed to the upper cover structure provided above the chamber, and the lower flange 65b is fixed to the cover frame 20.

In this embodiment, four gas inlet tubes 65 are provided around the central window 30A. Referring to Fig. 5, a single gas supply pipe 66a for supplying gas to the four inlet pipes 65 is branched into two first supply pipes 66b. Each of the first supply pipes 66b is branched into two second supply pipes 66c. The second supply pipe 66c is connected to each of the gas inlet pipes 65.

Meanwhile, although the shower head 61 is depicted as being arranged in a rectangular shape, the present invention is not limited thereto. Depending on the structure of the cover frame 20, the arrangement of the showerheads 61 can be modified in various ways, for example, it can be arranged in an octagon or a hexagon.

Next, the structure of the cooling antenna 40 and the structure of the heating insulating plate 31 will be described with reference to FIGS. 11 to 14.

The structure of the heating insulating plate 31 includes a heating pipe 71 that discharges heated air to the insulating plate 31.

The heating tube 71 is designed to be suitable for uniformly heating the arrangement of the insulating sheets 31. The arrangement of the heating tubes 71 can be appropriately modified as necessary, as long as it can uniformly heat the insulating sheets 31. In the embodiment of these figures, two heating lines are provided in each of the surrounding windows 30B. The insulating plate 31 placed in the center window 30A is heated by a heating line extending from the surrounding window 30B. The heating line comprises a heating tube 71 which is arranged horizontally on the window and has an outflow opening directed towards the window.

Of course, the heating tubes 71 can be placed lower or higher than the antennas arranged on the window to avoid mutual interference.

As shown in Fig. 11, the heating line 71a is connected between the heating pipes 71. In this example, each heating line 71a includes a tube having a diameter smaller than the diameter of the heating tube 71. Alternatively, the heating line 71a may not be provided.

Thus, since the apparatus of the present invention is provided with the heating tube 71 for heating the insulating sheet 31, the deposition of the polymer onto the insulating sheet 31 can be reduced.

The method of supplying heated air to the heating pipe 71 can be specifically carried out by various structures, for example, connecting a heated air supply line thereto. In this embodiment, a swirl generator 73 is used. This will be explained later with reference to Fig. 12.

As shown in Fig. 14, in the structure of the cooling antenna 40, each of the antennas 40, 41, 45 has a hollow tubular shape, and a cooling fluid flows through the tubular antenna 40 to cool the antenna 40.

In this embodiment, the cooling path is configured to cause the cooling fluid to break into the antenna 40 via the beginning of the antenna 40 and then exit the antenna 40 via its trailing end. The configuration of the cooling fluid circuit flowing along the antenna 40 can be embodied using well known techniques and will not be further described.

In an embodiment of the invention, the heating of the insulating plate and the cooling of the antenna may be embodied by the vortex generator 73. This will be detailed below.

The vortex generator 73 is an energy separating device that uses a circular tube and a nozzle having a simple structure without using any chemical action or combustion action to separate the compressed air into low temperature air and high temperature air. As shown in Fig. 12, compressed air is supplied to the scroll 74 via the supply pipe. Next, the compressed air supplied to the scroll 74 mainly enters the swirl chamber 75 and is rotated at an ultra high speed. The rotating air flows to the heated air outlet. At this point, when the secondary vortex passes through the low pressure zone within the primary vortex, the secondary vortex will lose heat and flow to the cooling air outlet. In the two air flows, the air particles of the internal air flow circulate for the same time as the air particles of the external air flow, so the internal air flow moves at a slower speed than the external air flow. The difference in moving speed means that the kinetic energy is reduced. The lost kinetic energy is converted into heat, which increases the temperature of the external airflow and further reduces the temperature of the internal airflow.

The cooling paths of the heating tube 71 and the antenna 40 are respectively connected to both ends of the vortex generator 73. Thus, the structure of the heating insulating plate 31 and the cooling antenna 40 can be simultaneously embodied by the simple structure.

Meanwhile, although the vortex generator is depicted as a means for providing heated air and cooling air, the apparatus is not limited to the vortex generator. A cooler having another structure may be employed, or a device for supplying heated air and a device for supplying cooling air may be separately provided.

Next, the energy loss reducing structure of the substrate processing apparatus will be described with reference to Figs. 15 to 19, which can minimize the energy loss around the inner surface of the chamber and ensure the uniformity of the plasma.

As shown in Figs. 15 and 16, the pad protector 81 is mounted on the inner surface of the wall of the chamber 10. Each pad protector 81 is in intimate contact with the corresponding corner and corresponding chamber wall.

Figure 15 illustrates a pad protector 81 disposed on the inner face of the outer frame of the cover frame 20 (portion W of Figure 1), and each extending from a corresponding corner of the cover frame 20 to a second adjacent outer frame inside.

FIG. 16 illustrates the spacer protector 81 when the partition frame 25 (see FIG. 2 and the like) is not disposed in the cover frame 20 or the pad protector 81 is located around the outer casing of the chamber 10 instead of the cover frame 20. Installation situation. The pad protector 81 is an element also known as a pad or protector. The pad protector 81 includes a corner protector 82 each having an L shape and mounted at a corresponding corner of the chamber 10, and a wall protector 83 each having a planar shape and mounted on a corresponding wall surface of the chamber 10.

The pad protector 81 is formed by anodizing the surface of the aluminum plate.

Further, in the embodiment of Fig. 16, only the corner guard 82 of the pad protector 81 is formed by the surface of the anodized aluminum plate. In this example, the wall protector 83 is composed of a ceramic coated plate.

In this embodiment, the edges of the mutually assembled corner protectors 82 and the corresponding edges of the adjacent wall protectors 83 have a ladder-like structure that engages each other such that the corner guard 82 and the wall protector 83 are joined together. It is flush on the wall of the chamber.

As shown in the "C" portion of Fig. 17, the corner protector 82 has a surface inclined at its inner corner with respect to the wall surface of the chamber.

In the energy loss reduction structure according to the present invention, the holes 12 are formed through the corners of the chamber wall surface behind the corresponding corner guard 82. The capacitor 85 is mounted in the hole 12 and electrically connected to the corresponding corner protector 82. The capacitor 85 is connected to an external circuit or to ground.

As shown in FIGS. 15 to 17, a single capacitor 85 can be inserted through the wall corner of the chamber 10 and connected to the back surface of the corner protector 82. In this example, the hole 12 into which the power supply container 85 is inserted forms a corner of the wall surface penetrating the chamber 10 in the diagonal direction.

Alternatively, as shown in Fig. 18, a plurality of capacitors 85 are disposed around corners of the chamber 10. In this case, the capacitor 85 can be inserted through the respective wall faces of the corners of the chamber 10 and connected to the back surface of the corner protector 82. Of course, the holes 12 form wall faces that pass through the corners of the corners of the chamber 10, so that the capacitors 85 are inserted into the wall surfaces via the respective holes 12.

Although not shown, a sealing member (not shown) is preferably provided to seal the chamber 10 for each of the holes 12 into which the capacitor 85 is inserted.

The capacitor 85 is coupled to the corresponding corner protector 82 by a threaded coupling method. To this end, a boss 84 protrudes from the back of the corner protector 82. The external thread portion 86 is provided at the end of the capacitor 85. The outer threaded portion 86 is screwed into the boss 84. In addition, a boss recess 13 is formed in the hole 12 such that the boss 84 of each capacitor 85 is inserted into the corresponding boss recess 13.

The pad protector 81, the boss 84, the screw portion 86, the capacitor 85, and the external circuit connecting the capacitor 85 are electrically connected to each other.

Preferably, the support cover 88 is mounted outside the wall surface of the chamber 10 to support the corresponding capacitor 85. The support cover 88 can be embodied in a variety of ways as long as it can support the corresponding capacitor 85 that is inserted into the aperture 12.

Capacitor 85 includes a vacuum variable capacitor. Vacuum variable capacitors have a known structure and will not be described in detail herein. Preferably, in the present invention, the vacuum variable capacitor is configured such that the capacitance of the capacitor is controlled by adjusting (e.g., rotating) the capacitance control device 89 provided outside the chamber.

The reason for controlling the capacitance of the capacitor is that the efficiency of the energy loss reduction structure can be optimized when the capacitance of the capacitor 85 is controlled in response to the plasma generation conditions within the chamber 10.

As shown in Fig. 19, in the example A in which the substrate processing apparatus lacks the energy loss reducing structure of the present invention, the potential around the wall surface and the corner of the chamber 10 is almost zero. However, in the example B provided with the pad guard 81 and the capacitor 85 as in the embodiment of the present invention, the potential around the corner of the chamber 10 is remarkably increased to zero or more.

Therefore, in the present invention, as shown in the example B of Fig. 19, the potential difference of the entire chamber 10 has been minimized, so that plasma can be more uniformly generated in the chamber 10. In particular, as shown in the "K" portion of the figure, energy loss on the wall of the chamber can be reduced. The energy saved can be used to generate plasma. Therefore, the efficiency of the deposition apparatus or etching apparatus such as the energy loss reducing structure of the present invention can be improved.

Meanwhile, the present invention having the above characteristics can be applied to all types of substrate processing apparatuses using plasma. For example, the present invention can be applied to a dry etching machine, a chemical vapor deposition apparatus, or the like.

As described above, in the substrate processing apparatus having the window heating structure according to the present invention, the heated air is supplied to the window, and the window is heated in such a manner as to discharge the heated air to the window. Therefore, the present invention can prevent by-products in the chamber from being deposited in the window, thereby enhancing the reliability of the device.

Further, in the present invention, a single device can simultaneously heat the window and the cooling antenna, thereby enhancing the performance of the device despite the simple structure.

The techniques described in the embodiments of the present invention are intended to be implemented independently or in combination. While the invention has been described in detail with reference to the embodiments of the present invention, it will be understood that Therefore, the spirit or scope of the invention is defined by the scope of the appended claims.

10. . . Chamber

11. . . shell

12. . . Hole

13. . . Groove

15. . . Support table

17. . . electrode

20. . . Cover frame

twenty one. . . Outer frame

twenty two. . . supporting item

23, 26, 29. . . support

24a. . . aisle

24b. . . Short tube

25. . . Separation frame

27. . . Groove

28. . . bracket

28a. . . Jack

30, 30A, 30B. . . Windows

31. . . Insulation board

40, 40', 41, 41', 45, 45', 45a. . . antenna

50. . . Power Supplier

60. . . Supply unit

61. . . Sprinkler

62. . . Sprinkler plate

62a, 62a', 62a"... injection hole

62b, 62b', 62b"... surface

63. . . Groove

64. . . Entrance

65. . . Inlet tube

65a, 65b. . . Flange

66a, 66b, 66c. . . Supply tube

71. . . Heating pipe

71a. . . Heating pipeline

73. . . Vortex generator

74. . . Vortex

75. . . Vortex chamber

81, 82, 83. . . Protective member

84. . . Protrusion

85. . . Capacitor

86. . . Thread part

88. . . Support cover

89. . . Capacitor control device

301-304. . . Windows

401. . . section

405. . . supporting item

451-454. . . antenna

A-d, a’. . . Side

C, K, W. . . section

S. . . Substrate

Figure 1 is a schematic cross-sectional view showing the construction of a substrate processing apparatus according to the present invention;

Figure 2 is a perspective view of a cover frame of a substrate processing apparatus according to the present invention;

3 is a plan view showing an antenna array structure on a cover frame of a substrate processing apparatus according to an embodiment of the present invention;

4 is a plan view showing an antenna array structure on a cover frame of a substrate processing apparatus according to another embodiment of the present invention;

Figure 5 is a perspective view of a key portion of the upper portion of the cover frame showing the process gas supply structure of the substrate processing apparatus according to the present invention;

Figure 6 is a cross-sectional perspective view taken along line A-A of Figure 5;

Figure 7 is an inverted perspective view of the center window showing the process gas injection structure of the substrate processing apparatus according to the present invention;

8 to 10 are cross-sectional views showing a process gas injection structure of a substrate processing apparatus according to several embodiments of the present invention;

Figure 11 is a plan view showing an antenna cooling structure and an insulating plate heating structure of a substrate processing apparatus according to the present invention;

Figure 12 is a cross-sectional view showing a vortex generator according to the present invention for cooling an antenna and heating an insulating plate;

Figure 13 is a cross-sectional view taken along line B-B of Figure 11;

Figure 14 is a cross-sectional view of an antenna according to the present invention;

Figure 15 is a plan view showing an embodiment of the structure of the present invention for reducing energy loss in a substrate processing apparatus;

Figure 16 is a plan view showing another structural embodiment according to the present invention for reducing energy loss in a substrate processing apparatus;

Figure 17 is an enlarged view of the key part of Figure 16;

Figure 18 is an enlarged view corresponding to Figure 17, but showing another embodiment;

Figure 19 is a reference view of the present invention showing the effect of a structure for reducing energy loss.

10. . . Chamber

11. . . shell

13. . . Groove

15. . . Support table

17. . . electrode

20. . . Cover frame

twenty one. . . Outer frame

25. . . Separation frame

30. . . Windows

40. . . antenna

50. . . Power Supplier

60. . . Supply unit

S. . . Substrate

W. . . section

Claims (5)

A substrate processing apparatus having a window heating structure, comprising: a chamber for processing a substrate; a window disposed at an upper portion of the chamber to realize an internal space of the chamber and an antenna Coupling, and the window is composed of an insulating material; a heating tube is disposed above the window, the heating tube discharges heated air to an upper surface of the window to heat the window; and is configured to supply the heated air To the device inside the heating tube. The substrate processing apparatus of claim 1, wherein the chamber comprises a chamber housing and a cover frame coupled to an upper end of the chamber housing, the cover frame comprising: an outer frame forming a polygonal frame a perimeter of the structure; and a plurality of divider frames disposed within the outer frame and coupled to each other to divide the window into a plurality of windows, the windows comprising: a central window defined by the divider frames and located a central portion of the cover frame; and a plurality of surrounding windows surrounding the central window, the peripheral windows being separated from each other by the dividing frame, and the heating tube simultaneously heating the central window and the surrounding windows. The substrate processing apparatus of claim 1, wherein the heating tube is arranged above the window in a horizontal direction, and a plurality of injection holes are formed in the heating tube, the injection holes being oriented toward the window. The substrate processing apparatus of claim 1, wherein the apparatus comprises a vortex generator for simultaneously generating heated air and cooling air. The substrate processing apparatus of claim 4, wherein a cooling passage is formed in the antenna such that a cooling fluid flows through the cooling passage along the antenna, and the cooling air generated by the device is supplied to the antenna Cool the antenna to cool the antenna.