TWI399893B - Chip card lock structure - Google Patents
Chip card lock structure Download PDFInfo
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- TWI399893B TWI399893B TW97114186A TW97114186A TWI399893B TW I399893 B TWI399893 B TW I399893B TW 97114186 A TW97114186 A TW 97114186A TW 97114186 A TW97114186 A TW 97114186A TW I399893 B TWI399893 B TW I399893B
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- card
- holding structure
- wafer
- fastening portion
- wafer card
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- Coupling Device And Connection With Printed Circuit (AREA)
Description
本發明涉及一種電子裝置之表面連接卡結構,尤其涉及一種電子裝置之晶片卡固持結構。 The invention relates to a surface connection card structure of an electronic device, and in particular to a wafer card holding structure of an electronic device.
近年來,具有積體電路之表面連接卡廣泛應用於電子裝置中以提高或增加電子裝置之性能,如安裝於行動電話中之晶片卡,其內儲存有操作行動電話之必要資訊,而且記載有用戶個人資訊。藉由更換晶片卡,一隻行動電話可以供多個用戶使用。 In recent years, surface connection cards having integrated circuits have been widely used in electronic devices to enhance or increase the performance of electronic devices, such as a wafer card installed in a mobile phone, in which necessary information for operating a mobile phone is stored, and User personal information. By replacing the wafer card, a mobile phone can be used by multiple users.
習知之一晶片卡固持結構通常包括一固定於行動電話內部印刷電路板上之一本體及一與該絕緣本體鉸鏈連接之蓋體。該本體對應電路板上之晶片卡連接器開設有一收容槽以收容晶片卡於其內。該蓋體包括一壓合部及一連接於該壓合部一端之一扣接部,該扣接部設置一第一卡塊,該本體對應凸設一第二卡塊。翻轉該蓋體直至第一卡塊越過該第二卡塊而卡合於第二卡塊上,此時該壓合部壓緊該晶片卡於該收容槽內,從而使得該晶片卡與晶片卡連接器電連接。 One of the conventional wafer card holding structures generally includes a body fixed to a printed circuit board inside the mobile phone and a cover hingedly connected to the insulating body. The chip card connector on the corresponding circuit board of the main body defines a receiving slot for receiving the wafer card. The cover body includes a nip portion and a fastening portion connected to one end of the nip portion. The fastening portion is provided with a first clamping block, and the body correspondingly protrudes with a second clamping block. Reversing the cover until the first block passes over the second block to engage with the second block, and the nip presses the wafer into the receiving slot, thereby causing the chip card and the wafer card The connector is electrically connected.
惟,所述晶片卡固持機構之蓋體於與本體之扣合過程中需發生一定之彈性彎曲變形,如此,於壓合部與扣接部之連接處會產生一較大之表面彎曲應力,時間一長,容易造成該蓋體於該連接處斷裂。 However, the cover of the wafer card holding mechanism needs to undergo a certain elastic bending deformation during the fastening process with the body, so that a large surface bending stress is generated at the joint between the nip portion and the fastening portion. Over time, it is easy to cause the cover to break at the joint.
有鑒於此,有必要提供一種固持穩固且不易損壞之晶片卡固持結構。 In view of this, it is necessary to provide a wafer card holding structure that is stable and not easily damaged.
一種晶片卡固持結構,包括一本體及一蓋體,該本體開設一收容槽,用於收容一晶片卡於其內,所述蓋體包括一壓合部、一連接部及一扣接部,該壓合部一端鉸接於該本體,用於按壓晶片卡,該扣接部扣合於該本體上,該連接部具有一第一片體及連接於該第一片體之一第二片體,該第一片體與第二片體之間之夾角小於180°,且它們之間形成一扇形區,該第一片體連接於該壓合部,該第二片體連接於該扣接部,該壓合部位於該扇形區外,該扣接部位於該扇形區內。 A wafer card holding structure includes a body and a cover. The body defines a receiving slot for receiving a wafer. The cover includes a pressing portion, a connecting portion and a fastening portion. One end of the nip is hinged to the body for pressing the wafer card, and the fastening portion is fastened to the body, the connecting portion has a first piece and a second piece connected to the first piece The angle between the first body and the second body is less than 180°, and a sector is formed therebetween. The first body is connected to the nip, and the second body is connected to the buckle. The nip is located outside the sector, and the fastening portion is located in the sector.
相較於習知技術,所述晶片卡固持結構藉由該連接部來連接該壓合部及扣接部,大大減弱了連接處之表面應力,避免了因表面彎曲應力過大而折斷該蓋體。 Compared with the prior art, the wafer card holding structure connects the nip portion and the fastening portion by the connecting portion, thereby greatly reducing the surface stress of the joint portion, and avoiding breaking the cover body due to excessive surface bending stress. .
10‧‧‧晶片卡固持結構 10‧‧‧ wafer card holding structure
11‧‧‧本體 11‧‧‧Ontology
111‧‧‧上壁 111‧‧‧Upper wall
112‧‧‧下壁 112‧‧‧The lower wall
113‧‧‧第一側壁 113‧‧‧First side wall
114‧‧‧第二側壁 114‧‧‧second side wall
115‧‧‧底壁 115‧‧‧ bottom wall
116‧‧‧電池容置槽 116‧‧‧Battery accommodating slot
117‧‧‧收容槽 117‧‧‧ receiving trough
1171‧‧‧安裝部 1171‧‧‧Installation Department
118‧‧‧斜壁 118‧‧‧ sloping wall
119‧‧‧第一卡塊 119‧‧‧ first block
12‧‧‧蓋體 12‧‧‧ Cover
121‧‧‧壓合部 121‧‧‧Pressing Department
1211‧‧‧轉軸筒 1211‧‧‧Shaft tube
1212‧‧‧矩形孔 1212‧‧‧ Rectangular hole
122‧‧‧扣接部 122‧‧‧Deduction Department
1221‧‧‧凸條 1221‧‧ ‧ ribs
1222‧‧‧第二卡塊 1222‧‧‧Second block
1223‧‧‧卡槽 1223‧‧‧ card slot
123‧‧‧連接部 123‧‧‧Connecting Department
1231‧‧‧第一片體 1231‧‧‧ first body
1232‧‧‧第二片體 1232‧‧‧Second body
13‧‧‧轉軸 13‧‧‧ shaft
14‧‧‧連接處 14‧‧‧ Connection
20‧‧‧用戶識別卡 20‧‧‧User Identification Card
21‧‧‧斜角 21‧‧‧ oblique angle
圖1係本發明較佳實施方式晶片卡固持結構與晶片卡組裝前之立體分解圖;圖2係本發明較佳實施方式晶片卡固持結構與晶片卡組裝前之另一角度之立體分解圖;圖3係本發明較佳實施方式晶片卡固持結構與晶片卡裝配過程圖;圖4係本發明較佳實施方式晶片卡固持結構與晶片卡組裝後之立體圖;圖5係圖1所示之蓋體之第一扣合示意圖;圖6係圖1所示之蓋體之第二扣合示意圖。 1 is an exploded perspective view of a wafer card holding structure and a wafer card assembly according to a preferred embodiment of the present invention; FIG. 2 is an exploded perspective view showing another embodiment of the preferred embodiment of the wafer card holding structure and the wafer card assembly; 3 is a perspective view of a wafer card holding structure and a wafer card assembly process according to a preferred embodiment of the present invention; FIG. 4 is a perspective view of the wafer card holding structure and the wafer card assembled in accordance with a preferred embodiment of the present invention; FIG. The first fastening diagram of the body; FIG. 6 is a second fastening diagram of the cover body shown in FIG.
本發明晶片卡固持結構適用於行動電話及個人數位助理(Personal Digital Assistant,PDA)等攜帶型電子裝置。於本較佳實施方式中,以應用於行動電話之用戶識別卡(Subscriber Identification Module,SIM)固持機構為例加以說明。 The chip card holding structure of the present invention is suitable for portable electronic devices such as mobile phones and personal digital assistants (PDAs). In the preferred embodiment, a Subscriber Identification Module (SIM) holding mechanism applied to a mobile phone is taken as an example for description.
請參閱圖1及圖2,本發明之較佳實施方式晶片卡固持結構10用於固持一用戶識別卡20。該晶片卡固持結構10包括一本體11、一蓋體12及一轉軸13。該蓋體12藉由該轉軸13鉸接於本體11。所述用戶識別卡20具有一斜角21。 Referring to FIG. 1 and FIG. 2, the wafer card holding structure 10 of the preferred embodiment of the present invention is used to hold a user identification card 20. The wafer card holding structure 10 includes a body 11 , a cover 12 and a rotating shaft 13 . The cover 12 is hinged to the body 11 by the rotating shaft 13. The subscriber identity card 20 has an oblique angle 21.
所述本體11具有一上壁111、一與該上壁111相對之下壁112、一連接該上、下壁111、112之一第一側壁113、一第二側壁114及一底壁115。該上壁111、下壁112、第一側壁113、第二側壁114及底壁115圍成一電池容置槽116。該本體11之底壁115鄰接該第一側壁113開設一收容槽117。該收容槽117對應行動電話內之電路板上之用戶識別卡連接器(圖未示)設置,其形狀及尺寸與該用戶識別卡20大致相當,用於收容該用戶識別卡20於其內。該收容槽117鄰接下壁112形成有一斜壁118,用於與用戶識別卡20之斜角21相配合以避免用戶識別卡20反插。該第一側壁113朝向該收容槽117之一側凸設一條形狀第一卡塊119。該收容槽117相對第一卡塊119之一側設置有一安裝部1171,用於安裝該轉軸13於其內。 The main body 11 has an upper wall 111, a lower wall 112 opposite to the upper wall 111, a first side wall 113 connecting the upper and lower walls 111, 112, a second side wall 114 and a bottom wall 115. The upper wall 111 , the lower wall 112 , the first side wall 113 , the second side wall 114 , and the bottom wall 115 define a battery receiving groove 116 . A bottom wall 115 of the body 11 defines a receiving groove 117 adjacent to the first sidewall 113. The receiving slot 117 is disposed corresponding to a subscriber identity card connector (not shown) on a circuit board in the mobile phone, and has a shape and a size substantially equivalent to the subscriber identity card 20 for receiving the subscriber identity card 20 therein. The receiving groove 117 is formed adjacent to the lower wall 112 with a slanted wall 118 for cooperating with the bevel 21 of the user identification card 20 to prevent the user identification card 20 from being reversely inserted. The first side wall 113 protrudes toward the one side of the receiving groove 117 by a shape of the first block 119. The receiving groove 117 is provided with a mounting portion 1171 on one side of the first block 119 for mounting the rotating shaft 13 therein.
請一併參閱圖5及圖6,所述蓋體12大致為一“L”形片體,其包括一壓合部121、一扣接部122以及一連接該壓合部121及扣接部122之連接部123。 Referring to FIG. 5 and FIG. 6 , the cover body 12 is substantially an “L”-shaped sheet body, and includes a pressing portion 121 , a fastening portion 122 , and a connecting portion of the pressing portion 121 and the fastening portion. The connection portion 123 of 122.
該壓合部121之遠離連接部123之一端設置一轉軸筒1211。該轉軸筒1211可相對轉動地容置該轉軸13於其內。該壓合部121上對應該用戶識別卡連接器貫通開設六矩形孔1212,以免壓合部121直接按壓於該用戶識別卡連接器。 A shaft barrel 1211 is disposed at one end of the nip portion 121 away from the connecting portion 123. The rotating shaft barrel 1211 accommodates the rotating shaft 13 therein in a relatively rotatable manner. The nip portion 121 has a rectangular opening 1212 corresponding to the user identification card connector, so that the nip portion 121 is directly pressed against the user identification card connector.
該扣接部122遠離連接部123之一端設置一凸條1221,以便使用者繞該轉軸13旋轉該蓋體12。該扣接部122遠離壓合部121之表面對應第一卡塊119凸設一條形第二卡塊1222,從而於該凸條1221與該第二卡塊1222之間形成一卡槽1223。該第一卡塊119卡持於該卡槽1223內。 The fastening portion 122 is disposed at a distal end of the connecting portion 123 to provide a rib 1221 for the user to rotate the cover 12 around the rotating shaft 13 . A strip-shaped second block 1222 is protruded from the surface of the splicing portion 122 away from the nip portion 121, so that a card slot 1223 is formed between the rib 1221 and the second block 1222. The first block 119 is held in the card slot 1223.
