CN101009305A - Organic light emitting display and fabricating method of the same - Google Patents
Organic light emitting display and fabricating method of the same Download PDFInfo
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- CN101009305A CN101009305A CNA2007100017820A CN200710001782A CN101009305A CN 101009305 A CN101009305 A CN 101009305A CN A2007100017820 A CNA2007100017820 A CN A2007100017820A CN 200710001782 A CN200710001782 A CN 200710001782A CN 101009305 A CN101009305 A CN 101009305A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
Disclosed are an organic light emitting display and a fabricating method of the same, which improve impact resistance and sealing property of a device using a reinforcing member besides a sealant. A first substrate includes a pixel region and a non-pixel region, at least one organic light emitting diode is formed at the pixel region and has a first electrode, an organic layer, and a second electrode, and the non-pixel region is formed at a peripheral portion of the pixel region. A second substrate is bonded to one region of the first substrate having the pixel region. A frit is disposed between the non-pixel region of the first substrate and the second substrate for adhering the first and second substrates to each other. An adhesive being coated to be spaced along a peripheral region of the frit, and including at least two discontinuous portions. A reinforcing member is disposed between the frit and the adhesive.
Description
Technical field
The present invention relates to organic light emitting display and manufacture method thereof, particularly, relate to the encapsulation of organic light emitting display.
Background technology
In recent years, adopt the organic light emitting display of organic light emitting display diode to cause people's attention.Organic light emitting display is an emission display, and it excites organic compound with fluorescent characteristic by electricity and be luminous.This organic light emitting display can drive under low-voltage, and has good luminous property, wide visual angle and high-speed response.
Organic light emitting display comprises a plurality of pixels that are formed on the substrate.Each this pixel comprises Organic Light Emitting Diode and is used to drive the thin-film transistor (TFT) of this Organic Light Emitting Diode.Because Organic Light Emitting Diode is subject to oxygen and influence of moisture, people propose to prevent that with hermetically-sealed construction oxygen and moisture from entering in the pixel.The sealing structure covers deposition substrate with metal cap with absorbent or sealed glass substrate.
United States Patent (USP) 6,998 has disclosed by be sealed with the structure of OLED with the melt coated glass substrate for No. 776.At United States Patent (USP) 6,998, in No. 776, this melt can hermetic sealing substrate and hermetic sealing substrate between the gap, and make this Organic Light Emitting Diode be effectively protected.
Yet the hermetic sealing substrate that is coated with melt in employing is sealed with in the structure of OLED, in the technology of irradiating laser to this melt, because the heat of laser can produce stress on this substrate.This makes that line is fuzzy in the technology that mother substrate is divided into cell substrate, thereby may produce slight crack.Therefore, when carrying out reliability testing, the incidence of defective device increases, and impact resistance degenerates.Discussion in this section provides the background information of correlation technique, rather than constitutes admission of prior art.
Summary of the invention
An aspect of of the present present invention provides a kind of organic light emitting display (OLED) device.This device comprises: first substrate; Second substrate, it is arranged on this first substrate top, and each this first and second substrate is made by individual layer or comprised multilayer; Array of organic light emitting pixels, it is arranged between this first and second substrate; And hermetically-sealed construction, it is arranged between this first and second substrate around this array, and wherein sealing structure, this first substrate and this second substrate engage and limit the confined space that this array is set; Wherein, the sealing structure comprises first member, second member and the 3rd member, and this first member comprises first material, and this second member comprises second material, and the 3rd member comprises the 3rd material, and wherein this second member is arranged between this first and second member and is in contact with it.
This first member can form the closed loop around this array.This second member can form around the closed loop of this first member.The 3rd member can have a discontinuous part around this second member and while basically at least.The 3rd member can comprise two discontinuous parts at least.This at least one discontinuous part can comprise gap or the material different with the 3rd material.This first material can comprise melt.This second material can be identical with the 3rd material.Can there be discernible interface between this second and the 3rd member.This second material can be different from the 3rd material.This second material can comprise and is selected from the group of being made up of epoxy, acrylic acid and urethane resin one or more.The 3rd material can comprise and is selected from the group of being made up of epoxy resin, acrylate, urethane acrylate (urethane acrylate) and acrylate cyanide resin (acrylate cyanide) one or more.
Another aspect of the present invention provides the manufacture method of a kind of organic light emitting display (OLED) device.This method comprises: generator, and it comprises: first substrate; Second substrate, it is arranged on this first substrate top; Array of organic light emitting pixels, it is arranged between this first and second substrate; With first containment member, it is arranged between this first and second substrate and substantially around this array, the 3rd containment member, it is arranged between this first and second substrate, basic simultaneously around this first containment member, have between this first and the 3rd containment member and the space that is limited between this first and second substrate.This method also comprises material is filled in this space and is arranged between this first and second substrate and second containment member between this first and the 3rd containment member with formation.
The 3rd containment member can comprise at least one discontinuous part and center on this first containment member substantially.Filling can comprise that at least one discontinuous part injection material is to this space by this.Filling can also be included in and move this material in this space.In this space, move this material and can utilize plus or minus air pressure.The 3rd containment member can comprise generally and the parallel part of this first containment member of part.This method is solidified this material after can also being included in and being filled in this space.This first containment member can comprise melt and form the closed loop that centers on this array.This second containment member and the 3rd containment member can comprise essentially identical material.The 3rd material can have about 100cp to about 4, the viscosity of 000cp.
Provide this device to comprise: this second substrate to be provided, to be formed on this first containment member on this substrate and to be formed on the 3rd containment member on this second substrate; And this first and second substrate is set, and this array is centered on by this first containment member so that this array is arranged between this first and second substrate.Provide this device to comprise: this first substrate and this first containment member that is formed on this first substrate are provided; Formation is basically parallel to the 3rd containment member of this first containment member, and has the gap therebetween; And this first and second substrate is set, and this array is centered on by this first containment member so that this array is arranged between this first and second substrate.
Provide this device to be included in and the back fusing is set and solidifies to this first containment member of small part again, so that connect this first containment member to this first and second substrate.Forming the 3rd containment member can comprise and utilize silk screen printing or distribution method.
This device can also comprise: the additional arrays of a plurality of organic light emission pixels is arranged between this first and second substrate; A plurality of additional first containment members are arranged between this first and second substrate, and first should center on one of this additional arrays by additional first containment member; A plurality of additional the 3rd containment members, be arranged between this first and second substrate, should add one of the 3rd containment member and be somebody's turn to do additional first containment member substantially around this first, has additional space, this additional space be limited to this first additional first containment member and one of should additional the 3rd containment member between, and wherein this additional space also is present between this first and second substrate; And wherein this method can also comprise packing material to this additional space with formation be arranged on this first additional first containment member and one of should additional the 3rd containment member between additional second containment member.This method can also comprise that the product with gained is cut into a plurality of, the described a plurality of cutting parts that comprise this first substrate, the cutting part of second substrate, this array of organic light emitting pixels, this first containment member, this second containment member and the 3rd containment member.
Another aspect of the present invention provides organic light emitting display and manufacture method thereof, and it also adopts stiffener to improve the shock resistance and the sealing characteristics of device except that adopting sealant.
Another aspect of the present invention provides a kind of organic light emitting display, it comprises: first substrate, it comprises pixel region and non-pixel region, at least one Organic Light Emitting Diode is formed in this pixel region, and have first electrode, organic layer and second electrode, and this non-pixel region is formed on the periphery of this pixel region; Second substrate, it joins on the zone of this first substrate with this pixel region; Melt, it is arranged between this non-pixel region and this second substrate of this first substrate, is used for this first and second substrate bonded to one another; Adhesive, its outer peripheral areas along this melt distributes, and comprises two discontinuous parts at least; And stiffener, it is arranged between this melt and this adhesive.
Further aspect of the present invention provides a kind of manufacture method of organic light emitting display, this organic light emitting display comprises first substrate and second substrate, this first substrate comprises pixel region and non-pixel region, at least one Organic Light Emitting Diode is formed in this pixel region, this non-pixel region is formed on the periphery of this pixel region, and this second substrate joins on the zone that this first substrate has this pixel region, and the step that this method comprises is: (i) the coating melt is to a zone of this second substrate and heat this melt; (ii) along the outer peripheral areas coating adhesive of this melt; This first substrate and this second substrate (iii) are engaged with each other; (iv) solidify this adhesive; (v) radiation laser or infrared ray are to this melt; (vi) a zone by this adhesive forms two discontinuous parts at least; (vii) between this melt and this adhesive, inject stiffener by this discontinuous part.
The present invention provides a kind of manufacture method of organic light emitting display on the other hand, this organic light emitting display comprises first mother substrate and second mother substrate, this first mother substrate comprises at least one pixel region and non-pixel region, Organic Light Emitting Diode is formed in this at least one pixel region, this non-pixel region is formed on the periphery of this pixel region, and this second substrate joins on this first mother substrate, and the step that this method comprises is: (i) the coating melt is to the periphery of the pixel region of this second mother substrate and heat this melt; (ii) coating adhesive separates with the outer peripheral areas with this melt; This first mother substrate and this second mother substrate (iii) are engaged with each other; (iv) solidify this adhesive; (v) radiation laser or infrared ray are to this melt; (first and second mother substrates of vi) dividing this joint become a plurality of display panels; (vii) between this melt and this adhesive, inject stiffener; (viii) solidify this stiffener.
Description of drawings
Engage accompanying drawing, from following description to execution mode, the present invention these and/or others and advantage will become obviously and be easier to understand, wherein:
Fig. 1 is the schematic top plan view of showing according to the organic light emitting display example of execution mode;
Fig. 2 is the schematic top plan view of the hermetic sealing substrate example in this organic light emitting display shown in the exploded view 1;
Fig. 3 is the schematic sectional view of this organic light emitting display shown in Figure 2;
Fig. 4 is the flow chart that illustrates according to the manufacture method of the organic light emitting display of first execution mode;
Fig. 5 A to Fig. 5 F is the schematic diagram that illustrates according to the manufacture method of the organic light emitting display of second execution mode;
Fig. 6 A is the schematic, exploded according to the passive matrix organic light emitting display of an execution mode;
Fig. 6 B is the schematic, exploded according to the active matrix type organic light emitting display of an execution mode;
Fig. 6 C is the schematic top plan view according to the organic light emitting display of an execution mode;
Fig. 6 D is the sectional view that cuts open the organic light emitting display of getting among Fig. 6 C along the d-d line; With
Fig. 6 E illustrates the perspective schematic view of producing in batches according to the organic light emitting apparatus of an execution mode.
Embodiment
Hereinafter, embodiments of the present invention are described with reference to the accompanying drawings.At this, when an element was connected on another element, an element can be to be directly connected on another element and by other element to be connected on another element.And, for clarity sake, omit incoherent element.Equally, the representative of similar reference number identical with functionally similar element.
Organic light emitting display (OLED) is the display unit that comprises organic LED array.Organic Light Emitting Diode is to comprise organic material and be suitable for producing also radiative solid-state device when granting suitable electromotive force.
According to the setting that exciting current is provided, OLED generally can be divided into two kinds of fundamental types.Fig. 6 A schematically shows the decomposition view of the simplified structure of passive matrix OLED1000.Fig. 6 B schematically shows the simplified structure of active array type OLED1001.In two kinds of structures, OLED1000,1001 comprises the OLED pixel that places substrate 1002 tops, and this OLED pixel comprises anode 1004, negative electrode 1006 and organic layer 1010.When granting suitable electric current for anode 1004, electric current flows through this pixel, and from this organic layer visible emitting.
With reference to Fig. 6 A, this passive OLED (PMOLED) design comprises that anode 1004 is rectangular, is arranged to rectangular vertically with negative electrode 1006 generally, and organic layer is arranged on therebetween.The crosspoint that negative electrode 1006 and anode are 1004 limits each OLED pixel, at this OLED pixel place, produces and emission light when suitably the exciting of the striped of the anode 1004 of correspondence and negative electrode 1006.PMOLED provides and has made simple relatively advantage.
With reference to Fig. 6 B, this active OLED (AMOLED) comprises the drive circuit 1012 that is arranged between substrate 1002 and the OLED array.Each AMOLED pixel is limited between common cathode 1006 and the anode 1004, and anode 1004 is isolated with other anode electricity.Each drive circuit 1012 is connected with the anode 1004 of OLED, and further is connected with scan line 1018 with data wire 1016.In execution mode, scan line 1018 provides the sweep signal of the row of selecting this drive circuit, and data wire 1016 provides data-signal for specific drive circuit.This data-signal and sweep signal excite local drive circuits 1O12, and its excitation anode 1004 is to launch light from its corresponding pixel.
In the AMOLED shown in this, local drive circuits 1012, data wire 1016 and scan line 1018 all are embedded in the complanation layer 1014 between pel array and the substrate 1002.Complanation layer 1014 provides the planar top surface that forms array of organic light emitting pixels.Complanation layer 1014 can be formed by the organic or inorganic material, although be shown as individual layer, it is formed by two-layer or multilayer.Local drive circuits 1012 typically forms has thin-film transistor (TFT), and is arranged in grid or array below this OLED pel array.Local drive circuits 1012 can be made by organic material to small part, comprises organic tft.AMOLED has the advantage of fast response time, has improved it and has been used for the performance need of display data signal.Equally, AMOLED has than passive matrix OLED and consumes the still less advantage of power.
With reference to the common trait of PMOLED and AMOLED design, substrate 1002 provides support structure for this OLED pixel and circuit.In each execution mode, substrate 1002 can comprise rigidity or flexible material, and opaque or transparent material, as plastics, glass and/or paillon foil.As mentioned above, each OLED pixel or diode are formed with anode 1004, negative electrode 1006 and are arranged on therebetween organic layer 1010.When granting suitable electric current for anode 1004, negative electrode 1006 injects electronics, and anode 1004 injected holes.In some embodiments, anode 1004 and negative electrode 1006 are put upside down.Promptly this negative electrode is formed on the substrate 1002, and this anode is oppositely arranged.
Be arranged on one or more layers organic layer that is between negative electrode 1006 and the anode 1004.More specifically, at least one emission or luminescent layer are arranged between negative electrode 1006 and the anode 1004.This luminescent layer can comprise the organic compound that one or more are luminous.Typically, this luminescent layer is configured to make its emission monochromatic visible light as blue, green, red or white.In execution mode this illustrate, one deck organic layer 1010 is formed between negative electrode 1006 and the anode 1004, and as luminescent layer.Other layer that can be formed between anode 1004 and the negative electrode 1006 can comprise hole transmission layer, hole injection layer, electron transfer layer and electron injecting layer.
Hole transport and/or implanted layer can be arranged between luminescent layer 1010 and the anode 1004.Electric transmission and/or implanted layer can be arranged between negative electrode 1006 and the luminescent layer 1010.By reducing the work function of injecting electronics from negative electrode 1006, this electron injecting layer helps injecting electronics from negative electrode 1006 to luminescent layer 1010.Similarly, this hole injection layer helps from anode 1004 to luminescent layer 1010 injected holes.This hole and electron transfer layer help moving of the charge carrier that injects to this luminescent layer from each electrode.
In some embodiments, an individual layer can play electronics to be injected and transmits, or plays the hole and inject and transmit.Lack one or more layers of these layers in some embodiments.In some embodiments, be doped with the material that one or more help charge carrier to inject and/or transmit in one or more layers organic layer.Having only one deck organic layer to be formed in the execution mode between negative electrode and the anode, this organic layer not only can comprise organic luminophor, and can include and help that charge carrier in this layer injects or some functional material of transmission.
These layers that multiple organic material is used for comprising luminescent layer have been developed.Equally, among multiple other organic material that is used for these layers is being developed.In some embodiments, these organic layers can be the big molecules that comprises oligomer and polymer.In some embodiments, this organic material that is used for these layers can be relatively little molecule.In specific design, those skilled in the art can be that every layer in these layers is selected suitable material according to the function of every layer of expectation, and be the suitable material of adjacent layer selection.
In operation, circuit provides suitable electromotive force between negative electrode 1006 and anode 1004.This causes electric current to flow to negative electrode 1006 via the organic layer that inserts and puts from anode 1004.In one embodiment, negative electrode 1006 provides the organic layer 1010 that electronics arrives this vicinity.Anode 1004 injected holes are in organic layer 1010.Hole in organic layer 1010 and electronics reconfigure and produce the energy particle that is called " exciton ".This exciton transmits on the luminous organic material of its energy in the organic layer 1010, and this energy is used for from the luminous organic material visible emitting.The spectral characteristic of the light of OLED1000,1001 generations and emission depends on the character and the composition of organic molecule in the organic layer.Those skilled in the art can select the combination of this one or more layers organic layer to satisfy the concrete needs of using.
The OLED device also can be based on photoemissive direction classification.In the type of " top-emission " type of a kind of being called, the OLED device is by negative electrode or top electrodes 1006 luminous and displayed image.In these execution modes, negative electrode 1006 by for visible transparent or at least the material of partially transparent make.In some embodiments, for avoiding any loss that can pass through the light of anode or hearth electrode 1004, this anode can be made by the material of fundamental reflection visible light.Second type OLED device is luminous by this anode or hearth electrode 1004, and it is called " bottom emission " type.In this bottom emissive type OLED device, anode 1004 by for visible light at least the material of partially transparent make.Usually, in bottom emissive type OLED device, negative electrode 1006 is made by the material of fundamental reflection visible light.The OLED device of the third type is luminous at both direction, for example by anode 1004 and negative electrode 1006.According to photoemissive direction, substrate can be formed by the material of transparent, opaque or reflect visible light.
In a lot of execution modes, shown in Fig. 6 C, comprise that the OLED pel array 1021 of a plurality of organic light emission pixels is arranged on substrate 1002 tops.In execution mode, the pixel in the array 1021 is controlled it by the drive circuit (not shown) and is opened and close, and a plurality of pixel display message or image on array 1021 as a whole.In some embodiments, OLED pel array 1021 with respect to other parts as driving and the setting of control electronic equipment, to limit viewing area and non-display area.In these execution modes, this viewing area finger-type becomes the zone of the substrate 1002 of OLED pel array 1021.This non-display area refers to the remaining area of substrate 1002.In execution mode, this non-display area can inclusive disjunction/or power circuit.It should be understood that and have at least part control/components of drive circuit to be arranged in this viewing area.For example, in PMOLED, conductive component can extend to thinks in this viewing area that anode and negative electrode provide suitable electromotive force.In AMOLED, local drive circuits will extend in the viewing area to drive and to control each pixel of this AMOLED with the data/scan line that is connected with this drive circuit.
A kind of design of OLED device and the Consideration of making be, some organic material layer of OLED device can be by being exposed in water, oxygen or other pernicious gas and through undermined or quicken to worsen.Therefore, be understandable that usually, should seal or encapsulate the OLED device, be exposed in moisture or other pernicious gas to prevent that it from causing in manufacturing or operating environment.Fig. 6 D schematically shows the sectional view that has Fig. 6 C layout and cut open the OLED device of getting 1011 that has encapsulated along the d-d line of Fig. 6 C.In this embodiment, normally the top board on plane or substrate 1061 engage with sealing 1071, further engage with base plate or substrate 1002 with sealing or encapsulation OLED pel array 1021 and seal 1071.In other embodiments, one or more layers is formed on top board 1061 or the base plate 1002, and seals 1071 and engage with the end or top board 1002,1061 by such layer.In the execution mode shown in this, sealing is extended along the periphery of OLED pel array 1021 or the end or top substrate 1002,1061.
In execution mode, sealing 1071 is made by the melt material, will further discuss below.In various execution modes, top and bottom plate 1061,1002 comprises can provide the material that stops for oxygen and/or aquaporin, and as plastics, glass and/or metal forming, thereby protection OLED pel array 1021 is not exposed in these materials.In execution mode, top board 1061 and base plate 1002 one of them material by substantially transparent form at least.
For prolonging the life-span of OLED device 1011, wish that usually sealing 1071 and top and bottom plate 1061,1002 can provide the sealing of impermeable substantially oxygen G﹠W, and airtight substantially airtight space 1081 is provided.Point out that in some applications the sealing 1071 of melt engages top and bottom plate 1061,1002 can be provided less than about 10
-3Cc/m
2-day oxygen barrier and less than 10
-6G/m
2The water resistance retaining in-sky.In some embodiments, if some oxygen and moisture can infiltrate in the confined space 1081, the material that can absorb oxygen and/or moisture then is formed in the confined space 1081.
Shown in Fig. 6 D, the width of sealing 1071 is W, and this is parallel to the thickness of the surface direction of top or base plate 1061,1002 for it.This width changes in execution mode, and scope is from about 300 μ m to about 3000 μ m, preferably from about 500 μ m to about 1500 μ m.Equally, this width also can change on the diverse location of sealing 1071.In some embodiments, at one of the 1071 contact ends of sealing and top board 1002,1061 or formation layer place thereon, the width of sealing 1071 can be maximum.At sealing 1071 other places of contact, this width can be minimum.Change width on sealing 1071 single cross sections relates to cross sectional shape and other design parameter of sealing 1071.
Shown in Fig. 6 D, sealing 1071 has height W, and this is its thickness perpendicular to the direction on the surface of top or base plate 1061,1002.This height in execution mode, change and scope from about 2 μ m to about 30 μ m, preferably from about 10 μ m to about 15 μ m.In general, at the diverse location of sealing 1071, this highly can significant change.Yet in some embodiments, the height of sealing 1071 can change on its diverse location.
In the execution mode shown in this, sealing 1071 has the cross section of rectangle generally.Yet in other embodiments, sealing 1071 can have other multiple cross sectional shape, as square-section generally, trapezoid cross section, the cross section with one or more circular edges or other shape according to given application need generally.For improving sealing, generally wish to increase the interfacial area that sealing 1071 directly contacts the end and top board 1002,1061 or formation layer thereon.In some embodiments, the shape that can design sealing can increase this interfacial area.
As mentioned above, in some embodiments, seal 1071 usefulness melt materials or simple " melt " or comprise that the melted glass of meticulous glass particle forms.This melt particle comprises magnesium oxide (MgO), calcium oxide (CaO), barium monoxide (BaO), lithia (Li
2O), sodium oxide molybdena (Na
2O), potassium oxide (K
2O), boron oxide (B
2O
3), vanadium oxide (V
2O
5), zinc oxide (ZnO), tellurium oxide (TeO
2), aluminium oxide (Al
2O
3), silica (SiO
2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P
2O
5), ruthenium-oxide (Ru
2O), rubidium oxide (Rb
2O), rhodium oxide (Rh
2O), iron oxide (Fe
2O
3), cupric oxide (CuO), titanium oxide (TiO
2), tungsten oxide (WO
3), bismuth oxide (Bi
2O
3), antimony oxide (Sb
2O
3), in lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate etc. one or more.In execution mode, the size range of these particles, preferably from about 5 μ m to about 10 μ m but is not limited thereto from about 2 μ m to about 30 μ m.This particle can be greatly to the distance between any layer on these substrates of being formed on that is about distance between the top and bottom plate 1061,1002 or the contact of this melt.
This melt material that is used to form sealing 1071 also can comprise one or more fillers or additional materials.Can provide this filler or additional materials to adjust the absorption characteristic that seals 1071 overall thermal expansion characteristics and/or adjust the incident radiation energy of 1071 pairs of selected frequencies of sealing.This filler or additional materials can comprise that also reverse (inversion) and/or additional filler are to adjust the thermal coefficient of expansion of melt.For example, this filler or additional materials can comprise transition metal, as chromium (Cr), iron (Fe), manganese (Mn), cobalt (Co), copper (Cu) and/or vanadium.Be used to fill or the additional materials of additive comprises ZnSiO
4, PbTiO
3, ZrO
2, eucryptite.
In execution mode, comprise the glass particle of about 20wt% to 90wt% as the melt material of dried composition (dry composition), remaining filler and/or the additive of comprising.In some embodiments, this frit paste comprises the inorganic material of organic material He the about 70-90wt% of about 10-30wt%.In some embodiments, this frit paste comprises the inorganic material of organic material He the about 80wt% of about 20wt%.In some embodiments, this organic material can comprise the binding agent of about 0-30wt% and the solvent of about 70-100wt%.In some embodiments, about 10wt% is a binding agent in the organic material, and about 90wt% is a solvent.In some embodiments, this inorganic material can comprise the filler of the additive of about 0-10wt%, about 20-40wt% and the glass powder of about 50-80wt%.In some embodiments, in the inorganic material, about 0-5wt% is an additive, and about 25-30wt% is a filler, and about 65-75wt% is a glass powder.
When forming frit seal, fluent material adds in this dryness melt material to form frit paste.Any organic or inorganic solvent that has or do not have additive can be used as this fluent material.In execution mode, this solvent comprises one or more organic compounds.For example, applicable organic compound is ethyl cellulose, celluloid, hydroxypropyl cellulose (hydroxyl propyl cellulose), diethylene glycol-butyl ether acetic acid esters (butyl carbitol acetate), terpinol (terpineol), ethylene glycol monobutyl ether (butyl cellusolve), acrylate compounds.Then, the frit paste that forms like this can be applied to form the shape of sealing 1071 on top and/or base plate 1061,1002.
In an exemplary embodiment, the shape of sealing 1071 is formed by this frit paste at first, and is arranged between top board 1061 and the base plate 1002.In some embodiments, sealing 1071 can precuring (pre-cured) or presintering (pre-sintered) to top board and base plate 1061,1002.After with the sealing 1071 assembling top boards 1061 and base plate 1002 that are arranged on therebetween, optionally heating part sealing 1071 makes this melt material partial melting at least that forms sealing 1071.Allow sealing 1071 to solidify again then, thereby prevent that the OLED pel array 1021 that seals is exposed to oxygen or water with the firm joint of formation between top board 1061 and base plate 1002.
In execution mode, implement optionally to heat this frit seal by radiant light, as laser or directional ir line lamp.As previously mentioned, this melt material that forms sealing 1071 can engage with one or more additives or filler, is used to improve the kind that this radiant light absorbs as selecting, so that heating and melt this melt material and seal 1071 to form.
In some embodiments, OLED device 1011 is produced in batches.In the execution mode shown in Fig. 6 E, a plurality of independent O led array 1021 are formed on the public substrate 1101.In the execution mode shown in this, each OLED array 1021 is centered on to form sealing 1071 by the melt that is shaped.In execution mode, the superstructure that public top substrate (not shown) is arranged on public substrate 1101 and forms thereon makes the frit paste of OLED array 1021 and this shaping be arranged between public substrate 1101 and this public top substrate.Encapsulation or sealing OLED array 1021 are as the sealing technology by aforesaid single OLED display unit.The product of gained comprises a plurality of OLED devices that keep together by this public end and top substrate.Then, the product with gained cuts into a plurality of, the OLED device 1011 shown in each sheet pie graph 6D.In some embodiments, each OLED device 1011 and then the encapsulation operation of adding, the sealing property that forms by frit seal 1071 and top and bottom plate 1061,1002 with further improvement.
Fig. 1 is the plane graph of showing according to the organic light emitting display example of execution mode.Fig. 2 is the plane graph of the hermetic sealing substrate example in this organic light emitting display shown in the exploded view 1.
See figures.1.and.2, comprise first substrate 100, melt 151, adhesive 152, stiffener 153 and second substrate 200 according to this organic light emitting display of execution mode.
When the temperature of glass material descends rapidly, just produced the melt of glass powder formula.This melt can comprise glass powder and oxide powder.In addition, when organic material adds in this melt, just formed gelatinous frit paste.This gel cream is along the potted line coating of this second substrate.Then, when this melt of sintering under predetermined temperature, organic material is removed, and stays solid-state curing melt.In one embodiment, the scope of this sintering temperature can be from about 300 ℃ to about 700 ℃.
Form adhesive 152, separate with melt 151, and comprise at least two discontinuous parts 52.At least one discontinuous part 52 is as the inlet of stiffener 153.When stiffener 153 was introduced in the gap between melts 151 and the adhesive 152, at least one other discontinuous part 52 can provide outlet for bubble.This structure allows stiffener 153 to be evenly distributed between melt 151 and the adhesive 152.In one embodiment, adhesive 152 can comprise at least a resin that is selected from the group of being made up of epoxy resin, acrylate, urethanes acrylic resin (urethane acrylate) and acrylate cyanide resin (acrylate cyanide).In addition, adhesive 152 forms along sealing line (not shown), and comprises and make adhesive 152 discontinuous at least two the discontinuous parts 52 that become.Can use ultraviolet ray or heat treatment for solidification adhesive 152.
The effect of stiffener 153 is after laser has been radiated on the melt 151, to reduce the impulse force that is applied on the melt 151 in the technical process that the mother substrate (not shown) is divided into unit substrate.Stiffener 153 is arranged between melt 151 and the adhesive 152, and one of the discontinuous part 52 by adhesive 152 is injected between melt 151 and the adhesive 152.At this, first and second substrates 100 and 200 that stiffener 153 can prevent to bond by melt 151 in the substrate marking technical process are owing to the heat that is radiated on this melt damages.Viscosity can be used to form stiffener 153 less than the material of adhesive 152.In one embodiment, stiffener 153 can comprise at least a material that is selected from the group of being made up of epoxy resin, acrylic acid and urethanes.When the viscosity that has when stiffener 153 was equal to or greater than the viscosity of adhesive 152, stiffener 153 may not can well spreads, thereby has hindered the even injection of stiffener 153 by discontinuous part 52.In one embodiment, the viscosity of stiffener 153 changes to the scope of about 4000cp at about 100cp.
Fig. 2 is the plane graph of the hermetic sealing substrate example in this organic light emitting display shown in the exploded view 1.With reference to Fig. 2, this organic light emitting display comprises first substrate 100, melt 151, adhesive 152, stiffener 153 and second substrate 200.
Fig. 3 is the schematic sectional view of this organic light emitting display shown in Figure 2.Comprise deposition substrate 101 and at least one Organic Light Emitting Diode 110 with reference to figure 3, the first substrates 100.At least one Organic Light Emitting Diode 110 is formed on the deposition substrate 101.At first, resilient coating 111 can be formed on the sedimentary deposit 101.Deposition substrate 101 can be formed by glass.Resilient coating 111 can be by insulating material such as silicon oxide sio
2Or silicon nitride SiNx forms.Resilient coating 111 prevents that deposition substrate 101 is owing to outside heat etc. is damaged.
Interlayer insulating film 115 is formed on the top of gate insulation layer 113, covering grid electrode 114.Source and drain electrode 116a and 116b are formed on the presumptive area top of interlayer insulating film 115.Source and drain electrode 116a and 116b are connected to the exposed region of source/drain region 112b.Complanation layer 117 is formed on the interlayer insulating film 115, covering source and drain electrode 116a and 116b.
Pixel defines film 120 and is formed on the complanation layer 117, covers first electrode 119.Pixel defines film 120 and comprises at least one the regional opening (not shown) that exposes first electrode 119.
The pixel that is formed on organic layer 121 defines in this opening of film 120.The pixel that is formed on the second electrode lay 122 defines on the film 120, covers organic layer 121.
Adhesive 152 forms with melt 151 and separates, and comprises at least two discontinuous parts 52.Adhesive 152 extends along the potted line (not shown), and comprises at least two zones and make adhesive 152 discontinuous at least two discontinuous parts 52.
The effect of stiffener 153 is after laser has been radiated on the melt 151, to reduce the outside impulse force that is applied on the melt 151 in the technical process that the mother substrate (not shown) is divided into unit substrate.Stiffener 153 is arranged between melt 151 and the adhesive 152, and injects between melt 151 and the adhesive 152 by the discontinuous part 52 of adhesive 152.At this, stiffener 153 can prevent that first and second substrates 100 and 200 are owing to the heat that is radiated the laser on this melt damages in the substrate marking technical process.
Because melt 151, adhesive 152 and stiffener 153 have been described with reference to Fig. 1 in the front, therefore omitted its more description of details.
For protecting the aforesaid structure that is formed on first substrate 100 to avoid the influence of external oxygen and moisture, adopt melt 151 that second substrate 200 is joined on first substrate 100.In one embodiment, second substrate 200 can comprise and being selected from by silicon oxide sio
2, at least a material in the group formed of silicon nitride SiNx, nitrogen-oxygen-silicon thing SiOxNy.
Fig. 4 is the flow chart that illustrates according to the manufacture method of the organic light emitting display of first execution mode.With reference to Fig. 4, comprise first step ST100 to the seven steps ST700 according to the manufacture method of the organic light emitting display of an execution mode.
First step ST100 is the step of the melt on formation and the zone of heating this second substrate.This melt is arranged between the non-pixel region of this second substrate and this first substrate.In one embodiment, this melt can form with sealing and be formed on pixel region and scanner driver on this first substrate.In another embodiment, this melt can form only to seal pixel region.In some embodiments, this melt comprises filler and absorbent.This filler is adjusted thermal coefficient of expansion.This absorbent absorbs laser or infrared ray.
When the temperature of glass material descends rapidly, just produced the melt of glass powder formula.This melt can comprise glass powder and oxide powder.In addition, when organic material adds in this melt, just formed gelatinous frit paste.This gel cream is along the potted line coating of this second substrate.Then, when this melt of sintering under predetermined temperature, organic material is removed, and stays solid-state curing melt.In one embodiment, the scope of this sintering temperature can be from about 300 ℃ to about 700 ℃.
The second step ST200 is the step along this melt coating adhesive.In one embodiment, this adhesive comprises at least a resin that is selected from the group of being made up of epoxy resin, acrylate, polyurethane acrylate resin (urethaneacrylate) and acrylate cyanide resin (acrylate cyanide).Can adopt silk screen printing or distribution method to implement coating adhesive.In method for printing screen, the layout of expectation is provided on the silk screen, and the zone of silk screen stops with non-penetration material.Adopt squeegee (squeegee) to push the opening of this adhesive by this silk screen.In this distribution method, adopt machine with nozzle, with predetermined shape and quantity this adhesive is applied on this second substrate.
The 3rd step ST300 is engaged with each other the step of this first substrate and this second substrate.This first substrate comprises at least one Organic Light Emitting Diode, first electrode, organic layer and second electrode.This first and second substrate is engaged with each other so that this Organic Light Emitting Diode is arranged between this first and second substrate.
The 4th step ST400 is the step of cure adhesive.This adhesive can solidify by ultraviolet ray or Technology for Heating Processing.
The 5th step ST500 is the step of this melt of fusing.This melt absorbs laser or infrared ray.This melt is melted in this laser or infrared radiation.In one embodiment, the strength range that melts the laser of this melt is about 25 to about 50W.Solidify this melt then so that be engaged with each other this first and second substrate.
The 6th step ST600 is the step that forms discontinuous part at least two zones of this adhesive.After solidifying this adhesive and this melt, bore a hole at least two zones of this adhesive.Therefore, at least two openings are formed in continuous this adhesive that forms of this melt.At least one discontinuous part is as the inlet of this stiffener.When this stiffener was introduced in the gap between this melt and this adhesive, at least one other discontinuous part can provide outlet for bubble.This structure makes this stiffener be evenly distributed between this melt and this adhesive.
The 7th step ST700 is injected into step between this melt and this adhesive by one of this discontinuous part with this stiffener.Because this melt and this adhesive separate each other within a predetermined distance, therefore between this melt and this adhesive, there is empty space.This empty space can prevent that first and second substrates from engaging each other fully.Therefore, this first and second substrate easily is hit.Dividing mother substrate to the technology of cell substrate, in device, be easy to be damaged as crackle.Therefore, form this stiffener filling the vacuum between this melt and this adhesive, and the impulse force that this can the absorption technique process.In one embodiment, this stiffener can comprise the material of viscosity less than adhesive.This stiffener can comprise at least a material that is selected from the group of being made up of epoxy resin, acrylic acid and urethanes.In one embodiment, the viscosity of this stiffener changes to the scope of about 4000cp at about 100cp.The injection technology of this stiffener can utilize capillarity or pressure differential to implement.Then, can solidify this stiffener.This stiffener can solidify by the hot or quick curing of ultraviolet ray.
Fig. 5 A to Fig. 5 F is the diagrammatic sketch that illustrates according to the manufacture method of the organic light emitting display of second execution mode; With reference to Fig. 5 A to Fig. 5 F, this organic light emitting display comprises first mother substrate 1000 and second mother substrate 2000.First mother substrate 1000 comprises at least one pixel region 100a and at least one non-pixel region 100b.Organic Light Emitting Diode is formed among the pixel region 100a.Non-pixel region 100b is formed on the outside of pixel region 100a.Second mother substrate 2000 is connected on first mother substrate 1000.
When making organic light emitting display, in zone, form and sintering melt 151 corresponding to second mother substrate 2000 of the non-pixel region 100b of first mother substrate 1000.Melt 151 is arranged between the non-pixel region 100b of second mother substrate 2000 and first mother substrate 1000.Melt 151 can comprise filler (not shown) and absorbent (not shown).This filler can be adjusted thermal coefficient of expansion.This absorbent absorbs laser and infrared ray.
When the temperature of glass material descends rapidly, just produced the melt of glass powder formula.This melt can comprise glass powder and oxide powder.In addition, when organic material adds in the melt 151, just formed gelatinous frit paste.Gel cream adopts the potted line coating of the first syringe 160a along second mother substrate 2000.Then, when sintering melt 151 under predetermined temperature, organic material is removed, and stays solid-state curing melt.In one embodiment, the scope of this sintering temperature can be from about 300 ℃ to about 700 ℃ (Fig. 5 A).
Next, adopt the second syringe 160b coating adhesive 152 to separate with the outside with melt 151.Adhesive 152 comprises a discontinuous part 52 at least.Discontinuous part 52 is indicated the cut-out zone of the adhesive 152 that separates with predetermined space.At least one discontinuous part 52 can be used as the inlet of stiffener 153.When stiffener 153 can be introduced in the gap between melt 151 and the adhesive 152, at least one other discontinuous part 52 can provide outlet for bubble.When forming two discontinuous parts 52 at least, stiffener 153 can be inserted in the space between melt 151 and the adhesive 152.In one embodiment, adhesive 152 comprises at least a resin that is selected from the group of being made up of epoxy resin, acrylate, polyurethane acrylate resin (urethane acrylate) and acrylate cyanide resin (acrylate cyanide).
In addition, can adopt silk screen printing or distribution coating adhesive.In method for printing screen, the layout of expectation is provided on the silk screen, and the zone of this silk screen stops with non-penetration material.Adopt squeegee (squeegee) to push the opening of this adhesive by this silk screen.In this distribution method, adopt machine with nozzle, with predetermined shape and quantity this adhesive is applied on this second substrate.
Next, be engaged with each other first mother substrate 1000 and second mother substrate 2000.Have at least the OLED (not shown) to be formed on first mother substrate 1000.This Organic Light Emitting Diode can comprise first electrode, organic layer and second electrode.First mother substrate 1000 and second mother substrate 2000 are aligned with each other so that this Organic Light Emitting Diode is arranged between first mother substrate 1000 and second mother substrate 2000 (Fig. 5 C).
Then, cure adhesive 152.Can adopt ultraviolet ray or heat treatment for solidification adhesive 152.
Next, radiation laser or infrared ray are to the melt 151 of waiting to melt and solidifying.Melt 151 can comprise filler (not shown) and absorbent (not shown).This filler can be adjusted thermal coefficient of expansion.This absorbent absorbs laser and infrared ray.The strength range of laser of fusing melt 151 is about 25 to about 60W.Solidify melt 151 to engage on second mother substrate, 2000 to first mother substrates 1000.
Then, first and second mother substrates 1000 and 2000 of joint are divided into a plurality of display floaters 10.Adhesive 152 can prevent that the pressure that produces is delivered to the line surface in line technology.This has reduced the ratio of defects of line technology.
Next, the discontinuous part 52 by adhesive 152 is injected into stiffener 153 between melt 151 and the adhesive 152.Because melt 151 and adhesive 152 separate each other within a predetermined distance, therefore between melt 151 and adhesive 152, there is empty space.This empty space can prevent that first mother substrate 1000 and second mother substrate 2000 from engaging each other fully.Therefore, they are subject to external impact.Dividing mother substrate to the technology of cell substrate, be easy to be damaged as crackle.Therefore, stiffener 153 is filled the space of the sky between melt 151 and the adhesive 152, and the impulse force of absorption technique process.In one embodiment, stiffener 153 can comprise the material of viscosity less than adhesive 152.Stiffener 153 can comprise at least a material that is selected from the group of being made up of epoxy resin, acrylic acid and urethanes.In one embodiment, the viscosity of stiffener 153 changes to the scope of about 4000cp at about 100cp.Equally.The injection technology of this stiffener can utilize capillarity or pressure differential to implement.Then, solidify stiffener 153 (Fig. 5 E).This stiffener can solidify by the hot or quick curing of ultraviolet ray.
According to organic light emitting display and manufacture method thereof, except that adopting sealant, can also adopt stiffener to increase the shock resistance and the anti-stress of device.Therefore, be in the technology of a plurality of cell substrates dividing mother substrate, can reduce the ratio of defects of device.
Although showed and described some execution modes, but what it should be appreciated by those skilled in the art is, can change in these execution modes, and not break away from principle of the present invention and spirit, scope of the present invention is defined by claim and equivalent thereof.
Claims (29)
1, a kind of organic light-emitting display device comprises:
First substrate;
Second substrate, it is arranged on this first substrate, and wherein each this first and second substrate is made by individual layer or is comprised multilayer;
Array of organic light emitting pixels, it is arranged between this first and second substrate; With
Hermetically-sealed construction, it is arranged between this first and second substrate and around this array, wherein sealing structure, this first substrate and this second substrate in combination limit the confined space that this array is set;
Wherein, the sealing structure comprises first member, second member and the 3rd member, and this first member comprises first material, and this second member comprises second material, and the 3rd member comprises the 3rd material, and
Wherein, this second member is arranged between this first and second member and is in contact with it.
2, device as claimed in claim 1, wherein this first member forms the closed loop around this array.
3, device as claimed in claim 1, wherein this second member forms the closed loop around this first member.
4, device as claimed in claim 1, wherein the 3rd member centers on this second member basically, and has at least one discontinuous part.
5, device as claimed in claim 4, wherein the 3rd member comprises two discontinuous parts.
6, device as claimed in claim 4, wherein this at least one discontinuous part material of comprising the gap or being different from the 3rd material.
7, device as claimed in claim 1, wherein this first material comprises melt.
8, device as claimed in claim 1, wherein this second material is identical with the 3rd material.
9, wherein there is discernible interface in device as claimed in claim 8 between this second and the 3rd member.
10, device as claimed in claim 1, wherein this second material is different from the 3rd material.
11, device as claimed in claim 1, wherein this second material comprises and is selected from the group of being made up of epoxy resin, acrylic acid and urethane resin one or more.
12, device as claimed in claim 1, wherein the 3rd material comprises and is selected from the group of being made up of epoxy resin, acrylate, urethane acrylate and acrylate cyanide resin one or more.
13, device as claimed in claim 1, wherein this first member comprises one or more materials that are selected from by in magnesium oxide, calcium oxide, barium monoxide, lithia, sodium oxide molybdena, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminium oxide, silica, lead oxide, tin oxide, phosphorous oxide, ruthenium-oxide, rubidium oxide, rhodium oxide, iron oxide, cupric oxide, titanium oxide, tungsten oxide, bismuth oxide, antimony oxide, lead borate glass, phosphoric acid tin glass, vanadate glass and the borosilicate etc.
14, a kind of method of making organic light emitting display apparatus, this method comprises:
Generator, it comprises:
First substrate;
Second substrate, it is arranged on this first substrate;
Array of organic light emitting pixels, it is arranged between this first and second substrate; With
First containment member, it is arranged between this first and second substrate and centers on this array substantially,
The 3rd containment member, it is arranged between this first and second substrate, and substantially around this first containment member, between this first and the 3rd containment member and the space that has qualification between this first and second substrate; With
Packing material in this space is arranged between this first and second substrate and second containment member between this first and the 3rd containment member with formation.
15, method as claimed in claim 14, wherein the 3rd containment member comprises at least one discontinuous part and centers on this first containment member substantially.
16, method as claimed in claim 15, wherein filling comprises that at least one discontinuous part is injected to material in this space by this.
17, method as claimed in claim 16 is wherein filled also to be included in and is moved this material in this space.
18, method as claimed in claim 17 wherein utilizes plus or minus air pressure to move this material in this space.
19, method as claimed in claim 14, wherein the 3rd containment member comprises that a part is parallel to the part of this first containment member generally.
20, method as claimed in claim 14 also comprises being filled to and solidifies this material in this space afterwards.
21, method as claimed in claim 14, wherein this first containment member comprises melt, and forms the closed loop around this array.
22, method as claimed in claim 14, wherein this second containment member and the 3rd containment member comprise essentially identical material.
23, method as claimed in claim 14, wherein the 3rd material has the viscosity of about 100cp to about 4000cp.
24, method as claimed in claim 14 wherein provides this device to comprise:
This second substrate is provided, is formed on this first containment member on this second substrate and is formed on the 3rd containment member on this second substrate; With
This first and second substrate is set, so that this array is arranged between this first and second substrate, and this array is centered on by this first containment member.
25, method as claimed in claim 14 wherein provides this device to comprise:
This first substrate and this first containment member that is formed on this first substrate are provided; And
Formation is basically parallel to the 3rd containment member of this first containment member, and has the gap between this first containment member and the 3rd containment member; With
This first and second substrate is set, so that this array is arranged between this first and second substrate, and this array is centered on by this first containment member.
26, method as claimed in claim 25 wherein provides this device also to be included in and the back fusing is set and solidifies to this first containment member of small part, so that this first containment member is engaged to this first and second substrate.
27, method as claimed in claim 25 wherein forms the 3rd encapsulant and comprises and utilize silk screen printing or distribution method.
28, a kind of method of making organic light emitting display apparatus, this method comprises:
Generator, it comprises:
First substrate;
Second substrate, it is arranged on this first substrate;
The array of a plurality of organic light emission pixels, it is arranged between this first and second substrate;
A plurality of first containment members, it is arranged between this first and second substrate, and each first containment member is around one of this corresponding array;
A plurality of the 3rd containment members, it is arranged between this first and second substrate, each the 3rd containment member centers on one of this corresponding first containment member substantially, have the space that is defined between one of each this first containment member and the 3rd containment member that should correspondence, and wherein this space is present in also between this first and second substrate; With
Packing material is arranged on second containment member between one of each first containment member and corresponding the 3rd containment member with formation to this space.
29, method as claimed in claim 28, it comprises that also the product that cuts gained is a plurality of, the cutting part that comprises this first substrate, this array of the cutting part of second substrate, organic light emission pixel, this first containment member, this second containment member and the 3rd containment member.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410012610.3A CN103762319B (en) | 2006-01-24 | 2007-01-16 | OLED and manufacture method thereof |
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| KR7353/06 | 2006-01-24 | ||
| KR1020060007353A KR100671644B1 (en) | 2006-01-24 | 2006-01-24 | Organic light emitting display device and fabricating method of the same |
| KR25755/06 | 2006-03-21 |
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| CN201410012610.3A Division CN103762319B (en) | 2006-01-24 | 2007-01-16 | OLED and manufacture method thereof |
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| CN101009305A true CN101009305A (en) | 2007-08-01 |
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| CNA2007100017820A Pending CN101009305A (en) | 2006-01-24 | 2007-01-16 | Organic light emitting display and fabricating method of the same |
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| CN (1) | CN101009305A (en) |
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