TW201006354A - Chip card latching device - Google Patents

Chip card latching device Download PDF

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Publication number
TW201006354A
TW201006354A TW97128396A TW97128396A TW201006354A TW 201006354 A TW201006354 A TW 201006354A TW 97128396 A TW97128396 A TW 97128396A TW 97128396 A TW97128396 A TW 97128396A TW 201006354 A TW201006354 A TW 201006354A
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TW
Taiwan
Prior art keywords
wafer card
holding device
placing table
wafer
card
Prior art date
Application number
TW97128396A
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Chinese (zh)
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TWI365033B (en
Inventor
Zhong-Shu Qin
Hsiao-Hua Tu
Wen-Wei Song
Jun Wang
Ye Liu
Xu-Ri Zhang
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Fih Hong Kong Ltd
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Priority to TW97128396A priority Critical patent/TWI365033B/en
Publication of TW201006354A publication Critical patent/TW201006354A/en
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Publication of TWI365033B publication Critical patent/TWI365033B/en

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A wafer card securing device is provided. The wafer card securing device includes a housing and a placed plat mounted on the housing for securing a wafer thereon. The wafer card securing device further includes a ejecting mechanism mounted on the housing and a chamber defined in the housing. The ejecting mechanism and the chamber respectively placed two opposite sides of the placed plat. The chamber is used for accommodating a battery therein. The ejecting mechanism provide a elastic force for ejecting the wafer card from the placed plat.

Description

201006354 九、發明說明: 【發明所屬之技術領域】 本發明涉及一種晶片卡卡持裝置,尤其涉及一種應用 於可攜式電子裝置之晶片卡卡持裝置。 【先前技術】 近年來,具有集成電路之表面晶片卡廣泛應用於電子 裝置中以提高或增加電子裝置之性能,如安裝於行動電話 ❿中之用戶識別卡(subscriber identification m〇dule 咖, 以下通稱SIM卡),其内儲存有操作行動電話之必要資訊, 而且記載有用戶個人資訊。藉由更換SIM卡,一隻行動 話可供多個用戶使用。 _ 習知之SIM卡一般容置於行動電話之一卡槽内。杳該 SIM卡容置於該卡槽内時’該咖卡上之集成電路藉 連接器與該行動電話之電路板連接。同時,該sim卡部分 暴露於該卡槽外,如此,當需要更換該㈣卡時,使用者 ©手指直接按壓該SIM卡暴露於該卡槽外之部分,並藉由使 用者手指與該㈣+之間之摩擦力,而使該隨卡由該卡 槽内滑出。 由於圓卡暴露於該卡槽外之部分一般較小,因此使 2者難以按壓該㈣卡,如此,使用者手指與該卡之 不易產生摩擦力,進而難以藉由該摩擦力帶動該“Μ卡 由該卡槽滑出。 【發明内容】 有鑒於此,有必要接供一德# 权供種便於取出晶片卡之晶片卡 201006354 卡持裝置。 -種晶片卡卡持裝置,其包括一放置台及一殼體,該 放置台設置於該殼體上,該放置台用以卡合一晶片卡於其 上,該晶片卡卡持裝置還包括一裝配於該殼體上之彈出機 Τ及-形成於該殼體上之容置腔,該彈出機構及該容置腔 分別位於該放置台相對之兩側,該容置腔用以容納一電池 於其内,該彈出機構用以提供一將該晶片卡由抵持於該電 池之一端彈出之彈性力。 相較于習知技術,所述晶片卡卡持裝置在取出電池 時,彈出機構抵持晶片卡由該置台上滑出 可輕鬆地由放置台上滑出。 于片卡 【實施方式】 本發明之較佳實施例公開一種晶片卡卡持裝置,苴適 =於行動電話等可攜式電子裝置。在本實施财,以㈣ 電話為例說明此晶片卡卡持裝置。 —々請參閱圖1,該晶片卡卡持裝置1〇〇包括一殼體1〇、 二:納於該殼體10内之電池2〇及一設置於該殼體1〇上之 2機構30。請參閱圖5’ 一晶片卡4〇(比如sm卡、存 =卡)經由該電池20與該彈出機構3G之卡合而固定於該 设體10上。 請參_ ί,該殼體1G為行動電話機殼之—部分,大 為長方體形。該殼體10之下半部開設一長方形容置腔 於1該容置腔12由㈣122圍成,其用來容納該電池20 内。請一併參閱圖2,該殼體1〇之上半部設置一放置 201006354 台14,該放置台14之一側與該周壁122鄰接,另一側與 該彈出機構30鄰接(參圖4 )。該放置台14用於放置該晶 片卡40。該放置台14之二相對侧緣分別垂直向上延伸有 一側壁142,每一該側壁142向放置台14内延伸有大致與 該放置台14平行之一卡鉤144。請參閱圖4,所述側壁142 及卡鉤144分別用於限定該晶片卡40之Y、Z方向上之自 由度。 請一併參閱圖3,該彈出機構30包括一滑動體32、一 ® 固定座34及一彈性體36。該滑動體32包括一弓形主體322 及一由該主體322向該固定座34方向延伸之導柱324。該 主體322之中部凸設有複數定位部3222,所述定位部3222 用以與該固定座34配合。 請一併參閱圖4,該固定座34固定(比如,熱熔)於 該殼體10上,其由朝向該滑動體32之一端向遠離該滑動 體32之一端依次開設一滑槽342及一與該滑槽342導通之 @ 盲孔344,從而於該固定座34上形成二相對之滑槽壁 3422。該滑槽342與該主體322對應設置,該主體322可 滑動地容置於該滑槽342内,該盲孔344用於容納該彈性 體36。該固定座34於所述滑槽壁3422上對應於所述定位 部3222開設複數定位槽3424,所述定位部3222可滑動地 容置於所述定位槽3424内。 請參閱圖3,該彈性體36抵持於該滑動體32與該固 定座34之間,其提供該滑動體32遠離該固定座34之力。 本實施例中,該彈性體36為一柱狀壓簧,其一端套設於該 201006354 導柱324上,另一端容納于該盲孔344内。 請參閱圖4,組裝該晶片卡卡持裝置1〇〇時,首先將 該彈性體36之一端伸進該盲孔344内;使該滑動體32之 導柱324與該彈性體36之另一端對準,然後以朝向該固定 座34之方向壓該滑動體32而使該滑動體32滑入該滑槽 342内及該定位部3222滑入該定位槽3424内,此時,該 彈性體36處於壓縮狀態而積蓄彈力;接著,將該固定座 ❺34固定於該殼體1〇上,且此時該滑動體%與該放置台μ 抵持,如此,可藉由該放置台14之抵持而阻止該滑^體 32於該彈性體36彈力之作用下而由該滑槽342内滑出, 即完成該晶片卡卡持裝置之組裝。 二安裝該晶片卡4〇時,首先將該晶片卡40置於該放置 台^上,再按如圖4箭頭χ所示之方向將該晶片卡扣之 一端插入所述卡鉤144内,然後將該電池2〇裝入該容置腔 12内,此時,該電池20壓迫該晶片卡4〇之另一端而使該 ❹晶片卡4〇繼續按如圖4箭頭X所示方向運動,該晶片卡 4〇運動過程中,將驅動該滑動體%運動而繼續壓=該彈 性,36,直到該晶片卡4〇位於如圖5所示位置,此時, 該βθ片卡40於X方向抵持於該電池2〇與該滑動體%之 門曰而γ、z方向由所述側壁142及卡鉤限制,因此 該晶片卡40穩固地安裝於該殼體1〇上。 需取出該晶片卡40時,將該電池2〇由該容置腔12 内取出,即解除該電池2〇與該晶片卡4〇之間之抵持,如 此,该彈性體36被釋放而驅使該滑動體32沿箭頭X之反 201006354 Ο ❹ 方向運動’進而將該晶片卡4〇彈出。 所述晶片卡卡持裝置1〇〇當該取出電池2〇時,該彈出 機構30抵持該晶片卡4〇由該放置台14上滑出這使得該 晶片卡40可輕鬆地由該放置台14上滑出。 / 綜上所述,本發明符合發明專利要件,爰依法提出專 利申請。$,以上所述者僅為本發明之較佳實施例,本發 明之範圍並不以上述實施例為限’舉凡熟悉本案技藝之乂 士援依本發明之精神所作之等效修飾或變化,皆應涵 以下申請專利範圍内。 ; 【圖式簡單說明】 圖1係本發明較佳實施例之晶片卡卡持裝置之立 解示意圖; 篮刀 圖2係圖1所示晶片卡卡持裝置之另—視 體分解示意圖; 立 圖3係圖1所示晶片卡卡持裝置之彈出機構之剖視 圖4係圖2所示晶片卡卡持裝置之彈出機構、丰 及殼體組合於一起之示意圖; 日曰月卡 圖5係圖2所示晶片卡卡持裝置之組裝圖。 【主要元件符號說明】 晶片卡卡持裝置100 殼體 容置腔 周壁 放置台 10 12 122 14 滑動體 主體 定位部 導柱 固定座 32 322 3222 324 34 11 201006354 側壁 142 滑槽 342 卡鉤 144 定位槽 3424 電池 20 彈性體 36 彈出機構 30 晶片卡 40 ❹ ❿ 12BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer card holding device, and more particularly to a wafer card holding device applied to a portable electronic device. [Prior Art] In recent years, surface wafer cards having integrated circuits have been widely used in electronic devices to enhance or increase the performance of electronic devices, such as subscriber identification cards installed in mobile phones (hereinafter referred to as subscriber identification m〇dule coffee, commonly known below). SIM card), which stores the necessary information for operating the mobile phone, and records the user's personal information. By replacing the SIM card, one action can be used by multiple users. _ The SIM card of the traditional knowledge is generally placed in one of the slots of the mobile phone. When the SIM card is placed in the card slot, the integrated circuit on the card is connected to the circuit board of the mobile phone. At the same time, the sim card portion is exposed outside the card slot. Thus, when the (four) card needs to be replaced, the user © finger directly presses the portion of the SIM card exposed to the card slot, and the user's finger and the (4) The friction between the +, so that the card is slipped out of the card slot. Since the portion of the round card exposed to the card slot is generally small, it is difficult for the two to press the (four) card, so that the user's finger and the card are less likely to generate friction, and thus it is difficult to drive the "Μ" by the friction force. The card slides out of the card slot. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a wafer card 201006354 holding device for facilitating the removal of a wafer card. A wafer card holding device includes a placement And a housing, the placing table is disposed on the housing, the placing table is configured to engage a wafer card thereon, and the wafer card holding device further comprises an ejecting device mounted on the housing a accommodating cavity formed on the housing, the ejector mechanism and the accommodating cavity are respectively located on opposite sides of the placing table, the accommodating cavity is for accommodating a battery therein, and the ejector mechanism is configured to provide a The wafer card is elastically biased by being held against one end of the battery. Compared with the prior art, when the wafer card holding device removes the battery, the eject mechanism resists the wafer card and slides out from the table. The ground slides out of the placement table. [Embodiment] A preferred embodiment of the present invention discloses a chip card holding device, such as a portable electronic device such as a mobile phone. In the present embodiment, the wafer card holding device is described by taking a (4) telephone as an example. - Referring to FIG. 1, the wafer card holding device 1 includes a casing 1 and 2, a battery 2 纳 in the casing 10, and a mechanism 30 disposed on the casing 1 Referring to FIG. 5', a wafer card 4 (such as an sm card, a card = card) is fixed to the device 10 via the battery 20 and the eject mechanism 3G. Please refer to _ ί, the housing 1G The portion of the casing of the mobile phone has a large rectangular shape. The lower half of the casing 10 defines a rectangular receiving cavity. The receiving cavity 12 is surrounded by a (four) 122 for accommodating the battery 20. Referring to FIG. 2, a top portion of the housing 1 is provided with a 201006354 stage 14, one side of which is adjacent to the peripheral wall 122, and the other side is adjacent to the eject mechanism 30 (see FIG. 4). The placing table 14 is configured to place the wafer card 40. The two opposite side edges of the placing table 14 respectively extend vertically upwards with a side wall 142. A side wall 142 extends into the placement table 14 with a hook 144 substantially parallel to the placement table 14. Referring to Figure 4, the side wall 142 and the hook 144 are respectively used to define the Y and Z directions of the wafer card 40. The degree of freedom of the upper part. Referring to FIG. 3 together, the ejecting mechanism 30 includes a sliding body 32, a mounting bracket 34 and an elastic body 36. The sliding body 32 includes an arcuate body 322 and a body 322 a guiding post 324 extending in the direction of the fixing base 34. A plurality of positioning portions 3222 are protruded from the middle portion of the main body 322, and the positioning portion 3222 is configured to cooperate with the fixing base 34. Referring to FIG. 4 together, the fixing base 34 is fixed ( For example, a heat sink is formed on the housing 10, and a sliding slot 342 and a @ blind hole 344 connected to the sliding slot 342 are opened from one end of the sliding body 32 toward the end of the sliding body 32, thereby Two opposing chute walls 3422 are formed on the fixing base 34. The sliding slot 342 is disposed corresponding to the main body 322. The main body 322 is slidably received in the sliding slot 342 for receiving the elastic body 36. The fixing portion 34 defines a plurality of positioning grooves 3424 corresponding to the positioning portion 3222 on the sliding groove wall 3422, and the positioning portion 3222 is slidably received in the positioning groove 3424. Referring to FIG. 3, the elastic body 36 is abutted between the sliding body 32 and the fixing seat 34, which provides the force of the sliding body 32 away from the fixing base 34. In this embodiment, the elastic body 36 is a columnar compression spring, and one end of the elastic body 36 is sleeved on the 201006354 guide post 324, and the other end is received in the blind hole 344. Referring to FIG. 4, when the wafer card holding device 1 is assembled, one end of the elastic body 36 is firstly inserted into the blind hole 344; the other end of the guide post 324 of the sliding body 32 and the elastic body 36 is Aligning, then sliding the sliding body 32 in the direction of the fixing seat 34 to slide the sliding body 32 into the sliding slot 342 and the positioning portion 3222 sliding into the positioning groove 3424. At this time, the elastic body 36 The elastic state is accumulated in a compressed state; then, the fixing seat 34 is fixed to the casing 1 , and at this time, the sliding body % is abutted against the placing table μ, so that the placing table 14 can be resisted by the placing table 14 The sliding body 32 is prevented from sliding out of the sliding slot 342 by the elastic force of the elastic body 36, thereby completing the assembly of the wafer card holding device. When the chip card 4 is mounted, the wafer card 40 is first placed on the placement table, and one end of the wafer clip is inserted into the hook 144 in the direction indicated by the arrow 如图 in FIG. Inserting the battery 2 into the accommodating cavity 12, at this time, the battery 20 presses the other end of the wafer card 4 to cause the ❹ wafer card 4 to continue to move in the direction indicated by the arrow X in FIG. During the movement of the wafer card 4, the sliding body % motion is driven to continue the pressing = the elasticity, 36 until the wafer card 4 is at the position shown in FIG. 5, at which time the βθ card 40 is in the X direction. The gamma and z directions are restricted by the side wall 142 and the hook by the threshold of the battery 2 and the sliding body %, so that the wafer card 40 is firmly attached to the casing 1 . When the wafer card 40 needs to be taken out, the battery 2 is removed from the accommodating cavity 12, that is, the resistance between the battery 2 and the wafer card 4 is released, so that the elastic body 36 is released and driven. The slider 32 is moved in the direction of the arrow X090063 Ο 箭头 of the arrow X to eject the wafer card 4 。. The wafer card holding device 1 is configured to slide the wafer card 4 against the wafer card 4 when the battery is removed, so that the wafer card 40 can be easily placed by the placing table Slide out on the 14th. / In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and equivalent modifications or variations made by the gentleman skilled in the art of the present invention in accordance with the spirit of the present invention are All should be within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a wafer card holding device according to a preferred embodiment of the present invention; FIG. 2 is a schematic view of another embodiment of the wafer card holding device shown in FIG. 1; 3 is a cross-sectional view of the eject mechanism of the wafer card holding device shown in FIG. 1 , which is a schematic diagram of the eject mechanism, the abundance and the housing of the wafer card holding device shown in FIG. 2; 2 shows the assembly diagram of the wafer card holding device. [Description of main component symbols] Wafer card holding device 100 Housing accommodating cavity peripheral wall placing table 10 12 122 14 Sliding body main body positioning portion Guide post fixing seat 32 322 3222 324 34 11 201006354 Side wall 142 Chute 342 Hook 144 Positioning groove 3424 Battery 20 Elastomer 36 Eject mechanism 30 Chip card 40 ❹ ❿ 12

Claims (1)

