CN101026182A - Organic light emitting display and method of fabricating the same - Google Patents
Organic light emitting display and method of fabricating the same Download PDFInfo
- Publication number
- CN101026182A CN101026182A CNA2007100047614A CN200710004761A CN101026182A CN 101026182 A CN101026182 A CN 101026182A CN A2007100047614 A CNA2007100047614 A CN A2007100047614A CN 200710004761 A CN200710004761 A CN 200710004761A CN 101026182 A CN101026182 A CN 101026182A
- Authority
- CN
- China
- Prior art keywords
- substrate
- oxide
- organic light
- seal
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 403
- 239000011521 glass Substances 0.000 claims abstract description 62
- 239000000463 material Substances 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims description 42
- 238000002310 reflectometry Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 9
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 6
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 3
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 3
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 claims description 3
- 229960004643 cupric oxide Drugs 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 2
- 239000005385 borate glass Substances 0.000 claims description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 2
- ZPPSOOVFTBGHBI-UHFFFAOYSA-N lead(2+);oxido(oxo)borane Chemical compound [Pb+2].[O-]B=O.[O-]B=O ZPPSOOVFTBGHBI-UHFFFAOYSA-N 0.000 claims description 2
- 229910001947 lithium oxide Inorganic materials 0.000 claims description 2
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 2
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 claims description 2
- 239000005365 phosphate glass Substances 0.000 claims description 2
- 229910003450 rhodium oxide Inorganic materials 0.000 claims description 2
- CWBWCLMMHLCMAM-UHFFFAOYSA-M rubidium(1+);hydroxide Chemical compound [OH-].[Rb+].[Rb+] CWBWCLMMHLCMAM-UHFFFAOYSA-M 0.000 claims description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 2
- 229910001948 sodium oxide Inorganic materials 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- QUBMWJKTLKIJNN-UHFFFAOYSA-B tin(4+);tetraphosphate Chemical compound [Sn+4].[Sn+4].[Sn+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QUBMWJKTLKIJNN-UHFFFAOYSA-B 0.000 claims description 2
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 claims 1
- 229910000410 antimony oxide Inorganic materials 0.000 claims 1
- 229910052810 boron oxide Inorganic materials 0.000 claims 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims 1
- 239000000292 calcium oxide Substances 0.000 claims 1
- 229910000464 lead oxide Inorganic materials 0.000 claims 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 claims 1
- 229910001950 potassium oxide Inorganic materials 0.000 claims 1
- 229910001952 rubidium oxide Inorganic materials 0.000 claims 1
- 229910052714 tellurium Inorganic materials 0.000 claims 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 229910001930 tungsten oxide Inorganic materials 0.000 claims 1
- 229910001935 vanadium oxide Inorganic materials 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 42
- 239000007789 gas Substances 0.000 description 30
- 239000012044 organic layer Substances 0.000 description 22
- 239000011368 organic material Substances 0.000 description 17
- 238000007789 sealing Methods 0.000 description 16
- 239000000565 sealant Substances 0.000 description 14
- 239000000654 additive Substances 0.000 description 13
- 230000000996 additive effect Effects 0.000 description 12
- 239000000945 filler Substances 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 229920001621 AMOLED Polymers 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- 239000002002 slurry Substances 0.000 description 8
- 238000013461 design Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000002745 absorbent Effects 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000505 pernicious effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- -1 acrylates compound Chemical class 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 1
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 229940071676 hydroxypropylcellulose Drugs 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910001867 inorganic solvent Inorganic materials 0.000 description 1
- 239000003049 inorganic solvent Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/877—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The invention provides an organic light emitting display and manufacturing method thereof, wherein, Newton's ring is prevented by controlling pressure difference. The organic light emitting display includes: a first substrate including pixel area in which at least one organic light emitting diode (OLED) is formed and non-pixel area; a second substrate which attaches to an area including the pixel area of the first substrate; glass material arranged between the non-pixel area of the first substrate and the second substrate. At least one of the first substrate and the second substrate forms an outward protrusion.
Description
Technical field
The present invention relates to organic light emitting display and manufacture method thereof, more specifically, relate to a kind of organic light emitting display and manufacture method thereof that prevents to produce Newton's ring (Newton ' s rings) by control pressure reduction (differential pressure).
Background technology
Recently, because its structure is simple relatively, so organic light emitting display has obtained extensive use.Organic light emitting display is a kind of self-emitting display, wherein, adopts organic layer as emission layer.Because organic light emitting display need be used for luminous backlight unlike LCD (LCD), so the thin thickness of organic light emitting display, in light weight.Therefore, organic light emitting display has obtained active development as the display panel of portable electric appts, and for example described portable electric appts can be portable computer, mobile phone, portable game machine and e-book.
In organic light emitting display, planting between first electrode and second electrode comprises one or more organic layers of emission layer.On substrate, form first electrode of the anode that plays a part injected hole.On first electrode, form organic layer.On organic layer, form second electrode of negative electrode that plays a part to be used to inject electronics in the face of first electrode.
In the Organic Light Emitting Diode (OLED) from the external penetration to the organic light emitting display time, electrode is subjected to oxidation and is spaced from each other at moisture and oxygen.In this case, will shorten the life-span of OLED, reduce emission effciency.In addition, also may change the color of emission.
Therefore, in the manufacture process of organic light emitting display, execute protection OLED is not subjected to the sealing technology of external disturbance.In one approach, the polymer of lamination such as PETG (PET) on the negative electrode of OLED.In another approach, outer cover or the cap that is formed by metal or glass comprises absorbent.In addition, can in outer cover or cap, fill nitrogen.Can be by the marginal membrane of outer cover or cap being closed sealing (capsule sealed) such as the sealant of epoxy resin.
But in can not preventing thoroughly that by said method moisture and oxygen are from the external penetration to OLED, so deterioration or change may take place in OLED.
In order to address the above problem, the someone has proposed to adopt film to close Sealing Method to improve blocks moisture characteristic between the device substrate, in described method, adopt frit as encapsulant.According to the U.S. Patent Publication text No.20040207314 that discloses a kind of structure by sealing OLED to glass substrate coated glass material; owing to adopt frit to make the slit between first substrate and second substrate obtain thorough sealing, therefore might protect OLED effectively.
The hermetic sealing substrate that is coated with frit in employing seals in the structure of OLED, and the distance between substrate and the hermetic sealing substrate is less than the distance between substrate and the hermetic sealing substrate in the structure that adopts absorbent.And, in the process made from frit-sealed organic light emitting display, on mother substrate, make a plurality of display panels simultaneously.Afterwards, mother substrate can be cut into each unit display panel.Because the weight of substrate, the center of substrate may be bent downwardly.
In such OLED, the light that incides on the substrate from the outside produces optical interference at the tie point of hermetic sealing substrate, and then forms concentric ring.These concentric rings are called Newton's ring.The Newton's ring phenomenon is by two surfaces, i.e. sphere and adjacent flat surface, between the interference figure that causes of light reflection.It is rendered as a series of bright ring and Crape rings that with one heart, replace, and it is centered close on two contact points between the surface.In the operating process of OLED, the Newton's ring deterioration picture quality.
The discussion of this part is intended to provide the background of correlation technique, does not constitute prior art.
Summary of the invention
One aspect of the present invention provides a kind of organic light emitting display (OLED) device.Described device comprises: first substrate, and it comprises first outer surface and first inner surface; Second substrate, it is relative with described first substrate substantially, and comprises second outer surface and second inner surface; Array of organic light emitting pixels, it is inserted between described first and second substrates; And glass frit seal, it is inserted between described first and second substrates, and around described array, wherein, the residing enclosure space of described array has been defined in the combination of described glass frit seal, described first substrate and described second substrate simultaneously; Wherein, described second substrate has curvature (curvature), compares with the situation that described second substrate does not have curvature, and it is enough to fully reduce the Newton's ring on described second substrate.
Radius of curvature can be in about 0.2 meter to 100 meters scope.Described second substrate can be outwardly-bent.Described second substrate can curve inwardly.Described second substrate can be more more soft than described first substrate substantially.Described enclosure space can have and the essentially identical gas pressure intensity of atmospheric pressure.Distance between described first and second inner surfaces can be greater than about 10 μ m.Described first substrate can have about 60% to about 70% reflectivity, and wherein, described second substrate has about 4% reflectivity.Described second substrate can comprise the material of selecting from the set that is made of naked glass (bare glass) and seamed edge glass (edge glass).Described device can also comprise another hermetically-sealed construction that is inserted between described first and second substrates, and wherein, described another hermetically-sealed construction is around described glass frit seal.Described another hermetically-sealed construction and described glass frit seal can form the slit between the two.
Another aspect of the present invention provides a kind of organic light emitting display (OLED) device, comprising: first substrate, and it comprises first outer surface and first inner surface; Second substrate, it is relative with described first substrate substantially, and comprises second outer surface and second inner surface; Array of organic light emitting pixels, it is inserted between described first and second substrates; And glass frit seal, it is inserted between described first and second substrates, simultaneously around described array, wherein, described glass frit seal, the residing enclosure space of described array has been defined in the combination of described first substrate and described second substrate, wherein, described second substrate has curvature, wherein, have angle between the tangent line of the edge of described second inner surface and described first outer surface, described tangent line is perpendicular to the described edge of described second inner surface, and wherein, described angle is greater than 0 °, and with when this angle is 0 °, compare it and be enough to fully reduce Newton's ring on described second substrate.
Described second substrate can be outwardly-bent.Described second substrate can curve inwardly.Described enclosure space can have and the essentially identical gas pressure intensity of atmospheric pressure.Described second substrate can be more more soft than described first substrate substantially.
Another aspect of the present invention provides the method for a kind of manufacturing organic light emitting display (OLED) device.Described method comprises: first substrate and array of organic light emitting pixels are provided, and described matrix-like is formed on described first substrate; On described first substrate, second substrate is set, thereby between described first and second substrates, inserts described array; Under predetermined gas pressure, the frit of between described first and second substrates, planting, and make it around described array, wherein, the residing enclosure space of described array has been defined in the combination of described frit, described first substrate and described second substrate, and described predetermined gas pressure is different from atmospheric pressure substantially; Make the fusing of described frit and be cured to once more on described first and second substrates, thus the abundant described enclosure space of gas-tight seal; And described device placed under the atmospheric pressure, thereby in described second substrate, form curvature.
After forming described curvature, the described gas pressure intensity in the described enclosure space can equal the atmospheric pressure outside the described enclosure space substantially.In described fusing with again in the solidification process, can keep described predetermined gas pressure substantially.Described predetermined gas pressure can be higher than atmospheric pressure substantially.After placing described device under the atmospheric pressure, described second substrate can be outwardly-bent substantially.Described predetermined gas pressure can be higher than atmospheric pressure.
Described predetermined gas pressure can be lower than atmospheric pressure substantially.After placing described device under the atmospheric pressure, described second substrate can curve inwardly substantially.Described predetermined gas pressure can be lower than atmospheric pressure.Described second substrate can be more more soft than described first substrate substantially.
Described method can also comprise: before placing described device under the atmospheric pressure, provide second seal that is inserted between described first and second substrates, wherein, described second seal is around described glass frit seal.Described method can also comprise: in the process of described frit of planting, control one of outer surface of described first and second substrates by suction (suction).
Another aspect of the present invention provides a kind of organic light emitting display and manufacture method thereof, wherein, prevents to produce Newton's ring by control pressure reduction.
Another aspect of the present invention provides a kind of organic light emitting display, and it comprises: first substrate, and it comprises pixel region and the non-pixel region that has formed at least one Organic Light Emitting Diode (OLED) in it; Second substrate, it is attached to the zone that comprises pixel region of described first substrate; And be arranged at the non-pixel region of described first substrate and the frit between described second substrate.In first substrate and second substrate at least one formed to outer lug.
The sealant that described first substrate and second substrate are adhered to mutually of being used in the outside that is positioned at described frit further is provided between described first substrate and second substrate.The sealant that described first substrate and second substrate are adhered to mutually of being used to of the inboard that is positioned at described frit further is provided between described first substrate and second substrate.Second substrate can be formed by seamed edge glass or naked glass.When the reflectivity of first substrate is that about 60% reflectivity to about 70%, the second substrate is about 4% o'clock, the distance between described first substrate and second substrate is not less than about 10 μ m.
Another aspect of the present invention provides a kind of method of making organic light emitting display, described organic light emitting display comprises first substrate with OLED and is used for sealing at least second substrate of the pixel region of described first substrate, the step that described method comprises has: first substrate is provided, and it comprises pixel region and the non-pixel region that has formed OLED in it; On the periphery corresponding to described non-pixel region of described second substrate, form frit; Be lower than under the predetermined pressure of atmospheric pressure second substrate attachment to the first substrate; And under atmospheric pressure, make described frit fusing, thereby adhere to described first substrate.Expand outwardly by at least one that changes that pressure makes described first substrate and described second substrate.
Another aspect of the present invention provides a kind of organic light emitting display, and it comprises: first substrate, and it comprises pixel region and the non-pixel region that has formed at least one Organic Light Emitting Diode (OLED) in it; Second substrate, it is attached to the zone that comprises pixel region of described first substrate; And be arranged at the non-pixel region of described first substrate and the frit between described second substrate.In described first substrate and described second substrate at least one formed cave inward.
Another aspect of the present invention provides a kind of method of making organic light emitting display, described organic light emitting display comprises first substrate with OLED and is used for sealing at least second substrate of the pixel region of described first substrate, the step that described method comprises has: first substrate is provided, and it comprises pixel region and the non-pixel region that has formed OLED in it; On the periphery corresponding to described non-pixel region of described second substrate, form frit; Be lower than under the predetermined pressure of atmospheric pressure second substrate attachment to the first substrate; And under atmospheric pressure, make described frit fusing, thereby adhere to described first substrate.By changing at least one inside contraction that pressure makes described first substrate and described second substrate.
Description of drawings
In conjunction with the accompanying drawings to the description of embodiment, these and/or other purpose of the present invention and advantage will become apparent, and be more readily understood by hereinafter, in the accompanying drawings:
Fig. 1 shows the schematic sectional view according to the organic light emitting display of first embodiment;
Fig. 2 A shows the schematic sectional view of the manufacture method of the organic light emitting display among Fig. 1 to Fig. 2 E;
Fig. 3 is the schematic sectional view according to the angle of curvature of second substrate of first embodiment;
Fig. 4 shows the schematic sectional view according to the organic light emitting display of second embodiment;
Fig. 5 A shows the schematic sectional view of the manufacture method of the organic light emitting display among Fig. 4 to Fig. 5 E; And
Fig. 6 is the schematic sectional view according to the angle of curvature of second substrate of second embodiment;
Fig. 7 A is the decomposing schematic representation according to the passive matrix organic light-emitting display device of an embodiment.
Fig. 7 B is the decomposing schematic representation according to the active matrix type organic light emitting display unit of an embodiment.
Fig. 7 C is the schematic top plan view according to the organic light emitting display of an embodiment.
Fig. 7 D is the sectional view along the organic light emitting display of Fig. 7 C of D-D line intercepting.
Fig. 7 E shows the perspective schematic view according to the batch process of the organic light emitting apparatus of an embodiment.
Embodiment
Hereinafter, will describe embodiments of the invention in detail with reference to following accompanying drawing.
Organic light emitting display (OLED) is a kind of display unit that comprises organic LED array.Organic Light Emitting Diode is a solid state device, and it comprises organic material, is applicable to produce when applying suitable electromotive force and emission light.
Usually can 0LED be divided into two fundamental types according to the configuration that exciting current is provided.Fig. 7 A schematically shows the exploded view of the simplified structure of passive matrix OLED 1000.Fig. 7 B schematically shows the simplified structure of active array type OLED 1001.In two kinds of configurations, OLED1000,1001 includes the OLED pixel that is structured on the substrate 1002, and the OLED pixel comprises anode 1004, negative electrode 1006 and organic layer 1010.When anode 1004 applies suitable electric current, the electric current pixel of flowing through, and by the organic layer visible emitting.
With reference to figure 7A, the elongate strip of the anode 1004 that passive matrix OLED (PMOLED) design comprises the elongate strip of negative electrode 1006, arrange perpendicular to the elongate strip of negative electrode 1006 substantially and be inserted in therebetween organic layer.Each OLED pixel has been defined in the rectangular crosspoint of the rectangular and anode 1004 of negative electrode 1006, when the anode 1004 of correspondence and negative electrode 1006 rectangular is subjected to suitably encouraging, will produce at the pixel place and emission light.PMOLED provides and has made comparatively simple advantage.
With reference to figure 7B, active matrix OLED (AMOLED) comprises the drive circuit 1012 that is arranged between substrate 1002 and the OLED pel array.Each pixel of AMOLED is defined between common cathode 1006 and the anode 1004, and described anode 1004 is isolated with other anode electricity.Each drive circuit 1012 is connected to the anode 1004 of OLED pixel, is connected with scan line 1018 with data wire 1016 in addition.In an embodiment, scan line 1018 provides selects the capable sweep signal of drive circuit, and data wire 1016 provides data-signal for specific drive circuit.Data-signal and sweep signal encourage local drive circuit 1012, drive circuit 1012 excitation anodes 1004, thus make corresponding pixel luminous.
In illustrated AMOLED, local drive circuit 1012, data wire 1016 and scan line 1018 are buried in the complanation layer 1014, and complanation layer 1014 is inserted between pel array and the substrate 1002.Complanation layer 1014 provides planar top surface, and forming array of organic light emitting pixels complanation layer 1014 thereon can be formed by the organic or inorganic material, and can be formed by two or more layers, but it may be shown single layer in the diagram.Local drive circuit 1012 has thin-film transistor (TFT) usually, and with the arranged in form of grid or array under the OLED pel array.Local drive circuit 1012 can be made of the organic material that comprises organic tft to small part.AMOLED has the fast advantage of response speed, is applied to the catering to the need property that data-signal shows thereby improved.In addition, compare with passive matrix OLED, AMOLED also has advantage low in energy consumption.
With reference to the common feature of PMOLED and AMOLED design, substrate 1002 provides support structure for OLED pixel and circuit.In various embodiments, substrate 1002 can comprise rigidity or flexible material, and opaque or transparent material, for example plastics, glass and/or foil.As mentioned above, each OLED pixel or diode are formed by anode 1004, negative electrode 1006 and the organic layer 1010 that is inserted into therebetween.When anode 1004 applied suitable electric current, negative electrode 1006 injected electronics, anode 1004 injected holes.In certain embodiments, counter-rotating anode 1004 and negative electrode 1006; Promptly on substrate 1002, form negative electrode, with it the positioned opposite anode.
The one or more organic layers of plant between negative electrode 1006 and anode 1004.More particularly, at least one emission layer of plant or luminescent layer between negative electrode 1006 and anode 1004.Luminescent layer can comprise one or more luminous organic compounds.Typically, luminescent layer is configured to launch the visible light of solid color, for example blue, green, redness or white light.In illustrated embodiment, between negative electrode 1006 and anode 1004, form the organic layer 1010 that plays the luminescent layer effect.Other layers be can also between anode 1004 and negative electrode 1006, form, hole transport layer, hole injection layer, electron transport layer and electron injecting layer comprised.
The hole can be transported and/or implanted layer is inserted between luminescent layer 1010 and the anode 1004.Electron transport and/or implanted layer can be inserted between negative electrode 1006 and the luminescent layer 1010.Electron injecting layer promotes to inject electronics from negative electrode 1006 to luminescent layer 1010 by reducing from the work function of negative electrode 1006 injection electronics.Similarly, hole injection layer promotes from anode 1004 to luminescent layer 1010 injected holes.Hole and electron transport layer promote to be injected into moving of charge carrier the luminescent layer from counter electrode.
In certain embodiments, can realize electronics injection and transportation function or realize that by single layer the hole injects and transportation function by single layer.In certain embodiments, can omit one or more in these layers.In certain embodiments, one or more materials that can in one or more organic layers, be doped with the injection that helps charge carrier and/or transport.Having only an organic layer to be formed among the embodiment between negative electrode and the anode, described organic layer not only can comprise organic luminophor, can also comprise the functional material that some helps charge carrier to be injected in this layer and transport.
Developed and much comprised the organic material that adopts in the layer of luminescent layer at these.And much other organic materials that are used for these layers are in the middle of the research and development.In certain embodiments, these organic materials can be the macromolecules that comprises oligomer and polymer.In certain embodiments, the organic material that is used for these layers can be less molecule.Those skilled in the art can be in specific design select to be used for each the suitable material of these layers according to the expectation function of each layer, and are adjacent layer selection material.
In running, circuit provides suitable electromotive force between negative electrode 1006 and anode 1004.This has caused that electric current flows to negative electrode 1006 by the organic layer of planting from anode 1004.In one embodiment, negative electrode 1006 provides electronics to adjacent organic 1010.Anode 1004 is to organic layer 1010 injected holes.Hole and electronics are compound in organic layer 1010, and produce the energy particle that is called as " exciton ".To the luminous organic material in the organic layer 1010, luminous organic material adopts described energy visible emitting to exciton with its energy delivery.Produce and the spectral characteristic of the light of emission depends on the attribute and the composition of the organic molecule in the organic layer by OLED 1000,1001.Those skilled in the art can assign to satisfy concrete requirement of using by the one-tenth of selecting one or more organic layers.
Can also classify to the OLED device according to light emission direction.In the type that is called as " top-emission " type, the OLED device is by negative electrode or top electrodes 1006 luminous and display images.In these embodiments, negative electrode 1006 is by constituting with respect to visible transparent or translucent at least material.In certain embodiments, for fear of any light that can pass anode or bottom electrode 1004 of loss, anode can be made of the material that substantially visible light is reflected.Second type of the OLED device is passed through anode or bottom electrode 1004 emission light, and this type is called as " bottom emission " type.In bottom emissive type OLED device, anode 1004 is by constituting with respect to the translucent at least material of visible light.In bottom-emission type OLED device, negative electrode 1006 is made of the material that substantially visible light is reflected usually.The OLED device of the third type is along both direction, for example, and by anode 1004 and negative electrode 1006 the two emission light.According to light emission direction, substrate can be by forming with respect to visible transparent, material opaque or reflection.
In a lot of embodiment, will comprise that the OLED pel array 1021 of a plurality of organic light emission pixels is arranged on the substrate 1002, shown in Fig. 7 C.In an embodiment, by the pixel conducting in the drive circuit (not shown) array of controls 1021 or end, in array 1021 by a plurality of pixels display message or image as a whole.In certain embodiments, OLED pel array 1021 is with respect to being provided with such as other assemblies that drive and control electronic device, with defined display area and non-display area.In these embodiments, the viewing area is meant the zone that forms OLED pel array 1021 on the substrate 1002.Non-display area is meant all the other zones of substrate 1002.In an embodiment, non-display area can comprise logic and/or power circuit.Should be appreciated that part control/drive circuit is set in the viewing area at least.For example, in PMOLED, conductive component will extend in the viewing area, thereby anode and negative electrode provide suitable electromotive force.In AMOLED, the local drive circuit and the data/scan line that are connected with drive circuit will extend in the viewing area, thereby drive and control each pixel of AMOLED.
One of OLED device design and make and consider that item is, some organic material layer of OLED device may be because of being exposed to water, oxygen or other pernicious gases suffer damage or accelerated deterioration.Therefore, usually to OLED device sealing or encapsulation, with prevent its be exposed to moisture, oxygen or make or operational environment under under other pernicious gases of producing.Fig. 7 D schematically shows along the cross section that encapsulates OLED device 1011 with layout shown in Fig. 7 C of the D-D line intercepting of Fig. 7 C.In this embodiment, integral body is that the top board or the substrate 1061 on plane engages with seal 1071, and seal 1071 further engages with base plate or substrate 1002, thus sealing or encapsulation OLED pel array 1021.In other embodiments, on top board 1061 or base plate 1002, form one or more layers, seal 1071 is engaged via such layer with bottom or head substrate 1002.In illustrated embodiment, seal 1071 extends around OLED pel array 1021 or base plate 1002 or top board 1061.
In an embodiment, seal 1071 is made of frit material, will do further discussion to it hereinafter.In each embodiment, top board 1061 and base plate 1002 comprise that plastics, glass and/or metal forming etc. can stop the material of oxygen and/or moisture penetration, thereby protection OLED pel array 1021 can not be exposed under these materials.In an embodiment, at least one material by substantially transparent in top board 1061 and the base plate 1002 forms.
In order to prolong the useful life of OLED device 1011, wish that usually seal 1071 and top board 1061 and base plate 1002 provide non-infiltration sealing at oxygen and water vapour, and an abundant hermetic closed space 1081 is provided.In some applications, the seal 1071 that is made of frit material combines with top board 1061 and base plate 1002 to be provided the stopping of oxygen, made it to be lower than about 10
-3Cc/m
2-day, provide in addition the stopping of water, make it to be lower than 10
-6G/m
2-day.Suppose that some oxygen and moisture can be penetrated in the enclosure space 1081, so in certain embodiments, can be in enclosure space 1081 formation can absorb the material of oxygen and/or moisture.
In illustrated embodiment, seal 1071 has the cross section that is roughly rectangle.But, in other embodiments, seal 1071 can have various other cross sectional shapes, for example is roughly square cross section, is roughly trapezoidal cross section, has the cross section of one or more round edges or according to the needs of set application and other definite shapes.In order to improve leak tightness, wish to improve the directly interfacial area at position contacting place of seal 1071 and bottom or head substrate 1002,1061 or layer formed thereon usually.In certain embodiments, the shaped design of seal can be the described interfacial area of raising.
As mentioned above, in certain embodiments, adopt frit material to form seal 1071, perhaps can abbreviate described frit material as " frit ", it comprises tiny glass particle.Described frit particle comprises one or more in the following material: magnesium oxide (MgO), calcium oxide (CaO), barium monoxide (BaO), lithia (Li
2O), sodium oxide molybdena (Na
2O), potassium oxide (K
2O), boron oxide (B
2O
3), vanadium oxide (V
2O
5), zinc oxide (ZnO), tellurium oxide (TeO
2), aluminium oxide (Al
2O
3), silicon dioxide (SiO
2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P
2O
5), ruthenium-oxide (Ru
2O), rubidium oxide (Rb
2O), rhodium oxide (Rh
2O), iron oxide (Fe
2O
3), cupric oxide (CuO), titanium oxide (TiO
2), tungsten oxide (WO
3), bismuth oxide (Bi
2O
3), antimony oxide (Sb
2O
3), lead-borate glass, tin-phosphate glass, vanadate glass and borosilicate etc.In an embodiment, the size of these particles is in about 2 μ m in the scope of about 30 μ m, preferably be in about 5 μ m in the scope of about 10 μ m, but described size is not limited thereto.The size of described particle can and head substrate 1061 and bottom substrate 1002 between or the distance that is formed between any layer that contacts with frit-sealed 1071 on these substrates the same big.
The frit material that is used to form seal 1071 can also comprise one or more fillers or additive material.Can be by overall thermal expansion characteristics that described filler or additive material adjustment seal 1071 is provided and/or the absorption characteristic of adjusting seal 1071 at the selected frequency of incident radiation energy.Described filler or additive material can also comprise counter-rotating (inversion) and/or additive filler, to adjust the thermal coefficient of expansion of frit.For example, described filler or additive material can comprise the transition metal such as chromium (Cr), iron (Fe), manganese (Mn), cobalt (Co), copper (Cu) and/or vanadium.The additional materials that is used for described filler or additive comprises ZnSiO
4, PbTiO
3, ZrO
2, eucryptite.
In an embodiment, comprise about 20 to about 90wt% glass particle as the frit material of dry ingredient, all the other comprise filler and/or additive.In certain embodiments, frit slurry comprises the inorganic material of organic material and the about 70-90wt% of about 10-30wt%.In certain embodiments, frit slurry comprises the inorganic material of organic material and the about 80wt% of about 20wt%.In certain embodiments, described organic material can comprise the binder (binder) of about 0-30wt% and the solvent of about 70-100wt%.In certain embodiments, about 10wt% of organic material is a binder, and approximately 90wt% is a solvent.In certain embodiments, inorganic material can comprise the additive of about 0-10wt%, the approximately filler of 20-40wt% and the approximately glass dust of 50-80wt%.In certain embodiments, about 0-5wt% of inorganic material is an additive, and approximately 25-30wt% is a filler, and approximately 65-75wt% is a glass dust.
In the process that forms glass frit seal, in dry glass material material, add fluent material, to form frit slurry.Can adopt and anyly have or do not have the organic or inorganic solvent of additive as described fluent material.In an embodiment, described solvent comprises one or more organic compounds.For example, available organic compound is ethyl cellulose, nitrocellulose, hydroxy propyl cellulose, refuse worm acetate (butyl carbitol acetate), terpineol, ethylene glycol monobutyl ether, acrylates compound.So, can on top board and/or base plate 1061,1002, apply the frit slurry that so forms, to form the profile of seal 1071.
In an one exemplary embodiment, form the shape of seal 1071 at first by frit slurry, and it is inserted between top board 1061 and the base plate 1002.In certain embodiments, seal 1071 can be solidified in advance or is sintered on one of top board and base plate 1061,1002.To top board 1061 and base plate 1002 be inserted into after therebetween seal 1071 assembles, the part of seal 1071 is heated selectively, thereby makes the frit material partial melting at least that forms seal 1071.Afterwards, make seal 1071 solidification again, thereby between top board 1061 and base plate 1002, form firm joint, prevent that thus besieged OLED pel array 1021 is exposed under oxygen or the moisture.
In an embodiment, by implement selection heating such as the illumination of laser or directional ir lamp to glass frit seal.As previously mentioned, the frit material that forms seal 1071 can be combined with one or more additives or filler, for example, selected additive or filler can be the materials that is used to improve to the absorption of irradiates light, promoting being heated and melting of frit material, thereby form seal 1071.
In certain embodiments, OLED device 1011 can be produced in batches.In the embodiment shown in Fig. 7 E, on common floor substrate 1101, form a plurality of independent OLED arrays 1021.In an illustrated embodiment, each OLED array 1021 is enclosed by the molding glass material package that is used to form seal 1071.In an embodiment, public head substrate (not shown) is placed on common floor substrate 1101 and the structure formed thereon, make OLED array 1021 and molding glass slip material be inserted between common floor substrate 1101 and the public head substrate.For example, closed process encapsulation and the sealing OLED array 1021 by above being used for single OLED display unit.Products therefrom comprises a plurality of OLED that keep one by common floor and head substrate.Afterwards, products therefrom is cut into a plurality of, each piece has constituted the OLED device 1011 shown in Fig. 7 D.In certain embodiments, after this each OLED device 1011 is implemented extra encapsulation operation, thereby further improve the sealing that forms by glass frit seal 1071 and top and bottom substrate 1061 and 1002.
In one embodiment, a kind of organic light emitting display (OLED) device comprises first substrate and second relative with the described first substrate substantially substrate with first outer surface and first inner surface.Second substrate has second outer surface and second inner surface.Described OLED device also comprises the array of organic light emitting pixels that is inserted between described first and second substrates.Described OLED also comprises and being inserted between described first and second substrates, simultaneously around the glass frit seal of described array.The residing enclosure space of described array has been defined in the combination of described glass frit seal, first substrate and second substrate.
Described second substrate can have certain curvature, and has radius of curvature.Described curvature can be crossed over whole second substrate and be formed.In other embodiments, described curvature can be formed in a part of second substrate.Second substrate can have enough big curvature, and the situation that does not have curvature with second substrate is compared, and it can fully reduce the Newton's ring on second substrate.
In one embodiment, radius of curvature can be in about 0.2m in the scope of about 200m.Described radius of curvature can be selected from following set: 0.2m, 0.3m, 0.4m, 0.5m, 0.75m, 1m, 1.25m, 1.5m, 1.75m, 2m, 2.25m, 2.5m, 2.75m, 3m, 3.25m, 3.5m, 3.75m, 4m, 4.25m, 4.5m, 4.75m, 5m, 5.25m, 5.5m, 5.75m, 6m, 6.25m, 6.5m, 6.75m, 7m, 7.25m, 7.5m, 7.75m, 8m, 8.25m, 8.5m, 8.75m, 9m, 9.25m, 9.5m, 9.75m, 10m, 15m, 20m, 25m, 30m, 35m, 40m, 45m, 50m, 55m, 60m, 65m, 70m, 75m, 80m, 85m, 90m, 100m, 110m, 120m, 130m, 140m, 150m, 160m, 170m, 180m, 190m and 200m.Those skilled in the art will recognize that described radius of curvature can change according to OLED device size and structure.
In another embodiment, be between the tangent line of edge of described second inner surface and described first outer surface and have an angle.Described tangent line is perpendicular to the edge of described second inner surface.Described angle is greater than 0 °, and compares when being 0 ° with this angle, and it is enough to fully reduce the Newton's ring on second substrate.In one embodiment, described angle can be in about 0.05 spend about 15 the degree between.Described angle can be selected from following set: 0.05,0.06,0.07,0.08,0.09,0.10,0.11,0.12,0.13,0.14,0.15,0.16,0.17,0.18,0.19,0.20,0.21,0.22,0.23,0.24,0.25,0.26,0.27,0.28,0.29,0.30,0.31,0.32,0.33,0.34,0.35,0.36,0.37,0.38,0.39,0.40,0.41,0.42,0.43,0.44,0.45,0.46,0.47,0.48,0.49,0.50,0.51,0.52,0.53,0.54,0.55,0.56,0.57,0.58,0.59,0.60,0.61,0.62,0.63,0.64,0.65,0.66,0.67,0.68,0.69,0.70,0.71,0.72,0.73,0.74,0.75,0.76,0.77,0.78,0.79,0.80,0.81,0.82,0.83,0.84,0.85,0.86,0.87,0.88,0.89,0.90,0.91,0.92,0.93,0.94,0.95,0.96,0.97,0.98,0.99,1,2,3,4,5,6,7,8,9,10,11,12,13,14 and 15 degree.Those skilled in the art will recognize that described angle can change according to OLED device size and structure.
Fig. 1 shows the sectional view according to the organic light emitting display of first embodiment.With reference to figure 1, organic light emitting display 100 comprises first substrate 110, second substrate 150 and frit 130.First substrate 110 comprises pixel region 120a and the non-pixel region 120b that has formed at least one Organic Light Emitting Diode (OLED) in it.Second substrate 150 is arranged on the pixel region 120a and the non-pixel region 120b of at least a portion of first substrate 110.Between the non-pixel region 120b of first substrate 110 and second substrate 150, provide frit 130.In first substrate 110 and second substrate 150 at least one can become and outwards protrude.
The frits 130 that first substrate 110 and second substrate 150 are adhered to mutually are provided between the non-pixel region 120b of first substrate 110 and second substrate 150.Term " frit " can refer to powder-type glass.Under this paper background, frit also can refer to perhaps refer to the solid glass by the sclerosis of powder-type glass is obtained by add gel or the slurry type glass that organic material obtains in powder-type glass.
Can on the outermost contour of second substrate 150 in the outside that is positioned at frit 130, form sealant 140.The sealant 140 that is formed at the outside of frit 130 has improved the adhesive strength between first substrate 110 and second substrate 150.At the outside of frit 130 formation sealant 140 as shown in the figure.In other embodiments, can form sealant 140 in the inboard of frit 130.
As shown in Figure 1, the outer side center projection of second substrate 150.Because the outer side center of second substrate 150 is protruding, therefore the distance between the center of the center of first substrate 110 and second substrate 150 is greater than the height between frit 130 or the sealant 140.For example, when the reflectivity of first substrate 110 is about 60 to about 70% (LTPS glass), the reflectivity of second substrate 150 is approximately 4% (naked glass), can make the distance between first substrate 110 and second substrate 150 keep being not less than 10 μ m.This structure can prevent to produce Newton's ring.Second substrate 150 can be formed by seamed edge glass (edge glass) or naked glass (bare glass).When second substrate 150 was formed by seamed edge glass, the distance along seamed edge between first substrate 110 and second substrate 150 was not less than tens μ m.Therefore, can reduce optical interference intensity.
Fig. 2 A shows sectional view according to the manufacture method of the organic light emitting display of first embodiment to Fig. 2 E.Fig. 3 is the sectional view according to the angle of curvature of second substrate of first embodiment.
With reference to figure 2A, substrate 110 comprises the pixel region 120a that formed at least one OLED that comprises first electrode, organic layer and second electrode in it and around the non-pixel region 120b of pixel region 120a.Second substrate 150 that will be used to seal first substrate 110 places under first substrate 110.
With reference to figure 2B, the regional coated glass material 130 on second substrate 150 corresponding to non-pixel region 120b.Frit 130 can comprise the filler (not shown) that is used to control thermal coefficient of expansion and be used for absorbing ultraviolet ray or ultrared absorbent (not shown) as additive.In one embodiment, described frit can comprise powder-type glass and oxide powder.Obtain powder-type glass by the temperature decrease that makes glass material.Add organic material to frit, to obtain the gel-type slurry.Afterwards, under predetermined temperature, frit 130 is annealed, thereby remove organic material, and make the sclerosis of gel-type frit slurry, thereby obtain solid glass material 130.To the temperature of frit 130 annealing can be in about 300 ℃ in about 700 ℃ scope.
With reference to figure 2C, on the outermost contour of second substrate 150 in the outside that is positioned at frit 130, form sealant 140.The sealant 140 that is formed at the outside of frit 130 has improved the adhesive strength between first substrate 110 and second substrate 150.Can form sealant 140 by bar coating (bar coating) method that adopts sputter or seal roller (roller).
With reference to figure 2D, first substrate 110 and second substrate 1 50 are inserted the vacuum chamber (not shown).After first substrate 110 and second substrate 150 are inserted vacuum chamber, can adopt the pressure control measure pressure in the vacuum chamber to be brought down below the negative pressure of atmospheric pressure (760 holder).In this embodiment, first substrate that keeps pressure in the vacuum chamber to be higher than not adhering to mutually and the pressure P1 between second substrate, thereby the atmospheric pressures that make first substrate 110 that adheres to mutually and the pressure between second substrate 120 remain 760 holders.At hypothesis P
1* V
1=P
2* V
2The time, first substrate that does not adhere to mutually and the pressure between second substrate and the volume value that first substrate that the value that obtains equals to adhere to mutually and the pressure between second substrate and volume multiply each other and obtain that multiplies each other.Can be by equation 1 expression pressure P1.
P
1＝760*V
2/V
1
Wherein, P
1, V
1, P
2And V
2First substrate and pressure between volume, first substrate that adheres to mutually and second substrate between the pressure between second substrate, first substrate that does not adhere to mutually and second substrate and the volume between first substrate that adheres to mutually and second substrate that do not adhere to mutually of expression respectively.
Afterwards, by physical force (physical force) first substrate 110 and second substrate 150 are adhered to mutually.Therefore, can make the pressure of the gas molecule between first substrate 110 and second substrate 150 be kept above pressure P1.
With reference to figure 2E, destroy the vacuum in the vacuum chamber, first substrate 110 and second substrate 120 that adhere to mutually are exposed under the atmospheric pressure.After first substrate 110 that will adhere to mutually and second substrate 150 are exposed under the atmospheric pressure, under the effect of pressure between first substrate 110 that adheres to mutually and second substrate 150 and the pressure difference between the atmospheric pressure (pressure reduction), the volume that is present in the gas molecule between first substrate 110 and second substrate 150 has increased the amount that depends on described pressure reduction.Therefore, first substrate 110 and second substrate 150 outwards expand.
