TWM294748U - Socket connector - Google Patents
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- TWM294748U TWM294748U TW95200873U TW95200873U TWM294748U TW M294748 U TWM294748 U TW M294748U TW 95200873 U TW95200873 U TW 95200873U TW 95200873 U TW95200873 U TW 95200873U TW M294748 U TWM294748 U TW M294748U
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Description
M294748 八、新型說明: 【新型所屬之技術領域】 B片模接為,尤指—種設於—電路板上以固持一 =座連接器使得該晶片模組電性連接於該電路板之 【先前技術】 a t(Land Gnd Array Package)^^^ : 電腦主機的中央處理器,係安裝在f於- 黾路板上的一插座連接哭上 α又; 靜、谪叙如+ 上5亥插座連接器包括一絕緣本 端子和—鎖扣組件。該等導電端子係設於 …巴、,、彖本體内。該絕緣本體係承載一晶片模 件,m晶片模組於該絕緣本體上、:如此,該: ==面的電性接點能夠電性接觸設於該絕緣本體 白々¥电立而子,以經由該耸墓帝 茨寺¥包编子電性連接於該電路板。 :曰:片模組的頂面塗布一層具有黏性 :二,插座連接器上且接觸塗布於該晶片模: 之頂面的政熱T ’以對該晶片模組進行散熱的工作。 當該散熱器被取起時,該鎖扣組 =免該嶋組隨著該散熱器也被取起而=而 習^插座連接器,如公告於2005年2月21 :民國專利證㈣” M257534號揭示的—種 格陣列電連接器」,包括一絕緣基體、一框體、一壓 =桿。該絕緣基體之安裝部的側緣設有複數個凸點% 框肢之中空底壁的内側緣設有複數個凹槽。該等凸點分別 M294748 配合於該等凹槽,使得該絕緣基體結合於該框體。該壓蓋 和該撥桿分別枢接於該框體的相對二端。 上述習知的插座連接器的框體、壓蓋和撥桿為導熱的 金屬材料所製成。該插座連接器的導電端子係經由一回焊 爐的加熱而焊接於一電路板上。 當該插座連接器和該電路板送入該回焊爐内加熱 時,由於該框體、該壓蓋和該撥桿極易吸收熱量且均結合 於該絕緣基體,使得該絕緣基體極易受熱變形。 另外,當該插座連接器和該電路板送入該回焊爐内加 熱時,該回焊爐所產生的熱量極易集中至該框體、該壓蓋 和該撥桿。結果,其他電子元件焊接於該電路板上所需的 熱量不足。因此,該回焊爐的溫度必須提高以彌補其他電 子元件焊接於該電路板上所需的熱量。如此,該插座連接 器的製造成本提高,且該絕緣基體更容易受熱變形。 再者,該框體、該壓蓋和該撥桿的材料需求多,使得 該插座連接器的製造成本高。 使用時,一晶片模組係被手指所抓取以放置於該絕緣 基體上。接著,該壓蓋被蓋合於該晶片模組上。然後,該 撥桿鎖扣於該壓蓋。然而,以手指放置該晶片模組於該絕 緣基體上的準確性差’且該晶片模組容易掉落而損及設於 該絕緣基體的導電端子。 是以,由上可知,上述習知的插座連接器,在實際使 用上,顯然具有不便與缺失存在,而有待加以改善。 緣是,本創作人有感上述缺失之可改善,乃特潛心研 究並配合學理之運用,終於提出一種設計合理且有效改善 M294748 上述缺失之本創作。 【新型内容】 〔創作目的〕 一本創作之主要目的,在於提供一種插座連接哭,以提 被安裝於其内綱性,且避免該晶片模組 在女衣日寸掉洛而損及該插座連接器的導電端子。 备次—目的,在於提供一種插座連接器,以避 免其%緣本體的受熱變形。M294748 VIII. New description: [New technical field] The B-mode is connected, especially, to the circuit board to hold a = connector to electrically connect the chip module to the circuit board. Prior art] at(Land Gnd Array Package)^^^ : The central processing unit of the computer host is installed on the socket of f--the circuit board to cry on the alpha and the other; static, 谪 如 如 + + 5 上 插座The connector includes an insulated terminal and a latch assembly. The conductive terminals are disposed in the body of the bar, the body, and the body. The insulating system carries a wafer module, and the m-chip module is mounted on the insulating body, such that: the electrical contact of the == surface can be electrically contacted to the insulating body, and the electric contact is The board is electrically connected to the circuit board via the shrine. : 曰: The top surface of the chip module is coated with a layer of adhesive: 2. The socket connector is attached to the top surface of the wafer die: the heat of the wafer is cooled. When the heat sink is taken up, the lock group = free of the stack is taken up with the heat sink and the socket connector is replaced, as disclosed in February 21, 2005: Republic of China Patent Certificate (4) The "grid array electrical connector" disclosed in M257534 includes an insulating substrate, a frame body, and a pressure = rod. The side edge of the mounting portion of the insulating base is provided with a plurality of bumps. The inner edge of the hollow bottom wall of the frame limb is provided with a plurality of grooves. The bumps M294748 are respectively fitted to the grooves such that the insulating substrate is bonded to the frame. The pressure cover and the lever are respectively pivotally connected to opposite ends of the frame. The frame, gland and lever of the above conventional socket connector are made of a thermally conductive metal material. The conductive terminals of the receptacle connector are soldered to a circuit board by heating of a reflow oven. When the socket connector and the circuit board are fed into the reflow furnace for heating, since the frame body, the gland and the lever are easy to absorb heat and are all coupled to the insulating substrate, the insulating substrate is highly susceptible to heat. Deformation. Further, when the socket connector and the circuit board are fed into the reflow furnace, heat generated by the reflow furnace is extremely concentrated to the frame, the gland, and the lever. As a result, the amount of heat required to solder other electronic components to the board is insufficient. Therefore, the temperature of the reflow oven must be increased to compensate for the heat required to solder other electronic components to the board. Thus, the manufacturing cost of the socket connector is increased, and the insulating substrate is more susceptible to thermal deformation. Moreover, the frame, the gland, and the material of the lever are in high demand, so that the socket connector is expensive to manufacture. In use, a wafer module is grasped by a finger to be placed on the insulating substrate. Then, the gland is covered on the wafer module. Then, the lever is locked to the cover. However, the accuracy of the placement of the wafer module on the insulating substrate by the finger is poor and the wafer module is easily dropped to damage the conductive terminals provided on the insulating substrate. Therefore, it can be seen from the above that the above-mentioned conventional socket connector is obviously inconvenient and lacking in actual use, and needs to be improved. The reason is that this creator feels that the above-mentioned deficiencies can be improved. He is devoted to research and cooperation with academics, and finally proposes a design that is reasonable in design and effective in improving the above-mentioned missing of M294748. [New Content] [Creation Purpose] The main purpose of a creation is to provide a socket connection to cry, to be installed in its internal features, and to avoid damage to the socket when the wafer module is lost in the female clothing. The conductive terminal of the connector. The purpose of the backup is to provide a socket connector to avoid thermal deformation of the body of the % edge.
=作之另—目的,在於提供—種插座連接器,以避 免,、烊接於一電路板時吸收過多的熱量而 元件焊接於該電路板上。 s八他电子 本創作之又一目的,在於提供一種插座連接器, 低该插座連接器的製造成本。 〔創作特徵〕 接哭上述目的,本創作主要係在提供一種插座連 係固持一晶片模組於其中,該插座連接器包括一 緣本體、複數個導電端子以及—框體;該等導電端子执於 繼接於該絕緣本體,該框體具“ 持裝置彈性地固持該晶片模組於 人 ΠΛ框體載運該晶片模組至該絕緣本體上。 =固:裝置先行固持該晶片模組於該框體 :至;二Γ 性提昇。接著,該框體載運該晶片模 =上,使得該晶片模組被安裝峨 該插座連接^導且電晶片模組在安裝時掉落而損及 M294748 ,在較佳的實施例中,該絕緣本體承載該晶片模組於其 ^ ’该框?的後部減於該絕緣本體的後部,該框體的前 有一弹性鎖扣裝置,該彈性鎖扣裝置可釋放地鎖扣於 ^ '彖本版的^部’且该框體擋止該晶片模組於該絕緣本 體上。 在較佳的實施例中,該絕緣本體承載該晶片模组於直 替ί絕緣本體的前部具有—彈性鎖扣I置,該框體的後 =於_緣本體的後部,該彈性鎖扣裝置可釋放地鎖 ^亥框體的前部,且該框體擒止該晶片模組於該絕緣本 體便連接器僅須以樞接於該絕緣本體的框 連】二:L 於該絕緣本體上。因此,當該插座 —回焊爐内加熱時,該框體所吸收 的插座連接器的鎖扣組件所 =如此’該絕緣本體不易受熱變形,且該框體所吸收的 熱1不會影響其他電子元件焊接於該電路板上。 :外’該框體的材料需求少於習知的 扣組件。因此,該插座連接器的製造成本降低。鎖 【實施方式】 且具體之瞭解,然而所附圖式僅接 亍冰入 用來對本創作加以限制。^供參考與說明用,並非 〔詳細說明〕 M294748 請芩閱第一圖至第四圖所未,為本創作第一實施例。 本創作係一種插座連接器,係固持-晶片模組3於其中。 该晶片模組3可為-平面栅格陣列封裝(Land㈣八叫 f ackage)規格的晶片模組,如一電腦主機的中央處理器。 λ插座連接為包括一絕緣本體1、複數個導電端子6以及 一框體2。The other purpose is to provide a socket connector to avoid excessive heat absorbed by a board and soldered to the board. s八他电子 Another purpose of this creation is to provide a socket connector that reduces the manufacturing cost of the socket connector. [Creating Features] In order to achieve the above purpose, the present invention mainly provides a socket supporting a wafer module therein, the socket connector comprising a rim body, a plurality of conductive terminals and a frame; the conductive terminals are Following the insulative housing, the frame has a holding device that elastically holds the chip module to carry the wafer module to the insulative housing. The solid device: the device first holds the wafer module in the frame. Then, the frame is loaded with the die modulo=up, so that the chip module is mounted on the socket and the electrical chip module is dropped during installation to damage the M294748. In a preferred embodiment, the insulative housing carries the wafer module at a rear portion of the frame minus the rear portion of the insulative housing, and the frame has a resilient latching device at the front thereof, and the elastic latching device can be released. The device is latched on the body of the device and the frame blocks the chip module on the insulative housing. In a preferred embodiment, the insulative housing carries the die to be insulated The front of the body has a bullet The latch I is disposed, and the rear of the frame is at the rear of the body of the rim. The elastic latching device releasably locks the front portion of the frame, and the frame stops the chip module on the insulating body. The connector only needs to be pivotally connected to the insulating body. The second connector is connected to the insulating body. Therefore, when the socket is heated in the reflow furnace, the latch assembly of the socket connector absorbed by the frame body Therefore, the insulating body is not easily deformed by heat, and the heat absorbed by the frame does not affect the soldering of other electronic components on the circuit board. The material of the outer casing is less than that of the conventional buckle assembly. Therefore, the manufacturing cost of the socket connector is reduced. The lock [embodiment] is specifically understood, but the drawing is only used to limit the creation of the ice. For reference and explanation, it is not [detailed description] M294748 Please refer to the first to fourth figures for the first embodiment of the present invention. The present invention is a socket connector in which a holding-wafer module 3 is located. The wafer module 3 can be a planar grid Grid array package (Land (four) eight called f ackage) specifications Central processing module sheet, such as a host computer. [Lambda] is a receptacle connector comprising an insulating body 1, a plurality of conductive terminals 6 and a frame 2.
遠絕緣本體1概呈一矩形。該絕緣本體i具有一前牆 1 1、二個側牆1 2、和一後牆3。該前牆i i位於該 絕緣本體1的前部。該後3位於該絕緣本體丄的後 部。該等側牆1 2的前端分別連接於該前牆i 1的二端。 該等側牆1 2的後端分別連接於該後牆i 3的二端。該絕 緣本體1的頂面設有一下沉的安裝部i 〇位於該前牆工 1、、該等側牆1 2、和該後牆} 3之間。該安裝部i 〇設 有複數個端子槽1 〇 5。 在第四圖中,该絕緣本體1之後部的二端(即該後牆 1 3的二端或該等侧牆1 2的後端)各設有一凸軸工3 1。該絕緣本體1的前部設有一扣接裝置。該扣接裝置具 有二個凸塊1 i i、二個擋部丄1 2、二個缺槽丄j ^凹口 1 1 4位於该絕緣本體1的前侧。該凹口 1 1 :於該等凸塊1 1 ;!之間。該等擋部工工2分別形成於該 等凸塊1 1 1之相對内侧的上緣。該等缺槽i i 3分 成於該等擋部1 1 2的後侧。 刀,> 該等導電端子6係分別設於該安裝部i 〇的端子枰 1 0 5内。如第一圖所示,各導電端子6為一表面=著^ (SMT, Surface Mount Technology)端子。各導電端子 6 的 Μ 谓 748 底端和頂端分別具有—焯接 接部6 0係用以焊接—錫球:::和-接觸部6 1。各焊 用以電性接觸該晶片模組3 路板。各接觸部6 1係 如第—Α圖所示,夂遑 (Thr〇ughHole)端子。各導D子^為一穿孔式 具有-焊接部60'和一接;= ^ 係用以穿過—電路板的穿孔_ ^ 口卜接4 6 〇 接觸部用以電性接觸==該電路板。各 奸Γ;!2具有一前擋板21、二個側撞板2 2、和- =二? Ϊ擋板Η位於該框體2的前部。該後播 == 的後部。該等側擔板2 2的前端分別 、車…刖“反2 1的二端。該等侧擋板2 2的後端分別 =於該後擔板23的二端。該前擔板21、該等側擔板 2 2、和該後擔板2 3連接形成—矩形的封閉外框和一中 工孔2 5於其間。該框體2亦可沒有該後擔板2 3而為一 U子型的開放外框。 • 此外,該框體2的後部具有二個枢接片2 4。該等樞 接月2 4分別連接於該框體2之後擋板2 3的二端(或該 等側擋板2 2的後端)。該等樞接片2 4各設有一樞孔2 4 1。該等樞孔2 4 1分別樞接於該等凸軸1 3 ;[,使得 该專樞接片2 4分別枢接於該絕緣本體1之後部的二 端。如此’邊框體2的後部插接於該絕緣本體1的後部。 請參閱第四Α圖所示,該絕緣本體1之後部的二端各 設有一凹部1 3 2取代如第四圖之凸軸1 3 1。該等樞接 片2 4的相對内側各設有一凸部2 4 2取代如第四圖之 10 M294748 枢孔該等凸部2 4 2分別樞接於該等凹部工3 2 ’Λ得該等樞接片2 4分別樞接於該絕緣本體1之後部 的而如此,5亥框體2的後部亦可樞接於該絕緣本體1 的後部。 請茶閱第四B圖所示,該絕緣本體i灸 設有-凹部…。該等拖接片24各設有一枢:孔;: 1。本創作之插座連接器另包括二個栖接件丄4。各栖接 :1 4樞接於一相應的樞孔2 4丄和一相應的凹部工3 f。如此’餘體2的後部亦可樞接於該絕緣本體丄的後 此外,雜體2的前部具有—彈性鎖扣裝置。本 鎖扣裝置具有—U字型鎖扣彈臂20。該鎖 妾於該前撞板21的前緣,該鎖扣彈 一自由端且具有二個勾部201分別位 再者,該框體2具有一彈性固持袭置。本實施 ^性固持裝置具有二個彈性夾臂26,且該等彈 於該框體2的二個相對側邊。如第一 = 失臂26分別連接於該等樞接片21 性夾臂26自該框體2的後部延伸向前。 火,2 6的自由端設有一向内彎折的夾持部2 6工。 接哭連接㈣設於—電路板(圖略)上。該插座連 接盗和该電路板送入一回焊爐内加埶 連 的導電端子6焊接於該電路板。吏件㈣座連接器 當該晶片模組3被安裝至該插座連接器時,首先,該 11 M294748 晶片模組3的頂部收容於該框體2的中空孔 ㈣夾臂2 6的夾持部2 6 i分別夾持於該晶片模:: 持兮曰只槿細q认吏 胜2彈性固持裝置彈性地固 ::體框體2中。因此,該晶片模組3和該 ^ 起,使侍該晶片模組3的穩定性提昇。 〃次,該框體2的前部蓋合至該絕緣 且該鎖扣彈臂20的自由端被後壓且 =二 2〇1分別通過該等缺槽113。 編寺勾部 彈臂扣㈣2 q的自由端被釋放,使得該鎖扣 1:二,晋的勾部201分別勾接於該絕緣本體 2扣接衣置的擔部1 1 2之下,且該彈性鎖扣裝置收容 置i14内。如此’該框體2之前部的彈性鎖扣裝 置可釋放地鎖扣於該絕緣本體1之前部的扣接裳置。 及框體2載運該晶 >;额3至_ :絕緣本趙1的安裝部10承載該晶片模組上: 模組3蚊位於該安裝部10的範_。因此,該 :吴組3被安裝於該絕緣本體工上的準石崔性提昇,且避 模組3在安料掉落而損及該插座連接器的導 9 Q此4 ’該前擋板2 1、料㈣板2 2、和該後擋板 二T該晶片模組3的-外肩部3 1的上方,使得該框 7才亥晶片模組3於該絕緣本體1上,且該晶片模組 的頂面對應於該框體2的中空孔2 5。因此,該晶片模 組3被承載和擋止於該插座連接器中。 、 該晶片模組3的頂面塗布一層散熱膏(圖略)。一 12 M294748 熱為(圖略)被放置於該播座連接器上且經由該中空孔2 5接觸塗布於該晶片模組3之頂面的散熱膏,以壓制該晶 片模、、且3且提供該晶片模組3 一散熱的功效。該晶片模組 =之底面的導電接點能夠電性接觸該插座連接器的導電 為子6的接觸部6 1,以經由該等導電端子6電性連接於 该電路板。 田孩放熱為被取起時,該框體2能夠擋止該晶片模組 3 以避免5亥晶片模組3隨著該散熱器也被取起。 _ 该w擋板2 1的前緣進一步設有一肋條2 1 1延伸 ' 向上,以強化該框體2的強度。該前擋板2 1的後緣進一 步设有一肋條2 1 2延伸向上,以強化該框體2的強度。 至少一個該等侧擋板2 2的内緣進一步設有一肋條$ 2 1延伸向上,以強化該框體2的強度。至少一個該等側擋 板2 2的外緣進一步設有一肋條2 2 2延伸向下,以強^ 該框體2的強度。該後擋板2 3的前緣進一步設有一肋條 2 3 1延伸向上’以強化该框體2的強度。如此,該框體 • 2能夠更為可靠地擋止該晶片模組3於該絕緣本體1上。 當欲自該插座連接器取出該晶片模組3時,該鎖扣彈 臂2 0的自由端被後壓且上移,使得該等勾部2 〇 1分別 通過該等缺槽1 1 3。如此,該彈性鎖扣裝置被釋放,使 得該框體2的前部能夠被釋放以脫離該絕緣本體i之前 部的扣接裝置。接著,該晶片模組3能夠被取出。 請參閱第五圖和第六圖所示,本創作之插座連接器進 一步包括一吸取板4。該吸取板4具有至少二個勾臂41 分別位於該吸取板4的二個相對侧邊且延伸向下。該絕緣 13 M294748 ΐ ί ί ί—步設有至少二個句槽121分别位於該絕緣 丄2\ !相對側邊。各勾臂41勾接於-相應的勾槽 二使得该吸取板4結合於該絕緣本體1。 哭处ΐίΓ板4係供一吸取裝置的吸取,使得該插座連接 浐夠迅I^動地搬運至該電路板上。如此,該插座連接器 接匕器焊二焊接於該電路板上。此外,該插座連 卸。 、电路板上之後,該吸取板4能夠被輕易地拆 二:閱第七圖和第八圖所示’為本創作第二實施例。 =¼例和第_實施例的差異為該絕緣本體厂的扣 接衣置^該框體2飞彈性鎖扣裝置和彈性固持裝置。 本實施例中,該扣接裝置具有二個凸塊i 1 1 -、 =112'和-凹口 I"、於該絕緣本體J °/亥凹口 114,位於該等凸塊111、間。該 側二】…分別形成於該等凸塊…、相對内 臂乂亥彈性鎖扣裝置具有一延伸板2 7、二個鎖扣彈 乂山0。该延伸板2 7白々上端連接於該前擋板2 1的 别2。各鎖扣彈臂20/的後端連接於該延伸板27/的 下端之相應的一側且延伸向前。各鎖扣彈臂2 〇 /的前/ 為—自由端。 1而 該彈性固持裝置具有二個彈性爪板2 6/,且該等γ 性爪板2 6 /分別位於該框體2 /的二個相對側邊〔士 = 七圖和第人圖所示,該等彈性爪板2 6飞上端分S 於该等側擔板2 2。各彈性爪板2 6飞下端為—自由端 14 M294748 且設有一向内彎拆的勾爪部m,。 當該晶片模組3被安裝至該插座連接器時,首先,該 晶片模組3的頂部收容於該框體2 /的中空孔2 5内。= 等彈性爪板2 6飞勾爪部2 6厂分別勾持於該晶^ 杈組3的二個相對側邊,使得該框體2 -的彈性固持裝置 彈性地固持遠晶片模組3於該框體2 >中。 、 其次,該框體2 /的前部蓋合至該絕緣本體i /的 部,且該等鎖扣彈臂2 的自由端被 寻鎖扣弹# 2 0的自由端分別勾接於該絕緣本體工一 之扣接裝置的擋部1 i 2 >之下,且該彈性 於該凹口 1 1 4,内。 省框體2載運該晶片模組3至該絕緣本體工> 上,使得該絕緣本體厂的安裝部i Μ載該晶片模組3 =其上,且該晶片模組3被定位於該安裝部i ◦的範圍 =自該插座連接器取出該晶片模組3時,該等鎖扣 弹# 2 0的自由端被相對内壓且内移。如此,該 扣裳置被釋放,使得該框體2飞前部能夠被釋放以脫離 该絕緣本體1、前部的扣接裝置。接著, 能夠被取出。 门俱、、且d 請參閱第九圖所示,為本創作第三實施例。第三每 例和第二實施例的差異為該框體2,的彈性固持裝置\心 本實施例中,如第七圖之各彈性爪板2 Π㊃ 有至少-個開口 2 6 2 >且形成至少二個彈性爪片^ M294748 3 >。苐三實施例之彈性爪片2 6 3 /的彈性較第二實施 例之彈性爪板2 6 —的彈性為佳。各彈性爪片2 6 3二的 下立而為一自由端且設有一向内彎折的勾爪部2 6 4 -。节 等彈性爪片2 6 3 ’的勾爪部2 6 4 >分別勾持於該晶 片模組3的二個相對侧邊,使得該框體2 -的彈性固持裝 置彈性地固持該晶片模組3於該框體2 -中。The far insulating body 1 has a rectangular shape. The insulative housing i has a front wall 1 1 , two side walls 12 , and a rear wall 3 . The front wall i i is located at the front of the insulative housing 1. The rear 3 is located at the rear of the insulating body bore. The front ends of the side walls 12 are respectively connected to the two ends of the front wall i1. The rear ends of the side walls 12 are respectively connected to the two ends of the rear wall i 3 . The top surface of the insulating body 1 is provided with a sinking mounting portion i 〇 between the front wall member 1, the side wall 12, and the back wall}3. The mounting portion i is provided with a plurality of terminal slots 1 〇 5. In the fourth figure, the two ends of the rear portion of the insulative housing 1 (i.e., the two ends of the rear wall 13 or the rear ends of the side walls 12) are each provided with a convex shaft 31. The front portion of the insulative housing 1 is provided with a fastening device. The fastening device has two protrusions 1 i i , two blocking portions 丄 1 2 , and two notches ^ j ^ notches 1 1 4 are located on the front side of the insulating body 1 . The notch 1 1 : between the bumps 1 1 ; The stoppers 2 are respectively formed on the upper edges of the opposite sides of the bumps 1 1 1 . The missing slots i i 3 are divided into the rear sides of the blocking portions 1 1 2 . Knife, > These conductive terminals 6 are respectively provided in the terminal 枰 1 0 5 of the mounting portion i 。. As shown in the first figure, each of the conductive terminals 6 is a surface (SMT, Surface Mount Technology) terminal. The bottom end and the top end of each of the conductive terminals 6 have a - 焯 junction portion 60 for soldering - solder balls::: and - contact portions 61. Each solder is used to electrically contact the wafer module 3-way board. Each of the contact portions 6 1 is a 夂遑 (Thr〇ugh Hole) terminal as shown in the first diagram. Each of the leads D is a perforated type having a soldering portion 60' and a connection; = ^ is used to pass through the perforation of the board _ ^ mouth to connect the 4 6 〇 contact portion for electrical contact == the circuit board. Each of the traits has a front baffle 21, two side strikers 2, and -= two Ϊ baffle Η located at the front of the frame 2. The back of the post ==. The front ends of the side support plates 2 2 are respectively the two ends of the opposite side of the vehicle. The rear ends of the side baffles 22 are respectively at the two ends of the rear support plate 23. The front plate 21, The side support plates 2 2 and the rear support plate 23 are connected to form a rectangular closed outer frame and a middle hole 25 5 therebetween. The frame 2 can also be a U without the rear support plate 2 3 . The open outer frame of the sub-type. • In addition, the rear portion of the frame 2 has two pivoting pieces 24. The pivoting ends 24 are respectively connected to the two ends of the baffle 2 3 of the frame 2 (or The rear end of the side baffle 22 is provided with a pivot hole 241. The pivot holes 241 are respectively pivotally connected to the convex shafts 13; The pivoting pieces 24 are respectively pivotally connected to the two ends of the rear portion of the insulative housing 1. Thus, the rear portion of the frame body 2 is inserted into the rear portion of the insulative housing 1. Referring to the fourth figure, after the insulative housing 1 The two ends of the portion are respectively provided with a recess 1 3 2 instead of the convex shaft 1 3 1 as shown in the fourth figure. The opposite inner sides of the pivoting pieces 24 are respectively provided with a convex portion 2 4 2 instead of the 10 M294748 pivot as shown in the fourth figure. The convex portions 2 4 2 of the holes are respectively pivotally connected to the concave portions 3 2 'The pivoting pieces 24 are pivotally connected to the rear portion of the insulative housing 1 respectively, and the rear portion of the 5 housing frame 2 can also be pivotally connected to the rear of the insulative housing 1. Please read the fourth As shown in Figure B, the insulative body i moxibustion is provided with a recessed portion. The tow tabs 24 are each provided with a pivot: a hole: 1. The socket connector of the present invention further comprises two habitats 丄 4. Each habitat Connected: 14 is pivotally connected to a corresponding pivot hole 2 4 丄 and a corresponding recess 3 f. Thus the rear portion of the body 2 can also be pivotally connected to the rear of the insulating body ,, the front of the body 2 The utility model has an elastic locking device. The locking device has a U-shaped locking elastic arm 20. The locking device is locked on the front edge of the front collision plate 21, and the locking buckle has a free end and two hook portions 201 respectively Furthermore, the frame 2 has an elastic retention. The embodiment of the holding device has two elastic clamping arms 26, and the two elastic arms 26 are opposite to the opposite sides of the frame 2. For example, the first = lost The arms 26 are respectively connected to the pivoting pieces 21, and the clamping arms 26 extend forward from the rear of the frame 2. The free ends of the fires 26 are provided with an inwardly bent clamping portion. (4) On the circuit board (not shown), the socket connection thief and the circuit board are fed into a reflow furnace and the conductive terminals 6 are connected to the circuit board. The (4) socket connector is the wafer module 3 When being mounted to the socket connector, first, the top portion of the 11 M294748 wafer module 3 is received in the hollow hole (4) of the frame 2, and the clamping portion 2 6 i of the clamp arm 26 is respectively clamped to the wafer mold: The 弹性 吏 吏 2 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性The front portion of the frame 2 is covered to the insulation and the free end of the latching spring arm 20 is pressed back and = 2 〇 1 passes through the slots 113, respectively. The free end of the arm of the temple hook (4) 2 q is released, so that the hooks 201 of the lock 1: 2 are hooked under the support 1 1 2 of the insulating body 2, and The elastic locking device is housed in the i14. Thus, the elastic latching device at the front of the frame 2 is releasably latched to the fastening portion of the front portion of the insulative housing 1. And the frame 2 carries the crystal >; the amount of 3 to _: the mounting portion 10 of the insulating body 1 carries the wafer module: the module 3 mosquito is located in the mounting portion 10. Therefore, the Wu group 3 is upgraded by the quasi-stone in the insulating body, and the module 3 is dropped in the material to damage the guide of the socket connector. 2, the material (4) board 2, and the back panel 2T above the outer shoulder portion 31 of the wafer module 3, so that the frame 7 is on the insulating body 1 and the The top surface of the wafer module corresponds to the hollow hole 25 of the frame 2. Therefore, the wafer module 3 is carried and blocked in the socket connector. The top surface of the wafer module 3 is coated with a layer of thermal grease (not shown). a 12 M294748 heat is placed on the docking connector and contacts the heat spread paste applied to the top surface of the wafer module 3 via the hollow hole 25 to press the wafer mold, and The heat dissipation effect of the wafer module 3 is provided. The conductive contact of the bottom surface of the chip module can electrically contact the contact portion 161 of the socket connector conductively connected to the circuit board 6 to be electrically connected to the circuit board via the conductive terminals 6. When the heat release of the child is taken up, the frame 2 can block the wafer module 3 to prevent the 5 chip module 3 from being picked up as the heat sink is also removed. The leading edge of the w baffle 2 1 is further provided with a rib 2 1 1 extending 'up' to strengthen the strength of the frame 2. The trailing edge of the front baffle 21 is further provided with a rib 2 1 2 extending upward to strengthen the strength of the frame 2. The inner edge of at least one of the side fences 2 2 is further provided with a rib $2 1 extending upward to strengthen the strength of the frame 2. The outer edge of at least one of the side fences 2 2 is further provided with a rib 2 2 2 extending downward to enhance the strength of the frame 2. The leading edge of the tailgate 23 is further provided with a rib 2 31 extending upward to strengthen the strength of the frame 2. Thus, the frame body 2 can more reliably block the wafer module 3 on the insulative housing 1. When the wafer module 3 is to be removed from the socket connector, the free ends of the latch arms 20 are post-pressed and moved up such that the hooks 2 〇 1 pass through the slots 1 1 3, respectively. Thus, the resilient latching device is released so that the front portion of the frame 2 can be released to disengage the fastening means in front of the insulative housing i. Then, the wafer module 3 can be taken out. Referring to Figures 5 and 6, the socket connector of the present invention further includes a suction plate 4. The suction plate 4 has at least two hook arms 41 respectively located on opposite sides of the suction plate 4 and extending downward. The insulation 13 M294748 ΐ ί ί ί step is provided with at least two sentence slots 121 respectively located on opposite sides of the insulating 丄 2 \ ! Each of the hook arms 41 is hooked to the corresponding hook groove 2 such that the suction plate 4 is coupled to the insulative housing 1. The crying plate 4 is for the suction of a suction device, so that the socket connection is quickly transported to the circuit board. Thus, the socket connector is soldered to the circuit board. In addition, the socket is detached. After the board, the pickup board 4 can be easily disassembled: see the seventh embodiment and the eighth figure as the second embodiment of the creation. The difference between the example and the first embodiment is that the casing of the insulative body factory is provided with the elastic locking device and the elastic holding device. In this embodiment, the fastening device has two protrusions i 1 1 -, =112' and - notch I", and the insulating body J °/hig recess 114 is located between the bumps 111. The side two] are respectively formed on the bumps. The opposite inner arm elastic locking device has an extension plate 27 and two latching springs. The upper end of the extension plate 2 7 is connected to the other 2 of the front baffle 2 1 . The rear end of each of the latch arms 20/ is coupled to a corresponding one side of the lower end of the extension plate 27/ and extends forward. Each latch arm 2 〇 / front / is - free end. 1 and the elastic holding device has two elastic claw plates 26/, and the γ-shaped claw plates 26/ are respectively located at two opposite sides of the frame body 2/[== Figure 7 and the first figure The elastic claw plates 26 fly over the upper end S to the side support plates 2 2 . Each of the elastic claw plates 26 has a lower end that is a free end 14 M294748 and is provided with an inwardly bent hook portion m. When the chip module 3 is mounted to the socket connector, first, the top of the wafer module 3 is received in the hollow hole 25 of the frame 2 /. = The elastic claw plate 2 6 is hooked on the opposite sides of the crystal group 3, so that the elastic holding device of the frame 2 elastically holds the remote chip module 3 In the frame 2 > Next, the front portion of the frame 2 / is covered to the portion of the insulative housing i / , and the free ends of the latching elastic arms 2 are respectively hooked to the insulation by the free ends of the seek latches # 2 0 Under the blocking portion 1 i 2 > of the fastening device of the main body, and the elasticity is inside the notch 1 14 . The casing 2 carries the wafer module 3 to the insulating body, such that the mounting portion i of the insulating body factory carries the wafer module 3 = thereon, and the wafer module 3 is positioned for the mounting Range of part i = = When the wafer module 3 is taken out from the socket connector, the free ends of the latches #20 are relatively internally pressed and moved inward. Thus, the buckle is released, so that the front portion of the frame 2 can be released to disengage from the fastening body of the insulative housing 1, the front portion. Then, it can be taken out. The door, and d, as shown in the ninth figure, is the third embodiment of the creation. The difference between the third embodiment and the second embodiment is the elastic holding device of the frame 2, and in the present embodiment, each of the elastic claw plates 2 of the seventh figure has at least one opening 2 6 2 > Form at least two elastic claws ^ M294748 3 >. The elasticity of the elastic claw piece 2 6 3 / of the third embodiment is better than that of the elastic claw plate 2 6 of the second embodiment. Each of the elastic claw pieces 2 6 3 is lower than a free end and is provided with an inwardly bent hook portion 2 6 4 -. The hook portions 2 6 4 of the elastic claw pieces 2 6 3 ' are respectively hooked on the opposite sides of the wafer module 3, so that the elastic holding device of the frame 2 elastically holds the wafer mold Group 3 is in the frame 2 -.
2參閱第十圖所示,為本創作第四實施例。第四實施 例和第二實施例的差異為該框體2〃的彈性固持裝置。 本實施例中,該彈性固持裝置具有一彈性厣臂2 『。,該彈性壓臂2 立於該後擋板2 3。該彈^壓臂 2 6夕的自由端伸向該中空孔2 5且設有一壓條2 6工" 延伸,向上。如此,該前擋板2 1的肋條2 1 2和該壓條2 =1〃 ^別位於該中空孔2 5的二個相對侧邊。該彈性壓 ^ 6❺壓條2 6 1 7/緊推該晶片模組3接觸該前擔板 的肋條212,使得該彈性壓臂2固持該晶片模 、、且3的頂部於該中空孔2 5中。 例。ί芩,第十一圖和第十二圖所示,為本創作第五實施 』第五貝靶例之絕緣本體5的前部具有一彈性鎖扣裝 壯。該彈性鎖扣$置取代第一實施例之絕緣本冑工的扣接 衣置和框體2的彈性鎖扣裝置。 ^ 貝知例中,邊彈性鎖扣裝置形成於該前牆1 1。該 鏤空部 二有一鎖扣彈臂5 5、一連結部5 6、和一 鎖Z彈臂7 °该連結部5 6位於該前牆1 1的前侧,且該 5平山5 5的下端連接於該連結部5 Θ。該鎖扣彈臂5 、而為自由端且具有一勾部5 5 1。該鏤空部5 7 16 M294748 形成於該鏆扣彈臂5 5之卞經, 後側。該彈性鎖扣裝置進胃^部^的 牆1 1的前側,且該按壓部5 8連接二壓部5 8位於該前 下端。 丨b 8連接於該鎖扣彈臂5 5的 田…曰u ?安裝至該插座連接 第-實施韻述,脑體2_性目Μ = 晶片模組3於該框體2中,使得該晶片模組3和該框^ 結合在-起,從而使得該晶片模組3的穩定性提昇。 2次’該框體2的前部蓋合至該絕緣本體5的前部, 且該前擋板2 1推動該鎖扣彈臂5 5的自由端前移。2 See the tenth figure, which is the fourth embodiment of the present creation. The difference between the fourth embodiment and the second embodiment is the elastic holding device of the frame 2〃. In this embodiment, the elastic holding device has an elastic arm 2 ′. The elastic pressing arm 2 stands on the tailgate 23. The free end of the elastic arm 2 6 extends toward the hollow hole 25 and is provided with a bead 2 &6; extension, upward. Thus, the rib 2 2 2 of the front baffle 21 and the bead 2 =1 are located on opposite sides of the hollow hole 25. The elastic pressing member 2 6 17 / presses the wafer module 3 to contact the rib 212 of the front plate, so that the elastic pressing arm 2 holds the wafer mold, and the top of the 3 is in the hollow hole 25 . example. In the eleventh and twelfth drawings, the front portion of the insulative housing 5 of the fifth embodiment of the present invention has a resilient latch. The elastic lock buckle is disposed in place of the insulation of the first embodiment and the elastic lock device of the frame 2. ^ In the example of the case, the edge elastic locking device is formed on the front wall 11. The hollow portion 2 has a latching elastic arm 5 5, a connecting portion 56, and a lock Z elastic arm 7°. The connecting portion 56 is located at the front side of the front wall 11 and the lower end of the 5 flat mountain 5 5 is connected. At the joint portion 5 Θ. The latching arm 5 is a free end and has a hook portion 55 1 . The hollow portion 5 7 16 M294748 is formed on the tweeting and rear side of the snap elastic arm 5 5 . The elastic locking device is inserted into the front side of the wall 11 of the stomach portion, and the pressing portion 58 is connected to the second pressing portion 58 at the front lower end.丨b 8 is connected to the field of the latching arm 5 5 安装u 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑 脑The wafer module 3 and the frame are combined to improve the stability of the wafer module 3. The front portion of the frame 2 is attached to the front portion of the insulative housing 5, and the front bezel 21 pushes the free end of the latching arm 5 5 forward.
?妾著,該鎖扣彈臂5 5的自由端彈性復位,使得該鎖 扣彈臂5 5之自由端的勾部5 5 i勾接於該框體2之前 撞板2 1之上。如此,該絕緣本體5之前部_性鎖扣裝 置可釋放地鎖扣於該框體2的前部。 田浴人自滅插座連接為取出該晶片模組3時,該按壓部 5 8被下壓以扭轉该連結部5 6,使得該勾部5 5 1向前 移動,或者,該勾部5 5 1被直接前壓以向前移動,從而 使得該前擋板2 1被釋放。如此,該框體2的前部能夠被 釋放以脫離該絕緣本體5之前部的彈性鎖扣裝置。接著, 該晶片模組3能夠被取出。 請參閱第十三圖所示,為本創作第六實施例。第六實 知例和第五實施例的差異為該框體2 /的彈性固持裝 置。第六實施例之框體2 —的彈性固持裝置係如第二實施 例之框體2 >的彈性固持裝置。 睛參閱第十四圖所示,為本創作第七實施例。第七實 17 M294748 施例和第五實施例的差異為該福體 置。第七貫施例之框體2 /的彈性固持裝置係如第三實施 例之框體2 >的彈性固持裝置。 、 請^閱第十五圖所示,為本創作第八實施例。第八實 施例和第七實施例的差異為該絕緣本體5 /的彈性鎖扣 裝置及其位置。 义本實施财,言亥彈性鎖扣裝置形成於該等側牆工2的 刖部。該彈性鎖扣裝置具有二個鎖扣彈臂5 5、二個連社The free end of the latching arm 5 5 is elastically reset, so that the hook portion 5 5 i of the free end of the latching arm 5 5 is hooked on the striker 2 1 before the frame 2 . As such, the front portion of the insulative housing 5 is releasably latched to the front of the frame 2. When the Tamken self-extinguishing socket is connected to take out the wafer module 3, the pressing portion 58 is pressed down to twist the connecting portion 5 6 so that the hook portion 55 1 moves forward, or the hook portion 5 5 1 It is directly pressed forward to move forward, so that the front bezel 21 is released. Thus, the front portion of the frame 2 can be released to disengage the elastic latching device at the front of the insulative housing 5. Then, the wafer module 3 can be taken out. Please refer to the thirteenth figure, which is the sixth embodiment of the present creation. The difference between the sixth embodiment and the fifth embodiment is the elastic holding device of the frame 2 /. The elastic holding device of the frame 2 of the sixth embodiment is an elastic holding device of the frame 2 > of the second embodiment. The eyepiece is shown in Fig. 14, which is the seventh embodiment of the creation. The seventh embodiment 17 M294748 The difference between the embodiment and the fifth embodiment is the object. The elastic holding device of the frame 2 of the seventh embodiment is an elastic holding device of the frame 2 > of the third embodiment. Please refer to the fifteenth figure, which is the eighth embodiment of the present creation. The difference between the eighth embodiment and the seventh embodiment is the elastic locking device of the insulative housing 5 / and its position. The Yishen implements the money, and the Yanhai elastic locking device is formed on the crotch portion of the side wall workers 2. The elastic locking device has two locking elastic arms 5 5 and two connected companies
=5 6、和二個鏤空部5 7。_連結部5 6㈣位於^ 寻側牆1 2的外側,且該等鎖扣彈臂5 5的下端分別連接 於該等連結部5 6。各鎖扣彈臂5 5的上端為-自由端且 二有勾彳5 5 1。该等鏤空部5 7分別形成於該等鎖扣 弹臂5 5之下端的内側和該等連結部5 6的内側。該彈性 鎖扣裝置進一步具有二個按壓部5 8分別位於該等側牆 1 2的外側,且該等按壓部5 8分別連接於該等鎖扣$ 5 5的下端。 、胃= 5 6, and two hollows 5 7 . The connecting portion 5 6 (4) is located outside the side wall 1 2, and the lower ends of the latching arms 5 5 are respectively connected to the connecting portions 56. The upper end of each latching arm 5 5 is a free end and has a hook 5 5 1 . The hollow portions 57 are formed on the inner side of the lower ends of the latching arms 5 5 and the inner sides of the connecting portions 56, respectively. The elastic locking device further has two pressing portions 58 respectively located outside the side walls 12, and the pressing portions 58 are respectively connected to the lower ends of the latches $5 5 . ,stomach
器時’首先,如 <的彈性固持裝 中。 當該晶片模組3被安裝至該插座連接 第二貫施例和第三實施例所述,該框體2 置彈性地固持該晶片模組3於該框體2 > 立其^欠,該框體2 /的前部蓋合至該絕緣本體5 >的前 =,且該等侧擋板2 2分別推動該等鎖扣彈臂5 5的自 端相對外移。 錯4 Ϊί ’料鎖扣料5 5的自由端彈性復位,使得各 、头扣弹’ 5 5之自由端的勾部5 5 1勾接於一相庫…丨 擋板22之上。 」接力相應的側 18 M294748 當欲自該猜座運接器取迅該晶I 部5 8被下壓以扭轉該等連結部5 6,使得該等勾部5 5 1向外私動’或者,該等勾部5 5 1直接被外壓以向外移 動,,從而使得該等侧擋板2 2被釋放。如此,該框體2 > 的前部能夠被釋放以脫離該絕緣本體5 -之前部的彈性 鎖扣裝置。接著,該晶片模組3能夠被取出。 ’第一實施例至第八實施例的框體可為一金屬材質所 製成或一塑膠材質所製成。When the device is first, the elastic holding device such as < When the wafer module 3 is mounted to the socket connection and the second embodiment and the third embodiment, the frame 2 elastically holds the wafer module 3 in the frame 2 > The front portion of the frame 2 / is covered to the front of the insulative housing 5 > and the side baffles 2 2 respectively push the self-ends of the latching arms 5 5 relatively outward. The free end of the material lock fastener 5 5 is elastically reset, so that the hook portion 55 1 of the free end of each of the head buckles 5 5 is hooked on a baffle 22 . The corresponding side of the relay 18 M294748 is intended to be taken from the guessing dock. The crystal portion 5 is pressed down to twist the joints 5 6 such that the hooks 5 5 1 are privately moved 'or The hooks 55 1 are directly pressed externally to move outward, so that the side fences 2 2 are released. Thus, the front portion of the frame 2 > can be released to disengage the elastic locking device of the front portion of the insulative housing 5. Then, the wafer module 3 can be taken out. The frame of the first to eighth embodiments may be made of a metal material or a plastic material.
凊芩閱第十六圖所示,為本創作第九實施例。第九實 施例和第一實施例的差異為該絕緣本體i的扣接裝置和 該框體2的彈性鎖扣裝置。此外,該框體2的前擋板2 1、侧叔板2 2、後擋板2 3、樞接片2 4和彈性夾臂2 6為一金屬材質所製成,且該框體2的彈性鎖扣裝置 塑膠材質所製成。 # 本實施例中,該扣接裝置具有—卡塊丄i 5位於該絕 緣本體1的前側。該彈性鎖扣裝置係模内置入成型 (inSert-molding)於該前擋板2丄。該彈性鎖扣裝置呈 一固持部2 7 1、一鎖扣彈臂2 7 2、一連結$ ^ 和-鏤空部2 7 4。該固持部2 7丄結合於;前擋板2 1。該連結部2 7 3連接於該固持部2 7 1,且該鎖扣彈 臂2 7 2的上端連接於該連結部2 7 3。該鎖扣彈臂2 7 2的下端為-自由端且具有一勾部2 7 5。該鏤 4形成於該鎖扣彈臂2 7 2之上端的後側和該連 7 3的後側。該彈性鎖扣裝置進—步具有_按屏部^ 位於該前擋板2!的前側,且該按壓部2 7 6連接於該= 19 M294748 Ψ 2 7 2 0¾ ± ^ 〇 實施例之彈性鎖扣裝置,且該鎖扣彈臂2 ”之自 =部Η 5、勾接於該卡塊丄15。此外,在另—實施例 ’ 5亥译性鎖扣裝置餘内置人成型於該_板2丄且進 :步包覆該前擋板2 1、該等側擋板2 2和該後擔板 荨。 〔創作特點及優點〕 是以,透過本創作之插座連接器,具有如下述之特點·· 中,使:早:生固锊衣置先仃固持該晶片模組於該框體 曰:::曰:片模組的穩定性提昇。接著,該框體载運該 曰曰片m該絕緣本體±,使得該日日日#频被 財體上的準確性提昇,且避免該晶片模組在安 而知及該插座連接器的導電端子。 σ 拖雜f纟創作之插座連接器僅須以樞接於該絕緣本體的 錢二擔亡=片模組於該絕緣本體上。因此,當該插 =置少於習知的插座連接器的鎖扣組件所吸收的熱 二曰口此,㈣緣本體不易受熱變形,且該框 熱!不會影響其他電子元件焊接於該電路板i。 3二該框體的材料需求少於習知的插座連接器的鎖扣 、、件。因此,該插座連接器的製造成本降低。 =所述’僅為本創作之具體實施例之詳細說 技^式,亚非用以限制本創作及本創作之特徵,舉 錢中具有通常知識者,沿依本創作 ; 政修飾或變化,皆應包含於本創作之專利 勺寺 20 M294748 【圖式簡草說明】 圖係本創作插座連接器第―實施例和—日日日(模組之 立體分解圖。 第-A圖係'本創作插座連接器的導電端子另一實施例之 立體圖。 第二圖係本創作插座連接器第-實施例和—晶片模組之 立體組合圖’其中該晶片模組被固持於該插座連接 器的框體中。 籲第三圖係本創作插座連接器第—實施例和—晶片模組之 " 另一立體組合圖。 係第三圖之4 —4剖視圖,其巾該插錢接器之框 體以其樞孔樞接於該插座連接器之絕緣本體的凸 轴。 第四A圖係本創作插座連接器第一實施例之剖視圖,其中 該插座連接器之框體以其凸部樞接於該插座連 接器之絕緣本體的凹部。 • 第四B圖係本創作插座連接器第一實施例之剖視圖,其中 口亥插座連接為以其樞接件椹接於該插座連接哭 之框體的樞孔和該插座連接器之絕緣本體的凹 部。 第五圖係本創作插座連接器第一實施例進一步包括一吸 取板之立體分解圖,其中該插座連接器的框體未示 出。 且y、 第六圖係本創作插座連接器第一實施例進一步包括一吸 取板之立體組合圖,其中該插座連接器的框體未示 21 M294748 出。 第七圖係本創作插座連接器第二實施例之立體组合圖。 第八圖係本創作插座連接器第二實施例之另一立體组合 f九圖係本創作插座連接器第三實施例之立體組合圖。 弟十圖係本創作插座連接器第四實施例之另—立體組合 圖。 第十一圖係本創作插座連接器第五實施例和一晶片模組 之立版組合圖,其中該晶片模組被固持於該插座 連接器的框體中。 弟十二圖係本創作插座連接器第五實施例和一晶片模組 之另一立體組合圖。 f十三圖係本創作插座連接器第六實施例之立體組合圖。 =十四圖係本創作插座連接器第七實施例之立體組合圖。 f十五圖係本創作插座連接器第人實施例之立體組合圖。 第十六圖係本創作插座連接器第九實施例之立體組合圖。 【主要元件符號說明】 〔本創作〕 絕緣本體 0 端子槽 凸塊 缺槽 卡塊 勾槽 10 安裳部 前牆 2 4 擋部 凹口 侧牆 22 M294748 後牆 13 凹部 13 絕緣本體 1 / 凸塊 11 凹口 11 框體 2 鎖扣彈臂2 0 前擋板 21 肋條 2 1 肋條 2 2 後擋板 2 3 枢接片 24 凸部 2 4 彈性夾臂2 6 固持部 27 連結部 27 勾部 2 7 框體 鎖扣彈臂2 0 勾爪部 26 彈性爪片2 6 延伸板 2 7 框體 2 〃 凸軸 13 枢接件 14 檔部 11 勾部 2 0 1 肋條 2 11 側擋板 22 肋條 2 2 2 肋條 2 3 1 樞孔 2 4 1 中空孔 25 夹持部 261 鎖扣彈臂2 7 2 鏤空部 274 按壓部 276 彈性爪板2 6 > 開口 2 6 2 勾爪部 264 23 M294748 彈性壓臂2 6 r/ 壓 條 2 6 1 晶片模組 3 外肩部 3 1 吸取板 4 勾臂 4 1 絕緣本體 5 鎖扣彈臂5 5 勾 部 5 5 1 連結部 5 6 鏤 空部 5 7 按壓部 5 8 絕緣本體 5 〆 導電端子 6 焊接部 6 0 接 觸部 6 1 導電端子 6 焊接部 6 0 ^ 接 觸部 6 rReferring to the sixteenth figure, the ninth embodiment of the present invention is shown. The difference between the ninth embodiment and the first embodiment is the fastening device of the insulative housing i and the elastic locking device of the frame 2. In addition, the front baffle 2 1 , the side unshield 2 2 , the rear baffle 23 , the pivoting piece 24 , and the elastic clamping arm 26 of the frame 2 are made of a metal material, and the frame 2 is The elastic locking device is made of plastic material. # In this embodiment, the fastening device has a card block 丄i 5 located on the front side of the insulating body 1. The elastic locking device is insert-molded to the front bezel 2丄. The elastic locking device is a holding portion 273, a locking elastic arm 27.2, a connecting $^ and a hollow portion 274. The holding portion 27 is coupled to the front baffle 21. The connecting portion 273 is connected to the holding portion 273, and the upper end of the latching arm 27.2 is connected to the connecting portion 273. The lower end of the latching arm 27.2 is a free end and has a hook portion 275. The crucible 4 is formed on the rear side of the upper end of the latching elastic arm 273 and the rear side of the ties 7. The elastic locking device further has a _ press screen portion located on the front side of the front bezel 2!, and the pressing portion 276 is connected to the = 19 M294748 Ψ 2 7 2 03⁄4 ± ^ 弹性 elastic lock of the embodiment a buckle device, and the latching arm 2" is hooked to the latch 丄 15. In addition, in another embodiment, the built-in person is formed on the _ plate 2丄 and proceed: step cover the front baffle 2 1 , the side baffle 22 and the rear plate 荨. [Creating Features and Advantages] Therefore, through the socket connector of the present invention, as described below Features ·· 中:::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::: m The insulative body ± makes the day and day frequency increase the accuracy of the financial body, and avoids the chip module being aware of the conductive terminal of the socket connector. σ The device only needs to be pivotally connected to the insulating body to the die body. Therefore, when the plug is less than the lock of the conventional socket connector The heat absorbed by the piece is (4) the edge body is not easily deformed by heat, and the frame is hot! It does not affect the soldering of other electronic components to the circuit board i. 3 The material requirement of the frame is less than the conventional socket connection. The lock of the device, the piece. Therefore, the manufacturing cost of the socket connector is reduced. The above is only a detailed description of the specific embodiment of the present invention, and the Asian and African are used to limit the features of the present creation and the present creation. The person who has the usual knowledge in the money, along the creation of the original; the political modification or change, should be included in the patent spoon of the creation of the 20 M294748 [Illustration of the simple description] Figure of the creation of the socket connector - the embodiment and - day and day (a perspective exploded view of the module. Fig. AA is a perspective view of another embodiment of the conductive terminal of the present socket connector. The second figure is the present embodiment of the socket connector - the wafer die A three-dimensional combination diagram of the group in which the wafer module is held in the frame of the socket connector. The third diagram is the first embodiment of the present invention, and the other embodiments of the wafer socket module. 4 of the third figure 4 is a cross-sectional view of the first embodiment of the present invention, wherein the frame of the plug connector is pivotally connected to the protruding shaft of the insulative housing of the socket connector. The frame of the socket connector is pivotally connected to the recess of the insulative housing of the socket connector with its convex portion. • FIG. 4B is a cross-sectional view of the first embodiment of the present socket connector, wherein the socket is connected with the hub The connector is connected to the socket to connect the pivot hole of the crying frame and the recess of the insulating body of the socket connector. The fifth embodiment is a perspective view of the first embodiment of the present invention, further comprising a suction plate, wherein The frame of the socket connector is not shown. The first embodiment of the socket connector further includes a three-dimensional combination diagram of the suction plate, wherein the frame of the socket connector is not shown as 21 M294748. . The seventh figure is a perspective assembled view of the second embodiment of the present socket connector. The eighth figure is another three-dimensional combination of the second embodiment of the present invention. The nine-figure diagram is a three-dimensional combination diagram of the third embodiment of the present invention. The tenth figure is another three-dimensional combination diagram of the fourth embodiment of the present socket connector. The eleventh drawing is a combination of a fifth embodiment of the present socket connector and a wafer module, wherein the wafer module is held in the frame of the socket connector. Figure 12 is another perspective view of a fifth embodiment of the present socket connector and a wafer module. F13 is a perspective assembled view of the sixth embodiment of the present socket connector. = Fourteen is a three-dimensional combination of the seventh embodiment of the present socket connector. F15 is a three-dimensional combination diagram of the first embodiment of the present socket connector. Fig. 16 is a perspective assembled view of the ninth embodiment of the present socket connector. [Main component symbol description] [This creation] Insulation body 0 Terminal groove bump missing slot block groove 10 Anshang front wall 2 4 Retaining recess side wall 22 M294748 Rear wall 13 Recessed part 13 Insulating body 1 / Bump 11 Notch 11 Frame 2 Locking arm 2 0 Front bezel 21 Rib 2 1 Rib 2 2 Rear baffle 2 3 Pivot piece 24 Protruding part 2 4 Elastic clamping arm 2 6 Retaining part 27 Connecting part 27 Hook part 2 7 Frame lock arm 2 2 Hook part 26 Elastic claw piece 2 6 Extension plate 2 7 Frame 2 〃 Convex shaft 13 Pivot part 14 Stall part 11 Hook part 2 0 1 Rib 2 11 Side baffle 22 Rib 2 2 2 Rib 2 3 1 Pivot hole 2 4 1 Hollow hole 25 Clamping part 261 Locking arm 2 7 2 Hollow part 274 Pressing part 276 Elastic claw plate 2 6 > Opening 2 6 2 Hook part 264 23 M294748 Elastic pressure Arm 2 6 r / bead 2 6 1 wafer module 3 outer shoulder 3 1 suction plate 4 hook arm 4 1 insulative body 5 latch arm 5 5 hook 5 5 1 joint 5 6 hollow 5 7 press 5 8 Insulation body 5 〆 Conductive terminal 6 Welded part 6 0 Contact part 6 1 Conductive terminal 6 Welded part 6 0 ^ contact 6 r
24twenty four
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW95200873U TWM294748U (en) | 2006-01-13 | 2006-01-13 | Socket connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW95200873U TWM294748U (en) | 2006-01-13 | 2006-01-13 | Socket connector |
Publications (1)
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TWM294748U true TWM294748U (en) | 2006-07-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW95200873U TWM294748U (en) | 2006-01-13 | 2006-01-13 | Socket connector |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI399893B (en) * | 2008-04-18 | 2013-06-21 | Fih Hong Kong Ltd | Chip card lock structure |
US9270035B2 (en) | 2013-05-02 | 2016-02-23 | Hon Hai Precision Industry Co., Ltd. | Carrier and carrier assembly used thereof for positioning IC package |
-
2006
- 2006-01-13 TW TW95200873U patent/TWM294748U/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI399893B (en) * | 2008-04-18 | 2013-06-21 | Fih Hong Kong Ltd | Chip card lock structure |
US9270035B2 (en) | 2013-05-02 | 2016-02-23 | Hon Hai Precision Industry Co., Ltd. | Carrier and carrier assembly used thereof for positioning IC package |
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