TWI405494B - Organic light-emitting display device and manufacturing method of the same - Google Patents

Abstract

An organic light-emitting display device and a manufacturing method thereof are provided to firmly attach a substrate and a sealing substrate to each other by using a reinforcing material and a frit. A first substrate includes a pixel region and a non-pixel region. An organic light emitting device is formed on the pixel region. The non-pixel region is formed at the outside of the pixel region. A second substrate is attached to a predetermined region including the pixel region of the first substrate. A frit(150) is formed between the non-pixel region of the first substrate and the second substrate. A reinforcing material(160) is separated from the frit and is made of a resin.

Description

Organic light emitting display device and method of manufacturing same

The present invention relates to an organic light emitting display device, and more particularly to a package of an organic light emitting display device.

An organic light emitting display is a flat display device. An organic light emitting display device typically includes an organic light emitting layer between opposing electrodes. A voltage is applied between the electrodes such that electrons injected from one electrode are coupled to the holes injected from the other electrode in the organic light-emitting layer. With this coupling, the luminescent molecules in the luminescent layer are excited and deactivated back to the ground state, thus illuminating.

One problem with such an organic light emitting display is that it deteriorates when moisture and/or impurities penetrate into the organic material of the organic light emitting diode.

One aspect of the present invention provides an organic light emitting display (OLED) device including: a first substrate; a second substrate disposed on the first substrate, wherein the first and second substrates are each layered or contained by a single layer a plurality of layers; an organic light emitting pixel array interposed between the first and second substrates; a fusion seal between the first and second substrates and surrounding the array, wherein the fusion seal and the first and second substrates Co-defining the cladding space where the array is located; The reinforcing member interconnects the first and second substrates between the first and second substrates.

The reinforcing member may comprise a resin. The resin may comprise one or more of the following: an epoxy resin, an acrylate resin, and a polyurethane resin. The reinforcing member can contact the weld seal. The reinforcing member may not contact the weld seal. The reinforcing member can be located within the cladding space. The reinforcing member can be located outside of the cladding space. The reinforcing member may include a first member and a second member, the first member being in the cladding space and the second member being outside the cladding space. The first member may comprise the same material as the second member. The first member can comprise a different material than the second member.

The fused seal can include a plurality of extended segments, wherein the segments join together to surround the array, and wherein the reinforcing member extends and extends substantially parallel to at least one of the segments. The reinforcing member can include a plurality of extended segments, wherein the segments join together to surround the array. Each extension line segment of the reinforcing member can extend along and substantially parallel to one of the extended line segments of the fusion seal. The reinforcing member can further seal the cladding space.

Another aspect of the present invention provides a method of fabricating an organic light emitting display (OLED). The method includes: providing a device comprising: a first substrate; a second substrate disposed on the first substrate; an organic light emitting pixel array interposed between the first and second substrates; and a fusion material interposed therebetween And surrounding the array with the second substrate, wherein the fusion material and the first substrate and the second substrate together define a cladding space in which the array is located; an uncured resin structure interposed between the first and second substrates Contacting the first and second substrates, wherein the uncured resin is in contact with or not contacting the fusion; curing the uncured resin structure to form a reinforcing member to bond the first and second substrates; applying a laser or infrared beam to the fusion To The fuse is bonded to the first and second substrates.

In the method, the resin structure may comprise one or more of the following: an epoxy resin, an acrylate resin, and a polyurethane resin. The reinforcing members can be within and/or outside of the cladding space. Curing the uncured resin structure may comprise applying UV or heat to the uncured resin structure. Curing the uncured resin structure can be performed prior to applying a laser or infrared beam. Curing the uncured resin structure can be carried out subsequent to the application of a laser or infrared beam.

The apparatus can further include: a plurality of additional organic luminescent pixel arrays interposed between the first and second substrates; a plurality of additional splicings between the first and second substrates, the additional The welds will each be surrounded by one of the additional arrays; a plurality of additional uncured resin structures are interposed between the first and second substrates, and the additional uncured resin structures will be in the additional welds Within or outside of the cladding space or both within and outside of it.

The method may further comprise: curing the additional uncured resin structures to form a plurality of reinforcing members interconnected to the first and second substrates; cutting the resulting products into a plurality of sheets, each comprising a cut portion of the first substrate, a cut portion of the second substrate, an organic light emitting pixel array, a fusion material, and a reinforcing member.

Another aspect of the present invention provides a method for preparing an organic light emitting display device, the device comprising a first substrate including an organic light emitting element and a second substrate sealing at least the pixel region of the substrate. The method comprises: a first step of applying a fusion glue to the outside of the second substrate pixel region and annealing it to form a weld; a second step for applying the reinforcing member to the edge of the weld; and a third step for The second substrate is bonded to the first substrate; the fourth step is for curing the reinforcing member; and the fifth step is for adhering the first substrate to the second substrate by irradiating laser or infrared rays to the fusion.

Another aspect of the present invention provides a method for preparing a plurality of organic light emitting display devices at a time, comprising: a first substrate including an organic light emitting element; and a second substrate sealed at least in a pixel region of the first substrate, and The method comprises: a first step of applying a sinter coating and annealing it to form a smelt on the outer side of the original substrate of the second substrate, on which a plurality of second substrates are formed; and a second step for strengthening a member is applied to a side of the individual weld; a third step of connecting the second substrate original sheet to the first substrate original sheet, on which a plurality of first substrates are formed; and a fourth step of curing the reinforcing member; a fifth step of irradiating the first substrate with the laser or the infrared rays to adhere the first substrate to the second substrate; and a sixth step of cutting the first substrate original sheet and the second substrate original sheet which are connected to each other, and It is divided into independent organic light emitting display devices.

Another aspect of the present invention provides a method for preparing an organic light emitting display device, the device comprising a first substrate including an organic light emitting element and a second substrate sealing at least the pixel region of the substrate. The method comprises: a first step of applying a fusion glue to the outside of the second substrate pixel region and annealing it to form a weld; a second step for applying the reinforcing member to the edge of the weld; and a third step for The second substrate is bonded to the first substrate; the fourth step is for adhering the first substrate to the second substrate by irradiating laser or infrared rays to the fusion; and the fifth step is for curing the reinforcing member.

