TWI414108B - 一種用於信號處理的方法和信號處理系統 - Google Patents

一種用於信號處理的方法和信號處理系統 Download PDF

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TWI414108B
TWI414108B TW097148608A TW97148608A TWI414108B TW I414108 B TWI414108 B TW I414108B TW 097148608 A TW097148608 A TW 097148608A TW 97148608 A TW97148608 A TW 97148608A TW I414108 B TWI414108 B TW I414108B
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integrated circuit
package
phased array
array antenna
antenna
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TW200943637A (en
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Ahmadreza Rofougaran
Maryam Rofougaran
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Broadcom Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
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    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
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    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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    • H01Q1/00—Details of, or arrangements associated with, antennas
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    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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Description

一種用於信號處理的方法和信號處理系統
本發明涉及信號處理，更具體地說，涉及一種用於嵌入在積體電路封裝中的相控陣(phased array antenna)天線的方法和系統。
移動通信已經改變了人們的通信方式，而移動電話也已經從奢侈品變成了人們日常生活中不可缺少的一部分。今天，移動設備的使用是由社會環境驅動的，而不受地域和技術的限制。雖然語音通信滿足了人們交流的基本要求，且移動語音通信已進一步滲入了人們的日常生活，但移動通信發展的下一階段是移動互聯網。移動互聯網將成為日常資訊的普通來源，理所當然應實現對這些資料的簡單通用的移動式訪問。
隨著可支援有線或移動通信的電子設備的數量的增加，將這些設備的電源使用效率變得更加高效需要付出大量的努力。例如，大部分通信裝置是移動無線裝置，這種裝置使用電池來工作。另外，在這些移動無線裝置中的發射和/或接收電路常常占在這些裝置中消耗的功率中的大部分。此外，在某些傳統通信系統中，與攜帶型通信裝置中的其他模組相比，發射器和/或接收器通常功率低效的。因此，這些發射器和/或接收器嚴重影響這些移動無線裝置的電池壽命。
比較本發明後續將要結合附圖介紹的系統的各個特徵，現有和傳統技術的其他局限性和弊端對於本領域的普通技術人員來說 是顯而易見的。
本發明提供了一種用於積體電路封裝中相控陣天線的系統和/或方法，結合至少一幅附圖進行了充分的展現和描述，並在權利要求中得到了更完整的闡述。
根據一個方面，一種用於信號處理的方法，該方法包括：通過嵌入到多層積體電路封裝中的相控陣天線發送和/或接收信號。
優選地，用於執行所述發送和/或接收的積體電路通過一個或多個焊料球結合到所述多層積體電路封裝。
優選地，所述積體電路將基準信號和/或所述基準信號的一個或多個相移形式發送到所述相控陣天線。
優選地，一個或多個移相器嵌入到所述多層積體電路封裝中。
優選地，所述方法進一步包括通過一個或多個來自結合到所述多層積體電路封裝中的積體電路的控制信號來控制所述一個或多個移相器的相移。
優選地，所述一個或多個移相器包括平面傳輸線。
優選地，所述相控陣天線包括多個天線元件，且每個天線元件包括用於與關聯的發射器和/或接收器、饋線、1/4波長變換器、和發射部件通信耦聯的相互連接。
優選地，所述發射部件是折合偶極結構。
優選地，所述相控陣天線包括平面傳輸線。
優選地，所述多層積體電路封裝包括一個或多個鐵磁體和/或亞鐵磁材料。
根據一個方面，提供了一種信號處理系統，該系統包括：嵌入到多層積體電路封裝中的相控陣天線，該相控陣天線可用於接收和/或發送信號。
優選地，積體電路通過一個或多個焊料球結合到所述多層積體電路封裝。
優選地，所述積體電路將基準信號和/或所述基準信號的一個或多個相移形式發送到所述相控陣天線。
優選地，一個或多個移相器嵌入到所述多層積體電路封裝中。
優選地，通過一個或多個來自結合到所述多層積體電路封裝中的積體電路的控制信號來控制所述一個或多個移相器的相移。
優選地，所述一個或多個移相器包括平面傳輸線。
優選地，所述相控陣天線包括多個天線元件，且每個天線元件包括用於與關聯的發射器和/或接收器、饋線、1/4波長變換器、和發射部件通信耦聯的相互連接。
優選地，所述發射部件是折合偶極結構。
優選地，所述相控陣天線包括平面傳輸線。
優選地，所述多層積體電路封裝包括一個或多個鐵磁體和/或亞鐵磁材料。
本發明的各種優點、各個方面和創新特徵，以及其中所示例的實施例的細節，將在以下的描述和附圖中進行詳細介紹。
102‧‧‧相控陣天線
104‧‧‧多層積體電路(IC)封裝
106‧‧‧關聯IC(晶片)
108‧‧‧焊料球
1501 ...1504 ‧‧‧天線元件
1521 ...1524 ‧‧‧折疊偶極發射元件(folded dipole radiating element)
1541 ...1544 ‧‧‧1/4波長變換器
1561 ...1564 ‧‧‧饋線
1581 ...1584 ‧‧‧相互連接
200‧‧‧系統
202、210‧‧‧金屬層
203‧‧‧絕緣材料
204a‧‧‧器件
204b‧‧‧傳輸線
206‧‧‧熱環氧樹脂
208‧‧‧表面貼裝器件
252‧‧‧移相器
420‧‧‧無線裝置
421a‧‧‧接收天線
421b‧‧‧發射天線
423a‧‧‧RF接收器
423b‧‧‧RF發射器
425‧‧‧處理器
427‧‧‧記憶體
429‧‧‧數位基帶處理器
圖1A是根據本發明的實施例的積體電路封裝中的相控陣天線的框圖；圖1B是根據本發明的實施例的嵌入在IC封裝中和/或上的相控陣天線的典型框圖；圖2A是根據本發明的實施例的具有嵌入的相控陣天線的多層IC封裝的橫向截面圖；圖2B是根據本發明的實施例的具有嵌入的相控陣天線和移相器的多層IC封裝的橫向截面圖；圖3是根據本發明實施例的使用嵌入在IC封裝中和/或上的相控陣天線發送信號的典型步驟的流程圖；圖4是根據本發明實施例的無線裝置的典型框圖。
本發明的某些實施例可包括用於嵌入在積體電路封裝中和/或上的相控陣天線的方法和系統。在這一點上，嵌入在多層積體電路封裝中和/或上的相控陣天線可用於傳送和/或接收信號。該多層積體電路封裝可包括一個或多個金屬層、絕緣材料、鐵磁材料和/或亞鐵磁材料。在本發明的典型實施例中，該天線還包括一個或多個平面傳輸線。該相控陣天線可包括多個天線元件，且每個天線元件可包括用於與關聯的發射器和/或接收器、饋線(feeder line)、1/4波長變換器(quarter wavelength transformer)、和發射部件(例如折合偶極天線)通信耦聯的相互連接(interconnection)。在本發明的各個典型實施例中，可通過一個或多個焊料球將可用於接收和/或發射信號的IC結合在多層IC封裝上。因此，該IC可將基準信號和所述基準信號的一個或多個相移形式(phase shifted version)發送給該天線。在本發明的一個典型實施例中，可將一個或多個移相器(例如，裝配在平面傳輸線中)嵌入到多層IC封裝中並且可通過與所述多層IC封裝結合的IC中的邏輯、電路和/或代碼控制。
圖1A是根據本發明的實施例的嵌入到積體電路封裝中和/或上的可配置天線(configurable antenna)的示意框圖。參照圖1，示出了多層積體電路(IC)封裝104、關聯IC(“晶片”)106、相控陣天線102和焊料球108。
IC 106可包括合適的邏輯、電路和/或代碼，用於執行與發送和/或接收RF信號相關的一個或多個功能。在這一點上，IC 106可包括圖4示出的系統420的一部份或全部。在這一點上，IC 106可使用嵌入到封裝104中的天線來發送和/或接收RF信號。在這一點上，IC 106可包括合適的邏輯、電路和/或代碼，以採用多個相移信號驅動所述天線102。例如，IC 106可包括發射器和/或接收器。或，該IC 106可包括相移電路並可與單獨的發射器和/或接收器耦聯(例如通過PCB上的一個或多個迹線(trace))。在另一實施 例中，相移元件可裝配在封裝104中，且所述封裝104可用作與各種發射器和/或接收器通信耦聯的“獨立”或“標準”天線。
該IC 106可使用該焊料球108凸點結合或倒裝結合在多層IC封裝104上。在這種方法中，可消除、減少將IC 106連接到多層IC封裝104的引線鍵合(wire bond)，和/或消除引線鍵合引起的無法控制的漏電感。另外，使用焊料球108和熱環氧樹脂206(圖2)可顯著改善IC 106外的熱導。熱環氧樹脂221可以是電絕緣的，但是是導熱的，這樣以允許將熱量導出IC 106到多層積體電路封裝104的更大的熱質。
焊料球108可包括用於在多層IC封裝104和IC 106間提供電、熱和物理接觸的金屬圓球(spherical ball)。在與焊料球108的接觸的製造中，可採用足夠的力壓IC以將金屬球稍微壓扁，並且可在較高的溫度中執行以提供合適的電阻和物理結合強度，該焊料球108可用於在多層IC封裝104和包括圖4示出的無線系統420的其他部件的印刷電路板之間提供電、熱和物理接觸。
多層IC封裝104可包括一個或多個金屬層和/或絕緣材料(各種實施例可包括鐵磁體和/或鐵磁區和/或層)。在這一點上，封裝104可以與IC相似或相同的方法製造。因此，這些層可用於實現電阻、電晶體、電容、傳輸線、開關、天線等電路元件。在這一點上，可將相控陣天線102的多個元件裝配到封裝104中和/或上。因此，所述多個天線元件中的每一個均可發送和/或接收相對與其他發送和/或接收信號發生相移的信號。
該相控陣天線102可包括多個天線元件，其中的每一個都可以是金屬或導體結構，用於向系統420中的收發器423提供RF能量。在本發明的各個實施例中，各個元件可以是矩形的、圓形的和/或其他形狀的。這些元件中的一個或多個可與焊料球108中的一個或多個耦合(通過一個或多個通孔(via)和/或一個或多個金屬層)。在這種方法中，可將信號傳向/出封裝104。示出的典型實施 例中，使用了對應4個相位的4個元件。因此，可通過天線102接收和/或發送基準信號的4個相移表示。圖1B示出了典型的4元件相控陣天線的細節。
在運行中，IC 106中和/或與封裝104耦合的另一裝置(例如，位於PCB上並通過一個或多個焊料球108耦合)中的邏輯、電路和/或代碼可通過相控陣天線發送和/或接收信號。可控制與天線元件耦合的信號的相位調整以獲得期望的發送模式。在該方法中，與另一方向上的靈敏度和/或功率相比，在期望方向中的靈敏度和/或功率可以是增強的。
圖1B是根據本發明的實施例的嵌入在IC封裝中和/或上的相控陣天線的典型框圖。參照圖1B，該相控陣天線可包括4個天線元件1501 ...1504 (在此合稱為150)。每個元件150可包括折疊偶極發射元件(folded dipole radiating element)1521 ...1524 (在此合稱為152)、1/4波長變換器1541 ...1544 (在此合稱為154)、饋線1561 ...1564 (在此合稱為156)和相互連接1581 ...1584 (在此合稱為158)。
該折疊偶極發射元件152可為能通過無線通道/媒介接收和/或發送RF能量的金屬和/或導體材料。在這一點上，折疊偶極發射元件1521 ...1524 可裝配到如平面傳輸線(例如，微波傳輸帶和/或帶狀線)以內。該偶極天線的物理尺寸可影響最佳發送和/或接收頻帶。每個偶極發射元件152可發送相對與其他偶極發射元件152發送的信號發生相移的信號。
該1/4波長變換器154可分別為如平面傳輸線(例如，微波傳輸帶和/或帶狀線)的長度。該1/4波長變換器154的長度和/或寬度取決於傳輸和/或接收頻率以及偶極發射元件152和饋線156的阻抗。在這一點上，該1/4波長變換器154可將饋線156阻抗匹配到折疊偶極發射元件152。
該饋線156可分別為用於耦合到/來自折合偶極發射元件152 的RF信號的平面或共面傳輸線的長度。
該相互連接158可分別為將封裝104上的饋線156耦合到一個或多個焊料球108(該焊料球將封裝104耦合到IC 106)的通孔和/或一個或多個金屬層。
在一個典型實施例中，該相控陣天線102可設計成在60GHz或附近頻率發送和/或接收信號。在這一點上，典型實施例可在約5mm乘5mm的多層積體電路封裝上實現。
圖2A是根據本發明的實施例的具有嵌入的相控陣天線的多層IC封裝的橫向截面圖。參照圖2，示出了包括IC 106和多層IC封裝104的系統200。該多層IC封裝104可包括絕緣材料203和金屬層202、210。儘管僅示出了兩個金屬層，本發明的各個實施例可包括任何數量的金屬層。該相控陣天線102可裝配到金屬層202中，且一個或多個器件，如電阻、電容、感應器、傳輸線、移相器等，可裝配到金屬層210。該IC 106可經焊料球108通信耦合到封裝104，且該封裝104經焊料球108通信耦合到PCB(未示出)。可將一個或多個表面貼裝器件208裝配到封裝104上。熱環氧樹脂(或類似材料)206可壓設在IC 106和封裝104之間。
IC 106可如圖1所示。
焊料球108可如圖1所示。
表面貼裝器件208可包括離散電路元件(discrete circuit element)，如電阻、電容、感應器或二極體。該表面貼裝器件208可焊接到多層IC封裝104上以提供電接觸。在本發明的各個實施例中，可以有或沒有其他表面貼裝器件208耦合到封裝104。
在本發明的典型實施例中，該金屬層202可包括用於描繪圖1A和1B所示的相控陣天線102的堆焊金屬層(deposited metal layer)。在這一點上，在形狀上，該金屬層202可堆積成平面傳輸線(例如微波傳輸帶)，和/或在大小上可以實現折疊偶極發射元件152、1/4波長變換器154和饋線156。
該相互連接158可以一個或多個通孔的形式實現，這些通孔可將相控天線102通信耦合到一個或多個焊料球108。
在本發明的典型實施例中，該金屬層210可包括用於描繪離散器件、波導、傳輸線、相互連接等的堆焊金屬層。例如，該器件204a可為裝配到金屬層210的感應器。此外，該傳輸線204b可將離散器件208耦合到焊料球108。在這種方法中，信號可傳送給/出金屬層202中的天線元件102。
在運行中，IC 106和關聯封裝104可用於發送和/或接收RF信號。該IC 106可通信耦合到嵌入在多層IC封裝104中和/或上的相控陣天線。可通過改變從相控陣天線發送和/或由相控陣天線接收的信號的相位來控制相控陣天線的方向性。例如，可將要傳送的信號調製到RF載波，並且生成該RF載波的4個相移形式。因此，各個信號可通過一個或多個焊料球108耦合到天線102。在這一點上，每個信號可通過相互連接158、饋線156和1/4波長變換器154耦合到對應的折合偶極發射元件152。
圖2B是根據本發明的實施例的具有嵌入的可配置天線和移相器的多層IC封裝的橫向截面圖。參照圖2B，示出了具有與圖2B類似的集成相控陣天線的多層IC封裝104。然而，圖2B與圖2A不同的是，圖2B中的封裝104包括移相器252。在這一點上，從相互連接1581 耦合到IC 106的RF信號可經歷第一相位延時，而從相互連接1583 耦合到IC 106的RF信號可經歷第二相位延時。雖然沒有示出，但是每個耦合到其他相互連接158的信號將經歷相位延時。
圖3是根據本發明實施例的使用嵌入在IC封裝中和/或上的相控陣天線發送信號的典型步驟的流程圖。參照圖3，當基帶信號準備好要發送時，該典型步驟可始於步驟302。在步驟302之後，該典型步驟將進行到步驟304。
在步驟304中，可將該基帶信號調製到載波信號。例如，可 將該基帶信號劃分成同相信號和正交相信號(quadrature phase)，並調製到一對相位積分(phase quadrature)載波信號。在這一點上，本發明的各個實施例可使用60GHz或接近60GHz的載波。接著，可合併該調製信號以生成RF信號。在步驟304之後，該典型步驟將進行到步驟306。
在步驟306，步驟304中生成的該RF信號可劃分成多個相位。例如，在圖1A和1B中示出的實施例中，該信號可分成4個相位。在這一點上，信號的相位調整可用於控制相控陣天線的方向。在步驟306之後，該典型步驟將進行到步驟308。
在步驟308，可放大該RF信號。在這一點上，可採用功率放大器放大該信號，這樣可通過該相控陣天線發送足夠的信號強度。在步驟308之後，該典型步驟將進行到步驟310。
在步驟310，可將該放大信號轉發給相控陣天線以用於發送。在這一點上，可將多個相位轉發給對應數量的發送元件。
與圖3所示的步驟類似的一些步驟也可用于通過集成到IC封裝中的相控陣天線接收信號。
圖4是根據本發明實施例的無線裝置的典型框圖。參照圖4，示出了可包括RF接收器423a、RF發射器423b、數位基帶處理器429、處理器425和記憶體427的無線裝置420。接收天線421a可通信耦合到RF接收器423a。發射天線421b可通信耦合到RF發射器423b。該無線裝置420可在一個系統中運行，如蜂窩網路和/或數位視頻廣播網路。
該天線421a和421b可以是與圖1A中示出的天線102類似或相同的相控陣天線。在這一點上，可通過控制耦合到天線的信號的相位控制天線的方向性。
該RF接收器423a可包括合適的邏輯、電路和/或代碼，用於處理接收到的信號。該RF接收器可在多個頻帶接收RF信號。例如，該RF接收器423a可在極高的頻帶(如60GHz)接收信號。RF 接收器423a可用於接收、濾波、放大、下變頻和/或執行數模轉換。該RF接收器423a可將接收到的RF下變頻。在這一點上，該RF接收器423a可執行接收到的RF信號到基帶的直接下變頻，或可將接收到的RF信號轉換到中頻(IF)。在本發明的各個實施例中，該接收器423a可執行積分下變頻，在此同相分量和正交相分量可並行處理。該接收器423a可用於通過天線421a接收信號，該天線421a可以是如圖1A、1B、2A和2B中所示的嵌入到積體電路封裝上和/或中的相控陣天線。在本發明的各個實施例中，無線裝置420可包括多個接收器423a，並且可支援多個頻帶和/或同一頻帶中的信號的同時接收。
該數位基帶處理器429可包括合適的邏輯、電路和/或代碼以處理和/或操控基帶信號。在這一點上，當存在RF發射器423b時，該數位基帶處理器可處理或操控從RF接收器423a接收到的信號和/或將要傳發給RF發射器423b的信號以發送給網路。該數位基帶處理器429可基於來自處理信號的資訊，將控制和/或反饋資訊提供給RF接收器423a和RF發射器423b。在這一點上，該基帶處理器429可提供一個或多個控制信號用於配置接收到的和/或發送的RF信號的相移。在這一點上，應用到RF信號的該相移可控制相控陣信號的方向性。該數位基帶處理器429可將來自處理後的資訊和/或資料發送到處理器425和/或記憶體427。此外，該數位基帶處理器429可從處理器425接收資訊和/或將資訊發送到記憶體427，處理該資訊並將該資訊轉發到RF發射器423b以發送到網路。
該RF發射器423b可包括合適的邏輯、電路和/或代碼，以處理RF信號，以便發送該RF信號。該發射器423b可用於通過天線421b發送信號，該天線421b可以是裝配在如圖1A、1B、2A和2B中的相控陣天線的積體電路封裝中。該RF發射器423b可用於在多個頻帶中發送RF信號。例如，該RF發射器423b可用于 在極高的頻帶(例如60GHz)發送信號。RF發射器423b支援的各個頻帶可具有用於操控放大和上變頻操作的對應前端電路。在這一點上，當其支援超過一個頻帶時，該RF發射器423b可稱為多頻帶發射器。在本發明的另一實施例中，該無線裝置420可包括多於一個RF發射器423b，其中每個RF發射器423b可以是單頻帶或多頻帶發射器。
在本發明的各個實施例中，該RF發射器423b可執行基帶信號到RF信號的直接上變頻。在某些例子中，該RF發射器423b可在上變頻之前，用於對從數位基帶處理器429接收到的基帶信號分量進行數模轉換。在其他的例子中，該RF發射器423b可接收類比形式的基帶信號分量。
該處理器425可包括合適的邏輯、電路和/或代碼，用於控制和/或用於無線裝置420的資料處理操作。該處理器425可用於控制至少一部分RF接收器423a、RF發射器423b、數位基帶處理器429和/或記憶體427。在這一點上，該處理器425可生成至少一個用於控制該無線裝置420中的操作的信號。在這一點上，該基帶處理器429可提供一個或多個用於控制通過相控陣天線421a和421b發送和/或接收的信號的相位。該處理器425可用於執行可由該無線裝置420使用的應用。例如，該處理器425可執行那些可顯示可通過無線裝置420中的蜂窩傳輸信號接收到的內容和/或與之交互的應用。
該記憶體427可包括合適的邏輯、電路和/或代碼，用於存儲由無線裝置420使用的資料和/或其他資訊。例如，記憶體427可用於存儲數位基帶處理器429和/或處理器425生成的處理後的資料。該記憶體427可用於存儲資訊，如可用於控制無線裝置420中至少一個模組的操作的配置資訊。例如，該記憶體427可包括對於控制通過天線421a和421b接收和/或發送的信號相位來說必要的資訊。在這一點上，記憶體可存儲用於配置一個或多個移相 器的控制和/或配置資訊。
本發明提供了用於積體電路封裝中可重置天線的方法和系統。在這一點上，一種嵌入多層積體電路(IC)封裝(例如，104)中的相控陣天線(例如，102)可用於發送和/或接收信號。該多層積體電路封裝可包括一個或多個金屬層(例如，202和210)、絕緣材料(例如，203)、鐵磁體和/或亞鐵磁材料。在本發明的一個典型實施例中，該天線可包括一個或多個平面傳輸線。該相控陣天線可包括多個天線元件(例如，150)，且各個天線元件可包括用於與關聯的發射器和/或接收器、饋線(例如，156)、1/4波長變換器(例如，154)、和發射部件(例如折疊偶極天線152)通信耦聯的相互連接(例如，158)。在本發明的各個典型實施例中，可通過一個或多個焊料球(例如，211)將可用於接收和/或發射信號的IC(例如，106)結合在多層IC封裝上。因此，該IC可將基準信號和所述基準信號的一個或多個相移形式(phase shifted version)發送給該天線。在本發明的一個典型實施例中，可將一個或多個移相器(例如，256)(例如，裝配在平面傳輸線中)嵌入到多層IC封裝中並且可通過與所述多層IC封裝結合的IC中的邏輯、電路和/或代碼控制。
本發明的又一實施例可提供一種電腦可讀的資訊存儲方式。存儲資訊在其上後，一個至少包含一個可被儀器執行的代碼段的電腦程式由此可控制儀器運行以上步驟，用於上述積體電路封裝中的相控陣天線。
因此，本發明可以通過硬體、軟體，或者軟、硬體結合來實現。本發明可以在至少一個電腦系統中以集中方式實現，或者由分佈在幾個互連的電腦系統中的不同部分以分散方式實現。任何可以實現方法的電腦系統或其他設備都是可適用的。常用軟硬體的結合可以是安裝有電腦程式的通用電腦系統，通過安裝和執行程式控制電腦系統，使其按方法運行。
本發明還可以通過電腦程式產品進行實施，套裝程式含能夠 實現本發明方法的全部特徵，當其安裝到電腦系統中時，可以實現本發明的方法。本文件中的電腦程式所指的是：可以採用任何程式語言、代碼或符號編寫的一組指令的任何運算式，該指令組使系統具有資訊處理能力，以直接實現特定功能，或在進行下述一個或兩個步驟之後實現特定功能：a)轉換成其他語言、編碼或符號；b)以不同的格式再現。
雖然本發明是通過具體實施例進行說明的，本領域技術人員應當明白，在不脫離本發明範圍的情況下，還可以對本發明進行各種變換及等同替代。另外，針對特定情形或材料，可以對本發明做各種修改，而不脫離本發明的範圍。因此，本發明不局限於所公開的具體實施例，而應當包括落入本發明申請專利範圍內的全部實施方式。
圖3為流程圖，無元件符號說明

Claims (8)

  1. 一種用於信號處理的方法，其特徵在於，所述方法包括：通過嵌入到多層積體電路封裝中的相控陣天線發送和/或接收信號；其中，用於執行所述發送和/或接收的積體電路通過一個或多個焊料球結合到所述多層積體電路封裝。
  2. 如申請專利範圍第1項所述的方法，其中，所述積體電路將基準信號和/或所述基準信號的一個或多個相移形式發送到所述相控陣天線。
  3. 如申請專利範圍第1項所述的方法，其中，一個或多個移相器嵌入到所述多層積體電路封裝中。
  4. 如申請專利範圍第3項所述的方法，其中，所述方法進一步包括通過一個或多個來自結合到所述多層積體電路封裝中的積體電路的控制信號來控制所述一個或多個移相器的相移。
  5. 如申請專利範圍第3項所述的方法，其中，所述一個或多個移相器包括平面傳輸線。
  6. 一種信號處理系統，其特徵在於，所述系統包括：嵌入到多層積體電路封裝中的相控陣天線，該相控陣天線可用於接收和/或發送信號；其中，積體電路通過一個或多個焊料球結合到所述多層積體電路封裝。
  7. 如申請專利範圍第6項所述的系統，其中，所述積體電路將基準信號和/或所述基準信號的一個或多個相移形式發送到所述相控陣天線。
  8. 如申請專利範圍第6項所述的系統，其中，一個或多個移相器嵌入到所述多層積體電路封裝中。
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Families Citing this family (142)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8873585B2 (en) 2006-12-19 2014-10-28 Corning Optical Communications Wireless Ltd Distributed antenna system for MIMO technologies
US7675465B2 (en) 2007-05-22 2010-03-09 Sibeam, Inc. Surface mountable integrated circuit packaging scheme
US8106829B2 (en) 2007-12-12 2012-01-31 Broadcom Corporation Method and system for an integrated antenna and antenna management
US8160498B2 (en) * 2007-12-12 2012-04-17 Broadcom Corporation Method and system for portable data storage with integrated 60 GHz radio
US8270912B2 (en) * 2007-12-12 2012-09-18 Broadcom Corporation Method and system for a transformer in an integrated circuit package
WO2009081376A2 (en) 2007-12-20 2009-07-02 Mobileaccess Networks Ltd. Extending outdoor location based services and applications into enclosed areas
US8064936B2 (en) * 2008-02-28 2011-11-22 Broadcom Corporation Method and system for a multistandard proxy
US8086190B2 (en) * 2008-03-27 2011-12-27 Broadcom Corporation Method and system for reconfigurable devices for multi-frequency coexistence
US8072287B2 (en) * 2008-03-27 2011-12-06 Broadcom Corporation Method and system for configurable differential or single-ended signaling in an integrated circuit
US8198714B2 (en) * 2008-03-28 2012-06-12 Broadcom Corporation Method and system for configuring a transformer embedded in a multi-layer integrated circuit (IC) package
CN102209921B (zh) 2008-10-09 2015-11-25 康宁光缆系统有限公司 具有支持来自光学分路器的输入和输出光纤的适配器面板的光纤终端
EP2178119B1 (en) * 2008-10-20 2018-06-20 QUALCOMM Incorporated Surface mountable integrated circuit package
US8854277B2 (en) 2008-11-19 2014-10-07 Nxp, B.V. Millimetre-wave radio antenna module
US8554136B2 (en) 2008-12-23 2013-10-08 Waveconnex, Inc. Tightly-coupled near-field communication-link connector-replacement chips
CN102396171B (zh) 2009-02-03 2015-09-30 康宁光缆系统有限责任公司 基于光纤的分布式天线系统、组件和用于监视和配置基于光纤的分布式天线系统、组件的相关方法
US9673904B2 (en) 2009-02-03 2017-06-06 Corning Optical Communications LLC Optical fiber-based distributed antenna systems, components, and related methods for calibration thereof
WO2010091004A1 (en) 2009-02-03 2010-08-12 Corning Cable Systems Llc Optical fiber-based distributed antenna systems, components, and related methods for calibration thereof
US8447250B2 (en) 2009-06-09 2013-05-21 Broadcom Corporation Method and system for an integrated voltage controlled oscillator-based transmitter and on-chip power distribution network
US8588686B2 (en) * 2009-06-09 2013-11-19 Broadcom Corporation Method and system for remote power distribution and networking for passive devices
US9590733B2 (en) 2009-07-24 2017-03-07 Corning Optical Communications LLC Location tracking using fiber optic array cables and related systems and methods
WO2011025241A2 (ko) * 2009-08-26 2011-03-03 연세대학교 산학협력단 본딩 와이어 안테나 통신 모듈
EP2494655B1 (de) * 2009-10-29 2018-07-18 Technische Universität Dresden Antennenanordnung zur übertragung von signalen
US8280259B2 (en) 2009-11-13 2012-10-02 Corning Cable Systems Llc Radio-over-fiber (RoF) system for protocol-independent wired and/or wireless communication
US8502735B1 (en) * 2009-11-18 2013-08-06 Ball Aerospace & Technologies Corp. Antenna system with integrated circuit package integrated radiators
US9401745B1 (en) * 2009-12-11 2016-07-26 Micron Technology, Inc. Wireless communication link using near field coupling
US8275265B2 (en) 2010-02-15 2012-09-25 Corning Cable Systems Llc Dynamic cell bonding (DCB) for radio-over-fiber (RoF)-based networks and communication systems and related methods
AU2011232897B2 (en) 2010-03-31 2015-11-05 Corning Optical Communications LLC Localization services in optical fiber-based distributed communications components and systems, and related methods
US8570914B2 (en) 2010-08-09 2013-10-29 Corning Cable Systems Llc Apparatuses, systems, and methods for determining location of a mobile device(s) in a distributed antenna system(s)
US9252874B2 (en) 2010-10-13 2016-02-02 Ccs Technology, Inc Power management for remote antenna units in distributed antenna systems
US9547145B2 (en) 2010-10-19 2017-01-17 Corning Optical Communications LLC Local convergence point for multiple dwelling unit fiber optic distribution network
WO2012129426A2 (en) * 2011-03-24 2012-09-27 Waveconnex, Inc. Integrated circuit with electromagnetic communication
EP2702780A4 (en) 2011-04-29 2014-11-12 Corning Cable Sys Llc SYSTEMS, METHODS AND DEVICES FOR INCREASING HIGH-FREQUENCY (HF) PERFORMANCE IN DISTRIBUTED ANTENNA SYSTEMS
EP2702710A4 (en) 2011-04-29 2014-10-29 Corning Cable Sys Llc DETERMINING THE TRANSMISSION DELAY OF COMMUNICATIONS IN DISTRIBUTED ANTENNA SYSTEMS AND CORRESPONDING COMPONENTS, SYSTEMS AND METHODS
WO2012170865A2 (en) 2011-06-09 2012-12-13 Lgc Wireless, Llc Antenna module having integrated radio frequency circuitry
KR20130062717A (ko) * 2011-12-05 2013-06-13 삼성전기주식회사 밀리미터 대역용 알에프아이씨 안테나 패키지 및 이를 포함하는 무선모듈
US9219546B2 (en) 2011-12-12 2015-12-22 Corning Optical Communications LLC Extremely high frequency (EHF) distributed antenna systems, and related components and methods
US10110307B2 (en) 2012-03-02 2018-10-23 Corning Optical Communications LLC Optical network units (ONUs) for high bandwidth connectivity, and related components and methods
EP2832012A1 (en) 2012-03-30 2015-02-04 Corning Optical Communications LLC Reducing location-dependent interference in distributed antenna systems operating in multiple-input, multiple-output (mimo) configuration, and related components, systems, and methods
US9781553B2 (en) 2012-04-24 2017-10-03 Corning Optical Communications LLC Location based services in a distributed communication system, and related components and methods
WO2013162988A1 (en) 2012-04-25 2013-10-31 Corning Cable Systems Llc Distributed antenna system architectures
TWI528468B (zh) 2012-05-30 2016-04-01 國立中山大學 多輸入輸出天線、其天線單元及具有天線之系統封裝
EP2883416A1 (en) 2012-08-07 2015-06-17 Corning Optical Communications Wireless Ltd. Distribution of time-division multiplexed (tdm) management services in a distributed antenna system, and related components, systems, and methods
TWI595715B (zh) 2012-08-10 2017-08-11 奇沙公司 用於極高頻通訊之介電耦接系統
CN104769852B (zh) 2012-09-14 2016-09-21 凯萨股份有限公司 具有虚拟磁滞的无线连接
US9455784B2 (en) 2012-10-31 2016-09-27 Corning Optical Communications Wireless Ltd Deployable wireless infrastructures and methods of deploying wireless infrastructures
CN105308876B (zh) 2012-11-29 2018-06-22 康宁光电通信有限责任公司 分布式天线系统中的远程单元天线结合
US9647758B2 (en) 2012-11-30 2017-05-09 Corning Optical Communications Wireless Ltd Cabling connectivity monitoring and verification
KR20150098645A (ko) 2012-12-17 2015-08-28 키사, 아이엔씨. 모듈식 전자장치
US9158864B2 (en) 2012-12-21 2015-10-13 Corning Optical Communications Wireless Ltd Systems, methods, and devices for documenting a location of installed equipment
US10403511B2 (en) * 2013-01-14 2019-09-03 Intel Corporation Backside redistribution layer patch antenna
EP2974057B1 (en) 2013-03-15 2017-10-04 Keyssa, Inc. Extremely high frequency communication chip
EP2974504B1 (en) 2013-03-15 2018-06-20 Keyssa, Inc. Ehf secure communication device
EP3008828B1 (en) 2013-06-12 2017-08-09 Corning Optical Communications Wireless Ltd. Time-division duplexing (tdd) in distributed communications systems, including distributed antenna systems (dass)
CN105452951B (zh) 2013-06-12 2018-10-19 康宁光电通信无线公司 电压控制式光学定向耦合器
US9247543B2 (en) 2013-07-23 2016-01-26 Corning Optical Communications Wireless Ltd Monitoring non-supported wireless spectrum within coverage areas of distributed antenna systems (DASs)
US9661781B2 (en) 2013-07-31 2017-05-23 Corning Optical Communications Wireless Ltd Remote units for distributed communication systems and related installation methods and apparatuses
US9385810B2 (en) 2013-09-30 2016-07-05 Corning Optical Communications Wireless Ltd Connection mapping in distributed communication systems
US9178635B2 (en) 2014-01-03 2015-11-03 Corning Optical Communications Wireless Ltd Separation of communication signal sub-bands in distributed antenna systems (DASs) to reduce interference
US9775123B2 (en) 2014-03-28 2017-09-26 Corning Optical Communications Wireless Ltd. Individualized gain control of uplink paths in remote units in a distributed antenna system (DAS) based on individual remote unit contribution to combined uplink power
US9357551B2 (en) 2014-05-30 2016-05-31 Corning Optical Communications Wireless Ltd Systems and methods for simultaneous sampling of serial digital data streams from multiple analog-to-digital converters (ADCS), including in distributed antenna systems
US10103447B2 (en) 2014-06-13 2018-10-16 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling structure
US9620841B2 (en) 2014-06-13 2017-04-11 Nxp Usa, Inc. Radio frequency coupling structure
US9917372B2 (en) 2014-06-13 2018-03-13 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling arrangement
US9865600B2 (en) 2014-06-18 2018-01-09 X-Celeprint Limited Printed capacitors
WO2015193433A2 (en) * 2014-06-18 2015-12-23 X-Celeprint Limited Micro assembled high frequency devices and arrays
US9525472B2 (en) 2014-07-30 2016-12-20 Corning Incorporated Reducing location-dependent destructive interference in distributed antenna systems (DASS) operating in multiple-input, multiple-output (MIMO) configuration, and related components, systems, and methods
US9730228B2 (en) 2014-08-29 2017-08-08 Corning Optical Communications Wireless Ltd Individualized gain control of remote uplink band paths in a remote unit in a distributed antenna system (DAS), based on combined uplink power level in the remote unit
US9887449B2 (en) 2014-08-29 2018-02-06 Nxp Usa, Inc. Radio frequency coupling structure and a method of manufacturing thereof
US10225925B2 (en) 2014-08-29 2019-03-05 Nxp Usa, Inc. Radio frequency coupling and transition structure
US9444135B2 (en) * 2014-09-19 2016-09-13 Freescale Semiconductor, Inc. Integrated circuit package
US9602210B2 (en) 2014-09-24 2017-03-21 Corning Optical Communications Wireless Ltd Flexible head-end chassis supporting automatic identification and interconnection of radio interface modules and optical interface modules in an optical fiber-based distributed antenna system (DAS)
US9420542B2 (en) 2014-09-25 2016-08-16 Corning Optical Communications Wireless Ltd System-wide uplink band gain control in a distributed antenna system (DAS), based on per band gain control of remote uplink paths in remote units
US9729267B2 (en) 2014-12-11 2017-08-08 Corning Optical Communications Wireless Ltd Multiplexing two separate optical links with the same wavelength using asymmetric combining and splitting
US10317512B2 (en) * 2014-12-23 2019-06-11 Infineon Technologies Ag RF system with an RFIC and antenna system
US10725150B2 (en) 2014-12-23 2020-07-28 Infineon Technologies Ag System and method for radar
US20160249365A1 (en) 2015-02-19 2016-08-25 Corning Optical Communications Wireless Ltd. Offsetting unwanted downlink interference signals in an uplink path in a distributed antenna system (das)
US9681313B2 (en) 2015-04-15 2017-06-13 Corning Optical Communications Wireless Ltd Optimizing remote antenna unit performance using an alternative data channel
US9667290B2 (en) 2015-04-17 2017-05-30 Apple Inc. Electronic device with millimeter wave antennas
US9948349B2 (en) 2015-07-17 2018-04-17 Corning Optical Communications Wireless Ltd IOT automation and data collection system
US10560214B2 (en) 2015-09-28 2020-02-11 Corning Optical Communications LLC Downlink and uplink communication path switching in a time-division duplex (TDD) distributed antenna system (DAS)
US10790576B2 (en) 2015-12-14 2020-09-29 Commscope Technologies Llc Multi-band base station antennas having multi-layer feed boards
US10452148B2 (en) 2016-01-19 2019-10-22 Infineon Technologies Ag Wearable consumer device
US9648580B1 (en) 2016-03-23 2017-05-09 Corning Optical Communications Wireless Ltd Identifying remote units in a wireless distribution system (WDS) based on assigned unique temporal delay patterns
US10236924B2 (en) 2016-03-31 2019-03-19 Corning Optical Communications Wireless Ltd Reducing out-of-channel noise in a wireless distribution system (WDS)
US10622700B2 (en) 2016-05-18 2020-04-14 X-Celeprint Limited Antenna with micro-transfer-printed circuit element
US10181653B2 (en) 2016-07-21 2019-01-15 Infineon Technologies Ag Radio frequency system for wearable device
US10218407B2 (en) 2016-08-08 2019-02-26 Infineon Technologies Ag Radio frequency system and method for wearable device
WO2018081146A1 (en) * 2016-10-24 2018-05-03 Anokiwave, Inc. Beamforming integrated circuit with rf grounded material ring and integral thermal mass
US10466772B2 (en) 2017-01-09 2019-11-05 Infineon Technologies Ag System and method of gesture detection for a remote device
US10505255B2 (en) 2017-01-30 2019-12-10 Infineon Technologies Ag Radio frequency device packages and methods of formation thereof
US10056922B1 (en) * 2017-06-14 2018-08-21 Infineon Technologies Ag Radio frequency device modules and methods of formation thereof
US10602548B2 (en) 2017-06-22 2020-03-24 Infineon Technologies Ag System and method for gesture sensing
US10944180B2 (en) 2017-07-10 2021-03-09 Viasat, Inc. Phased array antenna
US11394103B2 (en) * 2017-07-18 2022-07-19 Samsung Electro-Mechanics Co., Ltd. Antenna module and manufacturing method thereof
CN107332573B (zh) * 2017-07-25 2021-04-13 Oppo广东移动通信有限公司 一种射频电路、天线装置及电子设备
TWI685144B (zh) * 2017-11-30 2020-02-11 太盟光電科技股份有限公司 多訊號饋入表面黏著式的訊號收發模組
CN108109984A (zh) * 2017-12-07 2018-06-01 中芯长电半导体（江阴）有限公司 半导体封装结构及其制备方法
US10746625B2 (en) 2017-12-22 2020-08-18 Infineon Technologies Ag System and method of monitoring a structural object using a millimeter-wave radar sensor
US10312569B1 (en) 2018-01-05 2019-06-04 Cirocomm Technology Corp. Surface-mounted signal transceiver module with multi-signal feed-in
US11278241B2 (en) 2018-01-16 2022-03-22 Infineon Technologies Ag System and method for vital signal sensing using a millimeter-wave radar sensor
US11346936B2 (en) 2018-01-16 2022-05-31 Infineon Technologies Ag System and method for vital signal sensing using a millimeter-wave radar sensor
US10795012B2 (en) 2018-01-22 2020-10-06 Infineon Technologies Ag System and method for human behavior modelling and power control using a millimeter-wave radar sensor
US10576328B2 (en) 2018-02-06 2020-03-03 Infineon Technologies Ag System and method for contactless sensing on a treadmill
US10705198B2 (en) 2018-03-27 2020-07-07 Infineon Technologies Ag System and method of monitoring an air flow using a millimeter-wave radar sensor
US10775482B2 (en) 2018-04-11 2020-09-15 Infineon Technologies Ag Human detection and identification in a setting using millimeter-wave radar
US10761187B2 (en) 2018-04-11 2020-09-01 Infineon Technologies Ag Liquid detection using millimeter-wave radar sensor
US11189905B2 (en) 2018-04-13 2021-11-30 International Business Machines Corporation Integrated antenna array packaging structures and methods
US10794841B2 (en) 2018-05-07 2020-10-06 Infineon Technologies Ag Composite material structure monitoring system
US10553551B2 (en) * 2018-05-08 2020-02-04 Speedlink Technology Inc. Impedance compensation of flip chip connection for RF communications
US10399393B1 (en) 2018-05-29 2019-09-03 Infineon Technologies Ag Radar sensor system for tire monitoring
US10903567B2 (en) 2018-06-04 2021-01-26 Infineon Technologies Ag Calibrating a phased array system
US11416077B2 (en) 2018-07-19 2022-08-16 Infineon Technologies Ag Gesture detection system and method using a radar sensor
CN110808478A (zh) * 2018-08-06 2020-02-18 康普技术有限责任公司 多层移相器驱动装置以及相关的电调系统和电调天线
US10928501B2 (en) 2018-08-28 2021-02-23 Infineon Technologies Ag Target detection in rainfall and snowfall conditions using mmWave radar
US11183772B2 (en) 2018-09-13 2021-11-23 Infineon Technologies Ag Embedded downlight and radar system
US11125869B2 (en) 2018-10-16 2021-09-21 Infineon Technologies Ag Estimating angle of human target using mmWave radar
US11360185B2 (en) 2018-10-24 2022-06-14 Infineon Technologies Ag Phase coded FMCW radar
US11397239B2 (en) 2018-10-24 2022-07-26 Infineon Technologies Ag Radar sensor FSM low power mode
EP3654053A1 (en) 2018-11-14 2020-05-20 Infineon Technologies AG Package with acoustic sensing device(s) and millimeter wave sensing elements
US10862192B2 (en) * 2018-12-18 2020-12-08 Texas Instruments Incorporated Non-contact test solution for antenna-on-package (AOP) devices using near-field coupled RF loopback paths
US11087115B2 (en) 2019-01-22 2021-08-10 Infineon Technologies Ag User authentication using mm-Wave sensor for automotive radar systems
US11355838B2 (en) 2019-03-18 2022-06-07 Infineon Technologies Ag Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave
US11126885B2 (en) 2019-03-21 2021-09-21 Infineon Technologies Ag Character recognition in air-writing based on network of radars
US11454696B2 (en) 2019-04-05 2022-09-27 Infineon Technologies Ag FMCW radar integration with communication system
US11327167B2 (en) 2019-09-13 2022-05-10 Infineon Technologies Ag Human target tracking system and method
US11774592B2 (en) 2019-09-18 2023-10-03 Infineon Technologies Ag Multimode communication and radar system resource allocation
WO2021079361A1 (en) * 2019-10-21 2021-04-29 Rfisee Ltd Antenna-on-package array
US11435443B2 (en) 2019-10-22 2022-09-06 Infineon Technologies Ag Integration of tracking with classifier in mmwave radar
US11808883B2 (en) 2020-01-31 2023-11-07 Infineon Technologies Ag Synchronization of multiple mmWave devices
US11614516B2 (en) 2020-02-19 2023-03-28 Infineon Technologies Ag Radar vital signal tracking using a Kalman filter
US11585891B2 (en) 2020-04-20 2023-02-21 Infineon Technologies Ag Radar-based vital sign estimation
US11567185B2 (en) 2020-05-05 2023-01-31 Infineon Technologies Ag Radar-based target tracking using motion detection
KR20210156072A (ko) 2020-06-17 2021-12-24 삼성전자주식회사 안테나 패턴을 포함하는 반도체 패키지
US11774553B2 (en) 2020-06-18 2023-10-03 Infineon Technologies Ag Parametric CNN for radar processing
US11704917B2 (en) 2020-07-09 2023-07-18 Infineon Technologies Ag Multi-sensor analysis of food
US11614511B2 (en) 2020-09-17 2023-03-28 Infineon Technologies Ag Radar interference mitigation
US11719787B2 (en) 2020-10-30 2023-08-08 Infineon Technologies Ag Radar-based target set generation
WO2022098342A1 (en) * 2020-11-03 2022-05-12 Intel Corporation Distributed radiohead system
US11719805B2 (en) 2020-11-18 2023-08-08 Infineon Technologies Ag Radar based tracker using empirical mode decomposition (EMD) and invariant feature transform (IFT)
US11662430B2 (en) 2021-03-17 2023-05-30 Infineon Technologies Ag MmWave radar testing
KR20220141013A (ko) * 2021-04-12 2022-10-19 삼성전자주식회사 위상 시프터를 포함하는 안테나 구조 및 이를 포함하는 전자 장치
US11950895B2 (en) 2021-05-28 2024-04-09 Infineon Technologies Ag Radar sensor system for blood pressure sensing, and associated method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1146592A1 (en) * 1998-12-24 2001-10-17 NEC Corporation Phased array antenna and its manufacturing method
US20040150554A1 (en) * 2003-02-05 2004-08-05 Stenger Peter A. Low profile active electronically scanned antenna (AESA) for Ka-band radar systems
US20040263393A1 (en) * 2003-06-26 2004-12-30 Hrl Laboratories, Llc Integrated phased array antenna
US20060033671A1 (en) * 2004-08-11 2006-02-16 Chan Steven S Millimeter wave phased array systems with ring slot radiator element

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0319358A (ja) 1989-06-16 1991-01-28 Matsushita Electron Corp 半導体集積回路
US5015972A (en) * 1989-08-17 1991-05-14 Motorola, Inc. Broadband RF transformer
US5003622A (en) * 1989-09-26 1991-03-26 Astec International Limited Printed circuit transformer
JPH06326510A (ja) * 1992-11-18 1994-11-25 Toshiba Corp ビーム走査アンテナ及びアレーアンテナ
WO1996021255A1 (en) 1995-01-06 1996-07-11 Georgia Tech Research Corporation Curtain antenna
US5861853A (en) * 1997-05-07 1999-01-19 Motorola, Inc. Current balanced balun network with selectable port impedances
US5914873A (en) * 1997-06-30 1999-06-22 Advanced Micro Devices Distributed voltage converter apparatus and method for high power microprocessor with array connections
US5798567A (en) * 1997-08-21 1998-08-25 Hewlett-Packard Company Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors
US6060433A (en) 1998-01-26 2000-05-09 Nz Applied Technologies Corporation Method of making a microwave device having a polycrystalline ferrite substrate
US6573808B1 (en) * 1999-03-12 2003-06-03 Harris Broadband Wireless Access, Inc. Millimeter wave front end
WO2001075775A2 (en) * 2000-04-04 2001-10-11 Contact Technology Systems, Inc. Arc fault current interrupter testing device
US6856225B1 (en) * 2000-05-17 2005-02-15 Xerox Corporation Photolithographically-patterned out-of-plane coil structures and method of making
US7247932B1 (en) * 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
US7710199B2 (en) * 2000-09-12 2010-05-04 Black Sand Technologies, Inc. Method and apparatus for stabilizing RF power amplifiers
WO2002096166A1 (en) * 2001-05-18 2002-11-28 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates
JP4135861B2 (ja) * 2001-10-03 2008-08-20 日本電波工業株式会社 多素子平面アンテナ
WO2003049227A1 (fr) * 2001-12-04 2003-06-12 Matsushita Electric Industrial Co., Ltd. Antenne et appareil comportant ladite antenne
US6801114B2 (en) * 2002-01-23 2004-10-05 Broadcom Corp. Integrated radio having on-chip transformer balun
US6646581B1 (en) * 2002-02-28 2003-11-11 Silicon Laboratories, Inc. Digital-to-analog converter circuit incorporating hybrid sigma-delta modulator circuit
US6809581B2 (en) * 2002-04-23 2004-10-26 Broadcom Corp. Integrated circuit low noise amplifier and applications thereof
US7260424B2 (en) * 2002-05-24 2007-08-21 Schmidt Dominik J Dynamically configured antenna for multiple frequencies and bandwidths
JP2003347844A (ja) * 2002-05-29 2003-12-05 Fujitsu Ltd 電圧制御発振器、ｐｌｌ回路及び半導体装置
US6731248B2 (en) * 2002-06-27 2004-05-04 Harris Corporation High efficiency printed circuit array of log-periodic dipole arrays
US20040010554A1 (en) * 2002-07-15 2004-01-15 Hall John M. Determining a destination e-mail address for sending scanned documents
US7138884B2 (en) * 2002-08-19 2006-11-21 Dsp Group Inc. Circuit package integrating passive radio frequency structure
US7141883B2 (en) * 2002-10-15 2006-11-28 Silicon Laboratories Inc. Integrated circuit package configuration incorporating shielded circuit element structure
KR100498484B1 (ko) * 2003-01-30 2005-07-01 삼성전자주식회사 넓은 주파수 대역에서 일정한 이득을 가지는 전압 제어발진기 및 그 방법
US7151506B2 (en) * 2003-04-11 2006-12-19 Qortek, Inc. Electromagnetic energy coupling mechanism with matrix architecture control
US6856297B1 (en) 2003-08-04 2005-02-15 Harris Corporation Phased array antenna with discrete capacitive coupling and associated methods
DE10336171B3 (de) 2003-08-07 2005-02-10 Technische Universität Braunschweig Carolo-Wilhelmina Multichip-Schaltungsmodul und Verfahren zur Herstellung hierzu
US6933789B2 (en) * 2003-11-13 2005-08-23 Skyworks Solutions, Inc. On-chip VCO calibration
JP4335661B2 (ja) 2003-12-24 2009-09-30 Ｎｅｃエレクトロニクス株式会社 高周波モジュールの製造方法
US7196607B2 (en) * 2004-03-26 2007-03-27 Harris Corporation Embedded toroidal transformers in ceramic substrates
US7119745B2 (en) 2004-06-30 2006-10-10 International Business Machines Corporation Apparatus and method for constructing and packaging printed antenna devices
US7081800B2 (en) * 2004-06-30 2006-07-25 Intel Corporation Package integrated one-quarter wavelength and three-quarter wavelength balun
EP1797617A4 (en) * 2004-10-01 2009-08-12 Rochemont L Pierre De CERAMIC ANTENNA MODULE AND METHODS OF MAKING SAME
US7129784B2 (en) * 2004-10-28 2006-10-31 Broadcom Corporation Multilevel power amplifier architecture using multi-tap transformer
US7469152B2 (en) * 2004-11-30 2008-12-23 The Regents Of The University Of California Method and apparatus for an adaptive multiple-input multiple-output (MIMO) wireless communications systems
US7239291B2 (en) * 2005-01-05 2007-07-03 The Ohio State University Research Foundation Multi-band antenna
US7307341B2 (en) * 2005-01-10 2007-12-11 Ixys Corporation Integrated packaged having magnetic components
US7038625B1 (en) 2005-01-14 2006-05-02 Harris Corporation Array antenna including a monolithic antenna feed assembly and related methods
US7362203B2 (en) * 2005-05-24 2008-04-22 Intel Corporation Multi-tap microelectromechanical inductor
US7728784B2 (en) * 2005-05-31 2010-06-01 Tialinx, Inc. Analog phase shifter
US7834808B2 (en) * 2005-06-29 2010-11-16 Georgia Tech Research Corporation Multilayer electronic component systems and methods of manufacture
EP1913379A2 (en) * 2005-07-26 2008-04-23 Sionex Corporation Ultra compact ion mobility based analyzer apparatus, method, and system
BRPI0707639A2 (pt) * 2006-02-09 2011-05-10 Card Logistics Properties Ltd sistema localizador de proximidade
JP2007234896A (ja) * 2006-03-01 2007-09-13 Toyota Motor Corp 信号伝達装置
US7522122B2 (en) * 2006-03-21 2009-04-21 Broadcom Corporation Planer antenna structure
KR100853670B1 (ko) * 2006-04-03 2008-08-25 (주)에이스안테나 단일 패턴을 갖는 이중편파 광대역 안테나
US8049676B2 (en) * 2006-06-12 2011-11-01 Broadcom Corporation Planer antenna structure
DE102006035204B4 (de) * 2006-07-29 2009-10-15 Atmel Duisburg Gmbh Monolithisch integrierbare Schaltungsanordnung
US7675465B2 (en) 2007-05-22 2010-03-09 Sibeam, Inc. Surface mountable integrated circuit packaging scheme
US7911388B2 (en) * 2007-12-12 2011-03-22 Broadcom Corporation Method and system for configurable antenna in an integrated circuit package
US8270912B2 (en) * 2007-12-12 2012-09-18 Broadcom Corporation Method and system for a transformer in an integrated circuit package
US20090153260A1 (en) * 2007-12-12 2009-06-18 Ahmadreza Rofougaran Method and system for a configurable transformer integrated on chip
US8106829B2 (en) * 2007-12-12 2012-01-31 Broadcom Corporation Method and system for an integrated antenna and antenna management
US8072287B2 (en) * 2008-03-27 2011-12-06 Broadcom Corporation Method and system for configurable differential or single-ended signaling in an integrated circuit
US20090243741A1 (en) * 2008-03-27 2009-10-01 Ahmadreza Rofougaran Method and system for processing signals via an oscillator load embedded in an integrated circuit (ic) package
US8198714B2 (en) * 2008-03-28 2012-06-12 Broadcom Corporation Method and system for configuring a transformer embedded in a multi-layer integrated circuit (IC) package
US8256685B2 (en) * 2009-06-30 2012-09-04 International Business Machines Corporation Compact millimeter wave packages with integrated antennas

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1146592A1 (en) * 1998-12-24 2001-10-17 NEC Corporation Phased array antenna and its manufacturing method
US20040150554A1 (en) * 2003-02-05 2004-08-05 Stenger Peter A. Low profile active electronically scanned antenna (AESA) for Ka-band radar systems
US20040263393A1 (en) * 2003-06-26 2004-12-30 Hrl Laboratories, Llc Integrated phased array antenna
US20060033671A1 (en) * 2004-08-11 2006-02-16 Chan Steven S Millimeter wave phased array systems with ring slot radiator element

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US8199060B2 (en) 2012-06-12
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