201006354 、申清專利範園 卡卡持裝置,其包括一放置台及一殼 放置台設置於該殼體上,該放置台用以卡合一: 於其上,其改良在於··該晶片卡卡㈣置還包括1 配於該殼體上之彈出機構及—形成於該殼體上之容置 腔’該彈出機構及該容置腔分別位於該放置台相對之 ❹ 2. 3.201006354, Shenqing Patent Fanyuan card holding device, comprising a placing table and a shell placing table disposed on the casing, the placing table is used for engaging: on the above, the improvement is that the wafer card The card (4) further includes an ejecting mechanism disposed on the housing and a receiving cavity formed on the housing. The ejecting mechanism and the receiving cavity are respectively located opposite to the placing table. 兩側’該容置腔用以容納—電池於其内,該彈出機構 用以提供-將該晶片卡由婦於該電池之 彈性力。 汁®义 如申π專利範圍第!項所述之晶片卡卡持裝置,其中 所述之該電池容納于該容置腔内時,該晶片卡受該彈 出機構與該電池之抵持而穩固於該放置台上。 如申睛專利範圍第1項所述之晶片卡卡持裝置,其中 所述之放置台之二相對側緣分別延伸—侧壁,每一今 側壁向該放置台内延伸—卡鉤,該晶片卡藉由所述; 鉤卡合於該放置台上。 4.如申請專利範圍第1項所述之晶片卡卡持裝置,其中 所述之彈出機構包括一裝配於該殼體上之固定座、一 可滑動地容置於該固^座之滑動體及—抵持於該滑動 體與該固定座之間之彈性體,該滑動體用以抵持該晶 片卡該彈性體用以提供該晶片卡由該放置台上滑出 之力。 如申請專利範圍第4項所述之晶片卡卡持裝置,其中 13 201006354 所述之滑動體包括— 6. 7. 設___,體,該固定座對應於該主體開 曰^體可滑動地容置於該滑槽内。 ::請:利範圍第5項所述之晶片卡卡持裝置,其中 、之'月動體還包括由該主體延伸之-導柱,誃固定 座還開設-與該滑槽導通之盲孔,該彈 於該導柱上,另1容置於該盲孔内。 、套- 如申請專利範圍第5項所述之晶片卡卡持裝置,其中 所述之主體之中部凸設有複數定位部,該固^座對應 於所述定位部開設複數定位槽,所述定位部可滑動地 容置於所述定位槽内。 如申凊專利範圍第5項所述之晶片卡卡持裝置,其中 所述之主體呈一弓形。 〃 8.The accommodating chambers on both sides are for accommodating a battery therein, and the ejecting mechanism is for providing - the wafer card to be elasticized by the battery. Juice® Yi, such as Shen π patent range! The wafer card holding device of the present invention, wherein when the battery is housed in the accommodating cavity, the wafer card is stabilized on the placing table by the ejecting mechanism and the battery. The wafer card holding device of claim 1, wherein the opposite side edges of the placing table respectively extend from the side wall, and each of the present side walls extends into the placing table - the hook The card is engaged by the hook; the hook is engaged with the placing table. 4. The wafer card holding device of claim 1, wherein the ejecting mechanism comprises a fixing seat mounted on the housing, and a sliding body slidably received in the fixing base. And an elastic body that is resisted between the sliding body and the fixing seat, the sliding body is for resisting the wafer card to the elastic body for providing a force for the wafer card to slide out of the placing table. The wafer card holding device of claim 4, wherein the sliding body described in 13 201006354 comprises - 6. 7. ___, the body, the fixing seat corresponding to the main body sliding body slidably It is placed in the chute. The wafer card holding device of item 5, wherein the 'monthly moving body further includes a guide post extending from the main body, and the crucible fixing seat is further opened - a blind hole that is electrically connected to the chute The bullet is on the guide post and the other one is placed in the blind hole. The wafer card holding device of claim 5, wherein the middle portion of the main body is convexly provided with a plurality of positioning portions, and the fixing portion defines a plurality of positioning grooves corresponding to the positioning portion, The positioning portion is slidably received in the positioning groove. The wafer card holding device of claim 5, wherein the body has an arcuate shape. 〃 8.
TW97128396A 2008-07-25 2008-07-25 Chip card latching device TWI365033B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113382591A (en) * 2021-06-07 2021-09-10 深圳市资福医疗技术有限公司 PCB fixing structure, capsule endoscope and capsule endoscope assembling method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113382591A (en) * 2021-06-07 2021-09-10 深圳市资福医疗技术有限公司 PCB fixing structure, capsule endoscope and capsule endoscope assembling method

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