CN101009300A - Organic light-emitting display and method of making the same - Google Patents
Organic light-emitting display and method of making the same Download PDFInfo
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- CN101009300A CN101009300A CNA2007100001432A CN200710000143A CN101009300A CN 101009300 A CN101009300 A CN 101009300A CN A2007100001432 A CNA2007100001432 A CN A2007100001432A CN 200710000143 A CN200710000143 A CN 200710000143A CN 101009300 A CN101009300 A CN 101009300A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
Disclosed is an organic light-emitting display device in which a substrate and an encapsulation substrate are completely sealed using a frit; and the preparing method of the same. The organic light-emitting display device of the present invention includes a first substrate comprising a pixel region including an organic light-emitting diode and a non-pixel region formed in an outside of the pixel region; a second substrate coalesced onto at least a pixel region of the first substrate; a frit provided between the non-pixel region of the first substrate and the second substrate to attach the substrate and the encapsulation substrate to each other; and a supplement material composed of resin formed in at least one region of each outer surface of the first substrate, the second substrate and the frit.
Description
Technical field
The present invention relates to a kind of organic light emitting display and manufacture method thereof, more particularly, relate to a kind of encapsulation of organic light emitting display.
Background technology
Organic light emitting display is one of flat-panel monitor.Organic light emitting display generally includes the organic luminous layer that is arranged between the electrode of facing.When to electrode application voltage, inject electronics from an electrode, from another electrode injected hole.Electronics and hole are compound mutually in organic luminous layer, form exciton.Exciton makes the light emitting molecule of luminescent layer be in excitation state.When light emitting molecule returned ground state, this light emitting molecule was luminous.
Because this organic light emitting display has the excellent images quality, so it receives much concern as display of future generation.In addition, this organic light emitting display can manufacture in light weight and thin type.Can also drive this organic light emitting display with low-voltage.
Summary of the invention
An aspect of of the present present invention provides a kind of organic light-emitting display device.Described device comprises: preceding substrate, comprise front surface, inner surface and side surface, and wherein, described preceding substrate is individual layer or comprises a plurality of layers; Back substrate comprises rear surface, inner surface and side surface, and described preceding substrate is positioned at substrate top, described back, and wherein, described back substrate is individual layer or comprises a plurality of layers; The array of display pixel places between described front surface and the described rear surface; Frit seals, be formed on described before between the inner surface of the inner surface of substrate and the substrate of described back simultaneously around described array, wherein, described frit seals, described preceding substrate and described back substrate are in conjunction with limiting airtight space, described array is positioned at described confined space, and described frit seals comprises the outer surface that deviates from described confined space; Resin bed is formed at least a portion of side surface of at least a portion of rear surface of described back substrate and described back substrate, and described resin bed extends to contact with the described outer surface of described frit seals.
Described resin bed can also extend at least a portion of the side surface of described preceding substrate.Described resin bed can comprise the part between before described substrate and the described back substrate.Described part can contact the described inner surface of described preceding substrate and described back substrate.Described resin bed can cover the whole substantially zone of the rear surface of described back substrate.Described resin bed can cover the whole substantially zone of the described side surface of described back substrate.Described resin bed can cover the whole substantially zone of the described outer surface of described frit seals.
Substrate can comprise the part that is constructed to make the substantially transparent that the visible light from described array passes before described, and described resin bed may also extend into the part that described front surface does not cover described substantially transparent simultaneously.Described resin bed can comprise one or more materials of selecting from the group of being made of epoxy resin, acrylate and polyurethane acrylate resin.Described back substrate also can comprise non-overlapping part, and described preceding substrate does not extend to described non-overlapping part top, and wherein, at least a portion of the described non-overlapping part of described back substrate can not have resin bed basically.Described device also can be included in the array drive circuit that the top of the described non-overlapping part of described back substrate forms, and described resin bed can not extend to described array drive circuit.
Another aspect of the present invention provides a kind of method of making organic light-emitting display device.Described method comprises generator, and described device comprises: first substrate comprises first outer surface, first inner surface and first side surface; Second substrate comprises second outer surface, second inner surface and second side surface, and described second substrate is positioned at described first substrate top; The array of display pixel is between described first substrate and described second substrate; Frit seals, be formed between described first inner surface and described second inner surface simultaneously around described array, wherein, described frit seals, described first substrate and described second substrate are in conjunction with limiting airtight space, described array is positioned at described confined space, and described frit seals comprises the outer surface that deviates from described airtight space.Described method also comprises in the described device immersion resin solution; Remove described device from described resin solution, wherein, after removing, described resin solution is applied on the surface of described device; The described resin solution that is coated on the described device is solidified, on the surface of described device, to form resin bed.
Described device also can comprise from the extension of described first base extension.When immersing, described device can immerse substantially fully, except described extension.Described extension can comprise bar.Described extension can comprise the non-overlapping part of described first substrate, and described second substrate does not extend to described non-overlapping part top.When immersing, at least a portion of described non-overlapping part can not be dipped into, and the remainder of described device is dipped into substantially fully simultaneously.The viscosity of described resin solution can be approximately between the extremely about 4000cp of 100cp.Described device also can be included in the film removed to the small part of described second outer surface, and after immersing and removing, described resin solution can be coated in described the removal on the film.Described method can also comprise: after curing, remove and describedly remove film and be formed on the described part of removing the described resin bed on the film, with expose described second outer surface to small part.
Another aspect of the present invention provides a kind of and has comprised along the organic light-emitting display device of the supplementary material of the resin of the outside of first substrate, second substrate or frit.
Another aspect of the present invention provides a kind of organic light-emitting display device, and described device comprises: first substrate comprises the pixel region with Organic Light Emitting Diode and is formed on the outer non-pixel region of pixel region; Second substrate is attached on the pixel region at least of first substrate; Frit is provided between the non-pixel region and second substrate of first substrate, so that substrate and package substrates are attached to each other; Supplementary material is made of the resin at least one zone of the outer surface separately that is formed on first substrate, second substrate and frit.
Another aspect of the present invention provides a kind of method for preparing organic light-emitting display device, and described organic light-emitting display device comprises: first substrate includes OLED; Second substrate encapsulates the pixel region of first substrate at least.Described method comprises: the first step, stick with paste along the outside coated glass material of the pixel region of second substrate, and the described frit of sintering sticks with paste, to form frit; In second step, second substrate is engaged with first substrate; The 3rd step is by being attached to each other first substrate and second substrate to frit irradiating laser or infrared ray; In the 4th step, adhere to the diaphragm on the top that is used to cover second substrate; In the 5th step, the panel that first substrate and second substrate are attached to each other immerses in the solution of supplementary material, so that the solution of supplementary material is penetrated in the slit between first substrate and second substrate; In the 6th step, panel is taken out from the solution of supplementary material, and the supplementary material that will be formed on the panel solidifies; In the 7th step, remove diaphragm.
Description of drawings
Below, the description that embodiments of the invention are carried out in conjunction with the drawings, these and/or other aspect of the present invention and advantage will become clear and be easier to and understand, wherein:
Fig. 1 is the cutaway view that illustrates according to a kind of organic light emitting display of method;
Fig. 2 is the top plan view according to the organic light emitting display of an embodiment;
Fig. 3 is the cutaway view along the organic light emitting display among Fig. 2 of the intercepting of the line A-A ' among Fig. 2;
Fig. 4 A to Fig. 4 H is the cutaway view of process that is used to prepare organic light emitting display according to an embodiment;
Fig. 5 A is the schematic exploded view according to the passive matrix organic light emitting display of an embodiment;
Fig. 5 B is the schematic exploded view according to the active matrix type organic light emitting display of an embodiment;
Fig. 5 C is the schematic top plan view according to the organic light emitting display of an embodiment;
Fig. 5 D is the cutaway view of the organic light emitting display among Fig. 5 C of d-d along the line intercepting;
Fig. 5 E is the perspective schematic view that illustrates according to the batch process of the organic light emitting display of an embodiment.
Embodiment
Below, illustrate according to embodiments of the invention with reference to the accompanying drawings.In the accompanying drawings, identical label is represented identical or intimate element.
Organic light emitting display (OLED) is a kind of display unit that includes the array of OLED.Organic Light Emitting Diode is to comprise organic material and be suitable for producing also radiative solid state device when applying suitable electromotive force.
According to the configuration that is provided with exciting current, OLED can be divided into two kinds of fundamental types usually.Fig. 5 A schematically shows the decomposition view of passive matrix OLED1000 simple structure.Fig. 5 B schematically shows the simple structure of active array type OLED1001.In these two kinds of structures, OLED1000 and 1001 comprises the OLED pixel that is formed on substrate 1002 tops, and the OLED pixel comprises anode 1004, negative electrode 1006 and organic layer 1010.When anode 1004 applied suitable electric current, electric current flowed into pixel, from the organic layer visible emitting.
With reference to Fig. 5 A, passive matrix OLED (PMOLED) design comprises the anode 1004 of strip, the negative electrode 1006 of strip and the organic layer between them, and wherein, anode 1004 is arranged perpendicular to negative electrode 1006 usually.The intersection of bar shaped negative electrode 1006 and anode 1004 defines independent OLED pixel, in independent OLED pixel, produces when anode 1004 that suitably excites corresponding bar shaped and negative electrode 1006 and emission light.The advantage of PMOLED is to make simple relatively.
With reference to Fig. 5 B, active matrix OLED (AMOLED) comprises the local drive circuits 1012 between the array that is arranged in substrate 1002 and OLED pixel.The independent pixel of AMOLED be limited to common cathode 1006 and and the anode 1004 of other anode electric insulation between.Each drive circuit 1012 is connected with the anode 1004 of OLED pixel, and also is connected with scan line 1018 with data wire 1016.In an embodiment, scan line 1018 provides the sweep signal of the row of selecting drive circuit, and data wire 1016 is provided for the data-signal of specific drive circuit.Data-signal and sweep signal excitation local drive circuits 1012 are understood excitation anode 1004 like this, thereby luminous from their corresponding pixels.
In the AMOLED that illustrates, local drive circuits 1012, data wire 1016 and scan line 1018 are embedded in the planarization layer 1014, and planarization layer 1014 places between pel array and the substrate 1002.Planarization layer 1014 provides the smooth top surface that forms array of organic light emitting pixels thereon.Planarization layer 1014 can be formed by organic material or inorganic material, although illustrate for individual layer, also can form by two-layer or multilayer.Local drive circuits 1012 is formed with thin-film transistor (TFT) usually, and with grid or arranged in arrays below the OLED pel array.Local drive circuits 1012 can be formed by organic material to small part, comprises organic tft.The advantage of AMOLED is that the response time is fast, has improved their expectation in the use of display data signal like this.In addition, the advantage of AMOLED is that energy loss-rate passive matrix OLED is low.
With reference to the common trait of PMOLED and AMOLED design, substrate 1002 provides the support structure to OLED pixel and circuit.In various embodiments, substrate 1002 can comprise rigidity or flexible material and opaque or transparent material, as plastics, glass and/or paper tinsel.As mentioned above, with anode 1004, negative electrode 1006 and place anode and negative electrode between organic layer 1010 form each OLED pixel or diodes.When anode 1004 applied suitable electric current, negative electrode 1006 injected electronics, anode 1004 injected holes.In certain embodiments, anode 1004 and negative electrode 1006 are convertible, that is, negative electrode is formed in the substrate 1002, and anode is relatively arranged.
Between negative electrode 1006 and anode 1004, be provided with one or more layers organic layer.More particularly, at least one deck emission or luminescent layer between negative electrode 1006 and anode 1004.Luminescent layer can comprise one or more luminous organic compounds.Usually, luminescent layer is constructed to solid color (as blue, green.Red or white) visible emitting.In the illustrated embodiment, one deck organic layer 1010 is formed between negative electrode 1006 and the anode 1004 as luminescent layer.Other layer that can form between anode 1004 and negative electrode 1006 can comprise hole transmission layer, hole injection layer, electron transfer layer and electron injecting layer.
Hole transmission layer and/or hole injection layer can be between luminescent layer 1010 and anodes 1004.Electron transfer layer and/or electron injecting layer can be between negative electrode 1006 and luminescent layers 1010.By reducing to inject from negative electrode 1006 work function of electronics, electron injecting layer helps to inject electronics from negative electrode 1006 to luminescent layer 1010.Equally, hole injection layer helps from anode 1004 to luminescent layer 1010 injected holes.Hole transmission layer and electron transfer layer help moving of the charge carrier that injects to luminescent layer from each electrode.
In certain embodiments, simple layer can play the function that electronics injects and transmits, perhaps the function of hole injection and transmission.In certain embodiments, lack in these layers one or more layers.In certain embodiments, one or more layers organic layer is doped with one or more materials that helps the injection and/or the transmission of charge carrier.Only having one deck organic layer to be formed among the embodiment between negative electrode and the anode, organic layer can not only comprise organic luminophor, also includes the material of the specific function of the injection that helps the charge carrier in this layer or transmission.
Developed the organic material that is used for these layers (comprising luminescent layer) in a large number.In addition, developing a large amount of other organic materials that use in these layers.In certain embodiments, these organic materials can be for comprising the macromolecule of oligomer and polymer.In certain embodiments, the organic material that is used for these layers can be less relatively molecule.According to desired function of each layer in particular design and the material that is used for adjacent layer, the technical staff should be able to select to be fit to the material of each layer in these layers.
In operation, circuit provides suitable electromotive force between negative electrode 1006 and anode 1004.This makes electric current flow to negative electrode 1006 from anode 1004 through the organic layer between the centre.In one embodiment, negative electrode 1006 provides electronics to adjacent organic layer 1010.Anode 1007 is to organic layer 1010 injected holes.Hole and electronics are compound in organic layer 1010, and produce the energy particle that is called " exciton ".Exciton is given luminous organic material in the organic layer 1010 with their energy delivery, and this energy is used for from the luminous organic material visible emitting.The spectral characteristic of the light of OLED1000,1001 generations and emission depends on the characteristic and the composition of organic molecule in the organic layer.One of those of ordinary skills can select the composition of one or more layers organic layer to be fit to the needs of application-specific.
The OLED device can also be according to luminous direction classification.In being called a type of " top-emission " type, the OLED device is by negative electrode or top electrodes 1006 luminous and display images.In these embodiments, negative electrode 1006 by with respect to visible light be material transparent or at least the material of partially transparent make.In certain embodiments, for fear of losing any light that can pass anode or bottom electrode 1004, anode can be made by the material of fundamental reflection visible light.Second type OLED device is called " bottom emission " type by anode or bottom electrode 1004 emission light.In bottom emissive type OLED device, anode 1004 by with respect to visible light at least the material of partially transparent make.Usually, in bottom emissive type OLED device, negative electrode 1006 is made by the material of fundamental reflection visible light.The OLED device of the third type comes luminous at both direction (for example, by anode 1004 and negative electrode 1006).According to luminous direction, substrate can be made by transparent, material opaque or reflect visible light.
In a lot of embodiment, shown in Fig. 5 C, comprise that the OLED pel array 1021 of a plurality of organic light emission pixels is arranged in substrate 1002 tops.In an embodiment, the conducting by the pixel in the drive circuit (not shown) array of controls 1021 and ending, a plurality of pixels are as a whole at array 1021 display message or image.In certain embodiments, OLED pel array 1021 is arranged to limit viewing area and non-display area with respect to other assembly (as driving and the control electronic building brick).In these embodiments, the viewing area refers to the zone that is formed with OLED pel array 1021 of substrate 1002.Non-display area refers to the remaining area of substrate 1002.In an embodiment, but non-display area inclusive disjunction/or power circuit.It should be understood that in the viewing area arrange control/components of drive circuit to small part.For example, in PMOLED, conductive component will extend to the viewing area, provide suitable electromotive force with antianode and negative electrode.In AMOLED, local drive circuits will extend to the viewing area with the data/scan line that is connected with drive circuit, to drive and to control each pixel of AMOLED.
A kind of design and the specific organic material layer that is thought of as the OLED device made can be owing to being exposed to water, oxygen or other pernicious gas is damaged or accelerated deterioration in the OLED device.Therefore, common sense, with the OLED device sealing or the encapsulation to prevent to be exposed to moisture and oxygen or other pernicious gas in manufacturing environment or the operating environment.Fig. 5 D schematically shows along the cutaway view of the OLED device 1011 of the encapsulation with the layout among Fig. 5 C of the intercepting of the line d-d among Fig. 5 C.In this embodiment, smooth top board or bottom substrate 1061 engages with sealant 1071 usually, and described sealant 1071 also engages with base plate or bottom substrate 1002 with airtight or encapsulation OLED pel array 1021.In other embodiments, form one or more layers on top board 1061 or base plate 1002, sealant 1071 combines with bottom or bottom substrate 1002,1061 through such layer.In the illustrated embodiment, sealant 1071 extends along the periphery of OLED pel array 1021 or bottom or top plate 1002,1006.
In an embodiment, as will be discussed further below, sealant 1071 is made by frit material.In various embodiments, top board 1061 and base plate 1002 comprise the material as plastics, glass and/or metal forming, and this material can provide the barrier that prevents that oxygen and/or water from passing through, thereby protection OLED pel array 1021 avoids being exposed to these materials.In an embodiment, at least one in top board 1061 and the base plate 1002 made by the material of substantially transparent.
In order to prolong the life-span of OLED device 1011, expect that usually sealant 1071 and top board 1061 and base plate 1002 provide the sealant to the basic impermeability of oxygen and aqueous vapor, and the confined space 1081 of basic sealing is provided.In specific application, the sealant 1071 that demonstrates the frit material that combines with top board 1061 and base plate 1002 provides and is less than every day about 10
-3Cc/m
2Oxygen and be less than every day 10
-6G/m
2The barrier of water.In certain embodiments, suppose that some oxygen and moisture can be penetrated into airtight space 1081, formation can absorb the material of oxygen and/or moisture in airtight space 1081.
In the illustrated embodiment, sealant 1071 has general square-section.Yet in other embodiments, sealant 1071 can have other various cross sectional shapes, as square-section, general trapezoid cross section, have the cross section of one or more round edges or as by specifying other structure of using required indication.In order to improve sealing, expectation increases the interfacial area that sealant 1071 directly contacts bottom substrate 1002 or bottom substrate 1061 or is formed on the layer on bottom and the bottom substrate usually.In certain embodiments, the shape of sealant can be designed, thereby interfacial area can be increased.
As noted before, in certain embodiments, use frit material or abbreviate " frit " as or formation " glass dust " (comprising meticulous glass particle) sealant 1071.The frit particle comprises magnesium oxide (MgO), calcium oxide (CaO), barium monoxide (BaO), lithia (Li
2O), sodium oxide molybdena (Na
2O), potassium oxide (K
2O), boron oxide (B
2O
3), vanadium oxide (V
2O
5), zinc oxide (ZnO), tellurium oxide (TeO
2), aluminium oxide (Al
2O
3), silica (SiO
2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P
2O
5), ruthenium-oxide (Ru
2O), rubidium oxide (Rb
2O), rhodium oxide (Rh
2O), iron oxide (Fe
2O
3), cupric oxide (CuO), titanium oxide (TiO
2), tungsten oxide (WO
3), bismuth oxide (Bi
2O
3), antimony oxide (Sb
2O
3), in lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate etc. one or more.In an embodiment, the size range of these particles is extremely about 30 μ m of about 2 μ m, is that about 5 μ m are to about 10 μ m, although be not limited only to this alternatively.These particles can be approximately the same big with the bottom substrate 1061 of frit seals 1071 contact and the distance between the bottom substrate 1002 or the distance between any layer that forms in these substrates.
The frit material that is used to form sealant 1071 can also comprise one or more fillers or additive.The hot expansibility of filler or the additive integral body to regulate sealant 1071 can be provided and/or regulate 1071 pairs of absorbent properties of selecting the incident radiant energy of frequency of sealant.Filler or additive can also comprise conversion (inversion) and/or add the coefficient of filler with the thermal expansion of adjustment frit.For example, filler or additive can comprise transition metal, as chromium (Cr), iron (Fe), manganese (Mn), cobalt (Co), copper (Cu) and/or vanadium.Other material that is used for filler or additive comprises ZnSiO
4, PbTiO
3, ZrO
2, eucryptite.
In an embodiment, comprise the glass particle of about 20-90wt%, remaining filler and/or the additive of comprising as the frit material of the component of doing.In certain embodiments, the frit paste comprises the inorganic material of organic material and the about 70-90wt% of about 10-30wt%.In certain embodiments, the frit paste comprises the inorganic material of organic material and the about 80wt% of about 20wt%.In certain embodiments, organic material can comprise the adhesive of about 0-30wt% and the solvent of about 70-100wt%.In certain embodiments, approximately 10wt% is an adhesive in organic material, and approximately 90wt% is a solvent.In certain embodiments, inorganic material can comprise the glass dust of the additive of about 0-10wt%, about 20-40wt% filler and about 50-80wt%.In certain embodiments, in inorganic material, approximately 0-5wt% is an additive, and approximately 25-30wt% is a filler, and approximately 65-75wt% is a glass dust.
In forming frit-sealed process, in the frit material of doing, add fluent material, stick with paste to form frit.Can use any organic or inorganic solvent that has or do not have additive as fluent material.In an embodiment, solvent comprises one or more organic compounds.For example, spendable organic compound is ethyl cellulose, NC Nitroncellulose, hydroxy propyl cellulose, diethylene glycol (DEG)-butyl ether acetic acid esters (butyl carbitol acetate), terpineol, butyl cellosolve, acrylates compound.Then, the frit that can use formation is stuck with paste the shape that forms sealant 1071 on top board 1061 and/or base plate 1002.
In one exemplary embodiment, the shape of sealant 1071 is stuck with paste by frit at first and is formed, and places between top board 1061 and the base plate 1002.In certain embodiments, sealant 1071 can precuring or presintering on one of top board 1061 and base plate 1002.Assemble top board 1061 and base plate 1002 subsequently and place therebetween sealant 1071, the part of heated sealant agent 1071 optionally, thereby the frit material that forms sealant 1071 partial melting at least.Then, make sealant 1071 solidify again,, thereby stop airtight OLED pel array 1021 to be exposed to oxygen or water with formation firm engagement point (secure point) between top board 1061 and base plate 1002.
In an embodiment, the selectivity of carrying out frit seals by radiant light (as laser or directed infrared lamp) heats.As previously mentioned, the frit material that forms sealant 1071 can combine with one or more additives or filler (as selecting to be used to improve the kind to the absorption of the light of radiation), with heating and the fusing that helps frit material, thereby form sealant 1071.
In certain embodiments, OLED device 1011 is produced in batches.In the embodiment shown in Fig. 5 E, in common floor substrate 1101, form a plurality of independent OLED arrays 1021.In the illustrated embodiment, the frit that is formed of each OLED array 1021 surrounds to form sealant 1071.In an embodiment, the top that public bottom substrate (not shown) is placed on common floor substrate 1101 and is formed on the structure in the common floor substrate 1101, thus OLED array 1201 and the frit that is shaped are stuck with paste and are placed between common floor substrate 1101 and the public bottom substrate.As through previously described inclosure process, OLED array 1021 is encapsulated and sealing single OLED display device.The product that obtains comprises a plurality of OLED devices that keep together by common floor substrate and public bottom substrate.Then, the product that obtains is cut into a plurality of, the OLED device 1011 among each composition diagram 5D.In certain embodiments, independent OLED device 1011 also needs to experience other encapsulation operation subsequently, the sealing that is formed by frit seals 1071 and bottom substrate 1061 and bottom substrate 1002 with further improvement.
One of problem of organic light-emitting display device is to damage Organic Light Emitting Diode when moisture vapour transmission is in the organic material of forming Organic Light Emitting Diode.Fig. 1 is the cutaway view that has been depicted as the encapsulating structure of the Organic Light Emitting Diode that addresses this problem.
Organic light-emitting display device comprises deposition substrate 1, package substrates 2, encapsulant 3 and moisture absorption material 4.Deposition substrate 1 comprises: pixel region comprises at least one Organic Light Emitting Diode; Non-pixel region is around pixel region.Package substrates 2 invests the surface that its top is formed with the deposition substrate 1 of Organic Light Emitting Diode.
For deposition substrate 1 is invested package substrates 2, along the edge coating encapsulant 3 of deposition substrate 1 and package substrates 2.Utilize UV radiation or heating that encapsulant 3 is solidified then.Moisture absorption material 4 also can be included in the package substrates 2.Hydrogen, oxygen and moisture that moisture absorption material 4 is removed in the meticulous slit that can be penetrated between encapsulant 3 and substrate 1 and 2.
Yet in above-mentioned organic light-emitting display device, encapsulant 3 can not prevent the infiltration of moisture fully.In addition, moisture absorption material 4 needs the experience sintering process, and this will cause bubble.Adhesion between bubble meeting deterioration encapsulant 3 and the substrate.This problem can cause Organic Light Emitting Diode to be exposed in the moisture.
Disclosing in No. 20040207314 U.S. Patent Application Publication not to have the frit coated glass substrate of moisture absorption material to be sealed with OLED by using.Announce according to this, because the interface between substrate and the package substrates is sealed fully by the frit that solidifies fusing, thus do not need to use hygroscopic agent, and can more effectively protect Organic Light Emitting Diode.
Yet, even the interface by frit-sealed, when external impact is applied to substrate, the phenomenon that stress is concentrated can occur on the adhesive surface between frit and the substrate.Therefore, on adhesive surface, can produce the crack, and because the fragility of glass material, the crack can be diffused into whole substrate.
Fig. 2 is the plane graph that illustrates according to the organic light-emitting display device of an embodiment.Fig. 3 is the cutaway view along the intercepting of the line A-A ' among Fig. 2.With reference to Fig. 2 and Fig. 3, organic light-emitting display device comprises substrate 100, package substrates 200, frit 150 and supplementary material 160.For convenience of description, substrate 100 can refer to the substrate that includes OLED.Deposition substrate 101 can refer to the substrate that is formed with the base plate of Organic Light Emitting Diode as its top.Therefore, in the context of present specification, substrate 100 and deposition substrate 101 can be distinguished mutually, except as otherwise noted.
Pixel region 100a is included in the multi-strip scanning line (S1 to Sn) of horizontal direction layout and many data wires of arranging in vertical direction (D1 to Dm).Infall at scan line (S1 to Sn) and data wire (D1 to Dm) forms a plurality of pixels.Pixel is from being used to drive driver IC 300 received signals of Organic Light Emitting Diode.
Non-pixel region 100b comprises the driver IC (driver IC) that is used to drive Organic Light Emitting Diode.Non-pixel region 100b also comprise with pixel region in scan line (S1 to Sn) and the metal line that is electrically connected of data wire (D1 to Dm).In this embodiment, driver IC comprises data-driven unit 170 and scan drive cell 180,180 '.The Organic Light Emitting Diode that illustrates drives by the active matrix method.To its structure be described briefly below.
On deposition substrate 101, form resilient coating 111.Resilient coating 111 can be by insulating material (as silica (SiO
2) and/or silicon nitride (SiNx)) form.Resilient coating 111 prevents to damage substrate 100 by some factors (as the heat from the outside).
Intermediate insulating layer 115 covering grid electrodes 114.Intermediate insulating layer 115 is formed on the gate insulator 113.Source electrode 116a and drain electrode 116b be formed on intermediate insulating layer 115 on the part above the ohmic contact layer 112b.
On the part of protective layer 117, form first electrode 119.First electrode 119 is connected with one of drain electrode 116b with source electrode 116a by through hole 118.
Form pixel and limit layer 120 above protective layer 117, pixel limits the sidepiece that layer 120 covers first electrode 119.Pixel is limited layer 120 patterning, thus have the opening (not shown) with expose first electrode 119 to small part.
In the opening of pixel qualification layer 120, form organic layer 121.Organic layer 121 contacts with the exposed portions of first electrode 119.Above organic layer 121 and pixel qualification layer 120, form the second electrode lay 122.Above the upper surface of the second electrode lay 122, can also form passivation layer.It should be appreciated by those skilled in the art, can make various modifications and change the Organic Light Emitting Diode of active or passive-matrix structure.
The package substrates 200 that illustrates has the shape of plate.Package substrates 200 airtight pixel regions.For example, in this embodiment, basic entire portion that can package substrates is except data-driven unit and pad cell.
In one embodiment, frit 150 forms the line of the edge constant distance at the interface that is bonded with each other apart from package substrates 200 and substrate 100.For supplementary material 160 provides the space, will be described later like this.
Frit 150 can comprise the filler that is used to absorb the material of laser and is used to reduce thermal coefficient of expansion.For example, frit is from by K
2O, Fe
2O
3, Sb
2O
3, ZnO, P
2O
5, V
2O
5, TiO
2, Al
2O
3, B
2O
3, WO
3, two or more the mixture selected in the group formed of SnO and PbO.Frit can be coated on the package substrates 200 with the form that frit is stuck with paste.Then, the package substrates 200 and substrate 100 alignment of frit will be equipped with therebetween.Can use laser or infrared ray to melt and the curing glass material.Space between frit-sealed package substrates 200 and the substrate 100.
In one embodiment, the width of frit 150 greater than 0.5mm between the about 1.5mm.The thickness of frit 150 can be about 10 μ m to about 20 μ m.
In one embodiment, frit 150 is constructed to not stacked with metal line, because because laser or ultrared radiation meeting cause damaging metal line.Yet, in certain embodiments, metal line with the direct-connected part of driver IC can be positioned at frit 150 below.
Because use fragile material (frit 150), so supplementary material 160 can prevent that organic light-emitting display device is easy to damage as encapsulant.If because frit 150 by other material dissolves, causes frit 150 not adhere to or its adhesion reduces, then supplementary material 160 also has the effect of encapsulant.
In one embodiment, at least one part of the outer surface of the outer surface of the outer surface of substrate, package substrates and frit, form supplementary material.Supplementary material can be by immersing or dipping process formation.As will be described later, supplementary material optionally forms on the outer surface.Selectively, supplementary material can be formed on the basic whole outer surface, except forming the zone of diaphragm.
At organic light-emitting display device is among the embodiment of top emission structure, and supplementary material 160 can be formed at the bottom of the outside of side surface, frit 150 of substrate 100 and package substrates 200 and the base on 101 the outer surface.In another embodiment, can be by diaphragm 210 being invested the light-emitting zone of package substrates 200, and immerse package substrates 200 and form supplementary material.
Equally, if organic light-emitting display device is a bottom emissive type, then supplementary material can be formed on the outer surface of the outside of side, frit of substrate and package substrates and package substrates.If organic light-emitting display device is two emission types, then supplementary material can be formed on the side of substrate and package substrates, the outside of frit etc.
In the illustrated embodiment, supplementary material 160 covers inner driver IC (data-driven unit 170), and does not cover outside driver IC (scan drive cell 180,180 ').Yet, it should be appreciated by those skilled in the art, can design the structure that changes supplementary material 160 according to it.
Can prepare aforesaid organic light-emitting display device with the whole bag of tricks.Preparation method's a embodiment is described with reference to Fig. 4 A to Fig. 4 H.Fig. 4 A to Fig. 4 H is the cutaway view that the process of preparation organic light-emitting display device is shown.The organic light-emitting display device that illustrates is a top emission structure.It should be appreciated by those skilled in the art, under the situation of two emission types or bottom emissive type, can make and revising and change.
At first, frit 150 is coated on the part of package substrates 200 with linearity configuration.The distance that the part of coated glass material 150 is predetermined with the marginating compartment of package substrates 200.Described part will will be described later towards the non-pixel region 100b of substrate 100.Frit 150 is coated on the package substrates 200 with the form of sticking with paste.Then, frit 150 is carried out sintering, be included in moisture and/or organic bond in the paste, then frit 150 be cured (Fig. 4 A) with removal.
Then, prepare the substrate 100 that comprises pixel region and non-pixel region individually.Pixel region includes OLED.Non-pixel region comprises driver IC and metal line etc.Package substrates 200 is placed on the top of substrate 100, and covers pixel region (Fig. 4 B).
Next, with the frit 150 between laser or infrared radiation substrate 100 and the package substrates 200, with the frit 150 between fusing substrate 100 and the package substrates 200.In one embodiment, the laser of radiation or ultrared wavelength are that about 800nm is to about 1200nm (being about 810nm alternatively) as used herein.Its energy can be about 25 watts to about 45 watts.The basic entire portion (except frit) of substrate 100 and 200 outer surface can be covered.Can use the material of the bilayer of copper and aluminium as mask.Then, the frit 150 by will fusing solidifies and (Fig. 4 C) is adhered in substrate 100 and package substrates 200 mutually.
Next, driver IC (driver IC) 110 can be invested in the substrate 100.Polarizer 210 is attachable on the outer surface of package substrates 200.Diaphragm 220 is attachable on the polarizer 210.Diaphragm 220 can form by applying other mask material.In other embodiments, be used to protect polarizer 210 diaphragms 220 own to use here.Prepare diaphragm 220 with the size that is fit to, to cover pixel region at least.With respect to the top emission structure unit describe formation of said protection film.Under the situation of bottom emissive type device, protective layer can be formed on the opposite side, and under the situation of two emission type devices, protective layer can be formed on both sides.
The reason that forms diaphragm 220 is that if whole front panel is immersed in the solution of supplementary material, diaphragm 220 will prevent that pixel region is subjected to the pollution of the solution of supplementary material, will be described later.
Next, adhere to the flexible printed circuit board 120 that is connected with the pad cell of substrate 100, apply the Tuppy (Fig. 4 E) that is used to prevent the pad cell oxidation then.
Next, panel is immersed in the solution 300 of supplementary material.At least the panel pixels zone is dipped into the solution 300 with supplementary material and is filled in the gap between substrate 100 and the package substrates 200, and described gap forms along the outside of the frit 150 that forms on the edge of pixel region.By capillarity the solution 300 of supplementary material is filled into (Fig. 4 F) in the gap.
Next, supplementary material is solidificated between substrate 100 and the package substrates 200.In one embodiment,, then cover supplementary material 160, then with UV irradiation supplementary material 160 if UV solidifies.In another embodiment, if hot curing, then supplementary material 160 experience are heated.If by the supplementary material 160 that is heating and curing, then can under about 80 ℃ or lower temperature, solidify supplementary material, to prevent that Organic Light Emitting Diode is by cause thermal damage (Fig. 4 G).
Then, remove the diaphragm 220 in the outside of protection panel.Simultaneously, the carriage subsequently engages in (bracket coalescing) process, and the solution (not shown) that can use supplementary material is as adhesive, and wherein, described substrate is by this contaminated aqueous solution (Fig. 4 H).
The present invention has been described with reference to embodiment.Yet, should be appreciated that, without departing from the principles and spirit of the present invention, can make these embodiment and revising and change.For example, can change the solution of supplementary material, the position of diaphragm and the order that forms driver IC and flexible printed circuit board.
According to the organic light emitting display apparatus of embodiment and the method for preparing this device, if substrate and package substrates are used with frit, then substrate and package substrates utilize supplementary material can solve the fragility problem of organic light-emitting display device.Especially, can in being difficult to apply the process of supplementary material, use method effectively according to embodiment.
Although illustrated and described several embodiments of the present invention, but it should be appreciated by those skilled in the art without departing from the principles and spirit of the present invention and can change these embodiments that scope of the present invention is limited by claim and equivalent thereof.
Claims (21)
1, a kind of organic light-emitting display device comprises:
Preceding substrate comprises front surface, inner surface and side surface, and wherein, described preceding substrate is individual layer or comprises a plurality of layers;
Back substrate comprises rear surface, inner surface and side surface, and described preceding substrate is positioned at substrate top, described back, and wherein, described back substrate is individual layer or comprises a plurality of layers;
The array of display pixel places between described front surface and the described rear surface;
Frit seals, be formed on described before between the inner surface of the inner surface of substrate and the substrate of described back simultaneously around described array, wherein, described frit seals, described preceding substrate and described back substrate are in conjunction with limiting airtight space, described array is positioned at described confined space, and described frit seals comprises the outer surface that deviates from described confined space;
Resin bed is formed at least a portion of side surface of at least a portion of rear surface of described back substrate and described back substrate, and described resin bed extends to contact with the described outer surface of described frit seals.
2, device according to claim 1, wherein, described resin bed also extends at least a portion of the side surface of described preceding substrate.
3, device according to claim 1, wherein, described resin bed comprises the part between before described substrate and the described back substrate.
4, device according to claim 3, wherein, the described inner surface of substrate and described back substrate before described part contact is described.
5, device according to claim 1, wherein, described resin bed covers the whole substantially zone of the described rear surface of described back substrate.
6, device according to claim 1, wherein, described resin bed covers the whole substantially zone of the described side surface of described back substrate.
7, device according to claim 1, wherein, described resin bed covers the whole substantially zone of the described outer surface of described frit seals.
8, device according to claim 1, wherein, substrate comprises the part that is constructed to make the substantially transparent that the visible light from described array passes before described, and wherein, described resin bed also extends to the part that described front surface does not cover described substantially transparent simultaneously.
9, device according to claim 1, wherein, described resin bed comprises one or more materials of selecting from the group of being made up of epoxy resin, acrylate and polyurethane acrylate resin.
10, device according to claim 1, wherein, described back substrate also comprises non-overlapping part, and described preceding substrate does not extend to described non-overlapping part top, and wherein, at least a portion of the described non-overlapping part of described back substrate does not have resin bed basically.
11, device according to claim 10, wherein, described device also is included in the array drive circuit that the top of the described non-overlapping part of described back substrate forms, and wherein, described resin bed does not extend to described array drive circuit.
12, device according to claim 1, described frit seals comprise one or more materials of selecting from the group of being made of magnesium oxide, calcium oxide, barium monoxide, lithia, sodium oxide molybdena, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminium oxide, silica, lead oxide, tin oxide, phosphorous oxide, ruthenium-oxide, rubidium oxide, rhodium oxide, iron oxide, cupric oxide, titanium oxide, tungsten oxide, bismuth oxide, antimony oxide, lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate.
13, a kind of method of making organic light-emitting display device comprises:
Generator, described device comprises:
First substrate comprises first outer surface, first inner surface and first side surface,
Second substrate comprises second outer surface, second inner surface and second side surface, and described second substrate is positioned at described first substrate top,
The array of display pixel, between described first substrate and described second substrate,
Frit seals, be formed between described first inner surface and described second inner surface simultaneously around described array, wherein, described frit seals, described first substrate and described second substrate are in conjunction with limiting airtight space, described array is positioned at described confined space, and described frit seals comprises the outer surface that deviates from described airtight space;
Described device is immersed in the resin solution;
Remove described device from described resin solution, wherein, after removing, described resin solution is applied on the surface of described device;
The described resin solution that is coated on the described device is solidified, on the surface of described device, to form resin bed.
14, method according to claim 13, wherein, described device also comprises from the extension of described first base extension.
15, method according to claim 14, wherein, when immersing, described device immerses substantially fully, except described extension.
16, method according to claim 14, wherein, described extension comprises bar.
17, method according to claim 14, wherein, described extension comprises the non-overlapping part of described first substrate, and described second substrate does not extend to described non-overlapping part top.
18, method according to claim 17, wherein, when immersing, at least a portion of described non-overlapping part is not dipped into, and the remainder of described device is dipped into substantially fully simultaneously.
19, method according to claim 13, wherein, the viscosity of described resin solution is approximately between the extremely about 4000cp of 100cp.
20, method according to claim 13, wherein, described device also is included in the film removed to the small part of described second outer surface, and wherein, after immersing and removing, described resin solution is coated in described the removal on the film.
21, method according to claim 20 also comprises: after curing, remove and describedly remove film and be formed on the described part of removing the described resin bed on the film, with expose described second outer surface to small part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060007354 | 2006-01-24 | ||
| KR20060007354 | 2006-01-24 | ||
| KR1020060026816 | 2006-03-24 |
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| CN101009300A true CN101009300A (en) | 2007-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100001432A Pending CN101009300A (en) | 2006-01-24 | 2007-01-05 | Organic light-emitting display and method of making the same |
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| Country | Link |
|---|---|
| KR (1) | KR100732816B1 (en) |
| CN (1) | CN101009300A (en) |
| TW (1) | TWI335773B (en) |
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| US7746440B2 (en) | 2007-11-19 | 2010-06-29 | Au Optronics Corp. | Flat display panel having strength enhancing structure |
| CN103247238A (en) * | 2012-02-02 | 2013-08-14 | 三星显示有限公司 | Display apparatus |
| CN104081877A (en) * | 2012-01-30 | 2014-10-01 | 日立化成株式会社 | Electronic component, production method therefor, and sealing material paste used therein |
| CN104157670A (en) * | 2013-05-14 | 2014-11-19 | 精工爱普生株式会社 | Electro-optic device, method of manufacturing electro-optic device, and electronic apparatus |
| WO2015149485A1 (en) * | 2014-04-04 | 2015-10-08 | 京东方科技集团股份有限公司 | Glass substrate packaging method, glass material and electronic device |
| CN105702703A (en) * | 2014-12-16 | 2016-06-22 | 乐金显示有限公司 | Organic light emitting display device |
| CN107209148A (en) * | 2014-12-15 | 2017-09-26 | 阿克米-工程股份公司 | The hydrogen detector of medium for gases and liquids |
| CN108735914A (en) * | 2018-05-30 | 2018-11-02 | 深圳市华星光电半导体显示技术有限公司 | OLED display encapsulating structure |
| CN111312764A (en) * | 2014-03-07 | 2020-06-19 | 三星显示有限公司 | Display device and method for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101073564B1 (en) | 2010-02-02 | 2011-10-17 | 삼성모바일디스플레이주식회사 | Organic light emitting diode display and method for manufacturing organic light emitting diode display |
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| US6998776B2 (en) * | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
| KR100626004B1 (en) * | 2004-06-03 | 2006-09-20 | 삼성에스디아이 주식회사 | Flat panel display device and method of manufacturing the same |
-
2006
- 2006-03-24 KR KR1020060026816A patent/KR100732816B1/en active IP Right Grant
- 2006-11-27 TW TW095143708A patent/TWI335773B/en active
-
2007
- 2007-01-05 CN CNA2007100001432A patent/CN101009300A/en active Pending
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| CN104081877A (en) * | 2012-01-30 | 2014-10-01 | 日立化成株式会社 | Electronic component, production method therefor, and sealing material paste used therein |
| TWI501934B (en) * | 2012-01-30 | 2015-10-01 | Hitachi Chemical Co Ltd | Electronic parts and their manufacturing methods, as well as the use of its sealing material paste |
| CN103247238A (en) * | 2012-02-02 | 2013-08-14 | 三星显示有限公司 | Display apparatus |
| CN104157670B (en) * | 2013-05-14 | 2019-01-04 | 精工爱普生株式会社 | Electro-optical device, the manufacturing method of electro-optical device and electronic equipment |
| CN104157670A (en) * | 2013-05-14 | 2014-11-19 | 精工爱普生株式会社 | Electro-optic device, method of manufacturing electro-optic device, and electronic apparatus |
| CN111312764B (en) * | 2014-03-07 | 2023-04-11 | 三星显示有限公司 | Display device and method for manufacturing the same |
| CN111312764A (en) * | 2014-03-07 | 2020-06-19 | 三星显示有限公司 | Display device and method for manufacturing the same |
| WO2015149485A1 (en) * | 2014-04-04 | 2015-10-08 | 京东方科技集团股份有限公司 | Glass substrate packaging method, glass material and electronic device |
| US9768407B2 (en) | 2014-04-04 | 2017-09-19 | Boe Technology Group Co., Ltd. | Substrate-sealing method, frit and electronic device |
| CN107209148A (en) * | 2014-12-15 | 2017-09-26 | 阿克米-工程股份公司 | The hydrogen detector of medium for gases and liquids |
| CN105702703A (en) * | 2014-12-16 | 2016-06-22 | 乐金显示有限公司 | Organic light emitting display device |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI335773B (en) | 2011-01-01 |
| TW200730008A (en) | 2007-08-01 |
| KR100732816B1 (en) | 2007-06-27 |
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