TWI399896B - Chip card fixing device - Google Patents
Chip card fixing device Download PDFInfo
- Publication number
- TWI399896B TWI399896B TW97120071A TW97120071A TWI399896B TW I399896 B TWI399896 B TW I399896B TW 97120071 A TW97120071 A TW 97120071A TW 97120071 A TW97120071 A TW 97120071A TW I399896 B TWI399896 B TW I399896B
- Authority
- TW
- Taiwan
- Prior art keywords
- fixing device
- card
- wafer card
- wafer
- sliding body
- Prior art date
Links
Landscapes
- Telephone Set Structure (AREA)
Description
本發明涉及一種晶片卡固定裝置,尤其涉及一種應用於可攜式電子裝置之晶片卡固定裝置。 The present invention relates to a wafer card fixing device, and more particularly to a wafer card fixing device applied to a portable electronic device.
近年來,具有集成電路之表面晶片卡廣泛應用於電子裝置中以提高或增加電子裝置之性能,如安裝於行動電話中之用戶識別卡(subscriber identification module card,以下通稱SIM卡),其內儲存有操作行動電話之必要資訊,而且記載有用戶個人資訊。藉由更換SIM卡,一隻行動電話可供多個用戶使用。 In recent years, surface wafer cards with integrated circuits have been widely used in electronic devices to enhance or increase the performance of electronic devices, such as a subscriber identification module card (hereinafter referred to as a SIM card) installed in a mobile phone, and stored therein. There is necessary information for operating a mobile phone, and personal information about the user is recorded. By replacing the SIM card, a mobile phone can be used by multiple users.
習知之SIM卡一般容置於行動電話之一卡槽內。當該SIM卡容置於該卡槽內時,該SIM卡上之集成電路藉由一連接器與該行動電話之電路板連接。同時,該SIM卡部分暴露於該卡槽外,如此,當需要更換該SIM卡時,使用者直接按壓該SIM卡暴露於該卡槽外之部分,並藉由該使用者與該SIM卡之間之摩擦力,而使該SIM卡由該卡槽內滑出。 The SIM card of the conventional one is generally placed in one of the slots of the mobile phone. When the SIM card is received in the card slot, the integrated circuit on the SIM card is connected to the circuit board of the mobile phone by a connector. At the same time, the SIM card is partially exposed to the card slot. When the SIM card needs to be replaced, the user directly presses the SIM card to expose the portion outside the card slot, and the user and the SIM card The friction between the SIM cards is slipped out of the card slot.
由於SIM卡暴露於該卡槽外之部分一般較小,因此使用者按難以按壓該SIM卡,如此,使用者與該SIM卡之間不易產生摩擦力,進而難以藉由該摩擦力帶動該SIM卡由該卡槽滑出。 Since the portion of the SIM card exposed to the card slot is generally small, it is difficult for the user to press the SIM card. Therefore, friction between the user and the SIM card is less likely to occur, and it is difficult to drive the SIM by the friction. The card slides out of the card slot.
有鑒於此,有必要提供一種可便於取出晶片卡之晶片卡固定裝置。 In view of the above, it is necessary to provide a wafer card holding device that can facilitate the removal of a wafer card.
一種晶片卡固定裝置,其包括一結合體、一殼體及一螺釘,該結合體設置於該殼體上,該結合體內開設一卡槽用於容納該晶片卡於其內,該晶片卡固定裝置還包括一滑動體,該滑動體上開設一缺口,該殼體上開設一配合孔,該螺柱先穿過該缺口後,再螺合於該配合孔內,從而將該滑動體可滑動地裝配於該殼體上,該滑動體包括一抵持部及一觸發部,當該觸發部滑動時,該抵持部抵持該晶片卡由該卡槽內滑出。 A wafer card fixing device includes a combination body, a casing and a screw. The combination body is disposed on the casing. The coupling body defines a card slot for accommodating the wafer card therein. The wafer card is fixed. The device further includes a sliding body, a gap is formed in the sliding body, and a matching hole is formed in the housing. The stud first passes through the notch and then is screwed into the matching hole, thereby sliding the sliding body The sliding body includes a resisting portion and a triggering portion. When the triggering portion slides, the resisting portion abuts the wafer card and slides out of the card slot.
相較於習知技術,所述晶片卡固定裝置藉由該觸發部之滑動而帶動該晶片卡由該卡槽滑出,這使得該晶片卡可輕鬆地由該卡槽內滑出。 Compared with the prior art, the wafer card fixing device drives the wafer card to slide out of the card slot by the sliding of the trigger portion, so that the wafer card can be easily slipped out of the card slot.
