TWI411743B - - Google Patents

Info

Publication number
TWI411743B
TWI411743B TW100107383A TW100107383A TWI411743B TW I411743 B TWI411743 B TW I411743B TW 100107383 A TW100107383 A TW 100107383A TW 100107383 A TW100107383 A TW 100107383A TW I411743 B TWI411743 B TW I411743B
Authority
TW
Taiwan
Prior art keywords
light
surrounding wall
emitting diode
packaging
colloid
Prior art date
Application number
TW100107383A
Other languages
English (en)
Other versions
TW201237300A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100107383A priority Critical patent/TW201237300A/zh
Priority to CN2012100349155A priority patent/CN102655202A/zh
Publication of TW201237300A publication Critical patent/TW201237300A/zh
Application granted granted Critical
Publication of TWI411743B publication Critical patent/TWI411743B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW100107383A 2011-03-04 2011-03-04 Light-emitting diode lamp and package cup TW201237300A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100107383A TW201237300A (en) 2011-03-04 2011-03-04 Light-emitting diode lamp and package cup
CN2012100349155A CN102655202A (zh) 2011-03-04 2012-02-16 发光二极管灯及封装杯

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100107383A TW201237300A (en) 2011-03-04 2011-03-04 Light-emitting diode lamp and package cup

Publications (2)

Publication Number Publication Date
TW201237300A TW201237300A (en) 2012-09-16
TWI411743B true TWI411743B (zh) 2013-10-11

Family

ID=46730794

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100107383A TW201237300A (en) 2011-03-04 2011-03-04 Light-emitting diode lamp and package cup

Country Status (2)

Country Link
CN (1) CN102655202A (zh)
TW (1) TW201237300A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11538970B2 (en) 2020-03-06 2022-12-27 Lextar Electronics Corporation Light emitting diode device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767282B (zh) * 2018-10-31 2022-06-11 億光電子工業股份有限公司 發光裝置及發光模組
CN109856857B (zh) * 2019-02-28 2021-11-12 重庆京东方光电科技有限公司 一种发光组件、背光源和显示面板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM305437U (en) * 2006-04-24 2007-01-21 Everlight Electronics Co Ltd Light-emitting diode package structure
TWI287879B (en) * 2004-11-02 2007-10-01 Chi Mei Optoelectronics Corp Light emitting device
TW201003975A (en) * 2008-07-11 2010-01-16 Foxconn Tech Co Ltd Light emitting diode

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3910171B2 (ja) * 2003-02-18 2007-04-25 シャープ株式会社 半導体発光装置、その製造方法および電子撮像装置
JP2007324475A (ja) * 2006-06-02 2007-12-13 Sharp Corp 波長変換部材および発光装置
CN2935478Y (zh) * 2006-08-01 2007-08-15 一诠精密工业股份有限公司 具透光性表面黏着发光二极管支架构造
CN101226924A (zh) * 2007-01-18 2008-07-23 葳天科技股份有限公司 侧射型发光二极管

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI287879B (en) * 2004-11-02 2007-10-01 Chi Mei Optoelectronics Corp Light emitting device
TWM305437U (en) * 2006-04-24 2007-01-21 Everlight Electronics Co Ltd Light-emitting diode package structure
TW201003975A (en) * 2008-07-11 2010-01-16 Foxconn Tech Co Ltd Light emitting diode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11538970B2 (en) 2020-03-06 2022-12-27 Lextar Electronics Corporation Light emitting diode device
US11894503B2 (en) 2020-03-06 2024-02-06 Lextar Electronics Corporation Light emitting diode device

Also Published As

Publication number Publication date
TW201237300A (en) 2012-09-16
CN102655202A (zh) 2012-09-05

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