Another aspect of the present invention provides a method for preparing a plurality of organic light emitting display devices at a time, comprising: a first substrate including an organic light emitting element; and a second substrate sealed at least in a pixel region of the first substrate, and The method comprises: a first step of applying a fusion glue and annealing it to form a weld on the outer side of the original substrate of the second substrate, on which a plurality of second substrates are formed; and a second step for strengthening a member applied to a side of the individual weld; a third step of joining the second substrate original sheet to the first substrate original sheet, on which a plurality of first substrates are formed; and a fourth step of curing the reinforcing member a fifth step of irradiating the first substrate with the laser or the infrared ray to adhere the first substrate to the second substrate; and a sixth step of cutting the first substrate original sheet and the second substrate original sheet which are connected to each other, And it is divided into independent organic light-emitting display devices.

According to the method for preparing a plurality of organic light-emitting display devices, the reinforcing member encapsulates the melt and the encapsulated substrate, and strengthens the package of the organic light-emitting display device when the fuse is utilized. In addition, the reinforcing member protects the organic light-emitting element from the surrounding air.

1‧‧‧Deposited substrate

2‧‧‧encapsulated substrate

3‧‧‧encapsulated components

4‧‧‧Water Absorbent

100‧‧‧Substrate

100a‧‧‧pixel area

100b‧‧‧Non-pixel area

101‧‧‧Deposited substrate

111‧‧‧buffer layer

112‧‧‧Semiconductor layer

112a‧‧‧ active layer

112b‧‧‧Ohm contact layer

113‧‧‧ gate insulation

114‧‧‧gate electrode

115‧‧‧Interlayer insulation

116a‧‧‧Source electrode

116b‧‧‧汲electrode

117‧‧‧flattening layer

118‧‧‧through hole

119‧‧‧first electrode

120‧‧‧ pixel definition film

121‧‧‧Organic layer

122‧‧‧Second electrode layer

150‧‧‧welds

160‧‧‧Strengthened components

170‧‧‧Data Drive

180, 180’‧‧‧ scan drive

200‧‧‧encapsulated substrate

300‧‧‧Sheet original sheet

350‧‧‧welding

360‧‧‧Strength

370‧‧‧Original substrate encapsulation member

400‧‧‧encapsulated substrate original sheet

1000‧‧‧Passive Matrix OLED

1001‧‧‧Active Matrix OLED

1002‧‧‧Substrate

1004‧‧‧Anode

1006‧‧‧ cathode

1010‧‧‧Organic layer

1011‧‧‧OLED device

1012‧‧‧ Local drive circuit

1014‧‧‧flattening layer

1016‧‧‧Information line

1018‧‧‧ scan line

1021‧‧‧OLED pixel array

1061‧‧‧Top substrate

1071‧‧‧Seal

1081‧‧‧wrapped space

1101‧‧‧Common bottom substrate

Figure 1 is a cross-sectional view showing an organic light emitting display device.

2 is a plan view of an organic light emitting display device according to an embodiment.

Fig. 3 is a cross-sectional view taken along line A-A' of the organic light-emitting display device shown in Fig. 2.

4 is a cross-sectional view of an organic light emitting display according to another embodiment.

Figure 5 is a cross-sectional view of an organic light emitting display according to another embodiment.

6A to 6E are cross-sectional views showing an organic light emitting display preparation process according to an embodiment.

7A to 7F are cross-sectional views showing a preparation process of an organic light-emitting display device in an original thin plate unit according to an embodiment.

FIG. 8A is an exploded perspective view showing a passive matrix type organic light emitting display device according to an embodiment.

FIG. 8B is an exploded perspective view of an active matrix type organic light emitting display device according to an embodiment.

Figure 8C is a top plan view of an organic light emitting display device in accordance with an embodiment.

Fig. 8D is a cross-sectional view taken along line D-D of the organic light-emitting display device shown in Fig. 8C.

FIG. 8E is a perspective view showing mass production of an organic light emitting display device according to an embodiment.

Hereinafter, embodiments according to the present invention will be described with reference to the accompanying drawings. The above and other features and advantages of the present invention will become more apparent from the following description of the accompanying drawings.

Organic light emitting display (OLED) is a display including an organic light emitting diode array . Organic light-emitting diode systems include solid state elements of organic materials that generate and emit light when a suitable potential is applied.

Depending on the excitation current arrangement provided, OLEDs can generally be grouped into two basic types. A simplified architectural exploded view of a passive matrix OLED 1000 is shown in FIG. 8A. FIG. 8B is a simplified schematic diagram of an active matrix OLED 1001. In both configurations, the OLEDs 1000, 1001 comprise OLED pixels constructed over the substrate 1002, and the OLED pixels include an anode 1004, a cathode 1006, and an organic layer 1010. When a suitable current is applied to the anode 1004, current flows through the pixels and visible light is emitted from the organic layer.

Referring to Figure 8A, the design of a passive matrix OLED (PMOLED) includes an elongated strip of anode 1004 that is generally arranged to extend the strip perpendicular to the cathode 1006 with the organic layer interposed therebetween. The intersection of the cathode 1006 and the strip of anode 1004 defines individual OLED pixels that are generated and emitted when the respective strips of anode 1004 and cathode 1006 are properly excited. PMOLEDs offer relatively simple manufacturing advantages.

Referring to FIG. 8B, an active matrix OLED (AMOLED) includes a driver circuit 1012 arranged between a substrate 1002 and an OLED pixel array. The individual pixels of the AMOLEDs are defined between a common cathode 1006 and an anode 1004 that is electrically independent of the other anodes. Each localized driver circuit 1012 is coupled to an anode 1004 of the OLED pixel and further coupled to the data line 1016 and the scan line 1018. In some embodiments, scan line 1018 supplies a scan signal that selects a series of drive circuits, while data line 1016 supplies a data signal to a particular drive circuit. The data signal and the scan signal excite the local drive circuit 1012, which excites the anode 1004 to emit light from its corresponding pixel.

In the illustrated AMOLED, the local driver circuit 1012, the data line 1016, and the scan line 1018 are buried in the planarization layer 1014 between the pixel array and the substrate 1002. The planarization layer 1014 provides a flat upper surface on which an array of organic light emitting pixels is formed. The planarization layer 1014 may be formed of organic and inorganic materials, and although shown as a single layer, it may be formed of two or more layers. The local drive circuit 1012 is typically formed of thin film transistors (TFTs) and arranged in a grid or array under the OLED pixel array. The localized drive circuit 1012 can be at least partially made of an organic material, including an organic TFT. AMOLEDs have the advantage of fast response time and improve their desirability in the display of data signals. In addition, AMOLEDs have the advantage of less power consumption than passive matrix OLEDs.

Referring to the common features of PMOLED and AMOLED designs, substrate 1002 provides architectural support for OLED pixels and circuitry. In various embodiments, substrate 1002 comprises a hard or resilient material and an opaque or transparent material such as plastic, glass, and/or metal foil. As mentioned above, each OLED pixel or diode has an anode 1004, a cathode 1006, and an organic layer 1010 formed on the anode and cathode. When a suitable current is applied to the anode 1004, the cathode 1006 injects electrons and the anode 1004 injects into the holes. In a particular embodiment, anode 1004 and cathode 1006 are inverted, that is, the cathode is formed on substrate 1002 and the anodes are arranged oppositely.

One or more organic layers are interposed between the cathode 1006 and the anode 1004. More specifically, at least one of the emissive or luminescent layers is interposed between the cathode 1006 and the anode 1004. The luminescent layer can include one or more organic luminescent compounds. Typically, the luminescent layer will be configured to emit monochromatic visible light, such as blue, green, red, or white. color. In the illustrated embodiment, an organic layer 1010 is formed between the cathode 1006 and the anode 1004 and acts as a light-emitting layer. The additional layer formed between the anode 1004 and the cathode 1006 may include a hole transport layer, a hole injection layer, an electron transport layer, and an electron injection layer.

The hole transport and/or the implant layer may be interposed between the light emitting layer 1010 and the anode 1004. The electron transport and/or injection layer can be interposed between the cathode 1006 and the luminescent layer 1010. The electron injection layer facilitates electron injection from the cathode 1006 to the light emitting layer 1010 by reducing the work function required to inject electrons from the cathode 1006. Similarly, the hole injection layer facilitates injection of holes from the anode 1004 toward the luminescent layer 1010. The holes and the electron transport layer promote the movement of the carriers from the respective electrodes toward the luminescent layer.

In some embodiments, a single layer can have both electron injection and transfer functions or both hole injection and transfer functions. In some embodiments, there is no one or more of these layers. In some embodiments, one or more organic layers may be doped with one or more materials that aid in the injection and/or transport of the carriers. In embodiments where only one organic layer is formed between the cathode and the anode, the organic layer may include not only organic photocompounds, but also certain functional materials that aid in the implantation or transport of carriers at the layer.

Many organic materials have been developed for use in such layers including luminescent layers. Many other organic materials used in these layers have also been developed. In some embodiments, these organic materials may include macromolecules of oligomers and polymers. In some embodiments, the organic materials used for these layers can be relatively small molecules. Those who are familiar with the technology from the perspective of the required functions of these individual layers and special designs From the standpoint of adjacent layer materials, suitable materials for each layer can be selected.

In operation, the circuit provides appropriate potential between cathode 1006 and anode 1004. This causes current to flow from the anode 1004 through the organic layer therebetween to the cathode 1006. In one embodiment, cathode 1006 provides electrons to adjacent organic layer 1010. The anode 1004 injects a hole into the organic layer 1010. The holes and electrons recombine in the organic layer 1010 and produce energetic particles called "excitons". The excitons transfer their energy to the organic luminescent material in the organic layer 1010, which is used to emit visible light from the organic luminescent material. The spectral properties produced and emitted by OLEDs 1000, 1001 depend on the nature and composition of the organic molecules in the organic layer. Those skilled in the art can select one or more organic layer compositions to suit a particular application.

OLED devices can also be classified based on the direction of emission of light. In a type referred to as "uplighting" type, the OLED device emits light through the cathode or top electrode 1006 and displays an image. In these embodiments, the cathode 1006 is made of a material that is transparent to visible light or that is at least partially transparent. In some embodiments, to avoid any loss of light that can pass through the anode or bottom electrode 1004, the anode can be made of a material that substantially reflects visible light. The second type OLED device emits light through the anode or bottom electrode 1004 and is referred to as a "lower illuminating" type. In a lower emission type OLED device, the anode 1004 is made of a material that is at least partially transparent to visible light. In a lower emission type OLED device, the cathode 1006 is often made of a material that substantially reflects visible light. The third type OLED device emits light in two directions, that is, simultaneously through the anode 1004 and the cathode 1006. The substrate may be made of a material that is transparent, opaque or reflective to visible light depending on the direction in which the light is emitted. production.

In many embodiments, OLED pixel array 1021 includes a plurality of organic luminescent pixels arranged on substrate 1002 in the manner shown in Figure 8C. In some embodiments, the pixels in array 1021 are controlled to be turned on and off by a driver circuit (not shown), and information or images are displayed on array 1021 as a whole in a plurality of pixels. In some embodiments, the OLED pixel array 1021 is arranged with respect to other components (eg, drive and control electronics) to define a display area and a non-display area. In these embodiments, the display area refers to the area in the substrate 1002 where the OLED pixel array 1021 is formed. The non-display area refers to the remaining area of the substrate 1002. In some embodiments, the non-display area can include logic and/or power supply circuitry. It will be appreciated that at least a portion of the control/drive circuit components are arranged within the display area. For example, in PMOLEDs, conductive members will extend into the display area to provide a suitable potential to the anode and cathode. In AMOLEDs, local drive circuitry and data/scan connections coupled to the drive circuitry will extend into the display area to drive and control individual pixels of the AMOLEDs.

One consideration in the design and manufacture of OLED devices is to enable the OLED device specific organic material layer to withstand damage or accelerate deterioration of exposure to water, oxygen or other harmful gases. Thus, it is generally understood that the OLED device will be sealed or encapsulated to inhibit exposure to moisture and oxygen or other harmful gases in the manufacturing or operating environment. Figure 8D illustrates a cross section of the encapsulated OLED device 1011 along the line D-D of Figure 8C. In this embodiment, a generally flat top plate or substrate 1061 is bonded to the seal 1071, and the seal is further joined to the bottom plate or substrate 1002 to encapsulate or encapsulate the OLED pixel array 1021. In other embodiments, at the top One or more layers are formed on the flat plate 1061 or the bottom plate 1002, and the seal 1071 is coupled to the bottom or top substrate 1002, 1061 through the layer. In the illustrated embodiment, the seal 1071 extends along the perimeter of the OLED pixel array 1021 or the bottom or top panels 1002, 1061.

In some embodiments, the seal 1071 is made of a weld material as will be discussed further below. In various embodiments, the top and bottom panels 1061, 1002 comprise a material such as plastic, glass, and/or metal foil that can provide oxygen and/or water barriers to the barrier thereby protecting the OLED pixel array 1021 from exposure to such materials. . In some embodiments, at least one of the top panel 1061 and the bottom panel 1002 is formed from a substantially transparent material.

To increase the lifetime of the OLED device 1011, the seal 1071 and the top and bottom plates 1061, 1002 are typically required to provide a substantially impermeable seal to oxygen and water vapor and provide a substantially sealed envelope space 1081. In a particular application, it is shown that the weld material seal 1071 in combination with the top and bottom plates 1061, 1002 provides an oxygen barrier having an oxygen of less than about 10 ^-3 cc/m ² -day and a water content of less than about 10 ^-6 g/m. ² -day water barrier. Because some of the oxygen and moisture can penetrate into the cladding space 1081, in some embodiments a material that absorbs oxygen and/or moisture can be formed within the cladding space 1081.

The seal 1071 has a width W which is the thickness in the direction parallel to the surface of the top or bottom substrate 1061, 1002, as shown in Fig. 8D. The width varies from embodiment to embodiment and ranges from about 300 microns to about 3000 microns, or from about 500 microns to about 1500 microns. Moreover, the width of the different positions on the seal 1071 can vary. In some embodiments, the width of the seal 1071 is in the seal The place where the 1071 is in contact with one of the bottom and the top substrates 1002, 1061 or the seal 1071 is the largest in contact with the layer formed on the substrate. The seal width can be minimized when the seal 1071 is in contact with others. The change in width of the single section of the seal 1071 is related to the cross-sectional shape of the seal 1071 and other design parameters.

The seal 1071 has a height H which is the thickness in the direction perpendicular to the top or bottom substrate 1061, 1002, as shown in Fig. 8D. The height varies from embodiment to embodiment and ranges from about 2 microns to about 30 microns, or from about 10 microns to about 15 microns. Generally, the height at different positions of the seal 1071 does not change significantly. However, in some embodiments, the height of the seal 1071 can vary at different locations.

In the illustrated embodiment, the seal 1071 has a generally rectangular cross section. However, in other embodiments the seal 1071 can have various other cross-sectional shapes, such as a generally square cross-section, a generally trapezoidal cross-section, one or more cross-sections that are circular in shape, or other shapes that are indicative of a particular application need. In order to improve the sealing, it is common to increase the interface area of the seal 1071 directly with the bottom or top substrate 1002, 1061 or the layer formed thereon. In some embodiments, the shape of the seal can be designed such that the interface area is increased.

The seal 1071 can be disposed in close proximity to the OLED array 1021, while in other embodiments the seal 1071 is spaced a distance from the OLED array 1021. In a particular embodiment, the seal 1071 generally comprises linear segments that are joined together to surround the OLED array 1021. In some embodiments, a linear segment of such seal 1071 can extend, generally parallel to the boundaries of OLED array 1021. In other embodiments, one of the seals 1071 will be disposed in a relationship that is non-parallel to the boundaries of the OLED array 1021. Or more linear segments. In other embodiments, at least a portion of the seal 1071 extends in a curved pattern between the top panel 1061 and the bottom panel 1002.

As mentioned above, in some embodiments the seal 1071 is formed using a weld material or only "fusible" or "glass weld" which includes fine glass particles. The fused particles include one or more of the following: magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), potassium oxide (K ₂ O). Boron oxide (B ₂ O ₃ ), vanadium oxide (V ₂ O ₅ ), zinc oxide (ZnO), cerium oxide (TeO ₂ ), aluminum oxide (Al ₂ O ₃ ), cerium oxide (SiO ₂ ), oxidation Lead (PbO), tin oxide (SnO), phosphorus oxide (P ₂ O ₅ ), ruthenium oxide (Ru ₂ O), ruthenium oxide (Rb ₂ O), ruthenium oxide (Rh ₂ O), iron oxide (Fe ₂ O ₃ ), copper oxide (CuO), titanium oxide (TIO ₂ ), tungsten oxide (WO ₃ ), bismuth oxide (Bi ₂ O ₃ ), bismuth oxide (Sb ₂ O ₃ ), lead borate glass, tin phosphate glass, vanadium It is composed of acid salt glass and borosilicate. In some embodiments, the particle size ranges from about 2 microns to about 30 microns, or from about 5 microns to about 10 microns, but is not limited thereto. The particle size can be such as the distance between the top and bottom substrates 1061, 1002 or the distance between any of the layers formed on the substrates that are in contact with the frit seal.

The weld material used to form the seal 1071 may also include one or more fillers or additional materials. Fillers or additional materials may be provided to adjust the overall thermal expansion characteristics of the seal 1071 and/or to adjust the absorption characteristics of the seal 1071 to a selected frequency of incident radiant energy. The filler or additional material may also include an exchange and/or additional filler to adjust the coefficient of thermal expansion of the weld. For example, the filler or additional material may include transition metals such as chromium (Cr), iron (Fe), manganese (Mn), cobalt (Co), copper (Cu), and/or vanadium. Additional materials for the filler or addenda include ZnSiO ₄ , PbTiO ₃ , ZrO ₂ , and cryptite.

In some embodiments, the dry composition of the weld material comprises from about 20 to 90 weight percent (wt%) glass particles, and the remainder comprises filler and/or addenda. In some embodiments, the fusion paste comprises about 10-30 wt% organic material and about 70-90 wt% inorganic material. In some embodiments, the fusion paste comprises about 20 wt% organic material and about 80 wt% inorganic material. In some embodiments, the organic material can include from about 0 to 30 wt% binder and from about 70 to 100 wt% solvent. In some embodiments, the organic material has about 10 wt% binder and about 90 wt% solvent. In some embodiments, the inorganic material can include from about 0 to 10 wt% of the addenda, from about 20 to 40 wt% of the filler, and from about 50 to 80 wt% of the glass powder. In some embodiments, the inorganic material has from about 0 to about 5% by weight of the addenda, from about 25 to about 30 percent by weight of the filler, and from about 65 to about 75 percent by weight of the glass powder.

In forming the fusion seal, a liquid material is added to the dry fusion material to form a fusion paste. Any organic or inorganic solvent with or without additives may be used as the liquid material. In some embodiments, the solvent comprises one or more organic compounds. For example, applicable organic compounds are ethyl cellulose, nitrocellulose, hydroxypropyl cellulose, tetracarbitol acetate, enol, butyl glycol, acrylate compounds. The fusion paste thus formed can then be applied to shape the seal 1071 on the top and/or bottom panels 1061, 1002.

In an exemplary embodiment, the shape of the seal 1071 is initially in the form of a fused paste And inserted between the top plate 1061 and the bottom plate 1002. In a particular embodiment, the seal 1071 can be pre-cured and pre-sintered onto one of the top and bottom panels 1061, 1002. After the top plate 1061 and the bottom plate 1002 are combined with the seal 1071 therebetween, portions of the seal 1071 are selectively heated such that the weld material forming the seal 1071 is at least partially melted. The seal 1071 can then be re-solidified to form a stable joint between the top plate 1061 and the bottom plate 1002, thus preventing the coated OLED pixel array 1021 from being exposed to oxygen or water.

In some embodiments, selective heating of the fusion seal is performed with illumination of light, such as a laser or a directed infrared light. As previously mentioned, the weld material forming the seal 1071 can incorporate one or more addenda or fillers, such as a species selected to improve absorption of the illumination light to promote heating and melting of the weld material to form the seal 1071.

In some embodiments, OLED device 1011 is mass produced. In the embodiment shown in FIG. 8E, a plurality of separate OLED arrays 1021 are formed on a common bottom substrate 1101. In the illustrated embodiment, each OLED array 1021 is surrounded by a seal 1071 formed by a weld. In some embodiments, a common top substrate (not shown) is placed over the common bottom substrate 1101 and the structure formed thereon such that the OLED array 1021 and the shaped fusion paste are interposed between the common bottom substrate 1101 and the common top substrate. between. The OLED array 1021 is encapsulated and sealed, such as through a packaging process of a single OLED display device as previously described. The final product includes a plurality of OLED devices held together by a common bottom and a top substrate. Then cut the final product into multiple pieces, each piece of composition 8D OLED device 1011. In some embodiments, the individual OLED devices 1011 are further subjected to additional packaging operations to further improve the seal formed by the fusion seal 1071 and the top and bottom substrates 1061, 1002.

1 is a cross-sectional view showing a sealing structure of an organic light emitting diode. Referring to FIG. 1, the organic light-emitting display device includes a deposition substrate 1, an encapsulation substrate 2, an encapsulation member 3, and a moisture absorbent 4. The deposition substrate 1 is a substrate including a pixel region and a non-pixel region, the prime region includes at least one organic light emitting diode, and the non-pixel region surrounds the pixel region. The encapsulating substrate 2 is relatively adhered to the surface of the deposition substrate on which the organic light emitting diode is formed.

The encapsulation member 3 is formed along the edges of the deposition substrate 1 and the encapsulation substrate 2 to adhere the deposition substrate 1 to the encapsulation substrate 2. The encapsulating member 3 is cured by a method such as ultraviolet irradiation. Although the encapsulating member 3 has been applied, it is still possible to infiltrate through fine cracks due to hydrogen gas, oxygen gas, moisture, and the like, and the moisture absorbent 4 is contained in the encapsulating substrate 2 to be removed.

However, the encapsulating member 3 cannot completely prevent the infiltration of ambient air. Further, the moisture absorbent 4 is applied to the encapsulating substrate by an annealing process which causes the exhaust gas. Therefore, the annealing process may reduce the adhesion between the encapsulating member 3 and the substrate, so that the organic light emitting diode is easily exposed to the ambient air.

In one embodiment, the organic light-emitting diode is encapsulated by applying a weld to a glass substrate that does not include a moisture absorbent. According to this, since the space between the substrate and the encapsulating substrate is completely sealed by solidifying the melted fusion material, the moisture absorbent is not required, and the organic light emitting diode can be more effectively protected.

However, since the welding material is very weak, when an external impact force is applied, pressure concentration occurs on the bonding surface of the fusion material and the substrate, so that cracks are generated from the bonding surface and expanded into the entire substrate.

2 is a plan view of an organic light emitting display device according to an embodiment. Fig. 3 is a cross-sectional view taken along line A-A' of the organic light-emitting display device shown in Fig. 2. The organic light-emitting display device includes a substrate 100, an encapsulation substrate 200, a fusion material 150, and a reinforcing member 160. In the context of the present specification, the substrate 100 refers to a substrate including an organic light emitting element. The substrate 100 can be a single layer or a plurality of layers. The deposition substrate 101 refers to a base substrate on which an organic light emitting element is formed.

The substrate 100 includes a pixel region 100a and a non-pixel region 100b surrounding the pixel region 100a, and the substrate 100 is a flat plate including an organic light emitting element. The pixel region 100a includes at least one organic light emitting element having a first electrode 119, an organic layer 121, and a second electrode 122. As explained hereinafter, the pixel region 100a refers to a region in which a predetermined image is displayed by light emitted from the organic light-emitting element, and the non-pixel region 100b refers to all regions except the pixel region 100a above the substrate 100.

The pixel region 100a includes a plurality of scanning lines (S1 to Sm) arranged in the column direction and a plurality of data lines (D1 to Dm) arranged in the row direction. A plurality of pixels are formed at intersections between the scan lines (S1 to Sm) and the data lines (D1 and Dm), which can receive signals from the driving integrated circuit for driving the organic light emitting elements.

At the same time, a driving IC for driving the organic light emitting element and gold respectively electrically connected to the scan lines (S1 to Sm) and the data lines (D1 and Dm) are also formed in the non-pixel region 100b. It is a wiring. In the illustrated embodiment, the driver IC includes a data driver 170 and scan drivers 180, 180'.

The illustrated organic light emitting elements are driven in an active matrix type. Its structure will be explained graphically.

The buffer layer 111 is formed on the base substrate 101. The buffer layer is made of an insulating material such as yttria SiO ₂ or tantalum nitride SiN _x . The buffer layer 111 is formed to protect the substrate 100 from damage caused by factors such as external heat.

On at least any of the regions of the buffer layer 111, the semiconductor layer 112 includes an active layer 112a and an ohmic contact layer 112b. The gate insulating layer 113 is formed on the semiconductor layer 112 and the buffer layer 111. On one region of the gate insulating layer 113, a gate electrode 114 is formed, the size of which corresponds to the width of the active layer 112a.

The interlayer insulating layer 115 is formed over the gate insulating layer 113 having the gate electrode 114, and the source and drain electrodes 116a, 116b are formed on a predetermined region of the interlayer insulating layer 115.

The source and drain electrodes 116a, 116b are formed to be connected to the ohmic contact layer 112b, and the planarization layer 117 is formed on the interlayer insulating layer 115 including the source and drain electrodes 116a, 116b.

The first electrode 119 is formed on a region of the planarization layer 117. The first electrode 119 is connected to any exposed region of the source and drain electrodes 116a, 116b via the via 118.

The pixel defining film 120 is formed on the planarization layer 117 including the first electrode 119. The pixel defining film has an opening (not shown) to expose at least one region of the first electrode 119.

The organic layer 121 is formed in the opening of the pixel defining film 120. The second electrode layer 122 is formed over the pixel defining film 120 and the organic layer 121. A passivation layer may be further formed over the upper surface of the second electrode layer 122.

This embodiment can be applied to an active matrix type structure or a passive matrix type structure of an organic light emitting element. Those skilled in the art will appreciate that such structures can be altered. Each structure is well known, and thus its detailed explanation will be omitted.

The encapsulating substrate 200 is a member for encapsulating at least one pixel region 100a of the substrate on which the organic light emitting element is formed, which may include a transparent material in the case of front light emission or light emission on both sides. Alternatively, in the case of being illuminated, the encapsulating substrate may comprise an opaque material. In the case of front illuminating, an exemplary material for encapsulating the substrate 200 may be glass, but is not limited thereto.

The encapsulating substrate in the illustrated embodiment is a flat type which seals at least the pixel region in which the organic light emitting element is formed. For example, in the illustrated embodiment, all of the data drivers are sealed from areas other than the pad portion.

The solder 150 encapsulates the pixel region 100a such that ambient air cannot penetrate, and the solder is formed in a space between the encapsulation substrate 200 and the non-pixel region 100b of the substrate 100. The weld may be a glass stock comprising an additive in powder form. It can also be a glass formed by melting the weld. In the context of the present specification, "fusible" may mean any of the above.

The fuse 150 is formed to form a covered wire by bonding to the encapsulated substrate The edges on the side of the substrate 100 are formed at a fixed pitch.

The weld 150 is applied to the encapsulating substrate 200 in a fused colloid state, which comprises a glass material, a laser absorbing absorbent, and a filler for reducing the coefficient of thermal expansion. Next, the fusion material 150 is melted by laser or infrared rays and solidified between the encapsulating substrate 200 and the substrate 100 to encapsulate the encapsulating substrate 200 and the substrate 100.

In one embodiment, an absorbent containing a transition metal is included therein. An example of such a material contains V ₂ O ₅ .

In one embodiment, the line width formed by the weld is from about 0.5 mm to about 1.5 mm. The thickness of the weld 150 can range from about 10 to about 20 microns.

Meanwhile, the construction and material of the side of the substrate 100 directly contacting the weld 150 are not limited to the above embodiment. In one embodiment, the portion of the metal wiring that is not in direct contact with the drive integrated circuit does not overlap the metal wiring. Since the weld 150 is irradiated by laser or infrared rays as described above, the metal wire can be damaged when the weld is overlapped with the metal wire.

When the substrate 100, the encapsulating substrate 200, and the fusing material 150 are both glass, the reinforcing member 160 can prevent the organic light emitting display device from being easily broken. The reinforcing member 160 can also serve as a weld when the weld 150 is not adhered by fusion or when it is relatively weakly adhered. The reinforcing member 160 may be spaced apart from the weld 150 by a predetermined gap. In other embodiments, the reinforcing member can contact the weld 150.

One of the materials used in the reinforcing member 160 is a self-curing, heat-curing, or UV-curing resin. For example, the self-curable resin comprises hydrogen acrylate. Acrylate is a material that is thermally cured at a temperature of about 80 °C. Epoxy resin, The acrylate resin and the polyurethane resin can be UV cured.

Meanwhile, unlike the embodiment in FIG. 3, FIGS. 4 and 5 are diagrams of an organic light-emitting display device in which the reinforcing members are individually formed on the inner side and the outer side of the organic light-emitting display device, spaced apart from the fusion material. Thus, it will be appreciated by those skilled in the art that the reinforcing members can be formed on the inside or the outside of the weld or simultaneously formed on both sides thereof.

The foregoing organic light-emitting display device can be prepared in various methods, however it can be described based on the first embodiment of the preparation method with reference to FIGS. 6A to 6E. 6A to 6E show a process of manufacturing an organic light emitting display device.

First, the weld 150 is applied to a portion around the encapsulating substrate 200 and spaced apart from its edge by a predetermined distance. The fuse 150 is formed at a position corresponding to the non-pixel area of the substrate, which will be described below. The fuse 150 is applied to the encapsulating substrate 200 in a colloidal state, and is cured by annealing after removing the moisture or organic binder contained therein.

Referring next to Fig. 6B, a reinforcing member 160 containing a resin is applied along the outside of the applied fusion colloid. The reinforcing member 160 can be formed by dispensing or screen printing. The reinforcing member 160 may be formed with or formed in contact with the weld 150 at a predetermined interval. The reinforcing member 160 can also be aligned with or can be formed within the edge of the encapsulating substrate 200.

Next, a substrate 100 including a pixel region and a non-pixel region is provided, the pixel region including an organic light emitting element, and the non-pixel region is formed with a driver integrated circuit and a metal wiring or the like. The substrate 100 is bonded to the encapsulation substrate 200 and covered The area of the pixel area (Fig. 6C).

Next, the reinforcing member 160 is cured between the bonded substrate 100 and the encapsulating substrate 200. When the material of the reinforcing member is curable by ultraviolet light, it is exposed to ultraviolet light after being shielded. When the material of the reinforcing member 160 can be heat treated, the reinforcing member 160 receives heat radiation. In the case of heat curing, the organic light-emitting element is greatly damaged due to the high temperature. In one embodiment, the temperature is about 80 ° C or less (Figure 6D).

Next, the fusion material 150 between the bonded substrate 100 and the encapsulating substrate 200 is exposed to laser or infrared rays. Therefore, the fuse 150 is melted between the substrate 100 and the encapsulation substrate 200. In one embodiment, the weld 150 is melted by laser or infrared light. The wavelength of the laser or infrared ray used to illuminate may range from 800 nm to about 1200 nm (depending on 810 nm). The beam size can range from 1.0 nm to about 3.0 nm in diameter. The output electrical power can range from about 15 watts to about 45 watts. Portions other than the weld 150 are shielded. A two-layer film of copper and aluminum is used as a material for shielding. Thereafter, the molten solder 150 adheres to the substrate 100 and the encapsulating substrate 200 after curing.

Meanwhile, the second embodiment of the preparation method of the organic light-emitting display device provides a method of exchanging the step of curing the reinforcing member with the step of irradiating the fusion with laser. Those skilled in the art will appreciate that the reinforcing member can be cured after melting/curing the weld.

The foregoing preparation method is a preparation method for preparing an independent organic light-emitting display device. In mass production, a plurality of display device units are simultaneously prepared. therefore This preparation method will be described below with reference to FIGS. 7A to 7E.

First, an encapsulated substrate original sheet 400 is provided. The original sheet 400 will be cut into individual encapsulated substrates as will be described in more detail below. The weld colloid is applied in a closed loop form over the original sheet to which the weld seal will be applied. The fusion sizing may include: a glass material, an absorbent for absorbing the laser, a filler for reducing the coefficient of thermal expansion, an organic bonding agent, and the like. After the fusion of the glue is applied, the weld is annealed at a temperature of from about 300 ° C to about 500 ° C, and the organic binder or moisture, etc., evaporates during the annealing process ( FIG. 7A ).

Next, the reinforcing member 360 containing the resin is applied along the outer side of the applied fusion glume 350. The reinforcing member 360 is formed by a distribution method or a screen printing method. It may be formed at a predetermined distance from the weld colloid or in contact with the gel. The reinforcing member 360 can also be formed not to protrude from the edge of the encapsulating substrate or can be formed in its edge (Fig. 7B).

In one embodiment, the resin material is further formed along the entire edge of the encapsulated substrate original sheet 400. Next, the original wafer encapsulation member 370 will first cure and adhere by bonding the encapsulated substrate original sheet to the substrate original sheet 300. The bonding process is then carried out. In this case, even if the joining process of the original sheet enclosing member 370 is performed in a non-vacuum state, it can prevent the internal organic light emitting element from being exposed to the ambient air.

Next, an annealing frit 350 is formed on the encapsulating substrate original sheet 400 and bonded to the separately prepared substrate original sheet 300. At this time, the encapsulated substrate original sheet 400 is bonded so that it can cover the individual image of the substrate original sheet 300. Plain area (Figure 7C).

Next, the reinforcing member 360 will receive laser or thermal illumination. The reinforcing member comprising the resin material will thus cure and strengthen the weld (Fig. 7D).

Next, the fusion material 350 between the substrate original sheet 300 joined to the original sheet 400 and the original sheet 400 is subjected to laser or infrared irradiation to adhere the substrate original sheet 400 and the substrate original sheet 300. In one embodiment, the weld 150 will be melted by laser or infrared light. The wavelength of the laser or infrared ray to be irradiated can be set to about 810 nm. The beam size can be set to a diameter of from about 1.0 mm to about 3.0 mm. The output electrical power can be set from about 25 watts to about 45 watts. The laser can be irradiated in a direction encapsulating the substrate side, the substrate side, or both sides. In one embodiment, the substrate in the joined state and the interior of the encapsulated substrate are maintained at a pressure below atmospheric pressure (Fig. 7E).

Then, the original sheet 300 and the encapsulated substrate original sheet 400 which are cut in a joined state can be cut into a separate display device unit to prepare an independent organic light-emitting display device. In one embodiment, the cutting line is located between the two reinforcing members. In one embodiment, the individual encapsulating substrates are only bonded to predetermined areas of the individual substrates, and only the encapsulating substrates are separated for cutting (Fig. 7F).

After the individual panels are grooved and cleaned, a drive integrated circuit is provided on the substrate. A polarizing plate is provided on the surface of the encapsulating substrate. Processes for providing flexible printed circuits and processes for providing tuppy are also implemented.

In an embodiment, the prior art sheet is used to mass produce an organic light emitting display device. Those skilled in the art will appreciate that the solder may be cured prior to curing the reinforcing material.

While the invention has been described with respect to the basic principles of the foregoing embodiments, various modifications and changes can be made without departing from the spirit and scope of the invention. For example, changing the method of forming the reinforcing member and changing the position at which the reinforcing member is formed can be performed.

While the invention has been shown and described with respect to the embodiments of the invention . For example, the forming method and the forming position of the reinforcing member may be changed.

100‧‧‧Substrate

100a‧‧‧pixel area

100b‧‧‧Non-pixel area

150‧‧‧welds

160‧‧‧Strengthened components

170‧‧‧Data Drive

180, 180’‧‧‧ scan drive

200‧‧‧encapsulated substrate

Claims (12)

An organic light emitting display (OLED) device includes: a first substrate; a second substrate disposed on the first substrate, wherein the first substrate and the second substrate are each a single layer or a plurality of layers An organic light emitting pixel array is interposed between the first substrate and the second substrate; a solder is interposed between the first substrate and the second substrate and surrounds the organic light emitting pixel array, Wherein the fusion material, the first substrate, and the second substrate jointly define a cladding space provided with the organic light emitting pixel array; and a reinforcing member interposed between the first substrate and the second substrate The reinforcing member interconnects the first substrate and the second substrate; wherein the reinforcing member comprises a resin; wherein the reinforcing member is located outside the cladding space; wherein the reinforcing member does not contact the fusion; The weld comprises one or more of the following materials: magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), potassium oxide (K ₂ O). ), boron oxide (B ₂ O ₃ ), vanadium oxide (V ₂ O ₅ ) , zinc oxide (ZnO), lanthanum oxide (TeO ₂ ), aluminum oxide (Al ₂ O ₃ ), cerium oxide (SiO ₂ ), lead oxide (PbO), tin oxide (SnO), phosphorus oxide (P ₂ O ₅ ), ruthenium oxide (Ru ₂ O), ruthenium oxide (Rb ₂ O), ruthenium oxide (Rh ₂ O), iron oxide (Fe ₂ O ₃ ), copper oxide (CuO), titanium oxide (TIO ₂ ), tungsten oxide (WO ₃ ), bismuth oxide (Bi ₂ O ₃ ), bismuth oxide (Sb ₂ O ₃ ), lead borate glass, tin phosphate glass, vanadate glass, and borosilicate. The organic light-emitting display device according to claim 1, wherein the resin is composed of one of epoxy resin, acrylate resin, polyurethane resin or a combination thereof. The organic light-emitting display device of claim 1, wherein the fusion material comprises a plurality of first extension line segments, wherein the first extension line segments are combined to surround the organic light-emitting pixel array, and wherein the reinforcing member is along the edge And substantially parallel to at least one of the first extension segments. The organic light-emitting display device of claim 3, wherein the reinforcing member comprises a plurality of second extended line segments, wherein the second extended line segments jointly surround the organic light emitting pixel array. The organic light-emitting display device of claim 4, wherein each of the second extension segments of the reinforcing member extends along and substantially parallel to one of the first extension segments of the fusion. The organic light-emitting display device of claim 4, wherein the reinforcing member further seals the cladding space. A method of fabricating an organic light emitting display (OLED), the method comprising: providing an organic light emitting display device comprising: a first substrate; a second substrate disposed on the first substrate; an organic light emitting pixel array, The method is between the first substrate and the second substrate; and a solder is interposed between the first substrate and the second substrate and surrounds the organic light emitting pixel array, wherein the fusion material, the first a substrate, in combination with the second substrate, defines a cladding space provided with the array of organic light emitting pixels; and an uncured reinforcing member disposed at an interval from the solder substrate is disposed between the first substrate and the second substrate And the uncured reinforcing member contacts the first substrate and the second substrate; curing the uncured reinforcing member to form a reinforcing member to join the first substrate and the second substrate; and applying a laser or a Infrared light beam to the fusion material to bond the fusion material to the first substrate and the second substrate; wherein the reinforcing member comprises a resin; wherein the reinforcing member is outside the cladding space; wherein The seal comprises one or more of the following materials: magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), potassium oxide (K ₂ O) Boron oxide (B ₂ O ₃ ), vanadium oxide (V ₂ O ₅ ), zinc oxide (ZnO), cerium oxide (TeO ₂ ), aluminum oxide (Al ₂ O ₃ ), cerium oxide (SiO ₂ ), oxidation Lead (PbO), tin oxide (SnO), phosphorus oxide (P ₂ O ₅ ), ruthenium oxide (Ru ₂ O), ruthenium oxide (Rb ₂ O), ruthenium oxide (Rh ₂ O), iron oxide (Fe ₂ O ₃ ), copper oxide (CuO), titanium oxide (TiO ₂ ), tungsten oxide (WO ₃ ), bismuth oxide (Bi ₂ O ₃ ), bismuth oxide (Sb ₂ O ₃ ), lead borate glass, tin phosphate glass, vanadium Acid glass and borosilicate. The method of claim 7, wherein curing the uncured reinforcing member comprises applying UV or heat to the uncured reinforcing member. The method of claim 7, wherein curing the uncured reinforcing member is performed prior to applying the laser or the infrared beam. The method of claim 7, wherein curing the uncured reinforcing member is performed after applying the laser or the infrared beam. The method of claim 7, wherein the organic light emitting display device further comprises: a plurality of additional organic light emitting pixel arrays interposed between the first substrate and the second substrate; a plurality of additional fusion materials, Between the first substrate and the second substrate, each of the additional solders surrounds each of the additional organic illuminating pixel arrays, and the additional fused materials, the first substrate and the second substrate are combined Defining a plurality of additional cladding spaces provided with each of the additional organic light emitting pixel arrays; and a plurality of additional uncured reinforcing members interposed between the first substrate and the second substrate, the additional uncured strengthening The components are located within or outside of the additional cladding spaces or both within and outside of the additional cladding spaces. The method of claim 11, further comprising: curing the additional uncured reinforcing members to form a plurality of additional reinforcing members interposed between the first substrate and the second substrate, such that the first substrate The second substrate, the additional organic luminescent pixel arrays, the additional fused materials, and the additional reinforcing members generate a resultant product; and the dicing the resultant product to respectively form a plurality of organic luminescent displays, each of the organic luminescent displays Each of the first substrate, a portion of the second substrate, each of the additional organic luminescent pixel arrays, and the additional fused materials are respectively included And each of these additional reinforcing members.