100‧‧‧晶片卡固定裝置 100‧‧‧ wafer card holder
26‧‧‧卡槽 26‧‧‧ card slot
10‧‧‧殼體 10‧‧‧shell
27‧‧‧開口 27‧‧‧ openings
12‧‧‧容置腔 12‧‧‧容容
30‧‧‧滑動體 30‧‧‧Sliding body
14‧‧‧周壁 14‧‧‧Wall
32‧‧‧平板部 32‧‧‧ Flat section
16‧‧‧配合孔 16‧‧‧With holes
34‧‧‧抵持部 34‧‧‧Resistance Department
20‧‧‧結合體 20‧‧‧ combination
36‧‧‧觸發部 36‧‧‧Trigger
21‧‧‧上壁 21‧‧‧Upper wall
38‧‧‧缺口 38‧‧‧ gap
22‧‧‧下壁 22‧‧‧ Lower wall
40‧‧‧螺釘 40‧‧‧ screws
222‧‧‧通孔 222‧‧‧through hole
42‧‧‧螺帽 42‧‧‧ nuts
23‧‧‧第一側壁 23‧‧‧First side wall
44‧‧‧螺柱 44‧‧‧ Stud
24‧‧‧第二側壁 24‧‧‧ second side wall
50‧‧‧晶片卡 50‧‧‧wafer card
25‧‧‧第三側壁 25‧‧‧ third side wall
圖1係本發明較佳實施例之晶片卡固定裝置之立體分解示意圖;圖2係圖1所示晶片卡固定裝置之另一視角之局部立體分解示意圖;圖3係圖2所示晶片卡固定裝置之結合體之放大圖;圖4係圖2所示晶片卡固定裝置之結合體、滑動體及晶片卡結合為一體之立體示意圖;圖5係圖1所示晶片卡固定裝置之組裝圖;圖6係圖5所示晶片卡固定裝置之局部剖視圖。 1 is a perspective exploded view of a wafer card fixing device according to a preferred embodiment of the present invention; FIG. 2 is a partially exploded perspective view of the wafer card fixing device of FIG. 1; FIG. FIG. 4 is a perspective view showing the combination of the combination of the wafer card fixing device, the sliding body and the wafer card shown in FIG. 2; FIG. 5 is an assembled view of the wafer card fixing device shown in FIG. 1; Figure 6 is a partial cross-sectional view of the wafer card securing device of Figure 5.
本發明之較佳實施例公開一種晶片卡固定裝置,其適用於行動電話等可攜式電子裝置。在本實施例中,以行動電話為例說明此晶片卡固定裝置。 A preferred embodiment of the present invention discloses a wafer card securing device suitable for use in a portable electronic device such as a mobile phone. In the present embodiment, the wafer card fixing device will be described by taking a mobile phone as an example.
請參閱圖1及圖2,該晶片卡固定裝置100包括一殼體10、一結合體20、一滑動體30及一螺釘40。一晶片卡50(比如SIM卡、存儲卡)藉由該結合體20固定於該殼體10上,且該晶片卡50藉由設置於該結合體20之連接器22與 一電路板(圖未示)實現電連接。 Referring to FIG. 1 and FIG. 2 , the wafer card fixing device 100 includes a housing 10 , a combined body 20 , a sliding body 30 , and a screw 40 . A chip card 50 (such as a SIM card, a memory card) is fixed to the casing 10 by the combination body 20, and the chip card 50 is connected to the connector 22 of the combination body 20 by A circuit board (not shown) provides electrical connection.
該殼體10為行動電話機殼之一部分,大體為長方體形。該殼體10之下半部開設一容納電池之長方形容置腔12,容置腔12由四周壁14圍成。該殼體10之上半部開設有一配合孔16。本實施例中,該配合孔16為一螺紋孔,該配合孔16用於固定該滑動體30。 The housing 10 is part of a mobile phone housing and is generally cuboid. The lower half of the casing 10 defines a rectangular receiving cavity 12 for accommodating the battery, and the accommodating cavity 12 is surrounded by the surrounding wall 14. A fitting hole 16 is defined in the upper half of the housing 10. In this embodiment, the matching hole 16 is a threaded hole, and the matching hole 16 is used for fixing the sliding body 30.
請一併參閱圖3,該結合體20為一端開口之方形腔體,其包括一上壁21、一下壁22、一第一側壁23、一第二側壁24及一第三側壁25。該下壁22為該結合體20朝向該殼體10之壁面,該上壁21與該下壁22相對設置。該第一側壁23、該第二側壁24及該第三側壁25均設置於該上壁21與該下壁22之間,且該第一側壁23與該第二側壁24相對設置,該第三側壁25之兩端分別於該第一側壁23及該第二側壁24連接。 Referring to FIG. 3 , the combined body 20 is a square cavity with an open end, and includes an upper wall 21 , a lower wall 22 , a first sidewall 23 , a second sidewall 24 , and a third sidewall 25 . The lower wall 22 is a wall surface of the combined body 20 facing the casing 10, and the upper wall 21 is disposed opposite to the lower wall 22. The first sidewall 23, the second sidewall 24, and the third sidewall 25 are disposed between the upper wall 21 and the lower wall 22, and the first sidewall 23 is opposite to the second sidewall 24. Both ends of the side wall 25 are connected to the first side wall 23 and the second side wall 24, respectively.
該上壁21、該下壁22、該第一側壁23、該第二側壁24及該第三側壁25圍成一卡槽26,同時於該第三側壁25相對之一端形成一開口27。該卡槽26用來容納該晶片卡50,且該晶片卡50藉由該開口27進入該卡槽26。 The upper wall 21, the lower wall 22, the first side wall 23, the second side wall 24 and the third side wall 25 define a card slot 26, and an opening 27 is formed at one end of the third side wall 25. The card slot 26 is adapted to receive the wafer card 50, and the wafer card 50 enters the card slot 26 through the opening 27.
該下壁22於鄰近該第三側壁25之一端開設一方形通孔222,該通孔222之作用為:當該晶片卡50容納於該卡槽26內時,該滑動體30由該通孔222伸進該卡槽26與該晶片卡50抵持(如圖4所示)。 The lower wall 22 defines a square through hole 222 adjacent to one end of the third side wall 25. The through hole 222 functions to: when the wafer card 50 is received in the card slot 26, the sliding body 30 is formed by the through hole The 222 extends into the card slot 26 to resist the wafer card 50 (as shown in FIG. 4).
該滑動體30大體為長方形板狀,其包括一平板部32,該平板部32之兩端分別彎折形成一抵持部34及一觸發部36。該抵持部34用來與該晶片卡50抵持,本實施例中,該抵持部34為由該平板部32之一端彎折形成之折片。該觸發部36用來觸發該滑動體30由該卡槽26內滑出,本實施例中,該觸發部36為由該平板部32之另一端彎折之拉鉤。該滑動體30於該平板部32靠近該抵持部34之一端開設一橢圓形之缺口38,該缺口38對應於該配合孔16開設。 The sliding body 30 has a substantially rectangular plate shape and includes a flat plate portion 32. The two ends of the flat plate portion 32 are respectively bent to form a resisting portion 34 and a trigger portion 36. The abutting portion 34 is for resisting the wafer card 50. In the embodiment, the abutting portion 34 is a flap formed by bending one end of the flat plate portion 32. The triggering portion 36 is configured to trigger the slider 30 to slide out of the slot 26 . In the embodiment, the trigger portion 36 is a hook that is bent by the other end of the flat portion 32 . The sliding body 30 defines an elliptical notch 38 at one end of the flat portion 32 adjacent to the abutting portion 34. The notch 38 is opened corresponding to the matching hole 16.
該螺釘40包括一螺帽42及一由該螺帽42延伸之螺柱44。該螺柱44截面尺寸小於該缺口38之截面尺寸。螺釘40用來使該滑動體30可滑動地裝配於該殼體10上。 The screw 40 includes a nut 42 and a stud 44 extending from the nut 42. The stud 44 has a cross-sectional dimension that is less than the cross-sectional dimension of the indentation 38. A screw 40 is used to slidably mount the slider 30 to the housing 10.
請一併參閱圖5及圖6,裝配該晶片卡固定裝置100時,先將該滑動體30放置於該殼體10上,且使該缺口38與該配合孔16對準,然後將該螺柱44先穿過該缺口38後,再螺合於該配合孔16內,此時,由於該螺柱44截面尺寸小於該缺口38之截面尺寸,因此該螺柱44與該平板部32於水準方向上有空隙,同時使該螺帽42與該滑動體30於豎直方向上保有空隙,從而將該滑動體30可滑動地裝配於該殼體10上;然後,將該結合體20固接(比如螺接或熱熔)於殼體10上,此時,該滑動體30之抵持部34由該通孔222伸入該卡槽26內,從而完成該晶片卡50固持裝置之裝配。 Referring to FIG. 5 and FIG. 6 , when the wafer card fixing device 100 is assembled, the sliding body 30 is first placed on the housing 10 , and the notch 38 is aligned with the matching hole 16 , and then the screw is inserted. After the post 44 passes through the notch 38, it is screwed into the fitting hole 16. At this time, since the cross-sectional dimension of the stud 44 is smaller than the cross-sectional dimension of the notch 38, the stud 44 and the flat portion 32 are at the level. There is a gap in the direction, and the nut 42 and the sliding body 30 are kept in a vertical direction, so that the sliding body 30 is slidably fitted on the casing 10; then, the combined body 20 is fixed The splicing portion 34 of the sliding body 30 extends into the card slot 26 to complete the assembly of the wafer card 50 holding device.
安裝該晶片卡50時,該晶片卡50之一端藉由該開口27進入該卡槽26,且使該晶片卡50進入該卡槽26之一端與該抵持部34抵持,即完成該晶片卡50之安裝。需要取出該晶片卡50時,該觸發部36沿拉出該卡槽26之方向滑動,從而帶動該抵持部34由該卡槽26內滑出,而該抵持部34與該晶片卡50抵持,進而該抵持部34帶動該晶片卡50由該卡槽26內滑出。 When the chip card 50 is mounted, one end of the chip card 50 enters the card slot 26 through the opening 27, and the wafer card 50 enters one end of the card slot 26 to abut the abutting portion 34, that is, the chip is completed. Card 50 installation. When the chip card 50 needs to be removed, the triggering portion 36 slides in the direction of pulling out the card slot 26, thereby driving the resisting portion 34 to slide out of the card slot 26, and the resisting portion 34 and the chip card 50 are removed. The resisting portion 34 drives the wafer card 50 to slide out of the card slot 26.
所述晶片卡固定裝置藉由該觸發部36之滑動而帶動該晶片卡50由該卡槽26滑出,這使得該晶片卡可輕鬆地由該卡槽26內滑出。 The wafer card fixing device drives the wafer card 50 to slide out of the card slot 26 by sliding of the trigger portion 36, so that the wafer card can be easily slipped out of the card slot 26.
可以理解,該滑動體30可不設置於該殼體10上,而可滑動地設置於該結合體20之下壁22上。 It can be understood that the sliding body 30 can be disposed not on the casing 10 and slidably disposed on the lower wall 22 of the combined body 20.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵 蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are Should Covered in the scope of the following patent application.
10‧‧‧殼體 10‧‧‧shell
36‧‧‧觸發部 36‧‧‧Trigger
20‧‧‧結合體 20‧‧‧ combination
38‧‧‧缺口 38‧‧‧ gap
26‧‧‧卡槽 26‧‧‧ card slot
40‧‧‧螺釘 40‧‧‧ screws
30‧‧‧滑動體 30‧‧‧Sliding body
42‧‧‧螺帽 42‧‧‧ nuts
34‧‧‧抵持部 34‧‧‧Resistance Department
44‧‧‧螺柱 44‧‧‧ Stud
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97120071A TWI399896B (en) | 2008-05-30 | 2008-05-30 | Chip card fixing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97120071A TWI399896B (en) | 2008-05-30 | 2008-05-30 | Chip card fixing device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200950229A TW200950229A (en) | 2009-12-01 |
TWI399896B true TWI399896B (en) | 2013-06-21 |
Family
ID=44871244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97120071A TWI399896B (en) | 2008-05-30 | 2008-05-30 | Chip card fixing device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI399896B (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200723615A (en) * | 2005-12-02 | 2007-06-16 | Sutech Trading Ltd | Chip card holding structure |
-
2008
- 2008-05-30 TW TW97120071A patent/TWI399896B/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200723615A (en) * | 2005-12-02 | 2007-06-16 | Sutech Trading Ltd | Chip card holding structure |
Also Published As
Publication number | Publication date |
---|---|
TW200950229A (en) | 2009-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7442086B1 (en) | Chip card retaining mechanism | |
US7746635B2 (en) | Chip card catching mechanism and portable electronic device using the same | |
US8462512B2 (en) | Chip card holder and electronic device using the same | |
US8622646B2 (en) | Electronic device with slot cover ejection mechanism | |
US8061608B2 (en) | Card reader | |
TW201320498A (en) | Chip card holding structure and portable electronic device using same | |
US7780090B2 (en) | Chip card holder | |
US20090305541A1 (en) | Chip card retaining mechanism and printed circuit board module incorporating same | |
TW201018011A (en) | Module connector | |
US7837487B2 (en) | Card socket assembly | |
US8070521B2 (en) | Socket connector and electronic device using the same | |
US7753702B2 (en) | Card socket assembly | |
US7497727B2 (en) | Card connector | |
TWI399896B (en) | Chip card fixing device | |
TWI402021B (en) | Housing module | |
KR200460852Y1 (en) | Magnetic Head Module Unit of Card Reader | |
US8100714B2 (en) | Connector and electronic device using same | |
US8223502B2 (en) | Chip card holder and electronic device using the same | |
US8403226B2 (en) | Chip card holder | |
TWI416925B (en) | Chip card holding device | |
TWI446777B (en) | Chip card holding structure | |
TWI446779B (en) | Chip card holding structure | |
TWI391077B (en) | Chip card catching mechanism and portable electronic device using the same | |
TWI467859B (en) | Chip card holding structure | |
TWI393416B (en) | Sim card catching mechanism |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |