WO2012119684A3 - Metallisation barrier based on aluminium oxide - Google Patents
Metallisation barrier based on aluminium oxide Download PDFInfo
- Publication number
- WO2012119684A3 WO2012119684A3 PCT/EP2012/000590 EP2012000590W WO2012119684A3 WO 2012119684 A3 WO2012119684 A3 WO 2012119684A3 EP 2012000590 W EP2012000590 W EP 2012000590W WO 2012119684 A3 WO2012119684 A3 WO 2012119684A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- aluminium oxide
- barrier based
- layers
- metallisation
- relates
- Prior art date
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title abstract 6
- 230000004888 barrier function Effects 0.000 title abstract 2
- 238000001465 metallisation Methods 0.000 title 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000002161 passivation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1254—Sol or sol-gel processing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
- H01L31/02245—Electrode arrangements specially adapted for back-contact solar cells for metallisation wrap-through [MWT] type solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020137026493A KR20140022012A (en) | 2011-03-08 | 2012-02-09 | Metallisation barrier based on aluminium oxide |
SG2013066592A SG193304A1 (en) | 2011-03-08 | 2012-02-09 | Metallisation barrier based on aluminium oxide |
AU2012224973A AU2012224973B2 (en) | 2011-03-08 | 2012-02-09 | Metallisation barrier based on aluminium oxide |
EP12704685.2A EP2683777A2 (en) | 2011-03-08 | 2012-02-09 | Metallisation barrier based on aluminium oxide |
CA2829269A CA2829269A1 (en) | 2011-03-08 | 2012-02-09 | Aluminium oxide-based metallisation barrier |
US14/004,074 US20130341769A1 (en) | 2011-03-08 | 2012-02-09 | Aluminium oxide-based metallisation barrier |
CN2012800119575A CN103403885A (en) | 2011-03-08 | 2012-02-09 | Metallisation barrier based on aluminium oxide |
JP2013556984A JP6185845B2 (en) | 2011-03-08 | 2012-02-09 | Aluminum oxide-based metal wiring barrier |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11001920.5 | 2011-03-08 | ||
EP11001920 | 2011-03-08 | ||
EP11001921 | 2011-03-08 | ||
EP11001921.3 | 2011-03-08 | ||
EP11006971.3 | 2011-08-26 | ||
EP11006971 | 2011-08-26 | ||
EP11007207.1 | 2011-09-06 | ||
EP11007205 | 2011-09-06 | ||
EP11007207 | 2011-09-06 | ||
EP11007205.5 | 2011-09-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012119684A2 WO2012119684A2 (en) | 2012-09-13 |
WO2012119684A3 true WO2012119684A3 (en) | 2013-01-31 |
Family
ID=45688416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2012/000590 WO2012119684A2 (en) | 2011-03-08 | 2012-02-09 | Metallisation barrier based on aluminium oxide |
Country Status (10)
Country | Link |
---|---|
US (1) | US20130341769A1 (en) |
EP (1) | EP2683777A2 (en) |
JP (1) | JP6185845B2 (en) |
KR (1) | KR20140022012A (en) |
CN (1) | CN103403885A (en) |
AU (1) | AU2012224973B2 (en) |
CA (1) | CA2829269A1 (en) |
SG (1) | SG193304A1 (en) |
TW (1) | TW201241924A (en) |
WO (1) | WO2012119684A2 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011077526A1 (en) * | 2011-06-15 | 2012-12-20 | Robert Bosch Gmbh | Method for producing a semiconductor device |
TWI624958B (en) * | 2012-01-06 | 2018-05-21 | 日商日立化成股份有限公司 | Semiconductor substrate having passivation film and method for producing the same, and photovoltaic cell element and method for producing the same |
JP6285095B2 (en) * | 2012-09-28 | 2018-02-28 | 日立化成株式会社 | Composition for forming semiconductor substrate passivation film, semiconductor substrate with passivation film and method for producing the same, solar cell element and method for producing the same |
JP6107033B2 (en) * | 2012-09-28 | 2017-04-05 | 日立化成株式会社 | Composition for forming semiconductor substrate passivation film, semiconductor substrate with passivation film and method for producing the same, solar cell element and method for producing the same |
JP2014157871A (en) * | 2013-02-14 | 2014-08-28 | Hitachi Chemical Co Ltd | Composition for forming passivation film, semiconductor substrate with passivation film and manufacturing method therefor, and solar cell element and manufacturing method therefor |
KR20160113093A (en) * | 2013-09-16 | 2016-09-28 | 솔렉셀, 인크. | Laser processing for solar cell base and emitter regions |
JP6795877B2 (en) * | 2013-12-25 | 2020-12-02 | 東京応化工業株式会社 | Method of forming a surface coating film and a solar cell having a surface coating film |
WO2016150549A2 (en) * | 2015-03-23 | 2016-09-29 | Merck Patent Gmbh | Printable ink for use as diffusion and alloy barrier for the production of high-efficient crystalline silicone solar cells |
CN107532300A (en) | 2015-04-15 | 2018-01-02 | 默克专利股份有限公司 | The suppression parasitism locally adulterated for silicon wafer spreads and the printable doped dielectric based on collosol and gel |
US20180122640A1 (en) | 2015-04-15 | 2018-05-03 | Merck Patent Gmbh | Screen-printable boron doping paste with simultaneous inhibition of phosphorus diffusion in co-diffusion processes |
CN107532331A (en) * | 2015-04-15 | 2018-01-02 | 默克专利股份有限公司 | The method for preparing solar cell using the printable doped dielectric for suppressing phosphorus diffusion |
MY190562A (en) * | 2016-12-20 | 2022-04-27 | Zhejiang Kaiying New Mat Co Ltd | Interdigitated back contact metal-insulator-semiconductor solar cell with printed oxide tunnel junctions |
MY189222A (en) | 2016-12-20 | 2022-01-31 | Zhejiang Kaiying New Mat Co Ltd | Siloxane-containing solar cell metallization pastes |
CN106611799B (en) * | 2017-01-12 | 2018-02-02 | 合肥海润光伏科技有限公司 | A kind of two-sided crystal silicon solar energy battery of inkjet printing and preparation method thereof |
JP2017195377A (en) * | 2017-05-19 | 2017-10-26 | 日立化成株式会社 | Composition for formation of semiconductor substrate passivation film, semiconductor substrate with passivation film, method for manufacturing the same, solar battery device and method for manufacturing the same |
US10622502B1 (en) | 2019-05-23 | 2020-04-14 | Zhejiang Kaiying New Materials Co., Ltd. | Solar cell edge interconnects |
US10749045B1 (en) | 2019-05-23 | 2020-08-18 | Zhejiang Kaiying New Materials Co., Ltd. | Solar cell side surface interconnects |
CN111834492A (en) * | 2020-07-22 | 2020-10-27 | 常州时创能源股份有限公司 | Preparation method of TOPCon battery |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US4997482A (en) * | 1987-01-02 | 1991-03-05 | Dow Corning Corporation | Coating composition containing hydrolyzed silicate esters and other metal oxide precursors |
US5100764A (en) * | 1989-12-26 | 1992-03-31 | Iowa State University Research Foundation, Inc. | Method of making patterned metal oxide films comprising a sol-gel of metal oxide and a photoactive compound |
US5104636A (en) * | 1988-03-11 | 1992-04-14 | Kaiser Aerospace And Electronics Corporation | Method of making aluminum oxide precursors |
EP0887200A1 (en) * | 1997-06-24 | 1998-12-30 | Oji-Yuka Synthetic Paper Co., Ltd. | Coating composition for recording material and process for producing recording material |
FR2865219A1 (en) * | 2004-01-20 | 2005-07-22 | Peugeot Citroen Automobiles Sa | Coating substrate with metal oxide, e.g. for catalysis, comprises use of colloidal solution applied to substrate in thixotropic form |
GB2425976A (en) * | 2005-05-11 | 2006-11-15 | Univ Sheffield Hallam | Sol-gel derived coating |
US20080090101A1 (en) * | 2006-10-17 | 2008-04-17 | Andreas Klipp | Method of preparing a coating solution and a corresponding use of the coating solution for coating a substrate |
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FR2449474A1 (en) * | 1979-02-26 | 1980-09-19 | Rhone Poulenc Ind | DOUBLE POROSITY ALUMINA BEADS, THEIR PREPARATION PROCESS AND THEIR APPLICATIONS AS CATALYST SUPPORTS |
JPS62122133A (en) * | 1985-11-21 | 1987-06-03 | Nec Corp | Forming method for thin-film through solution coating |
JPH01272183A (en) * | 1988-04-25 | 1989-10-31 | Toshiba Corp | Ceramics circuit board |
US5283369A (en) * | 1992-03-24 | 1994-02-01 | Elf Atochem North America, Inc. | Selective synthesis of mercaptans and catalyst therefor |
DE19621413A1 (en) * | 1996-05-28 | 1997-12-04 | Max Planck Gesellschaft | Liquid phase sintering process for aluminate ceramics |
US5942376A (en) * | 1997-08-14 | 1999-08-24 | Symetrix Corporation | Shelf-stable liquid metal arylketone alcoholate solutions and use thereof in photoinitiated patterning of thin films |
JPH11261090A (en) * | 1998-03-09 | 1999-09-24 | Nisshin Steel Co Ltd | Solar battery substrate and its manufacture |
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JP2001307547A (en) * | 2000-04-25 | 2001-11-02 | Murata Mfg Co Ltd | Conductive composition and printed circuit board using the same |
US7175911B2 (en) * | 2002-09-18 | 2007-02-13 | Toshiba Ceramics Co., Ltd. | Titanium dioxide fine particles and method for producing the same, and method for producing visible light activatable photocatalyst |
JP2004193350A (en) * | 2002-12-11 | 2004-07-08 | Sharp Corp | Solar battery cell and its manufacturing method |
US7026267B2 (en) * | 2002-12-20 | 2006-04-11 | Exxonmobil Chemical Patents Inc. | Molecular sieve catalyst composition, its production and use in conversion processes |
US7250367B2 (en) * | 2004-09-01 | 2007-07-31 | Micron Technology, Inc. | Deposition methods using heteroleptic precursors |
US7381633B2 (en) * | 2005-01-27 | 2008-06-03 | Hewlett-Packard Development Company, L.P. | Method of making a patterned metal oxide film |
EP1763086A1 (en) * | 2005-09-09 | 2007-03-14 | Interuniversitair Micro-Elektronica Centrum | Photovoltaic cell with thick silicon oxide and silicon nitride passivation and fabrication method |
US7517718B2 (en) * | 2006-01-12 | 2009-04-14 | International Business Machines Corporation | Method for fabricating an inorganic nanocomposite |
US20100275982A1 (en) * | 2007-09-04 | 2010-11-04 | Malcolm Abbott | Group iv nanoparticle junctions and devices therefrom |
-
2012
- 2012-02-09 US US14/004,074 patent/US20130341769A1/en not_active Abandoned
- 2012-02-09 SG SG2013066592A patent/SG193304A1/en unknown
- 2012-02-09 AU AU2012224973A patent/AU2012224973B2/en not_active Ceased
- 2012-02-09 EP EP12704685.2A patent/EP2683777A2/en not_active Withdrawn
- 2012-02-09 KR KR1020137026493A patent/KR20140022012A/en not_active Application Discontinuation
- 2012-02-09 CN CN2012800119575A patent/CN103403885A/en active Pending
- 2012-02-09 WO PCT/EP2012/000590 patent/WO2012119684A2/en active Application Filing
- 2012-02-09 JP JP2013556984A patent/JP6185845B2/en not_active Expired - Fee Related
- 2012-02-09 CA CA2829269A patent/CA2829269A1/en not_active Abandoned
- 2012-03-07 TW TW101107736A patent/TW201241924A/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4997482A (en) * | 1987-01-02 | 1991-03-05 | Dow Corning Corporation | Coating composition containing hydrolyzed silicate esters and other metal oxide precursors |
US5104636A (en) * | 1988-03-11 | 1992-04-14 | Kaiser Aerospace And Electronics Corporation | Method of making aluminum oxide precursors |
US5100764A (en) * | 1989-12-26 | 1992-03-31 | Iowa State University Research Foundation, Inc. | Method of making patterned metal oxide films comprising a sol-gel of metal oxide and a photoactive compound |
EP0887200A1 (en) * | 1997-06-24 | 1998-12-30 | Oji-Yuka Synthetic Paper Co., Ltd. | Coating composition for recording material and process for producing recording material |
FR2865219A1 (en) * | 2004-01-20 | 2005-07-22 | Peugeot Citroen Automobiles Sa | Coating substrate with metal oxide, e.g. for catalysis, comprises use of colloidal solution applied to substrate in thixotropic form |
GB2425976A (en) * | 2005-05-11 | 2006-11-15 | Univ Sheffield Hallam | Sol-gel derived coating |
US20080090101A1 (en) * | 2006-10-17 | 2008-04-17 | Andreas Klipp | Method of preparing a coating solution and a corresponding use of the coating solution for coating a substrate |
Also Published As
Publication number | Publication date |
---|---|
CN103403885A (en) | 2013-11-20 |
KR20140022012A (en) | 2014-02-21 |
TW201241924A (en) | 2012-10-16 |
EP2683777A2 (en) | 2014-01-15 |
SG193304A1 (en) | 2013-10-30 |
AU2012224973B2 (en) | 2016-01-07 |
US20130341769A1 (en) | 2013-12-26 |
JP2014516467A (en) | 2014-07-10 |
JP6185845B2 (en) | 2017-08-23 |
AU2012224973A1 (en) | 2013-10-24 |
CA2829269A1 (en) | 2012-09-13 |
WO2012119684A2 (en) | 2012-09-13 |
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