TWI404823B - - Google Patents
Info
- Publication number
- TWI404823B TWI404823B TW99122460A TW99122460A TWI404823B TW I404823 B TWI404823 B TW I404823B TW 99122460 A TW99122460 A TW 99122460A TW 99122460 A TW99122460 A TW 99122460A TW I404823 B TWI404823 B TW I404823B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- gold plating
- gold
- plating bath
- ions
- Prior art date
Links
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99122460A TW201038766A (en) | 2010-07-08 | 2010-07-08 | Method of electroless gold plating over miniature circuits on substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99122460A TW201038766A (en) | 2010-07-08 | 2010-07-08 | Method of electroless gold plating over miniature circuits on substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201038766A TW201038766A (en) | 2010-11-01 |
TWI404823B true TWI404823B (zh) | 2013-08-11 |
Family
ID=44995103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW99122460A TW201038766A (en) | 2010-07-08 | 2010-07-08 | Method of electroless gold plating over miniature circuits on substrate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201038766A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI539032B (zh) | 2013-08-01 | 2016-06-21 | Chang Chun Petrochemical Co | Electrolytic copper foil, cleaning fluid composition and cleaning copper foil method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200815513A (en) * | 2006-08-03 | 2008-04-01 | Basf Ag | Thermoplastic molding composition for production of moldings metallizable by an electroplating method |
TW200848544A (en) * | 2007-06-13 | 2008-12-16 | Solution Chemicals Co Ltd | Electroless golden plating bath without cyanide |
TW200902757A (en) * | 2006-12-06 | 2009-01-16 | Uyemura C & Co Ltd | Electroless gold plating bath, electroless gold plating method and electronic parts |
-
2010
- 2010-07-08 TW TW99122460A patent/TW201038766A/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200815513A (en) * | 2006-08-03 | 2008-04-01 | Basf Ag | Thermoplastic molding composition for production of moldings metallizable by an electroplating method |
TW200902757A (en) * | 2006-12-06 | 2009-01-16 | Uyemura C & Co Ltd | Electroless gold plating bath, electroless gold plating method and electronic parts |
TW200848544A (en) * | 2007-06-13 | 2008-12-16 | Solution Chemicals Co Ltd | Electroless golden plating bath without cyanide |
Also Published As
Publication number | Publication date |
---|---|
TW201038766A (en) | 2010-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |