TWI420760B - Chip card locking device - Google Patents

Chip card locking device Download PDF

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Publication number
TWI420760B
TWI420760B TW97134124A TW97134124A TWI420760B TW I420760 B TWI420760 B TW I420760B TW 97134124 A TW97134124 A TW 97134124A TW 97134124 A TW97134124 A TW 97134124A TW I420760 B TWI420760 B TW I420760B
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TW
Taiwan
Prior art keywords
card
wafer
strip
mounting
holding device
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Application number
TW97134124A
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Chinese (zh)
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TW201012005A (en
Inventor
Shi-Jin Long
Li Cheng
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Fih Hong Kong Ltd
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Priority to TW97134124A priority Critical patent/TWI420760B/en
Publication of TW201012005A publication Critical patent/TW201012005A/en
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Publication of TWI420760B publication Critical patent/TWI420760B/en

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Description

晶片卡固持裝置 Wafer card holding device

本發明涉及一種用於容置並固持晶片卡之固持裝置,特別涉及一種用於攜帶型電子裝置上之晶片卡固持裝置。 The present invention relates to a holding device for accommodating and holding a wafer card, and more particularly to a wafer card holding device for a portable electronic device.

隨著通訊事業之迅速發展,行動電話、個人數位助理(personal digital assistant,PDA)等各種攜帶型電子裝置之使用越來越普及。隨著該等攜帶型電子裝置產品之功能日益多元化,應用於該等攜帶型裝置上之用於存儲記憶之晶片卡亦越來越多,例如SD卡(Secure Digital Memory Card)、CF卡(Compact Flash Card)、SIM卡(Subscriber Identification Module Card,用戶識別卡)等。其中,SIM卡係一種裝有IC晶片之塑膠卡片,其具記錄個人用戶號碼及通訊錄等功能,藉由更換SIM卡,其可供多個用戶使用。 With the rapid development of the communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular. As the functions of these portable electronic device products become increasingly diversified, more and more wafer cards for storing memories are applied to such portable devices, such as an SD card (Secure Digital Memory Card) and a CF card ( Compact Flash Card), SIM card (Subscriber Identification Module Card), etc. Among them, the SIM card is a plastic card equipped with an IC chip, which has the functions of recording a personal user number and an address book, and can be used by a plurality of users by replacing the SIM card.

習知晶片卡一般容置於攜帶型電子裝置之一卡槽內。當該晶片卡容置於該卡槽內時,該晶片卡上之積體電路藉由一連接器與該攜帶型電子裝置之電路板連接。當需要更換該晶片卡時,使用者使用手指直接按住該晶片卡暴露之部分,並向該卡槽外拖動,藉由使用者手指與該晶片卡之間之摩擦力使該晶片卡隨使用者手指運動,直至晶片卡由該卡槽內滑出。 Conventional wafer cards are generally housed in a card slot of a portable electronic device. When the chip card is received in the card slot, the integrated circuit on the chip card is connected to the circuit board of the portable electronic device by a connector. When the wafer card needs to be replaced, the user directly presses the exposed portion of the wafer card with a finger and drags the card card outside, and the wafer card is driven by the friction between the user's finger and the wafer card. The user's finger moves until the wafer card slides out of the card slot.

然,於實際使用中,由於晶片卡暴露於卡槽外之部分一般較小,直接按壓外露部分操作較為困難;有些型號之晶片卡甚至全部容置於卡槽內。故,使用者難以藉由直接按壓該晶片卡之方式帶動該晶片卡由卡槽滑出。 However, in actual use, since the portion of the wafer card exposed to the card slot is generally small, it is difficult to directly press the exposed portion; some types of wafer cards are even accommodated in the card slot. Therefore, it is difficult for the user to drive the wafer card to slide out of the card slot by directly pressing the wafer card.

有鑒於以上缺陷,有必要提供一種易於更換晶片卡且可有效容置、固持晶片卡之晶片卡固持裝置。 In view of the above drawbacks, it is necessary to provide a wafer card holding device that can easily replace a wafer card and can effectively accommodate and hold the wafer card.

一種晶片卡固持裝置,其包括一基體及一設置於該基體上之用於滑動裝設一晶片卡之卡裝設空間,該卡裝設空間具一用以插入晶片卡之開口;所述晶片卡固持裝置還包括一釋放裝置,其沿與該晶片卡滑動方向相垂直之方向滑動地裝設於所述基體上且位於所述開口前方,用以將該晶片卡鎖持或解鎖於該卡裝設空間內。 A wafer card holding device includes a base body and a card mounting space disposed on the base body for slidingly mounting a wafer card, the card mounting space having an opening for inserting a wafer card; The card retaining device further includes a release device slidably mounted on the base body in a direction perpendicular to a sliding direction of the wafer card and located in front of the opening for locking or unlocking the wafer card to the card Installed space.

相較於習知技術,所述晶片卡固持裝置結構簡單,其藉由於基體之卡裝設空間前方設置一釋放裝置,輕易地實現了晶片卡之安裝及拆卸,同時使得晶片卡之安裝及更換過程變得更加簡單,容易操作。 Compared with the prior art, the wafer card holding device has a simple structure, and the wafer card is easily installed and disassembled by installing a releasing device in front of the card mounting space of the substrate, and the wafer card is installed and replaced at the same time. The process is much simpler and easier to operate.

100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder

10‧‧‧基體 10‧‧‧ base

12‧‧‧條形凹槽 12‧‧‧ strip groove

15‧‧‧凸柱 15‧‧‧Bump

17‧‧‧導向凸塊 17‧‧‧ Guided bumps

30‧‧‧電路板 30‧‧‧ boards

31‧‧‧卡連接器 31‧‧‧ card connector

33‧‧‧卡裝設空間 33‧‧‧Card installation space

40‧‧‧夾持部 40‧‧‧Clamping Department

50‧‧‧釋放裝置 50‧‧‧ release device

51‧‧‧安裝端 51‧‧‧Installation end

53‧‧‧控制端 53‧‧‧Control terminal

55‧‧‧連接部 55‧‧‧Connecting Department

57‧‧‧安裝盲孔 57‧‧‧Installation blind hole

70‧‧‧彈性件 70‧‧‧Flexible parts

90‧‧‧晶片卡 90‧‧‧wafer card

圖1為本發明晶片卡固持裝置較佳實施例之立體分解示意圖;圖2為從本發明晶片卡固持裝置內取出或裝入晶片卡時之立體示意圖;圖3為晶片卡裝設於本發明晶片卡固持裝置內之立體示意圖;圖4為晶片卡裝設於本發明晶片卡固持裝置內之一俯視示意圖。 1 is a perspective exploded view of a preferred embodiment of a wafer card holding device of the present invention; FIG. 2 is a perspective view of the wafer card holding device of the present invention when the wafer card is removed or loaded; FIG. 3 is a wafer card mounted in the present invention. 3 is a schematic perspective view of a wafer card holding device; FIG. 4 is a top plan view of the wafer card mounted in the wafer card holding device of the present invention.

本發明之較佳實施例公開一種晶片卡固持裝置,其適用於行動電話、個人數位助理(personal digital assistant,PDA)等攜帶型電子裝置。於本實施例中,以應用於一行動電話(圖未示)為例說明此晶片卡固持裝置。 A preferred embodiment of the present invention discloses a wafer card holding device suitable for use in a portable electronic device such as a mobile phone or a personal digital assistant (PDA). In the present embodiment, the wafer card holding device is described by taking a mobile phone (not shown) as an example.

請參閱圖1,所述晶片卡固持裝置100包括一基體10、一電路板30、二夾持部40、一釋放裝置50及一彈性件70。所述基體10大致呈矩形板狀,其可以為一行動電話之機殼。所述基體10上靠近其一側緣位置處向下凹設形成一大致矩形之條形凹槽12,並對應地形成一條形開口(圖未標),以用於裝設所述釋放裝置50。所述條形凹槽12之一端之橫向側壁上沿縱向方向凸設有一圓形凸柱15(參閱圖4),該條形凹槽12之另一端之一縱向側壁之臨近開口位置處相對另一縱向側壁延伸形成一大致矩形之導向凸塊17,該導向凸塊17與該另一縱向側壁間隔設置。 Referring to FIG. 1 , the wafer card holding device 100 includes a base 10 , a circuit board 30 , two clamping portions 40 , a release device 50 , and an elastic member 70 . The base body 10 has a substantially rectangular plate shape, which may be a casing of a mobile phone. The base body 10 is recessed downwardly adjacent to a side edge thereof to form a substantially rectangular strip-shaped recess 12, and correspondingly forms a strip-shaped opening (not labeled) for mounting the release device 50. . A circular protrusion 15 (see FIG. 4) is protruded from the lateral side wall of one end of the strip groove 12 in the longitudinal direction, and the adjacent side of the longitudinal side wall of the other end of the strip groove 12 is adjacent to the opening position. A longitudinal side wall extends to form a generally rectangular guide projection 17 spaced from the other longitudinal side wall.

