TWI402007B - 印刷電路板 - Google Patents

印刷電路板 Download PDF

Info

Publication number
TWI402007B
TWI402007B TW099141306A TW99141306A TWI402007B TW I402007 B TWI402007 B TW I402007B TW 099141306 A TW099141306 A TW 099141306A TW 99141306 A TW99141306 A TW 99141306A TW I402007 B TWI402007 B TW I402007B
Authority
TW
Taiwan
Prior art keywords
printed circuit
electronic component
circuit board
vias
top layer
Prior art date
Application number
TW099141306A
Other languages
English (en)
Other versions
TW201223359A (en
Inventor
Tsung Sheng Huang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW099141306A priority Critical patent/TWI402007B/zh
Priority to US12/981,477 priority patent/US20120132461A1/en
Publication of TW201223359A publication Critical patent/TW201223359A/zh
Application granted granted Critical
Publication of TWI402007B publication Critical patent/TWI402007B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Description

印刷電路板
本發明涉及一種印刷電路板。
請參閱圖1及圖2，印刷電路板包括頂層1、底層2、一訊號層3以及一接地層4，該頂層1及底層2均為電源層。該頂層1上設置有一電子元件5。兩排過孔6a、6b及7a、7b貫穿整個印刷電路板且連通該頂層1及底層2。一設置於頂層1上的電源供應器8透過另外兩個過孔8a及8b與頂層1及底層2均相連，用於為電子元件5提供工作電流，其中一部分電流直接透過頂層1流至該電子元件5，另一部分電流將先透過過孔8a、8b、9a以及9b流至底層2，再透過兩排過孔6a、6b及7a、7b返回至頂層1，最後提供給該電子元件5。由於底層2的電流會選擇電阻最小的路徑流向該電子元件5，故此時底層2的電流的大部分會選擇距離電子元件5最近的過孔(即過孔7b)流向頂層1，從而到達電子元件5。如此會導致流經過孔7b的電流太大，從而導致該過孔7b溫度過高，給印刷電路板的工作帶來不穩定性。
鑒於以上內容，有必要提供一種能使得流經過孔的電流較為均勻的印刷電路板，該印刷電路板可避免流經其中一過孔的電流過大。
一種印刷電路板，包括一頂層及一底層，該頂層上設置有一電源供應器及一電子元件，該電源供應器透過至少一第一過孔與頂層與底層均相連，複數第二過孔貫穿整個印刷電路板且連通該頂層及底層，其中每一第二過孔 到該電子元件之間的距離相等。
上述印刷電路板透過將每一第二過孔到電子元件50的距離設置為相等以使得流經每一第二過孔的電流較為接近，避免了某一第二過孔由於流經的電流過大而導致的溫度過高。
10‧‧‧頂層
20‧‧‧底層
30‧‧‧接地層
40‧‧‧訊號層
80a、80b、60-69、90a、90b‧‧‧過孔
50‧‧‧電子元件
80‧‧‧電源供應器
圖1是習知印刷電路板的示意圖。
圖2為圖1中印刷電路板的剖視圖。
圖3是本發明印刷電路板的較佳實施方式的示意圖。
圖4為圖2中印刷電路板的剖視圖。
請參閱圖3，本發明印刷電路板包括一頂層10、一底層20、一接地層30以及一訊號層40，該頂層10及底層20均為電源層。該頂層10上設置有一電子元件50。複數過孔(本實施方式中包括十個過孔60-69)貫穿整個印刷電路板且連通該頂層10及底層20。
一設置於頂層10上的電源供應器80透過另外兩個過孔80a及80b與頂層10及底層20均相連，用於為電子元件50提供工作電流，其中一部分電流直接透過頂層10流至該電子元件50，另一部分電流將先透過過孔80a、80b、90a及90b流至底層20，再透過過孔60-69返回至頂層10，最後提供給該電子元件50。
該過孔60-69排列成兩排，其中每一排均呈一扇形且該扇形的圓心與該電子元件50重合。如此，第一排過孔中的每一過孔60-64與電子元件50之間的距離相等，第二排過孔中的每一過孔65-69與電子元件50之間的距離亦相等。
由於底層20的電流會選擇電阻最小的路徑流向該電子元件50，故此時底層20的電流的大部分會選擇距離電子元件50最近的過孔(即第一排過孔60-64)流向頂層10，從而到達電子元件50。對該印刷電路板進行仿真計算可以得到流經每一過孔的電流值，如表1所示：
從表1可以得知，流經第一排的五個過孔60-64的電流較為接近，從而避免某一過孔上流經過大的電流。
上述印刷電路板透過將過孔排列成扇形以使得每一過孔到電子元件50的距離相等，從而使得流經每一過孔的電流亦較為接近，避免了某一過孔由於流經的電流過大而導致的溫度過高。當然，其他實施方式中，該等過孔所組成的扇形的圓心亦可不與該電子元件50重合或者排列成其他形狀，只要滿足電子元件50到每一過孔的距離相等或者相近即可。
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。
10‧‧‧頂層
60-69、90a、90b‧‧‧過孔
50‧‧‧電子元件
80‧‧‧電源供應器

Claims (2)

  1. 一種印刷電路板，包括頂層及底層，該頂層上設置有一電源供應器及一電子元件，該電源供應器透過至少一第一過孔與頂層與底層均相連，複數第二過孔貫穿整個印刷電路板且連通該頂層及底層，其中每一第二過孔到該電子元件之間的距離相等；其中該電源供應器透過第一及第二過孔為電子元件供電，該第二過孔設置於電源供應器與電子元件之間的空白區域。
  2. 如申請專利範圍第1項所述之印刷電路板，其中該等第二過孔沿一扇形的弧邊排列，且該扇形的圓心與該電子元件重合。
TW099141306A 2010-11-29 2010-11-29 印刷電路板 TWI402007B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW099141306A TWI402007B (zh) 2010-11-29 2010-11-29 印刷電路板
US12/981,477 US20120132461A1 (en) 2010-11-29 2010-12-30 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099141306A TWI402007B (zh) 2010-11-29 2010-11-29 印刷電路板

Publications (2)

Publication Number Publication Date
TW201223359A TW201223359A (en) 2012-06-01
TWI402007B true TWI402007B (zh) 2013-07-11

Family

ID=46125874

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099141306A TWI402007B (zh) 2010-11-29 2010-11-29 印刷電路板

Country Status (2)

Country Link
US (1) US20120132461A1 (zh)
TW (1) TWI402007B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI640229B (zh) 2017-04-14 2018-11-01 和碩聯合科技股份有限公司 電源信號傳遞結構及其設計方法
EP4192199A1 (de) 2021-12-01 2023-06-07 Hilti Aktiengesellschaft Leiterplatte, system, energieversorgungsvorrichtung und werkzeugmaschine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7279771B2 (en) * 2004-03-31 2007-10-09 Shinko Electric Industries Co., Ltd. Wiring board mounting a capacitor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3610221B2 (ja) * 1998-01-27 2005-01-12 キヤノン株式会社 多層プリント配線基板
KR101084526B1 (ko) * 1999-09-02 2011-11-18 이비덴 가부시키가이샤 프린트배선판 및 그 제조방법
JP2002290030A (ja) * 2001-03-23 2002-10-04 Ngk Spark Plug Co Ltd 配線基板
US6657133B1 (en) * 2001-05-15 2003-12-02 Xilinx, Inc. Ball grid array chip capacitor structure
WO2005086554A1 (en) * 2004-03-09 2005-09-15 Nec Corporation Via transmission lines for multilayer printed circuit boards
US7075185B2 (en) * 2004-09-14 2006-07-11 Hewlett-Packard Development Company, L.P. Routing vias in a substrate from bypass capacitor pads
US7709747B2 (en) * 2004-11-29 2010-05-04 Fci Matched-impedance surface-mount technology footprints
US8035992B2 (en) * 2005-10-18 2011-10-11 Nec Corporation Vertical transitions, printed circuit boards therewith and semiconductor packages with the printed circuit boards and semiconductor chip
TWI278268B (en) * 2006-02-23 2007-04-01 Via Tech Inc Arrangement of non-signal through vias and wiring board applying the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7279771B2 (en) * 2004-03-31 2007-10-09 Shinko Electric Industries Co., Ltd. Wiring board mounting a capacitor

Also Published As

Publication number Publication date
TW201223359A (en) 2012-06-01
US20120132461A1 (en) 2012-05-31

Similar Documents

Publication Publication Date Title
CN102164455B (zh) 一种射频功放线路板的组装工艺
TWI402007B (zh) 印刷電路板
JP2006080168A (ja) プリント配線板の放熱構造
TWI410198B (zh) 印刷電路板
JP2015149336A (ja) プリント回路板
TW201240545A (en) Printed circuit board
US20200281069A1 (en) Printed wiring board
JP6098705B1 (ja) インバータ
US8553426B2 (en) Circuit board with higher current
JP2010118699A (ja) 電力用半導体装置
CN102487575B (zh) 印刷电路板
US20200296832A1 (en) Printed circuit board assembly forming a lighting pattern
JP2011210596A (ja) Ｉｃソケット及びその実装構造
TWI441571B (zh) 電容效能優化法及應用該電容效能優化法設計的電路板
CN106211556B (zh) 印刷电路板及具有其的电子装置
JP2007318023A (ja) 半導体パッケージ
CN104582247B (zh) 变频控制板
TW201940023A (zh) 電路板線路配置方法及電路板線路結構
CN210405763U (zh) 一种基于电源ic衬底的散热结构
JP6154994B2 (ja) 多層配線基板
JP5973342B2 (ja) 回路基板と接続端子の接続構造
US11871513B2 (en) Multilayer wiring substrate
JP4803071B2 (ja) 回路基板および電子部品付回路基板
JP2007221014A (ja) 多層配線基板構造
JP2013153106A (ja) 増幅素子実装基板

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees