TWI467859B - Chip card holding structure - Google Patents

Chip card holding structure Download PDF

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Publication number
TWI467859B
TWI467859B TW97138870A TW97138870A TWI467859B TW I467859 B TWI467859 B TW I467859B TW 97138870 A TW97138870 A TW 97138870A TW 97138870 A TW97138870 A TW 97138870A TW I467859 B TWI467859 B TW I467859B
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TW
Taiwan
Prior art keywords
card
mounting
holding device
top cover
wafer
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TW97138870A
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Chinese (zh)
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TW201015797A (en
Inventor
Jin Li
Chang-Zhi Li
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Fih Hong Kong Ltd
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Priority to TW97138870A priority Critical patent/TWI467859B/en
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Publication of TWI467859B publication Critical patent/TWI467859B/en

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Description

晶片卡固持裝置 Wafer card holding device

本發明涉及一種用於容置並固持晶片卡之固持裝置,特別涉及一種用於攜帶型電子裝置上之晶片卡固持裝置。 The present invention relates to a holding device for accommodating and holding a wafer card, and more particularly to a wafer card holding device for a portable electronic device.

隨著通訊事業之迅速發展,行動電話、個人數位助理(personal digital assistant,PDA)等各種攜帶型電子裝置之使用越來越普及。隨著該等攜帶型電子裝置產品之功能日益多元化,應用於該等攜帶型裝置上之用於存儲記憶之晶片卡亦越來越多,例如SD卡(Secure Digital Memory Card)、CF卡(Compact Flash Card )、SIM卡(Subscriber Identification Module Card,用戶識別卡)等。其中,SIM卡係一種裝有IC晶片之塑膠卡片,其具有記錄個人用戶號碼及通訊簿等功能,藉由更換SIM卡,其可供多個用戶使用。 With the rapid development of the communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular. As the functions of these portable electronic device products become increasingly diversified, more and more wafer cards for storing memories are applied to such portable devices, such as an SD card (Secure Digital Memory Card) and a CF card ( Compact Flash Card), SIM card (Subscriber Identification Module Card), etc. Among them, the SIM card is a plastic card equipped with an IC chip, which has functions of recording a personal user number and an address book, and can be used by a plurality of users by replacing the SIM card.

習知晶片卡一般容置於攜帶型電子裝置之卡槽內。當該晶片卡容置於該卡槽內時,該晶片卡上之積體電路藉由一連接器與該攜帶型電子裝置之電路板連接。當需要更換該晶片卡時,使用者使用手指直接按住該晶片卡暴露之部分,並向該卡槽外拖動,藉由使用者手指與該晶片卡之間之摩擦力使該晶片卡隨使用者手指運動,直至晶片卡由該卡槽內滑出。 Conventional wafer cards are generally housed in a card slot of a portable electronic device. When the chip card is received in the card slot, the integrated circuit on the chip card is connected to the circuit board of the portable electronic device by a connector. When the wafer card needs to be replaced, the user directly presses the exposed portion of the wafer card with a finger and drags the card card outside, and the wafer card is driven by the friction between the user's finger and the wafer card. The user's finger moves until the wafer card slides out of the card slot.

然,於實際使用中,由於晶片卡暴露於卡槽外之部分一般較小, 直接按壓外露部分操作較為困難;有些型號之晶片卡甚至全部容置於卡槽內。故,使用者難以藉由直接按壓該晶片卡之方式帶動該晶片卡由卡槽滑出。 However, in actual use, since the wafer card is generally exposed to the outside of the card slot, the portion is generally small. It is more difficult to directly press the exposed part; some models of the chip card are even placed in the card slot. Therefore, it is difficult for the user to drive the wafer card to slide out of the card slot by directly pressing the wafer card.

有鑒於以上缺陷,有必要提供一種易於更換晶片卡且可有效容置、固持晶片卡之晶片卡固持裝置。 In view of the above drawbacks, it is necessary to provide a wafer card holding device that can easily replace a wafer card and can effectively accommodate and hold the wafer card.

