CN103513388A - Wafer level camera lens and manufacturing method thereof - Google Patents
Wafer level camera lens and manufacturing method thereof Download PDFInfo
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- CN103513388A CN103513388A CN201210214525.6A CN201210214525A CN103513388A CN 103513388 A CN103513388 A CN 103513388A CN 201210214525 A CN201210214525 A CN 201210214525A CN 103513388 A CN103513388 A CN 103513388A
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- glass substrate
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Abstract
The invention discloses a manufacturing method of a wafer level camera lens. The manufacturing method of the wafer level camera lens comprises the following steps that a first glass substrate is provided; a first lens is formed on a first side of the first glass substrate, wherein the first lens possesses a first effective diameter area and a first peripheral area surrounding the first effective diameter area; a second lens is formed on a second side of the first glass substrate, wherein the second lens possesses a second effective diameter area and a second peripheral area surrounding the second effective diameter area and a thickness of the second peripheral area is greater than a thickness of the second effective diameter area; a back focal length of the lens is calculated; a second glass substrate is formed so as to contact the second peripheral area; according to the back focal length, a thickness of the second glass substrate is adjusted; an image sensing module is formed on the other side of the second glass substrate, wherein the other side is opposite to the second peripheral area.
Description
Technical field
Content of the present invention relates to a kind of camera lens and manufacturing technology thereof, and particularly relates to a kind of wafer scale camera lens and manufacture method thereof.
Background technology
In recent years, along with digitized video building block technique is constantly progressive, make the mankind have Bu Tong cognition in the past for the definition of image and application.In the revolution agitation of this ripple image, the universalness that surely belongs to image sensing module attracting attention most, can carry for the product of different purposes and type corresponding image sensing module, such as similar mobile phone, notebook computer etc., in volume size, there is the e-machine of certain limitation, can carry the image sensing module of miniaturization, low priceization.Along with the trend of cell phone camera module microminiaturization with low priceization, the appearance of wafer scale (wafer level) camera technique receives much concern.
The making pattern that significantly changes traditional image sensor with wafer-class encapsulation technology, advantage is too numerous to enumerate.Reason is, wafer-class encapsulation technology is to reach volume and weight microminiaturization in order to construct stereo circuit on electronic component originally, to produce more a high proportion of element on the wafer of same area.And when such theory is applied to production image sensor, expect exactly image sensor production can be changed into electronic component industry the same, and then standardization and a large amount of production.Utilizing another advantage of wafer scale manufacturing technology is low production cost.If the size of optical element can be dwindled, the number of elements of average every wafer just can increase, and the manufacturing cost of every micro optical element also can reduce, then coordinates the miniaturization of sensor or DSP, and optical element also can just can significantly reduce by miniaturization Shi， unit wafer manufacture cost.
Yet, because the lens set in camera lens need to be carried out adjustment for focal length, so that camera lens is able to the object imaging of wish shooting in position.How to design one and adjust easily mechanism, for this reason an industry problem demanding prompt solution.
Summary of the invention
Therefore,, for addressing the above problem, the invention provides a kind of wafer scale (wafer level) camera lens manufacture method.Wafer scale camera lens manufacture method comprises the following step.The first glass substrate is provided; Form the first eyeglass in the first side of the first glass substrate, wherein the first eyeglass has the first effective diameter district and around first external zones in the first effective diameter district; Form the second eyeglass in the second side of the first glass substrate, wherein the second eyeglass has the second effective diameter district and around second external zones in the second effective diameter district, wherein the thickness of the second external zones is greater than the thickness in the second effective diameter district; Calculate rear lens focus distance; Form the second glass substrate, to contact the second external zones; Thickness according to rear lens focus apart from adjustment the second glass substrate; And form image sensing module in the opposite side of relative the second external zones of the second glass substrate.
According to content one embodiment of the present invention, wherein corresponding the first effective diameter district of the first eyeglass of the first glass substrate and the second effective diameter district of the second eyeglass have aperture.
According to another embodiment of content of the present invention, wafer scale camera lens manufacture method more comprises formation optical filter between image sensing module and the second glass substrate, between the second glass substrate and the second eyeglass, between the second eyeglass and the first glass substrate or between the first glass substrate and the first eyeglass.
According to the another embodiment of content of the present invention, wafer scale camera lens manufacture method more comprises with viscose glue makes the second glass substrate be engaged in the second external zones, more comprises the thickness of adjusting the second glass substrate according to the thickness of rear lens focus distance and viscose glue according to rear lens focus apart from the step of adjusting the thickness of the second glass substrate.
According to a content of the present invention embodiment again, wafer scale camera lens manufacture method more comprises the thickness of adjusting the second external zones, more comprises the thickness of adjusting the second glass substrate according to the thickness of rear lens focus distance and the second external zones according to rear lens focus apart from the step of adjusting the thickness of the second glass substrate.
An embodiment who also has according to content of the present invention, wherein the thickness of the first external zones is greater than the thickness in the first effective diameter district.
An embodiment who has again according to content of the present invention, wherein image sensing module comprises image sensor and sensor protective seam, and sensor protective seam is covered in image sensor.The step that forms image sensing module also comprises makes sensor protective seam contact the second glass substrate, so that the distance in the second effective diameter district of image sensor and the second eyeglass is equivalent to rear lens focus distance.
Another aspect of content of the present invention is that a kind of wafer scale camera lens is being provided.Wafer scale camera lens comprises: the first glass substrate, the first eyeglass, the second eyeglass, the second glass substrate and image sensing module.The first eyeglass is positioned at the first side of the first glass substrate, and wherein the first eyeglass has the first effective diameter district and around first external zones in the first effective diameter district.The second eyeglass is positioned at the second side of the first glass substrate, and wherein the second eyeglass has the second effective diameter district and around second external zones in the second effective diameter district, wherein the thickness of the second external zones is greater than the thickness in the second effective diameter district.The second glass substrate contacts the second external zones, the thickness of the second glass substrate according to rear lens focus apart from adjustment.Image sensing module is in the opposite side of relative the second external zones of the second glass substrate.
According to content one embodiment of the present invention, wherein corresponding the first effective diameter district of the first eyeglass of the first glass substrate and the second effective diameter district of the second eyeglass have aperture.
According to another embodiment of content of the present invention, wafer scale camera lens also comprises optical filter, is arranged between image sensing module and the second glass substrate, between the second glass substrate and the second eyeglass, between the second eyeglass and the first glass substrate or between the first glass substrate and the first eyeglass.
According to the another embodiment of content of the present invention, wafer scale camera lens also comprises viscose glue, so that the second glass substrate is engaged in the second external zones, the thickness of the second glass substrate is further adjusted according to the thickness of rear lens focus distance and viscose glue.
According to a content of the present invention embodiment again, the thickness of the second glass substrate further according to rear lens focus apart from and adjust after the thickness of the second external zones adjust.
An embodiment who has more according to content of the present invention, wherein the thickness of the first external zones is greater than the thickness in the first effective diameter district.
An embodiment who has again according to content of the present invention, wherein image sensing module comprises image sensor and sensor protective seam, and sensor protective seam is covered in image sensor.Sensor protective seam contacts the second glass substrate, so that the distance in the second effective diameter district of image sensor and the second eyeglass is equivalent to rear lens focus distance.
The advantage of application content of the present invention is by directly carrying out the thickness adjustment of corresponding rear lens focus distance with the second external zones part of the second eyeglass, do not need additionally with manufacture craft, to form adjustment element, can facilitate and rapidly relative the second eyeglass of image sensing module be positioned, and reaching easily above-mentioned object.
Accompanying drawing explanation
For above and other object, feature, advantage and the embodiment of content of the present invention can be become apparent, appended the description of the drawings is as follows:
Fig. 1 is in content one embodiment of the present invention, a kind of sectional view of wafer scale camera lens;
Fig. 2 is in content one embodiment of the present invention, the sectional view of wafer scale camera lens; And
Fig. 3 is in content one embodiment of the present invention, the process flow diagram of wafer scale camera lens manufacture method.
Main element symbol description
1: 10: the first eyeglasses of wafer scale camera lens
102: the first external zoness, 100: the first effective diameter districts
14: the second eyeglasses of 12: the first glass substrates
142: the second external zoness, 140: the second effective diameter districts
Within 16: the second, glass substrate 160: viscose glue
18: image sensing module 180: sensor protective seam
182: image sensor 20: optical filter
300: wafer scale camera lens manufacture method 301-306: step
Embodiment
Please refer to Fig. 1.Fig. 1 is in content one embodiment of the present invention, a kind of sectional view of wafer scale camera lens 1.Wafer scale camera lens 1 comprises: the first eyeglass 10, the first glass substrate 12, the second eyeglass 14, the second glass substrate 16 and image sensing module 18.
The first glass substrate 12 is the sheet glass with aperture in the present embodiment.The first eyeglass 10 is the eyeglass towards the object direction of wish shooting, is arranged at the first side of the first glass substrate 12.The first eyeglass 10 has the first effective diameter district 100 and the first external zones 102.The first effective diameter district 100 is for wafer scale camera lens 1 is when taking, actual in so that light incident in the region of opposite side imaging.The first external zones 102, around the first effective diameter district 100, does not participate in the process of shot object.In one embodiment, the thickness H2 of the first external zones 102 is greater than the thickness H1 in the first effective diameter district 100, so that protective effect to be provided.
The second eyeglass 14 is positioned at the second side of the first glass substrate 16, and wherein the second eyeglass 14 has the second effective diameter district 140 and the second external zones 142.Similarly, the second effective diameter district 140 is for wafer scale camera lens 1 is when taking, actual in so that light incident in the region of opposite side imaging.The second external zones 142, around the second effective diameter district 140, does not participate in the process of shot object.Wherein the thickness H4 of the second external zones 142 is greater than the thickness H3 in the second effective diameter district 140.
The second external zones 142 of second glass substrate 16 contact the second eyeglasses 14.Wherein, the thickness of the second glass substrate 16 is according to the back focal length adjustment of calculating camera lens.In one embodiment, back focal length refers to that the second effective diameter district 140 of the second eyeglass 14 is to the distance of object imaging plane.Therefore,, after precomputing the back focal length of camera lens, the second glass substrate 16 can reach by worn segment thickness the thickness of the back focal length that can coordinate camera lens.
In one embodiment, the second glass substrate 16 can engage by viscose glue 160 with 142 of the second external zoness.Therefore, in this case, the thickness adjustment of the second glass substrate 16 need be considered the thickness of viscose glue 160 in the lump, so that its final thickness can coordinate the thickness of the back focal length of camera lens.
In another embodiment, the adjustment of thickness also can be carried out in the second external zones 142 of the second eyeglass 14.In this case, the thickness adjustment of the second glass substrate 16 also needs to consider the thickness of the second external zones 142.
Therefore,, after the thickness of the second glass substrate 16 is adjusted according to the back focal length of calculating camera lens, image sensing module 18 can be arranged at the opposite side of relative the second external zones 142 in the second glass substrate 16.In one embodiment, image sensing module 18 comprises sensor protective seam 180 and image sensor 182, and sensor protective seam 180 is covered in image sensor 182.Sensor protective seam 180 contact the second glass substrates 16, so that the rear lens focus distance that the distance in the second effective diameter district 142 of image sensor 182 and the second eyeglass 14 is equivalent to calculate.
Therefore, the advantage of application content of the present invention is that the wafer scale camera lens 1 of content of the present invention can be by directly carrying out the thickness adjustment of corresponding rear lens focus distance with the second external zones 142 of the second eyeglass 14.Because the second external zones 142 is a part for the second eyeglass 14, can be formed by same manufacture craft, therefore do not need extra manufacture craft to form adjustment element, can facilitate and rapidly relative the second eyeglass 14 of image sensing module 18 be positioned.
Please refer to Fig. 2.Fig. 2 is in content one embodiment of the present invention, the sectional view of wafer scale camera lens 1.In one embodiment, wafer scale camera lens 1 can more comprise optical filter 20.Optical filter 20 can be an infrared filter, so that the effect of optical filtering to be provided.In one embodiment, optical filter 20 is arranged at 16 of image sensing module 18 and the second glass substrates, in Fig. 2, is designated the position of A.In other embodiments, optical filter 20 also can be arranged at the second glass substrate 16 and the second eyeglass 14 (the B position in Fig. 2), at the second eyeglass 14 and the first glass substrate 12 (the C position in Fig. 2) or in the first glass substrate 12 and 10, the first eyeglass (the D position in Fig. 2).At diverse location, optical filter 20 is set, will the imaging of wafer scale camera lens 1 be had to different impacts, so deviser can need to adjust optical filter 20 position according to essence, to reach best imaging effect.
Please refer to Fig. 3.Fig. 3 is in content one embodiment of the present invention, the process flow diagram of wafer scale camera lens manufacture method 300.Wafer scale camera lens manufacture method 300 can be in order to manufacture wafer scale camera lens 1 as shown in Figure 1.Wafer scale camera lens manufacture method 300 comprises the following step (should be appreciated that, mentioned step, except chatting especially bright its order person, all can adjust its front and back order according to actual needs in the present embodiment, even can carry out simultaneously or partly simultaneously).
In step 301, provide the first glass substrate 12.
In step 302, form the first eyeglass 10 in the first side of the first glass substrate 12, wherein the first eyeglass 10 has the first effective diameter district 100 and around first external zones 102 in the first effective diameter district 100.
In step 303, form the second eyeglass 14 in the second side of the first glass substrate 12, wherein the second eyeglass 14 has the second effective diameter district 140 and around second external zones 142 in the second effective diameter district 140, wherein the thickness of the second external zones 142 is greater than the thickness in the second effective diameter district 140.
In step 304, calculate the back focal length of camera lens.
In step 305, form the second glass substrate 16, to contact the second external zones 142, and according to back focal length, adjust the thickness of the second glass substrate 16;
In step 306, form image sensing module 18 in the opposite side of the second relative the second external zones 142 of glass substrate 16.
Although disclosed content of the present invention in conjunction with above embodiment; yet it is not in order to limit content of the present invention; anyly be familiar with this operator; within not departing from the spirit and scope of content of the present invention; can be used for a variety of modifications and variations, thus the protection domain of content of the present invention should with enclose claim was defined is as the criterion.
Claims (16)
1. wafer scale (wafer level) camera lens manufacture method, comprises:
One first glass substrate is provided;
Form one first eyeglass in one first side of this first glass substrate, wherein this first eyeglass has one first effective diameter district and around one first external zones in this first effective diameter district;
Form one second eyeglass in one second side of this first glass substrate, wherein this second eyeglass has one second effective diameter district and around one second external zones in this second effective diameter district, wherein the thickness of this second external zones is greater than the thickness in this second effective diameter district;
Calculate a rear lens focus distance;
Form one second glass substrate, to contact this second external zones;
Thickness according to this rear lens focus apart from this second glass substrate of adjustment; And
Form an image sensing module in the opposite side of relative this second external zones of this second glass substrate.
2. wafer scale camera lens manufacture method as claimed in claim 1, wherein this first glass substrate to should this first effective diameter district of first mirror sheet and this second effective diameter district of this second eyeglass there is an aperture.
3. wafer scale camera lens manufacture method as claimed in claim 1, also comprises and forms an optical filter between this image sensing module and this second glass substrate, between this second glass substrate and this second eyeglass, between this second eyeglass and this first glass substrate or between this first glass substrate and this first eyeglass.
4. wafer scale camera lens manufacture method as claimed in claim 1, also comprise with a viscose glue and make this second glass substrate be engaged in this second external zones, according to this rear lens focus, apart from the step of adjusting the thickness of this second glass substrate, also comprise the thickness of adjusting this second glass substrate according to the thickness of this rear lens focus distance and this viscose glue.
5. wafer scale camera lens manufacture method as claimed in claim 1, also comprise the thickness of adjusting this second external zones, according to this rear lens focus, apart from the step of adjusting the thickness of this second glass substrate, also comprise the thickness of adjusting this second glass substrate according to the thickness of this rear lens focus distance and this second external zones.
6. wafer scale camera lens manufacture method as claimed in claim 1, wherein the thickness of this first external zones is greater than the thickness in this first effective diameter district.
7. wafer scale camera lens manufacture method as claimed in claim 1, wherein this image sensing module comprises image sensor and sensor protective seam, and this sensor protective seam is covered in this image sensor.
8. wafer scale camera lens manufacture method as claimed in claim 6; the step that wherein forms this image sensing module also comprises makes this sensor protective seam contact this second glass substrate, so that the distance in this second effective diameter district of this image sensor and this second eyeglass is equivalent to this rear lens focus distance.
9. a wafer scale camera lens, comprises:
The first glass substrate;
The first eyeglass, is positioned at one first side of this first glass substrate, and wherein this first eyeglass has one first effective diameter district and around one first external zones in this first effective diameter district;
The second eyeglass, is positioned at one second side of this first glass substrate, and wherein this second eyeglass has one second effective diameter district and around one second external zones in this second effective diameter district, wherein the thickness of this second external zones is greater than the thickness in this second effective diameter district;
The second glass substrate, contacts this second external zones, the thickness of this second glass substrate according to a rear lens focus apart from adjustment; And
Image sensing module, the opposite side in relative this second external zones of this second glass substrate.
10. wafer scale camera lens as claimed in claim 9, wherein this first glass substrate to should this first effective diameter district of first mirror sheet and this second effective diameter district of this second eyeglass there is an aperture.
11. wafer scale camera lenses as claimed in claim 9, also comprise an optical filter, be arranged between this image sensing module and the second glass substrate, between this second glass substrate and this second eyeglass, between this second eyeglass and this first glass substrate or between this first glass substrate and this first eyeglass.
12. wafer scale camera lenses as claimed in claim 9, also comprise a viscose glue, so that this second glass substrate is engaged in this second external zones, the thickness of this second glass substrate is further adjusted according to the thickness of this rear lens focus distance and this viscose glue.
13. wafer scale camera lenses as claimed in claim 9, wherein the thickness of this second glass substrate is further adjusted according to the thickness of this second external zones after this rear lens focus distance and adjustment.
14. wafer scale camera lenses as claimed in claim 9, wherein the thickness of this first external zones is greater than the thickness in this first effective diameter district.
15. wafer scale camera lenses as claimed in claim 9, wherein this image sensing module comprises image sensor and sensor protective seam, and this sensor protective seam is covered in this image sensor.
16. wafer scale camera lenses as claimed in claim 9, wherein this sensor protective seam contacts this second glass substrate, so that the distance in this second effective diameter district of this image sensor and this second eyeglass is equivalent to this rear lens focus distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210214525.6A CN103513388A (en) | 2012-06-26 | 2012-06-26 | Wafer level camera lens and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210214525.6A CN103513388A (en) | 2012-06-26 | 2012-06-26 | Wafer level camera lens and manufacturing method thereof |
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| CN103513388A true CN103513388A (en) | 2014-01-15 |
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| CN201210214525.6A Pending CN103513388A (en) | 2012-06-26 | 2012-06-26 | Wafer level camera lens and manufacturing method thereof |
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| CN101813814A (en) * | 2008-09-25 | 2010-08-25 | 夏普株式会社 | Optical element module, electronic element module and method for manufacturing the same |
| JP2011119925A (en) * | 2009-12-02 | 2011-06-16 | Olympus Corp | Imaging device and method of manufacturing imaging device |
| US20110149143A1 (en) * | 2009-12-17 | 2011-06-23 | Sony Corporation | Image pickup lens, camera module using the same, image pickup lens manufacturing method and camera module manufacturing method |
| TW201135288A (en) * | 2010-04-13 | 2011-10-16 | Himax Tech Ltd | Optical lens on wafer level and related method for forming the optical lens one wafer level |
| WO2011133746A1 (en) * | 2010-04-21 | 2011-10-27 | Empire Technology Development Llc | Precision spacing for stacked wafer assemblies |
| TW201348788A (en) * | 2012-05-23 | 2013-12-01 | Himax Tech Ltd | Wafer level les and manufacturing method of the same |
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- 2012-06-26 CN CN201210214525.6A patent/CN103513388A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101813814A (en) * | 2008-09-25 | 2010-08-25 | 夏普株式会社 | Optical element module, electronic element module and method for manufacturing the same |
| JP2011119925A (en) * | 2009-12-02 | 2011-06-16 | Olympus Corp | Imaging device and method of manufacturing imaging device |
| US20110149143A1 (en) * | 2009-12-17 | 2011-06-23 | Sony Corporation | Image pickup lens, camera module using the same, image pickup lens manufacturing method and camera module manufacturing method |
| TW201135288A (en) * | 2010-04-13 | 2011-10-16 | Himax Tech Ltd | Optical lens on wafer level and related method for forming the optical lens one wafer level |
| WO2011133746A1 (en) * | 2010-04-21 | 2011-10-27 | Empire Technology Development Llc | Precision spacing for stacked wafer assemblies |
| TW201348788A (en) * | 2012-05-23 | 2013-12-01 | Himax Tech Ltd | Wafer level les and manufacturing method of the same |
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Application publication date: 20140115 |