200950229 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種晶片卡固定裝置，尤其涉及一種應用 於可攜式電子裝置之晶片卡固定裝置。 ’ 【先前技術】 ❹ _ 近年來，具有集成電路之表面晶片卡廣泛應用於電子 裝置中以提高或增加電子裝置之性能，如安裝於行動電話 中之用戶識別卡（subscriber identificati〇n则㈣加， 以下通稱SIM卡），其内儲存有操作行動電話之必要資訊， 而且記載有用戶個人資訊。藉由更換SIM卡，一隹、動 話可供多個用戶使用。 又 習知之㈣卡一般容置於行動電話之一卡槽内 置於該卡槽内時，該SIM卡上之集成電路藉由二 =器與該行動電話之電路板連接。同時，該卡部分 2於該卡槽外，如此，當需要更換該_卡時，使用者 者盘MW Γ 槽卜之部分，並藉由該使用 =該卡之間之摩擦力’而使該咖卡由該卡槽内滑 用者露於該卡槽外之部分—般較小，因此使 不易產生麾與/ _卡’如此’使用者與該顯卡之間 不易產生摩擦力，進而難以益 該卡槽滑出。而難_由該摩擦力帶動該sm卡由 【發明内容】[0002] The invention relates to a wafer card fixing device, and more particularly to a wafer card fixing device applied to a portable electronic device. [Prior Art] ❹ _ In recent years, surface chip cards with integrated circuits have been widely used in electronic devices to improve or increase the performance of electronic devices, such as subscriber identification cards installed in mobile phones (subscriber identificati〇n (4) plus , hereinafter referred to as SIM card), which stores the necessary information for operating a mobile phone, and records personal information of the user. By replacing the SIM card, a single voice can be used by multiple users. Moreover, the conventional (4) card is generally placed in a card slot of the mobile phone. When the card is placed in the card slot, the integrated circuit on the SIM card is connected to the circuit board of the mobile phone by a second device. At the same time, the card portion 2 is outside the card slot, such that when the card needs to be replaced, the user disk MW is part of the slot, and by the use = the friction between the cards ' The coffee card is generally smaller than the portion of the card slot that is exposed to the outside of the card slot, so that it is not easy to generate 麾 and / _ card 'so that the user and the card are less likely to generate friction, and thus it is difficult to benefit The card slot slides out. And it is difficult to drive the sm card by the friction force. [Summary of the Invention]
有馨於此，有必暴JiM 要&供一種可便於取出晶片卡之晶片 7 200950229 卡固定裝置。 一種晶片卡固定裝置’其包括一結合體及一殼體，兮 結合體設置於該殼體上，該結合體内開設一卡槽^於 該晶片卡於其内，該晶片卡固定裝置還包括一滑動體令該 滑動體可滑動地裝配於該殼體上，該滑動體包括—抵持部 及一觸發部，當該觸發部滑動時，該抵持部抵持該晶片^ 由該卡槽内滑出。 相較於習知技術，所述晶片卡固定裝置藉由該觸發部 之滑動而帶動該晶片卡由該卡槽滑出，這使得該晶片卡可 輕鬆地由該卡槽内滑出。 【實施方式】 本發明之較佳實施例公開一種晶片卡固定裝置，其適 用於行動電話等可攜式電子裝置。在本實施例中，以行= 電話為例說明此晶片卡固定裝置。 請參閱圖1及圖2,該晶片卡固定裝置1〇〇包括一殼 ❿體10、一結合體20、一滑動體30及一螺釘4〇。一晶片卡 5〇 (比如SIM卡、存儲卡）藉由該結合體2〇固定於該殼 體10上，且該晶片卡50藉由設置於該結合體2〇之連接器 22與一電路板（圖未示）實現電連接。 該殼體10為行動電話機殼之一部分，大體為長方體 形。該殼體10之下半部開設一容納電池之長方形容置腔 i2’容置腔12由四周壁14圍成。該殼體1〇之上半部開設 有一配合孔16。本實施例中，該配合孔16為一螺紋孔， 該配合孔16用於固定該滑動體3〇。 8 200950229 吞月一併參閱圖3，該社人辦* 础心〇 口體20為一端開口之方形腔 上^ 21、—下壁22、-第—側壁23、一第 =壁广第三側壁25。該下壁22為該結合體2〇二 :該=1〇之壁面，該上壁21與該下壁心對設置。該 第一側壁23、該第二側壁24 雙24及該第二側壁25均設置於該 上壁21與該下壁22之間， 巧又置於这 Π且該第一側壁23與該第二側壁 24相對設置，該第三側壁 ^ 埜25之兩端分別於該第一侧壁23There is a sensation here, there must be a violent JiM to & a wafer for easy removal of the wafer card 7 200950229 card fixture. A wafer card fixing device includes a combination body and a casing. The yoke combination body is disposed on the casing. The conjugate body defines a card slot for the wafer to be chucked therein. The wafer card fixing device further includes a sliding body is slidably mounted on the housing, the sliding body includes a resisting portion and a triggering portion, and the resisting portion abuts the wafer when the triggering portion slides Slide out inside. Compared with the prior art, the wafer card fixing device drives the wafer card to slide out of the card slot by sliding the triggering portion, so that the wafer card can be easily slipped out of the card slot. [Embodiment] A preferred embodiment of the present invention discloses a wafer card fixing device suitable for a portable electronic device such as a mobile phone. In this embodiment, the wafer card fixing device will be described by taking a row=phone as an example. Referring to FIG. 1 and FIG. 2, the wafer card fixing device 1 includes a shell body 10, a combined body 20, a sliding body 30 and a screw 4. A chip card 5 (such as a SIM card, a memory card) is fixed to the casing 10 by the combination body 2, and the chip card 50 is connected to the circuit board by the connector 22 and the circuit board (not shown) to achieve electrical connection. The housing 10 is part of a mobile phone housing and is generally rectangular parallelepiped. The lower half of the casing 10 defines a rectangular receiving cavity for accommodating the battery. The accommodating cavity 12 is surrounded by the surrounding wall 14. A fitting hole 16 is defined in the upper half of the casing 1 . In this embodiment, the matching hole 16 is a threaded hole, and the matching hole 16 is used for fixing the sliding body 3〇. 8 200950229 Swallowing the moon together with reference to Figure 3, the community office * The base mouthpiece 20 is a square cavity open at one end ^ 21, - the lower wall 22, - the first side wall 23, a third wall 25. The lower wall 22 is the combined body 2: the wall surface of the 1〇, and the upper wall 21 is disposed opposite to the lower wall. The first side wall 23, the second side wall 24 double 24 and the second side wall 25 are disposed between the upper wall 21 and the lower wall 22, and are placed again and the first side wall 23 and the second side The side walls 24 are oppositely disposed, and the two ends of the third side wall 25 are respectively opposite to the first side wall 23
及該第二側壁24連接。 該上壁21、該下壁22、該第一側壁23、該第二侧壁 24及該第二侧壁25圍成一卡冑％，同時於該第三侧壁μ 相對之-端形成-開π 27。該卡槽26用來容納該晶片卡 5〇’且該晶片卡50藉由該開口 27進入該卡槽％。 該下壁22於鄰近該第三側壁25之—端開設—方形通 孔222，該通孔222之作用為：當該晶片卡％容納於該卡 槽26内時，該滑動體3〇由該通孔222伸進該卡槽％與該 晶片卡50抵持（如圖4所示）。 ” 該滑動體30大體為長方形板狀，其包括一平板部％， 該平板部32之兩端分別彎折形成一抵持部％及一觸發部 36。該抵持部34用來與該晶片卡刈抵持，本實施例中， 該抵持部34為由該平板部32之一端彎折形成之折片。該 觸發部36用來觸發該滑動體3〇由該卡槽26内滑出，本實 施例中，該觸發部36為由該平板部32之另一端彎折之拉 鉤。該滑動體30於該平板部32靠近該抵持部34之—端開 没一橢圓形之缺口 38,該缺口 38對應於該配合孔16開設。 9 200950229 該螺釘40包括一螺帽42及一由該螺帽42延伸之螺柱 該螺柱44截面尺寸小於該缺口 38之截面尺寸。螺釘 ,40用^使該滑動體3〇可滑動地裝配於該殼體⑽上。 明一併參閱圖5及圖6，裝配該晶片卡固定裝置1〇〇 先將該滑動體30放置於該殼體1〇上，且使該缺口 38 =該配口孔16對準’然後將該螺柱44先穿過該缺口如 1累σ於該配合孔16内’此時’由於該螺柱44截面 ❹38之截面尺寸，因此該螺柱44與該平板 30於私吉*肖上有空隙，同時使該螺帽42與該滑動體 於丑直方向上保有空隙’從而將該滑動 裝配於該殼體1〇上；然後，將該結合體 接或熱炼）於殼體^，此時，^^ μ楼（比如螺 由該通孔222伸入”样=該滑動體3〇之抵持部μ 持裝置之裝配，内，從而完成該晶片卡5。固 安裝該晶片卡50時，該晶片卡％之—端藉由 ❹27進人該卡槽26，且使該晶片卡％進人該卡槽％二 ”該抵持部34抵持，即完成該晶片卡50之安裳。需 出該晶片卡5〇時，該觸發部36沿拉出該卡槽26之 動’從而帶動該抵持部34由該卡槽26内滑出，而該抵= 部34與該晶片卡5〇抵持，進而該抵持部 :片^ 50由該卡槽26内滑出。 ，職曰曰片卡 所述Βθ片卡固定裝置藉由該觸發部％之 該晶1卡50由該卡槽26 _，較㈣w ^ 由該卡槽26内滑出。 权鬆地 200950229 可以理解，該滑動體30可不設置於該殼體1〇上，而 可滑動地設置於該結合體20之下壁22上。 * 綜上所述，本發明符合發明專利要件，爰依法提出專 .利申請。惟，以上所述者僅為本發明之較佳實施例，本發 明之範圍並不以上述實施例為限，舉凡熟悉本案技藝之又 士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於 以下申請專利範圍内。 〜 ' 【圖式簡單說明】 ❿—圖1係本發明較佳實施例之晶片卡固定裝置之立體分 圖2係圖1所示晶片卡固定奘罟 ^ x A 门下U疋展置之另一視角之局部立 體分解示意圖； 圖3係圖2所示晶片卡固定裝置之結合體之放大圖； 圖4係圖2所不晶片卡固定裝罟夕纟士人μ 曰y Α 卜U疋褒置之結合體、滑動體及 日日片卡結合為一體之立體示意圖； 圖5係圖1所示晶片卡固定裝置之組裝圖； 圖6係圖5所示晶片卡固定 r ± Φ . L 卜口疋裝置之局部剖視圖。 【主要7G件符號說明】 晶片卡固定裝置 100 殼體 10 容置腔 12 周壁 14 配合孔 16 結合體 20 卡槽 26 開口 27 滑動體 30 平板部 32 抵持部 34 觸發部 36 11 200950229 上壁 21 缺口 38 下壁 22 螺釘 40 . 通孔 222 螺帽 42 .第一侧壁 23 螺柱 44 第二側壁 24 晶片卡 50 第三側壁 25 β ❿ 12And the second side wall 24 is connected. The upper wall 21, the lower wall 22, the first side wall 23, the second side wall 24 and the second side wall 25 enclose a click %, and at the same time the third side wall μ is formed at the opposite end - Open π 27. The card slot 26 is for receiving the wafer card 5'' and the wafer card 50 enters the card slot % through the opening 27. The lower wall 22 defines a square through hole 222 adjacent to the end of the third side wall 25. The through hole 222 functions to: when the wafer card is received in the card slot 26, the sliding body 3 The through hole 222 extends into the card slot % to resist the wafer card 50 (as shown in FIG. 4). The sliding body 30 is substantially in the shape of a rectangular plate, and includes a flat portion. The two ends of the flat portion 32 are respectively bent to form a resisting portion % and a trigger portion 36. The resisting portion 34 is used for the wafer. In the embodiment, the abutting portion 34 is a flap formed by bending one end of the flat plate portion 32. The triggering portion 36 is configured to trigger the sliding body 3 to slide out of the slot 26 In this embodiment, the triggering portion 36 is a hook that is bent by the other end of the flat portion 32. The sliding body 30 has an elliptical notch 38 at the end of the flat portion 32 near the resisting portion 34. The notch 38 is opened corresponding to the fitting hole 16. 9 200950229 The screw 40 includes a nut 42 and a stud extending from the nut 42. The stud 44 has a cross-sectional dimension smaller than that of the notch 38. Screw, 40 The sliding body 3 is slidably mounted on the casing (10). Referring to FIG. 5 and FIG. 6, the wafer card fixing device 1 is assembled, and the sliding body 30 is first placed on the casing 1. 〇, and the notch 38 = the fitting hole 16 is aligned ' then the stud 44 is first passed through the notch, such as 1 16 is 'at this time' because of the cross-sectional dimension of the stud portion 44 of the stud 44, the stud 44 and the flat plate 30 have a gap in the private frame, and the nut 42 and the sliding body are retained in the ugly direction. a gap 'to thereby fit the sliding member to the casing 1; then, the combined body is joined or thermally smelted to the casing ^, at this time, the ^^ μ floor (such as the screw protrudes from the through hole 222) = the assembly of the sliding body 3 is held inside, thereby completing the wafer card 5. When the wafer card 50 is fixedly mounted, the chip card is inserted into the card slot 26 by the ❹ 27 And the wafer card is inserted into the card slot %2" the resisting portion 34 is resisted, that is, the card card 50 is completed. When the chip card 5 is required, the trigger portion 36 pulls the card along the card. The movement of the groove 26 causes the abutting portion 34 to slide out of the card slot 26, and the abutting portion 34 abuts against the wafer card 5, and the abutting portion: the plate 50 is replaced by the card slot 26. The slide card is slid out. The Β θ card card fixing device is rotated by the card slot 26 by the trigger slot % by the card slot 26 _, which is slipped out of the card slot 26 by (4) w ^. 200950229 It can be understood that the sliding body 30 can be disposed not on the casing 1 but slidably disposed on the lower wall 22 of the combined body 20. * In summary, the present invention complies with the patent requirements of the invention, and is proposed according to law. The application of the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art are skilled in the art according to the spirit of the present invention. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> FIG. 3 is an enlarged view of a combination of the wafer card fixing device shown in FIG. 2; FIG. 4 is a fixed view of the combination of the wafer card fixing device shown in FIG. FIG. 5 is an assembled view of the wafer card fixing device shown in FIG. 1; FIG. 6 is a schematic view of the combination of the combination of the 罟 纟 纟 μ Α Α Α 疋褒 疋褒 疋褒 ; ; ; ; ; ; ; ; ; ; ; ; ; ; The wafer card shown in Figure 5 is fixed r ± Φ . L 卜Cloth partial cross-sectional view of the apparatus. [Description of main 7G parts] wafer card fixing device 100 housing 10 accommodating cavity 12 peripheral wall 14 fitting hole 16 coupling body 20 card slot 26 opening 27 sliding body 30 flat plate portion 32 abutting portion 34 trigger portion 36 11 200950229 upper wall 21 Notch 38 Lower wall 22 Screw 40. Through hole 222 Nut 42. First side wall 23 Stud 44 Second side wall 24 Wafer card 50 Third side wall 25 β ❿ 12