TWI411031B - - Google Patents
Info
- Publication number
- TWI411031B TWI411031B TW98131916A TW98131916A TWI411031B TW I411031 B TWI411031 B TW I411031B TW 98131916 A TW98131916 A TW 98131916A TW 98131916 A TW98131916 A TW 98131916A TW I411031 B TWI411031 B TW I411031B
- Authority
- TW
- Taiwan
- Prior art keywords
- seats
- saw
- guiding component
- crystals
- platform
- Prior art date
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A serial multi-thread saw crystal slicing device includes a plurality of seats, a plurality of guiding components, and a saw wire. The plurality of seats are alternatively allocated adjacent to each other, and each includes a platform. The plurality of guiding components respectively faces each other and corresponds to the platforms of the plurality of the seats. Each guiding component can move relatively with respect to the platform of the corresponded seat so that the guiding component and the platform move close to each other. Each guiding component includes two rollers, and the saw wire extends backward and forward between the two rollers of the guiding component; therefore a plurality of wire nets that respectively face and in parallel to the surfaces of the platforms of the plurality of seats are formed. This invention enables the saw wires to cut the crystals on the plurality of seats each time the saw wires roll; therefore the number of crystals cut for each time can be greatly increased, significantly improving the cutting efficiency of the crystals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98131916A TW201112317A (en) | 2009-09-22 | 2009-09-22 | Serial multi-thread saw crystal slicing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98131916A TW201112317A (en) | 2009-09-22 | 2009-09-22 | Serial multi-thread saw crystal slicing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201112317A TW201112317A (en) | 2011-04-01 |
| TWI411031B true TWI411031B (en) | 2013-10-01 |
Family
ID=44909229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98131916A TW201112317A (en) | 2009-09-22 | 2009-09-22 | Serial multi-thread saw crystal slicing device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201112317A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244037A (en) * | 2017-07-10 | 2019-01-18 | 煜峰投资顾问有限公司 | Brittle material substrate splitting device and splitting method using same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024002329A1 (en) * | 2022-06-30 | 2024-01-04 | 青岛高测科技股份有限公司 | Wire saw device, multi-wire cutting apparatus, and control method for multi-wire cutting apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0716910B1 (en) * | 1994-12-15 | 2002-03-27 | Sharp Kabushiki Kaisha | Multi-wire saw device and slice method using the same |
| US20060249134A1 (en) * | 2003-10-27 | 2006-11-09 | Takafumi Kawasaki | Multi-wire saw |
| WO2009001453A1 (en) * | 2007-06-27 | 2008-12-31 | Mitsubishi Electric Corporation | Multi-wire saw and method of cutting ingot |
-
2009
- 2009-09-22 TW TW98131916A patent/TW201112317A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0716910B1 (en) * | 1994-12-15 | 2002-03-27 | Sharp Kabushiki Kaisha | Multi-wire saw device and slice method using the same |
| US20060249134A1 (en) * | 2003-10-27 | 2006-11-09 | Takafumi Kawasaki | Multi-wire saw |
| WO2009001453A1 (en) * | 2007-06-27 | 2008-12-31 | Mitsubishi Electric Corporation | Multi-wire saw and method of cutting ingot |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244037A (en) * | 2017-07-10 | 2019-01-18 | 煜峰投资顾问有限公司 | Brittle material substrate splitting device and splitting method using same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201112317A (en) | 2011-04-01 |
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