TWI411771B - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
- Publication number
- TWI411771B TWI411771B TW095118871A TW95118871A TWI411771B TW I411771 B TWI411771 B TW I411771B TW 095118871 A TW095118871 A TW 095118871A TW 95118871 A TW95118871 A TW 95118871A TW I411771 B TWI411771 B TW I411771B
- Authority
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- Taiwan
- Prior art keywords
- substrate
- hole
- pressure
- region
- saw
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 239000012530 fluid Substances 0.000 claims abstract description 4
- 230000004044 response Effects 0.000 claims description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 25
- 238000000034 method Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/008—Transmitting or indicating the displacement of flexible diaphragms using piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
本發明係關於基於表面聲波(SAW)之壓力感測計,且具體言之係關於此類其中僅該SAW基板之一部分對壓力敏感之感測計。The present invention relates to surface acoustic wave (SAW) based pressure sensors, and in particular to such sensors in which only a portion of the SAW substrate is pressure sensitive.
基於SAW之感測計已為人們習知,其中複數個SAW裝置安裝於一單個基板上,該基板被劃分為應變區域及非應變區域且各SAW安裝於該等區域上以使得能夠監視溫度及壓力,或至少使得能夠取得溫度補償之壓力讀數。舉例而言,GB 0302311.6揭示一SAW壓力及溫度感測計,其中三個SAW安裝於一單個基板上,該等SAW中之一個安裝於該基板上其應變區域隨壓力變化而改變之部分上,同時另外兩個安裝於該基板上與該應變區域完全分離之區域上,來自該三個SAW之資訊使得能夠針對該基板周圍環境計算壓力與溫度讀數。SAW-based sensors are well known in which a plurality of SAW devices are mounted on a single substrate that is divided into strained and unstrained regions and each SAW is mounted on the regions to enable temperature monitoring and The pressure, or at least makes it possible to obtain a temperature compensated pressure reading. For example, GB 0302311.6 discloses a SAW pressure and temperature sensor, wherein three SAWs are mounted on a single substrate, one of the SAWs being mounted on a portion of the substrate whose strain region changes with pressure, While the other two are mounted on the substrate in a region that is completely separated from the strained region, information from the three SAWs enables calculation of pressure and temperature readings for the environment surrounding the substrate.
於GB 0302311.6中,周圍環境中之壓力變化由一壓力敏感膜片與該基板之應變區域之間的機械連接傳送至該基板。隨後將該基板簡單地支撐或構建於該應變區域之週邊處以使周圍區域與該應變區域分離。然而,此方法具有無法完全有效隔離該基板之應變區域之缺陷。In GB 0302311.6, the pressure change in the surrounding environment is transmitted to the substrate by a mechanical connection between a pressure sensitive diaphragm and the strained region of the substrate. The substrate is then simply supported or constructed at the periphery of the strained region to separate the surrounding region from the strained region. However, this method has the drawback of not being able to completely isolate the strained regions of the substrate.
先前技術中(例如於微機電系統(MEMs)矽及石英裝置中)已知之一種可替換方法係使用一對壓力基本不敏感之厚基板,並局部蝕刻該基板之一區域以形成一對壓力敏感之薄膜片區,以將變送元件放置於此膜片區上以偵測壓力並亦放置於未蝕刻之區域上以監視溫度。然後將整個基板暴露于周圍空氣中,但僅該膜片區對周圍氣氛作出響應並因此僅安裝於彼區域上之元件輸出隨壓力而改變。然而,此方法具有蝕刻製程昂貴且消耗時間之缺陷。An alternative method known in the prior art (for example in microelectromechanical systems (MEMs) and quartz devices) is to use a pair of thick substrates that are substantially insensitive to pressure and locally etch a region of the substrate to form a pair of pressure sensitive The film area is such that the transfer element is placed on the diaphragm area to detect pressure and also placed on the unetched area to monitor the temperature. The entire substrate is then exposed to the surrounding air, but only the diaphragm region responds to the surrounding atmosphere and thus the component output mounted only on the other region changes with pressure. However, this method has the drawback that the etching process is expensive and time consuming.
根據本發明,其提供一種基於SAW之壓力感測計,該壓力感測計包括一其中形成有一孔隙之基底及一安裝於該基底上以完全覆蓋該孔隙之基板,該基板黏合至該基底以環繞該孔隙之週邊形成一流體密封,一第一SAW諧振器安裝於該基板上完全位於覆蓋該孔隙之區域內且一第二SAW諧振器安裝於該基板上完全位於一藉由黏合至下部之基底而硬化之區域內。According to the present invention, there is provided a SAW-based pressure sensor comprising a substrate having a void formed therein and a substrate mounted on the substrate to completely cover the aperture, the substrate being bonded to the substrate Forming a fluid seal around the periphery of the aperture, a first SAW resonator mounted on the substrate is completely located in a region covering the aperture, and a second SAW resonator is mounted on the substrate completely in a state by being bonded to the lower portion In the area where the substrate is hardened.
一根據本發明之壓力感測計具有下述優勢:由於該基板覆蓋孔隙之區域有效地充當一膜片,其簡化了該感測計之構造,從而消除了提供一與SAW基板具有機械接觸之單獨膜片之需要,否則將不得不預加載該膜片元件以確保在整個壓力範圍上維持接觸。此外,該基板與其所黏合之基底有效地形成一雙層結構,從而使該基板硬化而離開該孔隙以特別有效地使安裝於其上之SAW與因基板之扭曲而於該基板覆蓋孔隙之區域中出現之應變分離。A pressure sensor according to the present invention has the advantage that since the area of the substrate covering the aperture effectively acts as a diaphragm, it simplifies the construction of the sensor, thereby eliminating the need to provide mechanical contact with the SAW substrate. The need for a separate diaphragm, otherwise the diaphragm element will have to be preloaded to ensure contact is maintained over the entire pressure range. In addition, the substrate and the substrate to which it is bonded effectively form a two-layer structure, thereby hardening the substrate away from the aperture to particularly effectively seal the SAW mounted thereon and the substrate covered by the distortion due to the distortion of the substrate. The strain separation that occurs in the middle.
較佳地,該基板具有統一厚度。由於該基板之剩餘部分因其黏合至基底而硬化,一薄基板之使用對第二諧振器與應變場之分離並不具有任何不利影響。因此,可完全基於覆蓋該孔隙之區域所需之敏感性選擇該基板之厚度。此具有減少加工成本之優勢。Preferably, the substrate has a uniform thickness. Since the remainder of the substrate is hardened by its adhesion to the substrate, the use of a thin substrate does not have any adverse effect on the separation of the second resonator from the strain field. Thus, the thickness of the substrate can be selected based entirely on the sensitivity required to cover the area of the aperture. This has the advantage of reducing processing costs.
較佳地,該基底為一外殼之一部分,該外殼進一步包含多個側壁及一蓋板,該等側壁及蓋板與該基底共同界定一流體密封內室,該流體密封內室可充注一該基板之整個上表面所暴露至之參考壓力;該基板覆蓋孔隙之區域之下表面暴露於該外殼周圍氣氛且該區域響應於該參考壓力與周圍壓力之間的壓力差而扭曲。Preferably, the substrate is a portion of a casing, the casing further comprising a plurality of side walls and a cover plate, the side walls and the cover plate and the substrate together define a fluid-tight inner chamber, the fluid-tight inner chamber being chargeable The reference pressure is exposed to the entire upper surface of the substrate; the lower surface of the substrate covering the area of the aperture is exposed to the atmosphere surrounding the outer casing and the area is distorted in response to a pressure difference between the reference pressure and the ambient pressure.
於一特別佳之實施例中,將一第三SAW諧振器安裝於該基板上完全位於因黏合至下部基底而硬化之區域內,其中該第三SAW諧振器至少向該第二SAW傾斜。以此方式,可使用該諧振器獲得周圍氣氛之壓力及溫度兩者之讀數。In a particularly preferred embodiment, a third SAW resonator is mounted on the substrate in a region that is hardened by bonding to the lower substrate, wherein the third SAW resonator is at least tilted toward the second SAW. In this way, the resonator can be used to obtain readings of both the pressure and temperature of the surrounding atmosphere.
較佳經由該基板(其係一壓電基板)上之匯流排及兩個感測計輸出連接器管腳來連接每一諧振器。Each of the resonators is preferably connected via a bus bar on the substrate (which is a piezoelectric substrate) and two senser output connector pins.
參考圖1、2、3及4,其顯示一封裝1,其具有其中形成有一通孔3之基底2a及側壁2b,其中該基底與該等側壁共同界定一室2c。使用一種適合之黏合方法將一具有統一厚度之基板4固定於該基底之內表面上以完全覆蓋通孔3,從而提供一環繞通孔3之週邊3a之完全密封,設定該通孔3之尺寸以因該基板4之覆蓋區域4a之偏轉而提供最佳應變。將一第一SAW裝置5安裝於該基板4之內表面完全覆蓋該通孔3之區域4a上,以量測因彼覆蓋區域4a之偏轉而引起的應變場中之變化。將另外兩個SAW裝置6、7亦安裝於該基板4之內表面上遠離該通孔3之位置,以將其與第一區域4a中因其之偏轉而出現之應變區域完全分離。該三個SAW5、6、7可經由該基板3上之匯流排(未顯示)連接至感測計輸出連接引腳11。Referring to Figures 1, 2, 3 and 4, there is shown a package 1 having a substrate 2a and a side wall 2b having a through hole 3 formed therein, wherein the substrate and the side walls together define a chamber 2c. A substrate 4 having a uniform thickness is fixed to the inner surface of the substrate by a suitable bonding method to completely cover the through hole 3, thereby providing a complete seal around the periphery 3a of the through hole 3, and the size of the through hole 3 is set. The optimum strain is provided by the deflection of the covered area 4a of the substrate 4. A first SAW device 5 is mounted on the inner surface of the substrate 4 to completely cover the region 4a of the through hole 3 to measure changes in the strain field caused by the deflection of the cover region 4a. The other two SAW devices 6, 7 are also mounted on the inner surface of the substrate 4 away from the through hole 3 to completely separate them from the strain regions appearing in the first region 4a due to their deflection. The three SAWs 5, 6, 7 can be connected to the sense meter output connection pin 11 via a bus bar (not shown) on the substrate 3.
該封裝1之基底2a中之通孔3將該基板之覆蓋區域4a之外表面暴露於周圍空氣中以使其壓力變化導致覆蓋區域4a偏轉或扭曲,其中該扭曲因該基板黏合至該基底2a而僅侷限於覆蓋區域4a。因此,彼等扭曲僅在其上安裝之SAW裝置5之輸出中產生一變化。然而,全部三個SAW裝置5、6、7皆與該室2c內之空氣保持流體連通並因此響應於溫度變化,其中該第二與第三SAW 6、7之輸出中獨立於壓力之變化使得能夠以一熟知方式計算壓力及溫度資訊。The through hole 3 in the substrate 2a of the package 1 exposes the outer surface of the covered area 4a of the substrate to the surrounding air such that the pressure change causes the cover area 4a to deflect or twist, wherein the distortion is adhered to the substrate 2a by the substrate It is limited to the coverage area 4a. Therefore, their distortion produces a change only in the output of the SAW device 5 mounted thereon. However, all three SAW devices 5, 6, 7 are in fluid communication with the air within the chamber 2c and thus in response to temperature changes, wherein the outputs of the second and third SAWs 6, 7 are independent of pressure changes Pressure and temperature information can be calculated in a well known manner.
1...封裝1. . . Package
2a...基底2a. . . Base
2b...側壁2b. . . Side wall
2c...室2c. . . room
3...孔隙(通孔)3. . . Pore (through hole)
3a...週邊3a. . . Surrounding
4...基板4. . . Substrate
4a...覆蓋區域4a. . . Coverage area
5...第一SAW諧振器5. . . First SAW resonator
6...第二SAW諧振器6. . . Second SAW resonator
7...第三SAW諧振器7. . . Third SAW resonator
8...蓋板8. . . Cover
11...感測計輸出連接引腳11. . . Sensor output connection pin
為充分理解本發明,上文已參考附圖以舉例方式闡述了本發明之一實施例,其中:圖1係一根據本發明之壓力感測計組件之俯視圖,其中其蓋板部件已移去;圖2係一圖1之組件的透視圖;圖3係一圖1之組件的俯視圖,其中該蓋板部件處於適當位置;及圖4係一圖1之組件的仰視圖。BRIEF DESCRIPTION OF THE DRAWINGS In order to fully understand the present invention, an embodiment of the invention has been described above by way of example with reference to the accompanying drawings in which: FIG. 1 is a top view of a pressure sensor assembly according to the present invention, wherein the cover member has been removed Figure 2 is a perspective view of the assembly of Figure 1; Figure 3 is a top plan view of the assembly of Figure 1, with the cover member in place; and Figure 4 is a bottom plan view of the assembly of Figure 1.