所述電路板30大致呈矩形板狀,其裝設於所述基體10上臨近該基體10之條形凹槽12位置處。所述電路板30上臨近該條形凹槽12之一側裝設有一卡連接器31。 The circuit board 30 has a substantially rectangular plate shape and is disposed on the base body 10 adjacent to the strip-shaped recess 12 of the base body 10. A card connector 31 is mounted on one side of the circuit board 30 adjacent to the strip-shaped recess 12.

所述二夾持部40相對裝設所述電路板30上之卡連接器31之兩側,並與所述卡連接器31及電路板30共同圍成一卡裝設空間33,該卡裝設空間33具一用於插入晶片卡90之且朝向條形凹槽12之開口(圖未標),以便晶片卡90容置於該卡裝設空間33內。 The two clamping portions 40 are oppositely disposed on opposite sides of the card connector 31 on the circuit board 30, and together with the card connector 31 and the circuit board 30, a card mounting space 33 is defined. The space 33 has an opening (not shown) for inserting the wafer card 90 and facing the strip groove 12 so that the wafer card 90 is housed in the card mounting space 33.

所述釋放裝置50為一橫截面大致呈“Z”形之擋滑塊,其沿一與該晶片卡90滑動方向相垂直之方向滑動地裝設於所述基體10之條 形凹槽12內且位於所述開口前方位置處,用以將該晶片卡90卡鎖或解鎖於該卡裝設空間33內。所述釋放裝置50包括一安裝端51、一與該安裝端51相對設置之控制端53及一連接該安裝端51與控制端53之連接部55。所述安裝端51之一側面上凹設有一圓形安裝盲孔57。所述連接部55之長度尺寸與所述導向凸塊17之厚度尺寸相當,以使得該導滑塊50裝設於條形凹槽12內時,該連接部55被夾持於所述導向凸塊17與條形凹槽12之縱向側壁圍成之條形槽內,並可沿該條形槽滑移。 The release device 50 is a block slider having a substantially "Z" shape in cross section, and is slidably mounted on the base 10 in a direction perpendicular to the sliding direction of the wafer card 90. The groove 12 is located at a position in front of the opening for locking or unlocking the wafer card 90 in the card installation space 33. The release device 50 includes a mounting end 51, a control end 53 disposed opposite the mounting end 51, and a connecting portion 55 connecting the mounting end 51 and the control end 53. A circular mounting blind hole 57 is recessed on one side of the mounting end 51. The length of the connecting portion 55 is equivalent to the thickness of the guiding protrusion 17 so that when the guiding slider 50 is installed in the strip groove 12, the connecting portion 55 is clamped to the guiding convex portion. The block 17 is formed in a strip-shaped groove surrounded by the longitudinal side walls of the strip-shaped recess 12 and is slidable along the strip-shaped groove.

所述彈性件70為一圓柱形螺旋彈簧,其裝設於所述基體10之條形凹槽12內。該彈性件70之一端套設於所述條形凹槽12內之圓形凸柱15上,另一端裝設於所述釋放裝置50之安裝盲孔57內。 The elastic member 70 is a cylindrical coil spring that is mounted in the strip-shaped recess 12 of the base 10. One end of the elastic member 70 is sleeved on the circular protrusion 15 in the strip groove 12, and the other end is installed in the mounting blind hole 57 of the release device 50.

請一併參閱圖4,安裝所述晶片卡固持裝置100之釋放裝置50及彈性件70時,先將所述彈性件70之一端套設於基體10之條形凹槽12內之圓形凸柱15上,同時,將所述釋放裝置50之安裝端51之安裝盲孔57對準所述彈性件70之另一端,使該彈性件70之另一端裝設於該釋放裝置50之安裝盲孔57內。推動所述釋放裝置50壓縮該彈性件70將釋放裝置50從該條形凹槽12之靠近該圓形凸柱15之一端裝設於所述條形凹槽12內,所述釋放裝置50於彈性體70之彈力作用下抵持於所述條形凹槽12之遠離該圓形凸柱15一端之橫向側壁上。所述釋放裝置50之控制端53露出於所述條形凹槽12並卡抵於所述條形凹槽12之縱向側壁上。 Referring to FIG. 4 , when the release device 50 and the elastic member 70 of the wafer card holding device 100 are mounted, one end of the elastic member 70 is firstly sleeved in a circular convex shape in the strip groove 12 of the base body 10 . On the column 15, at the same time, the mounting blind hole 57 of the mounting end 51 of the release device 50 is aligned with the other end of the elastic member 70, so that the other end of the elastic member 70 is mounted on the release device 50. Inside the hole 57. Pushing the release device 50 to compress the elastic member 70 to mount the release device 50 from the strip-shaped recess 12 adjacent to one end of the circular post 15 in the strip-shaped recess 12, the release device 50 The elastic force of the elastic body 70 abuts against the lateral side wall of the strip-shaped recess 12 away from the end of the circular post 15 . The control end 53 of the release device 50 is exposed to the strip groove 12 and is abutted against the longitudinal side wall of the strip groove 12.

