TWI422868B - Optical lens on wafer level and related method for forming the optical lens one wafer level - Google Patents

Description

Wafer level optical lens and related forming method

The present invention relates to a wafer level optical lens and related forming method thereof, and more particularly to a crystal in which a bonding material is filled in a dielectric plug between two optical elements or a dielectric plug between two spacers. Circular optical lenses and their associated methods of forming to enhance adhesion between optical components.

With the evolution of optical technology, the use rate of image capture devices is becoming more and more popular. In addition to digital cameras and mobile devices such as mobile phones, personal digital assistants (PDAs) and notebook computers usually have image capture functions.

Optical lenses are one of the most important components in image capture devices. Currently, in the manufacture of wafer-level optical lenses, glues are typically applied between the optical components to bond the optical components. However, since it is often necessary to improve the temperature and/or humidity for quality testing in the manufacturing process of an optical lens, it often causes the optical element on the optical lens to fall off due to temperature or humidity in the quality test.

Therefore, how to improve the adhesion between optical components is one of the important considerations in this design field.

Accordingly, one of the objects of the present invention is to provide a wafer level optical lens and related method of forming the same to solve the above problems.

The present invention discloses a wafer level optical lens. The wafer level optical lens comprises: a first optical component, a second optical component, a first spacer, and an adhesive material. The first spacer includes at least one first dielectric plug extending through the first spacer, wherein the first optical component and the second optical component are separated on both sides of the first spacer. An adhesive material is coated between the first optical component and the first spacer and coated between the first spacer and the second optical component, and is filled in the first dielectric plug At least part of it. The first optical component can be an aperture, a lens plate or an image sensor; the second optical component can also be an aperture, a lens plate or an image sensor.

The invention further discloses a wafer level optical lens. The wafer level optical lens comprises: a first spacer, a second spacer, an optical component, and an adhesive material. An optical component is disposed between the first spacer and the second spacer, wherein the optical component further includes at least one dielectric plug extending through the optical component. An adhesive material is applied between the first spacer and the optical component and between the optical component and the second spacer, and is filled in at least a portion of the dielectric plug.

The present invention further discloses a method of forming a wafer level optical lens. The method includes the steps of: providing a first optical component and a second optical component; inserting a first spacer between the first optical component and the second optical component to cause the first optical component and the first The second optical component is disposed on the two sides of the first spacer; the at least one first dielectric plug is disposed in the first spacer, wherein the first dielectric plug extends through the first spacer; Applying an adhesive material between the first optical component and the first spacer to bond the first optical component and the first spacer, and coating the adhesive material on the first spacer and the first The first spacer and the second optical component are bonded between the two optical components, wherein the adhesive material is filled in at least a portion of the first dielectric plug.

Certain terms are used throughout the description and following claims to refer to particular elements. It should be understood by those of ordinary skill in the art that hardware manufacturers may refer to the same elements by different nouns. The scope of this specification and the subsequent patent application do not use the difference of the names as the means for distinguishing the elements, but the difference in function of the elements as the criterion for distinguishing. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to". In addition, the term "coupled" is used herein to include any direct and indirect electrical connection. Therefore, if a first device is coupled to a second device, it means that the first device can be directly electrically connected to the second device or indirectly electrically connected to the second device through other devices or connection means.

1 is a cross-sectional view showing a first embodiment of a structure of a wafer level optical lens 100 of the present invention. The wafer level optical lens 100 includes, but is not limited to, a plurality of optical elements 120-150, a plurality of spacers 160-180, and at least one dielectric plug 190. As shown in FIG. 1, the plurality of optical components include an image sensor 120, a first lens plate 130, a second lens plate 140, and a diaphragm 150, and the optical components 120-150 are respectively It is isolated by the first spacer 160, the second spacer 170, and the third spacer. For example, the image sensor 120 and the first lens plate 130 are separated from the two sides of the first spacer 160; the first lens plate 130 and the second lens plate 140 are separated from the two sides of the second spacer 170; The second lens plate 140 and the aperture 150 are separated on both sides of the third spacer 180. It should be noted that, in this embodiment, the first spacer 160, the second spacer 170, and the third spacer 180 each include at least one dielectric plug 190 extending through the spacers 160-180. In other words, any pad (eg, 160-180) positioned between the two optical elements to isolate the two optical elements can include at least one dielectric plug 190 extending therethrough.

In addition, an adhesive material (not shown) is applied between any of the optical elements 120-150 and any of the spacers 160-170, and is filled in at least a portion of the dielectric plug 190. For example, the adhesive material is applied between the image sensor 120 and the first spacer 160 to bond the image sensor 120 and the first spacer 160, and so on. In this way, the adhesion between the two optical elements can be enhanced by filling the adhesive material into the dielectric plug 190 between any two optical elements.

Please note that the wafer level optical lens 100 described above may be a compact camera module (CCM), but this is not a limitation of the present invention. The wafer level optical lens 100 can be disposed in an image capturing device, but the invention is not limited thereto. In addition, the location, size, and number of dielectric plugs 190 are not limited. That is, various changes in the position, size, and number of the dielectric plugs 190 are possible without departing from the spirit of the present invention, and are intended to fall within the scope of the present invention.

In an embodiment, the adhesive material may include epoxy resin (Epoxy Resin), but the invention is not limited thereto, and other materials may be used to bond the optical components and the spacers in the wafer level optical lens 100. . Furthermore, the types of optical elements mentioned in the present invention are not limited.

2 is a cross-sectional view showing a second embodiment of the structure of a wafer level optical lens 200 of the present invention. As shown in FIG. 2, the structure of the wafer level optical lens 200 is similar to that of the wafer level optical lens 100 shown in FIG. In this embodiment, the wafer level optical lens 200 includes a plurality of optical elements 120-150, a plurality of spacers 160-180, and at least one dielectric plug 290, and the optical elements 120-150 are respectively A spacer 160, a second spacer 170, and a third spacer are isolated. It should be noted that, in this embodiment, the first lens plate 130 and the second lens plate 140 each include at least one dielectric plug 290 extending through the lens plates 130, 140. In other words, any optical component (eg, 130, 140) positioned between the two pads can include at least one dielectric plug 290 extending therethrough. In addition, the adhesion material (not shown) is applied between any of the optical elements 120-150 and any of the spacers 160-170, and is filled in at least a portion of the dielectric plug 290. In this way, the adhesion between the two spacers can be filled by filling the adhesive material into the dielectric plug 290 between any two spacers.

3 is a cross-sectional view showing a third embodiment of the structure of a wafer level optical lens 300 of the present invention. As shown in FIG. 3, the structure of the wafer level optical lens 300 is similar to that of the wafer level optical lens 100 shown in FIG. 1 or the wafer level optical lens 200 shown in FIG. 2, and the wafer level is The optical lens 300 is an embodiment obtained by combining the wafer level optical lens 100 and the wafer level optical lens 200. In the present embodiment, the wafer level optical lens 300 includes a plurality of optical elements 120-150, a plurality of pads 160-180, at least one dielectric plug 190, and at least one dielectric plug 290. It should be noted that the first spacer 160, the second spacer 170 and the third spacer 180 each include at least one dielectric plug 190 extending through the spacers 160-180, and the first lens plate 130 and the second lens plate Each of the 140 includes at least one dielectric plug 290 extending through the lens plates 130, 140. In other words, any optical element (eg, 130, 140) positioned between the two pads can include at least one dielectric plug 290 extending therethrough and positioned between the two optical elements to isolate this Any of the two optical components (e.g., 160-180) may also include at least one dielectric plug 190 extending therethrough.

The above embodiments are merely illustrative of the possible embodiments of the invention and are not limiting of the invention. It will be appreciated by those skilled in the art that various variations of wafer level optical lenses 100-300 in Figures 1 through 3 are possible without departing from the spirit of the present invention.

4 is a flow chart showing an operation example of a method for forming a wafer level optical lens according to the present invention, which includes (but is not limited to) the following steps (please note that if available For qualitatively identical results, these steps are not necessarily performed in accordance with the execution order shown in Figure 4: Step 402: Start.

Step 404: providing a first optical element and a second optical element.

Step 406: Disposing at least one first dielectric plug in the first gasket, wherein the first dielectric plug penetrates the first gasket.

Step 408: Insert a first spacer between the first optical component and the second optical component to separate the first optical component and the second optical component from both sides of the first spacer.

Step 410: Apply an adhesive material between the first optical component and the first spacer to bond the first optical component and the first spacer, and apply the adhesive material to the first spacer and the second optical component. The first spacer and the second optical component are bonded to each other, wherein the adhesive material is filled in at least a portion of the first dielectric plug.

Please follow the steps shown in Figure 4 and the components shown in Figure 1 to learn how to make a wafer-level optical lens (for example, 100). For the sake of brevity, the related operations of the steps shown in FIG. 4 will not be repeated here.

FIG. 5 is a flow chart showing another example of the operation of the method for forming a wafer level optical lens according to the present invention. The method includes, but is not limited to, the following steps: Step 502: Start.

Step 504: providing a first spacer, an optical component, and a second spacer.

Step 506: Locating the optical element between the first spacer and the second spacer.

Step 508: Disposing at least one second dielectric plug into the optical component, wherein the second dielectric plug penetrates the optical component.

Step 510: Apply an adhesive material between the first spacer and the optical component to bond the first spacer and the optical component, and apply the adhesive material between the optical component and the second spacer to bond the optical component. And a second gasket, wherein the adhesion material is filled in at least a portion of the second dielectric plug.

Please follow the steps shown in Figure 5 and the components shown in Figure 2 to learn how to make a wafer-level optical lens (for example: 200). For the sake of brevity, the related operations of the steps shown in Figure 5 will not be repeated here.

It is to be noted that the steps of the above-described various processes are merely examples of the present invention, and are not intended to limit the present invention, and the methods may further include other intermediate steps or without departing from the spirit of the present invention. Several steps can be combined into a single step to make the appropriate changes. Those skilled in the art will appreciate that various variations of the methods are possible. For example, the steps in Figure 4 can be combined with the steps in Figure 5 to form a new variant embodiment.

The embodiments described above are only intended to illustrate the technical features of the present invention and are not intended to limit the scope of the present invention. As can be seen from the above, the present invention provides a wafer level optical lens and related methods of forming the same. The adhesion between each other can be enhanced by filling an adhesive material between the dielectric plug 190 between any two optical components and/or the dielectric plug 290 between any two spacers. In this way, the wafer-level optical lens can successfully pass the quality test in the process. In addition, since the wafer level optical lens disclosed in the present invention is simple in design and easy to manufacture, it does not add additional manufacturing cost.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

100, 200, 300. . . Wafer level optical lens

120. . . Image sensor

130. . . First lens plate

140‧‧‧second lens plate

150‧‧‧ aperture

160~180‧‧‧shims

190, 290‧‧‧ dielectric plug

402~410, 502~510‧‧‧ steps

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing a first embodiment of the structure of a wafer level optical lens of the present invention.

Figure 2 is a cross-sectional view showing a second embodiment of the structure of a wafer level optical lens of the present invention.

Figure 3 is a cross-sectional view showing a third embodiment of the structure of a wafer level optical lens of the present invention.

4 is a flow chart showing an operational example of one method of forming a wafer level optical lens of the present invention.

Figure 5 is a flow chart showing another example of the operation of the method of forming a wafer level optical lens of the present invention.

100. . . Wafer level optical lens

120. . . Image sensor

130. . . First lens plate

140. . . Second lens plate

150. . . aperture

160～180. . . Gasket

190. . . Dielectric plug

Claims (15)

An optical lens on wafer level, comprising: a first optical component; a second optical component; a first spacer comprising at least one first dielectric plug (via The first spacer, wherein the first optical component and the second optical component are separated from each other on the two sides of the first spacer; and an adhesive material coated on the first optical component and the first Between the pads, and between the first spacer and the second optical component, and filling in at least a portion of the first dielectric plug. The wafer level optical lens of claim 1, further comprising: a third optical element; and a second spacer, wherein the second optical element and the third optical element are separated from the first Two sides of the spacer; wherein the second optical component is located between the first spacer and the second spacer, and further comprising at least one second dielectric plug extending through the second optical component; The adhesive material is additionally coated between the second optical component and the second spacer, and is filled in at least a portion of the second dielectric plug. The wafer level optical lens of claim 1, wherein the first optical component comprises a diaphragm, a lens plate or a shadow Like a sensor. The wafer level optical lens described in claim 1 is a compact camera module (CCM). The wafer level optical lens of claim 1, wherein the wafer level optical lens is disposed in an image capturing device. A wafer level optical lens comprising: a first spacer; a second spacer; an optical component between the first spacer and the second spacer, wherein the optical component further comprises at least one An electrical plug extends through the optical component; and an adhesive material is coated between the first spacer and the optical component and coated between the optical component and the second spacer, and is filled in the Among at least a portion of the dielectric plug. The wafer level optical lens of claim 6, wherein the optical element comprises a lens plate. The wafer level optical lens described in claim 6 is a miniature camera module. The wafer level optical lens of claim 6, wherein the wafer level optical lens is disposed in an image capturing device. A method of forming a wafer level optical lens, comprising the steps of: providing a first optical component and a second optical component; and disposing at least one first dielectric plug in a first spacer, wherein the first a dielectric plug is inserted through the first spacer; the first spacer is inserted between the first optical component and the second optical component to separate the first optical component and the second optical component Both sides of the first spacer; and an adhesive material is coated between the first optical component and the first spacer to bond the first optical component and the first spacer, and the adhesive material is coated The first spacer and the second optical component are bonded between the first spacer and the second optical component, wherein the adhesive material is filled in at least a portion of the first dielectric plug. The method of claim 10, further comprising: providing a third optical component; inserting a second spacer between the second optical component and the third optical component to enable the second optical The component and the third optical component are separated from the two sides of the second spacer; at least one second dielectric plug is disposed in the second optical component, wherein the second dielectric plug extends through the second Optical component; Coating the adhesive material between the second optical component and the second spacer to bond the second optical component and the second spacer, wherein the adhesive material fills at least the second dielectric plug Part of it. The method of claim 10, wherein the first optical component comprises an aperture, a lens plate or an image sensor. The method of claim 10, wherein the second optical component comprises an aperture, a lens plate or an image sensor. The method of claim 10, wherein the wafer level optical lens is a miniature camera module. The method of claim 10, wherein the wafer level optical lens system is disposed in an image capturing device.