該連接部123大致為一“L”形彈性片體,其具有一第一片體1231及垂直連接於該第一片體1231之一第二片體1232。該第一片體1231與第二片體1232之間形成一扇形區1233。該第一片體1231垂直連接於該壓合部121與轉軸筒1211相對之一端,並使得該壓合部121位於該扇形區1233外。該第二片體1232垂直連接於該扣接部122與該凸條1221相對之一端,並使得該扣接部122位於該扇形區1233內。 The connecting portion 123 is substantially an "L"-shaped elastic sheet body having a first sheet body 1231 and a second sheet body 1232 vertically connected to the first sheet body 1231. A sector 1233 is formed between the first body 1231 and the second body 1232. The first piece 1231 is vertically connected to one end of the nip 121 and the rotating barrel 1211, and the nip 121 is located outside the sector 1233. The second piece 1232 is vertically connected to one end of the fastening portion 122 opposite to the rib 1221, and the fastening portion 122 is located in the sector 1233.
請參閱圖3及圖4,裝配該晶片卡時,首先將用戶識別卡20置放於該收容槽117內,並使得該用戶識別卡20之斜角21與斜壁118相配合,且該晶片卡與用戶識別卡連接器相對準;然後翻轉該蓋體12直至該扣接部122之第二卡塊1222越過該第一卡塊119直至該第一卡塊119卡合於該卡槽1223內,此時,用戶識別卡20於壓合部121之作用下電連接於該用戶識別卡連接器,如此則把用戶識別卡20固定於收容槽117中。同樣,拆卸用戶識別卡20時,只需作用於該凸條1221以將該第二卡塊1222越過該第一卡塊119使得扣接部122脫離於該本體11即可取出該用戶識別卡20。 Referring to FIG. 3 and FIG. 4, when the chip card is assembled, the user identification card 20 is first placed in the receiving slot 117, and the bevel 21 of the user identification card 20 is matched with the inclined wall 118, and the chip is matched. The card is aligned with the user identification card connector; then the cover 12 is flipped until the second card 1222 of the fastening portion 122 passes over the first card block 119 until the first card block 119 is engaged in the card slot 1223. At this time, the user identification card 20 is electrically connected to the subscriber identity card connector by the nip portion 121, and thus the subscriber identity card 20 is fixed in the receiving slot 117. Similarly, when the user identification card 20 is disassembled, the user identification card 20 can be taken out only by acting on the rib 1221 to pass the second card block 1222 over the first card block 119 so that the fastening portion 122 is detached from the body 11. .
請參閱圖5及圖6,於扣接部122之第二卡塊1222扣合與脫離該第一卡塊119時,該蓋體12需產生一定之折彎變形,根據物理知識可知,整個蓋體12之最大表面彎曲應力發生於該連接部123與扣接部122之連接處14。我們知道,扣接部122繞該連接處14旋轉之角度θ越大,該連接處14之表面彎曲應力越大。該晶片卡固持結構10藉由採用該連接部123增長了扣接部122之旋轉力臂d,如此扣接部122只需旋轉一較小角度θ即可實現第二卡塊1222與第一卡塊119之扣合,即大大減弱了連接處14之表面彎曲應力,避免了因表面彎曲應力過大而折斷該蓋體12。 Referring to FIG. 5 and FIG. 6 , when the second block 1222 of the fastening portion 122 is engaged and disengaged from the first block 119 , the cover 12 needs to have a certain bending deformation. According to physical knowledge, the entire cover is known. The maximum surface bending stress of the body 12 occurs at the junction 14 of the connecting portion 123 and the fastening portion 122. It is known that the greater the angle θ at which the fastening portion 122 rotates about the joint 14, the greater the surface bending stress of the joint 14. The wafer card holding structure 10 increases the rotational force arm d of the fastening portion 122 by using the connecting portion 123, so that the fastening portion 122 only needs to rotate a small angle θ to realize the second card 1222 and the first card. The snapping of the block 119 greatly weakens the surface bending stress of the joint 14, and prevents the cover 12 from being broken due to excessive surface bending stress.
可以理解,該第一片體1231與該第二片體1232也可呈一鈍角或銳角連接,即該第一片體1231與該第二片體1232之間之夾角小於180°即可。 It can be understood that the first piece 1231 and the second piece 1232 can also be connected at an obtuse or acute angle, that is, the angle between the first piece 1231 and the second piece 1232 is less than 180°.
可以理解,該第一片體1231與該壓合部121也可呈一鈍角或銳角連接即該第一片體1231與第二片體1232之間之夾角小於180°即可。 It can be understood that the first piece 1231 and the nip 121 can also be connected at an obtuse or acute angle, that is, the angle between the first piece 1231 and the second piece 1232 is less than 180°.
可以理解,該第二片體1232與扣接部122也可呈一鈍角或銳角連接,即該第一片體1231與第二片體1232之間之夾角小於180°即可。 It can be understood that the second piece 1232 and the fastening portion 122 can also be connected at an obtuse or acute angle, that is, the angle between the first piece 1231 and the second piece 1232 is less than 180°.
所述晶片卡固持結構10藉由該反向彎折之連接部123來連接該壓合部121及扣接部122,於本體11厚度不變之情況下增大了旋轉力臂d之長度,使得扣接部122之折彎變形大大減小,如此大大減弱了連接處14之表面應力,從而避免了因應力過大而折斷該蓋體12。另外,該晶片卡固持結構10於該扣接部反向沖出第二卡塊1222來卡合於該第一卡塊119上,從而避免了直接磨損本體11。 The wafer card holding structure 10 is connected to the pressing portion 121 and the fastening portion 122 by the reversely bent connecting portion 123, and the length of the rotating force arm d is increased when the thickness of the body 11 is constant. The bending deformation of the fastening portion 122 is greatly reduced, so that the surface stress of the joint portion 14 is greatly weakened, thereby preventing the cover body 12 from being broken due to excessive stress. In addition, the chip card holding structure 10 is reversely punched out of the second card block 1222 to be engaged with the first card block 119, thereby avoiding direct wear of the body 11.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟習本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in accordance with the spirit of the present invention are It should be covered by the following patent application.
12‧‧‧蓋體 12‧‧‧ Cover
121‧‧‧機體 121‧‧‧ body
1211‧‧‧轉軸筒 1211‧‧‧Shaft tube
122‧‧‧頂壁 122‧‧‧ top wall
1221‧‧‧凸條 1221‧‧ ‧ ribs
1222‧‧‧第二卡塊 1222‧‧‧Second block
1223‧‧‧卡槽 1223‧‧‧ card slot
123‧‧‧連接部 123‧‧‧Connecting Department
1231‧‧‧第一片體 1231‧‧‧ first body
1232‧‧‧第二片體 1232‧‧‧Second body
13‧‧‧轉軸 13‧‧‧ shaft
14‧‧‧連接處 14‧‧‧ Connection
119‧‧‧第一卡塊 119‧‧‧ first block
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW97114186A TWI399893B (en) | 2008-04-18 | 2008-04-18 | Chip card lock structure |
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Application Number | Priority Date | Filing Date | Title |
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TW97114186A TWI399893B (en) | 2008-04-18 | 2008-04-18 | Chip card lock structure |
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TW200945688A TW200945688A (en) | 2009-11-01 |
TWI399893B true TWI399893B (en) | 2013-06-21 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI455415B (en) * | 2010-03-31 | 2014-10-01 | Fih Hong Kong Ltd | Chip card hoiding device and portable electronic device employing the same |
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TWM293570U (en) * | 2006-01-13 | 2006-07-01 | Molex Taiwan Ltd | Socket connector |
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---|---|---|---|---|
TWM293570U (en) * | 2006-01-13 | 2006-07-01 | Molex Taiwan Ltd | Socket connector |
TWM294748U (en) * | 2006-01-13 | 2006-07-21 | Molex Taiwan Ltd | Socket connector |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI455415B (en) * | 2010-03-31 | 2014-10-01 | Fih Hong Kong Ltd | Chip card hoiding device and portable electronic device employing the same |
Also Published As
Publication number | Publication date |
---|---|
TW200945688A (en) | 2009-11-01 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |