TWI399673B - Touch panel and method of manufacturing the same - Google Patents

Description

Touch panel and method of manufacturing same

The present invention relates to a touch panel and a method of fabricating the same, and more particularly to a capacitive touch panel and a method of fabricating the same.

In order to enhance the convenience of modern people, the human interface has become more and more in our daily life. Touch panels have become popular with a variety of business, entertainment, information and other applications, such as cash machines, laptops, mobile phones, and navigation systems. Wait. At present, touch panels are roughly classified into four types according to the difference in technical principles: resistive, capacitive, ultrasonic, and optical touch panels.

Among them, the principle of the capacitive touch panel is capacitive sensing by touching a finger or other conductive body, so the touch sensing performance is very good. Recently, the development of the Apple iPhone product has further driven the trend of capacitive touch panels, and is applied to small high-priced consumer electronic products.

FIG. 1 illustrates a simplified process of a known capacitive touch panel. Referring to FIG. 1, first, a plain glass feed (step s101) is provided as a substrate for depositing other conductive materials; a coating method (for example, sputtering method), and a lithography and etching method are used for the substrate. A registration mark is formed on the edge area (step s102). Then, in order to form a plurality of unit touch panels on the substrate, an ITO (indium tin oxide) layer may be formed thereon by a coating method, for example, by sputtering (step s103); And etching the ITO layer to form an ITO vertical electrode (step s104); forming a dielectric layer as an insulating layer thereon by a coating method (step s105); forming an ITO layer thereon by a coating method (step s106) The ITO layer is formed by lithography and etching to form an ITO lateral electrode (step s107); a metal layer is formed thereon by a coating method (step s108); and the metal layer is formed into a metal trace by lithography and etching. a pattern (step s109); forming a protective layer by a coating method (step s110), the material of which may be tantalum nitride (SiNx), yttrium oxynitride (SiNxOy), yttrium oxide (SiOx) or acrylic resin (Acrylic resin); The opening is formed by lithography and etching (step s111), and the metal trace is exposed to provide an electrical connection for signal transmission; then the structures form a capacitive touch panel for discharging (step s112).

Therefore, the capacitance structure formed by the ITO vertical electrode, the insulating layer, and the ITO lateral electrode can accurately calculate the position of the X-axis and the Y-axis for the current change caused by the contact of the external conductor (for example, a finger); Metal traces are used for signal conduction. Therefore, the ITO electrode and the metal trace must be connected by the above steps s106 to s109.

However, in order to form a precise ITO electrode and a metal trace, in the touch panel process, multiple masks are required to define precise electrodes and traces. For example, please refer to FIG. 2 , which is a schematic diagram of a reticle in a conventional capacitive touch panel process, mainly showing a reticle design for a unit touch panel. As shown in FIG. 2, the conventional touch panel process must define a precise complex electrode pattern p1 (refer to FIG. 2(a)) and a mask m2 to define a precise complex trace pattern p2 using the mask m1, respectively. Refer to Figure 2 (b)). Therefore, in the above known processes, at least four masks including a registration mark, a longitudinal electrode, a lateral electrode, and a metal trace are required, and a mask defining a protective layer opening may be further required. In addition, in order to achieve the purpose of accurately connecting the ITO electrode and the metal trace, a highly accurate machine is required in the process, so that the alignment mark on the mask and the substrate can achieve precise alignment. Therefore, the cost of this process is very high, but the resolution and alignment are still limited.

In view of the above-mentioned problems, the inventors of the above-mentioned prior art have a high requirement for alignment accuracy, and it is necessary to produce a mask with a complicated pattern and use a device with high precision, which is costly and the like, and is carefully tested. With the research and the spirit of perseverance, I finally conceived the "touch panel and its manufacturing method", which not only overcomes the above problems, but also achieves good touch sensing performance. The following is a brief description of the case.

In view of the problems of the prior art regarding the accuracy of the alignment, the inventors have repeatedly thought about the touch panel of the present invention and a method of manufacturing the same. The method for manufacturing the touch panel of the present invention mainly utilizes simultaneously patterning the transparent conductive layer and the metal layer, and then removing the pattern of the transparent conductive layer in the metal layer to achieve the self-alignment effect in the patterning process to increase transparency. The alignment accuracy of the conductive layer pattern and the metal layer pattern. Therefore, the manufacturing method of the present invention can sufficiently reduce the cost and the cost of achieving alignment accuracy, and can achieve superior alignment accuracy and pattern resolution. Therefore, the touch panel of the present invention still has quite good touch sensing performance.

A first idea of the present invention is to provide a method of manufacturing a touch panel. The manufacturing method includes the following steps: forming a transparent conductive layer to form a metal layer on the transparent conductive layer, and simultaneously patterning the transparent conductive layer and the metal layer, each layer separately generating a first pattern and a second pattern (the second pattern is attached to the outer edge of the first pattern) and the first pattern of the metal layer is removed.

Preferably, the method provided by the present invention, wherein the transparent conductive layer is formed on a substrate.

Preferably, the method provided by the present invention, wherein the first pattern is a pattern of a plurality of electrodes, and the second pattern is a pattern of a plurality of traces. In the patterns, one end of the plurality of traces is connected to the signal output of the plurality of electrodes.

Preferably, the method provided by the present invention utilizes lithography and etching to simultaneously pattern the transparent conductive layer and the metal layer. The lithography method displays the patterns on the transparent conductive layer and the metal layer, and the patterns are defined by a mask; further, the etching removes the transparent conductive layer and the metal layer is not displayed. The area of the pattern.

Preferably, the method provided by the present invention, wherein the process of simultaneously patterning the transparent conductive layer and the metal layer by using lithography and etching comprises the steps of: coating a layer of photosensitive material on the metal layer, Exposure is performed using the mask defining the patterns to develop on the photosensitive material layer, etching the transparent conductive layer and the metal layer according to the developed photosensitive material layer, and removing the developed photosensitive material layer.

Preferably, the method provided by the present invention applies a positive photoresist layer as the photosensitive material layer to the metal layer, and the photomask utilizes a light shielding portion to define the patterns.

Preferably, the method provided by the present invention applies a negative photoresist layer as the photosensitive material layer to the metal layer, and the photomask utilizes a light transmitting portion to define the patterns.

Preferably, the method provided by the present invention utilizes one of lithography and screen printing and a selective etching method to remove the first pattern of the metal layer. Wherein, one of the lithography method and the screen printing method displays a reserved area on the metal layer, the reserved area not including the distribution range of the first pattern portion but at least including the distribution range of the second pattern portion; The selective etching removes portions of the metal layer that do not exhibit the retention region.

Preferably, the method of the present invention, wherein the lithography and selective etching to remove the first pattern portion of the metal layer comprises the steps of: coating a layer of photosensitive material on the metal layer Exposing is performed using a photomask defining the retention area, and development is performed on the photosensitive material layer, the metal layer is selectively etched according to the developed photosensitive material layer, and the developed photosensitive material layer is removed.

Preferably, the method provided by the present invention applies a positive photoresist layer as the photosensitive material layer to the metal layer, and the photomask utilizes a light shielding portion to define the region.

Preferably, the method provided by the present invention applies a negative photoresist layer as the photosensitive material layer to the metal layer, and the photomask utilizes a light transmitting portion to define the region.

Preferably, the method provided by the present invention, wherein the step of removing the first pattern of the metal layer by screen printing and selective etching comprises the steps of: coating an anti-etching material layer by screen printing; On the metal layer, the anti-etching material layer is covered in the remaining region of the metal layer, the uncovered metal layer is selectively etched, and the anti-etching material layer is removed.

A second concept of the present invention is to provide a method of manufacturing a touch panel. The manufacturing method includes the steps of: providing a substrate, forming at least a pair of alignment marks on an edge region of the substrate, forming a first transparent conductive layer on the substrate, and patterning the first transparent conductive layer to Generating a plurality of electrodes arranged along a first direction to form a dielectric layer on the plurality of electrodes to form a second transparent conductive layer on the dielectric layer to form a metal layer on the second transparent conductive layer. Simultaneously patterning the second transparent conductive layer and the metal layer such that the layers each have a pattern of a plurality of electrodes arranged in a second direction and a pattern of a plurality of traces (one end of each of the traces) Connected to the signal output of the plurality of electrodes arranged in the second direction, and the pattern of the plurality of electrodes removed from the metal layer.

Preferably, the method provided by the present invention, wherein the alignment mark is formed by lithography and etching, and the pattern of the alignment mark is defined by a mask.

Preferably, the method provided by the present invention, wherein the first transparent conductive layer is patterned by lithography and etching to generate the plurality of electrodes arranged along the first direction, and defined by a mask The pattern of the plurality of electrodes.

Preferably, the method provided by the present invention, wherein the second transparent conductive layer and the metal layer are simultaneously patterned by lithography and etching, and defined by a mask as a plurality of electrodes arranged along the second direction The pattern and the pattern of the plurality of traces.

Preferably, the method provided by the present invention removes the pattern of the plurality of electrodes of the metal layer by lithography and etching, and displays a reserved area on the metal layer by the lithography method. The reserved area does not include the distribution range of the pattern of the plurality of electrodes but at least includes the distribution range of the pattern of the plurality of traces, the etching removing portions of the metal layer that do not show the reserved area.

Preferably, the method provided by the present invention removes the pattern of the plurality of electrodes of the metal layer by screen printing and etching, the screen printing method displaying a reserved area on the metal layer, the retention The region does not include a distribution range of the pattern of the plurality of electrodes arranged in the second direction but at least includes a distribution range of the pattern of the plurality of traces, the etching removing portions of the metal layer not showing the reserved region Share.

Preferably, the method provided by the present invention further comprises: forming a protective layer on the patterned second transparent conductive layer and the metal layer.

Preferably, the method provided by the present invention, wherein the protective layer is patterned by lithography and etching, and an opening is defined by a mask, the opening exposing the metal traces.

A third aspect of the present invention provides a method of manufacturing a touch panel. The manufacturing method includes the steps of: providing a substrate, forming a first transparent conductive layer on the substrate, forming a metal layer on the first transparent conductive layer, and patterning the first transparent conductive layer and the metal layer Forming a pattern of a plurality of electrodes arranged in a first direction, a pattern of a plurality of traces, and at least one pair of bit marks, removing the pattern of the plurality of electrodes of the metal layer to form a pattern Forming a second transparent conductive layer on the dielectric layer on the patterned first transparent conductive layer and the metal layer, and patterning the second transparent conductive layer to generate a second direction Arranged multiple electrodes. The signal outputs of the plurality of electrodes arranged in the first or second direction are respectively connected to one ends of the traces.

Preferably, the method provided by the present invention, wherein the first transparent conductive layer and the metal layer are simultaneously patterned by lithography and etching, and defined by a mask as a plurality of electrodes arranged along the first direction The pattern, the pattern of the plurality of traces, and the alignment mark.

Preferably, the method provided by the present invention removes the pattern of the plurality of electrodes of the metal layer by lithography and etching, and displays a reserved area on the metal layer by the lithography method. The retention region does not include a distribution range of the pattern along the plurality of electrodes but at least includes a distribution range of the pattern in the plurality of traces, the etching removing portions of the metal layer that do not exhibit the retention region.

Preferably, the method provided by the present invention removes the pattern of the plurality of electrodes of the metal layer by screen printing and etching, the screen printing method displaying a reserved area on the metal layer, the retention The region does not include a distribution range of the pattern of the plurality of electrodes arranged in the second direction but at least includes a distribution range of the pattern of the plurality of traces, the etching removing portions of the metal layer not showing the reserved region Share.

Preferably, the method provided by the present invention, wherein the second transparent conductive layer is patterned by lithography and etching, and the pattern of the plurality of electrodes arranged in the second direction is defined by a mask.

Preferably, the method provided by the present invention further comprises: forming a protective layer on the patterned second transparent conductive layer.

Preferably, the method provided by the present invention, wherein the protective layer is patterned by lithography and etching, and an opening is defined by a mask, the opening exposing the metal traces.

A fourth aspect of the present invention is to provide a touch panel. The touch panel comprises: a transparent conductive area and a metal area. The transparent conductive region presents a first pattern and a second pattern, and the second pattern is connected to an outer edge of the first pattern. The metal zone presents the second pattern. The transparent conductive layer is a patterned transparent conductive layer, and the transparent conductive layer is simultaneously patterned with a metal layer on one side of the transparent conductive layer to present the first pattern and the second pattern. The metal region is formed by removing the first pattern of the patterned metal layer.

Preferably, the panel provided by the present invention, wherein the material of the transparent conductive layer is mainly composed of indium tin oxide.

Preferably, the panel provided by the present invention further comprises a substrate located on the other side of the transparent conductive layer.

Preferably, the panel provided by the present invention, wherein the material of the substrate is mainly composed of glass or quartz.

Preferably, the panel provided by the present invention, wherein the first pattern is a pattern of a plurality of electrodes, the electrodes are all arranged in a first direction, and the second pattern is a pattern of a plurality of traces, and the plurality of patterns are taken One end of the line is connected to the signal output of the plurality of electrodes.

Other objects and advantages of the invention as set forth in the present disclosure will become apparent to those skilled in the art.

The present invention will be fully understood by the following examples, so that those skilled in the art can do so. However, the implementation of the present invention may not be limited by the following embodiments.

As used herein, the term "patterning" means that the process of forming a particular pattern of a particular material layer during the manufacture of the touch panel preferably refers to the process of patterning a particular layer of material using lithography and etching.

As used herein, the term "definition" means the use of a reticle to determine a particular pattern during lithography. Taking the yellow light process (refer to the following) as an example, if the photomask is defined by the light shielding portion, the positive photoresist should be used as the photosensitive material; if the photomask is defined by the light transmitting portion, the negative photoresist should be used as the photosensitive material. .

As used herein, the term "yellow light process" generally refers to the process of photolithography and etching in a yellow room. When exposed to ultraviolet light through a reticle, the source of the light is typically a mercury lamp that is filtered by I-line (365 nm), H-line (405 nm), and G-line (436 nm). After exposure, the pattern defined by the reticle is displayed on the transparent conductive layer or metal layer. Then, development can be performed on the photosensitive material layer.

In the case of a positive photoresist, the developed photosensitive material layer exhibits the above pattern, and the developed transparent conductive layer or metal layer not covered by the developed photosensitive material layer can be removed by etching. Then, the developed photosensitive material layer is removed, and the transparent conductive layer or the metal layer exhibits the above pattern.

In short, in order to manufacture the touch panel of the present invention, a transparent conductive layer and a metal layer are first formed, and the transparent conductive layer and the metal layer are patterned, and then the metal layer is removed from the transparent conductive layer. Pattern part.

First, please refer to FIG. 3, which is a schematic diagram of a unit touch panel configuration for completing the process of the capacitive touch panel of the present invention. In the industry, when the capacitive touch panel process of the present invention is completed, in addition to the alignment mark AM on the substrate 1, the completed plurality of touch panel cells are disposed on the substrate, and the unit touch panels are The cells are individually cut into individual touch panels.

Please refer to FIG. 4(a) and (b), which are schematic diagrams of a preferred embodiment of the photomask in the process of the capacitive touch panel of the present invention, and mainly show the mask design for the unit capacitive touch panel. Wherein, the mask P1 of the plurality of electrodes and the plurality of traces are simultaneously defined by the mask M1 shown in FIG. 4(a) for simultaneously patterning the transparent conductive layer and the metal layer. Next, the design of the mask M2 can be greatly simplified by using another mask M2 as shown in FIG. 4(b) for defining a pattern portion (reserved region P2) which is not exclusively for the transparent conductive layer.

For a detailed procedure of a preferred embodiment of the present invention, please refer to the following embodiments.

First embodiment

Fig. 5 is a flow chart showing the process of the capacitive touch panel of the first embodiment of the present invention; and Figs. 6(a) to (d) are partial structural views showing the process of the first embodiment of the present invention. The process has the following steps:

Step S101: First, a monolithic glass material having a low cost but good light transmittance can be used as the substrate 1 for forming another conductive material (refer to FIG. 6(b)).

Step S102: A registration mark AM is formed on an edge region of the substrate 1 by a coating method such as sputtering, and lithography and etching (refer to FIG. 6(a)).

Step S103: In order to form a plurality of unit touch panels on the substrate 1, an ITO (indium tin oxide) layer (first transparent conductive layer) may be formed thereon by a coating method, for example, by sputtering. 2).

Step S104: The ITO layer (first transparent conductive layer 2) is formed into a ITO vertical electrode by lithography and etching (refer to FIG. 6(b)).

Step S105: forming a dielectric layer as an insulating layer thereon by a coating method.

Step S106: Another ITO layer (second transparent conductive layer) is formed thereon by a coating method.

Step S107: A metal layer 3 is formed thereon by a coating method such as sputtering.

Step S108: simultaneously patterning the ITO layer (second transparent conductive layer) and the metal layer 3 by lithography and etching to form a pattern of a plurality of lateral electrodes and a plurality of traces ((refer to FIG. 6(c))).

Step S109: selectively removing the lateral electrode pattern of the metal layer by lithography and etching to leave the metal trace 4 (refer to FIG. 6(d)).

Step S110: A protective layer (the material may be tantalum nitride, hafnium oxynitride, cerium oxide or acrylic resin, etc.) may be further formed by a coating method as needed for the process.

Step S111: using the lithography and etching method to form the opening of the protective layer, so that the output of the metal trace is exposed, thereby providing an electrical connection for the signal to be sent.

Step S112: The formed capacitive touch panels of each unit can be discharged by further processing (for example, dividing each unit).

With regard to the preferred process of the first embodiment of the present invention, please refer to FIG. 7(a) to (j), which are schematic cross-sectional views showing the structure of the panel of the unit (d) of FIG. 6 in the first embodiment of the present invention. Taking the exposure and development by a positive photoresist as an example, the section line section is represented by A-A'.

First, glass or quartz can be used as a substrate 1. The alignment mark AM can be formed on the edge region of the substrate 1 (see Fig. 6(a)), and used for the upper and lower alignment in the process. A transparent conductive material may be deposited on the plane of the substrate 1 by sputtering to form a transparent conductive layer as a first transparent conductive layer 2 (as shown in Fig. 7(a)). Indium tin oxide (ITO) has the characteristics of high transparency, good electrical conductivity, and low surface resistance, and is generally used as a material for the transparent conductive layer.

The first transparent conductive layer 2 can be formed into a plurality of electrodes arranged in a first direction by a yellow light process. For example, a longitudinal electrode is formed by first coating a photosensitive material (for example, a positive photoresist) layer on the first transparent conductive layer 2, and exposing the photomask defining the longitudinal electrode patterns to expose the photosensitive material layer 4. Developing (as shown in FIG. 7(b)), and etching and removing the photosensitive material layer according to the development (as shown in FIG. 7(c)), patterning the first transparent conductive layer 2 A longitudinal electrode is formed.

On the first transparent conductive layer 2, a dielectric layer 5 can be applied as an insulating layer by sputtering (as shown in Fig. 7(d)). Then, on the dielectric layer 5, another transparent conductive layer can be applied as a second transparent conductive layer 2a by sputtering, and then a metal material (for example, aluminum having good conductivity and ductility) is deposited thereon. The metal layer 3 is formed. In order to simultaneously pattern the second transparent conductive layer 2a and the metal layer 3, a lithography and etching method may be employed to form a precise conductive pattern in the yellow light process.

Preferably, the pattern to be formed by the second transparent conductive layer 2a is first defined by a mask into a first pattern (for example, a pattern of a plurality of lateral electrodes) and a second pattern (for example, a plurality of metal traces). a pattern), and the second pattern is attached to an outer edge of the first pattern. Specifically, the reticle may define a pattern of a plurality of electrodes and a plurality of traces, wherein the plurality of electrodes may be arranged in a second direction, and one ends of the plurality of traces are respectively connected to the signal outputs of the electrodes.

For example, a metal trace for forming a lateral electrode and a connection thereof may be first coated with a photosensitive material layer 4a, and exposed by a mask M1 defining the lateral electrodes and the metal trace pattern P1 (refer to FIG. 4 (a) )), and the photosensitive material layer 4a is developed (as shown in Fig. 7(e)). The developed photosensitive material layer 4a exhibits the above-described pattern, and the developed photosensitive material layer 4a covers the second transparent conductive layer 2a and the metal layer 3 (as shown in Fig. 7(f)). Then, the developed photosensitive material layer 4a is removed (as shown in FIG. 7(g)), and the second transparent conductive layer 2a and the metal layer 3 both exhibit the lateral electrode and the metal wiring pattern P1.

Since the metal layer 3 has both the first pattern and the second pattern after the above process, in order to remove the first pattern exclusive to the second transparent conductive layer 2a, lithography or screen printing and selection may be utilized. The first pattern of the metal layer 3 is removed by an etch to produce a metal layer 3 exhibiting the second pattern.

Preferably, in the lithography process, a mask M2 can be used to define a reserved area P2 to retain the second pattern of the metal layer 3 (refer to FIG. 4(b)). The reserved area P2 does not include the distribution range of the first pattern portion, but at least includes the distribution range of the second pattern portion. Specifically, a photosensitive material layer 6 may be coated on the metal layer 3, exposed by the mask M2, and developed on the photosensitive material layer 6 (as shown in FIG. 7(h)), according to the developed The photosensitive material layer 6 selectively etches a portion of the metal layer 3 where the remaining region P2 is not displayed (as shown in Fig. 7(i)). Preferably, the selective etching is used to remove the portion of the pattern in which the metal layer 3 exhibits a plurality of lateral electrodes. Then, the developed photosensitive material layer 6 is removed (as shown in Fig. 7(j)). Therefore, through the above process, the selectively etched metal layer 3 does not have the first pattern, but at least includes the second pattern. Therefore, the metal layer 3 can accurately display the precise second pattern, but only needs to use a simplification mask which is much simpler than the prior art, which can save the manufacturing cost of the reticle and solve the problem of alignment accuracy.

Since the above-mentioned reserved area P2 can be a very simplified figure, there is no problem of high alignment accuracy and high resolution requirement, and the reserved area P2 can also be determined by a screen printing method (not shown). Specifically, an anti-etching material (for example, an anti-etching ink) may be applied by screen printing to form an anti-etching material layer on the metal layer, and the anti-etching material layer covers only the reserved area of the metal layer. Selectively etching the metal layer that is not covered by the layer of anti-etching material and then removing the layer of anti-etching material leaves the second pattern. Therefore, this process can also significantly save the cost of manufacturing the reticle while still producing a precise metal pattern.

The capacitive touch panel obtained by the process of the first embodiment can respectively be arranged in a first direction and a second direction, and the first direction and the second direction can be perpendicular to each other. The relationship can be used to sense the touch position of the X-axis and the Y-axis. For example, the plurality of electrodes of the first layer can be longitudinal electrodes and the electrodes of the second layer can be lateral electrodes. In addition, the plurality of traces can be accurately connected to the signal outputs of the plurality of lateral electrodes to reduce the trace impedance of the lateral electrodes to the edge regions of the panel.

Second embodiment

Fig. 8 is a flow chart showing the process of the capacitive touch panel of the second embodiment of the present invention; and Figs. 9(a) to (c) are partial structural views showing the process of the second embodiment of the present invention. The process has the following steps:

Step S201: First, a single glass feed can be utilized as the substrate 1 for forming other conductive materials.

Step S202: forming an ITO layer (first transparent conductive layer 2) on the substrate by coating, for example, sputtering.

Step S203: forming a metal layer 3 thereon by a coating method.

Step S204: simultaneously patterning the ITO layer (first transparent conductive layer 2) and the metal layer 3 by using lithography and etching to simultaneously generate patterns of ITO lateral electrodes, metal patterns, and at least one alignment mark AM (please Refer to Figure 9 (a)).

Step S205: selectively removing the lateral electrode pattern of the metal layer 3 by lithography and etching to leave the metal trace 4 (refer to FIG. 9(b)).

Step S206: forming a dielectric layer as an insulating layer thereon by a coating method.

Step S207: Another ITO layer (second transparent conductive layer 2a) is formed thereon by a coating method.

Step S208: patterning the ITO layer (second transparent conductive layer 2a) by lithography and etching to form a plurality of vertical electrodes (refer to Fig. 9(c)).

Step S209: A protective layer (the material of which is the same as described above) may be further formed by a coating method as needed for the process.

Step S210: using the lithography and etching method to form the opening of the protective layer, so that the output of the metal trace is exposed, thereby providing an electrical connection for the signal to be sent.

Step S211: The formed capacitive touch panels of each unit can be discharged by further processing.

With regard to the preferred process of the second embodiment of the present invention, please refer to FIG. 10(a) to (l), which are schematic cross-sectional views showing the panel of the unit (c) of FIG. 9 in the second embodiment of the present invention. For example, the positive photoresist is exposed and developed, and the section line is represented by A-A'.

First, glass or quartz can be used as a substrate 1. A transparent conductive material (preferably indium tin oxide) can be deposited on the substrate plane by sputtering to form a transparent conductive layer as a first transparent conductive layer 2. Then, a metal material (for example, aluminum) is deposited thereon to form a metal layer 3 (as shown in Fig. 10(a)).

In order to form a plurality of electrodes arranged in a first direction, metal traces connected thereto, and alignment marks, the first transparent conductive layer 2 and the metal layer 3 may be simultaneously patterned by a yellow light process, for example, the first The plurality of electrodes arranged in the direction are lateral electrodes. In the yellow light process, the same mask can define the lateral electrodes, the metal traces and the pattern of at least one alignment mark for exposure, and a photosensitive material layer 4 can be disposed thereon. The first transparent conductive layer 2 and the metal layer 3 are developed (as shown in FIG. 10(b)), and the photosensitive material layer is removed after etching according to the development pattern (as shown in FIG. 10(c)). 4 (As shown in FIG. 10(d)), the first transparent conductive layer 2 and the metal layer 3 each have a pattern of the lateral electrodes, the metal traces and at least one alignment mark. In this process, the alignment mark can be formed without using another mask that defines the alignment mark.

In order to remove the pattern of the first transparent conductive layer 2 in the metal layer 3, the lithography method or the screen printing method and the selective etching method may be used to remove at least the pattern portion of the metal layer 3 from the plurality of electrodes. To leave a pattern of multiple metal traces.

Preferably, as described in the first embodiment, in the lithography process, a mask M2 can be used to define a reserved area P2 (refer to FIG. 4(b)). The reserved area P2 does not include the distribution range of the plurality of lateral electrode patterns, but at least includes the distribution range of the metal trace patterns. Specifically, a photosensitive material layer 6 may be coated, exposed by the mask M2, and developed on the photosensitive material layer 6 (as shown in FIG. 10(e)), according to the developed photosensitive material layer 6 The portion of the metal layer 3 that does not show the reserved region P2 is selectively etched (as shown in Fig. 10(f)). Preferably, the selective etching is used to remove the portion of the pattern in which the metal layer 3 exhibits a plurality of lateral electrodes. Then, the developed photosensitive material layer 6 is removed (as shown in Fig. 10(g)). Therefore, through the above process, the selectively etched metal layer 3 does not have the pattern of the plurality of lateral electrodes, but at least includes the pattern of the plurality of traces. Therefore, the metal layer 3 can form a precise plurality of metal traces, but only need to use a simplification of the reticle by the prior art, which can save the manufacturing cost of the reticle and solve the problem of high alignment accuracy and high resolution. problem.

As described in the first embodiment, the reserved area P2 can also be determined by screen printing, which can significantly save the cost of manufacturing the photomask, and still produce a precise metal wiring pattern.

Next, a dielectric layer 5 can be applied as an insulating layer by sputtering (as shown in Fig. 10(h)). Then, on the dielectric layer 5, another transparent conductive layer may be coated by sputtering as a second transparent conductive layer 2a (as shown in FIG. 10(i)) to form a second direction. electrode. For example, a photosensitive material layer 7 is first coated on the second transparent conductive layer 2a, and a photomask defining the longitudinal electrode patterns is exposed to expose the photosensitive material layer 7 (for example, Figure 10 (j)), and after etching according to the development (as shown in Fig. 10 (k)) and removing the photosensitive material layer (as shown in Fig. 10 (l)), patterning the The second transparent conductive layer 2a is formed to form a longitudinal electrode.

In summary, the capacitive touch panel manufactured by the process of the second embodiment can be fabricated by collectively patterning the transparent conductive layer 2 and the metal layer 3 when forming the underlying panel structure. The pattern of the plurality of electrodes, the plurality of metal traces and the alignment mark AM arranged in one direction can greatly save the time and cost of separately preparing the alignment mark AM. In addition, as described in the first embodiment, the metal layer 2 is selectively etched by using a simplified mask or a screen printing method to preserve the metal trace, and the cost of manufacturing the metal trace can be saved and accurate. Self-alignment effect.

Therefore, the capacitive touch panel produced by the manufacturing method of the present invention comprises at least: a transparent conductive region (presenting a first pattern and a second pattern, the second pattern being connected to the outer edge of the first pattern) And a metal region (presenting the second pattern). The transparent conductive layer is a patterned transparent conductive layer, and the transparent conductive layer is simultaneously patterned with a metal layer on one side of the transparent conductive layer to present the first pattern and the second pattern. The metal region is formed by removing the first pattern of the patterned metal layer. Preferably, the panel further comprises a substrate on the other side of the transparent conductive layer.

At present, small consumer electronic products (such as mobile phones) are widely used in the market, and the capacitive touch panel often uses two layers of ITO electrodes (capacitive touch structures respectively as lateral electrodes and vertical electrodes) and a plurality of metal traces ( Connected to one of the ITO electrodes as a signal conducting structure). Since small electronic products such as mobile phones use an upright touch screen, these metal traces are usually connected to the lateral ITO electrodes to reduce the impedance of the edge regions.

The manufacturing method of the touch panel of the present invention can also be used for manufacturing a touch panel having a double transparent conductive layer and a metal layer structure for application to a particularly high performance capacitive touch panel, such as a projection type used by the Apple iPhone. Capacitive touch panel, large capacitive touch panel or dual-sided (DITO type) capacitive touch panel. Specifically, in addition to a metal trace connected to the lateral electrode, a process of simultaneously patterning the transparent conductive layer and the metal layer may be utilized, so that another metal trace is connected to the vertical electrode, and the vertical electrode may also be lowered. The impedance of the edge region.

In summary, the touch panel of the present invention and the method of manufacturing the same have at least the following features:

1. The manufacturing method of the touch panel of the present invention can achieve the self-alignment effect in the patterning process, and can obtain a transparent electrode pattern and a metal trace with high resolution, without using a machine with a particularly high precision.

2. The method of manufacturing the touch panel of the present invention may also perform a lithography method using a simplified mask or a lower-cost screen printing method to determine a non-etched region before performing the selective etching of the metal layer. The alignment mark is produced in this part of the process, so that the cost in the conventional process can be greatly saved.

3. Although the cost of the touch panel of the present invention is low, it still has precise transparent electrodes and trace distribution, and still has quite good touch sensing performance, so it can be more widely used in various electronic or information products.

According to the above conclusion, the present invention is an industrially practical, novel and progressive invention, and has profound development value. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. That is to say, the equivalent changes and modifications made by the applicant in accordance with the scope of the patent application of the present invention should still fall within the scope of the patent of the present invention. I would like to ask your review committee to give a clear explanation and pray for it.

Figure 1

S101, s102, s103, s104, s105, s106, s107, s108, s109, s110, s111, s112. . . step

Figure 2 (a), (b)

M1, m2. . . Mask

P1. . . Complex electrode pattern

P2. . . Complex trace pattern

Figure 3

1. . . Substrate

AM. . . Alignment mark

Cell. . . Unit touch panel

Figure 4 (a), (b)

M1, M2. . . Mask

P1. . . Complex electrode and pattern of complex traces

P2. . . Reserved area

Figure 5

S101, S102, S103, S104, S105, S106, S107, S108, S109, S110, S111, S112. . . step

Figure 6 (a) to (d)

1. . . Substrate

2. . . First transparent conductive layer

3. . . Metal layer

4. . . Metal trace

A-A’. . . Section line segment

AM. . . Alignment mark

Figure 7 (a) to (j)

A-A’. . . Section line segment

1. . . Substrate

2. . . First transparent conductive layer

2a. . . Second transparent conductive layer

3. . . Metal layer

4. . . Photosensitive material layer

4a. . . Photosensitive material layer

5. . . Dielectric layer

6. . . Photosensitive material layer

Figure 8

S201, S202, S203, S204, S205, S206, S207, S208, S209, S210, S211. . . step

Figure 9

1. . . Substrate

2. . . First transparent conductive layer

3. . . Metal layer

4. . . Metal trace

A-A’. . . Section line segment

Figure 10

1. . . Substrate

2. . . First transparent conductive layer

2a. . . Second transparent conductive layer

3. . . Metal layer

4. . . Photosensitive material layer

5. . . Dielectric layer

6. . . Photosensitive material layer

7. . . Photosensitive material layer

Figure 1: Flow chart of a conventional capacitive touch panel process.

Fig. 2 (a) and (b): Schematic diagram of a mask in a conventional capacitive touch panel process.

FIG. 3 is a schematic diagram showing the configuration of a unit touch panel for completing the process of the capacitive touch panel of the present invention.

4(a) and (b) are schematic views of a preferred embodiment of the photomask in the process of the capacitive touch panel of the present invention.

Fig. 5 is a flow chart showing the process of the capacitive touch panel of the first embodiment of the present invention.

Fig. 6 (a) to (d) are partial structural views of a process of the first embodiment of the present invention.

Fig. 7 (a) to (j) are schematic cross-sectional views showing the sixth embodiment (d) in the first embodiment of the present invention.

Figure 8 is a flow chart showing the process of the capacitive touch panel of the second embodiment of the present invention.

Fig. 9 (a) to (c) are partial structural views of a process of a second embodiment of the present invention.

Fig. 10 (a) to (l) are schematic cross-sectional views showing the ninth drawing (c) in the second embodiment of the present invention.

M1. . . Mask

P1. . . Complex electrode and pattern of complex traces

Claims (30)

A method for manufacturing a touch panel, comprising the steps of: forming a transparent conductive layer; forming a metal layer on the transparent conductive layer; and patterning the transparent conductive layer and the metal layer to cause each layer to generate a a pattern and a second pattern, the second pattern being attached to an outer edge of the first pattern; and removing the first pattern of the metal layer. The method of claim 1, wherein the transparent conductive layer is formed on a substrate. The method of claim 1, wherein: the first pattern is a pattern of a plurality of electrodes; the second pattern is a pattern of a plurality of traces; and in the patterns, one end of the plurality of traces is different Connected to the signal output of the plurality of electrodes. The method of claim 1, wherein the transparent conductive layer and the metal layer are simultaneously patterned by lithography and etching, wherein: the lithography method displays the patterns on the transparent conductive layer and the metal layer The patterns are defined by a mask; and the etching removes the transparent conductive layer and regions of the metal layer that do not exhibit the patterns. The method of claim 4, wherein a positive photoresist layer is applied to the metal layer as the photosensitive material layer, and the photomask utilizes a light shielding portion to define the patterns. The method of claim 4, wherein a negative photoresist layer is applied to the metal layer as the photosensitive material layer, and the photomask utilizes a light transmitting portion to define the patterns. The method of claim 4, wherein the first pattern of the metal layer is removed by using one of a lithography and a screen printing method, wherein: the lithography method and the screen printing method One of the display areas is on the metal layer, the reserved area does not include the distribution range of the first pattern portion but at least includes the distribution range of the second pattern portion; and the selective etching removes the metal layer without displaying Part of the reserved area. The method of claim 7, wherein a positive photoresist layer is applied to the metal layer as the photosensitive material layer, and the photomask utilizes a light shielding portion to define the region. The method of claim 7, wherein a negative photoresist layer is applied to the metal layer as the photosensitive material layer, and the photomask utilizes a light transmitting portion to define the region. The method of claim 7, wherein the process of removing the first pattern of the metal layer by using screen printing and selective etching comprises: coating a layer of an anti-etching material on the metal layer by using a screen printing, Having the layer of the etch-resistant material over the remaining region of the metal layer; selectively etching the uncovered layer of the metal; and removing the layer of the etch-resistant material. A method for manufacturing a touch panel, comprising: providing a substrate; forming at least one pair of marks on an edge region of the substrate; forming a first transparent conductive layer on the substrate; patterning the first transparent conductive The layer is formed to form a plurality of electrodes arranged along a first direction; a dielectric layer is formed on the plurality of electrodes; a second transparent conductive layer is formed on the dielectric layer; and a metal layer is formed on the second transparent conductive layer Simultaneously patterning the second transparent conductive layer and the metal layer such that the layers all produce a pattern of a plurality of electrodes arranged in a second direction and a pattern of a plurality of traces, wherein the traces are One end is connected to the signal output of the plurality of electrodes arranged in the second direction; and the pattern of the plurality of electrodes is removed from the metal layer. The method of claim 11, wherein the alignment mark is formed by lithography and etching, and the pattern of the alignment mark is defined by a mask. The method of claim 11, wherein the first transparent conductive layer is patterned by lithography and etching to generate the plurality of electrodes arranged along the first direction, and the plurality of electrodes are defined by a mask. picture of. The method of claim 11, wherein the second transparent conductive layer and the metal layer are simultaneously patterned by lithography and etching, and the plurality of electrodes arranged in the second direction are defined by a mask. The pattern and the pattern in the plurality of lines. The method of claim 11, wherein the pattern of the plurality of electrodes is removed by lithography and etching, the lithography method displaying a reserved area on the metal layer, the reserved area is not The distribution range of the pattern including the plurality of electrodes includes at least a distribution range of the pattern of the plurality of traces, and the etching removes a portion of the metal layer where the reserved region is not displayed. The method of claim 11, wherein the pattern of the plurality of electrodes is removed by screen printing and etching, and the screen printing method displays a reserved area on the metal layer, the reserved area is not The distribution range of the pattern including the plurality of electrodes arranged in the second direction includes at least a distribution range of the pattern of the plurality of traces, and the etching removes a portion of the metal layer where the reserved region is not displayed. The method of claim 11, further comprising: forming a protective layer on the patterned second transparent conductive layer and the metal layer. The method of claim 17, wherein the protective layer is patterned by lithography and etching, and an opening is defined by a mask that exposes the metal traces. A method for manufacturing a touch panel, comprising the steps of: providing a substrate; forming a first transparent conductive layer on the substrate; forming a metal layer on the first transparent conductive layer; and patterning the first transparent conductive The layer and the metal layer are such that the layers each have a pattern of a plurality of electrodes arranged in a first direction, a pattern of a plurality of traces, and at least one pair of bit marks; and the plurality of electrodes are removed from the metal layer Forming a dielectric layer on the patterned first transparent conductive layer and the metal layer; forming a second transparent conductive layer on the dielectric layer; and patterning the second transparent conductive layer to And generating a plurality of electrodes arranged along a second direction, wherein signal outputs of the plurality of electrodes arranged in the first or second direction are respectively connected to one ends of the traces. The method of claim 19, wherein the first transparent conductive layer and the metal layer are simultaneously patterned by lithography and etching, and the plurality of electrodes arranged in the first direction are defined by a mask. a pattern, the pattern of the plurality of traces, and the alignment mark. The method of claim 19, wherein the pattern of the plurality of electrodes is removed by lithography and etching, the lithography method displaying a reserved area on the metal layer, the reserved area is not Included is a distribution range of the pattern along the plurality of electrodes but at least includes a distribution range of the pattern in the plurality of traces, the etching removing portions of the metal layer that do not exhibit the reserved region. The method of claim 19, wherein the pattern of the plurality of electrodes is removed by screen printing and etching, the screen printing method displaying a reserved area on the metal layer, the reserved area is not The distribution range of the pattern including the plurality of electrodes arranged in the second direction includes at least a distribution range of the pattern of the plurality of traces, and the etching removes a portion of the metal layer where the reserved region is not displayed. The method of claim 19, wherein the second transparent conductive layer is patterned by lithography and etching, and the pattern of the plurality of electrodes arranged in the second direction is defined by a mask. The method of claim 19, further comprising: forming a protective layer on the patterned second transparent conductive layer. The method of claim 19, wherein the protective layer is patterned by lithography and etching, and an opening is defined by a mask that exposes the metal traces. A touch panel comprising: a transparent conductive region, presenting a first pattern and a second pattern, the second pattern being connected to an outer edge of the first pattern; and a metal region presenting the second pattern; The transparent conductive layer is a patterned transparent conductive layer, and the transparent conductive layer is patterned simultaneously with a metal layer on one side of the transparent conductive layer to present the first pattern and the second pattern; Wherein the metal region is formed by removing the first pattern of the patterned metal layer. The panel of claim 26, wherein the material of the transparent conductive layer is mainly composed of indium tin oxide. The panel of claim 26, further comprising a substrate on the other side of the transparent conductive layer. The panel of claim 28, wherein the material of the substrate is mainly composed of glass or quartz. The panel of claim 26, wherein: the first pattern is a pattern of a plurality of electrodes; and the second pattern is a pattern of a plurality of traces, one end of the plurality of traces being individually connected to the plurality of electrodes Signal output.