一種晶片卡固持裝置,其包括一基體及一設置於該基體上之用於裝設一晶片卡之卡裝設部,該卡裝設部具有一用以插入晶片卡之開口;所述晶片卡固持裝置還包括一頂蓋及一釋放件,該頂蓋可拆卸地裝設於基體上並位於該卡裝設部上方,該頂蓋上貫通開設一條形通孔;所述釋放件可滑動地裝設於頂蓋之條形通孔內,用以將該晶片卡從該卡裝設空間內推出。 A wafer card holding device includes a base body and a card mounting portion disposed on the base body for mounting a wafer card, the card mounting portion having an opening for inserting a wafer card; the wafer card The holding device further includes a top cover and a release member, the top cover is detachably mounted on the base body and located above the card mounting portion, the top cover is formed through a through hole; the release member is slidably The strip is inserted into the strip-shaped through hole of the top cover for pushing the wafer card out of the card mounting space.

相較於習知技術,所述晶片卡固持裝置結構簡單,其藉由一可滑動地裝設於頂蓋上之釋放件,輕易地實現了晶片卡之安裝及拆卸,同時使得晶片卡之安裝及更換過程變得更加簡單,容易操作。 Compared with the prior art, the wafer card holding device has a simple structure, and the wafer card is easily mounted and disassembled by a release member slidably mounted on the top cover, and the wafer card is installed at the same time. And the replacement process is easier and easier to operate.

100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder

10‧‧‧基體 10‧‧‧ base

12‧‧‧卡裝設部 12‧‧‧Card Installation Department

121‧‧‧開口 121‧‧‧ openings

122‧‧‧底壁 122‧‧‧ bottom wall

123‧‧‧縱向側壁 123‧‧‧ longitudinal side wall

125‧‧‧連接壁 125‧‧‧Connecting wall

13‧‧‧第一卡合槽 13‧‧‧First engagement slot

15‧‧‧卡連接器 15‧‧‧ card connector

16‧‧‧第二卡合槽 16‧‧‧Second snap groove

18‧‧‧安裝槽 18‧‧‧Installation slot

30‧‧‧頂蓋 30‧‧‧Top cover

31‧‧‧頂板 31‧‧‧ top board

312‧‧‧條形通孔 312‧‧‧ strip through holes

315‧‧‧缺口 315‧‧ ‧ gap

317‧‧‧抵持部 317‧‧‧Resistance Department

33‧‧‧安裝壁 33‧‧‧Installation wall

333‧‧‧第一卡塊 333‧‧‧ first card block

336‧‧‧第二卡塊 336‧‧‧Second block

338‧‧‧凸柱 338‧‧‧Bump

50‧‧‧釋放件 50‧‧‧ release

51‧‧‧主體 51‧‧‧ Subject

52‧‧‧推塊 52‧‧‧ push block

53‧‧‧側面 53‧‧‧ side

55‧‧‧條形滑槽 55‧‧‧ strip chute

70‧‧‧晶片卡 70‧‧‧wafer card

圖1為本發明晶片卡固持裝置較佳實施例之立體分解示意圖;圖2為本發明晶片卡固持裝置較佳實施例之另一視角下之立體分解示意圖;圖3為本發明晶片卡固持裝置較佳實施例之立體組裝示意圖;圖4為晶片卡裝設於本發明晶片卡固持裝置內之立體示意圖;圖5為晶片卡被從晶片卡固持裝置內推出時之立體示意圖。 1 is a perspective exploded view of a preferred embodiment of a wafer card holding device of the present invention; FIG. 2 is a perspective exploded view of another preferred embodiment of the wafer card holding device of the present invention; FIG. 3 is a wafer card holding device of the present invention; 3 is a schematic perspective view of a preferred embodiment of the present invention; FIG. 4 is a perspective view of the wafer card mounted in the wafer card holding device of the present invention; and FIG. 5 is a perspective view of the wafer card as it is ejected from the wafer card holding device.

本發明之較佳實施例公開一種晶片卡固持裝置,其適用於行動電話、個人數位助理(personal digital assistant,PDA)等攜帶型電子裝置。於本實施例中,以應用於一行動電話(圖未示)為例說明此晶片卡固持裝置。 A preferred embodiment of the present invention discloses a wafer card holding device suitable for use in a portable electronic device such as a mobile phone or a personal digital assistant (PDA). In the present embodiment, the wafer card holding device is described by taking a mobile phone (not shown) as an example.

請參閱圖1及圖2,所述晶片卡固持裝置100包括一基體10、一頂蓋30及一釋放件50。所述基體10大致呈矩形板狀,其可以為一行動電話之機殼。所述基體10上向下凹設形成一大致矩形凹槽狀之卡裝設部12,以用於裝設晶片卡70(參閱圖4)。所述卡裝設部12之一端被貫通形成一連通該卡裝設部12與外界之開口121,以利於晶片卡70裝入該卡裝設部12內。所述卡裝設部12包括一底壁122、二相對平行設置之縱向側壁123及一連接該二縱向側壁123之橫向連接壁125,其共同圍成所述卡裝設部12。所述底壁122上裝設有一卡連接器15。所述二縱向側壁123之外側面上臨近開口121之一端分別相對凹設形成一第一卡合槽13,該二縱向側壁123之外側面上臨近該連接壁125一端分別相對凹設形成一第二卡合槽16及一安裝槽18。所述第一卡合槽13大致呈矩形凹槽狀,其內向外凸設形成一卡塊。所述第二卡合槽16與安裝槽18相鄰設置。 Referring to FIGS. 1 and 2 , the wafer card holding device 100 includes a base 10 , a top cover 30 and a release member 50 . The base body 10 has a substantially rectangular plate shape, which may be a casing of a mobile phone. The base body 10 is recessed downwardly to form a substantially rectangular recessed card mounting portion 12 for mounting the wafer card 70 (see FIG. 4). One end of the card mounting portion 12 is formed through an opening 121 that communicates with the card mounting portion 12 and the outside to facilitate loading of the wafer card 70 into the card mounting portion 12. The card mounting portion 12 includes a bottom wall 122, two longitudinal sidewalls 123 disposed in parallel with each other, and a lateral connecting wall 125 connecting the two longitudinal sidewalls 123. The card mounting portion 12 is enclosed. A card connector 15 is mounted on the bottom wall 122. A first engaging groove 13 is formed on one of the outer side surfaces of the two adjacent side walls 123, and one end of the two side walls 123 adjacent to the connecting wall 125 is oppositely recessed. The two engaging slots 16 and a mounting slot 18. The first engaging groove 13 is substantially in the shape of a rectangular groove, and protrudes outwardly and outwardly to form a block. The second engaging groove 16 is disposed adjacent to the mounting groove 18 .

所述頂蓋30可拆卸地裝設於所述基體10上並位於該卡裝設部12上方,該頂蓋30與基體10之卡裝設部12共同圍成一大致矩形腔體狀卡裝設空間,以用於裝設並容置所述晶片卡70。所述頂蓋30包括一大致矩形板狀之頂板31及二沿該頂板31之二相對縱向側緣垂直延伸彎折而成之安裝壁33。所述頂板31之大致中部位置處沿平行於該二安裝壁33所處之縱向方向朝向一端貫通開設有一條形通孔312,以用於裝設所述釋放件50。該頂板31上鄰近該條形通孔312 之相對兩側分別被貫通開設一“U”形缺口315從而各形成一朝向該二安裝壁33彎折方向之彈性抵持部317。所述二安裝壁33上對應於所述基體10上之第一卡合槽13、第二卡合槽16及安裝槽18分別凸設有一第一卡塊333、一第二卡塊336及一凸柱338。 The top cover 30 is detachably mounted on the base 10 and above the card mounting portion 12, and the top cover 30 and the card mounting portion 12 of the base 10 together form a substantially rectangular cavity card. A space is provided for mounting and accommodating the wafer card 70. The top cover 30 includes a top plate 31 having a substantially rectangular plate shape and two mounting walls 33 extending perpendicularly along opposite longitudinal side edges of the top plate 31. A substantially through-hole 312 is formed in a substantially central portion of the top plate 31 so as to be parallel to the longitudinal direction of the two mounting walls 33 toward the one end for mounting the release member 50. The top plate 31 is adjacent to the strip through hole 312 The opposite sides are respectively opened through a "U" shaped notch 315 to form an elastic abutting portion 317 which is bent toward the two mounting walls 33. A first block 333, a second block 336 and a first engaging block 13 , a second engaging groove 16 and a mounting groove 18 are respectively protruded from the two mounting walls 33 . A stud 338.

所述釋放件50可滑動地裝設於所述頂蓋30之條形通孔312內,其包括一主體51及一推塊52。所述主體51為一橫截面大致呈“工”形之矩形塊狀體,其一表面上凸設有複數條形凸筋(圖未標),以便於使用過程中推動所述釋放件50。所述主體51之二相對側面53上分別向內凹設形成一條形滑槽55,該二條形滑槽55之寬度與所述頂蓋30之頂板31之厚度相當,該二條形滑槽55之間間隔之距離與所述頂蓋30之條形通孔312之寬度大致相當。所述推塊52沿垂直且遠離設有複數條形凸筋之表面方向凸設於該主體51之一端部位置處。 The release member 50 is slidably mounted in the strip-shaped through hole 312 of the top cover 30 and includes a main body 51 and a push block 52. The main body 51 is a rectangular block body having a substantially "work" shape in cross section, and a plurality of strip-shaped ribs (not labeled) are protruded on one surface to facilitate the release member 50 during use. The two opposite sides 53 of the main body 51 are respectively recessed inwardly to form a strip-shaped sliding groove 55, and the width of the two-shaped sliding groove 55 is equivalent to the thickness of the top plate 31 of the top cover 30, and the two-shaped sliding groove 55 The distance between the spaces is substantially equal to the width of the strip-shaped through holes 312 of the top cover 30. The push block 52 protrudes at an end position of the main body 51 in a direction perpendicular to the surface of the plurality of strip-shaped ribs.

請一併參閱圖3,安裝所述晶片卡固持裝置100時,先將所述釋放件50可滑動地裝設於頂蓋30之條形通孔312內,該釋放件50之推塊52位於該頂蓋30之二側壁33之間。所述釋放件50之二條形滑槽55分別對應地卡合裝設於該頂蓋30之條形通孔312二側之頂板31上。接下來,將頂蓋30固定裝設於所述基體10上,該頂蓋30之二側壁33上之第一卡塊333、第二卡塊336及凸柱338分別對應地卡合於所述基體10上之第一卡合槽13、第二卡合槽16及一安裝槽18內,即完成晶片卡固持裝置100之組裝。所述釋放件50之推塊52容置於所述頂蓋30與基體10之間圍成之卡容置空間內,以用於推抵晶片卡70朝向開口121端方向滑移。 Referring to FIG. 3, when the wafer card holding device 100 is mounted, the release member 50 is slidably installed in the strip-shaped through hole 312 of the top cover 30, and the push block 52 of the release member 50 is located. Between the two side walls 33 of the top cover 30. The two-shaped sliding grooves 55 of the releasing member 50 are respectively engaged with the top plate 31 of the two sides of the strip-shaped through holes 312 of the top cover 30. Next, the top cover 30 is fixedly mounted on the base 10, and the first block 333, the second block 336 and the protrusion 338 on the two side walls 33 of the top cover 30 are respectively correspondingly engaged with the The assembly of the wafer card holding device 100 is completed in the first engaging groove 13 , the second engaging groove 16 and the mounting groove 18 of the base body 10 . The push block 52 of the release member 50 is received in a card accommodating space enclosed between the top cover 30 and the base 10 for sliding against the wafer card 70 toward the end of the opening 121.

請一併參閱圖4及圖5,裝入所述晶片卡70時,將所述晶片卡70由 該晶片卡固持裝置100之基體10之開口121端插入,使該晶片卡70裝設並容置於卡裝設部12內,同時該晶片卡70之插入端抵持於所述釋放件50之推塊52上。當需要取出所述晶片卡70時,朝開口121方向推動所述釋放件50,該釋放件50推抵所述晶片卡70朝開口121端移動直至將該晶片卡70露出,即可取出所述晶片卡70。 Referring to FIG. 4 and FIG. 5 together, when the chip card 70 is loaded, the wafer card 70 is The end of the opening 121 of the base 10 of the wafer card holding device 100 is inserted, so that the chip card 70 is mounted and received in the card mounting portion 12, and the insertion end of the wafer card 70 is abutted against the release member 50. Push block 52. When the wafer card 70 needs to be taken out, the release member 50 is pushed toward the opening 121, and the release member 50 is pushed against the wafer card 70 to move toward the opening 121 until the wafer card 70 is exposed. Wafer card 70.

本發明所述晶片卡固持裝置100結構簡單,其藉由一可滑動地裝設於頂蓋31上之釋放件50,輕易地實現了晶片卡70之安裝及拆卸,同時使得晶片卡70之安裝及更換過程變得更加簡單,容易操作。 The wafer card holding device 100 of the present invention has a simple structure, and the mounting and dismounting of the wafer card 70 is easily realized by a release member 50 slidably mounted on the top cover 31, and the wafer card 70 is mounted at the same time. And the replacement process is easier and easier to operate.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.

100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder

10‧‧‧基體 10‧‧‧ base

12‧‧‧卡裝設部 12‧‧‧Card Installation Department

121‧‧‧開口 121‧‧‧ openings

122‧‧‧底壁 122‧‧‧ bottom wall

123‧‧‧縱向側壁 123‧‧‧ longitudinal side wall

125‧‧‧連接壁 125‧‧‧Connecting wall

13‧‧‧第一卡合槽 13‧‧‧First engagement slot

15‧‧‧卡連接器 15‧‧‧ card connector

16‧‧‧第二卡合槽 16‧‧‧Second snap groove

18‧‧‧安裝槽 18‧‧‧Installation slot

30‧‧‧頂蓋 30‧‧‧Top cover

31‧‧‧頂板 31‧‧‧ top board

312‧‧‧條形通孔 312‧‧‧ strip through holes

315‧‧‧缺口 315‧‧ ‧ gap

317‧‧‧抵持部 317‧‧‧Resistance Department

33‧‧‧安裝壁 33‧‧‧Installation wall

333‧‧‧第一卡塊 333‧‧‧ first card block

336‧‧‧第二卡塊 336‧‧‧Second block

338‧‧‧凸柱 338‧‧‧Bump

50‧‧‧釋放件 50‧‧‧ release

51‧‧‧主體 51‧‧‧ Subject

52‧‧‧推塊 52‧‧‧ push block

53‧‧‧側面 53‧‧‧ side

55‧‧‧條形滑槽 55‧‧‧ strip chute

70‧‧‧晶片卡 70‧‧‧wafer card

Claims (8)

一種晶片卡固持裝置,其包括一基體及一設置於該基體上之用於裝設一晶片卡之卡裝設部,該卡裝設部具有一用以插入晶片卡之開口;其改良在於:所述晶片卡固持裝置還包括一頂蓋及一釋放件,該頂蓋裝設於基體上並位於該卡裝設部上方,該頂蓋上貫通開設一條形通孔;所述釋放件包括一主體,其二相對側面上分別向內凹設形成一條形滑槽;所述釋放件之二滑槽分別對應地卡合裝設於該頂蓋之條形通孔二側之頂蓋上,用以將該晶片卡從該卡裝設空間內推出。 A chip card holding device includes a base body and a card mounting portion disposed on the base body for mounting a wafer card, the card mounting portion having an opening for inserting the chip card; The chip card holding device further includes a top cover and a release member, the top cover is mounted on the base body and located above the card mounting portion, and the top cover is formed through a through hole; the release member includes a a main body is formed on the opposite sides of the two sides to form a strip-shaped sliding groove; the two sliding grooves of the releasing member are respectively correspondingly engaged with the top cover of the two sides of the strip-shaped through hole of the top cover, The wafer card is ejected from the card mounting space. 如申請專利範圍第1項所述之晶片卡固持裝置,其中所述釋放件還包括一推塊,其凸設於主體之一端部位置處,以用於推抵裝設於卡裝設部內之晶片卡。 The wafer card holding device of claim 1, wherein the release member further comprises a push block protruding from an end of the main body for pushing against the card mounting portion. Wafer card. 如申請專利範圍第2項所述之晶片卡固持裝置,其中所述卡裝設部包括一底壁及二相對平行設置之縱向側壁,該二縱向側壁之外側面上臨近開口之一端分別相對凹設形成一第一卡合槽;所述頂蓋包括一頂板及二沿該頂板之二相對縱向側緣延伸彎折而成之安裝壁,所述條形通孔縱向貫通開設頂板上;該二安裝壁上對應於所述第一卡合槽分別凸設有一第一卡塊,以將該頂蓋與基體固定裝設於一起。 The wafer card holding device of claim 2, wherein the card mounting portion comprises a bottom wall and two longitudinal side walls disposed opposite to each other, and one of the outer sides of the two longitudinal side walls is adjacent to the concave end Forming a first engaging groove; the top cover comprises a top plate and two mounting walls extending along opposite longitudinal side edges of the top plate, wherein the strip-shaped through holes extend longitudinally through the top plate; A first clamping block is respectively protruded from the mounting wall corresponding to the first engaging groove to fix the top cover and the base body together. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述卡裝設部還包括一連接該二縱向側壁之連接壁,該二縱向側壁之外側面上臨近連接壁一端分別相對凹設形成一第二卡合槽及一安裝槽;所述頂蓋之二安裝壁上對應於基體上之第二卡合槽及安裝槽分別凸設有一第二卡塊及一凸柱。 The wafer card holding device of claim 3, wherein the card mounting portion further comprises a connecting wall connecting the two longitudinal side walls, and the one end of the two longitudinal side walls adjacent to the connecting wall is oppositely recessed Forming a second engaging groove and a mounting groove; a second clamping block and a protruding post are respectively protruded from the second engaging groove and the mounting groove of the mounting wall of the top cover. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述頂板上鄰近條形通孔之兩側分別設有一朝向該二安裝壁彎折方向設置之彈性抵持部。 The wafer card holding device of claim 3, wherein the two sides of the top plate adjacent to the strip-shaped through holes are respectively provided with an elastic abutting portion disposed toward the bending direction of the two mounting walls. 如申請專利範圍第5項所述之晶片卡固持裝置,其中所述第一卡合槽呈矩形凹槽狀,其內向外凸設形成一卡塊,所述第二卡合槽與安裝槽相鄰設置,該安裝槽呈圓環狀。 The wafer card holding device of claim 5, wherein the first engaging groove has a rectangular groove shape, and a card block is protruded outwardly and outwardly, and the second engaging groove is opposite to the mounting groove. Adjacent setting, the mounting groove is annular. 如申請專利範圍第6項所述之晶片卡固持裝置,其中所述底壁上裝設有一卡連接器。 The wafer card holding device of claim 6, wherein the bottom wall is provided with a card connector. 如申請專利範圍第1項所述之晶片卡固持裝置,其中該主體之外表面上凸設有複數條形凸筋。 The wafer card holding device of claim 1, wherein the outer surface of the body is convexly provided with a plurality of strip-shaped ribs.
TW97138870A 2008-10-09 2008-10-09 Chip card holding structure TWI467859B (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM333688U (en) * 2007-12-12 2008-06-01 Chant Sincere Co Ltd Guiding device of card connector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM333688U (en) * 2007-12-12 2008-06-01 Chant Sincere Co Ltd Guiding device of card connector

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