TWI401199B - Substrate buffer unit - Google Patents
Substrate buffer unit Download PDFInfo
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- TWI401199B TWI401199B TW099105817A TW99105817A TWI401199B TW I401199 B TWI401199 B TW I401199B TW 099105817 A TW099105817 A TW 099105817A TW 99105817 A TW99105817 A TW 99105817A TW I401199 B TWI401199 B TW I401199B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G45/00—Lubricating, cleaning, or clearing devices
- B65G45/10—Cleaning devices
- B65G45/22—Cleaning devices comprising fluid applying means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Description
本發明係關於一種用來讓基板輸送路徑所輸送之例如用於平面顯示器(FPD)的玻璃基板暫時從基板輸送路徑退避離開的基板緩衝單元,特別是關於一種能夠讓緩衝裝置內部空間的空氣清淨程序有效率地進行的基板緩衝單元。The present invention relates to a substrate buffer unit for temporarily retracting a glass substrate, such as a flat panel display (FPD), which is transported by a substrate transport path, from the substrate transport path, and more particularly to a method for cleaning the air in the interior of the buffer device. The substrate buffer unit is efficiently executed by the program.
在FPD的製造過程中,係使用微影技術在FPD用的玻璃基板上形成電路圖案。微影形成電路圖案,係先在玻璃基板上塗佈光阻液以形成光阻膜,再以對應電路圖案的方式將光阻膜曝光,然後實施顯影處理。電路圖案的形成,係使用將實施光阻液塗布或顯影等處理的各處理單元沿著輸送路線(基板輸送路徑)設置的製造生產線。玻璃基板沿著輸送路線輸送,並在各處理單元接受既定處理。In the manufacturing process of the FPD, a circuit pattern is formed on a glass substrate for FPD using lithography. The lithography forms a circuit pattern by first coating a photoresist on a glass substrate to form a photoresist film, exposing the photoresist film in a corresponding circuit pattern, and then performing development processing. The circuit pattern is formed by using a manufacturing line in which each processing unit that performs processing such as photoresist coating or development is disposed along a transport path (substrate transport path). The glass substrate is transported along the transport path and subjected to predetermined processing at each processing unit.
另外,該製造生產線為了調整在各處理單元之間的基板接收以及傳遞的時序,通常會設置讓玻璃基板暫時從輸送路線退避離開並保管玻璃基板的緩衝裝置。關於該等緩衝裝置,本案申請人在專利文獻1中揭示一種讓能夠以多段方式載置玻璃基板的棚台部升降,藉此將基板送入或送出的升降式緩衝裝置(以下稱為升降緩衝裝置)。Further, in order to adjust the timing of substrate reception and transfer between the respective processing units, the manufacturing line usually has a buffer device that temporarily evacuates the glass substrate from the transport path and stores the glass substrate. In the case of the above-mentioned cushioning device, the applicant of the present invention disclosed a lifting cushion device (hereinafter referred to as a lifting buffer) that allows the substrate to be lifted and lowered by placing the glass substrate in a plurality of stages, thereby feeding or sending the substrate. Device).
根據圖7簡單說明專利文獻1所揭示之升降緩衝裝置的基板退避動作。圖7(a)~圖7(c)所示之升降緩衝裝置200,包含:棚台部205,其設置在輸送路線途中,並設有以多段方式設置的基板載置部202a~202f;升降機構206,其以可升降移動的方式支持該棚台部205。當需要將基板退避到升降緩衝裝置200內時,便停止驅動X方向下游側的輔助輸送機構210。再者,如圖7(a)所示的當從X方向上游側輸送過來的最初的基板G1通過框體201的送入口201a,而基板整體載置於載置部202a上時,輸送機構250a便停止。藉此基板G1形成載置於載置部202a上的狀態。The substrate retracting operation of the lifting cushion device disclosed in Patent Document 1 will be briefly described with reference to Fig. 7 . The lifting/lowering buffer device 200 shown in FIGS. 7(a) to 7(c) includes a shed portion 205 which is provided in the middle of the conveying path, and is provided with the substrate placing portions 202a to 202f which are provided in a plurality of stages; The mechanism 206 supports the shed portion 205 in a movable manner. When it is necessary to evacuate the substrate into the lift buffer device 200, the auxiliary conveyance mechanism 210 on the downstream side in the X direction is stopped. Further, as shown in FIG. 7(a), when the first substrate G1 conveyed from the upstream side in the X direction passes through the inlet 201a of the housing 201, and the entire substrate is placed on the placing portion 202a, the conveying mechanism 250a It stops. Thereby, the substrate G1 is placed in a state of being placed on the mounting portion 202a.
接著,當下一片基板G2接著從X方向上游側輸送過來時,便解除輸送機構250a與其驅動源的連接。Next, when the next substrate G2 is subsequently transported from the upstream side in the X direction, the connection of the transport mechanism 250a to its drive source is released.
然後,載置部202b~202f的其中任一個,例如圖7(b)所示的,升降機構206讓棚台部205上升以使載置部202b與輸送路線的高度一致,並讓載置部202b的輸送機構250b與其驅動部連接而受到驅動。在此,基板G1如載置部202a那樣形成從輸送路線退避離開的狀態。然後,當基板G2整體載置於載置部202b上時,便停止驅動輸送機構250b。Then, any one of the placing portions 202b to 202f, for example, as shown in FIG. 7(b), the elevating mechanism 206 raises the scaffolding portion 205 so that the mounting portion 202b coincides with the height of the transport path, and allows the mounting portion to be placed. The conveying mechanism 250b of 202b is connected to its driving portion and is driven. Here, the substrate G1 is in a state of being retracted from the conveyance path as in the placing portion 202a. Then, when the entire substrate G2 is placed on the placing portion 202b, the driving mechanism 250b is stopped.
藉由重複該等步驟,到基板輸送的待機狀態解除為止,輸送路線所輸送過來的後續基板G3、G4...會分別載置於載置部202c、202d...上並受到保管[參照圖7(c)]。By repeating these steps, after the standby state of the substrate conveyance is released, the subsequent substrates G3 and G4, which are transported by the transport path, are placed on the mounting portions 202c and 202d, respectively, and are stored. Figure 7 (c)].
另外,該升降緩衝裝置200,與其他單元一起設置在無塵室內。無塵室的頂部設有稱為FFU(風扇過濾單元)的清淨空氣供給裝置,藉此,空氣向下方流動形成垂直層流(降流)。Further, the lift buffer device 200 is installed in the clean room together with other units. A clean air supply device called an FFU (Fan Filter Unit) is provided at the top of the clean room, whereby the air flows downward to form a vertical laminar flow (downflow).
以往,係利用該降流確保室內的清淨度,進而確保收納基板之棚台部205內部的清淨度。Conventionally, the degree of cleanliness in the room is ensured by the downflow, and the cleanness of the inside of the shed portion 205 of the storage substrate is ensured.
亦即,如圖8所示的,作為外裝面板的框體201的頂面,為了將上方往下方流動的清淨空氣吸入框體內201而形成開放構造。因此,無塵室內的降流,形成從框體201的頂面流入框體201內部並從基板送入送出口201a、201b流出的清淨空氣流。In other words, as shown in FIG. 8, the top surface of the casing 201 as the exterior panel is formed into an open structure in order to suck the clean air flowing downward from the upper side into the casing 201. Therefore, the downflow in the clean room forms a clean air flow that flows into the inside of the casing 201 from the top surface of the casing 201 and flows out from the substrate feed-in ports 201a and 201b.
[專利文獻1]日本特開2007-250671號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-250671
然而,在該構造中若藉由升降機構206讓棚台部205在框體201內升降移動,則如圖9所示的棚台部205下方的空間207的容積會產生變化,形成於框體201內的空氣流會被打亂,可能會造成不良的影響。However, in this configuration, when the gantry portion 205 is moved up and down in the casing 201 by the elevating mechanism 206, the volume of the space 207 below the shed portion 205 as shown in FIG. 9 changes, and is formed in the casing. The air flow in 201 will be disrupted and may cause adverse effects.
亦即,在棚台部205的每次升降移動中,其下方空間207的容積變化而產生壓縮膨脹,將升降機構206所產生的塵埃捲起,塵埃流動進入棚台部205內部,可能會附著到棚台部205內所載置的基板上。In other words, in the up-and-down movement of the shed portion 205, the volume of the lower space 207 changes to cause compression expansion, and the dust generated by the elevating mechanism 206 is rolled up, and the dust flows into the inside of the shed portion 205, possibly adhering. It is placed on the substrate placed in the shed portion 205.
有鑑於上述問題,本發明之目的在於提供一種基板緩衝單元,其使單一方向輸送之基板暫時退避,讓緩衝空間的空氣清淨程序有效率地進行。In view of the above problems, an object of the present invention is to provide a substrate buffer unit that temporarily evacuates a substrate transported in a single direction and efficiently performs an air cleaning process in a buffer space.
為了解決上述問題,本發明提供一種基板緩衝單元,其將基板輸送路徑所輸送之基板暫時收納,使基板從該基板輸送路徑退避離開,包含:箱狀的框體,其頂面為開放;載置部,其載置從該基板輸送路徑送入該框體內的基板;箱狀的棚台部,其以能夠讓該載置部移動到離開該基板輸送路徑的既定位置上的方式設置;空氣導入口,其設置在該棚台部的一側面上,將清淨空氣導入該載置部;排氣機構,其連接該棚台部,將該棚台部內的空氣吸出該框體外;以及排氣窗,其設置在比該棚台部更下方的該框體側面上,將該框體內的蒙氣排出。In order to solve the above problems, the present invention provides a substrate buffer unit that temporarily stores a substrate conveyed by a substrate transport path and retreats the substrate from the substrate transport path, and includes a box-shaped frame having a top surface open; a mounting portion that mounts a substrate that is fed into the housing from the substrate transport path; and a box-shaped shed portion that is disposed to move the mounting portion to a predetermined position away from the substrate transport path; a guide inlet provided on one side of the shed portion, introducing clean air into the mounting portion; an exhaust mechanism connecting the shed portion, sucking air in the shed portion out of the frame; and exhausting The window is disposed on a side surface of the frame lower than the shed portion, and discharges the air in the frame.
藉由像這樣設置排氣機構,在框體內,便能夠從棚台部的側面將清淨空氣強制導入,使其朝單一方向流動排出。再者,藉由在框體的下部側面上設置排氣窗,便能夠將未被導入棚台部內部而流到棚台部下方的清淨空氣有效率地排出。By providing the exhaust mechanism in this manner, the clean air can be forcibly introduced from the side surface of the shed portion in the casing, and can be discharged and discharged in a single direction. Further, by providing the exhaust window on the lower side surface of the casing, it is possible to efficiently discharge the clean air that has not been introduced into the inside of the booth portion and flows below the booth portion.
又,在框體內,能夠讓上部空間相較於下部空間經常形成正壓,並抑制下部空間發生氣流捲起的情況。Further, in the casing, the upper space can be formed with a positive pressure in comparison with the lower space, and the airflow in the lower space can be suppressed from being rolled up.
又,該排氣窗,宜藉由分別以隨意開閉方式設置的複數開閉構件,使其開口面積能夠以複數階段方式改變。Further, it is preferable that the exhaust window is changed in a plurality of stages by a plurality of opening and closing members which are respectively provided in an openable and closable manner.
又,更設置:氣壓檢測機構,其檢測該框體內的上部空間與下部空間的氣壓或是其中任一方的氣壓;開閉驅動機構,其驅動各開閉構件開啟關閉;以及控制機構,其控制至少該開閉驅動機構與該排氣機構的其中任一方;該控制機構,宜根據該氣壓檢測機構之檢測結果與既定氣壓值的比較結果,決定至少該排氣窗的開口面積與該排氣機構的排氣輸出的其中任一方,並控制至少該開閉驅動機構與該排氣機構的其中任一方。Further, an air pressure detecting mechanism is provided to detect the air pressure of the upper space and the lower space in the casing or the air pressure of either one; the opening and closing drive mechanism drives the opening and closing members to open and close; and the control mechanism controls the at least Opening and closing the drive mechanism and the exhaust mechanism; the control mechanism preferably determines at least the opening area of the exhaust window and the row of the exhaust mechanism according to a comparison result between the detection result of the air pressure detecting mechanism and a predetermined air pressure value One of the gas outputs, and controls at least one of the opening and closing drive mechanism and the exhaust mechanism.
藉由該等構造,便能夠對應棚台部的升降移動而改變排氣窗的開口面積以及排氣機構的排氣輸出,在框體內形成穩定的降流。With these structures, the opening area of the exhaust window and the exhaust gas output of the exhaust mechanism can be changed in accordance with the lifting movement of the shed portion, and a stable downflow can be formed in the casing.
如是,便能夠抑制在框體內發生空氣逆流或捲起的情況,防止馬達等驅動系統所產生的塵埃流入棚台部。In this case, it is possible to prevent the air from flowing back or rolling up in the casing, and to prevent dust generated by the drive system such as a motor from flowing into the booth portion.
又,在該箱狀的棚台部的側面上宜設置將從該棚台部側邊流下之清淨空氣引導至該排氣窗的第一整流板。Further, it is preferable that the side surface of the box-shaped shed portion is provided with a first rectifying plate that guides the clean air flowing down from the side of the shed portion to the louver.
又,在該箱狀的棚台部的頂面上宜設置將從上方流下之清淨空氣引導至該棚台部側邊的第二整流板。Further, it is preferable that the top surface of the box-shaped shed portion is provided with a second flow regulating plate that guides the clean air flowing down from the upper side to the side of the shed portion.
藉由像這樣設置第一、第二整流板,便能夠對從上方導入之清淨空氣進行整流,進而抑制亂流情況發生,並形成經過整流而流向棚台部側邊以及排氣窗的空氣流。By providing the first and second flow regulating plates in this manner, it is possible to rectify the clean air introduced from above, thereby suppressing the occurrence of turbulence, and forming a flow of air that flows through the rectification to the side of the shed portion and the louver. .
本發明提供一種基板緩衝單元,其使單一方向輸送之基板暫時退避離開,讓緩衝空間的空氣清淨步驟有效率地進行。The present invention provides a substrate buffer unit that temporarily evacuates a substrate transported in a single direction, and allows the air cleaning step of the buffer space to be efficiently performed.
以下,根據圖示詳細說明本發明之基板緩衝單元的實施形態。本發明之基板緩衝單元設置在例如利用微影步驟形成電路圖案的製造生產線途中,將作為被處理基板的FPD用玻璃基板暫時收納,使其從製造生產線退避離開。在以下的實施形態中,就應用於升降緩衝裝置的實施例進行說明。Hereinafter, an embodiment of the substrate buffer unit of the present invention will be described in detail based on the drawings. In the middle of the manufacturing line in which the circuit pattern is formed by the lithography step, the substrate buffer unit of the present invention temporarily stores the FPD glass substrate as the substrate to be processed, and retreats from the manufacturing line. In the following embodiments, an embodiment applied to the lifting cushion device will be described.
圖1係本發明之基板緩衝單元的側剖面圖,圖2係沿圖1之A-A線段的端視圖,圖3係沿圖2之B-B線段的端視圖,圖4係沿圖2之C-C線段的端視圖。1 is a side cross-sectional view of a substrate buffer unit of the present invention, FIG. 2 is an end view taken along line AA of FIG. 1, FIG. 3 is an end view taken along line BB of FIG. 2, and FIG. 4 is taken along line CC of FIG. End view.
圖示之基板緩衝單元100,具備在單元框體1內將作為被處理基板的玻璃基板G以多段(圖中為5段)方式載置的箱狀棚台部2;以及從下方支持該棚台部2並與其一起升降移動的升降機構3。The substrate buffer unit 100 shown in the drawing includes a box-shaped shed portion 2 in which a glass substrate G as a substrate to be processed is placed in a plurality of stages (in the figure, five stages) in the unit casing 1; and the shed is supported from below. The table portion 2 is moved up and down together with the lifting mechanism 3.
對該基板緩衝單元100,玻璃基板G從圖1所示之單元框體1的送入口1a送入,收納於棚台部2之後,適時從相反側的送出口1b送出。In the substrate buffer unit 100, the glass substrate G is fed from the inlet 1a of the unit casing 1 shown in Fig. 1, and is stored in the booth portion 2, and then sent out from the opposite side of the delivery port 1b as appropriate.
該框體1的送入口1a以及送出口1b,設置在緩衝單元100的上游以及下游,配合所謂平流式基板輸送路線(基板輸送路徑)的高度位置而設置。The inlet 1a and the outlet 1b of the casing 1 are provided upstream and downstream of the buffer unit 100, and are provided in conjunction with a height position of a so-called flat flow substrate transport path (substrate transport path).
如圖1、2所示的棚台部2設有箱狀的殼體20,在該殼體20內設置例如5段的基板G的載置部6。在殼體20面臨該框體1之送入送出口1a、1b的側面上,對應各段載置部6設置複數個基板送入口2a與送出口2b。The shed portion 2 shown in FIGS. 1 and 2 is provided with a box-shaped casing 20, and the mounting portion 6 of the substrate G of, for example, five stages is provided in the casing 20. On the side surface of the casing 20 facing the feeding/discharging ports 1a and 1b of the casing 1, a plurality of substrate feeding ports 2a and a delivery port 2b are provided corresponding to the respective segment placing portions 6.
由於棚台部2(殼體20)在框體1內可藉由升降機構3升降移動,在對既定段之載置部6實施玻璃基板G的送入送出時,升降機構3讓棚台部2升降移動,使該既定段之載置部6移到該送入口1a以及送出口1b的高度。When the shed portion 2 (the casing 20) can be moved up and down by the elevating mechanism 3 in the casing 1, when the glass substrate G is fed and fed to the placing portion 6 of the predetermined stage, the elevating mechanism 3 allows the shed portion to be moved. 2 The lifting movement moves the placement portion 6 of the predetermined section to the height of the delivery inlet 1a and the delivery outlet 1b.
又,在將基板G載置於既定的載置部6之後,升降機構3讓棚台部2升降移動到離開基板輸送路線的既定位置上,藉此讓該基板G從基板輸送路線退避離開。Further, after the substrate G is placed on the predetermined placing portion 6, the elevating mechanism 3 moves the gantry portion 2 up and down to a predetermined position away from the substrate transport path, thereby retracting the substrate G from the substrate transport path.
又,如圖2所示的,各載置部6以並排方式設置複數個用來實行基板輸送的輥子輸送軸13,在各軸13的一端上設有軸旋轉驅動機構14,其由馬達等構件所構成,用來旋轉驅動各軸13。Further, as shown in Fig. 2, each of the placing portions 6 is provided with a plurality of roller conveying shafts 13 for performing substrate conveyance in a side-by-side manner, and a shaft rotation driving mechanism 14 is provided at one end of each of the shafts 13, which is provided by a motor or the like. The member is constructed to rotationally drive the respective shafts 13.
又,如圖1、圖2所示的框體1的頂面形成開放構造。因此,當該緩衝單元100設置在無塵室內,從其頂部以降流方式供給清淨空氣時,便能夠如圖所示從框體1的上方對框體1內部供給清淨空氣。Moreover, the top surface of the frame 1 shown in FIG. 1 and FIG. 2 forms an open structure. Therefore, when the buffer unit 100 is installed in the clean room and the clean air is supplied from the top thereof in a downflow manner, the clean air can be supplied from the upper side of the casing 1 to the inside of the casing 1 as shown.
在此,於棚台部2的頂面,設置中央部凸出成圓頂狀的整流板45(第二整流板),將上方的降流引導至棚台部2的側邊。Here, on the top surface of the shed portion 2, a rectifying plate 45 (second rectifying plate) in which a central portion protrudes in a dome shape is provided, and the upward downflow is guided to the side of the shed portion 2.
在棚台部2的一側面上設有用來將清淨空氣導入各載置部6的空氣導入口6a。從上方流到棚台部2側邊的降流的一部份,從該空氣導入口6a流入各載置部6,如圖2箭號所示的形成清淨空氣流。An air introduction port 6a for introducing clean air into each of the mounting portions 6 is provided on one side surface of the shed portion 2. A portion of the downflow that flows from the upper side to the side of the shed portion 2 flows into the respective placing portions 6 from the air introduction port 6a, and forms a clean air flow as indicated by an arrow in Fig. 2 .
由於各載置部6的該軸旋轉驅動機構14設置在下游側,故驅動機構的塵埃不會流入各載置部6。更詳細說明之,該複數軸旋轉驅動機構14,被蓋部15所覆蓋,其下部設置朝下方延伸的排氣管16,該排氣管16連接框體外部的排氣裝置30(排氣機構)。Since the shaft rotation drive mechanism 14 of each of the mounting portions 6 is provided on the downstream side, dust of the drive mechanism does not flow into the respective placement portions 6. More specifically, the plurality of shaft rotation drive mechanisms 14 are covered by the cover portion 15, and the lower portion thereof is provided with an exhaust pipe 16 extending downward, and the exhaust pipe 16 is connected to the exhaust device 30 outside the frame body (exhaust mechanism) ).
亦即,藉由設置排氣裝置30,以其吸引力從該空氣導入口6a將清淨空氣導入各載置部6,在各載置部6強制形成單一方向的清淨空氣流。因此,清淨空氣在通過下游的軸旋轉驅動機構14之後,便不會逆流而必定會被排出到外部。In other words, by providing the exhaust device 30, the clean air is introduced into the respective mounting portions 6 from the air introduction port 6a by the suction force thereof, and the clean air flow in a single direction is forcibly formed in each of the mounting portions 6. Therefore, after the clean air is rotated by the downstream shaft to drive the mechanism 14, it does not flow backward and is necessarily discharged to the outside.
又,排氣裝置30宜設置成排氣輸出可以改變的構造,此時,便可對應例如供給到框體1內的降流狀態等因素,設定最適當的排氣輸出。Further, the exhaust device 30 is preferably provided in a structure in which the exhaust gas output can be changed. In this case, an optimum exhaust gas output can be set in accordance with factors such as a downflow state supplied to the casing 1.
又,如圖3、圖4所示的,非框體1之基板送入出面的框體1的左右兩側面,在各面的下部,以例如横向並排2個的方式設置用來將框體1內的蒙氣排出而能夠開閉的排氣窗40。Further, as shown in FIG. 3 and FIG. 4, the left and right side surfaces of the frame body 1 on which the substrate of the non-frame 1 is fed out and the surface are provided in the lower portion of each surface so as to be horizontally arranged, for example, to form the frame. The exhaust window 40 that can be opened and closed by the exhaust gas in 1 is exhausted.
各排氣窗40,分別設有複數開閉構件,例如以縱向並排的方式設置4片開閉板41a、41b、41c、41d,該等開閉板41a~41d可各自獨立開閉。Each of the exhaust windows 40 is provided with a plurality of opening and closing members. For example, four opening and closing plates 41a, 41b, 41c, and 41d are provided side by side in the longitudinal direction, and the opening and closing plates 41a to 41d can be independently opened and closed.
各開閉板41a~41d宜如圖5以示意方式所表示的分別由電動馬達等的開閉驅動機構42a、42b、42c、42d控制開閉動作,各驅動機構42a~42d由電腦所構成之控制部43(控制機構)驅動控制。Each of the opening and closing plates 41a to 41d is preferably controlled by an opening and closing drive mechanism 42a, 42b, 42c, 42d of an electric motor or the like as shown in Fig. 5, and each of the drive mechanisms 42a to 42d is constituted by a computer. (Control mechanism) drive control.
再者,如圖1、圖2所示的宜在框體1內,設置檢測框體1內之上部空間氣壓的氣壓感應器S1(氣壓檢測機構)與檢測下部空間氣壓的氣壓感應器S2(氣壓檢測機構),並根據該等檢測結果控制該排氣窗40的開口面積。Further, as shown in FIG. 1 and FIG. 2, it is preferable to provide a gas pressure sensor S1 (a gas pressure detecting mechanism) for detecting a space pressure in the upper portion of the housing 1 and a gas pressure sensor S2 for detecting a lower air pressure in the housing 1 ( The air pressure detecting mechanism) controls the opening area of the exhaust window 40 based on the detection results.
此時,例如,當各感應器S1、S2的檢測結果分別超過預先設定的既定壓力值時,或該感應器S1、S2之間的壓力差在既定壓力值以上時,控制部43便控制各開閉驅動機構42a~42d以決定排氣窗40的開口面積。At this time, for example, when the detection results of the sensors S1 and S2 respectively exceed a predetermined pressure value set in advance, or when the pressure difference between the sensors S1 and S2 is equal to or higher than a predetermined pressure value, the control unit 43 controls each. The drive mechanisms 42a to 42d are opened and closed to determine the opening area of the exhaust window 40.
在此,控制開閉板41a~41d的開閉,使框體1內的氣壓不會受到棚台部2升降移動的影響而經常在上部形成正壓,藉此對框體1內的下部空間的空氣流進行整流,抑制空氣發生捲起的情況。Here, the opening and closing of the opening and closing plates 41a to 41d is controlled so that the air pressure in the casing 1 is not affected by the lifting movement of the shed portion 2, and a positive pressure is often formed in the upper portion, whereby the air in the lower space in the casing 1 is formed. The flow is rectified to suppress the wind from rolling up.
此時,由於能夠有效抑制框體1在下部空間發生空氣捲起的情況,排氣窗40的各開閉板41a~41d宜例如從下方的開閉板41a依序打開,以複數階段的方式改變排氣窗40的開口面積。例如,圖5顯示僅打開開閉板41a的狀態,圖6(a)顯示打開開閉板41a、41b的狀態,圖6(b)顯示打開開閉板41a、41b、41c的狀態,圖6(c)顯示打開全部開閉板41a~41d的狀態。In this case, it is possible to effectively suppress the air-up of the casing 1 in the lower space, and it is preferable that the opening and closing plates 41a to 41d of the exhaust window 40 are sequentially opened from the lower opening and closing plates 41a, for example, and the rows are changed in a plurality of stages. The opening area of the louver 40. For example, FIG. 5 shows a state in which only the opening and closing plate 41a is opened, FIG. 6(a) shows a state in which the opening and closing plates 41a, 41b are opened, and FIG. 6(b) shows a state in which the opening and closing plates 41a, 41b, 41c are opened, and FIG. 6(c) The state in which all of the opening and closing plates 41a to 41d are opened is displayed.
又,在開閉板41a~41d的背面側設置篩網構件44,對排氣進行整流。Further, a screen member 44 is provided on the back side of the opening and closing plates 41a to 41d to rectify the exhaust gas.
又,宜根據該氣壓感應器S1、S2的檢測結果,由控制部43再控制該排氣裝置30的排氣輸出,此時,便能夠更進一步對框體1內的空氣流進行整流。Further, it is preferable that the control unit 43 further controls the exhaust gas output of the exhaust device 30 based on the detection results of the air pressure sensors S1 and S2. At this time, the air flow in the casing 1 can be further rectified.
又,如圖2所示的在棚台部2的側面設置整流板48(第一整流板),將上方的降流之中未流到載置部6的清淨空氣引導至該排氣窗40。Further, as shown in FIG. 2, a rectifying plate 48 (first rectifying plate) is provided on the side surface of the shed portion 2, and the clean air that has not flowed into the placing portion 6 among the upper descending flows is guided to the louver 40. .
又,流到棚台部2的下方的清淨空氣,除了從該排氣窗40排出之外,還會被吸入包圍升降機構3的殼體46內。亦即,該殼體46透過排氣管47連接該排氣裝置30,特別在棚台部2下降時(壓縮下方空間時)將僅靠排氣窗40無法完全排出的捲起空氣強制吸入,利用排氣裝置30排出到外部。藉由該構造,便能夠防止升降機構3產生的塵埃因為空氣捲起而流到棚台部2。Further, the clean air flowing down the shed portion 2 is sucked into the casing 46 surrounding the elevating mechanism 3 in addition to being discharged from the louver 40. That is, the casing 46 is connected to the exhaust device 30 through the exhaust pipe 47, and particularly when the shed portion 2 is lowered (when the lower space is compressed), only the rolled air that cannot be completely discharged by the vent window 40 is forcibly sucked. It is discharged to the outside by the exhaust device 30. With this configuration, it is possible to prevent the dust generated by the elevating mechanism 3 from flowing to the shed portion 2 due to the air being rolled up.
如上所述,若利用本發明之實施形態,藉由設置排氣裝置30,而在框體1內從棚台部2的側面將清淨空氣強制導入,使其朝單一方向流動排出。再者,在框體1的下部側面設置排氣窗40,其將未被吸入棚台部2內而流到棚台部2下方的清淨空氣有效率地排出,且其開口面積(排氣量)可隨意改變。As described above, according to the embodiment of the present invention, by providing the exhaust device 30, the clean air is forcibly introduced from the side surface of the shed portion 2 in the casing 1, and is discharged and discharged in a single direction. Further, an exhaust window 40 is provided on the lower side surface of the casing 1, and the clean air that has not been sucked into the shed portion 2 and flows under the shed portion 2 is efficiently discharged, and the opening area (discharge amount) ) can be changed at will.
藉由該等構造,在棚台部2內,清淨空氣通過軸旋轉驅動機構14之後,不會逆流,而必定會被排出到外部。With these configurations, in the shed portion 2, after the clean air passes through the shaft rotation driving mechanism 14, it does not flow backward, but is necessarily discharged to the outside.
又,在框體1內,讓上部空間相較於下部空間經常形成正壓,便能夠抑制下部空間產生氣流捲起的情況。尤其,對應棚台部2的升降移動而改變設置在該框體1下部側面之排氣窗40的開口面積,藉此便能夠在框體1內形成穩定的降流。Further, in the casing 1, the upper space is often formed with a positive pressure in comparison with the lower space, so that the airflow in the lower space can be suppressed from being rolled up. In particular, the opening area of the exhaust window 40 provided on the lower side surface of the casing 1 is changed in accordance with the lifting movement of the shed portion 2, whereby a stable downflow can be formed in the casing 1.
如是,便能夠抑制框體1內部產生空氣的逆流或捲起的情況,防止馬達等驅動系統所產生的塵埃流到棚台部2(載置部6)。In this case, it is possible to suppress the backflow or the winding of the air generated inside the casing 1 and prevent the dust generated by the drive system such as the motor from flowing to the shed portion 2 (the mounting portion 6).
又,在該實施形態中,設置檢測上部空間之氣壓的氣壓感應器S1以及檢測下部空間之氣壓的氣壓感應器S2作為檢測框體1內部氣壓的氣壓檢測機構,當其所檢測之氣壓值超過既定值時,或者,檢測結果的差值超過既定值時,便對排氣窗40的開閉板41a~41d實施開閉控制。然而,本發明並非以該等構造為限,亦可在框體1內的上部空間或下部空間的其中一方設置氣壓感應器作為氣壓檢測機構,並在所檢測到的氣壓值超過既定值時對排氣窗40的開閉板41a~41d實施開閉控制。Further, in this embodiment, the air pressure sensor S1 for detecting the air pressure in the upper space and the air pressure sensor S2 for detecting the air pressure in the lower space are provided as the air pressure detecting means for detecting the internal air pressure of the casing 1, and when the detected air pressure value exceeds When the predetermined value is used, or when the difference between the detection results exceeds a predetermined value, the opening and closing plates 41a to 41d of the exhaust window 40 are opened and closed. However, the present invention is not limited to the configuration, and a gas pressure sensor may be provided as one of the upper space or the lower space in the casing 1 as the air pressure detecting mechanism, and when the detected air pressure value exceeds a predetermined value, The opening and closing plates 41a to 41d of the exhaust window 40 are subjected to opening and closing control.
又,在該實施形態中,係根據氣壓感應器S1、S2的檢測結果,由控制部43對開閉板41a~41d實施開閉控制,更宜由控制部43控制排氣裝置30的排氣輸出。Further, in the embodiment, the control unit 43 controls the opening and closing plates 41a to 41d to open and close based on the detection results of the air pressure sensors S1 and S2, and it is preferable that the control unit 43 controls the exhaust gas output of the exhaust device 30.
然而,本發明並非以該等構造為限,亦可根據氣壓感應器S1、S2的檢測結果,由控制部43控制開閉板41a~41d的開閉與排氣裝置30的排氣輸出的至少其中任一方。However, the present invention is not limited to the above-described configurations, and the control unit 43 may control at least one of the opening and closing of the opening and closing plates 41a to 41d and the exhaust gas output of the exhaust device 30 based on the detection results of the air pressure sensors S1 and S2. One party.
又,在該實施形態中,係以應用於多段式的升降緩衝裝置的實施例表示本發明,惟本發明並非以該形態為限。例如,亦可不採用多段式而改採單一段的基板緩衝裝置,又,亦可不使用棚台部2的升降機構3,而應用於以機械臂等構件將複數基板送入送出的緩衝裝置。Further, in this embodiment, the present invention is shown in an embodiment applied to a multi-stage lifting cushion device, but the present invention is not limited to this embodiment. For example, a single-stage substrate buffering device may be used instead of the multi-stage type, or a lifting device 3 for feeding the plurality of substrates by a member such as a robot arm may be used without using the lifting mechanism 3 of the gantry portion 2.
1...框體1. . . framework
1a...基板送入口1a. . . Substrate feed
1b...基板送出口1b. . . Substrate delivery
2...棚台部2. . . Shed department
2a...基板送入口2a. . . Substrate feed
2b...基板送出口2b. . . Substrate delivery
3...升降機構3. . . Lifting mechanism
6...載置部6. . . Mounting department
6a...空氣導入口6a. . . Air inlet
13...輥子輸送軸13. . . Roller conveyor shaft
14...軸旋轉驅動機構14. . . Shaft rotary drive mechanism
15...蓋部15. . . Cover
16...排氣管16. . . exhaust pipe
20...殼體20. . . case
30...排氣裝置(排氣機構)30. . . Exhaust device
40...排氣窗40. . . Exhaust window
41a、41b、41c、41d...開閉板(開閉構件)41a, 41b, 41c, 41d. . . Opening and closing plate
42a、42b、42c、42d...開閉驅動機構42a, 42b, 42c, 42d. . . Opening and closing drive mechanism
43...控制部(控制機構)43. . . Control department
44...篩網構件44. . . Screen member
45...整流板(第二整流板)45. . . Rectifier plate (second rectification plate)
46...殼體46. . . case
47...排氣管47. . . exhaust pipe
48...整流板(第一整流板)48. . . Rectifier plate (first rectifying plate)
100...基板緩衝單元100. . . Substrate buffer unit
200...升降緩衝裝置200. . . Lifting buffer
201...框體201. . . framework
201a...基板送入口201a. . . Substrate feed
201b...基板送出口201b. . . Substrate delivery
202a~202f...基板載置部202a~202f. . . Substrate mounting unit
205...棚台部205. . . Shed department
206...升降機構206. . . Lifting mechanism
207...空間207. . . space
210...輔助輸送機構210. . . Auxiliary transport mechanism
250a...輸送機構250a. . . Transport mechanism
250b...輸送機構250b. . . Transport mechanism
S1...氣壓感應器(氣壓檢測機構)S1. . . Air pressure sensor (air pressure detection mechanism)
S2...氣壓感應器(氣壓檢測機構)S2. . . Air pressure sensor (air pressure detection mechanism)
G1~G5...玻璃基板(基板)G1~G5. . . Glass substrate (substrate)
A-A、B-B、C-C...剖面線A-A, B-B, C-C. . . Section line
X...軸X. . . axis
圖1係本發明之基板緩衝單元的側剖面圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side cross-sectional view showing a substrate buffer unit of the present invention.
圖2係沿圖1之A-A線段的端視圖。Figure 2 is an end view taken along line A-A of Figure 1.
圖3係沿圖2之B-B線段的端視圖。Figure 3 is an end view taken along line B-B of Figure 2.
圖4係沿圖2之C-C線段的端視圖。Figure 4 is an end view taken along line C-C of Figure 2.
圖5係方塊圖,用來說明圖1之基板緩衝單元所具備之排氣窗的開閉控制。Fig. 5 is a block diagram for explaining the opening and closing control of the exhaust window provided in the substrate buffer unit of Fig. 1.
圖6係排氣窗的開口面積的階段變化圖。Fig. 6 is a phase change diagram of the opening area of the exhaust window.
圖7係升降緩衝裝置的基板退避動作的說明圖。Fig. 7 is an explanatory diagram of a substrate retracting operation of the lifting cushion device.
圖8係表示習知升降緩衝裝置內部空氣流的剖面圖。Figure 8 is a cross-sectional view showing the flow of air inside the conventional lifting cushion device.
圖9係表示習知升降緩衝裝置內部的其他空氣流的剖面圖。Figure 9 is a cross-sectional view showing other air flows inside a conventional lifting cushion device.
1a...基板送入口1a. . . Substrate feed
2...棚台部2. . . Shed department
2a...基板送入口2a. . . Substrate feed
2b...基板送出口2b. . . Substrate delivery
3...升降機構3. . . Lifting mechanism
16...排氣管16. . . exhaust pipe
20...殼體20. . . case
30...排氣裝置(排氣機構)30. . . Exhaust device
44...篩網構件44. . . Screen member
45...整流板(第二整流板)45. . . Rectifier plate (second rectification plate)
46...殼體46. . . case
100...基板緩衝單元100. . . Substrate buffer unit
S1...氣壓感應器(氣壓檢測機構)S1. . . Air pressure sensor (air pressure detection mechanism)
S2...氣壓感應器(氣壓檢測機構)S2. . . Air pressure sensor (air pressure detection mechanism)
A-A...剖面線A-A. . . Section line
Claims (5)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009052945A JP4873506B2 (en) | 2009-03-06 | 2009-03-06 | Substrate buffer unit |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201033101A TW201033101A (en) | 2010-09-16 |
TWI401199B true TWI401199B (en) | 2013-07-11 |
Family
ID=42690293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW099105817A TWI401199B (en) | 2009-03-06 | 2010-03-01 | Substrate buffer unit |
Country Status (4)
Country | Link |
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JP (1) | JP4873506B2 (en) |
KR (1) | KR20100100682A (en) |
CN (1) | CN101826448B (en) |
TW (1) | TWI401199B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114999968A (en) * | 2015-11-27 | 2022-09-02 | 株式会社国际电气 | Substrate processing apparatus, substrate transfer system, method for manufacturing semiconductor device, and recording medium |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284426A (en) * | 2000-03-29 | 2001-10-12 | Nikon Corp | Wafer lifting apparatus |
JP2003190894A (en) * | 2001-12-26 | 2003-07-08 | Clean Transport Matrix:Kk | Method and structure for preventing contamination caused by particle |
JP2007250671A (en) * | 2006-03-14 | 2007-09-27 | Tokyo Electron Ltd | Substrate buffer device, substrate buffering method, substrate processor, control program, and computer readable storage medium |
TW200900617A (en) * | 2007-03-19 | 2009-01-01 | Tokyo Electron Ltd | On-off valve and process apparatus employing the on-off valve |
-
2009
- 2009-03-06 JP JP2009052945A patent/JP4873506B2/en not_active Expired - Fee Related
-
2010
- 2010-02-25 CN CN201010123013XA patent/CN101826448B/en not_active Expired - Fee Related
- 2010-03-01 TW TW099105817A patent/TWI401199B/en not_active IP Right Cessation
- 2010-03-05 KR KR1020100019630A patent/KR20100100682A/en not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284426A (en) * | 2000-03-29 | 2001-10-12 | Nikon Corp | Wafer lifting apparatus |
JP2003190894A (en) * | 2001-12-26 | 2003-07-08 | Clean Transport Matrix:Kk | Method and structure for preventing contamination caused by particle |
JP2007250671A (en) * | 2006-03-14 | 2007-09-27 | Tokyo Electron Ltd | Substrate buffer device, substrate buffering method, substrate processor, control program, and computer readable storage medium |
TW200900617A (en) * | 2007-03-19 | 2009-01-01 | Tokyo Electron Ltd | On-off valve and process apparatus employing the on-off valve |
Also Published As
Publication number | Publication date |
---|---|
KR20100100682A (en) | 2010-09-15 |
TW201033101A (en) | 2010-09-16 |
JP2010206123A (en) | 2010-09-16 |
CN101826448B (en) | 2012-05-30 |
JP4873506B2 (en) | 2012-02-08 |
CN101826448A (en) | 2010-09-08 |
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