TWI407514B - 引線焊接指示器及方法 - Google Patents

引線焊接指示器及方法 Download PDF

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Publication number
TWI407514B
TWI407514B TW094119700A TW94119700A TWI407514B TW I407514 B TWI407514 B TW I407514B TW 094119700 A TW094119700 A TW 094119700A TW 94119700 A TW94119700 A TW 94119700A TW I407514 B TWI407514 B TW I407514B
Authority
TW
Taiwan
Prior art keywords
lead
carrier
indicator
semiconductor device
soldering
Prior art date
Application number
TW094119700A
Other languages
English (en)
Chinese (zh)
Other versions
TW200625484A (en
Inventor
布爾尼特 泰瑞Ｅ
柯舒米德 湯瑪斯Ｈ
Original Assignee
飛思卡爾半導體公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 飛思卡爾半導體公司 filed Critical 飛思卡爾半導體公司
Publication of TW200625484A publication Critical patent/TW200625484A/zh
Application granted granted Critical
Publication of TWI407514B publication Critical patent/TWI407514B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07234—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
TW094119700A 2004-06-29 2005-06-14 引線焊接指示器及方法 TWI407514B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/879,242 US7074627B2 (en) 2004-06-29 2004-06-29 Lead solder indicator and method

Publications (2)

Publication Number Publication Date
TW200625484A TW200625484A (en) 2006-07-16
TWI407514B true TWI407514B (zh) 2013-09-01

Family

ID=35504780

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119700A TWI407514B (zh) 2004-06-29 2005-06-14 引線焊接指示器及方法

Country Status (8)

Country Link
US (1) US7074627B2 (enExample)
EP (1) EP1761951A4 (enExample)
JP (1) JP5159306B2 (enExample)
KR (1) KR101227210B1 (enExample)
CN (1) CN100501960C (enExample)
MY (1) MY139006A (enExample)
TW (1) TWI407514B (enExample)
WO (1) WO2006007141A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
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US7251880B2 (en) * 2001-09-28 2007-08-07 Intel Corporation Method and structure for identifying lead-free solder
JP5056951B2 (ja) * 2008-10-30 2012-10-24 トヨタ自動車株式会社 被検査物に存在する鉛を検出する方法
KR101097488B1 (ko) * 2009-09-08 2011-12-22 삼성전기주식회사 핀 그리드 어레이 기판의 제조방법
DE102010033092A1 (de) * 2010-08-02 2012-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul und Kfz-Scheinwerfer
DE102017212796A1 (de) * 2017-07-26 2019-01-31 Robert Bosch Gmbh Elektrische Baugruppe
CN108346952B (zh) * 2018-01-25 2020-11-24 番禺得意精密电子工业有限公司 电连接器固持装置
JP7394880B2 (ja) * 2019-09-12 2023-12-08 長江存儲科技有限責任公司 熱インジケータを備えた基板を含む電子部品
CN115362762B (zh) * 2020-05-28 2026-01-30 松下知识产权经营株式会社 安装基板制造装置及安装基板制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6648210B1 (en) * 1999-02-16 2003-11-18 Multicore Solders Limited Lead-free solder alloy powder paste use in PCB production

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US5330917A (en) * 1989-02-02 1994-07-19 Hybrivet Systems, Inc. Test swab device and method of detecting lead, mercury, arsenic, and bismuth
US5364792A (en) * 1989-02-02 1994-11-15 Hybrivet Systems, Inc. Test swab and method of making and using same
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US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5086966A (en) 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
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US5320272A (en) * 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
US5389160A (en) * 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
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US5708812A (en) * 1996-01-18 1998-01-13 Microsoft Corporation Method and apparatus for Migrating from a source domain network controller to a target domain network controller
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JPH11272427A (ja) * 1998-03-24 1999-10-08 Hitachi Ltd データ退避方法および外部記憶装置
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Also Published As

Publication number Publication date
US7074627B2 (en) 2006-07-11
WO2006007141A3 (en) 2006-10-05
CN1977370A (zh) 2007-06-06
KR101227210B1 (ko) 2013-01-28
WO2006007141A2 (en) 2006-01-19
CN100501960C (zh) 2009-06-17
KR20070083395A (ko) 2007-08-24
MY139006A (en) 2009-08-28
EP1761951A2 (en) 2007-03-14
EP1761951A4 (en) 2009-09-09
US20050285274A1 (en) 2005-12-29
TW200625484A (en) 2006-07-16
JP2008504963A (ja) 2008-02-21
JP5159306B2 (ja) 2013-03-06

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MM4A Annulment or lapse of patent due to non-payment of fees