1...封裝1. . . Package
2a...基底2a. . . Base
3a...週邊3a. . . Surrounding
4a...覆蓋區域4a. . . Coverage area
5...第一SAW諧振器5. . . First SAW resonator
6...第二SAW諧振器6. . . Second SAW resonator
7...第三SAW諧振器7. . . Third SAW resonator
11...感測計輸出連接管腳11. . . Sensor output connector pin
Claims (4)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0510885A GB2426590B (en) | 2005-05-26 | 2005-05-26 | Pressure sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200702649A TW200702649A (en) | 2007-01-16 |
TWI411771B true TWI411771B (en) | 2013-10-11 |
Family
ID=34834774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095118871A TWI411771B (en) | 2005-05-26 | 2006-05-26 | Pressure sensor |
Country Status (7)
Country | Link |
---|---|
US (1) | US7841241B2 (en) |
EP (1) | EP1883796A1 (en) |
JP (1) | JP2008542701A (en) |
CN (1) | CN101248339B (en) |
GB (1) | GB2426590B (en) |
TW (1) | TWI411771B (en) |
WO (1) | WO2006125941A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7601287B2 (en) * | 2005-02-22 | 2009-10-13 | Raytheon Company | Method and apparatus for preform consistency |
JP2009109495A (en) * | 2007-10-29 | 2009-05-21 | Schott Ag | Package for strain sensor |
GB2465977A (en) * | 2008-12-02 | 2010-06-09 | Transense Technologies Plc | Sensor package with connection pins in lid |
CN101625274B (en) * | 2009-08-06 | 2011-01-05 | 浙江大学 | Acoustic surface wave pressure sensor and acoustic surface wave temperature sensor |
CN101620018B (en) * | 2009-08-06 | 2010-10-20 | 浙江大学 | Surface acoustic wave pressure sensor |
FR2965050B1 (en) * | 2010-09-22 | 2013-06-28 | Senseor | LOW COST PRESSURE AND TEMPERATURE SENSOR COMPRISING SAW RESONATORS AND METHOD OF MANUFACTURING SAME |
US8479590B2 (en) * | 2010-11-18 | 2013-07-09 | Honeywell International Inc. | System for monitoring structural assets |
CN102230837A (en) * | 2011-03-30 | 2011-11-02 | 厦门大学 | Temperature compensating microscopic vacuum sensor |
CN102435384B (en) * | 2011-12-02 | 2013-12-11 | 上海交通大学 | Temperature compensation method of SAW (surface acoustic wave) high-temperature pressure sensor based on vertical-horizontal stress adjustment |
CN103499024B (en) * | 2013-10-22 | 2015-11-25 | 天津七一二通信广播有限公司 | A kind of surface acoustic wave pressure sensor for Oil Pipeline Leakage Detecting System |
JP6862794B2 (en) | 2016-11-24 | 2021-04-21 | セイコーエプソン株式会社 | Force detection sensor, force sensor, torque sensor and robot |
TWI668419B (en) * | 2018-03-26 | 2019-08-11 | 創為精密材料股份有限公司 | Pressure sensing module having multiple air chambers inside |
CN112083065A (en) * | 2019-06-12 | 2020-12-15 | 千竣科技有限公司 | Ultrasonic sensing device |
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US20040216526A1 (en) * | 2003-04-30 | 2004-11-04 | Cook James D | Surface acoustic wave pressure sensor with microstructure sensing elements |
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FR2454616A1 (en) * | 1979-04-18 | 1980-11-14 | Thomson Csf | SURFACE ELASTIC WAVE PRESSURE SENSOR AND IGNITION SYSTEM FOR AN INTERNAL COMBUSTION ENGINE USING THE SAME |
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-
2005
- 2005-05-26 GB GB0510885A patent/GB2426590B/en not_active Expired - Fee Related
-
2006
- 2006-04-27 US US11/920,893 patent/US7841241B2/en active Active
- 2006-04-27 WO PCT/GB2006/001546 patent/WO2006125941A1/en not_active Application Discontinuation
- 2006-04-27 CN CN2006800180915A patent/CN101248339B/en not_active Expired - Fee Related
- 2006-04-27 EP EP06726928A patent/EP1883796A1/en not_active Ceased
- 2006-04-27 JP JP2008512896A patent/JP2008542701A/en active Pending
- 2006-05-26 TW TW095118871A patent/TWI411771B/en not_active IP Right Cessation
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US4216401A (en) * | 1978-12-22 | 1980-08-05 | United Technologies Corporation | Surface acoustic wave (SAW) pressure sensor structure |
JPS6180024A (en) * | 1984-09-27 | 1986-04-23 | Shimadzu Corp | Surface elastic wave pressure sensor |
TW524968B (en) * | 2000-08-11 | 2003-03-21 | Mks Instr Inc | Improved capacitive based pressure sensor design |
WO2003081195A1 (en) * | 2002-03-21 | 2003-10-02 | Transense Technologies Plc | Pressure monitor incorporating saw device |
US20040216526A1 (en) * | 2003-04-30 | 2004-11-04 | Cook James D | Surface acoustic wave pressure sensor with microstructure sensing elements |
Also Published As
Publication number | Publication date |
---|---|
CN101248339A (en) | 2008-08-20 |
JP2008542701A (en) | 2008-11-27 |
GB2426590A (en) | 2006-11-29 |
GB0510885D0 (en) | 2005-07-06 |
GB2426590B (en) | 2009-01-14 |
WO2006125941A1 (en) | 2006-11-30 |
US20090100935A1 (en) | 2009-04-23 |
US7841241B2 (en) | 2010-11-30 |
EP1883796A1 (en) | 2008-02-06 |
CN101248339B (en) | 2010-05-19 |
TW200702649A (en) | 2007-01-16 |
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