CN108461523B - Organic light emitting diode display panel and manufacturing method thereof - Google Patents
Organic light emitting diode display panel and manufacturing method thereof Download PDFInfo
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- CN108461523B CN108461523B CN201810203687.7A CN201810203687A CN108461523B CN 108461523 B CN108461523 B CN 108461523B CN 201810203687 A CN201810203687 A CN 201810203687A CN 108461523 B CN108461523 B CN 108461523B
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- 238000004519 manufacturing process Methods 0.000 title description 14
- 239000000758 substrate Substances 0.000 claims abstract description 183
- 239000011521 glass Substances 0.000 claims abstract description 96
- 239000004568 cement Substances 0.000 claims abstract description 36
- 239000003292 glue Substances 0.000 claims description 80
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 description 22
- 238000000034 method Methods 0.000 description 19
- 238000010586 diagram Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 6
- 238000000149 argon plasma sintering Methods 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 239000011324 bead Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
Abstract
The invention relates to an organic light emitting diode display panel, comprising: a first substrate; a second substrate arranged opposite to the first substrate; an organic light emitting diode unit arranged on the second substrate; the glass cement is arranged between the first substrate and the second substrate and surrounds the organic light-emitting diode unit; the wiring area is arranged on the second substrate, and part of the wiring area is arranged outside the glass cement; and a buffer unit arranged between the first substrate and the second substrate and outside the glass cement, wherein the buffer unit is arranged on the wiring area.
Description
This application is a divisional application, the application number of the parent: 201310616873.0, filing date: 11/28/2013, title: an organic light emitting diode display panel and a manufacturing method thereof.
Technical Field
The present invention relates to an organic light emitting diode display panel and a method for manufacturing the same, and more particularly, to an organic light emitting diode display panel meeting a narrow frame requirement and a method for manufacturing the same.
Background
An Organic Light Emitting Diode (OLED) has: light weight, thin thickness, high brightness, fast response speed, large viewing angle, no need of backlight source, low manufacturing cost, flexibility and the like, and has great potential to be applied to various electronic device display panels, such as mobile phone panels, automobile panels, MP3 panels and the like. However, the organic light emitting diode has the disadvantage of being not moisture-resistant, so the organic light emitting diode is mostly packaged by using glass cement to isolate external moisture.
Generally, an organic light emitting diode device is often packaged with a glass substrate and a glass Frit (Frit). Although the glass glue has better mechanical strength than the common frame glue, the glass glue is lack of elasticity and cannot absorb the impact of external force, so that the substrate is easy to crack or break in the rear-section cutting process due to the residual stress after laser sintering.
More specifically, in the glass cement laser sintering process, the glass cement absorbs different energy due to factors of laser scanning time and heat conduction, and the sintering temperature distribution is not uniform; meanwhile, when the glass cement is melted, solidified and shrunk, the stress applied to the glass cement can remain around the welding bead and in the heat affected zone, and the stress is called residual stress. If the back plate and the cover plate are fixed, great residual stress can be obtained; however, if not fixed, the substrate may be deformed. Both residual stress and substrate deformation are affected by destructive vibration of the cutter wheel during the cutting process, resulting in breakage of the glass substrate or cracking or chipping of the glass paste.
Therefore, in order to overcome the above-mentioned drawbacks, it is highly desirable to develop an oled panel and a method for fabricating the same, which can prevent the fatal damage of poor cutting yield due to stress factors without changing the structure of the conventional cutting machine, thereby improving the cutting yield of the panel and meeting the purpose of narrow frame.
Disclosure of Invention
The present invention is directed to an organic light emitting diode display panel having a narrow bezel.
Another objective of the present invention is to provide a method for fabricating an oled display panel, which can prevent the glass substrate from deforming or breaking due to the stress generated during the sintering process of the glass paste.
To achieve the above object, the organic light emitting diode display panel of the present invention includes: a first substrate having a first side, a second side, a third side and a fourth side, wherein the first side is opposite to the third side, and the second side is opposite to the fourth side; the second substrate is arranged opposite to the first substrate; an organic light emitting diode unit arranged on the second substrate; the glass cement is arranged between the first substrate and the second substrate and surrounds the organic light-emitting diode unit; and a buffer unit arranged between the first substrate and the second substrate and located between the glass cement facing the first side and the first side of the first substrate, wherein the buffer unit has a first end, and a first cutting edge of the first end is adjacent to the second side.
In addition, the manufacturing method of the organic light emitting diode display panel comprises the following steps: providing a first mother substrate and a second mother substrate, wherein the second mother substrate is provided with at least one organic light emitting diode unit and is provided with a fifth side, a sixth side, a seventh side and an eighth side, the fifth side corresponds to the seventh side, the sixth side corresponds to the eighth side, at least one glass cement and at least one buffer cement are arranged between the first mother substrate and the second mother substrate, each glass cement is respectively arranged around one organic light emitting diode unit, and each buffer cement is respectively arranged around one glass cement, so that the periphery of each organic light emitting diode unit is respectively and sequentially provided with one glass cement and one buffer cement; and cutting the first mother substrate and the second mother substrate, wherein the first mother substrate and the second mother substrate are cut on the reverse side of the buffer glue relative to the side provided with the glass glue at the position facing the fifth side edge by taking the organic light-emitting diode unit as a reference.
In one embodiment, the method for manufacturing an oled display panel of the present invention includes the following steps: (A) providing a first mother substrate and a second mother substrate, wherein the first mother substrate is provided with at least one glass cement and at least one buffer cement, each buffer cement surrounds one glass cement, the second mother substrate is provided with at least one organic light-emitting diode unit and is provided with a fifth side, a sixth side, a seventh side and an eighth side, the fifth side corresponds to the seventh side, and the sixth side corresponds to the eighth side; (B) assembling the first mother substrate and the second mother substrate, and enabling each glass cement and each buffer cement to correspond to and surround one organic light-emitting diode unit; and (C) cutting the first mother substrate and the second mother substrate, wherein the first mother substrate and the second mother substrate are cut on the reverse side of the buffer glue relative to the side provided with the glass glue at the position facing the fifth side edge by taking the organic light-emitting diode unit as a reference.
In another embodiment, the method for fabricating an oled display panel of the present invention includes the following steps: (A) providing a first mother substrate and a second mother substrate, wherein the second mother substrate is provided with at least one organic light-emitting diode unit, at least one glass cement and at least one buffer cement, the second mother substrate is provided with a fifth side, a sixth side, a seventh side and an eighth side, the fifth side corresponds to the seventh side, the sixth side corresponds to the eighth side, each glass cement is arranged around one organic light-emitting diode unit, and each buffer cement is arranged around one glass cement, so that the periphery of each organic light-emitting diode unit is sequentially provided with one glass cement and one buffer cement in a surrounding manner; (B) assembling the first mother substrate and the second mother substrate; and (C) cutting the first mother substrate and the second mother substrate, wherein the first mother substrate and the second mother substrate are cut on the reverse side of the buffer glue relative to the side provided with the glass glue at the position facing the fifth side edge by taking the organic light-emitting diode unit as a reference.
In the method for manufacturing the organic light emitting diode display panel, the situation that the glass substrate is deformed or the glass cement is cracked due to stress generated in the sintering process of the glass cement can be prevented through the arrangement of the buffer cement. Meanwhile, when the first mother substrate and the second mother substrate are cut, only the buffer glue facing the fifth side edge with the organic light emitting diode unit as the reference is reserved; therefore, in the formed organic light emitting diode display panel, only the first side edge of the second substrate is provided with the buffer unit formed after cutting, so that the purpose of narrow frame can be achieved.
In the method for manufacturing an organic light emitting diode display panel of the present invention, in the step (C), the first mother substrate and the second mother substrate are respectively cut between the buffer glue and the glass glue at positions facing the sixth side, the seventh side and the eighth side with the organic light emitting diode unit as a reference. Therefore, in the organic light emitting diode display panel formed by the invention, the second cut edge of the second end of the buffer unit is adjacent to the fourth side edge of the first substrate.
In the method for manufacturing an oled display panel of the present invention, in the step (a), at least one terminal portion is disposed on the second mother substrate, wherein each terminal portion corresponds to a side facing the fifth side with reference to the oled unit. Therefore, the oled display panel formed in the present invention may further include a terminal portion disposed on the second substrate and corresponding to one side of the first substrate.
In addition, in the method for manufacturing an oled display panel of the present invention, on a side facing a fifth side of the second mother substrate with the oled unit as a reference, a distance between an edge of a buffer paste of the buffer paste and an edge of a glass paste of the glass paste facing the edge of the buffer paste (i.e., a minimum distance between the buffer paste and the glass paste) may be between 50 μm and 800 μm; and preferably between 100 μm and 300 μm. Accordingly, in the oled display panel formed in the present invention, a distance between an edge of a buffer glue of the buffer unit and an edge of a glass glue of the glass glue facing the edge of the buffer glue (i.e., a minimum distance between the buffer glue and the glass glue) may be between 50 μm and 800 μm; and preferably between 100 μm and 300 μm.
Furthermore, in the method for manufacturing an oled display panel of the present invention, on one side of the sixth side, the seventh side, or the eighth side of the second mother substrate facing the oled unit as a reference, a distance between an edge of a buffer glue of the buffer glue and an edge of a glass glue of the glass glue facing the edge of the buffer glue (i.e., a minimum distance between the buffer glue and the glass glue) may be between 300 μm and 1500 μm, respectively; and preferably between 500 μm and 1000 μm. In an ideal case, the cutting line is located between the edge of the buffer glue and the edge of the glass glue on one side of the sixth side, the seventh side or the eighth side of the second mother substrate. Accordingly, in the oled display panel formed in the present invention, a distance between an edge of the buffer unit and the second, third, or fourth side of the second substrate may be between 150 μm and 750 μm; and preferably between 250 μm and 500 μm.
In the organic light emitting diode display panel and the manufacturing method thereof of the invention, the widths of the buffer glue and the buffer units formed after cutting can be respectively between 250 μm and 1200 μm. In addition, the width of the glass paste can be between 500 μm and 1000 μm.
In addition, the invention further provides an organic light emitting diode display device using the organic light emitting diode display panel.
Drawings
To further illustrate the detailed technical content of the present invention, the following detailed description is provided in conjunction with the embodiments and the accompanying drawings, in which:
fig. 1 is a schematic diagram of a first mother substrate and a second mother substrate before being assembled in a pair according to a preferred embodiment of the invention.
Fig. 2 is a schematic diagram illustrating a pair of a first mother substrate and a second mother substrate according to a preferred embodiment of the invention.
Fig. 3 is a cross-sectional view illustrating a first mother substrate and a second mother substrate in a pair according to a preferred embodiment of the invention.
Fig. 4 is a schematic diagram illustrating curing of the outer frame glue according to a preferred embodiment of the invention.
Fig. 5 is a schematic diagram of scribe lines of the first mother substrate and the second mother substrate according to a preferred embodiment of the invention.
Fig. 6 is a schematic diagram of an oled display panel according to a preferred embodiment of the invention.
Fig. 7 is a schematic diagram illustrating a pair of a first mother substrate and a second mother substrate according to another preferred embodiment of the invention.
Fig. 8 is a schematic view of an oled display panel according to another preferred embodiment of the invention.
Detailed Description
The following are descriptions of embodiments of the present invention with reference to specific embodiments, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention.
Fig. 1 is a schematic diagram of a first mother substrate and a second mother substrate before being assembled in a pair according to a preferred embodiment of the invention. First, a first mother substrate 11 and a second mother substrate 12, which are glass substrates, are provided. In the first mother substrate 11, at least one glass paste 111 with a width of about 500 μm to 1000 μm is coated on the first mother substrate 11, and the glass paste 111 is glazed at about 500 ℃ to be fixed on the first mother substrate 11. Then, at least one buffer glue 112 with a width of 250 μm to 1200 μm (preferably 600 μm to 1200 μm) is coated along the periphery of each glass glue 111 and the edge of the glass glue 111, and an outer frame glue 113 is coated along the edge of the first mother substrate 11. In the present embodiment, the buffer glue 112 and the outer frame glue 113 can be adhesive glue commonly used in the art; preferably, the buffer adhesive 112 is a thermosetting adhesive such as silicone (silicone) or a UV adhesive such as epoxy (epoxy), and the frame adhesive 113 is a UV adhesive commonly used in the art.
Through the above processes, at least one glass paste 111 and at least one buffer paste 112 may be disposed on the first mother substrate 11, and each buffer paste 112 surrounds one glass paste 111. Here, the plurality of glass paste 111 and the plurality of buffer paste 112 on the first mother substrate 11 are arranged in an array on the first mother substrate 11. In addition, in the embodiment, an outer frame adhesive 113 is further disposed on the first mother substrate 11, and the outer frame adhesive 113 is disposed along the edge of the first mother substrate 11, so that all the glass paste 111 and the buffer paste 112 are disposed in the region formed by the outer frame adhesive 113.
On the second mother substrate 12, at least one organic light emitting diode unit 121 is disposed. Here, the plurality of organic light emitting diode units 121 on the second mother substrate 12 are also arranged in an array on the second mother substrate 12. The second mother substrate 12 has a fifth side 12a, a sixth side 12b, a seventh side 12c and an eighth side 12d, wherein the fifth side 12a corresponds to the seventh side 12c, and the sixth side 12b corresponds to the eighth side 12 d. In addition, in the present embodiment, referring to fig. 1 and fig. 3, at least one terminal portion 122 and at least one metal wiring area 123 are further disposed on the second mother substrate 12, and the terminal portion 122 and the metal wiring area 123 are corresponding to a side facing the fifth side 12a of the second mother substrate 12 with reference to the organic light emitting diode unit 121.
Here, the organic light emitting diode unit 121 may use any organic light emitting diode structure in the art, for example: the organic light emitting diode structure comprises two electrodes and an organic light emitting layer sandwiched between the two electrodes, and the organic light emitting diode structure can further comprise a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer and/or other layers which can help light emission. However, the detailed structure thereof will not be described herein.
Referring to fig. 2 and 3, fig. 2 is a schematic diagram illustrating a first mother substrate and a second mother substrate in a pair according to a preferred embodiment of the invention, and fig. 3 is a schematic cross-sectional diagram illustrating the first mother substrate and the second mother substrate in the pair along a section line a-a' of fig. 2. After the first mother substrate 11 and the second mother substrate 12 are assembled, each of the glass paste 111 and the buffer paste 112 may be disposed correspondingly and surround an oled unit 121, as shown in fig. 2 and 3. In particular, as shown in fig. 3, the buffer glue 112 is disposed on the metal routing area 123 connecting the organic light emitting diode unit 121 and the terminal portion 122 on one side of the fifth side 12a of the second mother substrate 12.
After the first mother substrate 11 and the second mother substrate 12 are assembled, the outer frame adhesive 113 is cured by UV light irradiation. It should be noted that, when the buffer adhesive 112 is a thermosetting adhesive, the first mother substrate 11 and the second mother substrate 12 after being assembled can be directly irradiated with UV light to cure the outer frame adhesive 113; when the buffer 112 is a UV glue, as shown in fig. 4, a mask 2 is used to shield the buffer 112 (i.e. to shield the region outside the outer frame glue 113), and then the assembled first mother substrate 11 and second mother substrate 12 are irradiated with UV light to cure the outer frame glue 113.
After the outer frame paste 113 is solidified, the glass paste 111 is melted by laser sintering, so that the glass paste 111 is solidified on the second mother substrate 12. In the laser sintering process of the glass paste 111, due to the factors of laser scanning time and heat conduction, the glass paste 111 absorbs different energy, the sintering temperature distribution is not uniform, and the structure and the crystal phase thereof are also changed along with the sintering process, generally, the temperature of the heat affected zone of the weld bead and the substrates (including the first mother substrate 11 and the second mother substrate 12) nearby is much higher than the temperature of the substrates which are not affected by heat, and when the glass paste 111 is melted, solidified and shrunk, the substrates are deformed. The stress to which the substrate is tightly held remains around the weld bead and in the heat affected zone, and is referred to as residual stress. Therefore, in the embodiment, since the buffer glue 112 is disposed, the buffer glue 112 can be used as a medium for balancing the substrate deformation and the residual stress during the laser sintering process, and the effects of preventing the substrate deformation and reducing the residual stress are achieved.
After the glass paste 111 is sintered, the buffer paste 112 is cured. Wherein, when the buffer glue 112 is a thermosetting glue, the buffer glue 112 can be heated to cure according to a predetermined temperature (e.g., 100 ℃); when the buffer glue 112 is a UV glue, the buffer glue 112 can be cured by UV irradiation.
After the cushion rubber 112 is cured, please refer to fig. 3 and 5, the panel is cut; for the sake of clarity, fig. 5 is represented by only one of the panel units P of fig. 2. As shown in fig. 3 and 5, the first mother substrate 11 and the second mother substrate 12 are cut along the direction of the cutting line (shown by the dotted line) by the cutter wheel 13; in fig. 5, each cutting line cuts the first mother substrate 11 and the second mother substrate 12 at the same time, except that only the first mother substrate 11 is cut on the cutting line a. With the oled unit 121 as a reference, the first mother substrate 11 and the second mother substrate 12 are cut at the fifth side 12a facing the second mother substrate 12 on the opposite side of the buffer glue 112 from the side provided with the glass glue 111, and the first mother substrate 11 and the second mother substrate 12 are cut between the buffer glue 112 and the glass glue 111 in the direction facing the sixth side 12b, the direction of the seventh side 12c and the eighth side 12d, respectively.
More specifically, as shown in fig. 3 and 5, the first mother substrate 11 and the second mother substrate 12 are cut outside the buffer glue 112 on the side of the fifth side 12a of the oled unit facing the second mother substrate 12; more specifically, the cutting line of the second mother substrate 12 is located outside the terminal portion 122, and the cutting line of the first mother substrate 11 corresponds to the upper portion of the terminal portion 122 to expose the terminal portion 122; and the distance D1 between the edge of the buffer glue 112 and the edge of the glass glue 111 facing the edge of the buffer glue (i.e. the minimum distance between the buffer glue 112 and the glass glue 111) is between 50 μm and 800 μm, preferably between 100 μm and 300 μm. In addition, on the side of the oled unit facing the sixth side 12b, the seventh side 12c and the eighth side 12d of the second mother substrate 12, the first mother substrate 11 and the second mother substrate 12 are cut at the cutting streets formed between the buffer paste 112 and the glass paste 111 (i.e., the space between the buffer paste 112 and the glass paste 111); more specifically, it is preferable to cut the first mother substrate 11 and the second mother substrate 12 at about the middle of the cutting line formed between the buffer paste 112 and the glass paste 111; and distances D2, D3, D4 between the edge of the buffer glue 112 and the edge of the glass glue 111 facing the edge of the buffer glue (i.e. the minimum distance between the buffer glue 112 and the glass glue 111) are respectively 300 μm to 1500 μm, and preferably respectively 500 μm to 1000 μm.
In the embodiment, the buffer glue 112 is disposed to absorb the impact of the vibration of the cutter wheel, so as to protect the glass glue 111 and the substrate (including the first mother substrate 11 and the second mother substrate 12) from the impact during the cutting process; therefore, the glass paste 111 and the substrate are prevented from cracking or even breaking during the cutting process, and the cutting yield is improved. Meanwhile, except for the metal circuit area (i.e., the terminal portion 122), the buffer glue 112 is removed and left in the waste material area, so that it does not exist on the manufactured oled display panel; therefore, the purpose of narrow frame can be achieved.
Through the above processes and the subsequent packaging process, the organic light emitting diode display panel of the embodiment can be manufactured. As shown in fig. 6, the organic light emitting diode display panel of the present embodiment includes: a first substrate 11 ', a first side 11a ', a second side 11b ', a third side 11c ', and a fourth side 11d ', wherein the first side 11a ' is opposite to the third side 11c ', and the second side 11b ' is opposite to the fourth side 11d '; a second substrate 12 'disposed opposite to the first substrate 11' and having a ninth side 12a ', a tenth side 12b', an eleventh side 12c ', and a twelfth side 12 d', wherein the ninth side 12a 'is opposite to the eleventh side 12c', and the tenth side 12b 'is opposite to the twelfth side 12 d'; an organic light emitting diode unit 121 disposed on the second substrate 12'; a glass paste 111 disposed between the first substrate 11 'and the second substrate 12' and surrounding the organic light emitting diode unit 111; and a buffer unit 112 ' disposed between the first substrate 11 ' and the second substrate 12 ' and located between the glass paste 111 facing the first side 11a ' and the first side 11a ' of the first substrate 11 ', wherein the buffer unit 112 ' has a first end 112a and an opposite second end 112b, a first cut edge of the first end 112a is adjacent to the second side 11b ' and the tenth side 12b ', and a second cut edge of the second end 112b is adjacent to the fourth side 11d ' and the twelfth side 12d '. The first end 112a and the second end 112b of the buffer unit 112' respectively present an arc angle, and the arc angle is toward the oled unit 111.
In addition, the organic light emitting diode display panel of the embodiment further includes: a terminal portion 122 and a metal wiring area 123, wherein the terminal portion 122 is disposed on the second substrate 12 'and corresponds to one side of the first side 11 a' of the first substrate 11 ', and the buffer unit 112' is disposed on the metal wiring area 123 connecting the organic light emitting diode unit 121 and the terminal portion 122.
In the oled display panel of the present embodiment, the width of the buffer unit 112' is between 600 μm and 1200 μm; the width of the glass paste 111 is between 500 μm and 1000 μm. In addition, the distance D1 between an edge of the buffer glue of the buffer unit 112' and the edge of the glass glue 111 facing the edge of the buffer glue is between 50 μm and 800 μm, and preferably between 100 μm and 300 μm. Furthermore, the distances D2 ', D3' and D4 'between the edge of the buffer unit 112' and the second side 12b ', the third side 12c' or the fourth side 12D 'of the second substrate 12' are between 150 μm and 750 μm, and preferably between 250 μm and 500 μm; therefore, the purpose of narrow frame can be achieved.
In another embodiment of the present invention, referring to fig. 3 and 5, the first mother substrate 11 and the second mother substrate 12 are further cut between the buffer glue 112 and the glass glue 111 at positions selectively facing the sixth side 12b, the seventh side 12c and the eighth side 12d, respectively, based on the organic light emitting diode unit 121. More specifically, when the first mother substrate 11 and the second mother substrate 12 are cut only between the buffer paste 112 and the glass paste 111 facing at least one of the sixth side 12b, the seventh side 12c and the eighth side 12c, the first mother substrate 11 and the second mother substrate 12 are cut on the opposite side of the buffer paste to the side where the glass paste 111 is disposed at the remaining other sides. At this time, in the formed oled display panel, in addition to the buffer unit 112 formed between the glass paste 111 and the first side 11a 'of the first substrate 11, the buffer unit 112 may be selectively formed between the glass paste 111 and the second side 11b', the third side 11c ', and the fourth side 11 d' of the first substrate 11; in other words, a "two", "L", or "gate" shaped buffer unit 112 may be formed between the first substrate 11 'and the second substrate 12'.
In the above embodiment, the buffer glue and the glass glue are first disposed on the first mother substrate, then assembled with the second mother substrate having the organic light emitting diode units, and finally cut. However, in other embodiments of the present invention, the buffer paste and the glass paste may be selectively disposed on the second mother substrate; one of the buffer glue and the glass glue is arranged on the second mother substrate, and the other is arranged on the first mother substrate, or both the buffer glue and the glass glue are arranged on the second mother substrate; after the first mother substrate and the second mother substrate are subsequently assembled, a glass adhesive and a buffer adhesive are sequentially arranged around the periphery of each organic light emitting diode unit.
In addition, the present invention further provides another embodiment of an oled display panel, which is manufactured in the same manner as described above, except that the buffer glue 112 is coated around the glass glue 111 in a linear manner and continuously, as shown in fig. 7. Therefore, in the oled display panel according to another embodiment of the present invention, the buffer unit 112' is a straight line, and the first end 112a and the second end 112b do not have an arc angle.
The organic light emitting diode display panel provided in all the embodiments of the present invention can be applied to various electronic devices in the technical field, such as displays, mobile phones, notebook computers, video cameras, music players, mobile navigation devices, televisions, and other electronic devices.
The above-described embodiments are merely exemplary for convenience of description, and the scope of the claims of the present invention should be determined by the appended claims rather than by the foregoing description.
Claims (9)
1. An organic light emitting diode display panel comprising:
a first substrate;
a second substrate arranged opposite to the first substrate;
an organic light emitting diode unit arranged on the second substrate;
the glass cement is arranged between the first substrate and the second substrate and surrounds the organic light-emitting diode unit;
a wiring area arranged on the second substrate, wherein part of the wiring area is arranged outside the glass cement; and
and the buffer unit is arranged outside the glass cement, is arranged on the wiring area and does not surround the organic light-emitting diode unit.
2. The oled display panel of claim 1, wherein the routing area is connected to the oled cells, the buffer cell has a buffer cell edge, the glass paste has a glass paste edge facing the buffer cell edge, and the buffer cell edge is spaced apart from the glass paste edge.
3. The oled display panel claimed in claim 2, further comprising a terminal portion disposed on the second substrate, wherein the wiring region is connected to the terminal portion.
4. The oled display panel of claim 3, wherein the wiring area and the terminal portion are disposed on a same side of the second substrate.
5. The organic light emitting diode display panel of claim 4, wherein the routing area and the terminal portion correspond to one side of the first substrate.
6. The oled display panel claimed in claim 1, wherein the width of the buffer unit is between 250 μm and 1200 μm.
7. The oled display panel claimed in claim 1, wherein the glass paste has a width of 500 μm to 1000 μm.
8. The oled display panel of claim 1, wherein the buffer unit is a thermosetting adhesive.
9. The oled display panel of claim 1, wherein the buffer unit is UV glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810203687.7A CN108461523B (en) | 2013-11-28 | 2013-11-28 | Organic light emitting diode display panel and manufacturing method thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310616873.0A CN104681577B (en) | 2013-11-28 | 2013-11-28 | Organic LED display panel and preparation method thereof |
| CN201810203687.7A CN108461523B (en) | 2013-11-28 | 2013-11-28 | Organic light emitting diode display panel and manufacturing method thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310616873.0A Division CN104681577B (en) | 2013-11-28 | 2013-11-28 | Organic LED display panel and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN108461523A CN108461523A (en) | 2018-08-28 |
| CN108461523B true CN108461523B (en) | 2021-10-26 |
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| CN201810203687.7A Active CN108461523B (en) | 2013-11-28 | 2013-11-28 | Organic light emitting diode display panel and manufacturing method thereof |
| CN201310616873.0A Active CN104681577B (en) | 2013-11-28 | 2013-11-28 | Organic LED display panel and preparation method thereof |
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| KR102279375B1 (en) * | 2015-12-03 | 2021-07-22 | 엘지디스플레이 주식회사 | Organic Light Emitting Diode Device |
| KR102504073B1 (en) | 2015-12-14 | 2023-02-24 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| CN106981498A (en) * | 2016-01-19 | 2017-07-25 | 上海和辉光电有限公司 | Display device structure, display device preparation method |
| CN107204405A (en) * | 2016-03-18 | 2017-09-26 | 上海和辉光电有限公司 | A kind of organic electroluminescence display panel and its method for packing |
| KR102631975B1 (en) | 2016-08-31 | 2024-01-31 | 엘지디스플레이 주식회사 | Organic Light Emitting Display device having an adhesive layer between a lower substrate and an upper substrate |
| CN106449718B (en) * | 2016-11-15 | 2019-10-18 | 武汉华星光电技术有限公司 | Oled substrate and preparation method thereof |
| CN106549116A (en) * | 2017-01-25 | 2017-03-29 | 京东方科技集团股份有限公司 | A kind of motherboard and preparation method thereof |
| CN106876329B (en) * | 2017-02-23 | 2019-12-06 | 深圳市华星光电技术有限公司 | manufacturing method of OLED display device |
| CN109309174B (en) * | 2018-12-07 | 2021-11-05 | 合肥鑫晟光电科技有限公司 | Display panel and packaging method thereof |
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