請一併參閱圖2及圖3,裝入所述晶片卡90時,首先,用手撥動所述釋放裝置50,使該釋放裝置50沿條形凹槽12朝向圓形凸柱15方 向滑移,直至該釋放裝置50滑移至所述夾持部40之外側;接下來,將所述晶片卡90滑入所述二夾持部40與卡連接器31圍成之卡裝設空間33內;最後,釋放所述釋放裝置50,該釋放裝置50於彈性件70之彈力作用下回覆至其初始位置處,並擋抵於所述晶片卡90之前方以防止晶片卡90脫出,即完成所述晶片卡90之安裝。當需要取出所述晶片卡90時,只需撥動所述釋放裝置50,使該釋放裝置50沿條形凹槽12朝向圓形凸柱15方向滑移,直至該釋放裝置50滑移至所述夾持部40之外側,即可輕易取出晶片卡90。 Referring to FIG. 2 and FIG. 3 together, when loading the wafer card 90, first, the release device 50 is manually turned, so that the release device 50 faces the circular protrusion 15 along the strip groove 12. Sliding until the release device 50 slides to the outside of the clamping portion 40; next, the wafer card 90 is slid into the card mounting portion of the two clamping portions 40 and the card connector 31 Finally, the release device 50 is released, and the release device 50 is returned to its original position by the elastic force of the elastic member 70, and is blocked against the wafer card 90 to prevent the wafer card 90 from coming out. That is, the installation of the wafer card 90 is completed. When it is necessary to take out the wafer card 90, the release device 50 only needs to be toggled, and the release device 50 is slid along the strip groove 12 toward the circular post 15 until the release device 50 slides to the position. The wafer card 90 can be easily taken out on the outside of the grip portion 40.

可以理解,所述彈性件70亦可以為一裝設於所述條形凹槽12內之彈性塑膠體或板簧等。 It can be understood that the elastic member 70 can also be an elastic plastic body or a leaf spring or the like installed in the strip-shaped recess 12.

本發明所述晶片卡固持裝置100結構簡單,其藉由於所述二夾持部40與卡連接器31圍成之卡裝設空間33前方設置一釋放裝置50,輕易地實現了晶片卡90之安裝及拆卸,同時使得晶片卡90之安裝及更換過程變得更加簡單,容易操作。 The wafer card holding device 100 of the present invention has a simple structure, and the wafer card 90 is easily realized by providing a releasing device 50 in front of the card mounting space 33 surrounded by the two clamping portions 40 and the card connector 31. Installation and disassembly, at the same time, make the process of installing and replacing the wafer card 90 easier and easier to operate.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.

100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder

10‧‧‧基體 10‧‧‧ base

12‧‧‧條形凹槽 12‧‧‧ strip groove

17‧‧‧導向凸塊 17‧‧‧ Guided bumps

30‧‧‧電路板 30‧‧‧ boards

31‧‧‧卡連接器 31‧‧‧ card connector

33‧‧‧卡裝設空間 33‧‧‧Card installation space

40‧‧‧夾持部 40‧‧‧Clamping Department

50‧‧‧釋放裝置 50‧‧‧ release device

51‧‧‧安裝端 51‧‧‧Installation end

53‧‧‧控制端 53‧‧‧Control terminal

55‧‧‧連接部 55‧‧‧Connecting Department

57‧‧‧安裝盲孔 57‧‧‧Installation blind hole

70‧‧‧彈性件 70‧‧‧Flexible parts

90‧‧‧晶片卡 90‧‧‧wafer card

Claims (6)

一種晶片卡固持裝置,其包括一基體及一設置於該基體上之用於滑動裝設一晶片卡之卡裝設空間,該卡裝設空間具一用以插入晶片卡之開口;其改良在於:所述晶片卡固持裝置還包括一釋放裝置及一用以給所述釋放裝置提供一彈力的彈性件,其沿與該晶片卡滑動方向相垂直之方向滑動地裝設於所述基體上且位於所述開口前方,所述基體上靠近其一側緣位置處向下凹設形成一條形凹槽,所述釋放裝置可滑動地裝設於所述基體之條形凹槽內且部分露出於該條形凹槽以將該晶片卡鎖持或解鎖於該卡裝設空間內;所述條形凹槽之偏離該卡裝設空間一側之橫向側壁上凸設有一凸柱,所述彈性件一端套設於該凸柱上。 A wafer card holding device includes a base body and a card mounting space disposed on the base body for slidingly mounting a wafer card, the card mounting space having an opening for inserting the chip card; The chip card holding device further includes a releasing device and an elastic member for providing an elastic force to the releasing device, and slidingly mounted on the base body in a direction perpendicular to a sliding direction of the wafer card and Located in front of the opening, the base body is recessed downwardly to form a strip-shaped recess near the side edge thereof, and the release device is slidably mounted in the strip groove of the base body and partially exposed to The strip-shaped recesses are configured to lock or unlock the wafer card in the card mounting space; a protruding post is protruded from a lateral side wall of the strip-shaped recess from a side of the card mounting space, the elasticity One end of the piece is sleeved on the protruding post. 如申請專利範圍第1項所述之晶片卡固持裝置,其中,所述釋放裝置為一橫截面呈“Z”形之擋滑塊。 The wafer card holding device according to claim 1, wherein the releasing device is a blocking slider having a "Z" shape in cross section. 如申請專利範圍第2項所述之晶片卡固持裝置,其中所述釋放裝置包括一安裝端及一控制端,該安裝端上凹設一安裝盲孔,所述控制端露出並卡抵於該條形凹槽之縱向側壁上;所述彈性件為一彈簧,其一端套設於所述凸柱上,另一端裝設於釋放裝置之安裝盲孔內。 The wafer card holding device of claim 2, wherein the releasing device comprises a mounting end and a control end, wherein the mounting end is recessed with a mounting blind hole, and the control end is exposed and clamped to the The elastic member is a spring, and one end of the elastic member is sleeved on the protruding post, and the other end is installed in the blind hole of the mounting device. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述條形凹槽之遠離凸柱一端之一縱向側壁之臨近開口位置處相對另一縱向側壁延伸形成一導向凸塊;所述釋放裝置還包括一連接該安裝端與控制端之連接部,該連接部被夾持於所述導向凸塊與條形凹槽 之縱向側壁圍成之條形槽內。 The wafer card holding device of claim 3, wherein the strip groove extends away from the longitudinal side wall of one of the longitudinal side walls of the one end of the stud to form a guiding protrusion with respect to the other longitudinal side wall; The release device further includes a connecting portion connecting the mounting end and the control end, the connecting portion being clamped to the guiding protrusion and the strip groove The longitudinal side walls enclose a strip-shaped groove. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述晶片卡固持裝置還包括一電路板、一卡連接器及二夾持部,所述電路板裝設於基體上臨近條形凹槽位置處;所述卡連接器裝設於該電路板上,所述二夾持部相對裝設電路板上並位於該卡連接器之兩側,該卡連接器與所述二夾持部圍成所述卡裝設空間。 The wafer card holding device of claim 3, wherein the chip card holding device further comprises a circuit board, a card connector and two clamping portions, wherein the circuit board is mounted on the base body adjacent to the strip shape. The card connector is mounted on the circuit board, the two clamping portions are opposite to the circuit board and are located on opposite sides of the card connector, and the card connector and the two clamping portions are The part encloses the card installation space. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述彈性件為一圓柱形螺旋彈簧或一彈性塑膠體或一板簧。 The wafer card holding device of claim 3, wherein the elastic member is a cylindrical coil spring or an elastic plastic body or a leaf spring.
TW97134124A 2008-09-05 2008-09-05 Chip card locking device TWI420760B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1290051C (en) * 2002-07-03 2006-12-13 山一电机株式会社 Card connector
CN1983834B (en) * 2005-12-16 2011-03-30 深圳富泰宏精密工业有限公司 Chip-card holding structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1290051C (en) * 2002-07-03 2006-12-13 山一电机株式会社 Card connector
CN1983834B (en) * 2005-12-16 2011-03-30 深圳富泰宏精密工业有限公司 Chip-card holding structure

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