TWI409974B - - Google Patents

Info

Publication number
TWI409974B
TWI409974B TW97143496A TW97143496A TWI409974B TW I409974 B TWI409974 B TW I409974B TW 97143496 A TW97143496 A TW 97143496A TW 97143496 A TW97143496 A TW 97143496A TW I409974 B TWI409974 B TW I409974B
Authority
TW
Taiwan
Prior art keywords
ceramic
mounting
ceramic layer
optical lens
optical module
Prior art date
Application number
TW97143496A
Other languages
Chinese (zh)
Other versions
TW201019500A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN2008101338772A external-priority patent/CN101335319B/en
Application filed filed Critical
Publication of TW201019500A publication Critical patent/TW201019500A/en
Application granted granted Critical
Publication of TWI409974B publication Critical patent/TWI409974B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Abstract

A ceramic packaging substrate, especially a ceramic packaging substrate for the SMD high-power LED, has upper and lower ceramic layers made of ceramic materials, and the upper ceramic layer offers a reflecting cup. The upper ceramic layer is set with an optical lens mounting area for mounting an optical lens and a secondary optical module mounting area for mounting a secondary optical module. The upper surface of the lower ceramic layer is fixed with a wire-bonding area for setting the chip and a bottom pad. The substrate is punched to form conductive holes. The ceramic layers are made of the same or different ceramic materials and connected by sintering an inorganic medium.
TW97143496A 2008-07-15 2008-11-11 A ceramic packaging substrate for the high power LED TW201019500A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008101338772A CN101335319B (en) 2008-05-30 2008-07-15 High-power LED ceramic package base and productive technology

Publications (2)

Publication Number Publication Date
TW201019500A TW201019500A (en) 2010-05-16
TWI409974B true TWI409974B (en) 2013-09-21

Family

ID=41557466

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97143496A TW201019500A (en) 2008-07-15 2008-11-11 A ceramic packaging substrate for the high power LED

Country Status (2)

Country Link
TW (1) TW201019500A (en)
WO (1) WO2010006475A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103107276A (en) * 2012-12-07 2013-05-15 孙雪刚 Light-emitting diode (LED) packaging structure
TWI595687B (en) * 2016-03-28 2017-08-11 一詮精密工業股份有限公司 Light emitting diode base structure
CN107706280A (en) * 2016-08-08 2018-02-16 深圳市斯迈得半导体有限公司 A kind of manufacture method of the LED light source manufactured by vacuum sputtering technique
CN111384220A (en) * 2018-12-27 2020-07-07 南昌欧菲生物识别技术有限公司 Light emitter, depth camera and electronic equipment
CN113270240B (en) * 2021-05-17 2022-07-19 深圳聚德寿科技有限公司 Ceramic flat membrane piezoresistive chip and preparation method thereof
TWI797845B (en) * 2021-11-24 2023-04-01 財團法人工業技術研究院 Heat dissipation structure for package and chip having the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW573306B (en) * 2001-04-16 2004-01-21 Shipley Co Llc Dielectric laminate for a capacitor
TW583695B (en) * 2001-10-25 2004-04-11 Matsushita Electric Ind Co Ltd Manufacturing method of laminated ceramic electronic component
CN101252163A (en) * 2008-03-27 2008-08-27 潮州三环（集团）股份有限公司 SMD high power LED ceramic packaging base
CN101252162A (en) * 2008-03-27 2008-08-27 潮州三环（集团）股份有限公司 High power LED ceramic packaging base

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100342558C (en) * 2004-08-11 2007-10-10 深圳市瑞丰光电子有限公司 Ceramic package light-emitting diode an dits package method
JP2008515184A (en) * 2004-09-28 2008-05-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Light emitting device with improved conversion layer
JP2007095866A (en) * 2005-09-28 2007-04-12 Sumitomo Metal Electronics Devices Inc Manufacturing method of ceramic substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW573306B (en) * 2001-04-16 2004-01-21 Shipley Co Llc Dielectric laminate for a capacitor
TW583695B (en) * 2001-10-25 2004-04-11 Matsushita Electric Ind Co Ltd Manufacturing method of laminated ceramic electronic component
CN101252163A (en) * 2008-03-27 2008-08-27 潮州三环（集团）股份有限公司 SMD high power LED ceramic packaging base
CN101252162A (en) * 2008-03-27 2008-08-27 潮州三环（集团）股份有限公司 High power LED ceramic packaging base

Also Published As

Publication number Publication date
TW201019500A (en) 2010-05-16
WO2010006475A1 (en) 2010-01-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees