TWI396612B - Peeling equipment and peeling method for thin workpiece - Google Patents

Peeling equipment and peeling method for thin workpiece Download PDF

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TWI396612B
TWI396612B TW99147042A TW99147042A TWI396612B TW I396612 B TWI396612 B TW I396612B TW 99147042 A TW99147042 A TW 99147042A TW 99147042 A TW99147042 A TW 99147042A TW I396612 B TWI396612 B TW I396612B
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stage
peeling
cutting line
stripping
holding
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TW99147042A
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Chinese (zh)
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TW201226138A (en
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Juin Ming Wu
Chien Cheng Chang
Yan Zang Chen
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Au Optronics Corp
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Priority to CN 201110045988 priority patent/CN102173176B/en
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Publication of TWI396612B publication Critical patent/TWI396612B/en

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Description

薄件剝離設備及剝離方法Thin piece peeling device and peeling method

本發明關於一種剝離設備及剝離方法,尤指用於自一物件上剝離一薄件之剝離設備及剝離方法。The present invention relates to a peeling apparatus and a peeling method, and more particularly to a peeling apparatus and a peeling method for peeling a thin piece from an object.

於目前直接黏合的觸控顯示裝置的製程中,觸控面板以黏膠黏貼於顯示面板上,因重工或維修等原因後需分離觸控面板與顯示面板時,多以金屬線切入其間的黏膠層,以使觸控面板與顯示面板能分離,進而完成自觸控顯示裝置剝離觸控面板的操作。In the process of directly bonding the touch display device, the touch panel is adhered to the display panel by adhesive. When the touch panel and the display panel are separated after heavy work or maintenance, the metal wire is cut into the adhesive layer. The glue layer is configured to separate the touch panel from the display panel, thereby completing the operation of peeling off the touch panel from the touch display device.

雖黏膠層具有流動性,但其黏滯性頗大,除會黏附於金屬線上,亦會使金屬線於切割時受力過大,輕則永久形變,重則斷裂。為降低金屬線受力,已有於切割時,將金屬線垂直於切割方向左右拉動的剝離方法提出,此雖可減少黏膠黏附於金屬線的狀況,但易使黏膠層聚集成塊,除更加重前述永久形變及斷裂的問題,亦可能對觸控面板及顯示面板造成損傷。另有對金屬線加熱的剝離方法被提出,此雖可大幅降低黏膠層的黏滯性,但當溫度過低,則黏滯性降低不足;當溫度過高時,自金屬線散發出的熱亦可能對其他組件造成傷害。此外,當待剝離的觸控顯示裝置之尺寸變大時,其需切割的面積更大,前述的問題將更形嚴重。Although the adhesive layer has fluidity, its viscosity is quite large. In addition to sticking to the metal wire, the metal wire will be subjected to excessive force during cutting, and will be permanently deformed and severely broken. In order to reduce the force of the metal wire, a peeling method is proposed in which the metal wire is pulled perpendicularly to the cutting direction when cutting, which can reduce the adhesion of the adhesive to the metal wire, but it is easy to make the adhesive layer gather into the block. In addition to the problem of the above permanent deformation and fracture, the touch panel and the display panel may be damaged. In addition, a stripping method for heating the metal wire is proposed, which can greatly reduce the viscosity of the adhesive layer, but when the temperature is too low, the viscosity is not reduced enough; when the temperature is too high, the metal wire is emitted. Heat can also cause damage to other components. In addition, when the size of the touch display device to be peeled off becomes larger, the area to be cut is larger, and the aforementioned problem will be more serious.

鑑於先前技術中的問題,本發明的目的之一在於提供一種剝離設備,用以自一物件上剝離一薄件,其於切割時,利用切割線與待剝離物件產生相對偏轉,以減少切割線之受力,亦可大幅減輕黏膠的聚集程度。In view of the problems in the prior art, one of the objects of the present invention is to provide a peeling device for peeling a thin piece from an object, which, when cut, uses a cutting line to produce a relative deflection with the object to be peeled off to reduce the cutting line. The force can also greatly reduce the degree of aggregation of the glue.

本發明之剝離設備包含一載台、一切割線及二挾持元件。該載台係用以固定一物件並能相對於一剝離方向來回偏轉。該切割線位於該載台之上,用以大致沿該剝離方向切入該物件中,以自該物件剝離出一薄件。該挾持元件相對地設置於該載台之兩側,該切割線之兩端分別夾持於該二挾持元件,該二挾持元件能沿該剝離方向個別地移動以使該切割線相對於該剝離方向來回偏轉。其中,該載台與該切割線大致平行於該剝離方向相對移動,且該載台之偏轉方向與該切割線之偏轉方向相反。藉此,該剝離設備利用該切割線與該物件相對偏轉以剝離該薄件,並降低該切割線之受力,延長該切割線的使用壽命及抑制黏膠的聚集程度。The stripping apparatus of the present invention comprises a stage, a cutting line and two holding elements. The stage is used to secure an object and deflect back and forth relative to a peeling direction. The cutting line is located above the stage for cutting into the article substantially along the stripping direction to peel a thin piece from the article. The holding elements are oppositely disposed on two sides of the stage, and two ends of the cutting line are respectively clamped on the two holding elements, and the two holding elements can be individually moved along the peeling direction to make the cutting line relative to the peeling The direction is deflected back and forth. Wherein the stage and the cutting line move relatively parallel to the peeling direction, and the deflection direction of the stage is opposite to the deflection direction of the cutting line. Thereby, the stripping device utilizes the cutting line to deflect relative to the object to peel off the thin piece, and reduce the force of the cutting line, prolong the service life of the cutting line and inhibit the degree of aggregation of the glue.

本發明之另一目的在於提供一種剝離方法,利用本發明之剝離設備以自一物件上剝離一薄件,於剝離時,切割線之受力減少,亦可大幅減輕黏膠的聚集程度,使得該薄件能安全地剝離下來。Another object of the present invention is to provide a peeling method which utilizes the stripping apparatus of the present invention to peel a thin piece from an object, and when the peeling is performed, the force of the cutting line is reduced, and the degree of aggregation of the adhesive can be greatly reduced, so that The thin piece can be peeled off safely.

本發明之剝離方法包含將該切割線自固定於該載台上之該物件之一側邊切入該物件與該薄件之間,以及交替地使該二挾持元件相對於該剝離方向移動,同時使該載台對應該二挾持元件之移動相對於該剝離方向來回偏轉。藉此,該剝離方法藉由該剝離設備能降低該切割線之受力並抑制黏膠的聚集,使得該薄件能安全地剝離下來。The stripping method of the present invention comprises cutting the cutting line between the object and the thin member from one side of the object fixed to the stage, and alternately moving the two holding members relative to the peeling direction while simultaneously The movement of the stage corresponding to the two holding elements is deflected back and forth with respect to the peeling direction. Thereby, the peeling method can reduce the force of the cutting line and suppress the aggregation of the adhesive by the peeling device, so that the thin piece can be peeled off safely.

簡言之,本發明之剝離設備及剝離方法於切割時,利用切割線與物件相對偏轉以剝離自該物件剝離該薄件,故能減少切割線之受力並大幅減輕黏膠的聚集程度,解決先前技術中切割線易斷裂、黏膠易聚集及因而造成其他組件損傷的問題。In short, the stripping device and the stripping method of the present invention use a cutting line and a relative deflection of the object to peel off the thin piece from the object during cutting, thereby reducing the force of the cutting line and greatly reducing the degree of aggregation of the glue. The problem of the prior art that the cutting line is easy to break, the glue is easy to aggregate, and thus other components are damaged.

關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

請參閱第1圖,其為根據本發明之一較佳實施例之剝離設備1之俯視示意圖。剝離設備1可包含一框體12、一載台14、一切割線16、二挾持元件18、19、二滑軌20及一控制裝置22。載台14可設置於框體12上,用以固定一物件2,載台14可利用一旋轉軸142(以虛線表示其位置)以能相對於一剝離方向15(以箭頭表示)來回偏轉。滑軌20可固定於框體12上並沿剝離方向15延伸,挾持元件18、19相對地設置於載台14之兩側並分別滑動於滑軌20上,以能沿剝離方向15移動。切割線16位於該載台之上,並且其兩端分別夾持於挾持元件18、19。挾持元件18、19能沿剝離方向15個別地移動以使切割線16相對於剝離方向15來回偏轉。滑軌20上可各設置有兩個感測器202,例如光感測器或極限開關等,作為限制挾持元件18、19移動之範圍。控制裝置22可設置於框體12上並與載台14、挾持元件18、19、感測器202電連接,以控制載台14之偏轉及挾持元件18、19之移動,使用者可經由控制裝置22提供之操作介面進行參數設定。Please refer to FIG. 1, which is a top plan view of a stripping apparatus 1 in accordance with a preferred embodiment of the present invention. The stripping apparatus 1 can include a frame 12, a stage 14, a cutting line 16, two holding elements 18, 19, two slide rails 20, and a control device 22. The stage 14 can be disposed on the frame 12 for fixing an object 2, and the stage 14 can be deflected back and forth with respect to a peeling direction 15 (indicated by an arrow) by means of a rotating shaft 142 (indicated by a broken line). The slide rail 20 can be fixed to the frame body 12 and extends in the peeling direction 15. The holding members 18 and 19 are oppositely disposed on both sides of the stage 14 and respectively slid on the slide rail 20 so as to be movable in the peeling direction 15. The cutting line 16 is located above the stage and its ends are clamped to the holding elements 18, 19, respectively. The gripping elements 18, 19 can be individually moved in the peeling direction 15 to deflect the cutting line 16 back and forth relative to the peeling direction 15. Two sensors 202, such as a photo sensor or a limit switch, may be provided on the slide rail 20 as a range for limiting the movement of the gripping members 18, 19. The control device 22 can be disposed on the frame 12 and electrically connected to the stage 14, the holding elements 18, 19, and the sensor 202 to control the deflection of the stage 14 and the movement of the holding elements 18, 19, and the user can control The operating interface provided by device 22 is parameterized.

於進行剝離作業時,將切割線16與物件2之一側邊24形成一銳角162,以大致沿剝離方向15切入物件2中;接著載台14與切割線16大致平行於剝離方向15相對移動,且載台14之偏轉方向與切割線16之偏轉方向相反,以使切割線16能自物件2剝離出一薄件。例如當載台14之偏轉方向為順時針時,切割線16之偏轉方向為逆時針,並且當載台14之偏轉方向為逆時針時,切割線16之偏轉方向為順時針。又於本實施例中,物件2為一顯示面板,該薄件為貼附於該顯示面板上之一觸控面板,但本發明不以此為限。例如其他於基材上貼附有膜材組件,亦適用本發明之概念。During the stripping operation, the cutting line 16 forms an acute angle 162 with one of the side edges 24 of the article 2 to cut into the article 2 substantially in the peeling direction 15; then the stage 14 and the cutting line 16 move relatively parallel to the peeling direction 15 And the deflection direction of the stage 14 is opposite to the deflection direction of the cutting line 16 so that the cutting line 16 can be peeled off from the object 2 by a thin piece. For example, when the deflection direction of the stage 14 is clockwise, the deflection direction of the cutting line 16 is counterclockwise, and when the deflection direction of the stage 14 is counterclockwise, the deflection direction of the cutting line 16 is clockwise. In this embodiment, the object 2 is a display panel, and the thin member is a touch panel attached to the display panel, but the invention is not limited thereto. For example, other embodiments in which a film member is attached to a substrate also apply to the concept of the present invention.

請參閱第2圖,其為根據本發明之一較佳實施例之剝離方法之流程圖。該剝離方法係用以利用前述剝離設備1自物件2上剝離出該薄件。該剝離方法主要包含步驟S110將切割線16自固定於載台14上之物件2之側邊24切入物件2與該薄件之間;以及步驟S120交替地使挾持元件18、19相對於剝離方向15移動,同時使載台14對應挾持元件18、19之移動相對於剝離方向15來回偏轉。於步驟S110之前,該剝離方法將物件2固定於載台14上,及設定相關操作參數,如步驟S100所示。該剝離方法之步驟S110接著將挾持元件18、19沿剝離方向15錯位設置,使得切割線16之一部分164接觸物件2之側邊24並與側邊24間形成銳角162,如步驟S112所示;步驟完成後剝離設備1之示意圖如第1圖所示。此用以切入物件2之銳角162可設定在15度至25度,但本發明不以此為限。Please refer to FIG. 2, which is a flow chart of a stripping method in accordance with a preferred embodiment of the present invention. The peeling method is for peeling off the thin member from the article 2 by the aforementioned peeling device 1. The stripping method mainly comprises the step S110 of cutting the cutting line 16 from the side 24 of the article 2 fixed on the stage 14 between the object 2 and the thin member; and the step S120 alternately making the holding members 18, 19 relative to the peeling direction 15 moves while simultaneously deflecting the movement of the carriage 14 corresponding to the gripping elements 18, 19 relative to the stripping direction 15. Before the step S110, the stripping method fixes the object 2 on the stage 14, and sets relevant operating parameters, as shown in step S100. The step S110 of the stripping method then displaces the holding elements 18, 19 in the peeling direction 15 such that a portion 164 of the cutting line 16 contacts the side 24 of the object 2 and forms an acute angle 162 with the side 24, as shown in step S112; The schematic of the stripping apparatus 1 after the completion of the step is as shown in Fig. 1. The acute angle 162 for cutting the object 2 can be set at 15 degrees to 25 degrees, but the invention is not limited thereto.

該剝離方法之步驟S110接著固定接近切割線16之部分164的挾持元件18,並將另一個挾持元件19沿剝離方向15移動,使得該切割線16自側邊24切入物件2與該薄件之間,如步驟S114所示;步驟完成後剝離設備1之示意圖如第3圖所示。補充說明的是,於第3圖中,挾持元件19初始位置P1、水平位置P2均以虛線表示,載台14及其上物件2於載台14偏轉前亦以虛線表示,物件2中已被切割線16剝離的區域以影線表示。於挾持元件19自水平位置P2至步驟完成後的位置P3移動時,載台14同步逆時針偏轉;此可使切割線16掃過較於載台14未偏轉時更大的面積,可加速剝離速度。另外,前述載台14的偏轉角度可設定為15度;但本發明不以此為限。順帶一提的是,於第3圖中有部分已剝離的區域位於切割線16之下,此係因載台14偏轉所致;後續圖中亦有相同情形,不再贅述。The step S110 of the stripping method then fixes the gripping element 18 proximate the portion 164 of the cutting line 16 and moves the other gripping element 19 in the peeling direction 15 such that the cutting line 16 cuts into the article 2 from the side 24 and the thin piece For example, as shown in step S114; the schematic diagram of the stripping device 1 after the step is completed is as shown in FIG. In addition, in FIG. 3, the initial position P1 and the horizontal position P2 of the holding member 19 are indicated by broken lines, and the stage 14 and the upper object 2 thereof are also indicated by broken lines before the stage 14 is deflected, and the object 2 has been The area where the cutting line 16 is peeled off is indicated by hatching. When the holding member 19 moves from the horizontal position P2 to the position P3 after the completion of the step, the stage 14 is synchronously deflected counterclockwise; this allows the cutting line 16 to be swept over a larger area than when the stage 14 is not deflected, and the peeling can be accelerated. speed. In addition, the deflection angle of the aforementioned stage 14 can be set to 15 degrees; however, the invention is not limited thereto. Incidentally, in the third figure, a portion of the stripped area is located below the cutting line 16, which is caused by the deflection of the stage 14; the same is also the case in the subsequent figures, and will not be described again.

該剝離方法之步驟S120接著固定挾持元件19,使挾持元件18沿剝離方向15移動一預定距離D,使得切割線16以一第一旋轉方向172偏轉(即逆時針偏轉),並且於挾持元件18移動時,使載台14以相反於第一旋轉方向172之一第二旋轉方向174同時偏轉(即順時針偏轉),如步驟S122所示,步驟完成後剝離設備1之示意圖如第4圖所示。補充說明的是,於第4圖中,挾持元件18初始位置P4、水平位置P5均以虛線表示,載台14及其上物件2於載台14以第二旋轉方向174偏轉前亦以虛線表示,物件2中已被切割線16剝離的區域以影線表示。當挾持元件18自初始位置P4移動至水平位置P5時,載台14亦偏轉至水平位置(可參閱第1圖所示之載台14位置),此時載台14已偏轉15度;接著,於挾持元件18自水平位置P5至步驟完成後的位置P6移動時,載台14持續同步以第二旋轉方向174偏轉。同樣地,此可使切割線16掃過較載台14不偏轉時更大的面積,可加速剝離速度。另外,前述載台14以第二旋轉方向174的偏轉角度可設定為30度,即載台14旋轉至水平後,再接續旋轉15度;但本發明不以此為限。The step S120 of the stripping method then fixes the gripping member 19 to move the gripping member 18 a predetermined distance D in the peeling direction 15 such that the cutting line 16 is deflected in a first rotational direction 172 (i.e., counterclockwise) and is held in the gripping member 18. When moving, the stage 14 is simultaneously deflected (ie, clockwise deflected) in a second rotational direction 174 opposite to the first rotational direction 172. As shown in step S122, the schematic of the stripping apparatus 1 after the step is completed is as shown in FIG. Show. In addition, in FIG. 4, the initial position P4 and the horizontal position P5 of the holding member 18 are indicated by broken lines, and the stage 14 and its upper object 2 are also indicated by broken lines before the stage 14 is deflected in the second rotational direction 174. The area of the article 2 that has been peeled off by the cutting line 16 is indicated by hatching. When the holding member 18 is moved from the initial position P4 to the horizontal position P5, the stage 14 is also deflected to the horizontal position (refer to the position of the stage 14 shown in Fig. 1), at which time the stage 14 has been deflected by 15 degrees; When the holding member 18 is moved from the horizontal position P5 to the position P6 after the completion of the step, the stage 14 is continuously synchronized and deflected in the second rotational direction 174. Similarly, this allows the cutting line 16 to sweep over a larger area than when the stage 14 is not deflected, thereby speeding up the stripping speed. In addition, the deflection angle of the stage 14 in the second rotation direction 174 can be set to 30 degrees, that is, after the stage 14 is rotated to the horizontal position, and then rotated 15 degrees, the present invention is not limited thereto.

該剝離方法之步驟S120接著固定挾持元件18,使挾持元件19沿剝離方向15亦移動預定距離D,使得切割線16以第二旋轉方向174偏轉,並且於挾持元件19移動時,使載台14以第一旋轉方向172偏轉,如步驟S124所示,步驟完成後剝離設備1之示意圖如第5圖所示。補充說明的是,於第5圖中,挾持元件19初始位置P3、水平位置P7均以虛線表示,載台14及其上物件2於載台14以第一旋轉方向172偏轉前亦以虛線表示,物件2中已被切割線16剝離的區域以影線表示。當挾持元件19自初始位置P3移動至水平位置P7時,載台14亦偏轉至水平位置(可參閱第1圖所示之載台14位置),此時載台14已偏轉15度;接著,於挾持元件19自水平位置P7至步驟完成後的位置P8移動時,載台14持續同步以第一旋轉方向172偏轉。同樣地,此可使切割線16掃過較於載台14未偏轉時更大的面積,可加速剝離速度。另外,前述載台14以第一旋轉方向172的偏轉角度亦設定為30度,即載台14旋轉至水平後,再接續旋轉15度。The step S120 of the stripping method then fixes the gripping member 18 such that the gripping member 19 is also moved a predetermined distance D in the peeling direction 15 such that the cutting line 16 is deflected in the second rotational direction 174, and when the gripping member 19 is moved, the carrier 14 is caused to move. The first rotation direction 172 is deflected. As shown in step S124, the schematic diagram of the stripping apparatus 1 after the step is completed is as shown in FIG. In addition, in FIG. 5, the initial position P3 and the horizontal position P7 of the holding member 19 are indicated by broken lines, and the stage 14 and its upper object 2 are also indicated by broken lines before the stage 14 is deflected in the first rotational direction 172. The area of the article 2 that has been peeled off by the cutting line 16 is indicated by hatching. When the holding member 19 is moved from the initial position P3 to the horizontal position P7, the stage 14 is also deflected to the horizontal position (refer to the position of the stage 14 shown in Fig. 1), at which time the stage 14 has been deflected by 15 degrees; When the gripping member 19 is moved from the horizontal position P7 to the position P8 after the completion of the step, the stage 14 is continuously synchronized and deflected in the first rotational direction 172. As such, this allows the cutting line 16 to be swept over a larger area than when the stage 14 is undeflected, which accelerates the peeling speed. Further, the deflection angle of the stage 14 in the first rotational direction 172 is also set to 30 degrees, that is, after the stage 14 is rotated to the horizontal level, the rotation of the stage 14 is continued by 15 degrees.

該剝離方法之步驟S120接著判斷是否已完成剝離作業,如步驟S126所示。於步驟S126中,若判斷已完成,則結束剝離作業,另可對剝離後之物件進行其他作業程序,例如浸泡、清洗等;若判斷未完成,則再重覆步驟S122、S124。此判斷步驟S126實作上可於步驟S122及步驟S124之間亦執行一次,其或許能減少執行步驟S124一次。The step S120 of the stripping method next determines whether the peeling operation has been completed, as shown in step S126. In step S126, if the determination is completed, the peeling operation is ended, and other work procedures such as immersion, washing, etc. may be performed on the peeled object; if the determination is not completed, steps S122 and S124 are repeated. The determining step S126 can be performed once between step S122 and step S124, which may reduce the execution of step S124 once.

補充說明的是,前述挾持元件18、19交替移動的距離(即預定距離)於前述實施例中未予特定,於實作上,其可視待處理物件2之特性而定,尤其是黏膠層之特性。又,載台14配合挾持元件18、19交替移動之偏轉角度雖為30度(可視為相對剝離方向15為正負15度),但本發明不以此為限,例如可視待處理物件2之特性而定,尤其是黏膠層之特性。此外,於剝離過程中,可能因黏膠層的狀況或切割線16本身特性的變異,而有需要改變剝離參數,以提昇剝離效率。因此,本發明之剝離方法亦可藉由剝離設備1之挾持元件18、19分別包含一感測模組182、192,用以量測切割線16中之應力,以動態地改變剝離參數。例如,於步驟S122中,於挾持元件18移動時,量測切割線16之應力以動態調整挾持元件18的移動速度;同樣地,於步驟S124中,於挾持元件19移動時,量測切割線16之應力以動態調整挾持元件19的移動速度。由於載台14係配合挾持元件18、19之移動偏轉,故其旋轉角速度亦隨之動態調整。前述雖僅以加快挾持元件18、19移動的速度為例,但亦可在切割線16之可容許承受應力的範圍內,加長預定距離D,抑或兩者兼具,本發明均不以此為限。藉此,該剝離方法可視實際剝離狀況而動態地調整剝離作業參數,以提昇剝離作業速度。前述感測模組182、192可為拉力計或扭力計,本發明不以此為限。It is to be noted that the distance (ie, the predetermined distance) at which the holding members 18 and 19 are alternately moved is not specified in the foregoing embodiment. In practice, it may depend on the characteristics of the object to be processed 2, especially the adhesive layer. Characteristics. Moreover, although the deflection angle of the stage 14 in the alternate movement of the holding elements 18 and 19 is 30 degrees (which can be regarded as plus or minus 15 degrees with respect to the peeling direction 15), the present invention is not limited thereto, for example, the characteristics of the object to be processed 2 can be seen. Depending on the characteristics of the adhesive layer. In addition, during the stripping process, there may be a need to change the peeling parameters to improve the peeling efficiency due to the condition of the adhesive layer or the variation of the characteristics of the cutting line 16 itself. Therefore, the stripping method of the present invention can also include a sensing module 182, 192 by the holding elements 18, 19 of the stripping device 1 for measuring the stress in the cutting line 16 to dynamically change the peeling parameters. For example, in step S122, when the holding member 18 moves, the stress of the cutting line 16 is measured to dynamically adjust the moving speed of the holding member 18; likewise, in step S124, when the holding member 19 moves, the cutting line is measured. The stress of 16 dynamically adjusts the moving speed of the gripping member 19. Since the stage 14 is coupled to the movement deflection of the holding members 18, 19, the rotational angular velocity is also dynamically adjusted. Although the speed of the movement of the holding elements 18 and 19 is increased as an example, the predetermined distance D may be lengthened within the range of the allowable stress of the cutting line 16, or both, and the present invention does not limit. Thereby, the peeling method dynamically adjusts the peeling operation parameter in accordance with the actual peeling condition to increase the peeling work speed. The sensing module 182, 192 can be a tension meter or a torque meter, and the invention is not limited thereto.

於前述實施例中,剝離設備1之載台14僅利用單一旋轉軸142實現載台14偏轉之目的,但本發明不以此為限。請參閱第6圖,其為根據本發明之另一實施例之載台34之示意圖。於此實施例中,載台34上形成有二弧形導槽342、344,載台34並包含一第一旋轉軸346及一第二旋轉軸348,沿剝離方向15依序分別設置於弧形導槽342、344中。藉由控制第一旋轉軸346及第二旋轉軸348於弧形導槽342、344中之旋轉,即可實現載台34相對於剝離方向15來回偏轉的作動,故載台34亦可取代前述載台14。於實作上,第一旋轉軸346及第二旋轉軸348與弧形導槽342、344得以齒輪嚙合的方式實現,但本發明不以此為限。In the foregoing embodiment, the stage 14 of the stripping apparatus 1 uses only a single rotating shaft 142 for the purpose of deflecting the stage 14, but the invention is not limited thereto. Please refer to FIG. 6, which is a schematic diagram of a stage 34 in accordance with another embodiment of the present invention. In this embodiment, the stage 34 is formed with two arcuate guide grooves 342 and 344. The stage 34 includes a first rotating shaft 346 and a second rotating shaft 348, and is sequentially disposed in the arc in the peeling direction 15 . In the shaped guide grooves 342, 344. By controlling the rotation of the first rotating shaft 346 and the second rotating shaft 348 in the arcuate guiding grooves 342, 344, the movement of the stage 34 relative to the peeling direction 15 can be realized, so that the stage 34 can also replace the foregoing. Stage 14. In practice, the first rotating shaft 346 and the second rotating shaft 348 are realized by meshing with the curved guiding grooves 342 and 344, but the invention is not limited thereto.

請參閱第7圖及第8圖,其分別載台34於其與切割線16不同的相對位置時之偏轉示意圖;其中物件2、切割線16、挾持元件18、19以虛線表示。物件2大致沿剝離方向15定義一剝離長度26,即物件2沿剝離方向15之長度。當切割線16沿剝離方向15行進之距離小於剝離長度26之一半時,即切割線16之中心點仍在物件2之上半部,控制第一旋轉軸346旋轉,第二旋轉軸348固定,即能使載台34以第二旋轉軸348為旋轉中心,相對於剝離方向15來回偏轉,如第7圖所示;當切割線16沿剝離方向15行進之距離大於剝離長度26之一半時,即切割線16之中心點已在物件2之下半部,控制第二旋轉軸348旋轉,第一旋轉軸346固定,即能使載台34以第一旋轉軸346為旋轉中心,相對於剝離方向15來回偏轉,如第8圖所示。前述利用二個旋轉軸346、348來改變載台34之旋轉中心,此可使切割線16於每個剝離周期(即實施步驟S122及S124)所剝離的面積相近,亦即可加速剝離速度。Please refer to FIGS. 7 and 8 for a deflection diagram of the stage 34 at a different relative position to the cutting line 16; wherein the object 2, the cutting line 16, and the holding elements 18, 19 are indicated by dashed lines. The article 2 defines a peel length 26 substantially along the peeling direction 15, i.e. the length of the article 2 in the peeling direction 15. When the cutting line 16 travels in the peeling direction 15 by less than one half of the peeling length 26, that is, the center point of the cutting line 16 is still in the upper half of the object 2, the first rotating shaft 346 is controlled to rotate, and the second rotating shaft 348 is fixed. That is, the stage 34 can be deflected with respect to the peeling direction 15 with the second rotating shaft 348 as the center of rotation, as shown in FIG. 7; when the cutting line 16 travels in the peeling direction 15 by more than one half of the peeling length 26, That is, the center point of the cutting line 16 is already in the lower half of the object 2, and the second rotating shaft 348 is controlled to rotate, and the first rotating shaft 346 is fixed, that is, the stage 34 can be rotated with the first rotating shaft 346 as a center of rotation. Direction 15 is deflected back and forth as shown in Figure 8. The rotation centers of the stage 34 are changed by the two rotating shafts 346 and 348. This allows the cutting line 16 to be peeled off in each peeling period (that is, in the steps S122 and S124), that is, the peeling speed can be accelerated.

補充說明的是,於實作上可同時控制第一旋轉軸346及第二旋轉軸348之旋轉,以使載台34能依切割線16之相對位置而以不同的旋轉中心旋轉,使得切割線16於每個剝離周期所剝離的面積更為相近,使剝離作業更加有效率。In addition, the rotation of the first rotating shaft 346 and the second rotating shaft 348 can be controlled at the same time to enable the stage 34 to rotate at different centers of rotation according to the relative positions of the cutting lines 16 so that the cutting line 16 The area peeled off during each stripping cycle is more similar, making the stripping operation more efficient.

於前述實施例中,載台14、34與切割線16之相對移動主要藉由移動挾持元件18、19實現,但本發明不以此為限。請參閱第9圖,其為根據本發明之另一較佳實施例之剝離設備5之俯視示意圖。剝離設備5與剝離設備1之結構大致相同,不同之處主要在於剝離設備5係以移動載台14來實現載台14與切割線16之相對移動。進一步來說,剝離設備5包含一線性移動裝置52,可設置於框體12上,載台14則與線性移動裝置52銜接,藉此即可利用線性移動裝置52以使載台14往相反於剝離方向15之方向移動。其中,線性移動裝置52可利用導螺桿、齒條或履帶實現,但本發明不以此為限;又,載台14之旋轉軸142以一基座144與線性移動裝置52銜接,故載台14仍得藉由旋轉軸142相對於剝離方向15來回偏轉。In the foregoing embodiment, the relative movement of the stages 14, 34 and the cutting line 16 is mainly achieved by moving the holding members 18, 19, but the invention is not limited thereto. Please refer to FIG. 9, which is a top plan view of a stripping device 5 in accordance with another preferred embodiment of the present invention. The stripping device 5 is substantially identical in structure to the stripping device 1, except that the stripping device 5 is configured to move the stage 14 to effect relative movement of the stage 14 and the cutting line 16. Further, the stripping device 5 includes a linear moving device 52 that can be disposed on the frame 12, and the stage 14 is coupled to the linear moving device 52, whereby the linear moving device 52 can be utilized to cause the stage 14 to be opposite to Move in the direction of the peeling direction 15. The linear moving device 52 can be implemented by using a lead screw, a rack or a crawler, but the invention is not limited thereto; and the rotating shaft 142 of the stage 14 is coupled to the linear moving device 52 by a base 144, so the stage 14 still has to be deflected back and forth with respect to the peeling direction 15 by the axis of rotation 142.

由於剝離設備5係利用載台14相對框體12移動,故其挾持元件18、19得以往復周期運動實現剝離作業。進一步來說,以第9圖為例,於載台14往相反於剝離方向15之方向(即向上)移動時,挾持元件18亦自初始位置P11向上移動,挾持元件19則自初始位置P21向下移動,形成切割線16以第二旋轉方向174旋轉;此時,載台14亦藉由旋轉軸142以第一旋轉方向172旋轉。於挾持元件18到達終點位置P13、挾持元件19到達終點位置P23時,挾持元件18及挾持元件19即停止,即完成此步驟之剝離作業。接著進行下一步驟之剝離作業,如第10圖所示。於載台14再持續向上移動時,挾持元件18自初始位置P13(即前步驟之終點位置P13)向下移動,挾持元件19則自初始位置P23(即前步驟之終點位置P23)向上移動,形成切割線16以第一旋轉方向172旋轉;此時,載台14亦藉由旋轉軸142以第二旋轉方向174旋轉。於挾持元件18到達終點位置P11、挾持元件19到達終點位置P21時,挾持元件18及挾持元件19即停止,即完成此步驟之剝離作業。接著再持續重覆前述兩步驟,直至剝離完畢。藉此,剝離設備5亦能對物件2產生與剝離 設備1相同剝離效果之作業。Since the peeling device 5 is moved by the stage 14 with respect to the frame 12, the holding members 18 and 19 can be reciprocatingly moved to realize the peeling operation. Further, taking FIG. 9 as an example, when the stage 14 moves in a direction opposite to the peeling direction 15 (ie, upward), the holding member 18 also moves upward from the initial position P11, and the holding member 19 is moved from the initial position P21. Moving downward, the cutting line 16 is formed to rotate in the second rotational direction 174; at this time, the stage 14 is also rotated by the rotating shaft 142 in the first rotational direction 172. When the holding member 18 reaches the end position P13 and the holding member 19 reaches the end position P23, the holding member 18 and the holding member 19 are stopped, that is, the peeling operation of this step is completed. Then proceed to the next step of the stripping operation, as shown in Figure 10. When the stage 14 continues to move upward again, the holding member 18 moves downward from the initial position P13 (ie, the end position P13 of the previous step), and the holding member 19 moves upward from the initial position P23 (ie, the end position P23 of the previous step). The cutting line 16 is formed to rotate in the first rotational direction 172; at this time, the stage 14 is also rotated by the rotating shaft 142 in the second rotational direction 174. When the holding member 18 reaches the end position P11 and the holding member 19 reaches the end position P21, the holding member 18 and the holding member 19 are stopped, that is, the peeling operation of this step is completed. Then continue to repeat the above two steps until the peeling is completed. Thereby, the peeling device 5 can also produce and peel off the object 2 The same peeling effect of the equipment 1 operation.

補充說明的是,於前述剝離設備5之剝離作業中,挾持元件18及挾持元件19係分別以水平位置P12、P22為中心,作往復周期運動,但本發明不以此為限。例如於每次往復運動後,挾持元件18及挾持元件19係分別以水平位置P12、P22可相對載台14調整,此可縮短線性移動裝置52驅動載台14移動之距離。此外,於剝離設備5中,於挾持元件18或挾持元件19與載台14同向移動時,當挾持元件18或挾持元件19與載台14之移動速度相同時,則剝離設備5可獲致與剝離設備1等效之剝離效果。It is to be noted that in the peeling operation of the peeling device 5, the holding member 18 and the holding member 19 are reciprocatingly cycled around the horizontal positions P12 and P22, respectively, but the invention is not limited thereto. For example, after each reciprocating motion, the holding member 18 and the holding member 19 can be adjusted relative to the stage 14 at horizontal positions P12 and P22, respectively, which can shorten the distance that the linear moving device 52 drives the stage 14 to move. Further, in the peeling device 5, when the holding member 18 or the holding member 19 moves in the same direction as the stage 14, when the moving speed of the holding member 18 or the holding member 19 and the stage 14 are the same, the peeling device 5 can be obtained The peeling effect of the peeling device 1 is equivalent.

請參閱第11圖,其為根據本發明之又一較佳實施例之剝離設備7之俯視示意圖。剝離設備7與剝離設備5之結構大致相同,不同之處在於剝離設備7之挾持元件18及挾持元件19,與剝離設備1之挾持元件18及挾持元件19相似,往剝離方向15持續移動,並且剝離設備7之載台14,與剝離設備5之載台14相似,往相反於剝離方向15之方向持續移動,同樣能產生切割線16與載台14之相對移動,進而能完成物件2之剝離作業。由於前述剝離設備1、5、7結構大致相同,故於實作上,得以單一實體設備藉由程式設計實現前述各剝離設備1、5、7之操作。另外,當線性移動裝置52本身可相對於框體12旋轉時,則前述載台14之偏轉作動亦得直接藉由線性移動裝置52的旋轉以使載台14相對於剝離方向15偏轉,故載台14可不需旋轉軸142即能具有偏轉功能,其作動示意圖如第12圖 所示。Please refer to Fig. 11, which is a top plan view of a stripping device 7 in accordance with yet another preferred embodiment of the present invention. The peeling device 7 has substantially the same structure as the peeling device 5, except that the holding member 18 and the holding member 19 of the peeling device 7 are similar to the holding member 18 and the holding member 19 of the peeling device 1, and continue to move in the peeling direction 15, and The stage 14 of the stripping device 7 is similar to the stage 14 of the stripping apparatus 5, and is continuously moved in the opposite direction to the peeling direction 15, so that the relative movement of the cutting line 16 and the stage 14 can be generated, thereby enabling the peeling of the object 2. operation. Since the structures of the stripping devices 1, 5, and 7 are substantially the same, in practice, the operation of each of the stripping devices 1, 5, and 7 described above can be realized by a single physical device. In addition, when the linear moving device 52 itself is rotatable relative to the frame 12, the deflection of the stage 14 is also directly caused by the rotation of the linear moving device 52 to deflect the stage 14 relative to the peeling direction 15. The table 14 can have a deflection function without rotating the shaft 142, and its operation diagram is as shown in Fig. 12. Shown.

如前說明,本發明利用載台與切割線相對移動且載台與切割線相互相反偏轉以實現物件剝離作業。於每次偏轉剝離時,切割線並非全部均切割相同距離,或是說切割線的每一部分剝離的區域並不相同,原則上每次偏轉剝離時,靠近與載台相對移動較大的挾持元件的部分切割線剝離的區域較大;巨觀而言,以切割線之中心為分界,每次偏轉剝離可視為主要由其中一半的切割線實施剝離作業,故切割線整體受力即減小,既能延長切割線之使用壽命,亦能增加切割線於切割時之穩定性,有效解決先前技術中切割線易斷裂的問題。此外,本發明之切割線係大致沿剝離方向行進,於切割時,未有左右拉動(即切割線沿其軸向移動),故可有效抑制黏膠聚集,避免了先前技術中黏膠易聚集而造成其他組件損傷的問題。As described above, the present invention utilizes the stage to move relative to the cutting line and the stage and the cutting line are deflected opposite each other to effect the object peeling operation. At each deflection peeling, not all of the cutting lines are cut at the same distance, or the area where each part of the cutting line is peeled off is not the same. In principle, each time the deflection is peeled off, the holding member is moved relatively close to the stage. The area where part of the cutting line is peeled off is large; in the macro view, the center of the cutting line is demarcated, and each deflection peeling can be regarded as mainly performing peeling operation by half of the cutting lines, so that the overall force of the cutting line is reduced, The utility model can not only prolong the service life of the cutting line, but also increase the stability of the cutting line during cutting, and effectively solve the problem that the cutting line is easy to break in the prior art. In addition, the cutting line of the present invention travels substantially in the peeling direction, and does not pull left and right when cutting (ie, the cutting line moves along the axial direction thereof), so that the aggregation of the glue can be effectively suppressed, and the adhesive in the prior art is prevented from being easily gathered. The problem of damage to other components.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1、5、7‧‧‧剝離設備1, 5, 7‧ ‧ stripping equipment

2‧‧‧物件2‧‧‧ objects

12‧‧‧框體12‧‧‧ frame

14、34‧‧‧載台14, 34‧‧‧ stage

15‧‧‧剝離方向15‧‧‧Dismantling direction

16‧‧‧切割線16‧‧‧ cutting line

18、19‧‧‧挾持元件18, 19‧‧‧ holding components

20‧‧‧滑軌20‧‧‧Slide rails

22‧‧‧控制裝置22‧‧‧Control device

24‧‧‧側邊24‧‧‧ side

26‧‧‧剝離長度26‧‧‧ peel length

52‧‧‧線性移動裝置52‧‧‧Linear mobile device

142‧‧‧旋轉軸142‧‧‧Rotary axis

144‧‧‧基座144‧‧‧Base

162‧‧‧銳角162‧‧‧ acute angle

164‧‧‧部分Section 164‧‧‧

172‧‧‧第一旋轉方向172‧‧‧First direction of rotation

174‧‧‧第二旋轉方向174‧‧‧second direction of rotation

182、192‧‧‧感測模組182, 192‧‧‧ Sensing Module

202‧‧‧感測器202‧‧‧ Sensor

342、344‧‧‧弧形導槽342, 344‧‧ ‧ curved guides

346‧‧‧第一旋轉軸346‧‧‧First rotating shaft

348‧‧‧第二旋轉軸348‧‧‧second axis of rotation

D‧‧‧預定距離D‧‧‧Predetermined distance

P1~P8、P11~P13、P21~P23‧‧‧位置P1~P8, P11~P13, P21~P23‧‧‧ position

S100、S110~S114、S120~S126‧‧‧實施步驟S100, S110~S114, S120~S126‧‧‧ implementation steps

第1圖為根據本發明之一較佳實施例之剝離設備之俯視示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a top plan view of a stripping apparatus in accordance with a preferred embodiment of the present invention.

第2圖為根據本發明之一較佳實施例之剝離方法之流程圖。2 is a flow chart of a stripping method in accordance with a preferred embodiment of the present invention.

第3圖至第5圖為剝離設備根據第2圖之流程圖之剝離作動示意圖。Fig. 3 to Fig. 5 are schematic views showing the peeling operation of the peeling apparatus according to the flow chart of Fig. 2.

第6圖為根據另一實施例之剝離設備之載台之示意圖。Figure 6 is a schematic illustration of a stage of a stripping apparatus in accordance with another embodiment.

第7圖及第8圖分別為載台於其與切割線不同的相對位置時之偏轉 示意圖。Figures 7 and 8 show the deflection of the stage when it is at a different relative position to the cutting line. schematic diagram.

第9圖為根據本發明之另一較佳實施例之剝離設備之俯視示意圖。Figure 9 is a top plan view of a stripping apparatus in accordance with another preferred embodiment of the present invention.

第10圖為第9圖中剝離設備於載台處於不同位置之另一示意圖。Figure 10 is another schematic view of the stripping apparatus in the different positions of the stage in Figure 9.

第11圖為根據本發明之又一較佳實施例之剝離設備之俯視示意圖。Figure 11 is a top plan view of a stripping apparatus in accordance with still another preferred embodiment of the present invention.

第12圖為根據本發明之一實施例之載台偏轉之示意圖。Figure 12 is a schematic illustration of stage deflection in accordance with an embodiment of the present invention.

1...剝離設備1. . . Stripping equipment

2...物件2. . . object

12...框體12. . . framework

14...載台14. . . Loading platform

15...剝離方向15. . . Stripping direction

16...切割線16. . . Cutting line

18、19...挾持元件18, 19. . . Holding component

20...滑軌20. . . Slide rail

22...控制裝置twenty two. . . Control device

142...旋轉軸142. . . Rotary axis

172...第一旋轉方向172. . . First direction of rotation

174...第二旋轉方向174. . . Second direction of rotation

182、192...感測模組182, 192. . . Sensing module

202...感測器202. . . Sensor

D...預定距離D. . . Predetermined distance

P4、P5、P6...位置P4, P5, P6. . . position

Claims (16)

一種剝離設備,用以自一物件上剝離一薄件,該剝離設備包含:一載台,用以固定該物件並能相對於一剝離方向來回偏轉;一切割線,位於該載台之上,用以大致沿該剝離方向切入該物件中,以自該物件剝離出該薄件;以及二挾持元件,相對地設置於該載台之兩側,該切割線之兩端分別夾持於該二挾持元件,該二挾持元件能沿該剝離方向個別地移動以使該切割線相對於該剝離方向來回偏轉;其中,該載台與該切割線大致平行於該剝離方向相對移動,且該載台之偏轉方向與該切割線之偏轉方向相反。A stripping device for stripping a thin piece from an object, the stripping apparatus comprising: a stage for fixing the object and being deflectable back and forth with respect to a peeling direction; a cutting line located above the stage The utility model is configured to cut into the object substantially along the peeling direction to peel off the thin piece from the object; and the two holding elements are oppositely disposed on two sides of the loading table, and the two ends of the cutting line are respectively clamped on the two a holding member, the two holding members being individually movable in the peeling direction to deflect the cutting line back and forth with respect to the peeling direction; wherein the stage is relatively moved parallel to the cutting line in the peeling direction, and the stage is The direction of deflection is opposite to the direction of deflection of the cutting line. 如請求項1所述之剝離設備,其中當該載台之偏轉方向為順時針時,該切割線之偏轉方向為逆時針,並且當該載台之偏轉方向為逆時針時,該切割線之偏轉方向為順時針。The stripping apparatus of claim 1, wherein when the deflection direction of the stage is clockwise, the deflection direction of the cutting line is counterclockwise, and when the deflection direction of the stage is counterclockwise, the cutting line The direction of deflection is clockwise. 如請求項1所述之剝離設備,其中該二挾持元件係沿該剝離方向交替移動,以使該切割線自該物件剝離該薄件。The stripping apparatus of claim 1, wherein the two gripping elements are alternately moved in the peeling direction such that the cutting line peels the thin piece from the article. 如請求項1所述之剝離設備,更包含二滑軌,該二挾持元件係分別滑動設置於該二滑軌上,用以往該剝離方向移動。The stripping device of claim 1, further comprising two slide rails, wherein the two gripping elements are respectively slidably disposed on the two slide rails, and are moved by the peeling direction in the past. 如請求項1所述之剝離設備,其中該載台包含一平台及與該平台連接之二旋轉軸,該平台用以固定該物件並藉由該二旋轉軸以能相對於該剝離方向偏轉。The stripping apparatus of claim 1, wherein the stage comprises a platform and two rotating shafts coupled to the platform, the platform for fixing the object and being deflectable relative to the peeling direction by the two rotating shafts. 如請求項1所述之剝離設備,更包含一線性移動裝置,銜接該載台,用以驅動該載台往相反於該剝離方向之方向移動。The stripping device of claim 1 further comprising a linear moving device coupled to the stage for driving the stage to move in a direction opposite to the stripping direction. 如請求項6所述之剝離設備,其中該線性移動裝置係能旋轉以使該載台相對於該剝離方向偏轉。The stripping apparatus of claim 6, wherein the linear moving device is rotatable to deflect the stage relative to the stripping direction. 如請求項1所述之剝離設備,其中該二挾持元件分別包含一感測模組,用以量測該切割線中之應力。The stripping device of claim 1, wherein the two holding elements respectively comprise a sensing module for measuring stress in the cutting line. 一種剝離方法,使用一剝離設備以自一物件上剝離一薄件,該剝離設備包含一載台、一切割線及二挾持元件,該載台能相對於一剝離方向來回偏轉,該切割線位於該載台之上,該切割線之兩端分別挾持於該二挾持元件,該二挾持元件能沿該剝離方向個別地移動以使該切割線相對於該剝離方向來回偏轉,該剝離方法包含下列步驟:(a) 將該切割線自固定於該載台上之該物件之一側邊切入該物件與該薄件之間;以及(b) 交替地使該二挾持元件相對於該剝離方向移動,同時使該載台對應該二挾持元件之移動相對於該剝離方向來回偏轉。A method of stripping, using a stripping apparatus to strip a thin piece from an object, the stripping apparatus comprising a stage, a cutting line and two holding elements, the stage being deflectable back and forth with respect to a peeling direction, the cutting line being located On the stage, the two ends of the cutting line are respectively held by the two holding members, and the two holding members are individually movable along the peeling direction to deflect the cutting line back and forth with respect to the peeling direction, and the peeling method includes the following Step: (a) cutting the cutting line between the object and the thin member from one side of the object fixed to the stage; and (b) alternately moving the two holding members relative to the peeling direction At the same time, the stage is deflected back and forth with respect to the peeling direction of the two holding elements. 如請求項9所述之剝離方法,其中步驟(a)由下列步驟實施:將該二挾持元件沿該剝離方向錯位設置,使得該切割線之一部分接觸該物件之該側邊部分並與該側邊間形成一銳角;以及固定接近該切割線之該部分的該挾持元件,將該另一個挾持元件沿該剝離方向移動,使得該切割線自該側邊切入該物件與該薄件之間。The peeling method according to claim 9, wherein the step (a) is carried out by disposing the two holding members in the peeling direction such that one of the cutting lines partially contacts the side portion of the object and the side Forming an acute angle between the sides; and holding the holding member adjacent to the portion of the cutting line, moving the other holding member in the peeling direction such that the cutting line cuts between the object and the thin member from the side. 如請求項9所述之剝離方法,其中該二挾持元件定義為一第一挾持元件及一第二挾持元件,步驟(b)由下列步驟實施:(b-1) 固定該第一挾持元件,使該第二挾持元件沿該剝離方向移動一預定距離,使得該切割線以一第一旋轉方向偏轉,以及於該第二挾持元件移動時,使該載台以相反於該第一旋轉方向之一第二旋轉方向偏轉;(b-2) 固定該第二挾持元件,使該第一挾持元件沿該剝離方向移動該預定距離,使得該切割線以該第二旋轉方向偏轉,以及於該第一挾持元件移動時,使該載台以該第一旋轉方向偏轉;以及(b-3) 重覆步驟(b-1)及步驟(b-2)。The stripping method of claim 9, wherein the two holding elements are defined as a first holding element and a second holding element, and the step (b) is performed by the following steps: (b-1) fixing the first holding element, Moving the second holding element in the peeling direction by a predetermined distance such that the cutting line is deflected in a first rotational direction, and when the second holding element moves, the stage is opposite to the first rotational direction Deviating in a second direction of rotation; (b-2) fixing the second holding member to move the first holding member in the peeling direction by the predetermined distance such that the cutting line is deflected in the second direction of rotation, and When the holding member moves, the stage is deflected in the first rotational direction; and (b-3) repeats the steps (b-1) and (b-2). 如請求項11所述之剝離方法,其中於步驟(b-1)中,於該第二挾持元件移動時,量測該切割線之應力以動態調整該第二挾持元件的移動速度,以及於步驟(b-2)中,於該第一挾持元件移動時,量測該切割線之應力以動態調整該第一挾持元件的移動速度。The stripping method according to claim 11, wherein in the step (b-1), when the second holding member moves, the stress of the cutting line is measured to dynamically adjust the moving speed of the second holding member, and In the step (b-2), when the first holding member moves, the stress of the cutting line is measured to dynamically adjust the moving speed of the first holding member. 如請求項9所述之剝離方法,其中該載台包含一第一旋轉軸及一第二旋轉軸,沿該剝離方向依序設置,於步驟(b)中,控制該第一旋轉軸及該第二旋轉軸以使該載台能相對於該剝離方向來回偏轉。The stripping method of claim 9, wherein the stage comprises a first rotating shaft and a second rotating shaft, which are sequentially disposed along the peeling direction, and in the step (b), the first rotating shaft is controlled The second axis of rotation is such that the stage can be deflected back and forth relative to the stripping direction. 如請求項13所述之剝離方法,其中該物件其上沿該剝離方向定義一剝離長度,於步驟(b)中,當該切割線沿該剝離方向行進之距離小於該剝離長度之一半時,控制該第一旋轉軸旋轉以使該載台能相對於該剝離方向來回偏轉,以及當該切割線沿該剝離方向行進之距離大於該剝離長度之一半時,控制該第二旋轉軸旋轉以使該載台能相對於該剝離方向來回偏轉。The peeling method of claim 13, wherein the article defines a peeling length along the peeling direction, and in the step (b), when the cutting line travels in the peeling direction by a distance less than one half of the peeling length, Controlling the rotation of the first rotating shaft to enable the stage to be deflected back and forth with respect to the peeling direction, and controlling the rotation of the second rotating shaft to rotate when the cutting line travels in the peeling direction by a distance greater than one half of the peeling length The stage is deflectable back and forth with respect to the stripping direction. 如請求項9所述之剝離方法,其中該剝離設備更包含一線性移動裝置,銜接該載台,用以驅動該載台移動,步驟(b)更包含下列步驟:於該二挾持元件沿該剝離方向移動時,控制該線性移動裝置驅動該載台沿相反於該剝離方向之方向移動。The stripping method of claim 9, wherein the stripping apparatus further comprises a linear moving device that engages the stage for driving the stage to move, and the step (b) further comprises the step of: following the two holding elements When the peeling direction is moved, the linear moving device is controlled to drive the stage to move in a direction opposite to the peeling direction. 如請求項15所述之剝離方法,其中於步驟(b)中,控制該線性移動裝置旋轉以使該載台相對於該剝離方向來回偏轉。The peeling method of claim 15, wherein in the step (b), the linear moving device is controlled to rotate to deflect the stage back and forth with respect to the peeling direction.
TW99147042A 2010-12-30 2010-12-30 Peeling equipment and peeling method for thin workpiece TWI396612B (en)

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CN 201110045988 CN102173176B (en) 2010-12-30 2011-02-25 Thin piece peeling equipment and peeling method

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