1362208 九、發明說明： 【發明所屬之技術領域】 • 本發明係關於一種晶片卡固持結構。 . 【先前技術】 目前，可用於存儲記憶之晶片卡種類繁多，如CF (C0mpact Flash)' SD (Secure Digital)、SIM (Subscriber Identification Module card)等，這些 晶片卡被廣泛使用於各類電子裝置中。隨著通訊事業之迅速發展，行動g 話已成爲愈來愈多消費者曰常工作及生活不可缺少之工具。行動電話之^ ‘片卡，如用戶識別卡（SIM卡）’其係一種裝有IC晶片之塑膠卡片，其具 有記錄個人用戶號碼及通訊錄等功能，藉由更換SIM卡，一支行動 φ 以供多個用戶使用。 請參閱第一圖，一種習知之晶片卡固持結構，用於固定行動電話等電 子裝置之晶片卡，其可使晶片卡（圖未示）和晶片卡連接器5〇電連接，主 要包括一基座52及一閉鎖件54。基座52上開設有容置部52〇，容置部52〇 内設置有連接器50，容置部520與晶片卡尺寸相當，用於容納晶片卡。閉 鎖件54設置於基座52上且鄰近容置部52〇，其可以如圖所示箭頭方向往復 移動。 —安裝時，撥動閉鎖件54，使閉鎖件54朝遠離容置部520方向移動，即 自容置部520上方退開’然後將晶片卡裝於容置部52〇 +，並反方向撥動 閉鎖件54至容置部520上方，以將晶片卡扣於容置部52〇内。同樣藉由撥 φ 動閉鎖件54亦可取出已裝於容置部520内之晶片卡。 然，上述晶片卡固持結構中’撥動閉鎖件54，即可輕易地使閉鎖件％ 於基座52上往復移動，故當行動電話不慎落地時，外力之衝擊會使閉鎖件 5^極易從谷置部520上方退開，如此將會使晶片卡無法有效地與SIM連接 器50電連接，甚至使晶片卡自容置部52〇令脫出，進而嚴重影響 之穩定性。 【發明内容】 鑒于以上内容，有必要提供一種可將晶片卡穩固固定於行動電話中之 晶片卡固持結構。 種晶片卡固持結構，其設置於一本體上，該晶片卡一 曰^片卡容置部及件，該⑼卡容置部具有—絲，該一 日曰片卡連接益，該晶片卡連接器包括一觸片，該觸片具有彈性其突出於 6 1362208 $面，該鎖固件具有-開口，其固定於晶片卡容置部上方且與該晶片 卡谷置部一端形成一晶片卡入口。 相較習知技術，所述晶片卡固持結構藉由晶片卡連接器觸片之彈力及 鎖固件將晶片卡穩定地ID持於行動電話内，結構簡單，插人及抽取方便。 【實施方式】 本發明aa>i卡0持結制於攜帶式電子裝置上，於本較佳實施例中， 其用於行動電話上。 、 請參閲第二圖，本發明較佳實施例之晶片卡固持結構，其設置於行動 電話本體10之隔板12上，並鄰近電池容置部14。該晶片卡固持結構包括 一晶片卡容置部20與一鎖固件30。1362208 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a wafer card holding structure. [Prior Art] Currently, there are many types of wafer cards that can be used for memory storage, such as CF (C0mpact Flash) 'SD (Secure Digital), SIM (Subscriber Identification Module card), etc. These chip cards are widely used in various electronic devices. in. With the rapid development of the communications industry, action g has become an indispensable tool for more and more consumers to work and live. Mobile phone ^ 'chip card, such as user identification card (SIM card)' is a plastic card with IC chip, which has the function of recording personal user number and address book, by replacing the SIM card, an action φ For use by multiple users. Please refer to the first figure, a conventional wafer card holding structure for fixing a chip card of an electronic device such as a mobile phone, which can electrically connect a chip card (not shown) and a chip card connector 5, mainly including a base. The seat 52 and a latch 54 are provided. A receiving portion 52 is defined in the base 52. The receiving portion 52 is provided with a connector 50. The receiving portion 520 is sized to accommodate the wafer card. The latch 54 is disposed on the base 52 adjacent to the receiving portion 52A, which is reciprocable in the direction of the arrow as shown. - When installing, the latching member 54 is moved to move the latching member 54 away from the accommodating portion 520, that is, to retreat from above the accommodating portion 520, and then the wafer is chucked in the accommodating portion 52 〇 +, and is reversely dialed The latching member 54 is moved over the accommodating portion 520 to snap the wafer into the accommodating portion 52A. Similarly, the wafer card loaded in the accommodating portion 520 can be taken out by dialing the φ movable latch 54. However, in the above-mentioned wafer card holding structure, the latching member 54 can be easily moved to reciprocate on the base 52. Therefore, when the mobile phone accidentally falls, the impact of the external force causes the latch to be closed. It is easy to retreat from above the valley portion 520, which will make the wafer card unable to be electrically connected to the SIM connector 50, and even cause the wafer card to be released from the housing portion 52, thereby seriously affecting the stability. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a wafer card holding structure that can securely hold a wafer card in a mobile phone. The chip card holding structure is disposed on a body, the chip card has a card receiving portion and a member, and the (9) card receiving portion has a wire, and the chip card is connected to the chip card. The device includes a contact piece having an elasticity that protrudes from the surface of the 6 1362208 $. The lock has an opening that is secured over the wafer card receptacle and forms a wafer card entry with one end of the wafer card. Compared with the prior art, the chip card holding structure holds the chip card stably in the mobile phone by the elastic force and the lock of the wafer card connector contact, and has a simple structure, convenient insertion and extraction. [Embodiment] The aa>i card 0 of the present invention is held on a portable electronic device, which is used in a mobile phone in the preferred embodiment. Referring to the second figure, a wafer card holding structure according to a preferred embodiment of the present invention is disposed on the partition 12 of the mobile phone body 10 and adjacent to the battery receiving portion 14. The wafer card holding structure includes a wafer card housing portion 20 and a locking member 30.
日日片卡谷置部20由-底面200及複數突出於底面2〇〇上之立柱2〇2圍 成。本較佳實施例中，該立柱2〇2係為圓柱體狀，其數量係為五個，盆中 四立柱202均勾分佈於該晶片卡容置部2〇之四角，另一立柱2〇2位於二遠 離電池容置部14之立柱202端，且與該二立柱2〇2不在同一直線上。底面 200為本體1〇隔板12之一部分，其鄰近中央位置設置有一晶片卡連接器 2〇4，其可與-晶片卡4〇電連接’該晶片卡連接器2〇4包括複數彈性觸片 2040 ’該觸片2〇4〇突出於晶片卡容置部2〇之底面2〇〇，即觸片2_稍高 出晶片卡容置部20之底面200。 凊結合參閲第四圖，該鎖固件3〇包括—矩形主體3〇2，其形狀尺寸與 B曰片卡40相當，且具有二相對設置之長邊及連接該二長邊之二短邊，該主 體302上開設-開口 3〇2〇。該主體302於其二長邊處分別垂直延伸一第一 側壁304’該第一側壁304之兩端分別垂直延伸出一耳片3〇4〇,該耳片3〇4〇 上進一步開設一孔3042❶該主體302於其一短邊處垂直延伸一第二側壁 306，該第一側壁306之中間部位垂直延伸出一折片3〇6〇，該折片3〇6〇上 進-步開设-孔3062 »該主體302於其另-短邊處垂直延伸一第三侧壁 308 ’該第二側壁308係為鉤狀。其中，該第一側壁3〇4與第二側壁3〇6之 问度相同’且大於第二御邊308之高度’該第三側壁3〇8之高度略大於晶 片卡40之厚度；該耳片3040與折片3060均平行於主體302 ;該孔3042與 孔3062之形狀大小相同，且與晶片卡容置部2〇之立柱2〇2配合。 ” 明一併參閱第二圖及第五圖，組裝時，將鎖固件之孔3〇42、3〇62 穿過晶片卡容置部20之立柱202，並藉由熱溶等方式固定，從而將鎖固件 30固疋於晶片卡容置部20上。此時，鎖固件3〇之第三側壁308鄰近電池 7 1362208 了^ 14’該第二側壁3〇8與晶片卡容置部2〇底面之間具有一略大於 ΐ入口^f之間隙其係為一晶片卡入口 2〇6，晶片卡4〇可藉由該晶片 卡入口 206插入晶片卡容置部2〇内。 σ Ϊ安ί晶，40時，將晶片卡40置於晶片卡容置部20之晶片卡入 =H推入晶片卡容置部2〇内然後施 4之觸片_彈起，該晶片卡4〇㈣定_晶二容ί f fF晶片卡40時，從鎖固件3〇之開口 3〇2〇處㈣該晶片卡4〇， 亚向曰曰片卡入口 206方向推出該晶片卡4〇即可。 及礼柱2G2之數量不限於五個，其亦可省略；該耳片3040 及孔3042之數1不限於四個’其亦可省略；該折片删及孔地之The day-to-day card pocket portion 20 is surrounded by a bottom surface 200 and a plurality of pillars 2〇2 projecting from the bottom surface 2〇〇. In the preferred embodiment, the column 2〇2 is cylindrical, and the number is five. The four columns 202 in the basin are distributed at the four corners of the wafer card receiving portion 2, and the other column is 2〇. 2 is located at the end of the column 202 away from the battery receiving portion 14 and is not in line with the two columns 2〇2. The bottom surface 200 is a portion of the body 1 〇 spacer 12, and a wafer card connector 2 〇 4 is disposed adjacent to the center, which can be electrically connected to the wafer card 4 ' 4, the wafer card connector 2 〇 4 includes a plurality of elastic contacts 2040' The contact piece 2〇4〇 protrudes from the bottom surface 2 of the wafer card accommodating portion 2, that is, the contact piece 2_ is slightly higher than the bottom surface 200 of the wafer card accommodating portion 20. Referring to the fourth figure, the fastener 3 includes a rectangular body 3〇2 having a shape corresponding to the B-clip card 40 and having two oppositely disposed long sides and two short sides connecting the two long sides. The main body 302 is opened with an opening of 3〇2〇. The main body 302 extends vertically on a first side wall 304 of the main body 302. The two ends of the first side wall 304 extend perpendicularly to an ear piece 3〇4〇, and a hole is further formed in the ear piece 3〇4〇. The main body 302 extends a second side wall 306 vertically at a short side of the main body 302. The middle portion of the first side wall 306 extends perpendicularly to a flap 3〇6〇, and the flap 3〇6〇 is stepped up. - Hole 3062 » The body 302 extends vertically at a further short side of a third side wall 308 'the second side wall 308 is hooked. Wherein, the first side wall 3〇4 and the second side wall 3〇6 have the same degree 'and greater than the height of the second side edge 308'. The height of the third side wall 3〇8 is slightly larger than the thickness of the wafer card 40; the ear The sheet 3040 and the flap 3060 are both parallel to the main body 302; the hole 3042 has the same shape and shape as the hole 3062, and cooperates with the post 2 2 of the wafer card accommodating portion 2 . Referring to the second and fifth figures, when assembling, the holes 3〇42 and 3〇62 of the fastener are passed through the column 202 of the chip card accommodating portion 20, and are fixed by heat-dissolving or the like. The locking member 30 is fixed to the chip card accommodating portion 20. At this time, the third side wall 308 of the locking member 3 is adjacent to the battery 7 1362208. The second side wall 3 〇 8 and the wafer card accommodating portion 2 A gap between the bottom surface and a gap slightly larger than the entrance is formed as a wafer card inlet 2〇6, and the wafer card 4 can be inserted into the wafer card housing portion 2 by the wafer card inlet 206. σ Ϊ安ί At 40 o'clock, the wafer card 40 is placed in the wafer card accommodating portion 20, and the wafer is inserted into the chip card accommodating portion 2, and then the contact piece _ bounces, and the wafer card 4 〇 (4) When the ff wafer card 40 is used, the wafer card 4 is opened from the opening 3〇2〇 of the lock 3〇, and the wafer card 4 is pushed out in the direction of the sub-tile card inlet 206. The number of the shrine 2G2 is not limited to five, and may be omitted; the number 1 of the ear piece 3040 and the hole 3042 is not limited to four 'which may be omitted; the piece is deleted from the hole
不，於-個，其亦可省略；該鎖固件3〇與該晶片卡容置部2 J 方式固^在-起或-體由具他 綜上所述’本發明符合發明專利要件，爱依法提出專利申請 上所述者僅為本㈣之難實關，本發社顧並⑽ 限，舉凡《本案技藝之人域依本㈣之精神所作 1 =為 皆應涵蓋於以下申請專利範圍内。 /哪及變化， 【圖式簡單說明】 第一圖係習知之晶片卡固持結構示意圖； 第二圖係本發明晶片卡固持結構較佳實施例之立體分解圖； ❿ 第三圖係本發明晶片卡畴結構較佳實施例安裝晶片卡時之 第四圖係本發明晶片卡m持結構較佳實施例安裝晶片卡後之;·’ 第五圖係第四圖沿ιν_ιν線之剖視圖。 圖， 【主要元件符號說明】 本體 電池容置部 底面 晶片卡連接 晶片卡入口 主體 第一侧璧 第二側壁 器 10 14 200 204 206 302 304 306 隔板 晶片卡容置部 立柱 觸片 鎖固件 開口 耳片 折片 12 20 202 2040 30 3020 3040 3060 8 1362208 孔 3042、3062 第三側壁 308 晶片卡 40 連接器 50 基座 52 容置部 520 閉鎖件 54 9No, it can also be omitted; the lock 3 〇 and the chip card accommodating portion 2 J are fixed or hoisted by the above-mentioned invention, the invention meets the requirements of the invention patent, love The patent application mentioned in accordance with the law is only the difficulty of this (4), and the hair of the company is limited to (10). All the people in the spirit of this case are in the spirit of this (4). . BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic view of a conventional wafer card holding structure; the second drawing is an exploded perspective view of a preferred embodiment of the wafer card holding structure of the present invention; The fourth embodiment of the preferred embodiment of the present invention is the following: FIG. 4 is a cross-sectional view of the fourth embodiment along the line ιν_ιν. Fig. [Description of main component symbols] The bottom surface of the main body battery receiving portion is connected to the wafer card. The main body of the wafer card inlet body is the first side panel. The second side wall device 10 14 200 204 206 302 304 306 Bulkhead wafer card accommodating portion column contact lens lock opening Ear flap 12 20 202 2040 30 3020 3040 3060 8 1362208 Hole 3042, 3062 Third side wall 308 Wafer card 40 Connector 50 Base 52 Housing 520 Locking member 54 9