Angle (with reference to figure 3) by equation 2 expression first substrates and second substrate.
Equation 2
h＞10μm
tanα＝h/a
h＝a*tanα＞10μm
Therefore, α＞tan
-1(10/a)
Wherein, α＜45 °, the β value is unrestricted.
In equation 2, α, β, h, a and b represent the peak height of bending of 1/2 and second substrate of the length of the angle that forms corresponding to the angle of the distance between first substrate and second substrate, by the peak value between the two ends of crooked and second substrate of second substrate of expansion, the height that is arranged at the frit between first substrate and second substrate, second substrate respectively.
Can provide vacuum pump or aspirator in first substrate 110 and second substrate 150 at least one, under differential pressure action, slippage take place to prevent substrate.For example, a plurality of inlet (not shown) that are used to suck air are set on a surface of first substrate 110.Described inlet is connected to air suction apparatus such as the vacuum pump (not shown), and described air suction apparatus is arranged at a side of first substrate 110 by outlet.Therefore, will be drawn into air within first substrate 110 by inlet by outlet is discharged in the air suction apparatus such as vacuum pump.The vacuum draw plate that employing is positioned under first substrate 110 is fixed one of first substrate 110 and second substrate 150, thereby prevents the slippage of first substrate 110 and second substrate 150, and the shape that changes the expection substrate.
In one embodiment, first substrate 110 is fixed on the described plate, only allows second substrate 150 to become protruding thus by expansion by said method.Because the center of second substrate 150 is by the expansion projection that becomes, therefore, make distance between the center of first substrate 110 that adheres to mutually and second substrate 150 keep height greater than frit 130 or sealant 140.
Afterwards, irradiating laser or infrared ray on frit 130, thus make frit 130 fusings.Therefore, first substrate 110 and second substrate 150 are interconnected.
Fig. 4 shows the sectional view according to the organic light emitting display of second embodiment.With reference to figure 4, described organic light emitting display comprises: first substrate 210, and it comprises pixel region 220a that has formed at least one Organic Light Emitting Diode (OLED) in it and the non-pixel region 220b that is in outside the pixel region 220a; Second substrate 250, it is attached to a zone that comprises pixel region 220a of first substrate 210; And frit 230, it is arranged between the non-pixel region and second substrate 250 of first substrate 210.In first substrate 210 and second substrate 250 at least one formed cave inward.
For fear of lengthy and tedious, with the explanation of omitting to first substrate 210, frit 230 and sealant 240 because these all be with above-mentioned first embodiment in components identical.
Fig. 5 A shows schematic sectional view according to the manufacture method of the organic light emitting display of second embodiment to Fig. 5 E.Fig. 6 is the sectional view according to the angle of curvature of second substrate of second embodiment.
With reference to figure 5A, substrate 210 comprises that having formed at least one in it comprises the pixel region 220a of first electrode, organic layer and second electrode and be positioned at non-pixel region 220b outside the pixel region 220a.Second substrate 250 that will be used to seal first substrate 210 places under first substrate 210.
With reference to figure 5B, apply the zone corresponding to non-pixel region 220b of second substrate 250 with frit 230, thereby seal the pixel region 220a of first substrate 210.With reference to figure 5C, on the outermost contour of second substrate 250 in the outside that is positioned at frit 230, form sealant 240.
With reference to figure 5D, first substrate 210 and second substrate 250 are inserted the vacuum chamber (not shown).After first substrate 210 and second substrate 250 are inserted vacuum chamber, adopt the pressure control measure pressure in the vacuum chamber to be brought down below the negative pressure of atmospheric pressure (760 holder).At this moment, first substrate that keeps pressure in the vacuum chamber to be lower than not adhering to mutually and the pressure P1 between second substrate, thereby the atmospheric pressures that make first substrate 210 that adheres to mutually and the pressure between second substrate 220 remain 760 holders.At hypothesis P
1* V
1=P
2* V
2The time, first substrate that does not adhere to mutually and the pressure between second substrate and the volume value that first substrate that the value that obtains must equal to adhere to mutually and the pressure between second substrate and volume multiply each other and obtain that multiplies each other can be by equation 3 expression pressure P1.
Equation 3
P
1＝760*V
2/V
1
In equation 3, P
1, V
1, P
2And V
2First substrate and pressure between volume, first substrate that adheres to mutually and second substrate between the pressure between second substrate, first substrate that does not adhere to mutually and second substrate and the volume between first substrate that adheres to mutually and second substrate that do not adhere to mutually of expression respectively.
Equation 3 expression Boyle's laws, wherein, gas pressure intensity and volume are inversely proportional under the uniform temperature.That is to say, exerting pressure from the outside that gas volume was reduced to, and gas concentration is double at 1/2 o'clock, the gas collisions number of times of unit interval is double, thereby pressure is double.On the contrary, when reducing external pressure, gas expands, thereby gas volume increases.Therefore, under the uniform temperature, the volume and the pressure of uniform gas are inversely proportional to.
Afterwards, by physical force first substrate 210 and second substrate 250 are adhered to mutually.Therefore, can make the pressure of the gas molecule between first substrate 210 and second substrate 250 keep below pressure P
1
With reference to figure 5E, destroy the vacuum in the vacuum chamber, first substrate 210 and second substrate 220 that adhere to mutually are exposed under the atmospheric pressure.Be lower than pressure P will being in
1Negative pressure under first substrate 210 that adheres to mutually and second substrate 250 be exposed to atmospheric pressure following time, under the effect of pressure between first substrate 110 that adheres to mutually and second substrate 150 and the pressure difference between the atmospheric pressure (pressure reduction), the volume that is present in the gas molecule between first substrate 110 and second substrate 150 reduces.Therefore, first substrate 210 and second substrate 250 inwardly shrink.
Angle (with reference to figure 6) by equation 4 expression first substrates and second substrate.
Equation 4
h’-b’＞10μm
tanα’＝h’/a’，tanβ’＝b’/a’
Therefore, h '=a ' * tan α ', b '=a ' * tan β '
a’*(tanα’-tanβ’)＞10μm
Tan β '＜(tan α '-10 μ m/a '), wherein, a '＞0, α ', β '＜45 °
β’＜tan
-1((h’-10μm)/a’)
In equation 4, α ', β ', h ', a ' and b ' represent the peak height of bending of 1/2 and second substrate of the length of the angle that forms corresponding to the angle of the distance between first substrate and second substrate, by the peak value between the two ends of crooked and second substrate of second substrate that shrinks, the height that is arranged at the frit between first substrate and second substrate, second substrate respectively.
In one embodiment, at least one in first substrate 210 and second substrate 250 comprises vacuum pump or aspirator, under differential pressure action slippage takes place to prevent substrate.For example, a plurality of inlet (not shown) that are used to suck air are set on a surface of first substrate 210.Described inlet is connected to air suction apparatus such as the vacuum pump (not shown), and described air suction apparatus is arranged at a side of first substrate 210 by outlet.Therefore, will be drawn into air within first substrate 210 by inlet by outlet is discharged in the air suction apparatus such as vacuum pump.The vacuum draw plate that employing is positioned under first substrate 210 is fixed one of first substrate 210 and second substrate 250, thereby prevents the slippage of first substrate 210 and second substrate 250, and the shape that changes the expection substrate.
In one embodiment, first substrate 210 is fixed on the described plate, the center of second substrate 250 is shunk and the depression that becomes by said method.Keep the predetermined pressure between first substrate 210 and second substrate 250, thereby might prevent second substrate 250 sagging (sagged).
Afterwards, irradiating laser or infrared ray on frit 230, thus make frit 230 fusings.Therefore, make first substrate 210 and second substrate 250 bonding mutually.
As mentioned above,, control the pressure between first substrate and second substrate, thereby the distance between first substrate and second substrate is kept evenly according to described embodiment.Therefore, might prevent to produce the Newton's ring that is shown on the screen, i.e. concentric ring.
Although showed and described several embodiments of the present invention, those skilled in the art will be appreciated that, can make a change in these embodiments and not break away from principle of the present invention and spirit, and scope of the present invention is by claim and be equal to important document and define.
The application requires the korean patent application No.10-2006-0016480 that submits in Korea S Department of Intellectual Property respectively at February 20 in 2006 and on April 19th, 2006 and the rights and interests of No.10-2006-0035456, at this it is introduced for your guidance in full.
Claims (29)
1. organic light-emitting display device comprises:
First substrate, it comprises first outer surface and first inner surface;
Second substrate, it is relative with described first substrate substantially, and described second substrate comprises second outer surface and second inner surface;
Array of organic light emitting pixels, it is inserted between described first and second substrates; And
Glass frit seal, it is inserted between described first and second substrates, and around described array, wherein, the residing enclosure space of described array has been defined in the combination of described glass frit seal, described first substrate and described second substrate simultaneously;
Wherein, described second substrate has curvature, compares with the situation that described second substrate does not have curvature, and it is enough to fully reduce the Newton's ring on described second substrate.
2. device according to claim 1, wherein, the radius of described curvature is in about 0.2 meter and arrives in about 100 meters scope.
3. device according to claim 1, wherein, described second substrate is outwardly-bent.
4. device according to claim 1, wherein, described second substrate curves inwardly.
5. device according to claim 1, wherein, described second substrate is more more soft than described first substrate.
6. device according to claim 1, wherein, described enclosure space has and the essentially identical gas pressure intensity of atmospheric pressure.
7. device according to claim 1, wherein, the distance between described first and second inner surfaces is greater than about 10 μ m.
8. device according to claim 7, wherein, described first substrate has about 60% to about 70% reflectivity, and wherein, described second substrate has about 4% reflectivity.
9. device according to claim 1, wherein, described second substrate comprises the material of selecting from the set that is made of naked glass and seamed edge glass.
10. device according to claim 1 also comprises: be inserted in another hermetically-sealed construction between described first and second substrates, wherein, described another hermetically-sealed construction is around described glass frit seal.
11. device according to claim 10, wherein, described another hermetically-sealed construction and described glass frit seal form the slit between the two.
12. device according to claim 1, wherein, described glass frit seal comprises one or more materials of selecting from following set: magnesium oxide, calcium oxide, barium monoxide, lithia, sodium oxide molybdena, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminium oxide, silicon dioxide, lead oxide, tin oxide, phosphorous oxide, ruthenium-oxide, rubidium oxide, rhodium oxide, iron oxide, cupric oxide, titanium oxide, tungsten oxide, bismuth oxide, antimony oxide, lead-borate glass, tin-phosphate glass, vanadate glass and borosilicate.
13. an organic light-emitting display device comprises:
First substrate, it comprises first outer surface and first inner surface;
Second substrate, it is relative with described first substrate substantially, and described second substrate comprises second outer surface and second inner surface;
Be inserted in the array of organic light emitting pixels between described first and second substrates; And
Glass frit seal, it is inserted between described first and second substrates, and around described array, wherein, the residing enclosure space of described array has been defined in the combination of described glass frit seal, described first substrate and described second substrate simultaneously,
Wherein, described second substrate has curvature, wherein, has angle between the tangent line of the edge of described second inner surface and described first outer surface, described tangent line is perpendicular to the described edge of described second inner surface, and wherein, described angle is greater than 0 °, and with when this angle is 0 °, compare it and be enough to fully reduce Newton's ring on described second substrate.
14. device according to claim 13, wherein, described second substrate is outwardly-bent.
15. device according to claim 13, wherein, described second substrate curves inwardly.
16. device according to claim 13, wherein, described enclosure space has and the essentially identical gas pressure intensity of atmospheric pressure.
17. device according to claim 13, wherein, described second substrate is more more soft than described first substrate basically.
18. a method of making organic light-emitting display device, described method comprises:
First substrate and array of organic light emitting pixels are provided, and described matrix-like is formed on described first substrate;
On described first substrate, second substrate is set, thereby makes described array between described first and second substrates;
Under predetermined gas pressure, the frit of between described first and second substrates, planting, and make it around described array, wherein, the residing enclosure space of described array has been defined in the combination of described frit, described first substrate and described second substrate, and described predetermined gas pressure is different from atmospheric pressure substantially;
Make the fusing of described frit and be cured to once more on described first and second substrates, thus the basic described enclosure space of gas-tight seal; And
Described device is placed under the atmospheric pressure, thereby in described second substrate, form curvature.
19. method according to claim 18, wherein, after forming described curvature, the described gas pressure intensity in the described enclosure space equals the atmospheric pressure outside the described enclosure space substantially.
20. method according to claim 18 wherein, in described fusing with again in the solidification process, keeps described predetermined gas pressure substantially.
21. method according to claim 18, wherein, described predetermined gas pressure is higher than atmospheric pressure substantially.
22. method according to claim 21, wherein, after placing described device under the atmospheric pressure, described second substrate is outwardly-bent substantially.
23. method according to claim 21, wherein, described predetermined gas pressure is greater than atmospheric pressure.
24. method according to claim 18, wherein, described predetermined gas pressure is lower than atmospheric pressure substantially.
25. method according to claim 24, wherein, after placing described device under the atmospheric pressure, described second substrate curves inwardly substantially.
26. method according to claim 24, wherein, described predetermined gas pressure is lower than atmospheric pressure.
27. method according to claim 18, wherein, described second substrate is more more soft than described first substrate substantially.
28. method according to claim 18 also comprises: before placing described device under the atmospheric pressure, provide second seal that is inserted between described first and second substrates, wherein, described second seal is around described glass frit seal.
29. method according to claim 18 also comprises: in the process of described frit of planting, control one of outer surface of described first and second substrates by suction.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR16480/06 | 2006-02-20 | ||
| KR20060016480 | 2006-02-20 | ||
| KR35456/06 | 2006-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101026182A true CN101026182A (en) | 2007-08-29 |
Family
ID=38612580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100047614A Pending CN101026182A (en) | 2006-02-20 | 2007-01-30 | Organic light emitting display and method of fabricating the same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100784012B1 (en) |
| CN (1) | CN101026182A (en) |
| TW (1) | TWI338530B (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009143762A1 (en) * | 2008-05-26 | 2009-12-03 | 福建钧石能源有限公司 | Solar cell plate and method for making thereof |
| CN103165821A (en) * | 2011-12-08 | 2013-06-19 | 上海天马微电子有限公司 | Packaging structure of organic light emitting diode (OLED) display module |
| CN103531103A (en) * | 2012-06-29 | 2014-01-22 | 三星显示有限公司 | Display device, and method and apparatus for manufacturing the same |
| CN103681482A (en) * | 2012-09-21 | 2014-03-26 | 上海天马微电子有限公司 | An OLED display device and a packaging method thereof |
| CN103811432A (en) * | 2012-11-12 | 2014-05-21 | 财团法人工业技术研究院 | Environment sensitive electronic element packaging body |
| WO2014187032A1 (en) * | 2013-05-24 | 2014-11-27 | 京东方科技集团股份有限公司 | Oled display panel, packaging method therefor, and display apparatus |
| CN105655503A (en) * | 2016-03-01 | 2016-06-08 | 京东方科技集团股份有限公司 | Display panel sealing method, display panel and display device |
| WO2016101403A1 (en) * | 2014-12-26 | 2016-06-30 | 深圳市华星光电技术有限公司 | Organic light-emitting diode packaging structure and packaging method |
| WO2017124723A1 (en) * | 2016-01-21 | 2017-07-27 | 京东方科技集团股份有限公司 | Substrate-lifting device, substrate packaging apparatus and method |
| CN111095290A (en) * | 2019-11-20 | 2020-05-01 | 深圳市汇顶科技股份有限公司 | Optical fingerprint identification device under screen, system, reflective film and liquid crystal display screen |
| CN112259700A (en) * | 2020-10-23 | 2021-01-22 | 上海天马有机发光显示技术有限公司 | Display panel, display device and forming method of display panel |
| US11032924B2 (en) | 2012-06-29 | 2021-06-08 | Samsung Display Co., Ltd. | Display device, and method and apparatus for manufacturing the same |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100918402B1 (en) | 2008-02-01 | 2009-09-24 | 삼성모바일디스플레이주식회사 | Organic light emitting display apparatus and method of manufacturing thereof |
| KR101351409B1 (en) * | 2009-06-03 | 2014-01-14 | 엘지디스플레이 주식회사 | Organic Electro-luminescence Display Device and Method For Fabricating Thereof |
| KR100943188B1 (en) * | 2009-07-09 | 2010-02-19 | 삼성모바일디스플레이주식회사 | Organic light emitting display apparatus |
| KR101065402B1 (en) | 2009-08-13 | 2011-09-16 | 삼성모바일디스플레이주식회사 | Organic light emitting diode display |
| KR101174873B1 (en) | 2009-08-14 | 2012-08-17 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and method of manufacturing the same |
| KR101256026B1 (en) * | 2009-11-24 | 2013-04-18 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
| KR102264651B1 (en) | 2015-02-03 | 2021-06-15 | 삼성디스플레이 주식회사 | Display apparatus and method for manufacturing the same |
| CN110931539B (en) * | 2019-12-20 | 2022-09-09 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100394060B1 (en) * | 2001-01-12 | 2003-08-06 | 주식회사 유피디 | Exhausting method and apparatus for flat display pannel |
| US6688365B2 (en) * | 2001-12-19 | 2004-02-10 | Eastman Kodak Company | Method for transferring of organic material from a donor to form a layer in an OLED device |
| KR100433992B1 (en) * | 2002-04-25 | 2004-06-04 | 엘지.필립스 엘시디 주식회사 | Dual Panel Type Organic Electroluminescent Device and Method for Fabricating the same |
| US6998776B2 (en) | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
| KR100603345B1 (en) * | 2004-05-25 | 2006-07-20 | 삼성에스디아이 주식회사 | Manufacturing method of plat panel display device, plat panel display device, and panel of plat panel display device |
-
2006
- 2006-04-19 KR KR1020060035456A patent/KR100784012B1/en active IP Right Grant
- 2006-12-28 TW TW095149421A patent/TWI338530B/en active
-
2007
- 2007-01-30 CN CNA2007100047614A patent/CN101026182A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009143762A1 (en) * | 2008-05-26 | 2009-12-03 | 福建钧石能源有限公司 | Solar cell plate and method for making thereof |
| CN103165821A (en) * | 2011-12-08 | 2013-06-19 | 上海天马微电子有限公司 | Packaging structure of organic light emitting diode (OLED) display module |
| US11032924B2 (en) | 2012-06-29 | 2021-06-08 | Samsung Display Co., Ltd. | Display device, and method and apparatus for manufacturing the same |
| CN103531103A (en) * | 2012-06-29 | 2014-01-22 | 三星显示有限公司 | Display device, and method and apparatus for manufacturing the same |
| US11627670B2 (en) | 2012-06-29 | 2023-04-11 | Samsung Display Co., Ltd. | Display device, and method and apparatus for manufacturing the same |
| US11564321B2 (en) | 2012-06-29 | 2023-01-24 | Samsung Display Co., Ltd. | Display device, and method and apparatus for manufacturing the same |
| US11523522B2 (en) | 2012-06-29 | 2022-12-06 | Samsung Display Co., Ltd. | Display device, and method and apparatus for manufacturing the same |
| US11032918B2 (en) | 2012-06-29 | 2021-06-08 | Samsung Display Co., Ltd. | Display device, and method and apparatus for manufacturing the same |
| CN103681482A (en) * | 2012-09-21 | 2014-03-26 | 上海天马微电子有限公司 | An OLED display device and a packaging method thereof |
| CN103811432A (en) * | 2012-11-12 | 2014-05-21 | 财团法人工业技术研究院 | Environment sensitive electronic element packaging body |
| CN103811432B (en) * | 2012-11-12 | 2016-09-14 | 财团法人工业技术研究院 | Environment sensitive electronic element packaging body |
| WO2014187032A1 (en) * | 2013-05-24 | 2014-11-27 | 京东方科技集团股份有限公司 | Oled display panel, packaging method therefor, and display apparatus |
| WO2016101403A1 (en) * | 2014-12-26 | 2016-06-30 | 深圳市华星光电技术有限公司 | Organic light-emitting diode packaging structure and packaging method |
| US10205133B2 (en) | 2016-01-21 | 2019-02-12 | Boe Technology Group Co., Ltd. | Substrate lifting device, substrate packaging apparatus and substrate packaging method |
| WO2017124723A1 (en) * | 2016-01-21 | 2017-07-27 | 京东方科技集团股份有限公司 | Substrate-lifting device, substrate packaging apparatus and method |
| US10418584B2 (en) | 2016-03-01 | 2019-09-17 | Boe Technology Group Co., Ltd. | Method of sealing display panel, display panel and display device |
| CN105655503A (en) * | 2016-03-01 | 2016-06-08 | 京东方科技集团股份有限公司 | Display panel sealing method, display panel and display device |
| CN111095290A (en) * | 2019-11-20 | 2020-05-01 | 深圳市汇顶科技股份有限公司 | Optical fingerprint identification device under screen, system, reflective film and liquid crystal display screen |
| CN111095290B (en) * | 2019-11-20 | 2023-09-22 | 深圳市汇顶科技股份有限公司 | Under-screen optical fingerprint identification device and system, reflecting film and liquid crystal display screen |
| CN112259700A (en) * | 2020-10-23 | 2021-01-22 | 上海天马有机发光显示技术有限公司 | Display panel, display device and forming method of display panel |
| CN112259700B (en) * | 2020-10-23 | 2023-01-13 | 武汉天马微电子有限公司 | Display panel, display device and forming method of display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070083154A (en) | 2007-08-23 |
| TW200733789A (en) | 2007-09-01 |
| KR100784012B1 (en) | 2007-12-07 |
| TWI338530B (en) | 2011-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101026182A (en) | Organic light emitting display and method of fabricating the same | |
| US8778726B2 (en) | Organic light emitting display and method of fabricating the same | |
| CN100524803C (en) | Organic light-emitting display device and reinforcing structure bonded to frame | |
| CN100524745C (en) | Method for packaging organic light emitting display with frit seal and reinforcing structure | |
| CN100573868C (en) | Organic light emitting display and manufacture method thereof | |
| CN101009316B (en) | Flat panel display device and method of making the same | |
| US8803162B2 (en) | Organic light emitting display of mother substrate unit and method of fabricating the same | |
| US7498186B2 (en) | Method for packaging organic light emitting display with frit seal and reinforcing structure | |
| CN1953199B (en) | Organic electroluminescence display device and method for fabricating of the same | |
| CN100524805C (en) | Flat panel display device and method of making the same | |
| EP1811587B1 (en) | Organic light-emitting display device with frit seal and reinforcing structure | |
| US7385347B2 (en) | Organic electroluminescence display device and manufacturing method thereof | |
| US7586259B2 (en) | Flat panel display device and method of making the same | |
| EP1814184B1 (en) | Organic light emitting display device and a method of manufacturing thereof | |
| EP1921689A1 (en) | Organic light-emitting display device and fabricating method of the same | |
| EP1811590A2 (en) | Organic light-emitting display and method of making the same | |
| EP1814180A2 (en) | Organic light emitting display device and method of fabricating the same | |
| CN100524807C (en) | Organic light emitting display device and a method of manufacturing thereof | |
| CN101009305A (en) | Organic light emitting display and fabricating method of the same | |
| CN101009318A (en) | Organic light-emitting display device and method for fabricating the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20090109 Address after: Gyeonggi Do, South Korea Applicant after: Samsung Mobile Display Co., Ltd. Address before: Gyeonggi Do, South Korea Applicant before: Samsung SDI Co., Ltd. |
|
| ASS | Succession or assignment of patent right |
Owner name: SAMSUNG MOBILE DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG SDI CO., LTD. Effective date: 20090109 |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20070829 |