TWI401786B - Package structure - Google Patents

Description

Package structure

This invention relates to a semiconductor structure, and more particularly to a package structure.

The light-emitting diode has advantages such as long life, small volume, high shock resistance, low heat generation, and low power consumption, and thus has been widely used as an indicator or a light source in households and various devices. In recent years, light-emitting diodes have developed toward multiple colors and high brightness, so their application fields have expanded to large outdoor billboards, traffic lights and related fields. In the future, light-emitting diodes may even become the main source of illumination for both power saving and environmental protection functions.

The package of a plurality of light-emitting diodes can be roughly divided into two types: a wire-bonding type and a flip-chip type, wherein a package formed by wire bonding has a low cost and is formed by a flip chip method. The package has a better heat dissipation effect. Generally, a plurality of LED packages are packaged by disposing a plurality of LED chips on a circuit board, wherein the control chip is selectively disposed on the circuit board. When the control chip is disposed on the circuit board, the control chip is separated from the LED chip; when no control chip is disposed on the circuit board, the external control chip can be used to control the LED on the circuit board. Wafer. In other words, the LED chip and the control wafer are separately packaged, so the number of packages cannot be reduced, the process steps and production costs are easily increased, and mass production is not suitable.

In addition, when the light-emitting diode wafer is placed on the circuit board in a flip chip manner, the circuit board must have a large area and a flip chip contact corresponding to the light-emitting diode wafer. In particular, in order to maintain the smoothness of the flip-chip light-emitting diode wafer, the light-emitting diode wafer has three or more flip-chip contacts. This is not conducive to the packaging of small-sized LED chips, and since the LED chip is light-emitting on one side, the surface of the circuit board used for flip-chip is usually reflected, so when the LED is used When the conductive bumps are electrically connected to the flip-chip contacts on the circuit board, part of the light emitted by the conductive bumps must be reflected and refracted multiple times, and passed through the PN junction of the LEDs multiple times to be emitted. . As a result, the light path is longer and the light loss is higher. In other words, a large area of the flip chip contact on the board affects the luminous efficiency of the LED.

In addition, the substrate or conductive bumps used in the flip chip package may also have unevenness or different sizes due to process tolerances. In other words, when the LED chip is disposed on the circuit board, the light emitting surface of the LED chip may be different between the substrate used in the flip chip package or connected between the LED chip and the circuit board. The size of the conductive bumps is different, resulting in a height difference, meaning that the light emitting surfaces of the light emitting diodes are not on the same plane. As a result, the loss of package rate and the uniformity of light mixing of the light emitted by the LED chip are not good, thereby affecting the light-emitting effect of the multi-chip package of the light-emitting diode. In addition, the general package encapsulation has a poor heat dissipation effect and its refractive index cannot be matched with the LED, resulting in a low heat dissipation effect and a low light extraction efficiency of the packaged LED.

The present invention provides a package structure in which a plurality of light-emitting diodes are disposed on a bearing surface of a light-transmitting substrate with a light-emitting side surface facing the light-transmitting substrate. That is, a plurality of light emitting diodes can be arranged flat on the light transmissive substrate. In this way, the light emitted by the LED can penetrate the transparent substrate from the same plane, and has a better light-emitting effect.

The invention provides a package structure, wherein the control wafer is arranged on the light-emitting diode which is evenly arranged on the light-transmitting substrate in a flip chip manner, and is suitable for packaging of a small-sized light-emitting diode of a plurality of crystal grains, and is advantageous. For mass production and lower production costs.

The invention provides a package structure, which controls the wafer to be directly packaged together with the light emitting diode, which can effectively reduce the overall package structure volume and reduce the production cost.

The invention provides a package structure, wherein the light-transmitting substrate has a refractive index matched with the light-emitting diode, which helps to increase the overall light-emitting efficiency. At the same time, the transparent substrate can also provide a good heat dissipation effect on the light emitting diode.

The invention provides a package structure comprising a light transmissive substrate, a plurality of light emitting diodes and at least one control wafer. The light transmissive substrate has a bearing surface. Each of the light-emitting diodes has a light-emitting side and a joint side, and each of the light-emitting diodes is disposed on the bearing surface with the light-emitting side toward the light-transmitting substrate. The control wafer is disposed on the bonding side of the light emitting diode, and the control wafer is electrically connected to the light emitting diode.

In an embodiment of the invention, the package structure further includes at least one external component disposed on the carrying surface of the transparent substrate or the control wafer, wherein the control chip is electrically connected to an external circuit through the external component.

In an embodiment of the invention, the external component is electrically connected to the control wafer through a flip chip bonding method, a wire bonding method, a soldering method, or a conductive paste.

In an embodiment of the invention, the external component comprises a lead frame, a metal block or a printed circuit board.

In an embodiment of the invention, the external component is disposed on the bearing surface of the light-transmitting substrate, and the external component has substantially the same height as the light-emitting diode.

In one embodiment of the present invention, the at least one control chip includes a first control chip and a second control chip, each of the light emitting diodes has a first pin and a second pin, and the first The control chip and the second control chip are each connected to the first pin and the second pin of the same LED.

In one embodiment of the present invention, the package structure further includes at least one bridging element disposed on the carrying surface of the transparent substrate or the control wafer, and the at least one control wafer includes a first control wafer and a second control wafer. The bridging element is electrically connected to the first control wafer and the second control wafer.

In an embodiment of the invention, the bridging element electrically connects the first control wafer and the second control wafer by a flip chip bonding method, a wire bonding method, a soldering method or a conductive adhesive.

In an embodiment of the invention, the package structure further includes a light adjusting substance disposed on a surface or an interior of the light transmissive substrate.

In an embodiment of the invention, the light-adjusting substance comprises a fluorescent substance, a scattering substance or a reflective substance.

In an embodiment of the invention, the light adjusting substance is a continuous light adjusting substance layer or a plurality of light adjusting substance patterns.

In an embodiment of the invention, the light-adjusting substance pattern is disposed corresponding to the light-emitting diode.

In an embodiment of the invention, the light-transmitting substrate is a multi-layered board structure, and the light-adjusting substance is located on the surface or inside of each layer of the board structure.

In an embodiment of the invention, the package structure further includes a plurality of conductive elements disposed between the bonding side of each of the light emitting diodes and the control wafer, and the control wafer is electrically connected to the corresponding through the conductive elements. Light-emitting diode.

In an embodiment of the present invention, the bonding side of each of the light emitting diodes has a first bonding portion and a second bonding portion, and the conductive component includes a plurality of first conductive components and a plurality of second conductive components. The first conductive elements are respectively disposed on the first joint portion of each of the light emitting diodes, and the second conductive elements are respectively disposed on the second joint portion of each of the light emitting diodes, and the first joint portion and the second joint portion have a height Poor, and the height difference is h1, the height of each first conductive element is h2, the height of each second conductive element is h3, and h1+h2=h3.

In an embodiment of the invention, each of the first conductive elements or each of the second conductive elements is formed by one conductive bump or stacked by a plurality of conductive bumps.

In an embodiment of the invention, the package structure further includes an encapsulant disposed on the bearing surface of the transparent substrate and covering at least the LED.

In an embodiment of the invention, the package structure further includes a heat dissipating component disposed on a side of the control wafer that is relatively far from the light transmissive substrate.

In one embodiment of the present invention, the package structure further includes a light transmissive adhesive layer disposed between the light exiting side of each of the light emitting diodes and the bearing surface of the light transmissive substrate.

In an embodiment of the invention, the package structure further includes an optical path adjusting structure disposed on a bottom surface of one of the transparent substrates relative to the bearing surface.

In an embodiment of the invention, the optical path adjustment structure described above includes a plurality of lenses or a plurality of surface microstructures.

In an embodiment of the invention, the light path adjusting structure is integrally formed with the light transmissive substrate.

Based on the above, the light-emitting diode of the present invention is disposed on the bearing surface of the light-transmitting substrate with the light-emitting side surface facing the light-transmitting substrate, and the control wafer is placed on the light-emitting diode that is evenly arranged on the light-transmitting substrate in a flip chip manner. Physically. Therefore, the present invention is suitable for packaging of a small-sized light-emitting diode, and is advantageous for mass production and reduction of manufacturing cost. In addition, since the control wafer of the present invention can be directly packaged together with the light emitting diode, the volume of the overall package structure can be effectively reduced and the production cost can be reduced. In addition, the light-transmitting substrate of the present invention may have a refractive index matched with the light-emitting diode, which helps to increase the light-emitting efficiency of the overall package structure. At the same time, the transparent substrate can also provide a good heat dissipation effect on the light emitting diode.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a cross-sectional view showing a package structure according to an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the package structure 100 a includes a transparent substrate 110 a , a plurality of light emitting diodes 120 a 120 120 , and at least one control wafer 130 . The transparent substrate 110a has a bearing surface 112. The transparent substrate 110a is, for example, a glass substrate, a ceramic substrate, or a transparent plastic substrate. Each of the light-emitting diodes 120a (or the light-emitting diodes 120b, 120c, 120d, and 120e) has a light-emitting side 122a (or light-emitting sides 122b, 122c, 122d, and 122e) and a light-emitting side 122a (or a light-emitting side 122b). , the bonding side 124a (or the bonding sides 124b, 124c, 124d, 124e) of the 122c, 122d, 122e), and each of the light emitting diodes 120a (or the light emitting diodes 120b, 120c, 120d, 120e) is the light emitting side The 122a (or the light-emitting sides 122b, 122c, 122d, and 122e) are disposed on the carrying surface 112 of the light-transmitting substrate 110a facing the light-transmitting substrate 110a. The control wafer 130 is disposed on the bonding sides 124a to 124e of the LEDs 120a to 120e, and the control wafer 130 is electrically connected to the LEDs 120a to 120e.

Specifically, the control chip 130 of the present embodiment includes a first control chip 132 and a second control chip 134. The first control chip 132 is electrically connected to the LEDs 120a-120c through a plurality of conductive elements 170. The second control chip 134 is also electrically connected to the LEDs 120d to 120e through the conductive element 170. Conductive element 170 herein can be a conductive bump. In other embodiments, the conductive element 170 may also be a conductive paste, and the number of the control wafers 130 may be only one or three or more, which is not limited herein.

Since the light emitting diodes 120a to 120e are disposed on the carrying surface 112 such that the light emitting sides 122a to 122e face the light transmitting substrate 110a, the first control wafer 132 and the second control wafer 134 drive the light emitting diodes 120a to 120c, respectively. When the light-emitting diodes 120a to 120e are emitted, the light emitted from the light-emitting diodes 120a to 120e can be transmitted from the same plane to the transparent substrate 110a and transmitted to the outside, so that the light-emitting diodes 120a to 120e can have the same light-emitting rate. The light mixing effect of the light of the whole light-emitting diodes 120a-120e can be improved, that is, the uniformity of the light mixing is better. In other words, the package structure 100a of the present embodiment has a better light-emitting effect. Further, the control wafer 130 is placed on the light-emitting diodes 120a to 120e which are flatly arranged on the light-transmitting substrate 100a in a flip chip manner. In this way, the number of flip-chip packages of the LEDs 120a-120e completed by the single flip chip manufacturing process can be increased, which can effectively reduce the cost and is suitable for mass production. At the same time, since the flip chip method used in the embodiment is similar to the flip chip structure of the conventional wafer, the existing flip chip process and the process equipment can be used, and the mass production of the package structure 100a and the yield of the product can be improved. In addition, since the control wafer 130 is directly packaged together with the light emitting diodes 120a to 120e, the volume of the entire package structure 100a can be effectively reduced and the production cost can be reduced.

It is to be noted that the light-transmitting substrate 110a of the present embodiment can select a refractive index matching the light-emitting diodes 120a-120e, so that the light-emitting efficiency of the package structure 100a as a whole can be effectively increased. At the same time, the transparent substrate 110a can also serve as a heat dissipation plate of the LEDs 120a-120e, that is, the LEDs 120a-120e can transmit heat to the outside through the transparent substrate 110a, thereby effectively reducing the overall package structure 100a. The temperature is such that the package structure 100a has better reliability. In addition, in general, the material of the control wafer 130 is generally a germanium substrate, wherein the germanium substrate is a good heat conductor, so the control wafer 130 can also help to improve the heat dissipation efficiency of the overall package structure 100a.

The package structure 100a of the present embodiment may further include two external components 140a, 140b, wherein the external components 140a, 140b are, for example, a metal block. In detail, the external component 140a is disposed on the bearing surface 112 of the transparent substrate 110a, and the external component 140a and the LEDs 120a-120e have substantially the same height, and the external component 140b is disposed on the first control wafer 132. The first control chip 132 can be electrically connected to an external circuit (not shown) through the external components 140a, 140b, which can increase the applicability of the package structure 100a. The external component 140a can be electrically connected to the first control die 132 by a flip-chip bonding manner by the conductive component 170 (for example, a conductive bump), and the external component 140b can be electrically connected to the first control die 132 by the conductive paste 172. Sexual connection. Of course, in the other embodiments, the external components 140a and 140b can be electrically connected to the first control chip 132 through a wire bonding method, a soldering method, or other suitable manner, which is not limited thereto.

It is worth mentioning that the present invention does not limit the number, position and type of the external components 140a, 140b, although the external components 140a, 140b mentioned herein are embodied as two metal blocks, respectively The bearing surface 112 of the optical substrate 110a and the surface of the first control wafer 132 are relatively far from the transparent substrate 110a. However, in other embodiments not shown, the external components 140a, 140b may also be a circuit. The board or a lead frame; or one of the external components 140a or 140b may be used to electrically connect the control chip 130; the external component 140a or 140b may be disposed only on the transparent substrate 110a, and the first control chip 132 is away from the transparent substrate 110a. On one side of the surface or on the side of the second control wafer 134 away from the transparent substrate 110a, the invention can be applied without departing from the scope of the invention.

The design of the package structures 100b to 100p will be separately described below using a plurality of different embodiments. It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

2 is a cross-sectional view showing a package structure according to another embodiment of the present invention. Referring to FIG. 1 and FIG. 2 simultaneously, the package structure 100b of FIG. 2 is similar to the package structure 100a of FIG. 1, except that the LED 201f of the package structure 100b of FIG. 2 has a first pin 126a and A second pin 126b, and the first control chip 132 and the second control chip 134 are respectively connected to the first pin 126a and the second pin 126b of the LED 120f through the conductive element 170. That is, the LEDs 120f are electrically connected to the first control wafer 132 and the second control wafer 134 through the conductive elements 170 on the first and second leads 126a and 126b. In other words, the light emitting diodes 120a, 120b, 120d, 120e, 120f can be driven by a single control wafer or a plurality of control wafers, that is, the light emitting diodes 120a, 120b can be driven by the first control wafer 132, and the light emitting diode 120d 120e may be driven by the second control wafer 134, and the light emitting diode 120f may be commonly driven by the first control wafer 132 and the second control wafer 134.

3 is a cross-sectional view showing a package structure according to another embodiment of the present invention. Referring to FIG. 1 and FIG. 3 simultaneously, the package structure 100c of FIG. 3 is similar to the package structure 100a of FIG. 1, except that the package structure 100c of FIG. 3 further includes two bridging elements 150a, 150b, wherein the bridging element 150a is configured. On the carrying surface 112 of the transparent substrate 110a, the bridging element 150a is electrically connected to the first control wafer 132 and the second control wafer 134 through the conductive element 170, and the bridging element 150b is disposed on the control wafer 130. The bridging element 150b is electrically connected to the first control wafer 132 and the second control wafer 134 through the conductive adhesive 172. The bridging elements 150a, 150b can be, for example, a lead frame, a metal block or a printed circuit board.

It should be noted that the present invention does not limit the number and type of the bridging elements 150a, 150b, although the bridging elements 150a, 150b mentioned herein are embodied in two, and are respectively located on the transparent substrate 110a. On the bearing surface 112 and on the side surface of the control wafer 130 that is relatively far from the transparent substrate 110a, and electrically connected to the first control wafer 132 and the second control wafer 134 through the flip chip bonding and the conductive paste 172, respectively, but other In an embodiment not shown, only one of the bridging elements 150a or 150b may be used to bridge the control wafer 130; the bridging element 150a or 150b may also be disposed on the transparent substrate 110a or control the wafer 130 away from the transparent substrate 110a. On the side surface, the bridging element 150a or 150b can be electrically connected to the first control wafer 132 and the second control wafer 134 by other means, such as wire bonding, soldering or other suitable manner, which is still applicable to the present invention. The technical solution does not depart from the scope of the invention as intended.

4 is a cross-sectional view showing a package structure according to another embodiment of the present invention. The package structure 100d of FIG. The light-adjusting substance 160a is a continuous light-adjusting substance layer on the bearing surface 112 of the light-transmitting substrate 110a. Further, the light adjusting substance 160a may be, for example, a fluorescent substance or a discolored substance. When the light emitted by the LEDs 120a-120e enters the transparent substrate 110a from the same plane, the light adjusting substance 160a can change the wavelength of the light and adjust the light path, so that the light emitted from the transparent substrate 110a has better uniformity. In turn, the light-emitting effect of the package structure 100d can be improved.

It is worth mentioning that the present invention does not limit the position of the light adjusting substance 160a. For example, in other embodiments, referring to FIG. 5, the light adjusting substance 160b of the package structure 100e may be embedded in the transparent substrate 110a, or, referring to FIG. 6, the light adjusting substance 160c of the package structure 100f may be configured. On the side of the transparent substrate 110a, or referring to FIG. 7, the light adjusting substance 160d of the package structure 100g may be disposed on the bottom surface 114 of one of the transparent substrate 110a opposite to the bearing surface 112. In short, the light-adjusting materials 160a-160d can be disposed on the surface of the transparent substrate 110a or embedded in the transparent substrate 110a, or can be disposed on the surface of the transparent substrate 110a at the same time. It is embedded in the transparent substrate 110a, and is not limited thereto.

Of course, the present invention also does not limit the form of the light adjustment structure 160a. For example, in other embodiments, referring to FIG. 8 , the light adjusting substance 160 e of the package structure 100 h may be a plurality of light adjusting substance patterns, for example, a plurality of non-continuous sheet patterns having uniform density distribution, and the light adjustment is performed. The substance 160e can be, for example, a fluorescent substance, a scattering substance, or a reflective substance. The light-adjusting material 160e is disposed on the surface of the transparent substrate 110a and embedded in the transparent substrate 110a. The light-adjusting material 160e is disposed in the transparent substrate 110a. The light-adjusting material 160e is disposed on the bearing surface 112 of the transparent substrate 110a except for the distribution of the adjustable light energy (ie, the light shape). The light-adjusting substance 160e can also be used as a marker for alignment when the light-emitting diodes 120a to 120e are provided.

On the other hand, the present invention can also be used as the alignment pattern of the light-emitting diode 121 by the light-adjusting substance 162 located on the light-transmitting substrate 110a or in the light-transmitting substrate 110a. Specifically, please refer to FIG. 9. In this embodiment, the light-transmitting substrate 110a has a light-adjusting substance 162, and the light-emitting diode 121 is disposed on the light-transmitting substrate 110a through the light-adjusting substance 162. . That is, the light adjusting substance 162 and the light emitting diode 121 are disposed corresponding to the light transmitting substrate 110a. In this way, the alignment difficulty of the light-emitting diode 121 during the process can be reduced, and the process error can be reduced to improve the process yield.

In addition, referring to FIG. 10, the light adjusting substance 160f of the package structure 100i may be, for example, a plurality of non-continuous block patterns having uniform density distribution, and the light adjusting substance 160f may be distributed on the surface of the transparent substrate 110a and It is embedded in the transparent substrate 110a. Here, the light adjusting substance 160f can also be used as a three-dimensional mark for alignment when the light emitting diodes 120a to 120e are provided. When the light adjusting material 160f is disposed on the carrying surface 112 of the transparent substrate 110a, a height difference is generated between the light emitting diode 120d and the light emitting diode 120e, and the conductive element 170 can be transmitted through the stacked conductive element 170 to the light emitting diode. The second control wafer 134 is horizontally disposed on the light-emitting diodes 120d, 120e on the bonding surface 124d of 120d. Moreover, referring to FIG. 11 , the transparent substrate 110 b of the package structure 100 j may also be, for example, a multi-layer board structure, that is, the transparent substrate 110 b may be composed of the layer structures 116 , 117 , 118 , wherein the light adjusting substance 160 f may be located in the layer. The surface or interior of the plate structures 116, 117, 118, and each of the ply structures 116 (or ply structures 117, 118) have light-adjusting materials 160f. That is, the design of the package structure 100j of the present embodiment can perform different light conversions in different blocks or layers (for example, blue light red light in the laminate structure 116; blue light transfer in the laminate structure 117) Yellow light; blue light to green light in the layer structure 118 to improve the overall conversion efficiency, or adjust the chromaticity of different exit angles.

In short, the user can adjust the wavelength of the light emitted by the LEDs 120a to 120e by the type and arrangement position of the selected light adjusting substances 160a to 160f and the type of the transparent substrates 110a to 110b. The light path or light shape is such that the package structures 100d to 100j have a better light-emitting effect. Further, in the above embodiment, the light-adjusting substances 160a to 160f are arranged so as not to be covered on the light-transmitting substrates 110a and 110b, and the thickness of the light-adjusting substances 160e to 160f may be uneven. When the light emitted by the LEDs 120a to 120e penetrates the transparent substrates 110a and 110b, part of the light directly penetrates the transparent substrates 110a and 110b to exhibit the color light emitted by the original LEDs 120a to 120e. For example, blue light is emitted, and another portion of the light excites the light-adjusting substances 160a to 160f to generate color light different from that of the original light-emitting diodes 120a to 120e, for example, green light. In this way, the package structures 100d-100j can change the light-emitting intensity, the chromaticity, the color temperature, and the mixing of the different hues emitted by the different LEDs 120a-120e through the light-adjusting substances 160e-160f. The light effect is applied, and the light-emitting effect of the overall package structures 100d to 100j is adjusted by controlling the wafer 130. In other words, the light-adjusting substances 160a to 160f are arranged so as not to be covered on the transparent substrates 110a and 110b, and the light-emitting efficiency of the entire package structures 100d to 100j can be effectively improved. In addition, the above embodiments are merely illustrative, and those skilled in the art can refer to the foregoing embodiments to select the foregoing components or combine them according to actual needs to achieve the desired technical effects.

FIG. 12 is a cross-sectional view showing a package structure according to another embodiment of the present invention. Referring to FIG. 12 and FIG. 1 simultaneously, the package structure 100k of FIG. 12 is similar to the package structure 100a of FIG. 1 except that the types of the LEDs 120a1 to 120e1 of the package structure 100k of FIG. 12 and FIG. The types of the light-emitting diodes 120a to 120e are different. In detail, taking the light-emitting diode 120c1 of FIG. 12 as an example, the bonding side 124c1 of the light-emitting diode 120c1 has a first bonding portion 124c2 and a second bonding portion 124c3, and the conductive member 170 may include the first conductive member 170a. And the second conductive element 170b, wherein the first conductive element 170a is disposed on the first bonding portion 124c2 of the light emitting diode 120c1, and the second conductive element 170b is disposed in the second bonding portion 124c3 of the light emitting diode 120c1, wherein the first bonding The portion 124c2 and the second joint portion 124c3 have a height difference h1, the height of the first conductive element 170a is h2, and the height of the second conductive element 170b is h3, preferably h1+h2=h3.

Since the first joint portion 124c2 and the second joint portion 124c3 of the light-emitting diode 120c1 have a height difference h1, the height difference h1 can be adjusted by transmitting the first conductive member 170a and the second conductive member 170b having different heights, which is effective. The yield of the flip chip bonding of the control wafer 130 is improved. Here, the first conductive element 170a or the second conductive element 170b may be formed by one conductive bump or stacked by a plurality of conductive bumps, depending on the difference in height between the first joint portion 124c2 and the second joint portion 124c3. It is not limited here. For the same reason, the LEDs 120a1, 120b1, 120d1, and 120e1 have the same type as the LEDs 120c1. Please refer to the above description, and details are not described herein again. In addition, the conductive bumps described herein are metal balls or metal blocks that are applied to the first joint portion 124c2 and the second joint portion 124c3 through the wire bonding machine, wherein the metal is, for example, gold or aluminum.

FIG. 13 is a cross-sectional view showing a package structure according to another embodiment of the present invention. The package structure 1001 of FIG. The light-emitting diodes 120a to 120e are covered on the bearing surface 112 of the optical substrate 110a, and at least the light-emitting diodes 120a to 120e are prevented from being affected by external substances. Specifically, in the embodiment, the encapsulant 180 is filled between the LEDs 120a-120e and the first control wafer 132 and the second control wafer 134, that is, the encapsulant 180 encapsulates the LED. 120a-120e and the conductive member 170, and the bearing surface 112 covering the partially transparent substrate 110a, the first control wafer 132 and the second control wafer 134 are adjacent to the surface of the light-emitting diodes 120a-120e and a part of the surface of the external component 140a. In addition, the encapsulant 180 herein has the functions of shielding the light-emitting diodes 120a-120e, and also has the functions of guiding light and dissipating heat.

Figure 14 is a cross-sectional view showing a package structure in accordance with another embodiment of the present invention. Referring to FIG. 14 and FIG. 1 simultaneously, the package structure 100m of FIG. 14 is similar to the package structure 100a of FIG. 1 , except that the package structure 100m of FIG. 14 further includes a heat dissipation component 185, wherein the heat dissipation component 185 is configured to be controlled. The side of the wafer 130 away from the transparent substrate 110a can effectively conduct the first control wafer 132 and the second control wafer 134 to the outside when the operation of the second control wafer 132 is performed, so that the package structure 100m has a better heat dissipation effect.

Figure 15 is a cross-sectional view showing a package structure in accordance with another embodiment of the present invention. Referring to FIG. 15 and FIG. 1 , the package structure 100 n of FIG. 15 is similar to the package structure 100 a of FIG. 1 , except that the package structure 100 n of FIG. 15 further includes a transparent adhesive layer 190 , wherein the transparent adhesive layer 190 is disposed between the light-emitting sides 122a-122e of the light-emitting diodes 120a-120e and the bearing surface 112 of the transparent substrate 110a and between the external component 140a and the bearing surface 112 of the transparent substrate 110a, that is, the light-emitting diode 120a ～120e can be fixed on the transparent substrate 110a through the transparent adhesive layer 190, and the external component 140a can be fixed on the transparent substrate 110a through the transparent adhesive layer 190. The light-transmitting adhesive layer 190 can effectively increase the adhesion between the light-emitting diodes 120a-120e and the transparent substrate 110a and the adhesion between the external component 140a and the transparent substrate 110a, thereby improving the reliability of the package structure 100n. .

Figure 16 is a cross-sectional view showing a package structure in accordance with another embodiment of the present invention. Referring to FIG. 16 and FIG. 1 simultaneously, the package structure 100o of FIG. 16 is similar to the package structure 100a of FIG. 1, except that the package structure 100o of FIG. 16 further includes a light path adjustment structure 195a, wherein the light path adjustment structure The 195a is disposed on one of the transparent substrates 110a opposite to the bottom surface 114 of the carrying surface 112. The light path adjusting structure 195a is, for example, a plurality of lenses for influencing the light emitted by the LEDs 120a-120e to adjust the light path, and can improve the light-emitting efficiency and the light-emitting uniformity of the package structure 100o.

Figure 17 is a cross-sectional view showing a package structure in accordance with another embodiment of the present invention. Referring to FIG. 17 and FIG. 16 simultaneously, the package structure 100p of FIG. 17 is similar to the package structure 100o of FIG. 16, except that the optical path adjustment structure 195b of the package structure 100p of FIG. 17 is a plurality of surface microstructures, and The light path adjusting structure 195b is integrally formed with the light-transmitting substrate 110c, and the light path adjusting structure 195b is formed, for example, by surface-treating the bottom surface 114 of the light-transmitting substrate 110c.

In summary, the present invention has at least the following effects:

1. Since the light-emitting diode of the present invention is disposed on the bearing surface of the light-transmitting substrate with the light-emitting side surface facing the light-transmitting substrate, the light emitted by the light-emitting diode can be transmitted from the same plane through the light-transmitting substrate to the outside. It can effectively improve the uniformity of light output of the overall light-emitting diode.

2. The package structure of the present invention encapsulates the light-emitting diode and the control wafer by one flip chip, which can effectively reduce the number of packages, and has a simple process and good process efficiency, thereby improving the mass production of the package structure.

3. The control wafer of the present invention is arranged on the light-emitting diode which is evenly arranged on the light-transmitting substrate in a flip chip manner. Therefore, the present invention is suitable for packaging of a small-sized light-emitting diode and is advantageous for mass production. And reduce production costs.

4. Since the flip chip method used in the present invention is similar to the flip chip structure of the conventional wafer, the existing flip chip process and process equipment can be used, and the mass production of the package structure and the yield of the product can be improved.

5. Since the control wafer is directly packaged together with the light emitting diode, the volume of the overall package structure can be effectively reduced and the production cost can be reduced.

6. Since the package structure of the present invention has an external component, the control chip can be electrically connected to the external circuit through the external component, which can increase the applicability of the package structure.

7. The package structure of the present invention may further comprise a light adjusting substance or a light path adjusting structure to adjust a wavelength, a light path or a light shape of the light emitted by the light emitting diode, so that the package structure has a better light emitting effect.

8. The package structure of the present invention can also include a heat dissipating component, which can effectively conduct heat generated by the control wafer to the outside, so that the package structure has better heat dissipation effect.

9. The light-transmitting substrate of the present invention can select a refractive index matched with the light-emitting diode to increase the light-emitting efficiency of the package structure as a whole.

10. The transparent substrate and the control wafer of the present invention contribute to heat dissipation of the LED, and the heat dissipation efficiency of the overall package structure can be improved.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100a～100p. . . Package structure

110a～110c. . . Light transmissive substrate

112. . . Bearing surface

114. . . Bottom

116~118. . . Laminate structure

120a～120f, 120a1～120e1, 121. . . Light-emitting diode

122a～122e. . . Light exit side

124a～124e, 124c1. . . Joint side

124c2. . . First joint

124c3. . . Second joint

126a. . . First pin

126b. . . Second pin

130. . . Control chip

132. . . First control chip

134. . . Second control chip

140a, 140b. . . External component

150a, 150b. . . Bridging element

160a～160f,162. . . Light adjusting substance

170. . . Conductive component

170a. . . First conductive element

170b. . . Second conductive element

172. . . Conductive plastic

180. . . Encapsulant

185. . . Heat sink

190. . . Light-transmitting adhesive layer

195a, 195b. . . Light path adjustment structure

H1. . . Height difference

H2, h3. . . height

1 is a cross-sectional view showing a package structure according to an embodiment of the present invention.

2 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

3 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

4 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

6 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

FIG. 7 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

FIG. 8 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

Fig. 9 is a schematic view showing the positional relationship between a light-emitting diode and a light-adjusting substance according to an embodiment of the present invention.

FIG. 10 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

11 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

FIG. 12 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

FIG. 13 is a cross-sectional view showing a package structure according to another embodiment of the present invention.

Figure 14 is a cross-sectional view showing a package structure in accordance with another embodiment of the present invention.

Figure 15 is a cross-sectional view showing a package structure in accordance with another embodiment of the present invention.

Figure 16 is a cross-sectional view showing a package structure in accordance with another embodiment of the present invention.

Figure 17 is a cross-sectional view showing a package structure in accordance with another embodiment of the present invention.

100a. . . Package structure

110a. . . Light transmissive substrate

112. . . Bearing surface

120a～120e. . . Light-emitting diode

122a～122e. . . Light exit side

124a～124e. . . Joint side

130. . . Control chip

132. . . First control chip

134. . . Second control chip

140a, 140b. . . External component

170. . . Conductive component

172. . . Conductive plastic

Claims (22)

A package structure comprising: a light-transmissive substrate having a bearing surface; a plurality of light-emitting diodes, each light-emitting diode having an opposite light-emitting side and a joint side, and each light-emitting diode is used for the light-emitting diode The side surface of the light-emitting substrate is coplanarly attached to the bearing surface; and at least one control chip is disposed on the bonding sides of the light-emitting diodes, and the control chip and the light-emitting diodes are electrically connected Sexual connection. The package structure of claim 1, further comprising at least one external component disposed on the carrying surface of the transparent substrate or the control wafer, wherein the control chip is electrically connected to the external component through an external component connection. The package structure of claim 2, wherein the external component is electrically connected to the control chip through a flip chip bonding method, a wire bonding method, a soldering method, or a conductive paste. The package structure of claim 2, wherein the external component comprises a lead frame, a metal block or a printed circuit board. The package structure of claim 2, wherein the external component is disposed on the bearing surface of the light transmissive substrate, and the external component has substantially the same height as the light emitting diodes. The package structure of claim 1, wherein the at least one control chip comprises a first control chip and a second control chip, each of the light emitting diodes has a first pin and a second pin And the first control chip and the second control chip are respectively connected to the first pin and the second pin of the same LED. The package structure of claim 1, further comprising at least one bridging element disposed on the carrying surface of the transparent substrate or the control wafer, the at least one control chip comprising a first control chip and a first The control chip is electrically connected to the first control wafer and the second control wafer. The package structure of claim 7, wherein the bridging element electrically connects the first control wafer and the second control wafer by flip chip bonding, wire bonding, soldering or conductive adhesive. The package structure of claim 1, further comprising a light-adjusting substance disposed on a surface or inside of the light-transmitting substrate. The package structure of claim 9, wherein the light-adjusting substance comprises a fluorescent substance, a scattering substance or a reflective substance. The package structure of claim 9, wherein the light adjusting substance is a continuous light adjusting substance layer or a plurality of light adjusting substance patterns. The package structure of claim 11, wherein the light adjustment substance pattern is disposed corresponding to the light emitting diodes. The package structure of claim 9, wherein the light transmissive substrate is a multi-layered plate structure, and the light-adjusting substance is located on a surface or inside of each ply structure. The package structure of claim 1, further comprising a plurality of conductive elements disposed between the bonding side of each of the light emitting diodes and the control wafer, and the control chip is electrically connected through the conductive elements To the corresponding light-emitting diode. Such as the package structure described in claim 14 of the patent scope, wherein each The bonding side of a light emitting diode has a first bonding portion and a second bonding portion, and the conductive elements comprise a plurality of first conductive elements and a plurality of second conductive elements, wherein the first conductive elements are respectively disposed on The first conductive portion of each of the light-emitting diodes is disposed at the second joint portion of each of the light-emitting diodes, and the first joint portion and the second joint portion have a height difference And the height difference is h1, the height of each first conductive element is h2, the height of each second conductive element is h3, and h1+h2=h3. The package structure according to claim 15, wherein each of the first conductive elements or each of the second conductive elements is formed by one conductive bump or stacked by a plurality of conductive bumps. The package structure of claim 1, further comprising an encapsulant disposed on the carrying surface of the transparent substrate and covering at least the light emitting diodes. The package structure of claim 1, further comprising a heat dissipating component disposed on a side of the control wafer that is relatively far from the light transmissive substrate. The package structure of claim 1, further comprising a light transmissive layer disposed between the light exiting side of each of the light emitting diodes and the carrying surface of the light transmissive substrate. The package structure of claim 1, further comprising a light path adjusting structure disposed on a bottom surface of one of the light transmissive substrates relative to the bearing surface. The package structure of claim 20, wherein the light path adjustment structure comprises a plurality of lenses or a plurality of surface microstructures. The package structure of claim 20, wherein the light path adjustment structure is integrally formed with the light transmissive substrate.