TWI409136B - 表面具微溝槽之化學機械平坦化墊 - Google Patents

表面具微溝槽之化學機械平坦化墊 Download PDF

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Publication number
TWI409136B
TWI409136B TW096126187A TW96126187A TWI409136B TW I409136 B TWI409136 B TW I409136B TW 096126187 A TW096126187 A TW 096126187A TW 96126187 A TW96126187 A TW 96126187A TW I409136 B TWI409136 B TW I409136B
Authority
TW
Taiwan
Prior art keywords
pad
insoluble
grooves
micro
polishing
Prior art date
Application number
TW096126187A
Other languages
English (en)
Chinese (zh)
Other versions
TW200810878A (en
Inventor
Oscar K Hsu
Marc C Jin
David Adam Wells
John Erik Aldeborgh
Original Assignee
Innopad Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innopad Inc filed Critical Innopad Inc
Publication of TW200810878A publication Critical patent/TW200810878A/zh
Application granted granted Critical
Publication of TWI409136B publication Critical patent/TWI409136B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW096126187A 2006-07-19 2007-07-18 表面具微溝槽之化學機械平坦化墊 TWI409136B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83159506P 2006-07-19 2006-07-19

Publications (2)

Publication Number Publication Date
TW200810878A TW200810878A (en) 2008-03-01
TWI409136B true TWI409136B (zh) 2013-09-21

Family

ID=38957633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096126187A TWI409136B (zh) 2006-07-19 2007-07-18 表面具微溝槽之化學機械平坦化墊

Country Status (9)

Country Link
US (3) US8137166B2 (cg-RX-API-DMAC10.html)
EP (1) EP2040878A4 (cg-RX-API-DMAC10.html)
JP (1) JP5460316B2 (cg-RX-API-DMAC10.html)
KR (1) KR101409377B1 (cg-RX-API-DMAC10.html)
CN (1) CN101511533B (cg-RX-API-DMAC10.html)
CA (1) CA2658127A1 (cg-RX-API-DMAC10.html)
MY (1) MY151014A (cg-RX-API-DMAC10.html)
TW (1) TWI409136B (cg-RX-API-DMAC10.html)
WO (1) WO2008011535A2 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI754275B (zh) * 2015-10-16 2022-02-01 美商應用材料股份有限公司 拋光墊及形成其之方法
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

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US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
EP2271463A4 (en) * 2008-04-01 2013-11-27 Innopad Inc POLISHING CUSHION WITH CONTROLLED CAVITY
JP2011517111A (ja) * 2008-04-11 2011-05-26 イノパッド，インコーポレイテッド ボイドネットワークを有する化学機械的平坦化パッド
TWI409137B (zh) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd 研磨墊及其微型結構形成方法
US9276747B2 (en) * 2008-08-04 2016-03-01 Technology Policy Associates, Llc Remote profile security system
WO2010088246A1 (en) * 2009-01-27 2010-08-05 Innopad, Inc. Chemical-mechanical planarization pad including patterned structural domains
EP2396143B1 (en) * 2009-02-12 2014-04-09 innoPad, Inc. Three-dimensional network in cmp pad
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
WO2013123105A2 (en) * 2012-02-14 2013-08-22 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US9308620B2 (en) 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
WO2015153597A1 (en) 2014-04-03 2015-10-08 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
WO2016060712A1 (en) 2014-10-17 2016-04-21 Applied Materials, Inc. Cmp pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9643294B2 (en) * 2015-07-14 2017-05-09 K&D Pads LLC Buffing pad and methods of making and using the same
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
JP6829037B2 (ja) * 2016-09-30 2021-02-10 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7273796B2 (ja) * 2017-08-25 2023-05-15 スリーエム イノベイティブ プロパティズ カンパニー 表面突起研磨パッド
JP6980509B2 (ja) * 2017-12-12 2021-12-15 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
WO2020255744A1 (ja) 2019-06-19 2020-12-24 株式会社クラレ 研磨パッド、研磨パッドの製造方法及び研磨方法
CN111515872B (zh) * 2020-04-10 2022-01-11 广东大市智能装备有限公司 一种中空金刚石的粉末冶金一体成型方法
CN112809550B (zh) * 2020-12-31 2022-04-22 湖北鼎汇微电子材料有限公司 一种抛光垫
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11951590B2 (en) 2021-06-14 2024-04-09 Applied Materials, Inc. Polishing pads with interconnected pores
USD1004393S1 (en) * 2021-11-09 2023-11-14 Ehwa Diamond Industrial Co., Ltd. Grinding pad
CN117103107A (zh) * 2022-05-16 2023-11-24 成都高真科技有限公司 还原料浆用抛光装置
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad
CN114918824B (zh) * 2022-06-29 2024-08-20 万华化学集团电子材料有限公司 一种具有径向微沟槽的抛光垫

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US5584146A (en) * 1995-04-10 1996-12-17 Applied Materials, Inc. Method of fabricating chemical-mechanical polishing pad providing polishing uniformity
US20030207661A1 (en) * 2002-05-01 2003-11-06 Alexander Tregub Annealing of CMP polishing pads
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US20050255794A1 (en) * 2004-05-11 2005-11-17 Jean Vangsness Polishing pad

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JP2668016B2 (ja) * 1988-09-21 1997-10-27 スピードファム株式会社 ポリッシングパッド及びその製造方法
US6337280B1 (en) * 1998-05-11 2002-01-08 Kabushiki Kaisha Toshiba Polishing cloth and method of manufacturing semiconductor device using the same
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
US6953388B2 (en) * 1999-12-22 2005-10-11 Toray Industries, Inc. Polishing pad, and method and apparatus for polishing
US6712681B1 (en) 2000-06-23 2004-03-30 International Business Machines Corporation Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
US6383066B1 (en) 2000-06-23 2002-05-07 International Business Machines Corporation Multilayered polishing pad, method for fabricating, and use thereof
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
AU2001297847A1 (en) * 2000-11-20 2002-12-23 Freudenberg Nonwovens, L.P. Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
CN1610962A (zh) * 2001-12-28 2005-04-27 旭化成电子材料元件株式会社 研磨垫及其制法和研磨方法
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
DE60308946T2 (de) * 2002-06-03 2007-05-10 Jsr Corp. Polierkissen und Verfahren zur Herstellung eines Polierkissens
JP2004071985A (ja) * 2002-08-08 2004-03-04 Jsr Corp 半導体ウェハ用研磨パッドの加工方法及び半導体ウェハ用研磨パッド
TWI228768B (en) * 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
JP4039214B2 (ja) * 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
US20040224611A1 (en) 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
JP2008000831A (ja) * 2006-06-20 2008-01-10 Saitama Univ 研磨パッドの製造方法
FR2933004B1 (fr) 2008-06-27 2010-08-20 Inst Francais Du Petrole Solution absorbante contenant un inhibiteur de degradation derive du thiadiazole et methode pour limiter la degradation d'une solution absorbante

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US5584146A (en) * 1995-04-10 1996-12-17 Applied Materials, Inc. Method of fabricating chemical-mechanical polishing pad providing polishing uniformity
US20030207661A1 (en) * 2002-05-01 2003-11-06 Alexander Tregub Annealing of CMP polishing pads
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US20050255794A1 (en) * 2004-05-11 2005-11-17 Jean Vangsness Polishing pad

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI754275B (zh) * 2015-10-16 2022-02-01 美商應用材料股份有限公司 拋光墊及形成其之方法
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

Also Published As

Publication number Publication date
US9375822B2 (en) 2016-06-28
US8137166B2 (en) 2012-03-20
JP5460316B2 (ja) 2014-04-02
US20150056894A1 (en) 2015-02-26
EP2040878A4 (en) 2012-09-12
US20120178348A1 (en) 2012-07-12
MY151014A (en) 2014-03-31
KR101409377B1 (ko) 2014-06-20
US20080085661A1 (en) 2008-04-10
CN101511533B (zh) 2012-10-10
JP2009543709A (ja) 2009-12-10
KR20090031629A (ko) 2009-03-26
WO2008011535A3 (en) 2008-10-02
CA2658127A1 (en) 2008-01-24
WO2008011535A2 (en) 2008-01-24
EP2040878A2 (en) 2009-04-01
CN101511533A (zh) 2009-08-19
US8900036B2 (en) 2014-12-02
TW200810878A (en) 2008-03-01

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