CN103165821A - Packaging structure of organic light emitting diode (OLED) display module - Google Patents
Packaging structure of organic light emitting diode (OLED) display module Download PDFInfo
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- CN103165821A CN103165821A CN2011104075944A CN201110407594A CN103165821A CN 103165821 A CN103165821 A CN 103165821A CN 2011104075944 A CN2011104075944 A CN 2011104075944A CN 201110407594 A CN201110407594 A CN 201110407594A CN 103165821 A CN103165821 A CN 103165821A
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Abstract
The invention provides a packaging structure of an organic light emitting diode (OLED) display module. Air, oxygen and the like in the air can be effectively prevented from permeating and entering through a double-layer structure including an inorganic glass material layer and an ultraviolet curable organic layer. Meanwhile, the sealing position is enabled to have good flexibility, a rate of finished products of the OLED display module is improved, and the service life of the OLED display module is prolonged.
Description
Technical field
The present invention relates to the encapsulation technology field, relate in particular to a kind of OLED and show module package structure.
Background technology
OLED, be Organic Light Emitting Diode (Organic Light-Emitting Diode), be called again display of organic electroluminescence (Organic Electroluminesence Display), refer to organic semiconducting materials and luminescent material under electric field driven, by the phenomenon of carrier injection and composite guide photoluminescence.The OLED principle of luminosity is respectively as anode and the negative electrode of device with ITO pixel electrode and metal electrode, under certain voltage drives, electronics and hole are injected into electronics and hole transmission layer from negative electrode and anode respectively, electronics and hole move to luminescent layer through electronics and hole transmission layer respectively, and meet in luminescent layer, form exciton and light emitting molecule is excited, the latter sends visible light through radiative relaxation.No matter on image quality, usefulness and cost, congenital performance is all outstanding a lot of than Thin Film Transistor-LCD (TFT-LCD) for the panel that uses OLED.Yet the life cycle of general OLED is subject on every side, and aqueous vapor affects and reduces with oxygen, so the good encapsulation of AM-OLED panel needs completely cut off aqueous vapor and oxygen on every side.
Figure 1 shows that the OLED that uses the doped-glass material shows module package structure, this OLED shows in module package structure: at first, make organic function layer 201 arrays etc. on glass substrate 200; Then, on organic function layer 201 arrays etc., glass cover-plate 202 is set.Wherein, described cover plate 202 is bonded as one by sealing strip 203 and described substrate 200.Wherein, described sealing strip 203 is that employing doped-glass material is adhesive, prepares by techniques such as lfs.Under described packaged type, because the doped-glass material is non-organic material, make the sealing strip suppleness of formation not high, be easy to cause the OLED encapsulating structure cracked in the cutting technique stage, reduce the rate of finished products that OLED shows module.Simultaneously, because this encapsulating structure need to be by techniques such as lfs, and can discharge a large amount of heats due to laser at melting process in these techniques, cause raising near frit neighboring area temperature, be easy to damage organic function layer 201, cause the product yield of OLED significantly to reduce.
Summary of the invention
The object of the present invention is to provide a kind of OLED to show module package structure, can prevent effectively that the compositions such as airborne water, oxygen from penetrating into, and sealing place there is pliability preferably, rate of finished products and the useful life of raising OLED demonstration module.
For addressing the above problem, the invention provides a kind of OLED and show module package structure, comprising: substrate; And be arranged at cover plate on substrate, but described substrate is bonded as one by UV photocuring organic layer and frit inorganic layer and described cover plate, accommodates the cavity volume of OLED device with formation.
Further, but described UV photocuring organic layer is arranged on a side of the close OLED device of described frit inorganic layer.
Further, but described UV photocuring organic layer is arranged on the side away from the OLED device of described frit inorganic layer.
Further, but the width of described UV photocuring organic layer is 500 μ m～2000 μ m.
Further, described frit inorganic layer comprises one or more materials of selecting in the group of magnesium oxide, calcium oxide, barium monoxide, sodium oxide molybdena, potassium oxide, boron oxide, vanadium oxide, zinc oxide, dysprosia, aluminium oxide, silicon dioxide, lead oxide, tin oxide, phosphorous oxide, ruthenium-oxide, rubidium oxide, rhodium oxide, iron oxide, cupric oxide, titanium oxide, tungsten oxide, bismuth oxide, lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate composition.
Further, but described UV photo-curing material is epoxy resin.
Further, the width of described frit inorganic layer is 750 μ m～2000 μ m.
Further, but the spacing of described UV photocuring organic layer and described frit inorganic layer is 500 μ m～1000 μ m.
Further, described substrate is glass plate.
Further, described cover plate is glass plate.
Compared with prior art, OLED provided by the invention shows module package structure, but by frit inorganic layer and UV photocuring organic layer double-decker with when compositions such as effectively preventing airborne water, oxygen penetrates into, make sealing place that pliability preferably be arranged, improved rate of finished products and the useful life of OLED demonstration module.
Description of drawings
Fig. 1 is the generalized section of using the OLED demonstration module package structure of doped-glass material in prior art;
Fig. 2 is the vertical view that the OLED of the embodiment of the present invention one shows module package structure;
Fig. 3 is the generalized section that the OLED of the embodiment of the present invention one shows module package structure;
Fig. 4 is the vertical view that the OLED of the embodiment of the present invention two shows module package structure;
Fig. 5 is the generalized section that the OLED of the embodiment of the present invention two shows module package structure.
Embodiment
The OLED that the present invention is proposed below in conjunction with the drawings and specific embodiments shows that module package structure is described in further detail.
Embodiment one
Please refer to Fig. 3 and Fig. 4, the present embodiment provides a kind of OLED to show module package structure, comprise: substrate 300 and be arranged at cover plate 302 on substrate 300, but described substrate 300 is bonded as one by UV photocuring organic layer 304 and frit inorganic layer 305 with described cover plate 302, accommodates the cavity volume 303 of OLED device 301 with formation.In the present embodiment, but described UV photocuring organic layer 304 is epoxy resin, be arranged on a side of the close OLED device of described frit inorganic layer 305, but UV photocuring organic layer 304 and frit inorganic layer 305 all are and enclose structure, with respect to described OLED device 301, but UV photocuring organic layer 304 is positioned at the inside of described frit inorganic layer 305.In addition, in the present embodiment, described substrate 300 and cover plate 302 are glass plate.
but described UV photocuring organic layer 304 is positioned at described frit inorganic layer 305 inside, 305 meltings of frit inorganic layer are temperature required is 650 ℃, and but the maximum temperature that the epoxy resin of UV photocuring organic layer 304 can bear is no more than 100 ℃, therefore through repeatedly repetition test discovery, when but the spacing between described UV photocuring organic layer 304 and described frit inorganic layer 305 is 600 μ m～800 μ m, effectively guard ring epoxy resins organic layer is not guaranteed safety by laser damage, but the width of described UV photocuring organic layer 304 is 500～600 μ m, the width of described frit inorganic layer 305 is 800 μ m～1200 μ m, it can be by magnesium oxide, calcium oxide, barium monoxide, boron oxide, vanadium oxide, zinc oxide, dysprosia, aluminium oxide, silicon dioxide, lead oxide, tin oxide, phosphorous oxide, ruthenium-oxide, rubidium oxide, rhodium oxide, iron oxide, cupric oxide, titanium oxide, tungsten oxide, bismuth oxide, lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate form.
The OLED that the present embodiment provides shows module package structure, and its frit inorganic layer 305 provides the hardness consistent with substrate 300 glass and cover plate 302 glass, and prevents that effectively the compositions such as airborne water, oxygen from penetrating into; But its UV photocuring organic layer 304 provides pliability preferably for sealing place, in cutting technique, described cutting stress is applied to described cover plate 302 outsides, but cover plate 302 inboards are by the corresponding stress of bonding formation of UV photocuring organic layer 304 simultaneously, when making cutting, substrate 300 glass are not easily broken, improve rate of finished products and useful life that OLED shows module.Simultaneously, but be formed with UV photocuring organic layer 304 owing to showing between module 301 and frit inorganic layer 305 at OLED, can be reduced in widely in the process of frit inorganic layer 305 lfs, damage the probability that OLED shows module 301, thereby improve the yield of OLED product.
But the UV photocuring organic layer 304 in the present embodiment only for illustrating, is not limited to epoxide resin material for epoxy resin, but so long as the material of UV photocuring all can.
Embodiment two
Please refer to Fig. 4 and Fig. 5 the present embodiment provides a kind of OLED to show module package structure, comprise: substrate 500 and be arranged at cover plate 502 on substrate 500, but described substrate 500 is bonded as one by UV photocuring organic layer 504 and frit inorganic layer 505 with described cover plate 502, accommodates with formation the cavity volume 503 that OLED shows module 501.Wherein, but described UV photocuring organic layer 504 all be with described frit inorganic layer 505 and enclose structure.In the present embodiment, described substrate 500 and cover plate 502 are glass plate.
The difference of the present embodiment and embodiment one only is: but described UV photocuring organic layer 504 is arranged on the side away from OLED demonstration module 501 of described frit inorganic layer 505, but UV photocuring organic layer 504 and frit inorganic layer 505 all are and enclose structure, show module 501 with respect to described OLED, described epoxy resin organic layer 504 is outside at the annular seal space that described frit inorganic layer 505 forms.
The OLED that the present embodiment provides shows module package structure, but its frit inorganic layer 505 is in the inside of UV photocuring organic layer 504, therefore, frit inorganic layer 505 is except preventing that effectively whole OLED from showing that the compositions such as water in the module package structure peripheral air, oxygen penetrate into, can also block the compositions such as water in epoxy resin organic layer 504, oxygen, further improve the useful life that OLED shows module; But UV photocuring organic layer 504 provides pliability preferably for sealing place simultaneously, in cutting technique, described cutting stress is applied to described cover plate 502 outsides, but the corresponding stress of bonding formation by UV photocuring organic layer 504, when making cutting, substrate 500 glass are not easily broken, improve the rate of finished products that OLED shows module.
Need to prove, in other embodiments of the invention, but the width of described UV photocuring organic layer can be 500 μ m～2000 μ m, and the width of described frit inorganic layer can be 750 μ m～2000 μ m; But the spacing of described UV photocuring organic layer and described frit inorganic layer can be 500 μ m～1000 μ m, but UV photocuring organic layer is not limited to epoxide resin material, but so long as the material of UV photocuring all can.
In sum, OLED provided by the invention shows module package structure, but by frit inorganic layer and UV photocuring organic layer double-decker with when compositions such as effectively preventing airborne water, oxygen penetrates into, make sealing place that pliability preferably be arranged, improve rate of finished products and the useful life of OLED demonstration module, be applicable to the encapsulation manufacturing that large scale OLED shows module.
Obviously, those skilled in the art can carry out various changes and modification and not break away from the spirit and scope of the present invention invention.Like this, if within of the present invention these are revised and modification belongs to the scope of claim of the present invention and equivalent technologies thereof, the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. an OLED shows module package structure, it is characterized in that, comprising: substrate; And be arranged at cover plate on substrate, but described substrate is bonded as one by UV photocuring organic layer and frit inorganic layer and described cover plate, accommodates with formation the cavity volume that OLED shows module.
2. OLED as claimed in claim 1 shows module package structure, it is characterized in that, but described UV photocuring organic layer is arranged on the side that the close OLED of described frit inorganic layer shows module.
3. OLED as claimed in claim 1 shows module package structure, it is characterized in that, but described UV photocuring organic layer is arranged on the side away from OLED demonstration module of described frit inorganic layer.
4. OLED shows module package structure as claimed in claim 2 or claim 3, it is characterized in that, but the width of described UV photocuring organic layer is 500 μ m～2000 μ m.
5. OLED as claimed in claim 1 shows module package structure, it is characterized in that, described frit inorganic layer comprises one or more in magnesium oxide, calcium oxide, barium monoxide, sodium oxide molybdena, potassium oxide, boron oxide, vanadium oxide, zinc oxide, dysprosia, aluminium oxide, silicon dioxide, lead oxide, tin oxide, phosphorous oxide, ruthenium-oxide, rubidium oxide, rhodium oxide, iron oxide, cupric oxide, titanium oxide, tungsten oxide, bismuth oxide, lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate.
6. OLED as claimed in claim 1 shows module package structure, it is characterized in that, but described UV photo-curing material is epoxy resin.
7. OLED as claimed in claim 1 shows module package structure, it is characterized in that, the width of described frit inorganic layer is 750 μ m～2000 μ m.
8. OLED as described in any one in claim 1 to 7 shows module package structure, it is characterized in that, but the spacing of described UV photocuring organic layer and described frit inorganic layer is 500 μ m～1000 μ m.
9. OLED as claimed in claim 1 shows module package structure, it is characterized in that, described substrate is glass plate.
10. OLED as claimed in claim 1 shows module package structure, it is characterized in that, described cover plate is glass plate.
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Cited By (11)
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| CN103715366A (en) * | 2013-12-20 | 2014-04-09 | 京东方科技集团股份有限公司 | OLED film packaging structure, OLED device and display apparatus |
| CN104037363A (en) * | 2014-06-17 | 2014-09-10 | 深圳市华星光电技术有限公司 | Base plate packaging method |
| CN104112823A (en) * | 2014-06-30 | 2014-10-22 | 上海天马有机发光显示技术有限公司 | White organic light-emitting device |
| CN104241542A (en) * | 2014-09-22 | 2014-12-24 | 深圳市华星光电技术有限公司 | OLED packaging method and structure |
| CN104882556A (en) * | 2015-06-08 | 2015-09-02 | 京东方科技集团股份有限公司 | Packaging part and packaging method thereof, and OLED device |
| WO2016112597A1 (en) * | 2015-01-13 | 2016-07-21 | 京东方科技集团股份有限公司 | Encapsulation method, display panel, and display device |
| CN107369697A (en) * | 2016-05-11 | 2017-11-21 | 华为终端（东莞）有限公司 | Method for packing for organic LED display panel |
| CN107623010A (en) * | 2016-07-14 | 2018-01-23 | 半导体组件工业公司 | Wafer-level package and correlation technique |
| WO2018119886A1 (en) * | 2016-12-26 | 2018-07-05 | 武汉华星光电技术有限公司 | Oled display panel and packaging method for oled display panel |
| CN109003951A (en) * | 2018-08-10 | 2018-12-14 | 云谷（固安）科技有限公司 | Encapsulating structure, display device and encapsulating structure preparation method |
| CN109509402A (en) * | 2017-09-14 | 2019-03-22 | 昆山国显光电有限公司 | A kind of flexible display apparatus |
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| CN107369697A (en) * | 2016-05-11 | 2017-11-21 | 华为终端（东莞）有限公司 | Method for packing for organic LED display panel |
| CN107369697B (en) * | 2016-05-11 | 2019-04-26 | 华为终端（东莞）有限公司 | Packaging method for organic LED display panel |
| CN107623010A (en) * | 2016-07-14 | 2018-01-23 | 半导体组件工业公司 | Wafer-level package and correlation technique |
| WO2018119886A1 (en) * | 2016-12-26 | 2018-07-05 | 武汉华星光电技术有限公司 | Oled display panel and packaging method for oled display panel |
| CN109509402A (en) * | 2017-09-14 | 2019-03-22 | 昆山国显光电有限公司 | A kind of flexible display apparatus |
| CN109509402B (en) * | 2017-09-14 | 2022-03-18 | 广州国显科技有限公司 | Flexible display device |
| CN109003951A (en) * | 2018-08-10 | 2018-12-14 | 云谷（固安）科技有限公司 | Encapsulating structure, display device and encapsulating structure preparation method |
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Application publication date: 20130619 |