TWI416801B - Chip card holding structure - Google Patents

Chip card holding structure Download PDF

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Publication number
TWI416801B
TWI416801B TW97139904A TW97139904A TWI416801B TW I416801 B TWI416801 B TW I416801B TW 97139904 A TW97139904 A TW 97139904A TW 97139904 A TW97139904 A TW 97139904A TW I416801 B TWI416801 B TW I416801B
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TW
Taiwan
Prior art keywords
wall
cover
holding device
wafer card
card holding
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TW97139904A
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Chinese (zh)
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TW201017993A (en
Inventor
Shao-Mo Huang
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Fih Hong Kong Ltd
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Priority to TW97139904A priority Critical patent/TWI416801B/en
Publication of TW201017993A publication Critical patent/TW201017993A/en
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Publication of TWI416801B publication Critical patent/TWI416801B/en

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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a chip card holding structure including a main body, a cover and an elastic portion. The main body defines an accommodating space therethrough. The cover has a top wall which includes a hinged end and a latching end corresponding to the hinged end. The cover is rotatablely hinged with the main body and latched with the main body by the latching end. The elastic piece is defined on the hinged end and elastically resisting on the main body. The cover is slidably mounted on the main body and elastically latching with the main body. The chip card holding structure has simple structure and is easy to operate, it is easily fulfill the assemble and disassemble operation to the chip card.

Description

晶片卡固持裝置 Wafer card holding device

本發明涉及一種用於容置並固持晶片卡之固持裝置,特別涉及一種用於攜帶型電子裝置上之晶片卡固持裝置。 The present invention relates to a holding device for accommodating and holding a wafer card, and more particularly to a wafer card holding device for a portable electronic device.

隨著通訊事業之迅速發展,行動電話、個人數位助理(personal digital assistant,PDA)等各種攜帶型電子裝置之使用越來越普及。隨著該等攜帶型電子裝置產品之功能日益多元化,應用於該等攜帶型裝置上之用於存儲記憶之晶片卡亦越來越多,例如SD卡(Secure Digital Memory Card)、CF卡(Compact Flash Card)、晶片卡(Subscriber Identification Module Card,用戶識別卡)等。其中,晶片卡係一種裝有IC晶片之塑膠卡片,其具有記錄個人用戶號碼及通訊錄等功能,藉由更換晶片卡,其可供多個用戶使用。 With the rapid development of the communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular. As the functions of these portable electronic device products become increasingly diversified, more and more wafer cards for storing memories are applied to such portable devices, such as an SD card (Secure Digital Memory Card) and a CF card ( Compact Flash Card), a Subscriber Identification Module Card, etc. The chip card is a plastic card equipped with an IC chip, which has the functions of recording a personal user number and an address book, and can be used by a plurality of users by replacing the chip card.

習知晶片卡一般容置於攜帶型電子裝置之一卡槽內。當該晶片卡容置於該卡槽內時,該晶片卡上之積體電路藉由一連接器與該攜帶型電子裝置之電路板連接。當需要更換該晶片卡時,使用者使用手指直接按住該晶片卡暴露之部分,並向該卡槽外拖動,藉由使用者手指與該晶片卡之間之摩擦力使該晶片卡隨使用者手指運動,直至晶片卡由該卡槽內滑出。 Conventional wafer cards are generally housed in a card slot of a portable electronic device. When the chip card is received in the card slot, the integrated circuit on the chip card is connected to the circuit board of the portable electronic device by a connector. When the wafer card needs to be replaced, the user directly presses the exposed portion of the wafer card with a finger and drags the card card outside, and the wafer card is driven by the friction between the user's finger and the wafer card. The user's finger moves until the wafer card slides out of the card slot.

然,於實際使用中,由於晶片卡暴露於卡槽外之部分一般較小,直接按壓外露部分操作較為困難;有些型號之晶片卡甚至全部容置於卡槽內。故,使用者難以藉由直接按壓該晶片卡之方式帶動該晶片卡由卡槽滑出。 However, in actual use, since the portion of the wafer card exposed to the card slot is generally small, it is difficult to directly press the exposed portion; some types of wafer cards are even accommodated in the card slot. Therefore, it is difficult for the user to drive the wafer card to slide out of the card slot by directly pressing the wafer card.

有鑒於以上缺陷,有必要提供一種易於更換晶片卡且可有效容置、固持晶片卡之晶片卡固持裝置。 In view of the above drawbacks, it is necessary to provide a wafer card holding device that can easily replace a wafer card and can effectively accommodate and hold the wafer card.

一種晶片卡固持裝置,其包括一本體及一蓋體,該本體上設有一容納腔室;所述蓋體具有一頂壁,其包括一鉸接端及一與該鉸接端相對之扣合端,該蓋體可旋轉地鉸接於本體上並藉由其扣合端扣合於本體上;所述蓋體還包括一彈性部,其設置於頂壁之鉸接端上,該彈性部彈性抵持於本體上;所述蓋體藉由該彈性部可相對滑動地裝設於本體上並彈性扣合於本體上。 A wafer card holding device includes a body and a cover body, wherein the body is provided with a receiving chamber; the cover body has a top wall, and includes a hinge end and a fastening end opposite to the hinge end. The cover body is rotatably hinged to the body and fastened to the body by the fastening end thereof; the cover body further includes an elastic portion disposed on the hinge end of the top wall, the elastic portion elastically resisting The cover body is slidably mounted on the body by the elastic portion and elastically fastened to the body.

相較於習知技術,所述晶片卡固持裝置結構簡單,晶片卡裝設於蓋體上,並隨蓋體可旋轉地裝設於本體上,藉由於蓋體之鉸接端設置一彈性部,並對應地於該蓋體之另一側設置一扣接部,輕易地實現了晶片卡之安裝及拆卸,同時使得晶片卡之安裝及更換過程變得更加簡單,容易操作。 Compared with the prior art, the wafer card holding device has a simple structure, the chip card is mounted on the cover body, and is rotatably mounted on the body with the cover body, and an elastic portion is disposed by the hinge end of the cover body. Correspondingly, a fastening portion is disposed on the other side of the cover body, which facilitates the installation and removal of the wafer card, and at the same time, the process of installing and replacing the wafer card is simpler and easier to operate.

100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder

10‧‧‧本體 10‧‧‧ Ontology

11‧‧‧容納腔室 11‧‧‧Accommodation chamber

12‧‧‧底壁 12‧‧‧ bottom wall

13‧‧‧第一側壁 13‧‧‧First side wall

14,16‧‧‧開口 14,16‧‧ openings

15‧‧‧第二側壁 15‧‧‧second side wall

17‧‧‧卡合壁 17‧‧‧Card wall

18‧‧‧軸孔 18‧‧‧Axis hole

30‧‧‧蓋體 30‧‧‧ cover

31‧‧‧頂壁 31‧‧‧ top wall

311‧‧‧外表面 311‧‧‧ outer surface

312‧‧‧內表面 312‧‧‧ inner surface

313‧‧‧凸筋 313‧‧‧ ribs

315‧‧‧鉸接端 315‧‧‧Hinged end

317‧‧‧扣合端 317‧‧‧ buckle end

33‧‧‧夾持壁 33‧‧‧Clamping wall

332‧‧‧安裝孔 332‧‧‧ mounting holes

35‧‧‧彈性部 35‧‧‧Flexible Department

351‧‧‧自由端 351‧‧‧Free end

37‧‧‧扣接部 37‧‧‧Deduction Department

371‧‧‧連接壁 371‧‧‧Connecting wall

373‧‧‧扣接壁 373‧‧‧ buckle wall

375‧‧‧按壓部 375‧‧‧ Pressing Department

50‧‧‧轉軸 50‧‧‧ shaft

80‧‧‧晶片卡 80‧‧‧wafer card

圖1為本發明晶片卡固持裝置之較佳實施例之蓋體裝設於本體上且處於開啟時之立體示意圖;圖2為晶片卡固持裝置之較佳實施之蓋體蓋合於本體上之立體示意圖; 圖3為晶片卡固持裝置之較佳實施之立體分解示意圖;圖4為晶片卡固持裝置之較佳實施之另一視角立體分解示意圖;圖5為晶片卡固持裝置之較佳實施之蓋體之立體示意圖;圖6為圖1沿VI-VI線之剖示圖;圖7為圖2沿VII-VII線之剖示圖。 1 is a perspective view of a preferred embodiment of a wafer card holding device of the present invention, which is mounted on a body and opened; FIG. 2 is a cover of a preferred embodiment of the wafer card holding device. Stereoscopic view 3 is a perspective exploded view of a preferred embodiment of a wafer card holding device; FIG. 4 is a perspective exploded view of a preferred embodiment of the chip card holding device; FIG. 5 is a preferred embodiment of the chip card holding device Figure 6 is a cross-sectional view taken along line VI-VI of Figure 1; Figure 7 is a cross-sectional view taken along line VII-VII of Figure 2.

本發明公開一種晶片卡固持裝置,其適用於行動電話、個人數位助理(personal digital assistant,PDA)等攜帶型電子裝置。下麵將以本發明晶片卡固持裝置之較佳實施例應用於一行動電話(圖未示)為例進行說明。 The invention discloses a chip card holding device, which is suitable for a portable electronic device such as a mobile phone and a personal digital assistant (PDA). A preferred embodiment of the wafer card holding device of the present invention will be described as an example of a mobile phone (not shown).

請參閱圖1及圖2,本發明較佳實施例之晶片卡固持裝置100用於固持一晶片卡80。該晶片卡固持裝置100包括一本體10、一蓋體30及一轉軸50(參閱圖3)。 Referring to FIG. 1 and FIG. 2, the wafer card holding device 100 of the preferred embodiment of the present invention is used to hold a wafer card 80. The wafer card holding device 100 includes a body 10, a cover 30 and a rotating shaft 50 (see FIG. 3).

請一併參閱圖3及圖4,所述本體10由一金屬片材衝壓形成或由塑膠材料模內一體成型而成。該本體10上凹設有一大致矩形凹腔狀之容納腔室11,以用於裝設所述蓋體30及晶片卡80。該容納腔室11於本體10上形成一底壁12、二相對平行之第一側壁13及二連接該第一側壁13兩端之第二側壁15。所述本體10之底壁12上設有一晶片卡連接器20,用於與晶片卡80電性連接。所述容納腔室11內之一第一側壁13之兩端分別貫通開設有一開口14,其另一第一側壁13上遠離底壁12一側開設有一矩形開口16,並對應地於該本體10上形成一卡合壁17。所述二第二側壁15之遠離該開口16之一端 部位置處分別相對開設有一軸孔18,用於安裝所述轉軸50於其內。 Referring to FIG. 3 and FIG. 4 together, the body 10 is formed by stamping a metal sheet or integrally molded from a plastic material. The body 10 is recessed with a substantially rectangular cavity-shaped receiving chamber 11 for mounting the cover 30 and the wafer card 80. The receiving chamber 11 defines a bottom wall 12, two opposite first side walls 13 and two second side walls 15 connecting the first ends of the first side walls 13. A wafer card connector 20 is disposed on the bottom wall 12 of the body 10 for electrically connecting to the wafer card 80. An opening 14 is defined in each of the first side walls 13 of the receiving chamber 11 , and a rectangular opening 16 is defined in a side of the other first side wall 13 away from the bottom wall 12 , and corresponding to the body 10 . A snap wall 17 is formed thereon. One of the two second side walls 15 away from the opening 16 A shaft hole 18 is defined in each of the positions for mounting the rotating shaft 50 therein.

請一併參閱圖5,所述蓋體30由金屬片材衝壓形成或由塑膠材料模內一體成型而成,其藉由該轉軸50可旋轉地鉸接於本體10上並彈性卡合於本體10上。所述蓋體30包括一頂壁31、二夾持壁33、一彈性部35及一扣接部37。所述頂壁31大致呈矩形片板狀,其具有一外表面311、一與該外表面311相對之內表面312、一鉸接端315及一與該鉸接端315相對之扣合端317。該頂壁31之外表面311上凸設形成若干凸筋313以增強該頂壁31之整體強度。所述二夾持壁33大致呈“L”形片狀體,其由該頂壁31之兩側朝向內表面312方向延伸彎折形成。所述二夾持壁33之靠近頂壁31之鉸接端315一端分別相對貫通開設有一條形安裝孔332,以便於所述轉軸50穿過該安裝孔332將該蓋體30可旋轉並相對滑動地裝設於本體10上。 Referring to FIG. 5 , the cover 30 is formed by stamping a metal sheet or integrally molded from a plastic material. The shaft 50 is rotatably hinged to the body 10 and elastically engaged with the body 10 . on. The cover body 30 includes a top wall 31, two clamping walls 33, an elastic portion 35 and a fastening portion 37. The top wall 31 has a substantially rectangular plate shape and has an outer surface 311, an inner surface 312 opposite to the outer surface 311, a hinge end 315, and a fastening end 317 opposite the hinge end 315. A plurality of ribs 313 are formed on the outer surface 311 of the top wall 31 to enhance the overall strength of the top wall 31. The two clamping walls 33 are substantially "L"-shaped sheet-like bodies, and are formed by bending and bending the two sides of the top wall 31 toward the inner surface 312. One end of the hinged end 315 of the two clamping walls 33 adjacent to the top wall 31 is respectively provided with a strip-shaped mounting hole 332, so that the rotating shaft 50 can rotate and slide the cover 30 through the mounting hole 332. The ground is mounted on the body 10.

所述彈性部35及扣接部37分別相對設置於該頂壁31之鉸接端315及扣合端317,以將所述蓋體30可相對本體10滑移並藉由該扣接部37卡合於本體10上。於本實施例中,所述彈性部35為一大致呈弧形片狀之彈性壁,其由該頂壁31之鉸接端315朝向內表面312方向垂直延伸彎折形成,並位於該二夾持壁33之間。該彈性部35之兩端均為與頂壁31脫離之自由端351,且朝遠離該頂壁31方向彎折形成所述弧形片狀。所述彈性部35與頂壁31、二夾持壁33共同圍成一用於裝設晶片卡80之大致矩形空間狀之卡裝設部38。所述扣接部37為一橫截面大致呈“V”形之片狀體,其對應於所述本 體10上之卡合壁17設置於該頂壁31之扣合端317。所述扣接部37包括一連接壁371及一扣接壁373。該連接壁371由該頂壁31之扣合端317之大致中部位置處朝向內表面312方向延伸彎折形成。所述扣接壁373與該連接壁371相接,由該連接壁371之末端反向朝向外表面311方向彎折形成。所述連接壁371與蓋體30相接位置處被貫通開設有一“U”形缺口,形成一按壓部375,以便於開啟所述蓋體30。 The elastic portion 35 and the fastening portion 37 are respectively disposed opposite to the hinge end 315 and the fastening end 317 of the top wall 31 to slide the cover body 30 relative to the body 10 and are fastened by the fastening portion 37. Cooperate with the body 10. In the embodiment, the elastic portion 35 is a substantially arc-shaped elastic wall formed by the hinged end 315 of the top wall 31 extending perpendicularly toward the inner surface 312, and is located at the two clamping positions. Between the walls 33. Both ends of the elastic portion 35 are free ends 351 that are separated from the top wall 31, and are bent away from the top wall 31 to form the curved sheet shape. The elastic portion 35, together with the top wall 31 and the two clamping walls 33, encloses a substantially rectangular space-like card mounting portion 38 for mounting the wafer card 80. The fastening portion 37 is a sheet-like body having a substantially "V" shape in cross section, which corresponds to the The engaging wall 17 of the body 10 is disposed at the fastening end 317 of the top wall 31. The fastening portion 37 includes a connecting wall 371 and a fastening wall 373 . The connecting wall 371 is formed by bending and extending from a substantially central position of the engaging end 317 of the top wall 31 toward the inner surface 312. The fastening wall 373 is in contact with the connecting wall 371, and is formed by bending the end of the connecting wall 371 oppositely toward the outer surface 311. A connecting portion of the connecting wall 371 and the cover body 30 is formed with a U-shaped notch, and a pressing portion 375 is formed to facilitate opening the cover 30.

請參閱圖3及圖4,組裝所述晶片卡固持裝置100時,首先,將所述蓋體30蓋合於所述本體10上並容置於該本體10之容納腔室11內。所述蓋體30之彈性部35兩端之自由端351分別彈性抵持於本體10之第一側壁13上,該蓋體30之扣合端317之扣接部37對應地容置於本體10之矩形開口16內,其扣接壁373對應地卡合於卡合壁17上。接下來,將所述轉軸50之一端穿過所述本體10之一第二側壁15上之軸孔18、蓋體30之二夾持壁33上之安裝孔332及該本體10之另一第二側壁15上之軸孔18,從而將該蓋體30可旋轉地裝設於本體10上,即完成所述晶片卡固持裝置100之組裝。 Referring to FIG. 3 and FIG. 4 , when the wafer card holding device 100 is assembled, first, the cover 30 is covered on the body 10 and accommodated in the receiving chamber 11 of the body 10 . The free ends 351 of the elastic portions 35 of the cover 30 are respectively elastically resisted on the first side wall 13 of the body 10, and the fastening portions 37 of the fastening ends 317 of the cover 30 are correspondingly received in the body 10. In the rectangular opening 16, the fastening wall 373 is correspondingly engaged with the engaging wall 17. Next, one end of the rotating shaft 50 is passed through the shaft hole 18 on one of the second side walls 15 of the body 10, the mounting hole 332 on the two clamping walls 33 of the cover body 30, and the other part of the body 10 The shaft hole 18 of the two side walls 15 is rotatably mounted on the body 10, that is, the assembly of the wafer card holding device 100 is completed.

請一併參閱圖6及圖7,使用時,首先將所述晶片卡80裝設於蓋體30之卡裝設部38內。將所述蓋體30之扣接部37端朝向本體10翻轉,使該蓋體30之扣接部37扣合併容置於該本體10之矩形開口16內。當需要取下所述晶片卡80時,施力於蓋體30之扣接部37,朝向蓋體30之鉸接端315之彈性部35方向推壓蓋體30之按壓部375,該蓋體30之彈性部35兩端之自由端351被擠壓。同時,該轉軸50相對於該蓋體30之二夾持壁33上之條形安裝孔332內滑動,進而使 得蓋體30之扣接部37之扣接壁373與本體10之卡合壁17相互脫離。然後,翻轉該蓋體30,將該蓋體30相對本體10旋開,即可取出裝設於蓋體30上之晶片卡80。 Referring to FIG. 6 and FIG. 7 together, in use, the wafer card 80 is first installed in the card mounting portion 38 of the cover 30. The end of the fastening portion 37 of the cover 30 is turned toward the body 10, so that the fastening portion 37 of the cover 30 is buckled and received in the rectangular opening 16 of the body 10. When the wafer card 80 needs to be removed, the fastening portion 37 of the cover 30 is biased toward the elastic portion 35 of the hinge end 315 of the cover 30 to press the pressing portion 375 of the cover 30. The cover 30 The free ends 351 at both ends of the elastic portion 35 are pressed. At the same time, the rotating shaft 50 slides relative to the strip mounting holes 332 of the two clamping walls 33 of the cover 30, thereby The fastening wall 373 of the fastening portion 37 of the cover 30 is separated from the engagement wall 17 of the body 10. Then, the lid body 30 is turned over, and the lid body 30 is unscrewed from the body 10 to take out the wafer card 80 mounted on the lid body 30.

可以理解,所述蓋體30之二夾持壁33亦可以省略,即,所述晶片卡80直接裝設於本體10之容納腔室11內,該蓋體30可旋轉並相對滑動地蓋合於本體10之容納腔室11上方。 It can be understood that the two clamping walls 33 of the cover 30 can also be omitted, that is, the wafer card 80 is directly mounted in the accommodating chamber 11 of the body 10, and the cover 30 can be rotated and relatively slidably closed. Above the receiving chamber 11 of the body 10.

本發明所述晶片卡固持裝置100結構簡單,晶片卡80裝設於蓋體30上,並隨蓋體30可旋轉地裝設於本體10上,藉由於蓋體30之鉸接端315設置一彈性部35,並對應地於該蓋體30之另一側設置一扣接部37,輕易地實現了晶片卡80之安裝及拆卸,同時使得晶片卡80之安裝及更換過程變得更加簡單,容易操作。 The wafer card holder 100 of the present invention has a simple structure. The wafer card 80 is mounted on the cover 30 and rotatably mounted on the body 10 with the cover 30. The hinge end 315 of the cover 30 is provided with an elasticity. The portion 35 is provided with a fastening portion 37 on the other side of the cover body 30, which facilitates the installation and removal of the wafer card 80, and at the same time makes the installation and replacement process of the wafer card 80 easier and easier. operating.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟習本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in accordance with the spirit of the present invention are It should be covered by the following patent application.

100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder

10‧‧‧本體 10‧‧‧ Ontology

30‧‧‧蓋體 30‧‧‧ cover

37‧‧‧扣接部 37‧‧‧Deduction Department

80‧‧‧晶片卡 80‧‧‧wafer card

Claims (8)

一種晶片卡固持裝置,其包括一本體及一蓋體,該本體上設有一容納腔室;所述蓋體具有一頂壁,其包括一鉸接端及一與該鉸接端相對之扣合端,該蓋體可旋轉地鉸接於本體上並藉由其扣合端扣合於本體上;其改良在於:該頂壁之外表面上凸設形成若干凸筋以增強該頂壁之整體強度;所述蓋體還包括一彈性部,其設置於頂壁之鉸接端上,該彈性部彈性抵持於本體上;所述蓋體藉由該彈性部可相對滑動地裝設於本體上並彈性扣合於本體上。 A wafer card holding device includes a body and a cover body, wherein the body is provided with a receiving chamber; the cover body has a top wall, and includes a hinge end and a fastening end opposite to the hinge end. The cover body is rotatably hinged to the body and fastened to the body by the fastening end thereof; the improvement is that a convex rib is formed on the outer surface of the top wall to enhance the overall strength of the top wall; The cover body further includes an elastic portion disposed on the hinge end of the top wall, the elastic portion elastically resisting the body; the cover body is slidably mounted on the body by the elastic portion and elastically buckled Combined with the body. 如申請專利範圍第1項所述之晶片卡固持裝置,其中所述彈性部為一呈弧形片狀之彈性壁,其由頂壁之鉸接端向其內表面方向垂直延伸彎折形成。 The wafer card holding device according to claim 1, wherein the elastic portion is an elastic plate having an arc-shaped sheet shape, and is formed by bending a hinge end of the top wall to a direction perpendicular to the inner surface thereof. 如申請專利範圍第2項所述之晶片卡固持裝置,其中所述容納腔室包括一底壁及二相對平行之第一側壁,其中一第一側壁上遠離底壁一側開設有一開口,並對應地於該本體上形成一卡合壁;所述蓋體還包括一延伸彎折形成於蓋體之扣合端之扣接部,該扣接部對應卡合於本體之卡合壁上。 The wafer card holding device of claim 2, wherein the accommodating chamber comprises a bottom wall and two opposite first side walls, wherein a first side wall has an opening on a side away from the bottom wall, and Correspondingly, an engaging wall is formed on the body; the cover further includes a fastening portion that is bent and formed on the fastening end of the cover body, and the fastening portion is correspondingly engaged with the engaging wall of the body. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述晶片卡固持裝置還包括一轉軸,所述容納腔室還包括二相對平行之第二側壁,該二第二側壁之遠離卡合壁之一端分別相對開設有一軸孔,用於安裝所述轉軸;該蓋體還包括二由頂壁之兩側朝向內表面方向延伸彎折形成之夾持壁,其與頂壁形成一用於裝設晶片卡之卡裝設部,該二夾持壁之靠近鉸接端一端分別相對貫通開設有一 條形安裝孔;所述轉軸穿過該第二側壁上之軸孔及蓋體之條形安裝孔將蓋體可旋轉並相對滑動地鉸接於本體上。 The wafer card holding device of claim 3, wherein the wafer card holding device further comprises a rotating shaft, the receiving chamber further comprises two opposite parallel second sidewalls, and the second sidewalls are away from the card One end of the wall is oppositely defined with a shaft hole for mounting the rotating shaft; the cover body further includes two clamping walls which are formed by bending both sides of the top wall toward the inner surface, and are formed with the top wall. In the card mounting portion of the chip card, the two clamping walls are respectively open to the hinge end a strip-shaped mounting hole; the rotating shaft passes through the shaft hole on the second side wall and the strip-shaped mounting hole of the cover body, and the cover body is rotatably and slidably hinged to the body. 如申請專利範圍第4項所述之晶片卡固持裝置,其中所述彈性部位於該二夾持壁之間,該彈性部之兩端均為與頂壁脫離之自由端,且朝遠離該頂壁方向彎折形成弧形片狀。 The wafer card holding device of claim 4, wherein the elastic portion is located between the two clamping walls, and both ends of the elastic portion are free ends separated from the top wall, and are away from the top The wall direction is bent to form an arc shape. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述扣接部包括一連接壁及一扣接壁,該連接壁由該頂壁之扣合端之中部位置處朝向內表面方向延伸彎折形成,所述扣接壁與該連接壁相接,由該連接壁之末端反向朝向外表面方向彎折形成。 The wafer card holding device of claim 3, wherein the fastening portion comprises a connecting wall and a fastening wall, wherein the connecting wall is oriented from the middle of the fastening end of the top wall toward the inner surface The extension bend is formed, and the fastening wall is in contact with the connecting wall, and is formed by bending the end of the connecting wall in a direction opposite to the outer surface. 如申請專利範圍第6項所述之晶片卡固持裝置,其中所述連接壁與蓋體相接位置處被貫通開設有一“U”形缺口,形成一按壓部,以便於開啟所述蓋體。 The wafer card holding device of claim 6, wherein the connecting wall and the cover are connected to each other with a "U" shaped notch, and a pressing portion is formed to facilitate opening the cover. 如申請專利範圍第4項所述之晶片卡固持裝置,其中所述本體之底壁上設有一晶片卡連接器,用於與晶片卡電性連接。 The wafer card holding device of claim 4, wherein the bottom wall of the body is provided with a wafer card connector for electrically connecting to the wafer.
TW97139904A 2008-10-17 2008-10-17 Chip card holding structure TWI416801B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM272255U (en) * 2004-08-18 2005-08-01 Molex Inc Electrical card connector
TWM321597U (en) * 2007-03-09 2007-11-01 Advanced Connectek Inc Card connector

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM272255U (en) * 2004-08-18 2005-08-01 Molex Inc Electrical card connector
TWM321597U (en) * 2007-03-09 2007-11-01 Advanced Connectek Inc Card connector

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